Intersil ISL55190 Single and dual ultra-low noise, ultra-low distortion, low power op amp Datasheet

ISL55190, ISL55290
®
Data Sheet
March 30, 2007
Single and Dual Ultra-Low Noise, Ultra-Low
Distortion, Low Power Op Amp
The ISL55190 and ISL55290 are single and dual high speed
operational amplifiers featuring low noise, low distortion, and
rail-to-rail output drive capability. They are designed to
operate with single and dual supplies from +5VDC
(±2.5VDC) down to +3VDC (±1.5VDC). These amplifiers
draw 16mA of quiescent supply current per amplifier. For
power conservation, this family offers a low-power shutdown
mode that reduces supply current to 21µA and places the
amplifiers' output into a high impedance state. The ISL55190
ENABLE logic places the device in the shutdown mode with
EN = 0 and the ISL55290 is placed in the shutdown mode
with EN = 1.
FN6262.1
Features
• 1.2nV/√Hz input voltage noise, fO = 1kHz
• Harmonic Distortion -95dBc, -92dBc, fO = 4MHz
• Stable at gains as low as 5
• 800MHz gain bandwidth product (AV = 5)
• 268V/µs typical slew rate
• 16mA typical supply current (21µA in disable mode)
• 300µV typical offset voltage
• 25µA typical input bias current
• 3V to 5V single supply voltage range
• Rail-to-rail output
These amplifiers have excellent input and output overload
recovery times and outputs that swing rail-to-rail. Their input
common mode voltage range includes ground. The
ISL55190 and ISL55290 are stable at gains as low as 5 with
an input referred noise voltage of 1.2nV/√Hz and harmonic
distortion products -95dBc (2nd) and -92dBc (3rd) below a
4MHz 2VP-P signal.
The ISL55190 is available in space-saving 8 Ld DFN and 8 Ld
SOIC packages. The ISL55290 is available in a 10 Ld MSOP
package.
ISL55190IBZ
PART
MARKING
TAPE
AND
REEL
55190 IBZ
-
ISL55190IBZ-T13 55190 IBZ
ISL55190IRZ
ISL55290IUZ
-
• High speed pulse applications
• Low noise signal processing
• ADC buffers
• DAC output amplifiers
PACKAGE
(Pb-Free)
8 Ld SOIC
PKG.
DWG. #
8 Ld DFN
TABLE 1. ENABLE LOGIC
ENABLE
DISABLE
ISL55190
EN = 1
EN = 0
ISL55290
EN = 0
EN = 1
MDP0027
L8.3x3D
13”
8 Ld DFN
L8.3x3D
(2,500 pcs) Tape and Reel
5290Z
ISL55290IUZ-T13 5290Z
Applications
• Portable equipment
13”
8 Ld SOIC
MDP0027
(2,500 pcs) Tape and Reel
190Z
ISL55190IRZ-T13 190Z
• Pb-free plus anneal available (RoHS compliant)
• Radio systems
Ordering Information
PART
NUMBER
(Note)
• Enable pin
-
10 Ld MSOP
MDP0043
13”
10 Ld MSOP MDP0043
(2500 pcs) Tape and Reel
Coming Soon
Evaluation Board
ISL55190EVAL1Z
Coming Soon
Evaluation Board
ISL55290EVAL1Z
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100% matte
tin plate termination finish, which are RoHS compliant and compatible
with both SnPb and Pb-free soldering operations. Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2006, 2007. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
ISL55190, ISL55290
Pinouts
ISL55190
(8 LD DFN)
TOP VIEW
ISL55190
(8 LD SOIC)
TOP VIEW
FEEDBACK 1
IN- 2
IN+ 3
8 EN
EN 1
7 VS+
+
FEEDBACK 2
IN- 3
6 OUT
IN+ 4
V- 4
8 V+
7 OUT
+
6 NC
5 V-
5 NC
ISL55290
(10 LD MSOP)
TOP VIEW
OUT_A 1
IN-_A 2
IN+_A 3
V- 4
EN_A 5
2
10 V+
9 OUT_B
+
+
8 IN-_B
7 IN+_B
6 EN_B
FN6262.1
March 30, 2007
ISL55190, ISL55290
Absolute Maximum Ratings (TA = +25°C)
Thermal Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V
Supply Turn On Voltage Slew Rate . . . . . . . . . . . . . . . . . . . . . 1V/μs
Differential Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mA
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . V- - 0.5V to V+ + 0.5V
ESD Rating
Human Body Model (Per MIL-STD-883 Method 3015.7) . . . . .3kV
Machine Model (Per EIAJ ED-4701 Method C-111) . . . . . . . .300V
Thermal Resistance
θJA (°C/W)
8 Ld DFN Package . . . . . . . . . . . . . . . . . . . . . . . . .
65.75
8 Ld SO Package . . . . . . . . . . . . . . . . . . . . . . . . . .
110
10 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . .
115
Ambient Operating Temperature Range . . . . . . . . . .-40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . +125°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests
are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Electrical Specifications
PARAMETER
V+ = 5V, V -= GND, RL = 1kΩ, RG = 30Ω, RF = 120Ω. unless otherwise specified. Parameters are per amplifier.
All values are at V+ = 5V, TA = +25°C
DESCRIPTION
CONDITIONS
MIN
TYP
MAX
UNIT
-1100
-300
500
µV
DC SPECIFICATIONS
VOS
Input Offset Voltage
ΔV OS
--------------ΔT
Input Offset Drift vs Temperature
IOS
Input Offset Current
IB
Input Bias Current
VCM
Common-Mode Voltage Range
CMRR
Common-Mode Rejection Ratio
VCM = 0V to 3.8V
80
95
dB
PSRR
Power Supply Rejection Ratio
V+ = 3V to 5V
80
100
dB
AVOL
Large Signal Voltage Gain
VO = 0.5V to 4V, RL = 1kΩ
85
115
dB
VOUT
Maximum Output Voltage Swing
Output low, RL = 1kΩ
-40°C to +85°C
-1.3
Supply Current, Enabled
0.7
µA
-25
-40
µA
3.8
V
39
4.960
µV/°C
-0.3
0
Output high, RL = 1kΩ, V+= 5V
IS,ON
0.43
100
4.978
mV
V
ISL55190
16
20
mA
ISL55290
30
38
mA
21
49
µA
IS,OFF
Supply Current, Disabled
IO+
Short-Circuit Output Current
RL = 10Ω
110
130
mA
IO-
Short-Circuit Output Current
RL = 10Ω
110
130
mA
VSUPPLY
Supply Operating Range
V+ to V-
3
VINH
ENABLE High Level
Referred to -V
2
VINL
ENABLE Low Level
Referred to -V
IENH
ENABLE Input High Current
VEN = V+
ISL55190 (EN)
ENABLE Input Low Current
VEN = V-
IENL
3
5
V
V
0.8
V
20
80
nA
ISL55290 (EN)
0.8
1.5
µA
ISL55190 (EN)
5
6.2
µA
ISL55290 (EN)
20
80
nA
FN6262.1
March 30, 2007
ISL55190, ISL55290
Electrical Specifications
PARAMETER
V+ = 5V, V -= GND, RL = 1kΩ, RG = 30Ω, RF = 120Ω. unless otherwise specified. Parameters are per amplifier.
All values are at V+ = 5V, TA = +25°C
DESCRIPTION
CONDITIONS
MIN
TYP
MAX
UNIT
AC SPECIFICATIONS
GBW
Gain Bandwidth Product
AV = +5; VOUT = 100mVP-P; Rf/Rg = 402Ω/100Ω
800
MHz
HD
(4 MHz)
2nd Harmonic Distortion
AV = 5; VOUT = 2VP-P; Rf/Rg = 402Ω/100Ω
-95
dBc
3rd Harmonic Distortion
-92
dBc
ISO
Off-state Isolation; EN = 1 ISL55290; fO = 10MHz; AV = 5; VIN = 640mVP-P;
EN = 0 ISL55190
Rf/Rg = 402Ω/100Ω; CL = 1.2pF
-65
dB
X-TALK
ISL55290
Channel-to-Channel Crosstalk
fO = 10MHz; AV = 5; VOUT (Driven Channel) =
640mVP-P; Rf/Rg = 402Ω/100Ω; CL = 1.2pF
-75
dB
PSRR
Power Supply Rejection Ratio
fO = 10MHz;
VS = ±2.5V; AV = 5; VSOURCE = 640mVP-P;
Rf/Rg = 402Ω/100Ω; CL = 1.2pF
-45
dB
CMRR
Input Common Mode Rejection
Ratio; fO = 10MHz;
VS = ±2.5V; AV = 5; VCM = 640mVP-P;
Rf/Rg = 402Ω/100Ω; CL = 1.2pF
-38
dB
VN
Input Referred Voltage Noise
fO = 1kHz
1.2
nV/√Hz
IN
Input Referred Current Noise
fO = 10kHz
6
pA/√Hz
268
V/uS
AV = 5; VOUT = 3.5VP-P; Rf/Rg = 402Ω/100Ω
CL = 1.2pF
11.2
ns
9.8
ns
AV = 5; VOUT = 1VP-P; Rf/Rg = 402Ω/100Ω
CL = 1.2pF
4.4
ns
4.0
ns
2.2
ns
2.0
ns
TRANSIENT RESPONSE
SR
Slew Rate
163
tr, tf Large
Signal
Rise Time, tr 10% to 90%
Fall Time, tf 10% to 90%
Rise Time, tr 10% to 90%
Fall Time, tf 10% to 90%
tr, tf, Small
Signal
Rise Time, tr 10% to 90%
tpd
Propagation Delay
10% VIN to 10% VOUT
AV = 5; VOUT = 100mVP-P; Rf/Rg = 402Ω/100Ω
CL = 1.2pF
1.6
ns
tIOL
Positive Input Overload Recovery
Time, tIOL+; 10% VIN to 10% VOUT
VS = ±2.5V; AV = 5; VIN = +VCM +0.1V;
Rf/Rg = 402Ω/100Ω; CL = 1.2pF
15
ns
Negative Input Overload Recovery
Time, tIOL-; 10% VIN to 10% VOUT
VS = ±2.5V; AV = 5; VIN = -V -0.5V;
Rf/Rg = 402Ω/100Ω; CL = 1.2pF
18
ns
Positive Output Overload Recovery VS = ±2.5V; AV = 5; VIN = 1.1VP-P;
Time, tOOL+; 10% VIN to 10% VOUT Rf/Rg = 402Ω/100Ω; CL = 1.2pF
17
ns
Negative Output Overload Recovery VS = ±2.5V; AV = 5; VIN = 1.1VP-P;
Time, tOOL-; 10% VIN to 10% VOUT Rf/Rg = 402Ω/100Ω; CL = 1.2pF
17
ns
tOOL
tEN
ISL55190
tEN
ISL55290
Fall Time, tf 10% to 90%
AV = 5; VOUT = 1VP-P; Rf/Rg = 402Ω/100Ω
CL = 1.2pF
ENABLE to Output Turn-on Delay
Time; 10% EN to 10% VOUT
AV = 5; VIN = 500mVP-P; Rf/Rg = 402Ω/100Ω
CL = 1.2pF
420
ns
ENABLE to Output Turn-off Delay
Time; 10% EN to 10% VOUT
AV = 5; VIN = 500mVP-P; Rf/Rg = 402Ω/100Ω
CL = 1.2pF
240
ns
ENABLE to Output Turn-on Delay
Time; 10% EN to 10% VOUT
AV = 5; VIN = 500mVP-P; Rf/Rg = 402Ω/100Ω
CL = 1.2pF
160
ns
ENABLE to Output Turn-off Delay
Time;10% EN to 10% VOUT
AV = 5; VIN = 500mVP-P; Rf/Rg = 402Ω/100Ω
CL = 1.2pF
32
ns
4
FN6262.1
March 30, 2007
ISL55190, ISL55290
Typical Performance Curves
2
1
-1
Rf = 100, RG = 24.9
-2
Rf = 402, RG = 100
-3
Rf = 604, RG = 150
VOUT = 100mV
0
NORMALIZED GAIN (dB)
NORMALIZED GAIN (dB)
AV = 5
Rf = 1.21k, RG = 301
1 RL = 1k
VOUT = 100mVP-P
0
-4
-5
-6
-1
VOUT = 200mV
-2
-3
VOUT = 1V
-4
-5
AV = 5
Rf = 402
Rg = 100
RL = 1k
-6
-7
-7
-8
.01
-8
0.1
1.0
10
FREQUENCY (MHz)
100
1k
0.1
FIGURE 1. GAIN vs FREQUENCY vs Rf AND Rg
1k
70
0
60
-1
CLOSED LOOP GAIN (dB)
NORMALIZED GAIN (dB)
10
100
FREQUENCY (MHz)
FIGURE 2. GAIN vs FREQUENCY vs VOUT
1
-2
-3
RL= 1000
-4
RL= 499
-5
RL= 249
AV = 5
Cg = 0.8pF
CL = 1.2pF
Rg = 100
Rf = 402
VP-P = 100mV
-6
-7
-8
-9
.01
0.1
RL= 100
AV = 100 Rf/Rg = 10k/100
30
10
AV = 5 Rf/Rg = 402/100
1.0
10
FREQUENCY (MHz)
100
1k
2
NORMALIZED GAIN (dB)
-1
-2
-3
VS = 2.4V
-8
-9
.01
AV = 5
Cg
1.6pF
G == 1.6pF
RL = 1k
100
Rg
G == 100
402
RfF==402
VOUT
100mVP-P
P-P ==100mV
0.1
VS==5.0V
5.0V
1.0
10
FREQUENCY (MHz)
100
FIGURE 5. GAIN vs FREQUENCY vs VS
5
10
100
1k
FIGURE 4. CLOSED LOOP GAIN vs FREQUENCY
4
-4
1.0
FREQUENCY (MHz)
3
-7
AV = 10 Rf/Rg = 909/100
20
0
-6
RL = 1k
CL = 2.2pF
Cg = 2.5pF
VP-P = 100mV
40
1
-5
AV = 1000 Rf/Rg = 100k/100
50
0
0.1
FIGURE 3. ISL55290 GAIN vs FREQUENCY vs RL
NORMALIZED GAIN (dB)
1.0
1k
CL = 13.2pF
CL = 8.0pF
1
CL = 4.5pF
0
CL = 2.2pF
-1
CL = 1.2pF
-2
-3 AV = 5
RL = 1k
-4 Rf = 402
-5 Rg = 100
VOUT = 100mVP-P
-6
.01
0.1
1.0
10
100
1k
FREQUENCY (MHz)
FIGURE 6. ISL55190 GAIN vs FREQUENCY vs CL
FN6262.1
March 30, 2007
ISL55190, ISL55290
Typical Performance Curves (Continued)
5
AV = 5
4 RL = 1k
R = 402
3 Rf = 100
g
2 VOUT = 100mVpp
AV = 5
RL = 1k
Rg = 100
Rf = 402
VOUT = 100mVP-P
4
CL = 13.2pF
NORMALIZED GAIN (dB)
NORMALIZED GAIN (dB)
5
CL = 8.0pF
1
0
-1
CL = 2.2pF
-2
CL = 2.2pF
-3
CL = 1.2pF
3
2
0
-2
1k
Cg = 2.3pF
-3
-5
.01
100
Cg = 3.0pF
-1
-5
.01
10
Cg = 1.8pF
Cg = 0.8pF
0.1
FREQUENCY (MHz)
2
1
Cg = 8.7pF
Cg = 5.2pF
Cg = 3.8pF
0
-1
Cg = 2.7pF
-2
Cg = 2.0pF
-3
Cg = 1.6pF
-4
Cg = 0.5pF
-5
.01
0.1
1.0
10
100
100k
10k
1k
100
10
1
.01
1k
FIGURE 9. ISL55290 GAIN vs FREQUENCY vs Cg
0.1
OUTPUT IMPEDANCE (Ω)
ENABLED INPUT IMPEDANCE (Ω)
100
1k
1000
10k
1k
1
.01
1.0
10
FREQUENCY (MHz)
FIGURE 10. DISABLED INPUT IMPEDANCE vs FREQUENCY
100k
10
1k
AV = 5
RL = 1k
Cg = 1.6pF
CL = 1.2pF
Rf = 402
Rg = 100
VSOURCE = 500mVP-P
1M
FREQUENCY (MHz)
100
100
10M
Cg = 10.5pF
DISABLED INPUT IMPEDANCE (Ω)
NORMALIZED GAIN (dB)
3
10
FIGURE 8. ISL55190 GAIN vs FREQUENCY vs Cg
5
AV = 5
RL = 1k
Rg = 100
Rf = 402
VOUT = 100mVP-P
1.0
FREQUENCY (MHz)
FIGURE 7. ISL55290 GAIN vs FREQUENCY vs CL
4
Cg = 5.5pF
Cg = 4.1pF
-4
1.0
Cg = 7.6pF
1
-4
0.1
Cg = 9.0pF
AV = 5
R
= 1k
RL
L = 1k
Cg = 1.6pF
Rf = 402
CL = 1.2pF
Ri = 100
Rf = 402
= 500mVP-P
V
RSOURCE
i = 100
0.1
1.0
10
FREQUENCY (MHz)
100
AV = 5
Rf = 402
Rg = 100
VSOURCE = 1VP-P
100
1k
FIGURE 11. ENABLED INPUT IMPEDANCE vs FREQUENCY
6
OUTPUT DISABLED
10
.01
0.1
1.0
10
100
1k
FREQUENCY (MHz)
FIGURE 12. DISABLED OUTPUT IMPEDANCE vs
FREQUENCY
FN6262.1
March 30, 2007
ISL55190, ISL55290
Typical Performance Curves (Continued)
10
10
AV = 5
Rg = 100
Rf = 402
VSOURCE =1VP-P
GAIN (dB)
OUTPUT IMPEDANCE (Ω)
100
1
OUTPUT ENABLED
A =5
0 CV = 0.8pF
g
-10 RL = 1k
Rg = 100
-20 Rf = 402
VCM = 1VP-P
-30
-40
-50
-60
0.1
-70
-80
0.01
.01
0.1
1.0
10
100
-90
.01
1k
0.1
FREQUENCY (MHz)
FIGURE 13. ENABLED OUTPUT IMPEDANCE vs FREQUENCY
100
1k
FIGURE 14. CMRR vs FREQUENCY
10
0
AV = 5
0 C = 0.8pF
g
-10 RL = 1k
Rg = 100
-20 Rf = 402
VSOURCE = 1VP-P
-30
AV = 5
Cg = 1.6pF
CL = 1.2pF
RL = 1k
Rf = 402
Ri = 100
VIN = 640mVP-P
-20
PSRR-
OFF ISOLATION (dB)
PSRR (dB)
1.0
10
FREQUENCY (MHz)
-40
PSRR+
-50
-60
-40
-60
-80
-100
-70
-80
-90
.01
-120
0.1
1.0
10
100
.01
1k
0.1
FREQUENCY (MHz)
FIGURE 15. PSRR vs FREQUENCY
100
1k
100
AV = 5
Cg = 1.6pF
-20 C = 1.2pF
L
RL = 1k
Rf = 402
-40
Ri = 100
VOUT (DRIVEN CHANNEL) = 640mVP-P
-60
INPUT NOISE VOLTAGE (nV√Hz)
CROSSTALK (dB)
10
FIGURE 16. OFF ISOLATION vs FREQUENCY
0
-80
-100
-120
.01
1.0
FREQUENCY (MHz)
AV = 100
Cg = 1.6pF
Rf = 330
Rg = 3.3
Ri = 1k
10
1
0.1
1.0
10
100
1k
FREQUENCY (MHz)
FIGURE 17. ISL55290 CHANNEL TO CHANNEL CROSSTALK
vs FREQUENCY
7
0.1
1
10
100
1k
10k
100k
FREQUENCY (Hz)
FIGURE 18. INPUT VOLTAGE NOISE vs FREQUENCY
FN6262.1
March 30, 2007
ISL55190, ISL55290
Typical Performance Curves (Continued)
0.6
LARGE SIGNAL (V)
100
10 AV = 100
Cg = 1.6pF
Rf = 330
Rg = 3.3
Ri = 1k
1
0.1
AV = 5
VS = ±2.5V
0.4 RL = 1k
CL = 1.3pF
VOUT = 1VP-P
0.2
0
-0.2
-0.4
1
10
100
1k
FREQUENCY (Hz)
10k
-0.6
0
100k
FIGURE 19. INPUT NOISE CURRENT vs FREQUENCY
20
30
40 50 60
TIME (µs)
70
80
90
100
FIGURE 20. LARGE SIGNAL STEP RESPONSE
0.06
50
AV = 5
RL = 1k
Rg = 100
Rf = 402
45
0.04
40
0.02
OVERSHOOT (%)
SMALL SIGNAL (V)
10
AV = 5
VS = ±2.5V
RL = 1k
CL = 1.3pF
VOUT =100mVP-P
0
-0.02
35
2
30
1
25
VOUT = 0.5V
20
0
VOUT = 1V
15
10
-0.04
3
VOUT = 0.1V
VOUT = 3.5V
OUTPUT (V)
INPUT NOISE CURRENT (pA√Hz)
1000
-1
5
-0.06
20
30
40
50
60
70
80
90
100
0
5
10
1.3
1.2
INPUT
1.0
0.9
1.5
1.0
0
-0.5
0.6
-1.0
0.5
-1.5
10
20
30
40
50
60
70
-1.5
2.0
0.7
0.4
3
2.5
0.5
OUTPUT
0.8
-1.0
3.0
2
INPUT
-2.0
-2.0
80
INPUT (V)
AV = 5
RL = 10k
VS = ±2.5V
Rg = 100
Rf = 402
VIN = VCM +0.1V
-3
FIGURE 22. ISL55290 PERCENT OVERSHOOT vs VOUT, CL
OUTPUT (V)
1.4
0
20
CL (pF)
FIGURE 21. SMALL SIGNAL STEP RESPONSE
1.1
15
1
-2.5
OUTPUT
0
AV = 5
RL = 10k
VS = ±2.5V
Rg = 100
Rf = 402
VIN = -V-0.5V
-3.0
-3.5
-4.0
0
10
20
30
40
50
60
OUTPUT (V)
10
TIME (µs)
INPUT (V)
-2
25
0
0
-1
-2
70
-3
80
TIME (ns)
TIME (ns)
FIGURE 23. POSITIVE INPUT OVERLOAD RECOVERY TIME
FIGURE 24. NEGATIVE INPUT OVERLOAD RECOVERY TIME
8
FN6262.1
March 30, 2007
ISL55190, ISL55290
Typical Performance Curves (Continued)
INPUT(V)
2
2.5
1
0
0
AV = 5
RL = 10k
VS = +2.5V
Rg = 100
Rf = 402
VIN = 1.1VP-P
-0.2
-0.4
-0.6
0
10
20
30
40 50 60
TIME (nS)
-1
1.5
90
2.0
0.5
1.0
0
0
-0.5
0
100
0.5
1.0
1.5
2.0
2.5
3.0
-1.0
4.0
3.5
TIME (µs)
FIGURE 26. ISL55290 ENABLE TO OUTPUT DELAY
-220
265
AV = 5
RL = 10k
Ri = 100
Rf = 402
-230
SLEW RATE (V/µs)
255
SLEW RATE (V/µs)
3.0
ENABLE
FIGURE 25. OUTPUT OVERLOAD RECOVERY TIME
245
235
-240
-250
-260
AV = 5
RL = 10k
Ri = 100
Rf = 402
-270
225
-280
215
-290
3.0
3.5
4.0
4.5
VS (V)
5.0
5.5
3.0
FIGURE 27. ISL55290 POSITIVE SLEW RATE vs VS
3.5
4.0
4.5
VS (V)
5.0
5.5
FIGURE 28. ISL55290 NEGATIVE SLEW RATE vs VS
24
34
n = 100
n = 100
32
22
MAX
30
MAX
20
CURRENT(µA)
CURRENT (mA)
4.0
OUTPUT
1.0
-3
80
5.0
AV = 5
RL = 1k
Rg = 100
Rf = 402
VIN = 0.5V
2.0
-2
70
6.0
ENABLE (V)
OUTPUT
0.2
3.0
OUTPUT (V)
INPUT
0.4
3
OUTPUT (V)
0.6
MEDIAN
18
16
14
ISL55190
10
-40
-20
0
20
40
TEMPERATURE (°C)
60
80
FIGURE 29. SUPPLY CURRENT ENABLED vs TEMPERATURE
VS = ±2.5V
9
26
MEDIAN
24
22
20
MIN
12
28
18
16
-40
MIN
-20
0
20
40
TEMPERATURE (°C)
60
80
FIGURE 30. SUPPLY CURRENT DISABLED vs TEMPERATURE
VS = ±2.5V
FN6262.1
March 30, 2007
ISL55190, ISL55290
Typical Performance Curves (Continued)
17.5
7.5
n = 100
n = 100
16.5
7.0
MAX
6.5
MAX
CURRENT(µA)
CURRENT(mA)
15.5
14.5
MEDIAN
13.5
12.5
11.5
MIN
10.5
9.5
0
20
40
TEMPERATURE (°C)
MEDIAN
5.0
4.5
60
3.0
-40
80
FIGURE 31. SUPPLY CURRENT ENABLED vs TEMPERATURE
VS = ±1.5V
MIN
3.5
ISL55190
-20
5.5
4.0
8.5
-40
6.0
-20
0
20
40
TEMPERATURE (°C)
60
80
FIGURE 32. SUPPLY CURRENT DISABLED vs
TEMPERATURE VS = ±1.5V
600
500
n = 100
MAX
300
VOS ( µV)
MEDIAN
MEDIAN
100
n = 100
MAX
300
0
VOS ( µV)
-100
-300
-500
-300
MIN
-600
MIN
-700
-900
-900
-1100
-40
-20
0
20
40
TEMPERATURE (°C)
60
80
-1200
-40
FIGURE 33. VIO vs TEMPERATURE VS = ±2.5V
60
80
n = 100
-23
MAX
MAX
-24
-26
IBIAS - (µA)
-25
IBIAS + (µA)
20
40
TEMPERATURE (°C)
-22
n = 100
-24
MEDIAN
-27
-28
-29
-25
MEDIAN
-26
-27
-28
-29
-30
-31
-32
-40
0
FIGURE 34. VIO vs TEMPERATURE VS = ±1.5V
-22
-23
-20
-30
MIN
-20
0
20
40
TEMPERATURE (°C)
60
80
FIGURE 35. IBIAS+ vs TEMPERATURE VS = ±2.5V
10
-31
-40
MIN
-20
0
20
40
TEMPERATURE (°C)
60
80
FIGURE 36. IBIAS- vs TEMPERATURE VS = ±2.5V
FN6262.1
March 30, 2007
ISL55190, ISL55290
Typical Performance Curves (Continued)
-21
-21
n = 100
-22
-23
MAX
-23
-25
IBIAS - (µA)
-24
IBIAS + (µA)
n = 100
-22
MAX
MEDIAN
-26
-27
-28
-24
-25
MEDIAN
-26
-27
-28
-29
MIN
-30
-31
-40
-20
0
20
40
-29
60
MIN
-30
-40
80
-20
0
TEMPERATURE (°C)
FIGURE 37. IBIAS+ vs TEMPERATURE VS = ±1.5V
0.4
60
80
0.5
n = 100
0.3
0
0.1
MAX
-0.2
MAX
-0.1
-0.6
IOS (nA)
-0.4
IOS (µA)
40
FIGURE 38. IBIAS- vs TEMPERATURE VS = ±1.5V
n = 100
0.2
20
TEMPERATURE (°C)
MEDIAN
-0.8
-1.0
-0.3
-0.5
MEDIAN
-0.7
-0.9
-1.2
-1.1
MIN
-1.4
MIN
-1.3
-1.6
-40
-20
0
20
40
TEMPERATURE (°C)
60
-1.5
-40
80
FIGURE 39. IOS vs TEMPERATURE VS = ±2.5V
-20
0
20
40
TEMPERATURE (°C)
60
80
FIGURE 40. IOS vs TEMPERATURE VS = ±1.5V
98
n = 100
130
97
V+ = 5V
MAX
120
PSRR (dB)
96
CMRR (dB)
n = 100
95
94
110
MEDIAN
100
93
90
V+ = 3V
92
MIN
91
-40
80
-20
0
20
40
60
80
TEMPERATURE (°C)
FIGURE 41. CMRR vs TEMPERATURE. V+ = ±2.5V, ±1.5V
11
-40
-20
0
20
40
60
80
TEMPERATURE (°C)
FIGURE 42. PSRR vs TEMPERATURE ±1.5V to ±2.5V,
VS = ±2.5V
FN6262.1
March 30, 2007
ISL55190, ISL55290
Typical Performance Curves (Continued)
4.986
110
n = 100
MAX
100
4.982
90
4.980
80
VOUT (mV)
VOUT (mV)
4.984
4.978
MEDIAN
4.976
n = 100
MAX
70
60
50
4.974
40
4.972
MIN
4.970
20
-40
4.968
-40
-20
0
20
40
TEMPERATURE (°C)
MEDIAN
30
60
80
MIN
-20
0
20
40
60
FIGURE 43. VOUT HIGH vs TEMPERATURE VS = ±2.5V,
RL = 1k
FIGURE 44. VOUT LOW vs TEMPERATURE VS = ±2.5V, RL = 1k
2.986
60
n = 100
n = 100
MAX
2.984
55
VOUT (mV)
2.980
2.978
MEDIAN
2.976
45
40
MEDIAN
35
30
2.974
25
MIN
MIN
2.972
-40
MAX
50
2.982
VOUT (V)
80
TEMPERATURE (°C)
-20
0
20
40
TEMPERATURE (°C)
20
60
80
FIGURE 45. VOUT HIGH vs TEMPERATURE VS = ±1.5V,
RL = 1k
12
-40
-20
0
20
40
60
80
TEMPERATURE (°C)
FIGURE 46. VOUT LOW vs TEMPERATURE VS = ±1.5V, RL = 1k
FN6262.1
March 30, 2007
ISL55190, ISL55290
Pin Descriptions
ISL55190
(8 Ld SOIC)
ISL55190
(8 Ld DFN)
5
6
2
3
ISL55290
(10 Ld MSOP)
2 (A)
8 (B)
PIN NAME
FUNCTION
NC
Not connected
IN-
Inverting input
EQUIVALENT CIRCUIT
V+
IN-
IN+
VCircuit 1
3
4
3 (A)
7 (B)
IN+
4
5
4
V-
6
7
1 (A)
9 (B)
OUT
Non-inverting input
(See circuit 1)
Negative supply
Output
V+
OUT
VCircuit 2
7
8
10
V+
Positive supply
5 (A)
6 (B)
EN
Enable pin with internal pulldown referenced to the -V
pin; Logic “1” selects the
disabled state; Logic “0”
selects the enabled state.
V+
EN
VCircuit 3a
8
1
EN
Enable pin with internal pulldown referenced to the -V
pin; Logic “0” (-V) selects
the disabled state; Logic “1”
(+V) selects the enabled
state.
V+
EN
VCircuit 3b
1
2
FEEDBACK Feedback pin to reduce INcapacitance
V+
FEEDBACK
OUT
VCircuit 4
13
FN6262.1
March 30, 2007
ISL55190, ISL55290
Applications Information
where:
Product Description
• PDMAXTOTAL is the sum of the maximum power
dissipation of each amplifier in the package (PDMAX)
The ISL55190 and ISL55290 are single and dual high
speed, voltage feedback amplifiers designed for fast pulse
applications, as well as communication and imaging systems
that require very low voltage and current noise. Both devices
are stable at a minimum gain of 5 and feature low distortion
while drawing moderately low supply current. The ISL55190
and ISL55290 use a classical voltage-feedback topology,
which allows them to be used in a variety of high speed
applications where current-feedback amplifiers are not
appropriate due to restrictions placed upon the feedback
element used with the amplifier.
• PDMAX for each amplifier can be calculated using
Equation 2:
V OUTMAX
PD MAX = 2*V S × I SMAX + ( V S - V OUTMAX ) × ---------------------------R
L
(EQ. 2)
where:
• TMAX = Maximum ambient temperature
• θJA = Thermal resistance of the package
• PDMAX = Maximum power dissipation of 1 amplifier
Enable/Power-Down
Both devices can be operated from a single supply with a
voltage range of +3V to +5V, or from split ±1.5V to ±2.5V.
The logic level input to the ENABLE pins are TTL compatible
and are referenced to the -V terminal in both single and split
supply applications. The following discussion assumes
single supply operation.
The ISL55190 uses a logic “0” (<0.8V) to disable the
amplifier and the ISL55290 uses a logic “1” (>2V) to disable
its amplifiers. In this condition, the output(s) will be in a high
impedance state and the amplifier(s) current will be reduced
to 21µA. The ISL55190 has an internal pull-up on the EN pin
and is enabled by either floating or tying the EN pin to a
voltage >2V. The ISL55290 has internal pull-downs on the
EN pins and are enabled by either floating or tying the EN
pins to a voltage <0.8V. The enable pins should be tied
directly to their respective supply pins when not being used
(EN tied to -V for the ISL55290 and EN tied to +V for the
ISL55190).
Current Limiting
The ISL55190 and ISL55290 have no internal currentlimiting circuitry. If the output is shorted, it is possible to
exceed the Absolute Maximum Rating for output current or
power dissipation, potentially resulting in the destruction of
the device.
Power Dissipation
It is possible to exceed the +125°C maximum junction
temperatures under certain load and power-supply
conditions. It is therefore important to calculate the
maximum junction temperature (TJMAX) for all applications
to determine if power supply voltages, load conditions, or
package type need to be modified to remain in the safe
operating area. These parameters are related using
Equation 1:
T JMAX = T MAX + ( θ JA xPD MAXTOTAL )
14
(EQ. 1)
• VS = Supply voltage
• IMAX = Maximum supply current of 1 amplifier
• VOUTMAX = Maximum output voltage swing of the
application
• RL = Load resistance
Power Supply Bypassing and Printed Circuit
Board Layout
As with any high frequency device, good printed circuit
board layout is necessary for optimum performance. Low
impedance ground plane construction is essential. Surface
mount components are recommended, but if leaded
components are used, lead lengths should be as short as
possible. The power supply pins must be well bypassed to
reduce the risk of oscillation. The combination of a 4.7µF
tantalum capacitor in parallel with a 0.01µF capacitor has
been shown to work well when placed at each supply pin.
For good AC performance, parasitic capacitance should be
kept to a minimum, especially at the inverting input. When
ground plane construction is used, it should be removed
from the area near the inverting input to minimize any stray
capacitance at that node. Carbon or Metal-Film resistors are
acceptable with the Metal-Film resistors giving slightly less
peaking and bandwidth because of additional series
inductance. Use of sockets (particularly for the SOIC
package) should be avoided if possible. Sockets add
parasitic inductance and capacitance which, will result in
additional peaking and overshoot.
For inverting gains, this parasitic capacitance has little effect
because the inverting input is a virtual ground, but for noninverting gains, this capacitance (in conjunction with the
feedback and gain resistors) creates a pole in the feedback
path of the amplifier. This pole, if low enough in frequency,
has the same destabilizing effect as a zero in the forward
open-loop response. The use of large-value feedback and
gain resistors exacerbates the problem by further lowering
the pole frequency (increasing the possibility of oscillation).
FN6262.1
March 30, 2007
ISL55190, ISL55290
CURRENT
INPUT
+5VDC
RF
10kΩ
RGRT 100
PARASITIC
L TO R
RSENSE
0.01Ω
ISL55190
IN- V+
FEEDBACK
OUT
IN+ V-
RG+
100Ω
VOUT
RL
RREF
10kΩ
VREF
+2.5V
CURRENT
INPUT
FIGURE 47. GROUND SIDE CURRENT SENSE AMPLIFIER
The ISL55190 single has a dedicated feedback pin which is
internally connected to the amplifier output and located next
to the inverting input pin. This additional output connection
enables the PC board trace capacitance at the inverting pin
to be minimized.
Current Sense Application Circuit
The schematic in Figure 47 provides an example of utilizing
the ISL55190 high speed performance with the ground
sensing input capability to implement a single-supply, G =1 0
differential low side current sense amplifier. This circuit can
be used to sense currents of either polarity. The reference
voltage applied to VREF (+2.5V) defines the amplifier output
0A current sense reference voltage at one half the supply
voltage level (VS = +5VDC), and RSENSE sets the current
sense gain and full scale values. In this example the current
gain is 10A/V over a maximum current range of slightly less
than ±25A with RSENSE = 0.01Ω. The amplifier VIO error
(-1.1mV max) and input bias offset current (IIO) error (1.3µA)
together contribute less than 15mV (150mA) at the output for
better than 0.3% full scale accuracy.
The amplifier’s high slew rate and fast pulse response make
this circuit suitable for low-side current sensing in PWM and
motor control applications. The excellent input overload
recovery response enables the circuit to maintain
performance in the presence of parasitic inductance that can
cause fast rise and falling edge spikes that can momentarily
overload the input stage of the amplifier.
15
FN6262.1
March 30, 2007
ISL55190, ISL55290
Small Outline Package Family (SO)
A
D
h X 45°
(N/2)+1
N
A
PIN #1
I.D. MARK
E1
E
c
SEE DETAIL “X”
1
(N/2)
B
L1
0.010 M C A B
e
H
C
A2
GAUGE
PLANE
SEATING
PLANE
A1
0.004 C
0.010 M C A B
L
b
0.010
4° ±4°
DETAIL X
MDP0027
SMALL OUTLINE PACKAGE FAMILY (SO)
INCHES
SYMBOL
SO-14
SO16 (0.300”)
(SOL-16)
SO20
(SOL-20)
SO24
(SOL-24)
SO28
(SOL-28)
TOLERANCE
NOTES
A
0.068
0.068
0.068
0.104
0.104
0.104
0.104
MAX
-
A1
0.006
0.006
0.006
0.007
0.007
0.007
0.007
±0.003
-
A2
0.057
0.057
0.057
0.092
0.092
0.092
0.092
±0.002
-
b
0.017
0.017
0.017
0.017
0.017
0.017
0.017
±0.003
-
c
0.009
0.009
0.009
0.011
0.011
0.011
0.011
±0.001
-
D
0.193
0.341
0.390
0.406
0.504
0.606
0.704
±0.004
1, 3
E
0.236
0.236
0.236
0.406
0.406
0.406
0.406
±0.008
-
E1
0.154
0.154
0.154
0.295
0.295
0.295
0.295
±0.004
2, 3
e
0.050
0.050
0.050
0.050
0.050
0.050
0.050
Basic
-
L
0.025
0.025
0.025
0.030
0.030
0.030
0.030
±0.009
-
L1
0.041
0.041
0.041
0.056
0.056
0.056
0.056
Basic
-
h
0.013
0.013
0.013
0.020
0.020
0.020
0.020
Reference
-
16
20
24
28
Reference
-
N
SO-8
SO16
(0.150”)
8
14
16
Rev. M 2/07
NOTES:
1. Plastic or metal protrusions of 0.006” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994
16
FN6262.1
March 30, 2007
ISL55190, ISL55290
Package Outline Drawing
L8.3x3D
8 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE (DFN)
Rev 0, 9/06
PIN 1 INDEX AREA
3.00
1.45
A
PIN 1 INDEX AREA
B
0.075 C
4X
6X 0.50 BSC
3.00
1.50
REF
1.75
8X 0.25
0.10 M C A B
8X 0.40
2.20
TOP VIEW
BOTTOM VIEW
SEE DETAIL X''
(8X 0.60)
(8X 0.25)
0.10 C
0.85
C
(1.75)
SEATING PLANE
0.08 C
(6X 0.50 BSC)
SIDE VIEW
(1.45)
(2.20)
TYPICAL RECOMMENDED LAND PATTERN
c
0.20 REF
5
0~0.05
DETAIL “X”
NOTES:
1. Controlling dimensions are in mm.
Dimensions in ( ) for reference only.
2. Unless otherwise specified, tolerance : Decimal ±0.05
Angular ±2°
3. Dimensioning and tolerancing conform to JEDEC STD MO220-D.
4. The configuration of the pin #1 identifier is optional, but must be located
within the zone indicated. The pin #1 identifier may be either a mold or
mark feature.
5. Tiebar shown (if present) is a non-functional feature.
17
FN6262.1
March 30, 2007
ISL55190, ISL55290
Mini SO Package Family (MSOP)
0.25 M C A B
D
MINI SO PACKAGE FAMILY
(N/2)+1
N
E
MDP0043
A
E1
MILLIMETERS
PIN #1
I.D.
1
B
(N/2)
e
H
C
SEATING
PLANE
0.10 C
N LEADS
SYMBOL
MSOP8
MSOP10
TOLERANCE
NOTES
A
1.10
1.10
Max.
-
A1
0.10
0.10
±0.05
-
A2
0.86
0.86
±0.09
-
b
0.33
0.23
+0.07/-0.08
-
c
0.18
0.18
±0.05
-
D
3.00
3.00
±0.10
1, 3
E
4.90
4.90
±0.15
-
E1
3.00
3.00
±0.10
2, 3
e
0.65
0.50
Basic
-
L
0.55
0.55
±0.15
-
L1
0.95
0.95
Basic
-
N
8
10
Reference
-
0.08 M C A B
b
Rev. D 2/07
NOTES:
1. Plastic or metal protrusions of 0.15mm maximum per side are not
included.
L1
2. Plastic interlead protrusions of 0.25mm maximum per side are
not included.
A
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
c
SEE DETAIL "X"
A2
GAUGE
PLANE
L
A1
0.25
3° ±3°
DETAIL X
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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18
FN6262.1
March 30, 2007