Bourns CHF2010XNP 10 w power rf chip termination/resistor Datasheet

PL
IA
NT
CO
M
*R
oH
S
Features
Applications
■ DC to 2.2 GHz
■ RF amplifiers
■ Terminals for PCB placement
■ Attenuators
■ Low VSWR
■ Antenna feeds
■ Aluminum Nitride ceramic
■ Wilkinson dividers
■ High power
■ RoHS compliant*
CHF2010xNP Series 10 W Power RF Chip Termination/Resistor
Substrate ......................................... ALN
Resistive Film ........................ Thick-Film
Terminals ........................................ NiAu
Capacitance ...............................0.75 pF
Resistance
CHF2010CNP500L ..................... 50 Ω
CHF2010CNP101R ................... 100 Ω
CHF2010DNP101R ................... 100 Ω
Tolerance
CHF2010CNP500L .................... ±5 %
CHF2010CNP101R .................... ±5 %
CHF2010DNP101R .................... ±2 %
Packaging
Tape & Reel .......... 2000 pcs./10 ” reel
Bulk ................................100 pcs./bag
Characteristic Curve
12
10
Power (Watts)
General Specifications
8
6
4
2
0
-55
0
100
150
Heat Sink Temperature (°C)
Absolute Ratings
Power .............................................10 W
Frequency
CHF2010CNP500L ...................2 GHz
CHF2010CNP101R ................2.2 GHz
CHF2010DNP101R ................2.2 GHz
VSWR ............................... 1.2 Maximum
Product Dimensions
CHF2010CNP500L
5.3
(0.208)
5.3
(0.208)
2.7
(0.106)
0.76
(.03)
0.58
(.02)
1.2
(0.047)
DIMENSIONS = MILLIMETERS
(INCHES)
TOLERANCE =
±0.3
(±0.012)
0.58
(.02)
CHF2010CNP101R & CHF2010DNP101R
5.3
(0.208)
Asia-Pacific:
Tel: +886-2 2562-4117
Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555
Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500
Fax: +1-951 781-5700
www.bourns.com
5.3
(0.208)
2.7
(0.106)
2.3
(0.9)
TYP.
0.87
(0.03)
2.4
(.09)
1.2
(0.047)
0.58
(.02)
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CHF2010xNP Series 10 W Power RF Chip Termination/Resistor
Packaging Dimensions
2.0
(.080)
8.0 ± 0.1
(.315 ± .004)
2.0 ± 0.05
(.08 ± .002)
4.0 ± 0.1
(.157 ± .004)
254.0 ± 0.2
(10.0 ± .008)
5.5 ± 0.05
(0.22 ± .002)
5.6 ± 0.1
(.221 ± .004)
12.0 ± 0.2
(.47 ± .008)
1.0 ± 0.2
(.040 ± .008)
13.0 ± 0.5
(.512 ± .020)
63.0 ± 0.2
(2.5 ± .008)
ORIENTATION OF CHIP
CHF2010CNP500LXF
4.0 ± 0.1
(.157 ± .004)
1.5 +0.1/-0
(.056 +.004/-0)
MAXIMUM CAMBER:
1.75 ± 0.1
(.050 ± .004)
ORIENTATION
OF CHIP
CHF2010XNPXXXL/RE
1.0
(.040)
CUMULATIVE TOLERANCE OVER 10 HOLES:
DIMENSIONS:
MM
(INCHES)
20.5
(.807)
0.2
(.008)
12.5 ± 0.2
(0.5 ± .008)
How to Order
CHF 2010 C N P 500 L X E
Model
Package
Version
C = 5 % Tolerance
D = 2 % Tolerance
Substrate
Mount
P = Printed Circuit Board
Resistance Code
500 = 50 Ohm
101 = 100 Ohm
Type
L = Termination (One Lead)
R = Resistor (Two Leads)
Plating
X = NiAu
Packaging
Blank = Bulk (100 pcs./bag)
E = Tape & Reel (2,000 pcs./10 ” reel, Orientation of Input Terminal Away from Sprocket)
*F = Tape & Reel (2,000 pcs./10 ” reel, Orientation of Input Terminal Facing from Sprocket)
*Packaging Option F is only available on CHF2010CNP500LXF.
REV. 11/10
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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