LM258A-EP DUAL OPERATIONAL AMPLIFIERS www.ti.com SLOS506 – OCTOBER 2006 FEATURES • • • • • • • • (1) Controlled Baseline – One Assembly/One Test Site, One Fabrication Site Extended Temperature Performance of –55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree (1) Wide Supply Range: – Single Supply . . . 3 V to 30 V – Dual Supplies . . . ±1.5 V to ±15 V Low Supply-Current Drain, Independent of Supply Voltage . . . 0.7 mA Typ Common-Mode Input Voltage Range Includes Ground, Allowing Direct Sensing Near Ground • • • • Low Input Bias and Offset Parameters: – Input Offset Voltage . . . 2 mV Typ – Input Offset Current . . . 2 nA Typ – Input Bias Current . . . 15 nA Typ Differential Input Voltage Range Equal to Maximum-Rated Supply Voltage . . . 32 V Open-Loop Differential Voltage Amplification . . . 100 V/mV Typ Internal Frequency Compensation D PACKAGE (TOP VIEW) 1OUT 1IN– 1IN+ GND 1 2 3 4 8 7 6 5 VCC 2OUT 2IN– 2IN+ Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. DESCRIPTION/ORDERING INFORMATION The LM258A consists of two independent, high-gain, frequency-compensated operational amplifiers designed to operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the difference between the two supplies is 3 V to 30 V, and VCC is at least 1.5 V more positive than the input common-mode voltage. The low supply-current drain is independent of the magnitude of the supply voltage. Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier circuits that now can be implemented more easily in single-supply-voltage systems. For example, this device can be operated directly from the standard 5-V supply used in digital systems and easily can provide the required interface electronics without additional ±5-V supplies. ORDERING INFORMATION TA VIOmax AT 25°C MAX TESTED VCC –55°C to 125°C 3mV 30V (1) PACKAGE (1) SOIC – D Reel of 2500 ORDERABLE PART NUMBER LM258AMDREP TOP-SIDE MARKING 258AM Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006, Texas Instruments Incorporated LM258A-EP DUAL OPERATIONAL AMPLIFIERS www.ti.com SLOS506 – OCTOBER 2006 SYMBOL (EACH AMPLIFIER) IN+ IN- + - OUT SCHEMATIC (EACH AMPLIFIER) VCC+ »6-mA Current Regulator »100-mA Current Regulator »6-mA Current Regulator OUT IN– »50-mA Current Regulator IN+ GND (or VCC-) To Other Amplifier COMPONENT COUNT Epi-FET Diodes Resistors Transistors Capacitors 2 1 2 7 51 2 Submit Documentation Feedback LM258A-EP DUAL OPERATIONAL AMPLIFIERS www.ti.com SLOS506 – OCTOBER 2006 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VALUE UNIT ±16 or 32 V Differential input voltage (3) ±32 V Input voltage (either input) –0.3 to 32 V Duration of output short circuit (one amplifier) to ground at (or below) 25°C free-air temperature (VCC ≤ 15 V) (4) Unlimited VCC Supply voltage (2) VID VI θJA Package thermal impedance (5) (6) 97 °C/W TA Operating free-air temperature range –55 to 125 °C TJ Operating virtual junction temperature 150 °C Tstg Storage temperature range (7) –65 to 150 °C (1) (2) (3) (4) (5) (6) (7) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages and VCC specified for measurement of IOS, are with respect to the network ground terminal. Differential voltages are at IN+ with respect to IN–. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging. Submit Documentation Feedback 3 LM258A-EP DUAL OPERATIONAL AMPLIFIERS www.ti.com SLOS506 – OCTOBER 2006 Electrical Characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted) PARAMETER VIO Input offset voltage aI Average temperature coefficient of input offset voltage IO IIO Input offset current aI Average temperature coefficient of input offset current IO TEST CONDITIONS (1) VCC = 5 V to 30 V, VIC = VICR(min), VO = 1.4 V TYP (3) MAX 2 3 Full range 4 Full range 7 15 25°C 2 15 Full range Input bias current VO = 1.4 V VICR Common-mode input voltage range VCC = 5 V to Max VOH High-level output voltage 30 Full range 10 25°C –15 Full range 25°C Full range RL ≥ 2 kΩ 25°C VCC = 30 V VOL Low-level output voltage RL ≤ 10 kΩ AVD Large-signal differential voltage amplification VCC = 15 V, VO = 1 V to 11 V, RL ≥ 2 kΩ CMRR Common-mode rejection ratio kSVR VO1/VO2 200 –80 –100 0 to VCC – 1.5 RL = 2 kΩ Full range 26 RL ≥ 10 kΩ Full range 27 µV/°C nA pA/°C nA V 28 5 20 mV 25°C 50 Full range 25 VCC = 5 V to Max VIC = VICR(min) 25°C 70 80 dB Supply-voltage rejection ratio (∆VDD/∆VIO) VCC = 5 V to Max 25°C 65 100 dB Crosstalk attenuation f = 1 kHz to 20 kHz 25°C 120 dB Output current Source VCC = 15 V, VID = –1 V, VO = 15 V Sink 25°C –20 Full range –10 25°C 10 Full range 5 12 100 V/mV –30 –60 mA 20 µA VID = –1 V, VO = 200 mV 25°C IOS VCC at 5 V, GND at –5 V, VO = 0 25°C ±40 ±60 ICC Supply current (two amplifiers) VO = 2.5 V, No load Full range 0.7 1.2 VCC = Max, VO = VCC/2, No load Full range 1 2 (2) (3) mV VCC – 1.5 Short-circuit output current (1) UNIT V 0 to VCC – 2 Full range VCC = 15 V, VID = 1 V, VO = 0 4 MIN 25°C VO = 1.4 V IIB IO TA (2) 30 mA mA All characteristics are measured under open-loop conditions with zero common-mode input voltage, unless otherwise specified. MAX VCC for testing purposes is 30 V. Full range is –55°C to 125°C. All typical values are at TA = 25°C. Submit Documentation Feedback LM258A-EP DUAL OPERATIONAL AMPLIFIERS www.ti.com SLOS506 – OCTOBER 2006 Operating Characteristics VCC = ±15 V, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT SR Slew rate at unity gain RL = 1 MΩ, CL = 30 pF, VI = ±10 V, See Figure 1 0.3 V/µs B1 Unity-gain bandwidth RL = 1 MΩ, CL = 20 pF, See Figure 1 0.7 MHz Vn Equivalent input noise voltage RS = 100 Ω, VI = 0 V, f = 1 kHz, See Figure 2 40 nV/√Hz VCC+ – VO VI + VCC- CL RL Figure 1. Unity-Gain Amplifier 900 W VCC+ 100 W – VI = 0 V VO RS + VCC- Figure 2. Noise-Test Circuit Submit Documentation Feedback 5 PACKAGE OPTION ADDENDUM www.ti.com 31-May-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM258AMDREP ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 258AM LM258AMDREPG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 258AM V62/07605-01XE ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 258AM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 31-May-2014 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM258A-EP : • Catalog: LM258A NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device LM258AMDREP Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.4 B0 (mm) K0 (mm) P1 (mm) 5.2 2.1 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM258AMDREP SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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