PROTEC LC0402FC3.3C 200w low capacitance flip chip tvs array Datasheet

05139
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
200W LOW CAPACITANCE flip chip tvs array
Description
The LC0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This low capacitance series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 200 Watts per line for an 8/20µs waveform. In addition, the LC0402FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low
inductance virtually eliminates overshoot voltage due to package inductance.
Features
applications
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• SMART Phones
• Portable Electronics
• SMART Cards
Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
ESD Protection > 25 kilovolts
Available in Voltages Ranging from 3.3V to 36V
200 Watts Peak Pulse Power per Line (tp = 8/20µs)
Bidirectional and Monolithic Structure
Low Clamping Voltage
Low Capacitance
Low Leakage Current
Protection for 1 Line
RoHS Compliant
REACH Compliant
Mechanical characteristics
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Standard EIA Chip Size: 0402
Approximate Weight: 0.73 milligrams
Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Flammability Rating UL 94V-0
8mm Tape per EIA Standard 481
Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGURATION
05139.R10 912
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05139
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
typical device characteristics
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOL
VALUE
UNITS
PPP
200
Watts
TA
-55 to 150
°C
TSTG
-55 to 150
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(Fig. 2)
@ IP = 1A
VC
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(Fig. 2)
V WM
VOLTS
@ 1mA
V(BR)
VOLTS
LC0402FC3.3C
3.3
4.0
7.0
12.5V @ 16A
75*
70
LC0402FC05C
5.9
6.0
11.0
13.0V @ 15A
10**
35
LC0402FC08C
8.0
8.5
13.2
18.0V @ 11A
1
32
LC0402FC12C
12.0
13.3
19.8
26.9V @ 7.4A
1
30
LC0402FC15C
15.0
16.7
25.4
34.5V @ 5.8A
1
25
LC0402FC24C
24.0
26.7
37.2
50.6V @ 4A
1
20
LC0402FC36C
36.0
40.0
70.0
80.0V @ 2.5A
1
18
@ 8/20µs
VC @ IPP
MAXIMUM
LEAKAGE
CURRENT
(Note 2)
@V WM
ID
µA
TYPICAL
CAPACITANCE
@0V, 1MHz
C
pF
notes
1. All devices are bidirectional. Electrical characteristics apply in both directions.
2. *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current < 500nA @ 3.3V.
05139.R10 912
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05139
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
typical device characteristics
figure 1
peak pulse power vs pulse time
PPP - Peak Pulse Power - Watts
10,000
1,000
200W, 8/20µs Waveform
100
10
0.1
10
100
td - Pulse Duration - µs
Peak Value IPP
80
100
TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs
e-t
60
40
10,000
figure 3
power derating curve
Peak Pulse Power
8/20µs
80
% Of Rated Power
tf
100
td = t/(IPP/2)
60
40
20
20
0
1,000
figure 2
pulse wave form
120
IPP - Peak Pulse Current - % of IPP
1
0
05139.R10 912
5
10
15
t - Time - µs
20
25
0
30
Page 3
Average Power
0
25
50
75 100 125
TA - Ambient Temperature - °C
150
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05139
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
typical device characteristics
figure 4
overshoot & clamping voltage for LC0402fc05c
35
5 Volts per Division
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (Waveshape)
figure 5
typical clamping voltage vs peak pulse current LC0402fc05c
VC - Clamping Voltage - Volts
12
8
4
0
0
05139.R10 912
5
10
IPP - Peak Pulse Current - Amps
Page 4
15
20
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05139
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
spice model
figure 1
spice model for
I/O
ABD
ABD
GND
ABD - Avalanche Breakdown Diode (TVS)
table 1 - spice parameters
PART NUMBER
05139.R10 912
parameter
unit
abd(tvs)
BV
V
See Table 2
IBV
µA
1
Cjo
pF
See Table 2
IS
A
See Table 2
Vj
V
0.6
M
-
0.33
N
-
1
RS
-
See Table 2
TT
s
1E-8
EG
eV
1.11
table 2 - abd specific spice parameters
i s (amps)
bv(volts)
cjo(pF)
rs(ohms)
LC0402FC3.3C
4.0
70
1E-11
0.20
LC0402FC05C
6.0
35
1E-11
0.16
LC0402FC08C
8.5
32
1E-13
0.33
LC0402FC12C
13.3
30
1E-13
0.51
LC0402FC15C
16.7
25
1E-13
0.53
LC0402FC24C
26.7
20
1E-13
0.63
LC0402FC36C
40.2
18
1E-13
0.73
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05139
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
SOLDER REFLOW INFORMATION
printed circuit board recommendations
parameter
value
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask Defined Pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.150mm
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
0.330mm Round
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance - Edge To Corner Ball
±50µm
Solder Ball Side Coplanarity
±20µm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Soldering Maximum Temperature
270°C
Requirements
recommended non-solder mask
defined pad illustration
Temperature:
TP for Lead-Free (Sn/Ag/Cu): 260-270°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area and plating.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
Maximum Solder Reflow
(35-53°C Above Maximum Solder Melt Temp)
TP
Solder Melt
(Maximum Temp)
Temperature - °C
Ramp-Up
Ramp-Down
Preheat
(Stay Below Flux Activation Temp)
30-60 seconds
05139.R10 912
Ramp-Up
15 seconds
(Minimize)
Page 6
Solder-Time
15-20 seconds
Ramp-Down
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05139
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
0402 package information
outline dimensions
max
inches
min
max
A
0.46
0.018
B
0.86
0.034
C
0.98
1.02
0.038
D
0.10
0.004
E
0.35
0.014
F
0.458
G
H
0.508
0.018
0.20
0.076
I
TOP
0.040
A
B C
0.020
0.008
0.127
0.003
0.406
0.005
D
0.016
E
F
Notes
1. Controlling dimensions in inches.
2. Decimal tolerance: .xxx ± 0.05mm (0.002”).
3. Maximum chip size: 1.02mm (0.040”) by 0.51mm (0.020”).
END
H
I
layout dimensions
inches
nominal
nominal
A
0.23
0.009
B
0.48
0.019
C
0.69
0.027
D
0.46
0.018
E
0.99
0.039
F
0.20
0.008
G
0.20
0.008
H
0.66
0.026
I
0.13
0.005
C
B
D
A
SOLDER PAD
millimeters
dim
SIDE
millimeters
min
G
dim
DIE
SOLDER
BUMP
F
H
E
I
Notes
1. Controlling dimensions in inches.
2. Decimal tolerance: .xxx ± 0.05mm (0.002”).
05139.R10 912
SOLDER PRINT
DIAMETER 0.010” - 0.012”
Page 7
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05139
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
TAPE AND REEL information
P0
D
T
10 Pitches Cumulative
Tolerance on tape ± 0.2
E
P2
Top Cover
Tape
F
A0
K0
W
B0
P
User Direction of Feed
specifications
Reel Dia.
Tape
Width
178(7”)
8
A0
B0
K0
D
E
F
P0
P2
P
tmax
0.70 ± 0.05 1.15 ± 0.10 0.56 ± 0.05 1.55 ± 0.05 1.75 ± 0.10 3.50 ± 0.05 8.00 ± 0.20 4.00 ± 0.05 2.00 ± 0.05 2.00 ± 0.05
Notes
1.
2.
3.
4.
5.
6.
W
0.25
tape & reel orientation
Dimensions in millimeters.
Top view of tape. Metal contacts are face down in tape package.
Orientation: preferred stencil - 0.1mm (0.004”).
Surface mount product is taped and reeled in accordance with EIA 481.
8mm plastic tape: 7” Reels - 5,000 (pocket under hole skipped) pieces per reel.
Marking on Reel - part number, date code and lot number.
Single Die - 0402
Package outline, pad layout and tape specifications per document number 06001.R7 8/12.
ORDERING INFORMATION
base PART NUMBER
(xx = voltage)
LEADFREE SUFFIX
TAPE SUFFIX
QTY/REEL
REEL SIZE
TUBE qty
LC0402FCxxC
-LF
-T75-1
5,000
7”
n/a
This device is only available in a Lead-Free configuration.
05139.R10 912
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05139
LC0402FC3.3C - LC0402FC36C
Only One Name Means ProTek’Tion™
company information
COMPANY PROFILE
In business more than 20 years, ProTek Devices™ is a privately-held company located in Tempe, Arizona, that offers a product line of transient voltage suppressors (TVS); avalanche breakdown diodes; steering diode TVS arrays and other surge suppressor component products.
These TVS devices protect electronic systems from the effects of lightning, electrostatic discharge (ESD), nuclear electromagnetic pulses
(NEMP), inductive switching and EMI / RFI. ProTek Devices also offers high performance interface and linear products that include analog
switches; multiplexers; LED drivers; audio control ICs; RF and related high frequency products. The analog devices work in a host of consumer; industrial; automotive and other applications.
CONTACT US
Corporate Headquarters
2929 South Fair Lane
Tempe, Arizona 85282
USA
By Telephone
General: 602-431-8101
Sales: & Marketing: 602-414-5109
Customer Service: 602-414-5114
Product Technical Support: 602-414-5107
By Fax
General: 602-431-2288
By E-mail:
Sales: [email protected]
Customer Service: [email protected]
Technical Support: [email protected]
ProTek Devices (Asia Pacific) Pte. Ltd.
8 Ubi Road 2, #06-19
Zervex
Singapore - 408538
Tel: +65-67488312
Fax: +65-67488313
Web
www.protekdevices.com
COPYRIGHT © ProTek Devices 2000 - This literature is subject to all applicable copyright laws and is not for resale in any manner.
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice.
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering
and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of
its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special,
consequential or incidental damages.
LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory.
PATENT INFORMATION: This device is patented under U.S. Patent No. Des. “D456,367S”.
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