FPF1003A / FPF1004 IntelliMAX™ Advanced Load Management Products Features Description The FPF1003A and FPF1004 are low RDS P-channel MOSFET load switches with controlled turn-on. The input voltage range operates from 1.2 V to 5.5 V to fulfill today's ultra-portable device supply requirements. Switch control is accomplished with a logic input (ON) capable of interfacing directly with low-voltage control signal. In FPF1004, a 120 Ω on-chip load resistor is added for output quick discharge when the switch is turned off. 1.2 V to 5.5 V Input Voltage Operating Range Typical RDS(ON): - 30 mΩ at VIN=5.5 V - 35 mΩ at VIN=3.3 V ESD Protected: Above 8000 V HBM ROHS Compliant Both FPF1003A and FPF1004 are available in a spacesaving 1.0x1.5 mm2 wafer-level chip-scale package. Applications PDA’s Cell Phones GPS Devices MP3 Players Digital Cameras Peripheral Ports Hot Swap Supplies Ordering Information Part Number Top Mark FPF1003A FPF1004 Q2 Q3 © 2007 Fairchild Semiconductor Corporation FPF1003A / FPF1004 • Rev. 1.0.6 Switch 30 mΩ, PMOS Input Buffer Output Discharge ON Pin Activity NA Active HIGH 120Ω Active HIGH Schmitt Package 1.0 x 1.5 mm2 Wafer-Level Chip-Scale Package (WLCSP), www.fairchildsemi.com FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products August 2012 VIN OFF ON ON VOUT To Load GND Figure 1. Typical Application Block Diagram Figure 2. Functional Block Diagram © 2007 Fairchild Semiconductor Corporation FPF1003A / FPF1004 • Rev. 1.0.6 www.fairchildsemi.com 2 FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products Application Diagram Figure 3. WLCSP Bumps Facing UP Figure 4. WLCSP Bumps Facing Down Figure 5. 1.0mm x 1.5mm WLCSP Pin Assignments (Bottom View) Pin Definitions Pin # Name Description A2, B2 VIN Input to the power switch and the supply voltage for the IC C2 ON ON Control Input A1, B1 VOUT Output of the power switch C1 GND Ground © 2007 Fairchild Semiconductor Corporation FPF1003A / FPF1004 • Rev. 1.0.6 www.fairchildsemi.com 3 FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products Pin Configurations Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit -0.3 6.0 V VIN VIN, VOUT, ON to GND ISW Maximum Continuous Switch Current 2.0 A PD Power Dissipation at TA=25°C(1) 1.2 W TSTG Storage Junction Temperature -65 +150 °C TA Operating Temperature Range -40 +125 °C ΘJA Thermal Resistance, Junction-to-Ambient 85 °C/W ESD Electrostatic Discharge Capability Human Body Model, JESD22-A114 5500 Charged Device Model, JESD22-C101 1500 V Note: 1. Package power dissipation on one square inch pad, 2 oz. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Unit VIN Supply Voltage 1.2 5.5 V TA Ambient Operating Temperature -40 +85 °C © 2007 Fairchild Semiconductor Corporation FPF1003A / FPF1004 • Rev. 1.0.6 www.fairchildsemi.com 4 FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products Absolute Maximum Ratings Unless otherwise noted, VIN=1.2 to 5.0V, TA=-40 to +85°C; typical values are at VIN=3.3V and TA=25°C. Symbol Parameter Conditions Min. Typ. Max. Units 5.5 V VON=GND, OUT=Open 1 μA VON=GND, VOUT=0 at VIN=5.5, TA=85°C 1 μA 100 nA 1 μA Basic Operation VIN IQ(OFF) Supply Voltage Off Supply Current ISD Shutdown Current IQ Quiescent Current RON On-Resistance 1.2 VON=GND, VOUT=0 at VIN=3.3, TA=85°C 10 IOUT=0 mA, VIN=VON VIN=5.5 V, IOUT=1 A, TA=25°C 20 30 VIN=3.3 V, IOUT=1 A, TA=25°C 25 35 VIN=1.5 V, IOUT=1 A, TA=25°C 50 75 VIN=1.2 V, IOUT=1 A, TA=25°C 95 150 VIN=3.3 V, IOUT=1 A, TA=85°C 30 42 VIN=3.3 V, IOUT=1 A, TA=40°C to 85°C 12 mΩ 42 RPD Output Pull-Down Resistance VIH ON Input Logic High Voltage VIN=1.2 V VIL ON Input Logic Low Voltage VIN=2.7 V to 5.5 V 0.8 VIN=1.2 V 0.35 ION ON Input Leakage VON=VIN or GND VIN=3.3 V, VON=0 V, TA=25°C, FPF1004 VIN=1.2 V to 5.5 V 75 120 Ω 2 V 0.8 1 V μA Dynamic Characteristics tON tOFF tR tF Turn-On Time Turn-Off Time VOUT Rise Time VOUT Fall Time © 2007 Fairchild Semiconductor Corporation FPF1003A / FPF1004 • Rev. 1.0.6 VIN=3.3 V, RL=500 Ω, CL=0.1 µF, TA=25°C 13 VIN=3.3 V, RL=500 Ω, CL=0.1 µF, TA=25°C, FPF1003A 45 VIN=3.3 V, RL=500 Ω, CL=0.1 µF, RL_CHIP=120 Ω, TA=25°C, FPF1004 15 VIN=3.3 V, RL=500 Ω, CL=0.1 µF, TA=25°C 13 VIN=3.3 V, RL=500 Ω, CL=0.1 µF, TA=25°C, FPF1003A 113 VIN=3.3 V, RL=500 Ω, CL=0.1 µF, RL_CHIP=120 Ω, TA=25°C, FPF1004 10 μs μs μs μs www.fairchildsemi.com 5 FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products Electrical Characteristics Typical Performance Characteristics Figure 6. Quiescent Current vs. VIN Figure 7. ON Threshold vs. VIN Figure 8. Quiescent Current vs. Temperature Figure 9. Quiescent Current (OFF) vs. Temperature Figure 10. ISWITCH-OFF Current vs. Temperature Figure 11. ISWITCH-OFF Current vs. VIN © 2007 Fairchild Semiconductor Corporation FPF1003A / FPF1004 • Rev. 1.0.6 www.fairchildsemi.com 6 Figure 12. RON vs. VIN Figure 13. RON vs. Temperature Figure 14. tON/tOFF vs. Temperature Figure 15. tR/tF vs. Temperature Figure 16. FPF1003A tON Response Figure 17. FPF1003A tOFF Response © 2007 Fairchild Semiconductor Corporation FPF1003A / FPF1004 • Rev. 1.0.6 FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products Typical Performance Characteristics www.fairchildsemi.com 7 Figure 18. FPF1003A tON Response Figure 19. FPF1003A tOFF Response Figure 20. FPF1004 tON Response Figure 21. FPF1004 tOFF Response Figure 22. FPF1004 tON Response Figure 23. FPF1004 tOFF Response © 2007 Fairchild Semiconductor Corporation FPF1003A / FPF1004 • Rev. 1.0.6 FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products Typical Performance Characteristics www.fairchildsemi.com 8 1.2 to 5.5 V. Switch control is accomplished with a logic input (ON) capable of interfacing directly with lowvoltage control signal. In FPF1004, a 120 Ω on-chip load resistor is added for output quick discharge when the switch is turned off. Input Capacitor FPF1003A and FPF1004 are low-RDS(ON) P-channel load switches with controlled turn-on. The core of each device is a 30 mΩ P-Channel MOSFET and a controller capable of functioning over an input operating range of Application Information Figure 24. Typical Application PMOS switch, a CIN greater than COUT is recommended. A COUT greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN. Input Capacitor To limit the voltage drop on the input supply caused by transient inrush currents when the switch turns on into a discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 0.1 μF ceramic capacitor, CIN, must be placed close to the VIN pin. A higher value of CIN can be used to further reduce the voltage drop experienced as the switch is turned on into a large capacitive load. Board Layout For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for VIN, VOUT, and GND minimizes the parasitic electrical effects and case-to-ambient thermal impedance. Output Capacitor A 0.1 μF capacitor, COUT, should be placed between VOUT and GND. This capacitor prevents parasitic board inductance from forcing VOUT below GND when the switch turns off. Due to the integral body diode in the © 2007 Fairchild Semiconductor Corporation FPF1003A / FPF1004 • Rev. 1.0.6 FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products Description of Operation www.fairchildsemi.com 9 0.03 C E 2X F A (Ø0.350) SOLDER MASK OPENING B (Ø0.250) Cu Pad A1 (1.00) BALL A1 INDEX AREA D (0.50) 0.03 C 2X TOP VIEW RECOMMENDED LAND PATTERN (NSMD PAD TYPE) 0.06 C 0.625 0.539 0.05 C C 0.332±0.018 0.250±0.025 E SEATING PLANE D SIDE VIEWS NOTES: A. NO JEDEC REGISTRATION APPLIES. 0.005 Ø0.315 +/- .025 6X 0.50 C 1.00 B A 0.50 (Y) ±0.018 1 2 F (X) ±0.018 BOTTOM VIEW C A B B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCE PER ASMEY14.5M, 1994. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS ±43 MICRONS (539-625 MICRONS). F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products Physical Dimensions G. DRAWING FILNAME: MKT-UC006AFrev2. Figure 25. 1.0 x 1.5 mm2 Wafer-Level Chip-Scale Package (WLCSP) Product-Specific Dimensions Product D E X Y FPF1003A 1480 µm ± 30 µm 980 µm ± 30 µm 240 µm 240 µm FPF1004 1480 µm ± 30 µm 980 µm ± 30 µm 240 µm 240 µm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. © 2007 Fairchild Semiconductor Corporation FPF1003A / FPF1004 • Rev. 1.0.6 www.fairchildsemi.com 10 FPF1003A / FPF1004 — IntelliMAX™ Advanced Load Management Products © 2007 Fairchild Semiconductor Corporation FPF1003A / FPF1004 • Rev. 1.0.6 www.fairchildsemi.com 11