ECG050 The Communications Edge TM Product Information InGaP HBT Gain Block Product Features x DC – 4 GHz x +19 dBm P1dB at 1 GHz x +34 dBm OIP3 at 1 GHz x 19 dB Gain at 1 GHz x 5.5 dB Noise Figure at 2 GHz x Available in SOT-86, SOT89 and lead-free / green SOT89 Package Styles x Internally matched to 50 : Applications x Mobile Infrastructure x CATV / DBS x W-LAN / ISM x RFID x Defense / Homeland Security x Fixed Wireless Product Description Functional Diagram The ECG050 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 1000 MHz, the ECG050 typically provides 19 dB of gain, +34 dBm Output IP3, and +19 dBm P1dB. GND The ECG050 consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is available in low-cost, surface-mountable plastic SOT-86 and SOT-89 packages. The ECG050 is also available in a lead-free/green/RoHScompliant SOT-89 package. All devices are 100% RF and DC tested. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the ECG050 will work for other various applications within the DC to 4 GHz frequency range such as CATV and fixed wireless. Specifications (1) Parameter 4 1 2 3 RF IN GND RF OUT ECG050B / ECG050B-G GND 4 RF In 3 RF Out 1 2 GND ECG050C Typical Performance (3) Units Min MHz MHz dB dBm dBm MHz dB dB dB dBm dBm dB V mA DC Operational Bandwidth Test Frequency Gain Output P1dB Output IP3 (2) Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current 4.2 Typ Max Parameter 4000 Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure 1000 19 +19 +34 2000 17 19 15 +18.5 +31 5.4 5.0 70 Units MHz dB dB dB dBm dBm dB Typical 500 20 -17 -15 +18 +33 3.5 900 19.2 -18 -15 +19 +34 4 1900 17 -19 -15 +18.5 +31 5.4 3. Test conditions: T = 25º C, Supply Voltage = +6 V, Device Voltage = +5.0V, Rbias = 14 , 50 2140 16 -20 -15 +18.2 +30.5 3.8 System. 5.2 1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +6 V, Rbias = 14 , 50 System. 2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Ordering Information Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature RF Input Power (continuous) Device Current Junction Temperature Part No. Rating -40 to +85 qC -65 to +150 qC +12 dBm 150 mA +250 qC Description ECG050B InGaP HBT Gain Block ECG050B-G InGaP HBT Gain Block ECG050C ECG050B-PCB ECG050C-PCB InGaP HBT Gain Block (SOT-86 Pkg) 700 –2400 MHz Fully Assembled Eval. Board 700 –2400 MHz Fully Assembled Eval. Board (leaded SOT-89 Pkg) (lead-free/green/RoHS-compliant SOT-89 Pkg) Operation of this device above any of these parameters may cause permanent damage. Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com December 2004 ECG050 The Communications Edge TM Product Information InGaP HBT Gain Block Typical Device RF Performance Supply Bias = +6 V, Rbias = 14 :, Icc = 70 mA Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure MHz dB dB dB dBm dBm dB 100 20.4 -17 -15 +18 +33 3.4 500 20 -17 -15 +18 +33 3.5 900 19.2 -18 -15 +19 +34 4 1900 17.2 -19 -15 +18.7 +31 5.4 2140 16.7 -20 -15 +18.2 +30.5 5.8 2400 16.1 -20 -15 +17.8 +29 6 3500 14.2 -19 -14 +12.2 5800 10.3 -11 -7.5 1. Test conditions: T = 25º C, Supply Voltage = +6 V, Device Voltage = 5.0 V, Rbias = 14 , Icc = 70 mA typical, 50 System. 2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. Gain vs. Frequency S11, S22 vs. Frequency 200 -5 160 S11, S22 (dB) 18 S22 -10 16 120 -15 14 S11 -20 12 10 40 -25 0 1 2 3 4 5 6 0 0 Frequency (GHz) OIP3 vs. Frequency 2 3 4 Frequency (GHz) 5 6 NF (dB) 30 25 1000 85°C 1500 2000 Frequency (MHz) 0 1 2 3 Vde (V) 6 22 4 18 2 14 25°C 3000 5 P1dB vs. Frequency -40°C 2500 4 26 6 35 20 500 1 Noise Figure vs. Frequency 40 25°C 25°C 80 P1dB (dBm) Gain (dB) 20 Icc vs. Vde 0 Icc (mA) 22 OIP3 (dBm) 0 500 1000 1500 2000 Frequency (MHz) 10 500 1000 85°C -40°C 1500 2000 Frequency (MHz) 2500 3000 Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com December 2004 ECG050 The Communications Edge TM Product Information InGaP HBT Gain Block Recommended Application Circuit Vcc Icc = 70 mA R4 Bias Resistor C4 Bypass Capacitor C3 0.018 µF L1 RF Choke RF IN RF OUT ECG050 C2 Blocking Capacitor C1 Blocking Capacitor ECG050B-PCB Reference Designator L1 C1, C2, C4 50 820 nH .018 µF ECG050C-PCB Recommended Component Values Frequency (MHz) 500 900 1900 2200 220 nH 68 nH 27 nH 22 nH 1000 pF 100 pF 68 pF 68 pF 2500 18 nH 56 pF 3500 15 nH 39 pF 1. The proper values for the components are dependent upon the intended frequency of operation. 2. The following values are contained on the evaluation board to achieve optimal broadband performance: Ref. Desig. L1 C1, C2 C3 C4 R4 Value / Type 39 nH wirewound inductor 56 pF chip capacitor 0.018 PF chip capacitor Do Not Place 14 : 1% tolerance Size 0603 0603 0603 Recommended Bias Resistor Values Supply R1 value Size Voltage 6V 14.3 ohms 0805 7V 28.6 ohms 1210 8V 43 ohms 1210 9V 57 ohms 2010 10 V 71 ohms 2010 12 V 100 ohms 2512 The proper value for R1 is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of +6 V. A 1% tolerance resistor is recommended. 0805 Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com December 2004 ECG050 The Communications Edge TM Product Information InGaP HBT Gain Block ECG050B (SOT-89 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Product Marking The component will be marked with an “E050” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135” ) diameter drill and have a final plated thru diameter of .25 mm (.010” ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Land Pattern Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com December 2004 ECG050 The Communications Edge TM Product Information InGaP HBT Gain Block ECG050B-G (Green / Lead-free SOT-89 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded (maximum 245qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Product Marking Outline Drawing The component will be marked with an “ E050G” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “ Application Notes” section. MSL / ESD Rating ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Land Pattern Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135” ) diameter drill and have a final plated thru diameter of .25 mm (.010” ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com December 2004 ECG050 The Communications Edge TM Product Information InGaP HBT Gain Block ECG050C (SOT-86 Package) Mechanical Information Outline Drawing Product Marking The component will be marked with a twodigit numeric lot code followed by a “ V” designator on the top surface of the package. Tape and reel specifications for this part are located on the website in the “ Application Notes” section. MSL / ESD Rating ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 1 at +235 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes Land Pattern 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135” ) diameter drill and have a final plated thru diameter of .25 mm (.010” ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com December 2004 ECG050 The Communications Edge TM Product Information InGaP HBT Gain Block Typical Device S-Parameters – ECG050B / ECG050B-G S-Parameters (Vdevice = +5 V, ICC = 70 mA, T = 25 C, calibrated to device leads) Freq (MHz) 50 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000 S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) -24.67 -23.02 -20.62 -18.00 -15.55 -13.31 -12.32 -10.81 -9.44 -8.05 -6.55 -5.51 -4.48 -3.70 -46.71 -90.90 -120.26 -154.19 173.42 144.67 116.58 93.67 72.95 55.09 39.20 25.52 21.16 20.62 19.55 18.33 17.43 16.53 15.45 14.33 13.19 12.09 10.89 9.64 8.50 176.94 148.95 121.77 98.78 77.57 55.93 35.48 15.84 -3.31 -20.87 -38.22 -54.94 -70.62 -23.25 -22.86 -21.99 -20.82 -19.60 -18.78 -18.21 -17.75 -17.44 -17.20 -17.20 -17.33 -17.57 0.44 2.51 3.04 0.20 -6.65 -15.98 -25.37 -35.05 -45.26 -55.51 -66.45 -76.61 -87.04 -19.85 -17.88 -15.13 -12.53 -10.50 -8.97 -7.94 -7.23 -6.22 -5.47 -4.64 -4.04 -3.59 -5.11 -66.96 -106.94 -136.27 -164.08 169.04 142.85 121.33 101.54 83.50 67.48 51.93 38.34 Typical Device S-Parameters – ECG050C S-Parameters (Vdevice = +5, ICC = 70 mA, T = 25 C, calibrated to device leads) Freq (MHz) 50 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000 S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) -20.98 -20.20 -19.34 -18.54 -18.87 -19.47 -20.32 -21.04 -18.70 -16.20 -12.95 -10.83 -8.87 1.45 -4.73 -18.92 -33.65 -50.53 -73.82 -97.64 -138.52 -173.90 159.57 137.68 123.87 110.42 20.66 20.19 19.27 18.09 17.03 15.90 14.91 14.02 13.20 12.38 11.64 10.80 9.99 176.82 153.75 130.28 109.96 92.08 75.80 61.09 46.72 32.70 19.24 5.50 -8.36 -21.17 -22.87 -22.67 -22.24 -21.62 -20.77 -19.95 -19.08 -18.29 -17.51 -16.83 -16.30 -15.88 -15.56 0.51 4.30 8.25 10.86 12.09 11.53 9.94 6.69 2.82 -2.20 -7.81 -14.30 -20.60 -17.49 -18.13 -18.82 -19.01 -19.21 -18.26 -16.38 -14.83 -12.69 -11.23 -9.78 -8.58 -7.59 -2.70 -31.56 -58.47 -89.85 -122.43 -148.97 -175.04 166.20 150.06 134.69 122.17 108.98 97.93 Device S-parameters are available for download off of the website at: http://www.wj.com Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com December 2004