6N139, 6N138, HCPL-0701, HCPL-0700, HCNW138, HCNW139 Low Input Current, High Gain Optocouplers Data Sheet Lead (Pb) Free RoHS 6 fully compliant RoHS 6 fully compliant options available; -xxxE denotes a lead-free product Description Features These high gain series couplers use a Light Emitting Diode and an integrated high gain photodetector to provide extremely high current transfer ratio between input and output. Separate pins for the photodiode and output stage result in TTL compatible saturation voltages and high speed operation. Where desired the VCC and VO terminals may be tied together to achieve conven tional photodarlington operation. A base access terminal allows a gain bandwidth adjustment to be made. High current transfer ratio – 2000% typical (4500 % typical for HCNW139/138) Low input current requirements – 0.5 mA TTL compatible output – 0.1 V VOL typical Performance guaranteed over temperature 0°C to 70°C Base access allows gain bandwidth adjustment High output current – 60 mA Safetyapproval UL recognized – 3750 V rms for 1 minute and 5000 V rms* for 1 minute per UL 1577 CSA approved IEC/EN/DIN EN 60747-5-2 approved with VIORM = 1414 Vpeak for HCNW139 and HCNW138 Available in 8-Pin DIP or SOIC-8 footprint or widebody package MIL-PRF-38534 hermetic version available (HCPL-5700/1) The 6N139, HCPL-0701, and CNW139 are for use in CMOS, LSTTL or other low power applications. A 400% minimum current transfer ratio is guaranteed over 0 to 70°C operating range for only 0.5 mA of LED current. The 6N138, HCPL-0700, and HCNW138 are designed for use mainly in TTL applications. Current Transfer Ratio (CTR) is 300% minimum over 0 to 70°C for an LED current of 1.6 mA (1 TTL Unit load ). A 300% minimum CTR enables operation with 1 TTL Load using a 2.2 kΩ pull-up resistor. Applications Functional Diagram NC 1 8 VCC ANODE 2 7 VB CATHODE 3 NC 4 6 VO TRUTH TABLE LED VO ON LOW OFF HIGH 5 GND Ground isolate most logic families – TTL/TTL, CMOS/ TTL, CMOS/CMOS, LSTTL/TTL, CMOS/LSTTL Low input current line receiver High voltage insulation (HCNW139/138) EIA RS-232C line receiver Telephone ring detector 117 V ac line voltage status indicator – low input power dissipation Low power systems – ground isolation *5000 V rms/1 minute rating is for HCNW139/138 and Option 020 (6N139/138) products only. A 0.1 μF bypass capacitor connected between pins 8 and 5 is recommended. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. Selection for lower input current down to 250 μA is available upon request. The HCPL-0701 and HCPL-0700 are surface mount devices packaged in an industry standard SOIC-8 footprint. The SOIC-8 does not require “through holes” in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes. The HCNW139 and HCNW138 are packaged in a widebody encapsulation that provides creepage and clearance dimensions suitable for safety approval by regulatory agencies worldwide. Selection Guide 8-Pin DIP (300 Mil) Small Outline SO-8 Single Dual Channel Channel Package Package HCPLHCPL- Single Channel Package Dual Channel Package HCPL- 6N139 2731[1] 0701 6N138 [1] 0700 2730 [1] HCPL-4701 [1] 4731 [1] 070A Note: 1. Technical data are on separate Avago publications. 2 Widebody Package (400 mil) Single Channel Package Minimum Input ON Current (IF) Minimum CTR Absolute Maximum VCC 0731 HCNW139 0.5 mA 400% 18 V 0730 HCNW138 1.6 mA 300% 7V 40 μA 800% 18 V 0.5 mA 300% 20 V [1] 073A Hermetic Single and Dual Channel Packages HCPL- 5701[1] 5700[1] 5731[1] 5730[1] Ordering Information 6N138, 6N139, HCPL-0700 and HCPL-0701 are UL Recognized with 3750 Vrms for 1 minute per UL1577 and are approved under CSA Component Acceptance Notice #5, File CA 88324. Option Part Number 6N138 6N139 HCPL-0700 HCPL-0701 HCNW138 HCNW139 RoHS non RoHS Compliant Compliant Package Surface Mount Gull Wing -000E no option -300E #300 X X -500E #500 X X -020E #020 -320E #320 -520E #520 -060E #060 -360E #360 UL 5000 Vrms/ 1 Minute IEC/EN/DIN rating EN 60747-5-2 Quantity Tape & Reel 50 per tube 300 mil DIP-8 X X X X X X X -560E #560 X -000E no option X -500E #500 -060E #060 -560E #560 -000E no option -300E #300 -500E #500 SO-8 50 per tube X X 50 per tube X 50 per tube X 1000 per reel X X 50 per tube X 50 per tube X 1000 per reel 100 per tube X X 1500 per reel X X 400 mil Widebody DIP-8 1000 per reel X X X 100 per tube X 1500 per reel 42 per tube X X X X To order, choose a part number from the part number column and combine with the desired option from the option column to form an order entry. 42 per tube X 750 per reel Schematic V CC 8 Example 1: 6N138-560E to order product of 300 mil DIP Gull Wing Surface Mount package in Tape and Reel packaging with IEC/EN/DIN EN 60747-5-2 Safety Approval and RoHS compliant. Example 2: HCPL-0700 to order product of 300 mil DIP package in Tube packaging and non RoHS compliant. I CC 2 ANODE IF + VF CATHODE – IO 3 VO Option datasheets are available. Contact your Avago sales representative or authorized distributor for information. Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since July 15, 2001 and RoHS compliant will use ‘–XXXE.’ 3 6 5 SHIELD IB 7 VB GND Package Outline Drawings 8-Pin DIP Package (6N139/6N138)** 7.62 ± 0.25 (0.300 ± 0.010) 9.65 ± 0.25 (0.380 ± 0.010) 8 TYPE NUMBER 7 6 5 6.35 ± 0.25 (0.250 ± 0.010) OPTION CODE* DATE CODE A XXXXZ YYWW RU 1 2 3 4 UL RECOGNITION 1.78 (0.070) MAX. 1.19 (0.047) MAX. 5° TYP. 3.56 ± 0.13 (0.140 ± 0.005) 4.70 (0.185) MAX. + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 0.51 (0.020) MIN. 2.92 (0.115) MIN. DIMENSIONS IN MILLIMETERS AND (INCHES). * MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 020 OPTION NUMBERS 300 AND 500 NOT MARKED. 0.65 (0.025) MAX. 1.080 ± 0.320 (0.043 ± 0.013) 2.54 ± 0.25 (0.100 ± 0.010) NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. **JEDEC Registered Data. 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138) LAND PATTERN RECOMMENDATION 9.65 ± 0.25 (0.380 ± 0.010) 8 7 6 1.016 (0.040) 5 6.350 ± 0.25 (0.250 ± 0.010) 1 2 3 10.9 (0.430) 4 1.27 (0.050) 1.19 (0.047) MAX. 1.780 (0.070) MAX. 9.65 ± 0.25 (0.380 ± 0.010) 7.62 ± 0.25 (0.300 ± 0.010) 3.56 ± 0.13 (0.140 ± 0.005) 1.080 ± 0.320 (0.043 ± 0.013) 0.635 ± 0.130 2.54 (0.025 ± 0.005) (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. 4 2.0 (0.080) 0.635 ± 0.25 (0.025 ± 0.010) + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 12° NOM. Small Outline SO-8 Package (HCPL-0701/HCPL-0700) LAND PATTERN RECOMMENDATION 8 7 6 5 XXX YWW 3.937 ± 0.127 (0.155 ± 0.005) 5.994 ± 0.203 (0.236 ± 0.008) TYPE NUMBER (LAST 3 DIGITS) 7.49 (0.295) DATE CODE PIN ONE 1 2 3 4 1.9 (0.075) 0.406 ± 0.076 (0.016 ± 0.003) 1.270 BSC (0.050) 0.64 (0.025) * 5.080 ± 0.127 (0.200 ± 0.005) 3.175 ± 0.127 (0.125 ± 0.005) 7° 1.524 (0.060) 45° X 0.432 (0.017) 0 ~ 7° 0.228 ± 0.025 (0.009 ± 0.001) 0.203 ± 0.102 (0.008 ± 0.004) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) 5.207 ± 0.254 (0.205 ± 0.010) 0.305 MIN. (0.012) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX. 8-Pin Widebody DIP Package (HCNW139/HCNW138) 11.00 MAX. (0.433) 11.23 ± 0.15 (0.442 ± 0.006) 8 7 6 5 TYPE NUMBER A HCNWXXXX 9.00 ± 0.15 (0.354 ± 0.006) DATE CODE YYWW 1 2 3 4 10.16 (0.400) TYP. 1.55 (0.061) MAX. 7° TYP. 5.10 MAX. (0.201) 3.10 (0.122) 3.90 (0.154) + 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) 0.51 (0.021) MIN. 2.54 (0.100) TYP. 1.80 ± 0.15 (0.071 ± 0.006) 0.40 (0.016) 0.56 (0.022) DIMENSIONS IN MILLIMETERS (INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. 5 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138) 11.23 ± 0.15 (0.442 ± 0.006) 8 7 6 LAND PATTERN RECOMMENDATION 5 9.00 ± 0.15 (0.354 ± 0.006) 1 2 3 13.56 (0.534) 4 2.29 (0.09) 1.3 (0.051) 12.30 ± 0.30 (0.484 ± 0.012) 1.55 (0.061) MAX. 11.00 MAX. (0.433) 4.00 MAX. (0.158) 1.80 ± 0.15 (0.071 ± 0.006) 0.75 ± 0.25 (0.030 ± 0.010) 2.54 (0.100) BSC 1.00 ± 0.15 (0.039 ± 0.006) + 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) DIMENSIONS IN MILLIMETERS (INCHES). 7° NOM. LEAD COPLANARITY = 0.10 mm (0.004 INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. Solder Reflow Temperature Profile 300 PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC. REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC. 200 PEAK TEMP. 245 °C PEAK TEMP. 240 °C TEMPERATURE (°C) 2.5 C ± 0.5 °C/SEC. 30 SEC. 160 °C 150 °C 140 °C SOLDERING TIME 200 °C 30 SEC. 3 °C + 1 °C/–0.5 °C 100 PREHEATING TIME 150 °C, 90 + 30 SEC. 50 SEC. TIGHT TYPICAL LOOSE ROOM TEMPERATURE 0 0 50 100 150 TIME (SECONDS) NOTE: NON-HALIDE FLUX SHOULD BE USED. 6 PEAK TEMP. 230 °C 200 250 Recommended Pb-Free IR Profile tp Tp TEMPERATURE TL Tsmax * 260 +0/-5 °C TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE 15 SEC. 217 °C 150 - 200 °C RAMP-UP 3 °C/SEC. MAX. NOTES: THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200 °C, Tsmin = 150 °C RAMP-DOWN 6 °C/SEC. MAX. Tsmin ts PREHEAT 60 to 180 SEC. 25 tL NOTE: NON-HALIDE FLUX SHOULD BE USED. 60 to 150 SEC. * RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 400mils PACKAGE IS 245 °C t 25 °C to PEAK TIME Regulatory Information The 6N139/138, HCNW139/138, and HCPL-0701/0700 have been approved by the following organizations: UL IEC/EN/DIN EN 60747-5-2 Recognized under UL 1577, Component Recognition Program, File E55361. Approved under IEC 60747-5-2:1997 + A1:2002 EN 60747-5-2:2001 + A1:2002 DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01 (HCNW139/138 only) CSA Approved under CSA Component Acceptance Notice #5, File CA 88324. Insulation and Safety Related Specifications Parameter Symbol 8-Pin DIP (300 Mil) Value Units Conditions Minimum External Air Gap (External Clearance) L(101) 7.1 4.9 9.6 mm Measured from input terminals to output terminals, shortest distance through air. Minimum External Tracking (External Creepage) L(102) 7.4 4.8 10.0 mm Measured from input terminals to output terminals, shortest distance path along body. Minimum Internal Plastic Gap (Internal Clearance) 0.08 0.08 1.0 mm Through insulation distance, conductor to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Minimum Internal Tracking (Internal Creepage) NA NA 4.0 mm Measured from input terminals to output terminals, along internal cavity. 200 200 200 Volts DIN IEC 112/VDE 0303 Part 1 IIIa IIIa IIIa Tracking Resistance (Comparative Tracking Index) Isolation Group CTI SO-8 Value Widebody (400 Mil) Value Option 300 - surface mount classification is Class A in accordance with CECC 00802. 7 Material Group (DIN VDE 0110, 1/89, Table 1) IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCNW139 and HCNW138) Description Symbol Installation Classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage ≤600 V rms Characteristic Units I-IV for rated mains voltage ≤1000 V rms I-III Climatic Classification 55/100/21 Pollution Degree (DIN VDE 0110/1.89) 2 VIORM 1414 Vpeak Input to Output Test Voltage, Method b* VPR = 1.875 x VIORM, 100% Production Test with tP = 1 sec, Partial Discharge < 5 pC VPR 2652 Vpeak Input to Output Test Voltage, Method a* VPR = 1.5 x VIORM, Type and Sample Test, tP = 60 sec, Partial Discharge < 5 pC VPR 2121 Vpeak VIOTM 8000 Vpeak TS IS,INPUT PS,OUTPUT 175 400 700 °C mA mW RS > 109 Maximum Working Insulation Voltage Highest Allowable Overvoltage* (Transient Overvoltage, tini = 10 sec) Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure 11, Thermal Derating curve.) Case Temperature Current (Input Current IF, PS = 0) Output Power Insulation Resistance at TS, VIO = 500 V *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN 60747-5-2, for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application. 8 Absolute Maximum Ratings* (No Derating Required up to 85°C) Parameter Storage Temperature Operating Temperature** Average Forward Input Current Peak Forward Input Current (50% Duty Cycle, 1 ms Pulse Width) Peak Transient Input Current (<1 μs Pulse Width, 300 pps) Reverse Input Voltage Symbol Min. Max. Units TS -55 125 °C TA -40 85 °C IF(AVG) 20 mA IFPK 40 mA IF(TRAN) 1.0 A VR 5 V 3 V 35 mW HCNW139/138 Input Power Dissipation PI Output Current (Pin 6) IO 60 mA Emitter Base Reverse Voltage (Pin 5-7) VEB 0.5 V Supply Voltage and Output Voltage (6N139, HCPL-0701, HCNW139) VCC -0.5 18 V Supply Voltage and Output Voltage (6N138, HCPL-0700, HCNW138) VCC -0.5 7 V Output Power Dissipation PO 100 mW Total Power Dissipation PT 135 mW Lead Solder Temperature (for Through Hole Devices) 260°C for 10 sec., 1.6 mm below seating plane HCNW139/138 260°C for 10 sec., up to seating plane Reflow Temperature Profile (for SOIC-8 and Option #300) See Package Outline Drawings section *JEDEC Registered Data for 6N139 and 6N138. **0°C to 70°C on JEDEC Registration. Recommended Operating Conditions Parameter Symbol Min. Max. Units Power Supply Voltage VCC 4.5 18 V Forward Input Current (ON) IF(ON) 0.5 12.0 mA Forward Input Voltage (OFF) VF(OFF) 0 0.8 V TA 0 70 °C Operating Temperature 9 Electrical Specifications 0°C ≤ TA ≤ 70°C, 4.5 V ≤ VCC ≤ 18 V, 0.5 mA ≤ IF(ON) ≤ 12 mA, 0 V ≤ VF(OFF) ≤ 0.8 V, unless otherwise specified. All Typicals at TA = 25°C. See Note 7. Parameter Sym. Device Min. Typ.** Max. Units Test ConditionsFig. Current Transfer Ratio Logic Low Output Voltage CTR VOL 6N139 HCPL-0701 HCNW139 6N139 HCPL-0701 HCNW139 6N138 HCPL-0700 HCNW138 6N139 HCPL-0701 HCNW139 400* 2000 5000 % 400 500* 4500 1600 2600 IF = 1.6 mA 500 300 200 300* 3000 1600 850 1600 2600 IF = 5.0 mA IF = 12 mA IF = 1.6 mA 1500 0.1 0.4 V Logic High Output Current Logic Low Supply Current Logic High Supply Current Input Forward Voltage IOH ICCL ICCH VF Input Reverse Breakdown Voltage BVR Temperature Coefficient of Forward Voltage Input Capacitance ΔVF ΔTA HCNW139 HCNW138 CIN HCNW139 HCNW138 0.1 0.05 100 0.1 250 0.4 1.5 0.5 2 0.01 10 2, 3 1, 2, 4 VCC = 4.5 1 2 μA VO = VCC = 18 V IF = 0 mA 2 VO = VCC = 7 V mA IF = 1.6 mA, VO = Open, VCC = 18 V μA IF = 0 mA, VO = Open, VCC = 18 V V TA = 25°C 10 1.25 1.40 1.7* IF = 1.6 mA 4, 8 1.75 1.0 1.45 0.95 5.0* 3.0 TA = 25°C 1.85 1.95 V -1.8 mV/°C 60 90 pF IR = 10 μA, TA = 25°C IR = 100 μA, TA = 25°C IF = 1.6 mA f = 1 MHz, VF = 0 V 2 2 1 * JEDEC Registered Data for 6N139 and 6N138. **All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted. 10 IF = 0.5 mA, IO = 2 mA Note VCC = 4.5 VO = 0.4 V IF = 1.6 mA, IO = 8 mA IF = 5.0 mA, IO = 15 mA IF = 12 mA, IO = 24 mA IF = 1.6 mA, IO = 4.8 mA 0.2 6N138 HCPL-0700 HCNW138 6N139 HCPL-0701 HCNW139 6N138 HCPL-0700 HCNW138 6N138/139 HCPL-0701/ 0700 HCNW139 HCNW138 6N138/139 HCPL-0701/ 0700 HCNW139 HCNW138 6N138 6N139 HCPL-0701 HCPL-0700 HCNW139 HCNW138 IF = 0.5 mA 8 Switching Specifications (AC) Over recommended operating conditions (TA = 0 to 70°C), VCC = 5 V, unless otherwise specified. Parameter Sym. Device Propagation Delay Time to Logic Low at Output tPHL 6N139 HCPL-0701 HCNW139 6N139 HCPL-0701 HCNW139 6N138 HCPL-0700 HCNW138 6N139 HCPL-0701 HCNW139 6N139 HCPL-0701 HCNW139 6N138 HCPL-0700 HCNW138 Propagation Delay Time to Logic High at Output Common Mode Transient Immunity at Logic High Output Common Mode Transient Immunity at Logic Low Output tPLH Min. Typ.** Max. TA =25°C 5 25* 30 s IF = 0.5 mA, Rl = 4.7 k 0.2 1* 2 s IF = 12 mA, Rl = 270 1.6 10* 11 15 s IF = 1.6 mA, Rl = 2.2 k 18 60* 11 90 s IF = 0.5 mA, Rl = 4.7 k 2 7* 115 10 s IF = 12 mA, Rl = 270 10 35* 11 50 s IF = 1.6 mA, Rl = 2.2 k IF = 0 mA, TA = 25°C Rl = 2.2 k |VCM| = 10 Vp-p IF = 1.6 mA, TA = 25°C Rl = 2.2 k |VCM| = 10 Vp-p Fig. Note 5, 6, 7, 9, 12 2, 4 5, 6, 7, 9, 12 2, 4 13 5, 6 13 5, 6 70 |CMH| 1000 10000 V/s |CML| 1000 10000 V/s * JEDEC Registered Data for 6N139 and 6N138. **All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted. 11 Units Test Conditions Package Characteristics Parameter Sym. Min. Input-Output Momentary Withstand Voltage† VISO 3750 Option 020 HCNW139 HCNW138 Typ.** Max. Units Test Conditions V rms RH < 50%, t = 1 min., TA = 25°C 5000 Fig. Note 3, 8 3, 9 Resistance (Input-Output) RI-O 1012 VI-O = 500 Vdc RH < 45% 3 Capacitance (Input-Output) CI-O 0.6 pF f = 1 MHz 3 **All typicals at TA = 25°C, unless otherwise noted. †The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table (if applicable), your equipment level safety specification or Avago Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.” Notes: 1. DC CURRENT TRANSFER RATIO (CTR) is defined as the ratio of output collector current, IO, to the forward LED input current, IF, times 100%. 2. Pin 7 Open. 3. Device considered a two-terminal device. Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together. 4. Use of a resistor between pin 5 and 7 will decrease gain and delay time. Significant reduction in overall gain can occur when using resistor values below 47 k. For more information, please contact your local Avago Components representative. 5. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM /dt of the common mode pulse, VCM, to assure that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a Logic Low level is the maximum tolerable (negative) dVCM /dt of the common mode pulse, VCM, to assure that the output will remain in a Logic Low state (i.e., VO < 0.8 V). 6. In applications where dV/dt may exceed 50,000 V/μs (such as static discharge) a series resistor, RCC, should be included to protect the detector IC from destructively high surge currents. The recommended value is RCC = 220 . 7. Use of a 0.1 F bypass capacitor connected between pins 8 and 5 adjacent to the device is recommended. 8. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage 4500 V rms for 1 second (leakage detection current limit, II-O < 5 A). This test is per formed before the 100% production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table, if applicable. 9. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 6000 V rms for 1 second (leakage detection current limit, II-O < 5 A). This test is per formed before the 100% production test for partial discharge (method b) shown in the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table, if applicable. 12 A 1.5 m 25 1.0 mA 0.5 mA VCC = 5 V TA = 25° C 0 1.0 2.0 800 400 0 0.1 + VF – TA = 85°C TA = 70°C 0.1 TA = 25°C 0.001 1.1 TA = 0°C TA = -40°C 1.2 1.3 1.4 1.5 tP – PROPAGATION DELAY – μs IF – FORWARD CURRENT – mA 40 IF 0.01 35 tPLH 1 tPHL 0 20 40 60 80 100 TA – TEMPERATURE – °C Figure 7. Propagation delay vs. temperature 13 TA = 85° C 1.0 25 20 15 10 tPHL 5 0 20 40 60 10 1 Figure 3. 6N138/6N139 output current vs. input diode forward current 21 IF = 1.6 mA RL = 2.2 kΩ 1/f = 50 μs tPLH 18 15 12 9 6 tPHL 3 0 -60 -40 -20 80 100 Figure 5. Propagation delay vs. temperature 0.1 IF – INPUT DIODE FORWARD CURRENT – mA 24 tPLH TA = 70° C TA = 25° C TA = 0° C TA = -40° C 0.1 0 40 60 20 80 100 TA – TEMPERATURE – °C Figure 6. Propagation delay vs. temperature 1.6 2 0 -60 -40 -20 10 TA – TEMPERATURE – °C VF – FORWARD VOLTAGE – V tP – PROPAGATION DELAY – μs 3 100 0.01 0.01 10 IF = 0.5 mA RL = 4.7 kΩ 1/f = 50 μs 0 -60 -40 -20 1.6 Figure 4. Input diode forward current vs. forward voltage IF = 12 mA RL = 270 kΩ 1/f = 50 μs 1.0 30 VF – FORWARD VOLTAGE – V 4 VCC = 5 V VO = 0.4 V Figure 2. Current transfer ratio vs. forward current 6N138/6N139 10 1.0 -40°C IF – FORWARD CURRENT – mA Figure 1. 6N138/6N139 DC transfer characteristics 100 70°C 1200 VO – OUTPUT VOLTAGE – V 1000 25°C 1600 100 IF = 1.6 mA TA = 25° C tf 1.5 TIME – μs 0 70°C tP – PROPAGATION DELAY – μs 4.0 mA 85°C 2000 IO – OUTPUT CURRENT – mA A 3.5 m A 3.0 m A 2.5 m A 2.0 m CTR – CURRENT TRANSFER RATIO – % IO – OUTPUT CURRENT – mA 5.0 mA 50 4.5 mA 1.4 tr 10 1.3 IF – ADJUSTED FOR VOL = 2 V 1.2 -60 -40 -20 0 20 40 60 80 100 TA – TEMPERATURE – °C Figure 8. Forward voltage vs. temperature 1 0.1 1.0 10 RL – LOAD RESISTANCE – kΩ Figure 9. Nonsaturated rise and fall times vs. load resistance OUTPUT POWER – PS, INPUT CURRENT – IS ICCL – LOGIC LOW SUPPLY CURRENT – mA 0.8 0.7 0.6 0.5 VCC = 18 V 0.4 VCC = 5 V 0.3 0.2 0.1 0 0 4 2 6 8 12 10 14 16 WIDEBODY 1000 PS (mW) 900 IS (mA) 800 700 600 500 400 300 200 100 0 0 25 50 75 100 125 150 175 TS – CASE TEMPERATURE – °C IF – FORWARD CURRENT Figure 10. Logic low supply current vs. forward current Figure 11. Thermal derating curve, dependence of safety limiting value with case temperature per IEC/EN/DIN EN 60747-5-2 IF 0 5V VO (SATURATED RESPONSE) 1.5 V 1.5 V VOL t PHL t PLH IF PULSE GEN. ZO = 50 Ω tr = 5 ns 10% DUTY CYCLE I/f < 100 μs 1 8 2 7 3 6 +5 V RL VO 0.1 μF IF MONITOR 5 4 CL = 15 pF* RM VO 90% (NON-SATURATED RESPONSE) 5V 90% 10% * INCLUDES PROBE AND FIXTURE CAPACITANCE 10% tf tr Figure 12. Switching test circuit VCM 10 V 0V 10% 90% 90% tr VO tf A SWITCH AT A: I F = 0 mA SWITCH AT B: I F = 1.6 mA 1 8 R CC (SEE NOTE 6) +5 V 2 7 RL 3 6 4 5 B 10% 5V VO IF tr, tf = 16 ns VFF VCM + – VOL PULSE GEN. Figure 13. Test circuit for transient immunity and typical waveforms For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2005-2012 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0543EN AV02-1359EN - July 27, 2012 VO