ISSI IS62WV5128BLL-55BLI 512k x 8 low voltage, ultra low power cmos static ram Datasheet

IS62WV5128ALL
IS62WV5128BLL
512K x 8 LOW VOLTAGE,
ULTRA LOW POWER CMOS STATIC RAM
JANUARY 2008
FEATURES
DESCRIPTION
• High-speed access time: 55ns, 70ns
The ISSI IS62WV5128ALL / IS62WV5128BLL are highspeed, 4M bit static RAMs organized as 512K words by 8
bits. It is fabricated using ISSI's high-performance CMOS
technology. This highly reliable process coupled with
innovative circuit design techniques, yields highperformance and low power consumption devices.
• CMOS low power operation
36 mW (typical) operating
9 µW (typical) CMOS standby
When CS1 is HIGH (deselected) the device assumes a
standby mode at which the power dissipation can be
reduced down with CMOS input levels.
• TTL compatible interface levels
• Single power supply
1.65V – 2.2V VDD (IS62WV5128ALL)
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs. The active LOW Write Enable
(WE) controls both writing and reading of the memory.
2.5V – 3.6V VDD (IS62WV5128BLL)
• Fully static operation: no clock or refresh
required
• Three state outputs
• Industrial temperature available
The IS62WV5128ALL and IS62WV5128BLL are packaged
in the JEDEC standard 32-pin TSOP (TYPE I), 32-pin
sTSOP (TYPE I), 32-pin TSOP (Type II), 32-pin SOP and
36-pin mini BGA.
• Lead-free available
FUNCTIONAL BLOCK DIAGRAM
A0-A18
DECODER
512K x 8
MEMORY ARRAY
VDD
GND
I/O
DATA
CIRCUIT
I/O0-I/O7
CS1
OE
COLUMN I/O
CONTROL
CIRCUIT
WE
Copyright © 2005 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com
Rev. E
01/29/08
1
IS62WV5128ALL,
IS62WV5128BLL
PIN DESCRIPTIONS
A0-A18
Address Inputs
CS1
Chip Enable 1 Input
OE
Output Enable Input
WE
Write Enable Input
I/O0-I/O7
Input/Output
NC
No Connection
VDD
Power
GND
Ground
36-pin mini BGA (B) (6mm x 8mm)
(Package Code B)
2
1
2
3
4
5
6
A
A0
A1
NC
A3
A6
A8
B
I/O4
A2
WE
A4
A7
I/O0
C
I/O5
NC
A5
D
GND
VDD
E
VDD
GND
F
I/O6
G
I/O7
H
A9
I/O1
I/O2
A18
A17
OE
CS1
A16
A15
I/O3
A10
A11
A12
A13
A14
Integrated Silicon Solution, Inc. — www.issi.com
Rev. E
01/29/08
IS62WV5128ALL,
IS62WV5128BLL
PIN DESCRIPTIONS
A0-A18
Address Inputs
CS1
Chip Enable 1 Input
OE
Output Enable Input
WE
Write Enable Input
I/O0-I/O7
Input/Output
VDD
Power
GND
Ground
PIN CONFIGURATION
32-pin TSOP (TYPE I), (Package Code T)
32-pin sTSOP (TYPE I) (Package Code H)
A11
A9
A8
A13
WE
A18
A15
VDD
A17
A16
A14
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CS1
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
A3
Integrated Silicon Solution, Inc. — www.issi.com
Rev. E
01/29/08
32-pin SOP (Package Code Q)
32-pin TSOP (TYPE II) (Package Code T2)
A17
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VDD
A15
A18
WE
A13
A8
A9
A11
OE
A10
CS1
I/O7
I/O6
I/O5
I/O4
I/O3
3
IS62WV5128ALL,
IS62WV5128BLL
OPERATING RANGE (VDD)
Range
Ambient Temperature
IS62WV5128ALL
0°C to +70°C
–40°C to +85°C
1.65V - 2.2V
1.65V - 2.2V
Commercial
Industrial
IS62WV5128BLL
2.5V - 3.6V
2.5V - 3.6V
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
VTERM
VDD
TSTG
PT
Parameter
Terminal Voltage with Respect to GND
VDD Related to GND
Storage Temperature
Power Dissipation
Value
–0.2 to VDD+0.3
–0.2 to VDD+0.3
–65 to +150
1.0
Unit
V
V
°C
W
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods
may affect reliability.
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol
Parameter
Test Conditions
VDD
Min.
Max.
Unit
VOH
Output HIGH Voltage
IOH = -0.1 mA
IOH = -1 mA
1.65-2.2V
2.5-3.6V
1.4
2.2
—
—
V
V
VOL
Output LOW Voltage
IOL = 0.1 mA
IOL = 2.1 mA
1.65-2.2V
2.5-3.6V
—
—
0.2
0.4
V
V
VIH
Input HIGH Voltage
1.65-2.2V
2.5-3.6V
1.4
2.2
VDD + 0.2
VDD + 0.3
V
V
VIL(1)
Input LOW Voltage
1.65-2.2V
2.5-3.6V
–0.2
–0.2
0.4
0.6
V
V
ILI
Input Leakage
GND ≤ VIN ≤ VDD
–1
1
µA
ILO
Output Leakage
GND ≤ VOUT ≤ VDD, Outputs Disabled
–1
1
µA
Notes:
1. VIL (min.) = –1.0V for pulse width less than 10 ns.
4
Integrated Silicon Solution, Inc. — www.issi.com
Rev. E
01/29/08
IS62WV5128ALL,
IS62WV5128BLL
CAPACITANCE(1)
Symbol
Parameter
CIN
Input Capacitance
COUT
Input/Output Capacitance
Conditions
Max.
Unit
VIN = 0V
8
pF
VOUT = 0V
10
pF
Note:
1. Tested initially and after any design or process changes that may affect these parameters.
AC TEST CONDITIONS
Parameter
Input Pulse Level
Input Rise and Fall Times
Input and Output Timing
and Reference Level
Output Load
IS62WV5128ALL
(Unit)
0.4V to VDD-0.2V
5 ns
VREF
IS62WV5128BLL
(Unit)
0.4V to VDD-0.3V
5ns
VREF
See Figures 1 and 2
See Figures 1 and 2
IS62WV5128ALL
1.65 - 2.2V
IS62WV5128BLL
2.5V - 3.6V
R1(Ω)
3070
3070
R2(Ω)
3150
3150
VREF
0.9V
1.5V
VTM
1.8V
2.8V
AC TEST LOADS
Figure 1
Integrated Silicon Solution, Inc. — www.issi.com
Rev. E
01/29/08
Figure 2
5
IS62WV5128ALL,
IS62WV5128BLL
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
62WV5128ALL (1.65V - 2.2V)
Symbol Parameter
Test Conditions
ICC
VDD Dynamic Operating
Supply Current
VDD = Max.,
IOUT = 0 mA, f = fMAX
ICC1
Operating Supply
Current
ISB1
TTL Standby Current
(TTL Inputs)
VDD = Max., CS1 = 0.2V Com.
WE = VDD-0.2V
Ind.
f=1MHZ
VDD = Max.,
Com.
VIN = VIH or VIL
Ind.
CS1 = VIH,
f = 1 MHZ
ISB2
CMOS Standby
Current (CMOS Inputs)
VDD = Max.,
CS1 ≥ VDD – 0.2V,
VIN ≥ VDD – 0.2V, or
VIN ≤ 0.2V, f = 0
Com.
Ind.
Com.
Ind.
Max.
70 ns
25
30
Unit
10
10
mA
0.35
0.35
mA
15
15
µA
mA
Note:
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
62WV5128BLL (2.5V - 3.6V)
Symbol Parameter
Test Conditions
ICC
VDD Dynamic Operating
Supply Current
VDD = Max.,
IOUT = 0 mA, f = fMAX
ICC1
Operating Supply
Current
ISB1
TTL Standby Current
(TTL Inputs)
VDD = Max., CS1 = 0.2V Com.
WE = VDD-0.2V
Ind.
f=1MHZ
VDD = Max.,
Com.
VIN = VIH or VIL
Ind.
CS1 = VIH,
f = 1 MHZ
ISB2
CMOS Standby
Current (CMOS Inputs)
VDD = Max.,
CS1 ≥ VDD – 0.2V,
VIN ≥ VDD – 0.2V, or
VIN ≤ 0.2V, f = 0
Com.
Ind.
Com.
Ind.
Max.
55 ns
40
45
Unit
15
15
mA
0.35
0.35
mA
15
15
µA
mA
Note:
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
6
Integrated Silicon Solution, Inc. — www.issi.com
Rev. E
01/29/08
IS62WV5128ALL,
IS62WV5128BLL
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)
Symbol
Parameter
55 ns
Min.
Max.
70 ns
Min.
Max.
Unit
tRC
Read Cycle Time
55
—
70
—
ns
tAA
Address Access Time
—
55
—
70
ns
tOHA
Output Hold Time
10
—
10
—
ns
tACS1
CS1 Access Time
—
55
—
70
ns
OE Access Time
—
25
—
35
ns
tHZOE
OE to High-Z Output
—
20
—
25
ns
tLZOE(2)
OE to Low-Z Output
5
—
5
—
ns
tHZCS1
CS1 to High-Z Output
0
20
0
25
ns
tLZCS1
CS1 to Low-Z Output
10
—
10
—
ns
tDOE
(2)
Notes:
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 0.9V/1.5V, input pulse levels of 0.4 to
VDD-0.2V/VDD-0.3V and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
AC WAVEFORMS
READ CYCLE NO. 1(1,2) (Address Controlled) (CS1 = OE = VIL, WE = VIH)
tRC
ADDRESS
tAA
tOHA
DOUT
PREVIOUS DATA VALID
Integrated Silicon Solution, Inc. — www.issi.com
Rev. E
01/29/08
tOHA
DATA VALID
7
IS62WV5128ALL,
IS62WV5128BLL
AC WAVEFORMS
READ CYCLE NO. 2(1,3) (CS1, OE Controlled)
tRC
ADDRESS
tAA
tOHA
OE
tDOE
CS1
tHZOE
tLZOE
tACS1
tLZCS1
DOUT
HIGH-Z
tHZCS
DATA VALID
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CS1= VIL. WE=VIH.
3. Address is valid prior to or coincident with CS1 LOW transition.
8
Integrated Silicon Solution, Inc. — www.issi.com
Rev. E
01/29/08
IS62WV5128ALL,
IS62WV5128BLL
WRITE CYCLE SWITCHING CHARACTERISTICS(1,2) (Over Operating Range)
Symbol
55 ns
Min. Max.
Parameter
70 ns
Min. Max.
Unit
tWC
Write Cycle Time
55
—
70
—
ns
tSCS1
tAW
CS1 to Write End
45
—
60
—
ns
Address Setup Time to Write End
45
—
60
—
ns
tHA
tSA
Address Hold from Write End
0
—
0
—
ns
Address Setup Time
0
—
0
—
ns
tPWE
tSD
WE Pulse Width
40
—
50
—
ns
Data Setup to Write End
25
—
30
—
ns
tHD
tHZWE(3)
Data Hold from Write End
0
—
0
—
ns
WE LOW to High-Z Output
—
20
—
20
ns
tLZWE(3)
WE HIGH to Low-Z Output
5
—
5
—
ns
Notes:
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 0.9V/1.5V, input pulse levels of 0.4V to
VDD-0.2V/VDD-0.3V and output loading specified in Figure 1.
2. The internal write time is defined by the overlap of CS1 LOW and WE LOW. All signals must be in valid states to initiate a Write, but any one can go inactive to
terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that terminates the write.
3. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
AC WAVEFORMS
WRITE CYCLE NO. 1 (CS1 Controlled, OE = HIGH or LOW)
tWC
ADDRESS
tHA
tSCS1
CS1
tAW
tPWE
WE
tSA
DOUT
tHZWE
DATA UNDEFINED
tLZWE
HIGH-Z
tSD
DIN
Integrated Silicon Solution, Inc. — www.issi.com
Rev. E
01/29/08
tHD
DATA-IN VALID
9
IS62WV5128ALL,
IS62WV5128BLL
WRITE CYCLE NO. 2 (WE Controlled: OE is HIGH During Write Cycle)
tWC
ADDRESS
OE
tHA
tSCS1
CS1
tAW
tPWE
WE
tSA
DOUT
tHZWE
tLZWE
HIGH-Z
DATA UNDEFINED
tSD
DIN
tHD
DATA-IN VALID
WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle)
tWC
ADDRESS
OE
tHA
tSCS1
CS1
tAW
tPWE
WE
tSA
DOUT
DATA UNDEFINED
tHZWE
tLZWE
HIGH-Z
tSD
DIN
10
tHD
DATA-IN VALID
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Rev. E
01/29/08
IS62WV5128ALL,
IS62WV5128BLL
DATA RETENTION SWITCHING CHARACTERISTICS
Symbol
Parameter
Test Condition
Min.
Max.
Unit
VDR
VDD for Data Retention
See Data Retention Waveform
1.2
3.6
V
IDR
Data Retention Current
VDD = 1.2V, CS1 ≥ VDD – 0.2V
—
15
µA
tSDR
Data Retention Setup Time
See Data Retention Waveform
0
—
ns
tRDR
Recovery Time
See Data Retention Waveform
tRC
—
ns
DATA RETENTION WAVEFORM (CS1
CS1 Controlled)
tSDR
Data Retention Mode
tRDR
VDD
VDR
CS1
GND
CS1 ≥ VDD
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Rev. E
01/29/08
- 0.2V
11
IS62WV5128ALL,
IS62WV5128BLL
ORDERING INFORMATION
IS62WV5128ALL (1.65V-2.2V)
Industrial Range: –40°C to +85°C
Speed (ns)
Order Part No.
Package
70
IS62WV5128ALL-70TI
TSOP, TYPE I
70
IS62WV5128ALL-70T2I
TSOP, TYPE II
70
IS62WV5128ALL-70HI
sTSOP, TYPE I
70
IS62WV5128ALL-70BI
mini BGA (6mmx8mm)
ORDERING INFORMATION
IS62WV5128BLL (2.5V - 3.6V)
Commercial Range: 0°C to +70°C
Speed (ns)
55
Order Part No.
Package
IS62WV5128BLL-55H
sTSOP, TYPE I
Industrial Range: –40°C to +85°C
Speed (ns)
12
Order Part No.
Package
55
IS62WV5128BLL-55TI
TSOP, TYPE I
55
IS62WV5128BLL-55TLI
TSOP, TYPE I, Lead-free
55
IS62WV5128BLL-55QLI
SOP, Lead-free
55
IS62WV5128BLL-55T2I
TSOP, TYPE II
55
IS62WV5128BLL-55T2LI
TSOP, TYPE II, Lead-free
55
IS62WV5128BLL-55HI
sTSOP, TYPE I
55
IS62WV5128BLL-55HLI
sTSOP, TYPE I, Lead-free
55
IS62WV5128BLL-55BI
mini BGA (6mmx8mm)
55
IS62WV5128BLL-55BLI
mini BGA (6mmx8mm), Lead-free
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Rev. E
01/29/08
PACKAGING INFORMATION
Plastic TSOP
Package Code: T (Type II)
N
N/2+1
E1
1
Notes:
1. Controlling dimension: millimieters,
unless otherwise specified.
2. BSC = Basic lead spacing
between centers.
3. Dimensions D and E1 do not
include mold flash protrusions and
should be measured from the
bottom of the package.
4. Formed leads shall be planar with
respect to one another within
0.004 inches at the seating plane.
E
N/2
D
SEATING PLANE
A
ZD
.
b
e
Symbol
Ref. Std.
No. Leads
A
A1
b
C
D
E1
E
e
L
ZD
α
Millimeters
Min
Max
Inches
Min
Max
(N)
32
—
1.20
—
0.047
0.05 0.15
0.002 0.006
0.30 0.52
0.012 0.020
0.12 0.21
0.005 0.008
20.82 21.08
0.820 0.830
10.03 10.29
0.391 0.400
11.56 11.96
0.451 0.466
1.27 BSC
0.050 BSC
0.40 0.60
0.016 0.024
0.95 REF
0.037 REF
0°
5°
0°
5°
L
α
A1
Plastic TSOP (T - Type II)
Millimeters
Inches
Min
Max
Min Max
44
—
1.20
—
0.047
0.05 0.15
0.002 0.006
0.30 0.45
0.012 0.018
0.12 0.21
0.005 0.008
18.31 18.52
0.721 0.729
10.03 10.29
0.395 0.405
11.56 11.96
0.455 0.471
0.80 BSC
0.032 BSC
0.41 0.60
0.016 0.024
0.81 REF
0.032 REF
0°
5°
0°
5°
Millimeters
Min
Max
C
Inches
Min
Max
50
—
1.20
0.05 0.15
0.30 0.45
0.12 0.21
20.82 21.08
10.03 10.29
11.56 11.96
0.80 BSC
0.40 0.60
0.88 REF
0°
5°
—
0.047
0.002 0.006
0.012 0.018
0.005 0.008
0.820 0.830
0.395 0.405
0.455 0.471
0.031 BSC
0.016 0.024
0.035 REF
0°
5°
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
06/18/03
PACKAGING INFORMATION
Plastic TSOP-Type I
Package Code: T (32-pin)
1
E
H
N
D
SEATING PLANE
A
S
MILLIMETERS
Symbol
No. Leads
A
A1
B
C
D
E
H
e
L
α
S
Min.
L
B
e
A1
INCHES
Max.
Min.
Max.
32
—
1.20
0.05
0.25
0.17
0.23
0.12
0.17
7.90
8.10
18.30
18.50
19.80
20.20
0.50 BSC
0.40
0.60
0°
8°
0.25 REF
—
0.047
0.002
0.010
0.007
0.009
0.005
0.007
0.311
0.319
0.720
0.728
0.780
0.795
0.020 BSC
0.016
0.024
0°
8°
0.010 REF
α
C
Notes:
1. Controlling dimension: millimeters, unless
otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold
flash protrusions and should be measured
from the bottom of the package.
4. Formed leads shall be planar with respect
to one another within 0.004 inches at the
seating plane.
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. C
06/13/03
PACKAGING INFORMATION
450-mil Plastic SOP
Package Code: Q (32-pin)
N
E1
E
1
D
SEATING PLANE
A
S
MILLIMETERS
Symbol
No. Leads
A
A1
B
C
D
E
E1
e
L
α
S
Min.
L
B
e
A1
INCHES
Max.
Min.
Max.
32
—
3.00
0.10
—
0.36
0.51
0.15
0.30
20.14
20.75
13.87
14.38
11.18
11.43
1.27 BSC
0.58
0.99
0°
10°
—
0.86
—
0.118
0.004
—
0.014
0.020
0.006
0.012
0.793
0.817
0.546
0.566
0.440
0.450
0.050 BSC
0.023
0.039
0°
10°
—
0.034
α
C
Notes:
1. Controlling dimension: inches, unless
otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold
flash protrusions and should be measured
from the bottom of the package.
4. Formed leads shall be planar with respect to
one another within 0.004 inches at the
seating plane.
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. C
06/13/03
PACKAGING INFORMATION
Plastic STSOP - 32 pins
Package Code: H (Type I)
A2
A
A1
1
N
E
b
e
D1
S
SEATING PLANE
D
L
Plastic STSOP (H - Type I)
Millimeters
Inches
Symbol Min Max
Min
Max
Ref. Std.
N
32
A
—
1.25
—
0.049
A1
0.05
—
0.002
—
A2
0.95 1.05
0.037
0.041
b
0.17 0.23
0.007
0.009
C
0.14 0.16
0.0055 0.0063
D
13.20 13.60
0.520
0.535
D1 11.70 11.90
0.461
0.469
E
7.90 8.10
0.311
0.319
e
0.50 BSC
0.020 BSC
L
0.30 0.70
0.012
0.028
S
0.28 Typ.
0.011 Typ.
α
0°
5°
0°
5°
Integrated Silicon Solution, Inc.
PK13197H32 Rev. B 04/21/03
α
C
Notes:
1. Controlling dimension: millimeters, unless otherwise
specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another
within 0.004 inches at the seating plane.
PACKAGING INFORMATION
Mini Ball Grid Array
Package Code: B (36-pin)
Top View
Bottom View
φ b (36x)
1
2
3
4
5 6
6
A
4
3
2
1
A
e
B
B
C
C
D
D
D
5
D1
E
E
F
F
G
G
H
H
e
E
E1
Notes:
1. Controlling dimensions are in millimeters.
A2
A
A1
SEATING PLANE
mBGA - 6mm x 8mm
mBGA - 8mm x 10mm
MILLIMETERS
INCHES
MILLIMETER
INCHES
Sym.
Min. Typ. Max.
Min. Typ. Max.
Sym.
Min. Typ. Max.
Min. Typ. Max.
N0.
Leads
36
36
N0.
Leads
36
36
A
—
—
1.20
—
—
0.047
A
—
—
1.20
—
—
0.047
A1
0.24
—
0.30
0.009
—
0.012
A1
0.24
—
0.30
0.009
—
0.012
A2
0.60
—
—
0.024
—
—
A2
0.60
—
—
0.024
—
—
D
7.90
8.00
8.10
D
9.90 10.00 10.10
D1
E
5.25BSC
5.90
6.00
0.311 0.315 0.319
0.207BSC
6.10
D1
0.232 0.236 0.240
E
5.25BSC
7.90
0.390 0.394 0.398
.207BSC
8.00
8.10
0.311 0.315 0.319
E1
3.75BSC
0.148BSC
E1
3.75BSC
0.148BSC
e
0.75BSC
0.030BSC
e
0.75BSC
0.030BSC
0.012 0.014 0.016
b
b
0.30
0.35
0.40
0.30
0.35
0.40
0.012 0.014 0.016
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. E
01/15/03
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