FUJITSU SEMICONDUCTOR DATA SHEET DS04-29113-4E ASSP BIPOLAR 1A Motor Drive IC for Motor Applications MB3853 ■ DESCRIPTION The FUJITSU MB3853 is a motor drive IC with two power driver channels capable of sink/source operation, for use in two-channel independent operation or H-type drive operation. The control system and output system have independent power supplies, allowing the control system to be set to low-voltage operation to conserve power. Protective circuits are provided for temperature, overvoltage, and overload current, with an open collector type monitoring terminal. The MB3853 is designed for use with motors in AV products, office automation products, or cameras, and is also an ideal IC for use in automated vending equipment and other unmanned operating devices. ■ FEATURES • Circuit configuration Two sets of built-in control circuits and power circuits Built-in fly-back diode • Functions Can drive two motors independently or in H-type drive configurations Built-in inhibitor function (Continued) ■ PACKAGE Plastic SIP, 9 pins (SIP-9P-M02) MB3853 (Continued) • Input/output terminals Power supply terminals : Independent control system supply terminal and output system supply terminal Control terminals : TTL level/CMOS level compatible Monitor terminal : Open collector type • Space-saving package (SIP9) ■ PIN ASSIGNMENT (FRONT VIEW) VCC1 1 IN1 2 IN2 3 OUT2 4 GND 5 OUT1 6 INH 7 VCC2 8 MONITOR 9 (SIP-9P-M02) ■ PIN DESCRIPTION 2 Pin no. Symbol I/O Description 1 VCC1 2 IN1 I Load control signal input terminal 1 3 IN2 I Load control signal input terminal 2 4 OUT2 O Load control output terminal 2 5 GND Ground terminal 6 OUT1 O Load control output terminal 1 7 INH I Inhibitor signal input terminal 8 VCC2 Output system power supply terminal 9 MONITOR O Protective circuit motor signal output terminal (open collector type terminal) Control system power supply terminal MB3853 ■ BLOCK DIAGRAM VCC1 1 INH 7 IN1 VCC2 8 Power supply circuit (ON/OFF) 2 6 OUT1 IN2 3 4 OUT2 Temperature protection circuit 9 MONITOR (open collector terminal) Overvoltage protection circuit Overload current protection circuit Timer circuit 5 GND 3 MB3853 ■ FUNCTIONAL DESCRIPTION The MB3853 provides two methods for controlling motors. The IC can be connected to two motors and drive each motor independently, or connected to one motor in an H-type connection and drive the motor in forward and reverse directions. 1. Sample connection to 2 motors for run-stop control. (1) Connection diagram 100 µF *1 − + VCC1 INH IN1 7 2 1 8 Power supply circuit VCC2 M2 SW1 Control circuit 6 SW2 M3 Run-stop control OUT1 *2 SW3 IN2 3 Control circuit 4 SW4 OUT2 *2 Protective circuits 9 M2′ MONITOR M3′ Run-stop control 5 GND *1 : The capacitor should be placed close to the IC terminal. *2 : When using the M2’ and M3’ terminals, ensure that the OUT1 terminal (pin 6) voltage and OUT2 terminal (pin 4) voltage do not fall below −0.3 V by connecting the OUT1 and OUT2 terminals to ground through a Shottky barrier diode. (2) Table of Functions Input voltage level Mode INH IN1 IN2 OUT1 OUT2 Motor operating mode M2 OFF (high impedance) M3 M2’ M3’ × × “L” “L” “H” “H” Brake Brake Run Run “L” “H” “H” “L” Brake Run Run Brake “H” “L” “L” “H” Run Brake Brake Run Mode (4) “H” × : May be either “H” or “L” level “H” “L” “L” Run Run Brake Brake Inhibit mode “L” Mode (1) Mode (2) Mode (3) 4 Output terminals “H” Continuous operation MB3853 2. Sample connection to 1 motor for forward-reverse control (1) Connection diagram 100 µF *1 − + VCC1 INH IN1 7 2 1 Power supply circuit Control circuit 8 VCC2 SW1 6 SW2 OUT1 *2 M1 SW3 IN2 3 Control circuit Forward-reverse control 4 SW4 OUT2 *2 Protective circuits 9 MONITOR 5 GND *1 : The capacitor should be placed close to the IC terminal. *2 : Ensure that the OUT1 terminal (pin 6) voltage and OUT2 terminal (pin 4) voltage do not fall below −0.3 V by connecting the OUT1 and OUT2 terminals to ground through a Shot key barrier diode. (2) Table of functions Mode Inhibit mode Input voltage level IN1 IN2 “L” × × “L” “L” “H” “H” Brake “L” “H” “H” “L” Forward (reverse) Mode (3) “H” “L” “L” “H” Reverse (forward) “H” “H” “L” “L” Brake “H” Mode (4) OUT1 OUT2 Motor mode INH Mode (1) Mode (2) Output terminals OFF (High impedance) Continuous operation × : May be either “H” or “L” level 5 MB3853 ■ PROTECTIVE CIRCUITS Circuit name Operating description Timing chart Detection level Overvol tage protection circuit When the Vcc2 supply voltage input exceeds 33 V (Typ.) , the following occurs : (1) All output transistors are turned off, and output is set to high impedance (2) As long as the condition is detected, the monitoring output from the open collector terminal is set to “L” level. During detection VCC2 = 33 V (Typ.) VCC2 Output terminals Hi-Z * ON ON “H” Monitor terminal “L” Detection level Temperature protection circuit When the chip temperature exceeds TJ = +180 °C, the following occurs : (1) All output transistors are turned off, and output is set to high impedance (2) As long as the condition is detected, the monitoring output from the open collector terminal is set to “L” level. During detection TJ = +180 °C (Typ.) Chip temperature Output terminals Hi-Z * ON ON “H” Monitor terminal “L” IO = 2.4 A (Typ.) Detection level During detection Load status Monitors VBE of all output transistors. When any transistor output load current exOvercur ceeds Io = 2.4 A (Typ.) , the following occurs : rent protec(1) All output transistors are switched on tion and off repeatedly circuit (2) As long as the condition is detected, the monitoring output from the open collector terminal is set to “L” level. Output terminals Hi-Z * ON Hi-Z * “H” Monitor terminal “L” t1 t2 t1 t2 (t1 ≅ 5 µs, t2 ≅ 95 µs) * : All output transistors are turned off regardless of logic input voltage. 6 ON MB3853 ■ ABSOLUTE MAXIMUM RATINGS (GND = 0 V) Parameter Symbol Condition VCC1 VCC2 Supply voltage Rating Unit Min. Max. 30 V 30 V tr ≥ 1 ms, ts ≤ 200 ms 60 V Surge voltage VCC (S) Output current IO 10 ms or less per terminal 1.8 A Power consumption PD TC ≤ +75 °C 18 W Operating temperature TC −40 +85 °C Tstg −55 +150 °C Storage temperature WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. ■ RECOMMENDED OPERATING CONDITIONS (GND = 0 V) Parameter Supply voltage Symbol Conditions Values Min. Typ. Max. Unit VCC1 Control system supply voltage 4.5 5 30 V VCC2 Output system supply voltage 24 30 V 2.0 VCC1 + 0.3 V −0.3 0.8 V 0 25 70 °C “H” level input voltage VIH “L” level input voltage VIL Operating temperature TC IN1, IN2, INH terminals WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device’s electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their FUJITSU representatives beforehand. 7 MB3853 ■ ELECTRICAL CHARACTERISTICS (TC = +25 °C, GND = 0 V, VCC1 = 5 V, VCC2 = 24 V) Parameter Symbol Values Min. Typ. Max. Unit “L” level input current IIL VIL = 0.4 V 100 µA “H” level input current IIH VIH = 2.4 V 100 µA “L” level output current VOL IO = 1 A 1.0 1.4 V “H” level output current VOH IO = −1 A 22.5 23.0 V Diode forward voltage VF IO = 1.8 A 2.2 V Overcurrent detection current ICS 1.8 2.4 3.5 A Overcurrent detection voltage VSD 30.5 33.0 35.5 V “L” level monitoring output voltage VOL IO = 1 mA 0.2 0.4 V “H” level monitoring output current IOH VOH = 24 V 0.01 mA IN1 = IN2 = “H” 3.7 7.4 mA IN1/IN2 = “H/L” 2.8 5.6 mA IN1 = IN2 = “L” 1.9 3.8 mA IN1 = IN2 = “H” 1.0 mA IN1/IN2 = “H/L” 13 20 mA IN1 = IN2 = “L” 26 40 mA ICC0 ICC1 + ICC2 INH = “L” 1.0 mA θJ-C Infinite heat dissipation 4 °C/W IO = 1 A 1.2 W IO = 0 mA (braking) 300 mW IO = 1 A 2.4 W ICC1 Supply current ICC2 Package thermal resistance Power consumption OUT1 or OUT2, per terminal In H-type drive configuration 8 Conditions PD MB3853 ■ TYPICAL CHARACTERISTIC Supply voltage vs. supply current (VCC1 - ICC1) Supply current vs. inhibitor terminal input voltage 6 6 VCC1 = 5 V VCC2 = 24 V 5 Supply current ICC1 (mA) Supply current ICC1 (mA) 5 VIN1 = 2.4 V, VIN2 = 2.4 V 4 VIN1 = 2.4 V, VIN2 = 0 V or VIN1 = 0 V, VIN2 = 2.4 V 3 VIN1 = 0 V, VIN2 = 0 V 2 1 VIN1 = 2.4 V, VIN2 = 2.4 V 4 VIN1 = 0 V, VIN2 = 2.4 V or VIN1 = 2.4 V, VIN2 = 0 V 3 VIN1 = 0 V, VIN2 = 0 V 2 1 0 0 0 2 3 4 6 1 5 Inhibitor signal input voltage VINH (V) 0 Supply voltage vs. supply current (VCC2 - ICC1) VIN1 = 0 V, VIN2 = 0 V 10 8 VIN1 = 0 V, VIN2 = 2.4 V or VIN1 = 2.4 V, VIN2 = 0 V 6 VIN1 = 2.4 V, VIN2 = 2.4 V 4 VIN1 = 0 V, VIN2 = 0 V 2 5 10 15 20 25 Supply voltage VCC1 (V) 30 Supply voltage vs. supply current (VCC2 - ICC2) 35 VCC1 = 5 V VINH = 2.4 V VCC1 = 5 V VINH = 2.4 V 30 Supply current ICC2 (mA) 12 Supply current ICC1 (mA) VCC2 = 24 V VINH = 2.4 V VIN1 = 0 V, VIN2 = 0 V 25 20 VIN1 = 0 V, VIN2 = 2.4 V or VIN1 = 2.4 V, VIN2 = 0 V 15 10 5 0 0 5 10 15 20 25 Supply voltage VCC2 (V) 30 VIN1 = 2.4 V, VIN2 = 2.4 V 0 0 5 10 15 20 25 Supply voltage VCC2 (V) 30 (Continued) 9 MB3853 Supply voltage vs. supply current (VCC1 - ICC2) VCC2 = 24 V VINH = 2.4 V Supply current ICC2 (mA) 30 VIN1 = 0 V, VIN2 = 0 V 25 20 15 VIN1 = 0 V, VIN2 = 2.4 V or VIN1 = 2.4 V, IN2 = 0 V 10 25 Saturation voltage VOL (V) 35 Saturation voltage vs. pull side drive load current VCC1 = 5 V VCC2 = 24 V VINH = 2.4 V VIN1 = 2.4 V VIN2 = 2.4 V 20 15 10 5 0 0 0.5 1.0 1.5 2.0 2.5 Pull side drive load current IO (A) 5 VIN1 = 2.4 V, VIN2 = 2.4 V 0 0 5 10 15 20 25 Supply voltage VCC1 (V) 30 Standby supply voltage vs. supply current (VCC2 - ICC2) Saturation voltage vs. push side drive load current VCC1 = 5 V VCC2 = 24 V VINH = 2.4 V VIN1 = 0 V VIN2 = 0 V VCC2 −0.5 VCC2 −1.0 VCC2 −1.5 VCC2 −2.0 200 Supply current ICC2 (µA) Saturation voltage VOH (V) VCC2 VCC2 −2.5 3.0 VCC1 = 5 V VINH = 0 V 150 100 50 0 0 5 10 15 20 25 30 Supply voltage VCC2 (V) 0 0.5 1.0 1.5 2.0 2.5 3.0 Push side drive load current IO (A) (Continued) 10 MB3853 Flyback diode voltage vs. reverse surge current 0.30 5 0.25 Diode voltage VF (V) Monitoring terminal output voltage VOL (V) Monitoring terminal output current vs. output voltage VCC2 = 36 V 0.20 0.15 0.10 0.05 VCC1 = 5 V VCC2 = 24 V VINH = 2.4 V VIN1 = 0 V VIN2 = 0 V 4 3 2 1 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Reverse surge current IO (A) 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Monitoring terminal output current IO (mA) Input current vs. voltage characteristics at maximum applied voltage (Inhibitor terminal, function input terminals) Input current vs. input voltage (Inhibitor terminal, function input terminals) 1.6 VCC1 = 5 V VCC2 = 24 V 200 150 VINH – IINH 100 VIN1 – IIN1 or VIN2 – IIN2 50 0 0 1 2 3 4 5 Input voltage VIN1, VIN2, VINH (V) 6 Input current IIN1, IIN2, IINH (mA) Input current IIN1, IIN2, IINH (µA) 250 VCC1 = 30 V VCC2 = 30 V 1.4 1.2 VINH – IINH 1.0 0.8 0.6 0.4 VIN1 – IIN1 or VIN2 – IIN2 0.2 0 0 5 10 15 20 25 30 35 Input voltage VIN1, VIN2, VINH (V) (Continued) 11 MB3853 (Continued) Allowable loss vs. Ambient temperature (1) Infinite heat dissipation plate (2) 900 cm2 × 2 mm Al plate (3) 400 cm2 × 2 mm Al plate (4) 200 cm2 × 2 mm Al plate (5) 100 cm2 × 2 mm Al plate (6) No dissipation plate (1) (4) (2) Allowable loss PD (W) 20 15 (3) (5) 10 Junction temperature vs. duty ratio 100 Drive current 0.3 A 80 Duty ratio (%) 25 0.5 A 60 1A 40 5 20 (6) 0 25 50 75 100 125 150 Ambient temperature Ta (°C) 0 −40 0 40 80 120 160 Junction temperature TJ (°C) Notes : • For stable operation over periods of extended usage, the duty ratio should be kept below the characteristic curve. • Junction temperature should be maintained at TJ ≤ +150 °C. (Tj calculation) TJ = TC + ∆T ∆T = 4 ( °C/W) × PDI PDI = VCC × ICC + ∆VO × IO ∆VO = (VCC − VOH) +VOL TC : case temperature, ∆T : difference between case and junction temperature PDI : IC power consumption (W) ■ ORDERING INFORMATION Part Number MB3853PS 12 Package Plastic SIP, 9 pins (SIP-9P-M02) Remarks MB3853 ■ PACKAGE DIMENSION 9-pin plastic SIP (SIP-9P-M02) 23.60(.929)MAX 23.40(.921)MAX 8.00(.315) 3.30(.130)MAX 8.00(.315) 3.90(.154) Ø3.40(.134) 0.60±0.10 (.024±.004) 3.40(.134) 11.10(.437) 14.20(.559) MAX 6.40(.252) 1 PIN INDEX 0.80(.031) 5.80(.228)MIN 2.54(.100) TYP C +0.30 1.20 –0 .047 +.012 –0 0.70±0.10 (.028±.004) 0.60±0.10 (.024±.004) 1994 FUJITSU LIMITED S09003S-3C-3 Dimensions in mm (inches) . 13 MB3853 FUJITSU LIMITED All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information and circuit diagrams in this document are presented as examples of semiconductor device applications, and are not intended to be incorporated in devices for actual use. Also, FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of this information or circuit diagrams. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that Fujitsu will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan. F0107 FUJITSU LIMITED Printed in Japan