[ /Title (CD74 HC75, CD74 HCT75 ) /Subject (Dual 2-Bit Bistabl e CD54HC75, CD74HC75, CD54HCT75, CD74HCT75 Data sheet acquired from Harris Semiconductor SCHS135F Dual 2-Bit Bistable Transparent Latch March 1998 - Revised October 2003 Features Description • True and Complementary Outputs The ’HC75 and ’HCT75 are dual 2-bit bistable transparent latches. Each one of the 2-bit latches is controlled by separate Enable inputs (1E and 2E) which are active LOW. When the Enable input is HIGH data enters the latch and appears at the Q output. When the Enable input (1E and 2E) is LOW the output is not affected. • Buffered Inputs and Outputs • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads Ordering Information • Wide Operating Temperature Range . . . -55oC to 125oC • Balanced Propagation Delay and Transition Times PART NUMBER • Significant Power Reduction Compared to LSTTL Logic ICs • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH TEMP. RANGE (oC) PACKAGE CD54HC75F3A -55 to 125 16 Ld CERDIP CD54HCT75F3A -55 to 125 16 Ld CERDIP CD74HC75E -55 to 125 16 Ld PDIP CD74HC75M -55 to 125 16 Ld SOIC CD74HC75MT -55 to 125 16 Ld SOIC CD74HC75M96 -55 to 125 16 Ld SOIC CD74HC75NSR -55 to 125 16 Ld SOP CD74HC75PW -55 to 125 16 Ld TSSOP CD74HC75PWR -55 to 125 16 Ld TSSOP CD74HCT75E -55 to 125 16 Ld PDIP CD74HCT75M -55 to 125 16 Ld SOIC CD74HCT75PWT -55 to 125 16 Ld TSSOP NOTE: When ordering, use the entire part number. The suffixes 96 and R denote tape and reel. The suffix T denotes a small-quantity reel of 250. Pinout CD54HC75, CD54HCT75 (CERDIP) CD74HC75 (PDIP, SOIC, SOP, TSSOP) CD74HCT75 (PDIP, SOIC, TSSOP) TOP VIEW 1Q0 1 16 1Q0 1D0 2 15 1Q1 1D1 3 14 1Q1 13 1E 2E 4 VCC 5 12 GND 2D0 6 11 2Q0 2D1 7 10 2Q0 2Q1 8 9 2Q1 CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated 1 CD54HC75, CD74HC75, CD54HCT75, CD74HCT75 Functional Diagram 16 (10) 2 (6) Q0 1 (11) D0 1 OF 2 LATCHES 3 (7) D1 Q0 14 (8) Q1 15 (9) Q1 13 (4) E TRUTH TABLE INPUTS OUTPUTS D E Q Q L H L H H H H L X L Q0 Q0 H= High Level L= Low Level X= Don’t Care Q0 = The level of Q before the transition of E. Logic Diagram LATCH 0 16 (10) 2 (6) D0 D Q LE LE Q0 1 (11) Q0 13 (4) E LE 14 (8) Q Q1 LE LE D Q 3 (7) D1 P P N N LE 15 (9) Q1 LE Q LATCH 1 5 12 VCC GND FIGURE 1. LOGIC DIAGRAM FIGURE 2. LATCH DETAIL 2 LE CD54HC75, CD74HC75, CD54HCT75, CD74HCT75 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Drain Current, per Output, IO For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA Package Thermal Impedance, θJA (see Note 1) E (PDIP) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W M (SOIC) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W NS (SOP) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W PW (TSSOP) package . . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W Maximum Junction Temperature (Hermetic Package or Die) . . . 175oC Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER SYMBOL VI (V) VIH - 25oC IO (mA) VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 2 1.5 - - 1.5 - 1.5 - V 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current II VCC or GND - - -0.02 2 1.9 - - 1.9 - 1.9 - V 4.5 4.4 - - 4.4 - 4.4 - V 6 5.9 - - 5.9 - 5.9 - V - - - - - - - - - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 4.5 - - 0.1 - 0.1 - 0.1 V 6 - - 0.1 - 0.1 - 0.1 V - - - - - - - - - V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V - 6 - - ±0.1 - ±1 - ±1 µA 3 CD54HC75, CD74HC75, CD54HCT75, CD74HCT75 DC Electrical Specifications (Continued) TEST CONDITIONS SYMBOL VI (V) ICC VCC or GND 0 High Level Input Voltage VIH - Low Level Input Voltage VIL High Level Output Voltage CMOS Loads VOH PARAMETER Quiescent Device Current 25oC IO (mA) VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 6 - - 4 - 40 - 80 µA - 4.5 to 5.5 2 - - 2 - 2 - V - - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V VIH or VIL - 0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V ±0.1 - ±1 - ±1 µA HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load II VCC and GND - 5.5 - ICC VCC or GND 0 5.5 - - 4 - 40 - 80 µA ∆ICC (Note 2) VCC - 2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA NOTE: 2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS D0, D1 0.8 1E, 2E 1.2 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Specifications table, e.g., 360µA max at 25oC. Prerequisite For Switching Specifications PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tW - 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns 2 60 - - 75 - 90 - ns 4.5 12 - - 15 - 18 - ns 6 10 - - 13 - 15 - ns HC TYPES Pulse Width Enable Input Setup Time D to Enable tSU - 4 CD54HC75, CD74HC75, CD54HCT75, CD74HCT75 Prerequisite For Switching Specifications PARAMETER Hold Time Enable to D (Continued) 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tH - 2 3 - - 3 - 3 - ns 4.5 3 - - 3 - 3 - ns 6 3 - - 3 - 3 - ns HCT TYPES Pulse Width Enable Input tW - 4.5 16 - - 20 - 24 - ns Setup Time D to Enable tSU - 4.5 12 - - 15 - 18 - ns Hold Time Enable to D tH - 4.5 3 - - 3 - 3 - ns SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tPLH, tPHL CL = 50pF 2 - - 110 - 140 - 165 ns CL = 50pF 4.5 - - 22 - 28 - 33 ns CL = 15pF 5 - 9 - - - - - ns CL = 50pF 6 - - 19 - 24 - 28 ns CL = 50pF 2 - - 130 - 165 - 195 ns CL = 50pF 4.5 - - 26 - 33 - 39 ns CL = 15pF 5 - 10 - - - - - ns CL = 50pF 6 - - 22 - 28 - 33 ns CL = 50pF 2 - - 130 - 165 - 195 ns CL = 50pF 4.5 - - 26 - 33 - 39 ns CL = 15pF 5 - 10 - - - - - ns CL = 50pF 6 - - 22 - 28 - 33 ns CL = 50pF 2 - - 130 - 165 - 195 ns CL = 50pF 4.5 - - 26 - 33 - 39 ns CL = 15pF 5 - 11 - - - - - ns CL = 50pF 6 - - 22 - 28 - 33 ns CL = 50pF 2 - - 75 - 95 - 110 ns CL = 50pF 4.5 - - 15 - 19 - 22 ns CL = 50pF 6 - - 13 - 16 - 19 ns Switching Specifications Input tr, tf = 6ns PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC HC TYPES Propagation Delay, Data to Q Propagation Delay, Data to Q Propagation Delay, Enable to Q Propagation Delay, Enable to Q Output Transition Time Input Capacitance Power Dissipation Capacitance (Notes 3, 4) tPLH, tPHL tPLH, tPHL tPLH, tPHL tTLH, tTHL CI - - - - 10 - 10 - 10 pF CPD - 5 - 46 - - - - - pF CL = 50pF 4.5 - - 28 - 35 - 42 ns CL = 15pF 5 - 11 - - - - - ns CL = 50pF 4.5 - - 28 - 35 - 42 ns HCT TYPES Propagation Delay, Data to Q tPLH, tPHL Propagation Delay, Data to Q tPLH, tPHL Propagation Delay, Enable to Q tPLH, tPHL CL = 15pF 5 - 11 - - - - - ns CL = 50pF 4.5 - - 28 - 35 - 42 ns CL = 15pF 5 11 - - - - - ns 5 CD54HC75, CD74HC75, CD54HCT75, CD74HCT75 Switching Specifications Input tr, tf = 6ns (Continued) 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS Propagation Delay, Enable to Q tPLH, tPHL CL = 50pF 4.5 - - 30 - 38 - 45 ns CL = 15pF 5 - 12 - - - - - ns Output Transition Time tTLH, tTHL CL = 50pF 4.5 - - 15 - 19 - 22 ns PARAMETER Input Capacitance Power Dissipation Capacitance (Notes 3, 4) CI - - - - 10 - 10 - 10 pF CPD - 5 - 46 - - - - - pF NOTES: 3. CPD is used to determine the dynamic power consumption, per latch. 4. PD = VCC2 fi (CPD + CL) where fi = input frequency, CL = output load capacitance, VCC = supply voltage. Test Circuits and Waveforms tfCL trCL CLOCK tWL + tWH = 90% 10% I tr = 6ns FIGURE 4. HCT CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH tf = 6ns tr = 6ns VCC GND tTLH GND tTHL 90% 50% 10% INVERTING OUTPUT 3V 2.7V 1.3V 0.3V INPUT tTHL GND tWH NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. tf = 6ns 90% 50% 10% 1.3V 1.3V tWL FIGURE 3. HC CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH tPHL 1.3V 0.3V tWH NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. INPUT 2.7V 0.3V GND tWL I fCL 3V CLOCK 50% 50% tfCL = 6ns fCL VCC 50% 10% tWL + tWH = trCL = 6ns tTLH 90% 1.3V 10% INVERTING OUTPUT tPHL tPLH FIGURE 5. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPLH FIGURE 6. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 6 CD54HC75, CD74HC75, CD54HCT75, CD74HCT75 Test Circuits and Waveforms trCL tfCL trCL CLOCK INPUT (Continued) VCC 90% GND tH(H) GND tH(H) VCC DATA INPUT 50% tH(L) 3V 1.3V 1.3V 1.3V GND tSU(H) tSU(H) tSU(L) tTLH 90% OUTPUT tTHL 90% 50% 10% tTLH 90% 1.3V OUTPUT tREM 3V SET, RESET OR PRESET GND tTHL 1.3V 10% FIGURE 7. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS tPHL 1.3V GND IC CL 50pF GND 90% tPLH 50% IC tSU(L) tPHL tPLH tREM VCC SET, RESET OR PRESET 1.3V 0.3V tH(L) DATA INPUT 3V 2.7V CLOCK INPUT 50% 10% tfCL CL 50pF FIGURE 8. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS 7 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 1-Jun-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9075801MEA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type 8407001EA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) CD54HC75F3A ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type CD54HCT75F3A ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type CD74HC75E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC75EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC75M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75MTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75NSRG4 ACTIVE SO NS 16 2000 TBD Call TI CD74HC75PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC75PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Call TI PACKAGE OPTION ADDENDUM www.ti.com 1-Jun-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CD74HCT75E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT75EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT75M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT75ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT75MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-May-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 19-May-2007 Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74HC75M96 D 16 FMX 0 16 6.5 10.3 12.1 2 16 Q1 CD74HC75NSR NS 16 MLA 330 16 8.2 10.5 2.5 12 16 Q1 CD74HC75PWR PW 16 MLA 330 12 7.0 5.6 1.6 8 12 Q1 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) CD74HC75M96 D 16 FMX 342.9 336.6 28.58 CD74HC75NSR NS 16 MLA 342.9 336.6 28.58 CD74HC75PWR PW 16 MLA 338.1 340.5 20.64 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-May-2007 Pack Materials-Page 3 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. 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