STMicroelectronics M274001-80XC1 4 mbit (512kb x 8) uv eprom and otp eprom Datasheet

M27C4001
4 Mbit (512Kb x 8) UV EPROM and OTP EPROM
Feature summary
■
5V ± 10% supply voltage in Read operation
■
Access time: 35ns
■
Low power consumption:
– Active Current 30mA at 5MHz
– Standby Current 100µA
■
Programming voltage: 12.75V ± 0.25V
■
Programming time: 100µs/Word
■
Electronic signature
– Manufacturer Code: 20h
– Device Code: 41h
■
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FDIP32W (F)
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Packages
– ECOPACK® compliant versions
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PDIP32 (B)
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PLCC32 (C)
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March 2006
TSOP32 (N) 8 x 20 mm
Rev 4
1/24
www.st.com
1
Contents
M27C4001
Contents
1
Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1
Read Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2
Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3
Two Line Output Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4
System Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.5
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6
PRESTO II Programming Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.7
Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.8
Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.9
Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.10
Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11
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Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5
Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
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Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
M27C4001
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package mechanical data. . . . . . . 18
PDIP32 - 32 lead Plastic DIP, 600 mils width, package mechanical data . . . . . . . . . . . . . 19
PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data . . . . . . . . . . . . 20
TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Mechanical Data. . . . 21
Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
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List of figures
M27C4001
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Logic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
DIP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
FDIP32W - 32 pin Ceramic Frit-seal DIP with window, Package Outline . . . . . . . . . . . . . . 18
PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Outline. . . . . . . . . . . . . . . . . . . . . 19
PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline . . . . . . . . . . . . . . . . . . . 20
TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Outline . . . . . . . . . . . 21
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M27C4001
1
Summary description
Summary description
The M27C4001 is a 4 Mbit EPROM offered in the two ranges UV (ultra violet erase) and
OTP (one time programmable). It is ideally suited for microprocessor systems requiring
large programs and is organised as 524,288 by 8 bits.
The FDIP32W (window ceramic frit-seal package) has a transparent lid which allows the
user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be
written to the device by following the programming procedure.
For applications where the content is programmed only one time and erasure is not
required, the M27C4001 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages.
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In order to meet environmental requirements, ST offers the M27C4001 in ECOPACK®
packages.
ECOPACK packages are Lead-free. The category of second Level Interconnect is marked
on the package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
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ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 1.
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Logic Diagram
VCC
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A0-A18
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E
VPP
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Q0-Q7
M27C4001
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Table 1.
VSS
AI00721B
Signal names
A0-A18
Address Inputs
Q0-Q7
Data Outputs
E
Chip Enable
G
Output Enable
VPP
Program Supply
VCC
Supply Voltage
VSS
Ground
5/25
Summary description
Figure 2.
M27C4001
DIP Connections
1
32
2
31
3
30
4
29
5
28
6
27
7
26
8
25
M27C4001
9
24
10
23
11
22
12
21
13
20
14
19
15
18
16
17
VPP
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
VSS
VCC
A18
A17
A14
A13
A8
A9
A11
G
A10
E
Q7
Q6
Q5
Q4
Q3
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AI00722
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LCC Connections
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A12
A15
A16
VPP
VCC
A18
A17
Figure 3.
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A7
A6
A5
A4
A3
A2
A1
A0
Q0
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M27C4001
25
A14
A13
A8
A9
A11
G
A10
E
Q7
17
VSS
Q3
Q4
Q5
Q6
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Q1
Q2
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AI00723
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M27C4001
Summary description
Figure 4.
TSOP Connections
A11
A9
A8
A13
A14
A17
A18
VCC
VPP
A16
A15
A12
A7
A6
A5
A4
1
8
9
32
M27C4001
(Normal)
16
25
24
G
A10
E
Q7
Q6
Q5
Q4
Q3
VSS
Q2
Q1
Q0
A0
A1
A2
A3
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AI01155B
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Device operation
2
M27C4001
Device operation
The operating modes of the M27C4001 are listed in the Operating Modes table. A single
power supply is required in the read mode. All inputs are TTL levels except for VPP and 12V
on A9 for Electronic Signature.
2.1
Read Mode
The M27C4001 has two control functions, both of which must be logically active in order to
obtain data at the outputs. Chip Enable (E) is the power control and should be used for
device selection. Output Enable (G) is the output control and should be used to gate data to
the output pins, independent of device selection. Assuming that the addresses are stable,
the address access time (tAVQV) is equal to the delay from E to output (tELQV). Data is
available at the output after a delay of tGLQV from the falling edge of G, assuming that E has
been low and the addresses have been stable for at least tAVQV-tGLQV.
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2.2
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Standby Mode
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The M27C4001 has a standby mode which reduces the supply current from 30mA to 100µA.
The M27C4001 is placed in the standby mode by applying a CMOS high signal to the E
input. When in the standby mode, the outputs are in a high impedance state, independent of
the G input.
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Two Line Output Control
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Because EPROMs are usually used in larger memory arrays, this product features a 2 line
control function which accommodates the use of multiple memory connection. The two line
control function allows:
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the lowest possible memory power dissipation,
b)
complete assurance that output bus contention will not occur.
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For the most efficient use of these two control lines, E should be decoded and used as the
primary device selecting function, while G should be made a common connection to all
devices in the array and connected to the READ line from the system control bus. This
ensures that all deselected memory devices are in their low power standby mode and that
the output pins are only active when data is required from a particular memory device.
M27C4001
2.4
Device operation
System Considerations
The power switching characteristics of Advanced CMOS EPROMs require careful
decoupling of the devices. The supply current, ICC, has three segments that are of interest to
the system designer: the standby current level, the active current level, and transient current
peaks that are produced by the falling and rising edges of E. The magnitude of the transient
current peaks is dependent on the capacitive and inductive loading of the device at the
output. The associated transient voltage peaks can be suppressed by complying with the
two line output control and by properly selected decoupling capacitors. It is recommended
that a 0.1µF ceramic capacitor be used on every device between VCC and VSS. This should
be a high frequency capacitor of low inherent inductance and should be placed as close to
the device as possible. In addition, a 4.7µF bulk electrolytic capacitor should be used
between VCC and VSS for every eight devices. The bulk capacitor should be located near the
power supply connection point. The purpose of the bulk capacitor is to overcome the voltage
drop caused by the inductive effects of PCB traces.
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2.5
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Programming
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When delivered (and after each erasure for UV EPROM), all bits of the M27C4001 are in the
'1' state. Data is introduced by selectively programming '0's into the desired bit locations.
Although only '0's will be programmed, both '1's and '0's can be present in the data word.
The only way to change a '0' to a '1' is by die exposure to ultraviolet light (UV EPROM). The
M27C4001 is in the programming mode when VPP input is at 12.75V, G is at VIH and E is
pulsed to VIL. The data to be programmed is applied to 8 bits in parallel to the data output
pins. The levels required for the address and data inputs are TTL. VCC is specified to be
6.25V ± 0.25V.
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2.6
PRESTO II Programming Algorithm
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PRESTO II Programming Algorithm allows the whole array to be programmed with a
guaranteed margin, in a typical time of 52.5 seconds. Programming with PRESTO II
consists of applying a sequence of 100µs program pulses to each byte until a correct verify
occurs (see Figure 5). During programming and verify operation, a MARGIN MODE circuit is
automatically activated in order to guarantee that each cell is programmed with enough
margin. No overprogram pulse is applied since the verify in MARGIN MODE provides the
necessary margin to each programmed cell.
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Device operation
Figure 5.
M27C4001
Programming Flowchart
VCC = 6.25V, VPP = 12.75V
n=0
E = 100µs Pulse
NO
++n
= 25
YES
FAIL
NO
++ Addr
VERIFY
YES
Last
Addr
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NO
YES
CHECK ALL BYTES
1st: VCC = 6V
2nd: VCC = 4.2V
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Program Inhibit
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Programming of multiple M27C4001s in parallel with different data is also easily
accomplished. Except for E, all like inputs including G of the parallel M27C4001 may be
common. A TTL low level pulse applied to a M27C4001's E input, with VPP at 12.75V, will
program that M27C4001. A high level E input inhibits the other M27C4001s from being
programmed.
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2.8
Program Verify
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A verify (read) should be performed on the programmed bits to determine that they were
correctly programmed. The verify is accomplished with G at VIL, E at VIH, VPP at 12.75V and
VCC at 6.25V.
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2.9
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Electronic Signature
The Electronic Signature (ES) mode allows the reading out of a binary code from an
EPROM that will identify its manufacturer and type. This mode is intended for use by
programming equipment to automatically match the device to be programmed with its
corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C
ambient temperature range that is required when programming the M27C4001. To activate
the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of
the M27C4001 with VPP = VCC = 5V. Two identifier bytes may then be sequenced from the
device outputs by toggling address line A0 from VIL to VIH. All other address lines must be
held at VIL during Electronic Signature mode. Byte 0 (A0 = VIL) represents the manufacturer
code and byte 1 (A0 = VIH) the device identifier code. For the STMicroelectronics
M27C4001, these two identifier bytes are given in Table 3 and can be read-out on outputs
Q7 to Q0.
M27C4001
2.10
Device operation
Erasure operation (applies to UV EPROM)
The erasure characteristics of the M27C4001 are such that erasure begins when the cells
are exposed to light with wavelengths shorter than approximately 4000 Å. It should be noted
that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å
range. Data shows that constant exposure to room level fluorescent lighting could erase a
typical M27C4001 in about 3 years, while it would take approximately 1 week to cause
erasure when exposed to direct sunlight. If the M27C4001 is to be exposed to these types of
lighting conditions for extended periods of time, it is suggested that opaque labels be put
over the M27C4001 window to prevent unintentional erasure. The recommended erasure
procedure for the M27C4001 is exposure to short wave ultraviolet light which has
wavelength of 2537 Å. The integrated dose (i.e. UV intensity x exposure time) for erasure
should be a minimum of 15 W-sec/cm2. The erasure time with this dosage is approximately
15 to 20 minutes using an ultraviolet lamp with 12000 µW/cm2 power rating. The M27C4001
should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps
have a filter on their tubes which should be removed before erasure.
Table 2.
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Operating Modes(1)
Mode
E
G
Read
VIL
VIL
Output Disable
VIL
VIH
VIL Pulse
VIH
Verify
VIH
Program Inhibit
VIH
Program
VIH
Electronic Signature
VIL
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Pr
Vpp
Q7 - Q0
VCC or VSS
Data Out
X
VCC or VSS
Hi-Z
X
VPP
Data In
VIL
X
VPP
Data Out
VIH
X
VPP
Hi-Z
X
X
VCC or VSS
Hi-Z
VIL
VID
VCC
Codes
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Standby
A9
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1. X = VIH or VIL, VID = 12V ± 0.5V.
Table 3.
Electronic Signature
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Identifier
A0
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
Hex Data
Manufacturer’s
Code
VIL
0
0
1
0
0
0
0
0
20h
Electronic
Signature
VIH
0
1
0
0
0
0
0
1
41h
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Maximum rating
3
M27C4001
Maximum rating
Stressing the device above the rating listed in the Absolute Maximum Ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 4.
Absolute Maximum Ratings
Symbol
TA
Parameter
Ambient Operating
TBIAS
Temperature Under Bias
TSTG
Storage Temperature
VIO(2)
Input or Output Voltage (except A9)
VCC
VA9(2)
VPP
Value
Temperature(1)
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Supply Voltage
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A9 Voltage
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Program Supply Voltage
1. Depends on range.
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–40 to 125
–50 to 125
Pr
Unit
°C
°C
–65 to 150
°C
–2 to 7
V
–2 to 7
V
–2 to 13.5
V
–2 to 14
V
2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period
less than 20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC
+2V for a period less than 20ns.
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M27C4001
4
DC and AC parameters
DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC Characteristic tables that
follow are derived from tests performed under the Measurement Conditions summarized in
the relevant tables. Designers should check that the operating conditions in their circuit
match the measurement conditions when relying on the quoted parameters.
Table 5.
AC Measurement Conditions
High Speed
Standard
Input Rise and Fall Times
≤10ns
≤20ns
Input Pulse Voltages
0 to 3V
0.4 to 2.4V
1.5V
0.8 and 2V
Input and Output Timing Ref. Voltages
Figure 6.
AC Testing Input Output Waveform
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High Speed
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e
l
o
3V
0V
)
(s
Standard
t
c
u
let
P
e
Figure 7.
o
s
b
1.5V
s
b
O
2.4V
d
o
r
u
d
o
2.0V
0.8V
0.4V
AI01822
AC Testing Load Circuit
1.3V
1N914
O
3.3kΩ
DEVICE
UNDER
TEST
OUT
CL
CL = 30pF for High Speed
CL = 100pF for Standard
CL includes JIG capacitance
AI01823B
13/25
DC and AC parameters
M27C4001
Capacitance (1) (2)
Table 6.
Symbol
Parameter
CIN
Test Condition
Input Capacitance
Output Capacitance
COUT
Min
Max
Unit
VIN = 0V
6
pF
VOUT = 0V
12
pF
1. TA = 25 °C, f = 1 MHz.
2. Sampled only, not 100% tested.
.
Table 7.
Read Mode DC Characteristics(1) (2)
Symbol
Parameter
Test Condition
Max
Unit
0V ≤VIN ≤VCC
±10
µA
0V ≤VOUT ≤VCC
±10
µA
ILI
Input Leakage Current
ILO
Output Leakage Current
ICC
Supply Current
ICC1
Supply Current (Standby) TTL
ICC2
Supply Current (Standby)
CMOS
IPP
Program Current
VPP = VCC
VIL
Input Low Voltage
VIH(3)
Input High Voltage
so
VOL
Output Low Voltage
E = VIL, G = VIL,
IOUT = 0mA, f = 5MHz
)-
Output High Voltage TTL
VOH
Min
E = VIH
b
O
s
(
t
c
Output High Voltage CMOS
uc
30
mA
1
mA
100
µA
10
µA
–0.3
0.8
V
2
VCC + 1
V
0.4
V
od
r
P
e
E > VCC – 0.2V
)
s
(
t
let
IOL = 2.1mA
IOH = –400µA
2.4
V
IOH = –100µA
VCC – 0.7V
V
1. TA = 0 to 70 °C or –40 to 85 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC
u
d
o
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP..
r
P
e
3. Maximum DC voltage on Output is VCC +0.5V.
Table 8.
let
Symbol
so
b
O
Programming Mode DC Characteristics (1) (2)
Parameter
Test Condition
Min
0 ≤VIN ≤VCC
Max
Unit
±10
µA
50
mA
50
mA
ILI
Input Leakage Current
ICC
Supply Current
IPP
Program Current
VIL
Input Low Voltage
–0.3
0.8
V
VIH
Input High Voltage
2
VCC + 0.5
V
VOL
Output Low Voltage
0.4
V
VOH
Output High Voltage TTL
VID
A9 Voltage
E = VIL
IOL = 2.1mA
IOH = –400µA
2.4
11.5
V
12.5
1. TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V.
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
14/25
V
M27C4001
DC and AC parameters
Figure 8.
Read Mode AC Waveforms
VALID
A0-A18
VALID
tAVQV
tAXQX
E
tEHQZ
tGLQV
G
tGHQZ
tELQV
Hi-Z
Q0-Q7
)
s
(
ct
AI00724B
Table 9.
u
d
o
Read Mode AC Characteristics(1) (2)
r
P
e
M27C4001
Symbol
Alt
Parameter
-35(3)
Test Condition
t
e
l
o
Min
tACC
Address Valid to
Output Valid
tELQV
tCE
Chip Enable Low to
Output Valid
tGLQV
tOE
Output Enable Low
to Output Valid
tEHQZ(4)
tDF
Chip Enable High to
Output Hi-Z
G = VIL
0
30
0
30
tDF
Pr
Output Enable High
to Output Hi-Z
E = VIL
0
30
0
30
tOH
Address Transition
to Output Transition
E = VIL, G = VIL
0
e
t
e
l
tAXQX
b
O
Max Min Max
tAVQV
tGHQZ(4)
so
bs
-45(3)
E = VIL, G = VIL
u
d
o
Min
Unit
Max
35
45
55
ns
G = VIL
35
45
55
ns
E = VIL
20
25
30
ns
0
30
ns
0
30
ns
O
)
s
(
t
c
-55(3)
0
0
ns
1. TA = 0 to 70 °C or –40 to 85 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP
3. Speed obtained with High Speed AC measurement conditions.
4. Sampled only, not 100% tested.
15/25
DC and AC parameters
M27C4001
Read Mode AC Characteristics(1) (2)
Table 10.
M27C4001
Symbol
Alt
Parameter
Test Condition
-70
Min
tAVQV
tACC
Address Valid to
Output Valid
tELQV
tCE
tGLQV
-80/-90
Max
Min
Max
-10/-12/-15 Unit
Min
Max
E = VIL, G = VIL
70
80
100
ns
Chip Enable Low to
Output Valid
G = VIL
70
80
100
ns
tOE
Output Enable Low
to Output Valid
E = VIL
35
40
50
ns
tEHQZ(3)
tDF
Chip Enable High to
Output Hi-Z
G = VIL
0
30
0
30
ns
tGHQZ(3)
tDF
Output Enable High
to Output Hi-Z
E = VIL
0
30
0
30
ns
tAXQX
tOH
Address Transition
to Output Transition
E = VIL, G = VIL
0
30
u
d
o
t
e
l
o
r
P
e
0
)
s
(
ct
0
30
0
0
1. TA = 0 to 70 °C or –40 to 85 °C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
3. Sampled only, not 100% tested.
)
(s
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
16/25
s
b
O
ns
M27C4001
DC and AC parameters
Figure 9.
Programming and Verify Modes AC Waveforms
VALID
A0-A18
tAVPL
Q0-Q7
DATA IN
DATA OUT
tQVEL
tEHQX
VPP
tVPHEL
tGLQV
tGHQZ
VCC
)
s
(
ct
tVCHEL
tGHAX
E
tELEH
tQXGL
u
d
o
G
r
P
e
PROGRAM
Table 11.
t
e
l
o
AI00725
Programming Mode AC Characteristics(1) (2) (3)
s
b
O
Symbol
Alt
tAVEL
tAS
Address Valid to Chip Enable Low
2
µs
tQVEL
tDS
Input Valid to Chip Enable Low
2
µs
tVPHEL
tVPS
VPP High to Chip Enable Low
2
µs
tVCHEL
tVCS
VCC High to Chip Enable Low
2
µs
tELEH
tPW
Chip Enable Program Pulse Width
95
tDH
Chip Enable High to Input Transition
2
µs
tOES
Input Transition to Output Enable Low
2
µs
tGLQV
tOE
Output Enable Low to Output Valid
tGHQZ
tDFP
Output Enable High to Output Hi-Z
0
tGHAX
tAH
Output Enable High to Address
Transition
0
tEHQX
tQXGL
e
t
e
ol
s
b
O
VERIFY
Parameter
)
(s
t
c
u
od
Pr
Test Condition
Min
Max
105
Unit
µs
100
ns
130
ns
ns
1. TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V
2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
3. Sampled only, not 100% tested.
17/25
Package mechanical
5
M27C4001
Package mechanical
Figure 10. FDIP32W - 32 pin Ceramic Frit-seal DIP with window, Package Outline
A2
A3
A1
B1
B
A
L
α
e
eA
D2
C
eB
D
)
s
(
ct
S
N
∅
E1
E
u
d
o
1
FDIPW-a
r
P
e
1. Drawing is not to scale.
Table 12.
bs
millimeters
Symbol
Typ
O
)
Min
A
s
(
t
c
A1
A2
u
d
o
A3
B
B1
e
t
e
l
C
o
s
b
O
Pr
1.45
D
Max
Typ
inches
Min
5.72
Max
0.225
0.51
1.40
0.020
0.055
3.91
4.57
0.154
0.180
3.89
4.50
0.153
0.177
0.41
0.56
0.016
0.022
–
–
–
–
0.23
0.30
0.009
0.012
41.73
42.04
1.643
1.655
0.057
D2
38.10
–
–
1.500
–
–
e
2.54
–
–
0.100
–
–
E
15.24
–
–
0.600
–
–
13.06
13.36
0.514
0.526
–
–
–
–
eB
16.18
18.03
0.637
0.710
L
3.18
4.10
0.125
0.161
0.060
0.098
–
–
4°
11°
E1
eA
N
14.99
32
S
Ø
α
18/25
t
e
l
o
FDIP32W - 32 pin Ceramic Frit-seal DIP with window, package mechanical
data
7.11
0.590
32
1.52
2.49
–
–
4°
11°
0.280
M27C4001
Package mechanical
Figure 11. PDIP32 - 32 lead Plastic DIP, 600 mils width, Package Outline
A2
A
A1
b1
b
α
L
e
eA
c
D2
D
S
N
E1
)
s
(
ct
E
1
PDIP-C
u
d
o
1. Drawing is not to scale.
Table 13.
let
millimeters
Symbol
Typ
Min
A
so
Max
b
O
Typ
inches
Min
4.83
A1
0.38
A2
)
(s
3.81
t
c
u
b
Max
0.190
0.015
0.150
0.41
0.53
0.016
0.021
1.14
1.65
0.045
0.065
0.23
0.38
0.009
0.015
41.78
42.29
1.645
1.665
15.24
–
–
0.600
–
–
2.54
–
–
0.100
–
–
E
15.24
15.88
0.600
0.625
E1
13.46
13.97
0.530
0.550
S
1.65
2.21
0.065
0.087
L
3.05
3.56
0.120
0.140
α
0°
15°
0°
15°
N
32
b1
c
D
e
t
e
ol
eA
e
s
b
O
r
P
e
PDIP32 - 32 lead Plastic DIP, 600 mils width, package mechanical data
Pr
od
32
19/25
Package mechanical
M27C4001
Figure 12. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline
D
D1
A1
A2
1 N
B1
E2
E3
e
E1 E
F
B
0.51 (.020)
E2
1.14 (.045)
R
D2
CP
u
d
o
D2
r
P
e
1. Drawing is not to scale.
Table 14.
Symbol
Typ
Min
A
c
u
d
B
ro
B1
o
s
b
O
P
e
3.56
0.125
0.140
1.53
2.41
0.060
0.095
0.38
–
0.015
–
0.33
0.53
0.013
0.021
0.66
0.81
0.026
0.032
)-
Max
Typ
0.10
0.004
D
12.32
12.57
0.485
0.495
D1
11.35
11.51
0.447
0.453
D2
4.78
5.66
0.188
0.223
–
–
–
–
E
14.86
15.11
0.585
0.595
E1
13.89
14.05
0.547
0.553
E2
6.05
6.93
0.238
0.273
D3
7.62
0.300
E3
10.16
–
–
0.400
–
–
e
1.27
–
–
0.050
–
–
0.00
0.13
0.000
0.005
–
–
–
–
F
20/25
Max
t(s
A2
s
b
O
inches
Min
3.18
A1
let
t
e
l
o
PLCC-A
PLCC32 - 32 lead Plastic Leaded Chip Carrier, package mechanical data
millimeters
CP
)
s
(
ct
A
D3
R
0.89
N
32
0.035
32
M27C4001
Package mechanical
Figure 13. TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package Outline
A2
N
1
e
E
B
N/2
A
D1
CP
D
DIE
u
d
o
C
r
P
e
A1
TSOP-a
Symbol
Typ
s
(
t
c
A1
u
d
o
A2
e
t
e
l
)-
Min
A
C
Pr
O
s
b
O
Max
inches
Typ
Min
1.200
Max
0.0472
0.050
0.150
0.0020
0.0059
0.950
1.050
0.0374
0.0413
0.170
0.250
0.0067
0.0098
0.100
0.210
0.0039
0.0083
CP
o
s
b
L
TSOP32 - 32 lead Plastic Thin Small Outline, 8 x 20 mm, Package
Mechanical Data
millimeters
B
α
t
e
l
o
1. Drawing is not to scale.
Table 15.
)
s
(
ct
0.100
0.0039
D
19.800
20.200
0.7795
0.7953
D1
18.300
18.500
0.7205
0.7283
–
–
–
–
E
7.900
8.100
0.3110
0.3189
L
0.500
0.700
0.0197
0.0276
0°
5°
e
N
α
0.500
32
0.0197
32
0°
5°
21/25
Part numbering
6
M27C4001
Part numbering
Table 16.
Ordering Information Scheme
Example:
M27C4001
-45
X
C
1
Device Type
M27
Supply Voltage
C = 5V
)
s
(
ct
Device Function
4001 = 4 Mbit (512Kb x 8)
u
d
o
Speed
-35(1) = 35 ns
-45(1) = 45 ns
-55(1) = 55 ns
-70 = 70 ns
-80 = 80 ns
-90 = 90 ns
-10 = 100 ns
-12 = 120 ns
-15 = 150 ns
VCC Tolerance
blank = ± 10%
X = ± 5%
r
P
e
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
Package
F = FDIP32W
B = PDIP32
C = PLCC32
N = TSOP32: 8 x 20 mm
t
e
l
o
s
b
O
Temperature Range
1 = 0 to 70 °C
6 = –40 to 85 °C
1. High Speed, see AC Characteristics section for further information.
For a list of available options (Speed, Package, etc...) or for further information on any
aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.
22/25
M27C4001
7
Revision history
Revision history
Table 17.
Document revision history
Date
Revision
July 1998
1
First Issue
09/25/00
2
AN620 Reference removed
11/29/00
3
PLCC codification changed (Table 16.)
4
Document converted to new template (sections added, information
moved). LCCC32W package removed. Package specifications
updated (see Section 5: Package mechanical). Packages are
ECOPACK® compliant. X and TR options removed from Table 16:
Ordering Information Scheme.
28-Mar-2006
Changes
)
s
(
ct
u
d
o
r
P
e
t
e
l
o
)
(s
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
s
b
O
23/25
M27C4001
)
s
(
ct
Please Read Carefully:
u
d
o
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24/24