Philips Semiconductors Product specification Damper diode fast, high-voltage FEATURES BY329X-1500, BY329X-1500S SYMBOL • Low forward volt drop • Fast switching • Soft recovery characteristic • High thermal cycling performance • Isolated mounting tab QUICK REFERENCE DATA VR = 1500 V k 1 VF ≤ 1.35 V / 1.5 V a 2 IF(peak) = 6 A (f = 16 kHz) IF(peak) = 6 A (f = 70 kHz) IFSM ≤ 75 A trr ≤ 230 ns / 160 ns GENERAL DESCRIPTION PINNING Glass-passivated double diffused rectifier diode featuring low forward voltage drop, fast reverse recovery and soft recovery characteristic. The device is intended for use in TV receivers and PC monitors. PIN SOD113 DESCRIPTION case 1 anode 2 cathode tab isolated The BY329X series is supplied in the conventional leaded SOD113 package. 1 2 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER VRSM CONDITIONS MIN. MAX. UNIT - 1500 V - 1500 V - 1300 V VRWM Peak non-repetitive reverse voltage Peak repetitive reverse voltage Crest working reverse voltage IF(peak) Peak working forward current f = 16 kHz f = 70 kHz - IFRM Peak repetitive forward current RMS forward current Peak non-repetitive forward current t = 25 µs; δ = 0.5; Ths ≤ 86 ˚C - 14 A - 11 75 A A -40 - 150 150 ˚C ˚C VRRM BY329X IF(RMS) IFSM Tstg Tj Storage temperature Operating junction temperature September 1998 t = 10 ms sinusoidal; Tj = 150 ˚C prior to surge; with reapplied VRWM(max) 1 -1500 6 - -1500S 6 A A Rev 1.100 Philips Semiconductors Product specification Damper diode fast, high-voltage BY329X-1500, BY329X-1500S ISOLATION LIMITING VALUE & CHARACTERISTIC Ths = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS Visol R.M.S. isolation voltage from both terminals to external heatsink f = 50-60 Hz; sinusoidal waveform; R.H. ≤ 65% ; clean and dustfree MIN. Cisol Capacitance from both terminals f = 1 MHz to external heatsink TYP. - MAX. UNIT 2500 V - 10 - pF MIN. TYP. MAX. UNIT - 55 4.8 5.9 - K/W K/W K/W THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-hs Thermal resistance junction to heatsink Thermal resistance junction to ambient with heatsink compound without heatsink compound in free air. Rth j-a STATIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT BY329X- 1500 1500S 1500 1500S VF Forward voltage IR Reverse current IF = 6.5 A IF = 6.5 A; Tj = 125 ˚C VR = 1300 V VR = 1300 V; Tj = 125 ˚C 1.1 1.05 - 1.3 1.2 250 1 1.45 1.35 - 1.6 1.5 250 1 V V µA mA DYNAMIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS TYP. BY329X 1500 1500S MAX. UNIT 1500 1500S trr Reverse recovery time IF = 1 A; VR ≥ 30 V; dIF/dt = 50A/µs 0.18 0.13 0.23 0.16 µs Qs Vfr tfr Reverse recovery charge Peak forward recovery voltage Forward recovery time IF = 2 A; -dIF/dt = 20 A/µs IF = 6.5A; dIF/dt = 50A/µs IF = 6.5A; dIF/dt = 50A/µs 1.6 17 210 0.7 23 220 2.0 30 300 0.95 40 320 µC V ns September 1998 2 Rev 1.100 Philips Semiconductors Product specification Damper diode fast, high-voltage I BY329X-1500, BY329X-1500S 100 F Maximum pulse width / us BY459X-1500 VRRM V pulse width tp 10% time tfr time period T 10 VF V 5V VF fr 1 10 100 time line frequency / kHz Fig.1. Definition of Vfr and tfr I dI F Fig.4. Maximum allowable pulse width tp versus line frequency; Basic horizontal deflection circuit. 30 F IF / A BY32915 Tj = 125 C Tj = 25 C dt trr 20 time Qs I 25% 10 100% typ max R 0 Fig.2. Definition of trr and Qs 0 0.5 1 1.5 VF / V 2 Fig.5. BY329-1500 Typical and maximum forward characteristic IF = f(VF); parameter Tj IF / A VCC BY32915S 30 Tj = 125 C Tj = 25 C 20 Line output transformer LY 10 Cf deflection transistor Cs max D1 0 Fig.3. Basic horizontal deflection circuit. September 1998 typ 0 0.5 1 1.5 VF / V 2 Fig.6. BY329-1500S Typical and maximum forward characteristic IF = f(VF); parameter Tj 3 Rev 1.100 Philips Semiconductors Product specification Damper diode fast, high-voltage 10 BY329X-1500, BY329X-1500S Transient thermal impedance, Zth j-hs (K/W) 1 0.1 PD 0.01 0.001 1us tp D= T 10us tp T t 100us 1ms 10ms 100ms 1s pulse width, tp (s) BY229F 10s Fig.7. Transient thermal impedance Zth = f(tp) September 1998 4 Rev 1.100 Philips Semiconductors Product specification Damper diode fast, high-voltage BY329X-1500, BY329X-1500S MECHANICAL DATA Dimensions in mm 10.3 max 4.6 max Net Mass: 2 g 3.2 3.0 2.9 max 2.8 Recesses (2x) 2.5 0.8 max. depth 6.4 15.8 19 max. max. 15.8 max seating plane 3 max. not tinned 3 2.5 13.5 min. 1 0.4 2 M 1.0 (2x) 0.6 2.54 0.9 0.7 0.5 2.5 5.08 Fig.8. SOD113; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". September 1998 5 Rev 1.100 Philips Semiconductors Product specification Damper diode fast, high-voltage BY329X-1500, BY329X-1500S DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1998 6 Rev 1.100