Foshan BC556 Silicon pnp transistor in a to-92(r) plastic package Datasheet

BC556
Rev.F Mar.-2016
描述
/
DATA SHEET
Descriptions
TO-92(R)塑封封装 PNP 半导体三极管。Silicon PNP transistor in a TO-92(R) Plastic Package.

特征
/ Features
高电压,与 BC546 互补。
High voltage, complementary to BC546.
用途
/
Applications
用于一般放大及开关。
General purpose and switching application.
内部等效电路
引脚排列
12
/ Equivalent Circuit
/ Pinning
3
PIN1:Emitter
放大及印章代码
PIN 2:Base
PIN 3:Collector
/ hFE Classifications & Marking
hFE Classifications
Symbol
hFE Range
http://www.fsbrec.com
B
200~450
1/6
BC556
Rev.F Mar.-2016
极限参数
/
DATA SHEET
Absolute Maximum Ratings(Ta=25℃)
参数
Parameter
符号
Symbol
数值
Rating
单位
Unit
Collector to Base Voltage
VCBO
-80
V
Collector to Emitter Voltage
VCEO
-65
V
Emitter to Base Voltage
VEBO
-5.0
V
Collector Current - Continuous
IC
-100
mA
Emitter Current - Continuous
IE
100
mA
Collector Power Dissipation
PC
625
mW
Junction Temperature
Tj
150
℃
Tstg
-55~150
℃
Storage Temperature Range
电性能参数
/ Electrical Characteristics(Ta=25℃)
参数
Parameter
符号
Symbol
测试条件
Test Conditions
Collector Cut-Off Current
ICBO
VCB=-30V
IE=0
DC Current Gain
Collector-Emitter Saturation
Voltage
Base-Emitter Saturation Voltage
hFE
VCE=-5.0V
IC=-2.0mA
VCE(sat)
IC=-100mA
IB=-5.0mA
VBE(sat)
IC=-100mA
IB=-5.0mA
VBE(1)
VCE=-5.0V
IC=-2.0mA
VBE(2)
VCE=-5.0V
IC=-10mA
fT
VCE=-5.0V
f=100MHz
IC=-10mA
VCB=-10V
VCE=-6.0V
Rg=10KΩ
f=1.0MHz
IC=-0.1mA
f=1.0KHz
Base-Emitter Voltage
Current Gain Bandwidth Product
Transition Frequency
Cob
Noise Figure
NF
http://www.fsbrec.com
最小值 典型值
Min
Typ
200
最大值
Max
单位
Unit
-0.015
μA
450
-0.9
-0.6
-0.65
V
-1.1
V
-0.75
V
-0.8
V
150
MHz
4.5
pF
1.0
10
dB
2/6
BC556
Rev.F Mar.-2016
电参数曲线图
DATA SHEET
/ Electrical Characteristic Curve
http://www.fsbrec.com
3/6
BC556
Rev.F Mar.-2016
外形尺寸图
DATA SHEET
/ Package Dimensions
http://www.fsbrec.com
4/6
BC556
Rev.F Mar.-2016
印章说明
/
DATA SHEET
Marking Instructions
BR
BC556
B
****
说明:
BR: 
为公司代码
BC556: 为产品型号
B: 
为 hFE 分档代码
****:
为生产批号代码,随生产批号变化。
Note:
BR:
Company Code.
BC556:
Product Type.
B: 
hFE Classifications Symbol
****:
Lot No. Code, code change with Lot No.
http://www.fsbrec.com
5/6
BC556
Rev.F Mar.-2016
DATA SHEET
波峰焊温度曲线图(无铅)
/
Temperature Profile for Dip Soldering(Pb-Free)
说明:
Note:
1、预热温度 25~150℃,时间 60~90sec;
1.Preheating:25~150℃, Time:60~90sec.
2、峰值温度 255±5℃,时间持续为 5±0.5sec;
2.Peak Temp.:255±5℃, Duration:5±0.5sec.
3、焊接制程冷却速度为 2~10℃/sec.
3. Cooling Speed: 2~10℃/sec.
耐焊接热试验条件
/
温度:270±5℃
包装规格
散件包装
Time:10±1 sec
Units 包装数量
Units/Bag
只/袋
Bags/Inner Box
袋/盒
Units/Inner Box
只/盒
Dimension
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Bag 袋
包装尺寸
Inner Box 盒
(unit:mm3)
Outer Box 箱
1,000
10
10,000
5
50,000
135×190
237×172×102
560×245×195
1,000
10
10,000
10
100,000
135×190
237×172×102
560×245×375
Units/tape
只/纸带
Tape/Inner Box
纸带/盒
Rows/Inner Box
纸带层/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Inner Box 盒
3,000
1
120
10
30,000
328×230×42
/ AMMO
Package Type
封装形式
使用说明
Temp.:270±5℃
/ BULK
TO-92
TO-92
时间:10±1 sec.
/ Packaging SPEC.
Package Type
封装形式
编带包装
Resistance to Soldering Heat Test Conditions
Units 包装数量
Dimension
包装尺寸
(unit:mm3)
Outer Box 箱
小箱 480×346×235,
大箱 547×407×268
/ Notices
http://www.fsbrec.com
6/6
Similar pages