Material Content Data Sheet Sales Product Name SAL-XC866L-4FRA 3V BE MA# MA000914036 Package PG-TSSOP-38-4 Issued 29. August 2013 Weight* 118.23 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal noble metal organic material plastics inorganic material noble metal noble metal noble metal non noble metal plastics noble metal < 10% silicon magnesium silicon nickel copper gold carbon black epoxy resin silicondioxide gold silver palladium nickel epoxy resin silver 7440-21-3 7439-95-4 7440-21-3 7440-02-0 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-57-5 7440-22-4 7440-05-3 7440-02-0 7440-22-4 6.433 5.44 0.075 0.06 0.326 0.28 2757 1.504 1.27 12724 48.239 40.80 42.41 408007 424124 0.875 0.74 0.74 7404 7404 0.176 0.15 wire encapsulation plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 5.44 54413 54413 636 1490 7.460 6.31 51.105 43.23 0.004 0.00 37 0.002 0.00 20 0.003 0.00 0.080 0.07 0.389 0.33 1.558 1.32 63098 49.69 432244 23 0.07 676 2. 3. 1.65 13177 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 756 3294 Important Remarks: 1. 496832 16471 1000000