TI1 GRM216R71H103KA01D Boostxl-senshub sensor hub boosterpack Datasheet

User Manual
SPMU290 – April 2013
BOOSTXL-SENSHUB Sensor Hub BoosterPack
The Sensor Hub Booster Pack (BOOSTXL-SENSHUB) is a low-cost extension board for the Tiva™ C
Series TM4C LaunchPad EK-TM4C123GXL evaluation platform for ARM® Cortex™-M4F-based
microcontrollers (MCUs). This extension board, or BoosterPack, is specifically designed to expand the
functionality of the Tiva TM4C LaunchPad. This user’s manual provides an overview of the Sensor Hub
BoosterPack software and hardware
Figure 1 shows a photo of the BOOST-XL-SENSHUB.
Figure 1. BOOSTXL-SENSHUB BoosterPack Extension Board
RF Expansion
Connections
TPS75118
Voltage Regulator
BMP180
Pressure Sensor
RF Expansion
Connections
User
LED
1.6 in
MPU9150
9-axis Motion Sensor
User
Button
TMP006
Temp Sensor
SHT21
Humidity Sensor
ISL29023
Light Sensor
User
Button
2.0 in
1
2
3
4
Contents
Board Overview .............................................................................................................
Hardware Description ......................................................................................................
Software Development .....................................................................................................
References, PCB Layout, and Bill of Materials .........................................................................
2
3
5
6
Tiva, Code Composer Studio are trademarks of Texas Instruments.
TivaWare, Stellaris are registered trademarks of Texas Instruments.
Cortex, Keil are trademarks of ARM Limited.
ARM, RealView are registered trademarks of ARM Limited.
Microsoft, Windows are registered trademarks of Microsoft Corp.
All other trademarks are the property of their respective owners.
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1
Board Overview
1
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Board Overview
The Sensor Hub BoosterPack is an extension board for the TI MCU LaunchPad evaluation module ecosystem. It was designed specifically to extend the functionality of the Tiva TM4C1233 LaunchPad (EKTM4C123GXL). The Sensor Hub enables customers to create and model innovative prototype solutions
that leverage the processing and floating-point capabilities of the TM4C123GH6PM MCU coupled with
motion and environmental sensors. The Sensor Hub BoosterPack plugs in to the BoosterPack XL headers
located on the top of the LaunchPad. The BoosterPack also features a TI-standard extension module
(EM) connector to further extend customer applications through a variety of wireless extension modules.
This board and the available software also highlight the use of the new TivaWare® SensorLib sensor
driver library, an easy-to-use, extendable foundation of sensor communication software.
NOTE: The Sensor Hub BoosterPack is fully compatible with both the Tiva™ C Series LaunchPad
(EK-TM4C123GXL) and the Stellaris® LM4F120 LaunchPad (EK-LM4F120XL).
1.1
Kit Features
The BOOSTXL-SENSHUB BoosterPack offers the following features:
• TMP006 infrared object temperature sensor
• 9-axis InvenSense MPU9150 motion sensor:
– 3-axis acceleration
– 3-axis gyroscope
– 3-axis magnetometer
• Bosch BMP180 pressure sensor
• Intersil ISL29023 ambient and infrared light sensor
• Sensirion SHT21 humidity sensor
• Two user pushbuttons
• One user LED
• One power LED
• EM connector for additional wireless expansion
1.2
Using the Sensor Hub BoosterPack
Follow these recommended steps to quickly configure your Sensor Hub for proper operation.
Step 1. Review the BOOSTXL-SENSHUB BoosterPack Getting Started Guide (literature number
SPMU295, available for download at www.ti.com). This document guides you through
downloading, installing, and running the associated TivaWare examples that demonstrate the
Sensor Hub capabilities and functions.
Step 2. Examine the additional examples that are provided with the downloaded software to
understand the capabilities and limitations of each on-board sensor.
Step 3. Create your own application using the Tiva C Series LaunchPad and Sensor Hub
BoosterPack. Use the TivaWare for C Series Sensor Library to enable your innovative Tiva
TM4C MCU applications.
Step 4. Customize and integrate the hardware to suit a specific end application. This user’s manual is
an important reference for understanding circuit operation and completing hardware
modifications.
2
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Hardware Description
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1.3
Specifications
Table 1 summarizes the specifications for the BOOSTXL-SENSHUB BoosterPack.
Table 1. Sensor Hub BoosterPack Specifications
2
Parameter
Value
Board supply voltage
2.7 V to 5.5 V nominally supplied
as 3.3 V from the BoosterPack
interface
Dimensions
2.0 x 1.5 x 0.625 (in)
5.08 x 3.81 x 1.587 (cm)
RoHS status
Compliant
Hardware Description
The Sensor Hub BoosterPack includes five motion and environmental sensors. It also enables RF
expansion and access to user LEDs and buttons. The hardware is designed to enable innovative
applications that fuse sensor information and Tiva C Series software processing through the functionality
of the Tiva C Series LaunchPad.
Figure 2 shows a block diagram of the Sensor Hub BoosterPack.
Figure 2. BOOSTXL-SENSHUB BoosterPack Block Diagram
User
Buttons
BoosterPack XL
Connectors
3.3 V
TPS75118
BMP180
I2C3
MPU9150
3.3 V
UART/SPI/
I2C1
LED
1.8 V
SHT21
ISL29023
RF Expansion
TMP006
BOOSTXL-SENSHUB
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Hardware Description
2.1
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Functional Description
This section provides a functional description of the Sensor Hub BoosterPack.
2.1.1
BoosterPack XL Connector
The BoosterPack XL connector attaches the BoosterPack to the Tiva TM4C LaunchPad. This
BoosterPack is specifically designed to match the pin function with the Tiva TM4C LaunchPad. Basic I2C
and UART communication to the sensors and RF expansion connectors are also available when the
Sensor Hub is connected to either the C2000 or MSP430 LaunchPad.
Table 2 describes the BoosterPack XL interface connections and the respective uses on the Sensor Hub
BoosterPack. It also shows which pins remain available for additional expansion at the user's discretion.
Table 2. BoosterPack XL Interface Connections (1)
Pin
Function
Pin
J1.1
3.3 V IN
J1.2
Function
Pin
Function
J2.1
Ground
J3.1
J4.1
J2.2
Interrupt
J3.2
J4.2
Interrupt
J3.3
J4.3
RF GPIO
J4.4
UART RTS
UART RX
J2.3
J1.4
UART TX
J2.4
J3.4
J2.5
J3.5
USER LED
J4.5
UART CTS
J1.6
Interrupt
J1.7
2.1.2
Pin
J1.3
J1.5
(1)
Function
J2.6
Sensor I2C
J3.6
User Button
J4.6
RF Shutdown
J2.7
Sensor I2C
J3.7
User Button
J4.7
RF Reset
RF GPIO
J1.8
SSI TX
J2.8
SSI RX
J3.8
RF GPIO
J4.8
J1.9
RF I2C
J2.9
SSI SS
J3.9
RF GPIO
J4.9
J1.10
RF I2C
J2.10
SSI CLK
J3.10
J4.10
Shaded cells indicate unused pins that are available for additional expansion.
TMP006 Temperature Sensor
The TMP006 provides both direct and indirect temperature measurements. It contains an on-chip
temperature sensor to directly measure ambient temperature conditions. It also allows contactless infrared
object temperature measurement.
2.1.3
InvenSense MPU9150 9-Axis Motion Sensor
The MPU9150 is a 3-axis accelerometer, 3-axis gyroscope, and 3-axis magnetometer in a single package.
This device is the primary motion sensor on the Sensor Hub. It is used by the demonstration software as
the raw motion inputs, which are fused by a direct cosine matrix into roll, pitch, and yaw measurements.
2.1.4
Intersil ISL29023 Ambient and Infrared Light Sensor
The ISL29023 provides sensor measurements of light conditions across both the ambient (human-visible)
spectrum and the infrared spectrum.
2.1.5
Sensirion SHT21 Humidity Sensor
The SHT21 provides relative humidity measurements.
2.1.6
Bosch BMP180 Barometric Pressure Sensor
The BMP180 measures barometric pressure conditions. It can be used to enhance the motion sensor by
determining relative changes in altitude.
2.1.7
Low-Power RF Expansion Connection
The RF expansion connection provides a wide array of options to the end application.
4
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2.1.8
TPS75118 Voltage Regulator
The TPS75118 regulates the 3.3-V supply from the LaunchPad down to 1.8 V for the input to the RF
expansion connector.
3
Software Development
This section provides general information on software development as well as instructions for Flash
memory programming. Note: This information presumes that the Sensor Hub BoosterPack is connected to
a Tiva TM4C1233 LaunchPad.
3.1
Software Description
The TivaWare software provided with the Tiva C Series LaunchPad includes functional drivers for all of
the peripheral devices supplied in the design. The TivaWare for C Series Peripheral Driver Library is used
to configure and operate the on-chip peripherals as part of TivaWare.
The TivaWare package includes a set of example applications that use the TivaWare Peripheral Driver
Library. These applications demonstrate the capabilities of the TM4C1233H6 microcontroller, as well as
provide a starting point for the user to develop the final application for use on the Tiva C Series
LaunchPad evaluation board and the BOOSTXL-SENSHUB BoosterPack.
3.2
Source Code
The complete source code, including the source code installation instructions, are available at
www.ti.com/tool/boostxl-senshub. The source code and binary files are installed in the TivaWare for C
Series Peripheral Driver Library tree.
3.3
Tool Options
The source code installation includes directories that contain projects and/or makefiles for the following
tool chains:
• Keil™ ARM RealView® Microcontroller Development System
• IAR Embedded Workbench for ARM
• Sourcery CodeBench
• Texas Instruments' Code Composer Studio™ IDE
Download evaluation versions of these tools from www.ti.com/tiva-c. As a result of code size restrictions,
the evaluation tools may not build all example programs. A full license is necessary to rebuild or debug all
examples.
Instructions on installing and using each of the evaluation tools can be found in the Quickstart guides (for
example, Quickstart-Keil, Quickstart-IAR), which are available for download from the Evaluation Kit section
of our website at www.ti.com/tiva-c.
For detailed information on using each tool, see the documentation included with the respective tool chain
installation or visit the website of the respective tool supplier.
3.4
Programming the Tiva TM4C LaunchPad Evaluation Board
The Tiva TM4C LaunchPad software package includes pre-built binaries for each of the example
applications. If you installed TivaWare for C Series to the default installation path of
C:\ti\TivaWare_C_Series_<version>, you can find these example applications in
C:\ti\TivaWare_C_Series_<version>/examples\boards\ek-tm4c123gxl. The onboard ICDI is used with the
LM Flash Programmer tool to program applications on the Tiva C Series LaunchPad.
Follow these steps to program example applications into the Tiva C Series LaunchPad evaluation board
using the ICDI:
1. Install the LM Flash Programmer on a PC running Microsoft® Windows® XP, Windows 7, or later
Windows OS.
2. Switch the POWER SELECT switch to the right to use Debug mode.
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3. Connect the USB-A cable plug to an available port on the PC and the Micro-B plug to the Debug USB
port on the board.
4. Verify that the POWER LED D4 on the board is lit.
5. Run the LM Flash Programmer program.
6. In the Configuration tab, use the Quick Set control to select the Tiva C Series LaunchPad evaluation
board.
7. Move to the Program tab and click the Browse button. Navigate to the example applications directory
(the default location is C:\ti\TivaWare_C_Series_<version>/examples\boards\ek-tm4c123gxl-senshub\).
8. Each example application has its own directory. Navigate to the example directory that you want to
load, then navigate to the directory that contains the binary (*.bin) files. Select the desired binary file
and click Open.
9. Set the Erase Method to Erase Necessary Pages. Check the Verify After Program box, and check
the Reset MCU After Program option.
10. Click the Program button to start the Erase, Download, and Verify process. Program execution starts
once the Verify process is complete.
4
References, PCB Layout, and Bill of Materials
Complete schematics for the Sensor Hub BoosterPack are appended to this user's guide.
4.1
References
In
•
•
•
•
•
addition to this document, the following references are available for download at www.ti.com:
BOOSTXL-SENSHUB BoosterPack Getting Started Guide (literature number SPMU295)
Tiva C Series TM4C123GH6PM Microcontroller Data Sheet (literature number SPMS376).
TivaWare for C Series Driver Library. Available for download at www.ti.com/tool/sw-tm4c-drl.
TivaWare for C Series Driver Library User’s Manual (literature number SPMU298).
TPS75118 Fast Transient Response, 1.5-A, Low-Dropout Regulator Data Sheet (literature number
SLVS241)
• TMP006 Infrared Thermopile Sensor Data Sheet (literature number SBOS518)
• Texas Instruments’ Code Composer Studio IDE website: www.ti.com/ccs
Additional support:
• RealView MDK (www.keil.com/arm/rvmdkkit.asp)
• IAR Embedded Workbench (www.iar.com)
• Sourcery CodeBench development tools (www.codesourcery.com/gnu_toolchains/arm)
• InvenSense MPU9150 (www.invensense.com/mems/gyro/mpu9150.html)
• Intersil ISL29023 (www.intersil.com/en/products/optoelectronics/ambient-light-sensors/light-to-digitalsensors/ISL29023.html)
• Bosch BMP180 (www.boschsensortec.com/homepage/products_3/environmental_sensors_1/bmp180_1/bmp180)
• Sensirion SHT21 (www.sensirion.com/en/products/humidity-temperature/humidity-sensor-sht21)
6
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4.2
Bill of Materials (BOM)
Table 3 shows the bill of materials for the BOOSTXL-SENSHUB BoosterPack board.
Table 3. BOOSTXL-SENSHUB Bill of Materials (1) (2) (3)
Item
(2)
(3)
(4)
Qty
Value
Description
Manufacturer
Manufacturer Part No
IC, digital, barometric pressure
sensor
Bosch
BMP180
1
U2
1
BMP180
2
C1-2, C8-9, C11,
C13, C15-16
8
100 nF
Capacitor, ceramic, NPO or C0G or
X5R, 10 V or higher, 0805 (4)
Murata
GRM21BR71E104KA01L
3
C4, C6
2
100 nF
Capacitor, ceramic, X7R, ±10%,
10 V or higher, 0805 (4)
Murata
GRM21BR71E104KA01L
4
C5
1
10 nF
Capacitor, ceramic, X7R, ±10%,
10 V or higher, 0805 (4)
Murata
GRM216R71H103KA01D
5
C3
1
2.2 nF
Capacitor, ceramic, X7R, ±10%,
50 V or higher, 0805 (4)
Kemet
C0805C222K5RACTU
6
C7, C10, C12,
C14
4
1 μF
Capacitor, tantalum, 10 V or higher,
Type A
AVX Corp.
TAJA105M020RNJ
7
C17
1
47 μF
Capacitor, tantalum, 10 V or higher,
Type A
Nichicon
F931A476MAA
—
Y1
0
32.768 kHz
8
D1
1
Red
9
D2
1
Yellow
Clock oscillator, 2.5 x 3.2 mm
Do not populate
Do not populate
Light emitting diode, 1.7 V forward
voltage or less, 0805
Stanley
BR1112H-TR
Light emitting diode, 0805
Knightbright
APT2012YC
Sullins
PPTC101LFBN-RC
10
J1-4
4
PEC10SAAN
Header, female, 10-pin, 100-mil
spacing, 0.100 inch x 10
11
RF_PART1-2
2
TFM-110-02SM-D-A-K-TR
Header, SMT 10x2 pin, shrouded,
0.225 x 0.625 inch
Samtec
TFM-110-02-SM-D-A-K-TR
12
U4
1
ISL29023
IC, integrated digital light sensor with
interrupt
Intersil
ISL29023
13
U3
1
MPU-9150
IC, nine-axis MEMS motion tracking
device
InvenSense
MPU-9150
14
R1, R4, R9-10
4
10 kΩ
Surface mount resistor, 1/10 W or
higher, 0805
Yageo
RC0805JR-0710KL
—
R2
0
10 kΩ
Surface mount resistor, 1/10 W or
higher, 0805
15
R6
1
5.1 Ω
Surface mount resistor, 1/10 W or
higher, 0805
Yageo
RC0805JR-075R1L
16
R7
1
100 Ω
Surface mount resistor, 1/10 W or
higher, 0805
Yageo
RC0805JR-07100RL
17
R5, R8
2
0Ω
Surface mount resistor, 1/10 W or
higher, 0805
Yageo
RC0805JR-070RL
18
R3
1
499 kΩ
Surface mount resistor, 1/10 W or
higher, 0805
Yageo
RC0805FR-07499KL
19
R11-12
2
3.3 kΩ
Surface mount resistor, 1/10 W or
higher, 0805
Yageo
RC0805JR-073K3L
20
U5
1
SHT21
IC, humidity and temperature sensor
Sensirion AG
SHT21
Bourns
7914G
Do not populate
Do not populate
21
S1-2
2
7914G
Switch, 1P1T, PB momentary,
100 mA, SM, 0.19 x 0.18 inch
22
U1
1
TMP006AIYZFT
IC, infrared thermopile sensor
Texas Instruments
TMP006YZF
1
TPS75118Q
PWP
IC, low dropout voltage regulator,
1.8 V, 1.5 A
Texas Instruments
TPS75118QPWP
23
(1)
Ref Des
U6
These assemblies are ESD sensitive. ESD precautions shall be observed.
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
These assemblies must comply with workmanship standards IPC-A-610 Class 2.
A dielectric with a higher thermal range and/or lower capacitance variation is also permitted (for example, X7R, X9R).
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A
B
C
D
Temperature Sensor
U1
TMP006
B1
3.3V
C1
ANALOG_GND
A2
Pressure Sensor
DGND
SDA
ADR1
SCL
ADR0
V+
AGND
DRDY
C3
3.3V
B3
I2C_SCL
A3
9-Axis Motion Sensor
ANALOG_PWR
1
C1
U3
MPU-9150
C2
I2C_SDA
R1
10k
INT_TEMP
1
U2
BMP180
I2C_SDA
100nF
2
3
CSB
SDA
VDD
6
I2C_SDA
5
I2C_SCL
SCK
VDDIO
GND
A1
I2C_SCL
1
SDO
4
7
3.3V
C2
100nF
RESV 19
CPOUT 20
RESV 21
1 CLKIN
GND 18
2 NC
GND 17
3 VDD
NC 16
4 NC
GND 15
5 NC
NC 14
INT
C6
100nF
I2C_SDA
2 GND
SCL 5
I2C_SCL
3 R-EXT
C8
100nF
R3
499k
7
INT 4
3.3V
SDA 6
INT_LT
Humidity & Temp. Sensor
INT_MOTION
C7
1uF
+
1 VDD
GND
3.3V
3
(Do Not
Populate)
U5
SHT21
I2C_SDA
1 SDA
SCL 6
I2C_SCL
2 VSS
VDD 5
3.3V
3 NC
R4
10k
VSS
Light Sensor
C4
100nF
R2
10k
C5
10nF
3
3.3V
12
RESV-G
11
REGOUT
10
9 AD0
8 VLOGIC
VDD 13
7 RESV
6 RESV
U4
ISL29023
2
3.3V
3.3V
RESV 22
2
SCL 23
SDA
24
C3
2.2nF
NC 4
C9
100nF
7
3.3V
Texas Instruments
4
Title
Size
Number
Rev
1
B
Date
Engineer Aneesh Rai
A
B
C
Filename
4
Sensor Hub Booster Pack
2/20/2013
Sensor_Hub_Booster_Pack Rev A.sch
D
A
Drawn by
1
Sheet
2/20/2013
AR
of
2
A
B
C
D
RF Headers
LaunchPad Headers
RF_PART1
1
U1RTS
RF_PART2
1
2
3
4
1.8V
1
2
3
4
32.768_CLK
5
6
5
6
U1TX
7
8
7
8
U1RX
9
10
9
10
3.3V
RF_GPIO0
RF_I2C_SDA
11
12
RF_GPIO1
RF_I2C_SCL
13
14
SSI0FSS
15
16
SSI0CLK
17
18
SSI0TX
19
20
SSI0RX
RF_GPIO2
RF_RST
RF_SHUTDN
11
12
13
14
J1
3.3V
16
17
18
U1CTS
19
20
RF_GPIO3
Power Indicator LED
1
1
2
2
INT_MOTION
U1RX
3
3
INT_TEMP
U1TX
4
4
5
5
6
6
I2C_SDA
7
7
I2C_SCL
8
8
SSI0RX
RF_I2C_SCL
9
9
SSI0FSS
RF_I2C_SDA
10
10
SSI0CLK
INT_LT
15
SSI0TX
General Purpose LED
J3
LED_GPIO
2
1.8V
3.3V
J2
1
J4
2
1
1
2
2
3
3
RF_GPIO0
4
4
U1RTS
LED_GPIO
5
5
U1CTS
PUSH_BUT_GPIO0
6
6
RF_SHUTDN
PUSH_BUT_GPIO1
7
7
RF_RST
RF_GPIO1
8
8
RF_GPIO3
RF_GPIO2
9
9
10
10
ANALOG_PWR
C12
C13
100nF
1uF
R6
5.1
ANALOG_GND
3
PG_1.8V
R8
0
Regulator
3.3V
+
C14
1uF
1.8V
NC 19
3 IN
NC 18
4 IN
GND 17
C17
EN
NC 16
6 PG
NC 15
7 FB/SEN
NC 14
8 OUTPUT
NC 13
9 OUTPUT
NC 12
10 GND/HTSK
47uF
GND/HTSK 11
S1
Oscillator
Y1
1
3
R9
10k
32.768_CLK
R10
10k
S2
PUSH_BUT_GPIO0
R11
3.3k
CRYSTAL_ECS-327KE
4
General Purpose
Push Buttons
I2C_SDA
3.3V
PUSH_BUT_GPIO1
C15
100nF
C16
100nF
I2C_SCL
R12
3.3k
2
PWRPAD
4
21
4
+
2 NC
5
PG_1.8V
GND/HTSK 20
3.3V
1 GND/HTSK
3
3.3V
U6
TPS75118
R7
100
3.3V
R5
0
D2
C11
100nF
1uF
+
D1
C10
+
Size
Number
B
Engineer
A
B
C
Aneesh Rai
Filename
Rev
Texas Instruments
A
1
Date
2/20/2013
Sensor_Hub_Booster_Pack Rev A.sch
Drawn by
Sheet
D
2
of
2
EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS
Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims
arising from the handling or use of the goods.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from
the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO
BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF
MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH
ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL
DAMAGES.
Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This
notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety
programs, please visit www.ti.com/esh or contact TI.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and
therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,
software performance, or infringement of patents or services described herein.
REGULATORY COMPLIANCE INFORMATION
As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal
Communications Commission (FCC) and Industry Canada (IC) rules.
For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,
DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer
use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency
interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will
be required to take whatever measures may be required to correct this interference.
General Statement for EVMs including a radio
User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and
power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local
laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this
radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and
unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory
authorities, which is responsibility of user including its acceptable authorization.
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant
Caution
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause
harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the
equipment.
FCC Interference Statement for Class A EVM devices
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
For EVMs annotated as IC – INDUSTRY CANADA Compliant
This Class A or B digital apparatus complies with Canadian ICES-003.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment.
Concerning EVMs including radio transmitters
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this
device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Concerning EVMs including detachable antennas
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain
approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should
be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum
permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain
greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.
Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de
l'utilisateur pour actionner l'équipement.
Concernant les EVMs avec appareils radio
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain
maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à
l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel
d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans
cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
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【Important Notice for Users of this Product in Japan】
】
This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan
If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:
1.
2.
3.
Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and
Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of
Japan,
Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this
product, or
Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with
respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note
that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan.
Texas Instruments Japan Limited
(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan
http://www.tij.co.jp
【ご使用にあたっての注】
本開発キットは技術基準適合証明を受けておりません。
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
http://www.tij.co.jp
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EVALUATION BOARD/KIT/MODULE (EVM)
WARNINGS, RESTRICTIONS AND DISCLAIMERS
For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished
electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in
laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks
associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end
product.
Your Sole Responsibility and Risk. You acknowledge, represent and agree that:
1.
2.
3.
4.
You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug
Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees,
affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes.
You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable
regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates,
contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical)
between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to
minimize the risk of electrical shock hazard.
You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even
if the EVM should fail to perform as described or expected.
You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials.
Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the
user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and
environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact
a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the
specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or
interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the
load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures
greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include
but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the
EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please
be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable
in electronic measurement and diagnostics normally found in development environments should use these EVMs.
Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives
harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in
connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims
arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected.
Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such
as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices
which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate
Assurance and Indemnity Agreement.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
IMPORTANT NOTICE
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
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