MURD320, NRVUD320, SURD8320 Switch-mode Power Rectifier DPAK Surface Mount Package These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. Features • • • • • Ultrafast 35 Nanosecond Recovery Time Low Forward Voltage Drop Low Leakage NRVUD, SURD8 Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant* • Case: Epoxy, Molded • Weight: 0.4 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds ESD Ratings: ♦ Machine Model = C (> 400 V) ♦ Human Body Model = 3B (> 8 kV) MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 200 V Average Rectified Forward Current (Rated VR, TC = 158°C) IF(AV) Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 158°C) IFRM Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, 60 Hz) IFSM Operating Junction and Storage Temperature Range A 3.0 A 6.0 A 75 TJ, Tstg °C −65 to +175 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2015 September, 2016 − Rev. 10 ULTRAFAST RECTIFIER 3.0 AMPERES, 200 VOLTS DPAK CASE 369C 1 Mechanical Characteristics • www.onsemi.com 1 1 4 4 3 3 STYLE 8 STYLE 3 MARKING DIAGRAM AYWW U 320G AYWW U 320W1G MURD320T4G SURD8320T4G NRVUD320VT4G A Y WW G NRVUD320W1T4G = Assembly Location = Year = Work Week = Pb−Free Package ORDERING INFORMATION Package Shipping† MURD320T4G DPAK (Pb−Free) 2500 / Tape & Reel NRVUD320VT4G DPAK (Pb−Free) 2500 / Tape & Reel NRVUD320W1T4G DPAK (Pb−Free) 2500 / Tape & Reel SURD8320T4G DPAK (Pb−Free) 2500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: MURD320/D MURD320, NRVUD320, SURD8320 THERMAL CHARACTERISTICS Characteristics Symbol Value Unit Thermal Resistance − Junction−to−Case RqJC 6 °C/W Thermal Resistance − Junction−to−Ambient (Note 1) RqJA 80 °C/W Symbol Value Unit 1. Rating applies when surface mounted on the minimum pad sizes recommended. ELECTRICAL CHARACTERISTICS Characteristics Maximum Instantaneous Forward Voltage Drop (Note 2) (iF = 3 Amps, TJ = 25°C) (iF = 3 Amps, TJ = 125°C) vF Maximum Instantaneous Reverse Current (Note 2) (TJ = 25°C, Rated dc Voltage) (TJ = 125°C, Rated dc Voltage) iR Maximum Reverse Recovery Time (IF = 1 Amp, di/dt = 50 Amps/ms, VR = 30 V, TJ = 25°C) (IF = 0.5 Amp, iR = 1 Amp, IREC = 0.25 A, VR = 30 V, TJ = 25°C) trr Volts 0.95 0.75 mA 5 500 ns 35 25 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. 100 IR, REVERSE CURRENT (m A) 70 50 20 10 TJ = 175°C 150°C 100°C 0.08 0.04 0.02 0.008 0.004 0.002 7.0 25°C 0 40 20 5.0 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (VOLTS) Figure 2. Typical Reverse Current* 3.0 175°C * The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these curves if VR is sufficiently below rated VR. TJ = 25°C 2.0 150°C 100°C PF(AV) , AVERAGE POWER DISSIPATION (WATTS) i , INSTANTANEOUS FORWARD CURRENT (AMPS) F 30 80 40 20 8.0 4.0 2.0 0.8 0.4 0.2 1.0 0.7 0.5 0.3 0.2 0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 vF, INSTANTANEOUS VOLTAGE (VOLTS) 14 13 12 11 10 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 SINE WAVE SQUARE WAVE 5.0 dc 10 IPK/IAV = 20 TJ = 175°C 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 1. Typical Forward Voltage Figure 3. Average Power Dissipation www.onsemi.com 2 9.0 10 MURD320, NRVUD320, SURD8320 IF(AV) , AVERAGE FORWARD CURRENT (AMPS) 8.0 RATED VOLTAGE APPLIED RqJC = 6°C/W 7.0 6.0 5.0 SINE WAVE OR SQUARE WAVE 4.0 3.0 dc 2.0 TJ = 175°C 1.0 0 100 110 120 130 140 150 160 170 180 TC, CASE TEMPERATURE (°C) IF(AV) , AVERAGE FORWARD CURRENT (AMPS) Figure 4. Current Derating, Case 4.0 RATED VOLTAGE APPLIED RqJA = 80°C/W 3.5 3.0 SURFACE MOUNTED ON MIN. PAD SIZE RECOMMENDED 2.5 2.0 dc TJ = 175°C 1.5 SINE WAVE OR SQUARE WAVE 1.0 0.5 0 0 20 40 60 80 100 120 140 160 180 200 TA, AMBIENT TEMPERATURE (°C) Figure 5. Current Derating, Ambient 1000 C, CAPACITANCE (pF) 500 300 200 TJ = 25°C 100 50 30 20 10 0 10 20 30 40 50 60 70 80 VR, REVERSE VOLTAGE (VOLTS) Figure 6. Typical Capacitance www.onsemi.com 3 90 100 MURD320, NRVUD320, SURD8320 PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. 7. OPTIONAL MOLD FEATURE. A E C A b3 B c2 4 L3 Z D 1 2 H DETAIL A 3 L4 NOTE 7 b2 e c SIDE VIEW b TOP VIEW 0.005 (0.13) M C Z H L2 GAUGE PLANE C L L1 DETAIL A DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z BOTTOM VIEW Z SEATING PLANE BOTTOM VIEW A1 ALTERNATE CONSTRUCTIONS ROTATED 905 CW STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.102 5.80 0.228 3.00 0.118 1.60 0.063 INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.028 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.114 REF 0.020 BSC 0.035 0.050 −−− 0.040 0.155 −−− MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.72 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.90 REF 0.51 BSC 0.89 1.27 −−− 1.01 3.93 −−− STYLE 8: PIN 1. N/C 2. CATHODE 3. ANODE 4. CATHODE 6.17 0.243 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] ◊ N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 4 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MURD320/D