HCPL-261A, HCPL-061A, HCPL-263A, HCPL-063A HCPL-261N, HCPL-061N, HCPL-263N, HCPL-063N HCMOS Compatible, High CMR, 10 MBd Optocouplers Data Sheet Lead (Pb) Free RoHS 6 fully compliant RoHS 6 fully compliant options available; -xxxE denotes a lead-free product Description Features The HCPL-261A family of optically coupled gates shown on this data sheet provide all the benefits of the industry standard 6N137 family with the added benefit of HCMOS compatible input current. This allows direct interface to all common circuit topologies without additional LED buffer or drive components. The AlGaAs LED used allows lower drive currents and reduces degradation by using the latest LED technology. On the single channel parts, an enable output allows the detector to be strobed. The output of the detector IC is an open collector schottky-clamped transistor. The internal shield provides a minimum common mode transient immunity of 1000 V/µs for the HCPL-261A family and 15000 V/µs for the HCPL-261N family. • HCMOS/LSTTL/TTL performance compatible Functional Diagram HCPL-261A/261N HCPL-061A/061N • Available in 8 pin DIP, SOIC-8 packages • Safety approval: – UL recognized per UL1577 3750 V rms for 1 minute and 5000 V rms for 1 minute (Option 020) – CSA Approved – IEC/EN/DIN EN 60747-5-2 approved 1 8 VCC • Low input current (3.0 mA) HCMOS compatible version of 6N137 optocoupler VE CATHODE 1 2 7 VO1 • Isolated line receiver 6 VO CATHODE 2 3 6 VO2 • Simplex/multiplex data transmission 5 GND ANODE 2 4 5 GND • Computer-peripheral interface 8 VCC ANODE 2 7 CATHODE 3 NC 4 TRUTH TABLE (POSITIVE LOGIC) ENABLE H H L L NC NC • AC and DC performance specified over industrial temperature range -40°C to +85°C ANODE 1 1 LED ON OFF ON OFF ON OFF • High speed: 10 MBd typical Applications HCPL-263A/263N HCPL-063A/063N NC SHIELD • 1000 V/µs minimum Common Mode Rejection (CMR) at VCM = 50 V (HCPL-261A family) and 15 kV/µs minimum CMR at VCM = 1000 V (HCPL-261N family) OUTPUT L H H H L H SHIELD TRUTH TABLE (POSITIVE LOGIC) LED ON OFF OUTPUT L H • Digital isolation for A/D, D/A conversion • Switching power supplies • Instrumentation input/output isolation • Ground loop elimination • Pulse transformer replacement The connection of a 0.1 µF bypass capacitor between pins 5 and 8 is required. HCPL-261A Functional Diagram CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. Selection Guide Input Minimum CMR 8-Pin DIP (300 Mil) Small-Outline SO-8 (400 Mil) Widebody Hermetic dV/dt VCM (V/µs) (V) Single Channel Package NA NA On- Current Output (mA) Enable 5 5,000 50 10,000 1,000 Single Channel Package YES Dual Channel Package 6N137[1] NO YES NO NO 1,000 50 YES HCPL-2602[1] 3,500 300 YES HCPL-2612[1] 1,000 50 YES HCPL-261A 3 1,000 [2] 1,000 NO YES NO HCNW2601[1] HCNW2611[1] HCPL-0661[1] HCPL-061A HCPL-263A HCPL-261N HCNW137[1] HCPL-0631[1] HCPL-0611[1] HCPL-4661[1] Single and Dual Channel Packages HCPL-0630[1] HCPL-0601[1] HCPL-2631[1] HCPL-2611[1] Dual Channel Package HCPL-0600[1] HCPL-2630[1] HCPL-2601[1] YES Single Channel Package HCPL-063A HCPL-061N HCPL-263N HCPL-063N 1,000 50 12.5 [3] HCPL-193X[1] HCPL-56XX[1] HCPL-66XX[1] Notes: 1. Technical data are on separate Avago publications. 2. 15 kV/µs with VCM = 1 kV can be achieved using Avago application circuit. 3. Enable is available for single channel products only, except for HCPL-193X devices. Schematic IF HCPL-261A/261N HCPL-061A/061N HCPL-263A/263N HCPL-063A/063N ICC 8 2+ IO 6 VF VCC VO 1 ICC 8 IF1 IO1 + 7 VF1 VCC VO1 – 2 – 3 SHIELD IE 7 VE USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED BETWEEN PINS 5 AND 8 IS RECOMMENDED (SEE NOTE 16). 5 SHIELD GND 3 IF2 IO2 – 6 VF2 VO2 + 4 SHIELD HCPL-261A Schematic a HCPL-261A Schematic b 5 GND Ordering Information HCPL-xxxx is UL Recognized with 3750 Vrms for 1 minute per UL1577. Part number HCPL-261A HCPL-261N HCPL-263A HCPL-263N HCPL-061A HCPL-061N HCPL-063A HCPL-063N Option RoHS Non RoHS Compliant Compliant -000E -300E -500E -020E -320E -520E -060E -560E -000E -300E -500E -020E -320E -520E -060E -360E -560E -000E -300E -500E -020E -320E -520E -000E -300E -500E -020E -320E -520E -000E -500E -060E -560E -000E -500E No option #300 #500 #020 -320 -520 #060 #560 No option #300 #500 #020 #320 -520 #060 #360 No option #300 #500 #020 #320 -520 No option #300 #500 #020 #320 #520 No option #500 #060 #560 No option #500 Package 300mil DIP-8 300mil DIP-8 300mil DIP-8 300mil DIP-8 SO-8 SO-8 Surface Mount Gull Wing Tape & Reel X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X UL 5000 Vrms/1 Minute rating IEC/EN/DIN EN 60747-5-2 Quantity X X X X X X X X X X X X X X X X X X X X X X X X X 50 per tube 50 per tube 1000 per reel 50 per tube 50 per tube 1000 per reel 50 per tube 1000 per reel 50 per tube 50 per tube 1000 per reel 50 per tube 50 per tube 1000 per reel 50 per tube 50 per tube 1000 per reel 50 per tube 50 per tube 1000 per reel 50 per tube 50 per tube 1000 per reel 50 per tube 50 per tube 1000 per reel 50 per tube 50 per tube 1000 per reel 100 per tube 1500 per reel 100 per tube 1500 per reel 100 per tube 1500 per reel To order, choose a part number from the part number column and combine with the desired option from the option column to form an order entry. Combination of Option 020 and Option 060 is not available. Example 1: HCPL-261A-560E to order product of 300mil DIP Gull Wing Surface Mount package in Tape and Reel packaging with IEC/EN/DIN EN 60747-5-2 Safety Approval in RoHS compliant. Example 2: HCPL-263N to order product of 300mil DIP package in tube packaging and non RoHS compliant. Option datasheets are available. Contact your Avago sales representative or authorized distributor for information. Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15th July 2001 and RoHS compliant option will use ‘-XXXE‘. HCPL-261A/261N/263A/263N Outline Drawing Pin Location (for reference only) 9.40 (0.370) 9.90 (0.390) TYPE NUMBER 8 7 6 5 OPTION CODE* A XXXXZ DATE CODE YYWW PIN ONE 1 2 3 0.20 (0.008) 0.33 (0.013) 6.10 (0.240) 6.60 (0.260) 7.36 (0.290) 7.88 (0.310) 5 TYP. 4 1.78 (0.070) MAX. 1.19 (0.047) MAX. DIMENSIONS IN MILLIMETERS AND (INCHES). 3.56 ± 0.13 (0.140 ± 0.005) 4.70 (0.185) MAX. 0.51 (0.020) MIN. 2.92 (0.115) MIN. 0.76 (0.030) 1.40 (0.056) * MARKING CODE LETTER FOR OPTION NUMBERS. "L" = OPTION 020 "V" = OPTION 060 OPTION NUMBERS 300 AND 500 NOT MARKED. NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. 0.65 (0.025) MAX. 2.28 (0.090) 2.80 (0.110) Figure 1. 8-Pin dual in-line package device outline drawing. LAND PATTERN RECOMMENDATION 9.65 ± 0.25 (0.380 ± 0.010) 8 7 6 1.02 (0.040) 5 6.350 ± 0.25 (0.250 ± 0.010) 1 2 3 10.9 (0.430) 4 1.27 (0.050) 9.65 ± 0.25 (0.380 ± 0.010) 1.780 (0.070) MAX. 1.19 (0.047) MAX. 7.62 ± 0.25 (0.300 ± 0.010) 0.20 (0.008) 0.33 (0.013) 3.56 ± 0.13 (0.140 ± 0.005) 1.080 ± 0.320 (0.043 ± 0.013) 2.540 (0.100) BSC 0.635 ± 0.130 (0.025 ± 0.005) 0.635 ± 0.25 (0.025 ± 0.010) DIMENSIONS IN MILLIMETERS (INCHES). TOLERANCES (UNLESS OTHERWISE SPECIFIED): xx.xx = 0.01 xx.xxx = 0.005 LEAD COPLANARITY MAXIMUM: 0.102 (0.004) NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. Figure 2. Gull wing surface mount option #300. 2.0 (0.080) 12 NOM. HCPL-061A/061N/063A/063N Outline Drawing LAND PATTERN RECOMMENDATION 8 7 6 5 5.994 ± 0.203 (0.236 ± 0.008) XXX YWW 3.937 ± 0.127 (0.155 ± 0.005) TYPE NUMBER (LAST 3 DIGITS) 7.49 (0.295) DATE CODE 1 2 3 4 1.9 (0.075) 0.406 ± 0.076 (0.016 ± 0.003) 1.270 BSC (0.050) 0.64 (0.025) 7 * 5.080 ± 0.127 (0.200 ± 0.005) 3.175 ± 0.127 (0.125 ± 0.005) 0.432 (0.017) 45 X 0.228 ± 0.025 (0.009 ± 0.001) 1.524 (0.060) 0.203 ± 0.102 (0.008 ± 0.004) 0.305 MIN. (0.012) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) 5.207 ± 0.254 (0.205 ± 0.010) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX. Figure 3. 8-Pin Small Outline Package Device Drawing. Solder Reflow Thermal Profile TEMPERATURE (°C) 300 PREHEATING RATE 3°C + 1°C/–0.5°C/SEC. REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. 200 PEAK TEMP. 245°C PEAK TEMP. 240°C 2.5 C ± 0.5°C/SEC. 30 SEC. 160°C 150°C 140°C PEAK TEMP. 230°C UL Recognized under UL 1577, Component Recognition Program, File E55361. SOLDERING TIME 200°C 30 SEC. 3°C + 1°C/–0.5°C 100 Regulatory Information The HCPL-261A and HCPL-261N families have been approved by the following organizations: PREHEATING TIME 150°C, 90 + 30 SEC. 50 SEC. TIGHT TYPICAL LOOSE ROOM TEMPERATURE 0 0 50 100 150 200 250 CSA Approved under CSA Component Acceptance Notice #5, File CA 88324. TIME (SECONDS) Note: Non-halide flux should be used. Recommended Pb-Free IR Profile tp TEMPERATURE Tp TL Tsmax 260 +0/-5 °C TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE 20-40 SEC. 217 °C RAMP-UP 3 C/SEC. MAX. 150 - 200 °C RAMP-DOWN 6 °C/SEC. MAX. Tsmin ts PREHEAT 60 to 180 SEC. 25 tL 60 to 150 SEC. t 25 °C to PEAK TIME NOTES: THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200 °C, Tsmin = 150 °C Note: Non-halide flux should be used. IEC/EN/DIN EN 60747-5-2 Approved under: IEC 60747-5-2:1997 + A1:2002 EN 60747-5-2:2001 + A1:2002 DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01. (Option 060 only) Insulation and Safety Related Specifications Parameter Symbol 8-Pin DIP (300 Mil) Value SO-8 Value Units Conditions Minimum External Air L(101) 7.1 4.9 mm Gap (External Clearance) Measured from input terminals to output terminals, shortest distance through air. Minimum External L(102) 7.4 4.8 mm Tracking (External Creepage) Measured from input terminals to output terminals, shortest distance path along body. Minimum Internal Plastic 0.08 0.08 mm Gap (Internal Clearance) Tracking Resistance (Comparative Tracking Index) CTI 200 200 Through insulation distance, conductor to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Volts Isolation Group IIIa IIIa DIN IEC 112/ VDE 0303 Part 1 Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 – surface mount classification is Class A in accordance with CECC 00802. IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Description Symbol PDIP Option 060 SO-8 Option 60 Units Installation classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage ≤ 150 V rms for rated mains voltage ≤ 300 V rms I-IV for rated mains voltage ≤ 600 V rms I-III I-IV I-III I-II Climatic Classification 55/85/21 55/85/21 Pollution Degree (DIN VDE 0110/1.89) 2 2 Maximum Working Insulation Voltage VIORM 630 566 Vpeak Input to Output Test Voltage, Method b* VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec, Partial Discharge < 5 pC VPR 1181 1063 Vpeak Input to Output Test Voltage, Method a* VIORM x 1.5 = VPR, Type and Sample Test, tm = 60 sec, Partial Discharge < 5 pC VPR 945 849 Vpeak VIOTM 6000 4000 Vpeak Safety Limiting Values (See below for Thermal Derating Curve Figures) Case Temperature Input Current Output Power TS IS,INPUT PS,OUTPUT 175 230 600 150 150 600 ˚C mA mW Insulation Resistance at TS, VIO = 500 V RS ≥ 109 ≥ 109 Ω Highest Allowable Overvoltage* (Transient Overvoltage, tini = 10 sec) *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section IEC/EN/DIN EN 60747-5-2, for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application. Absolute Maximum Ratings Parameter Symbol Storage Temperature TS -55 125 °C Operating Temperature TA -40 +85 °C Max. Units Note Average Input Current IF(AVG) 10 mA Reverse Input Voltage VR 3 Volts Supply Voltage VCC -0.5 7 Volts Enable Input Voltage VE -0.5 5.5 Volts Output Collector Current (Each Channel) IO 50 mA Output Power Dissipation (Each Channel) PO 60 mW VO 7 Volts Output Voltage (Each channel) Lead Solder Temperature (Through Hole Parts Only) Solder Reflow Temperature Profile (Surface Mount Parts Only) Recommended Operating Conditions Parameter Min. Symbol -0.5 1 2 3 260°C for 10 s, 1.6 mm Below Seating Plane See Package Outline Drawings section Min. Max. Units Input Voltage, Low Level VFL -3 0.8 V Input Current, High Level IFH 3.0 10 mA Power Supply Voltage VCC 4.5 5.5 Volts High Level Enable Voltage VEH 2.0 VCC Volts Low Level Enable Voltage VEL 0 0.8 Volts Fan Out (at RL = 1 kΩ) N 5 TTL Loads Output Pull-up Resistor RL 330 4k Ω Operating Temperature TA -40 85 °C Electrical Specifications Over recommended operating temperature (TA = - 40°C to +85°C) unless otherwise specified. Parameter Symbol Min. Typ.* Max. Units Test Conditions High Level Output Current IOH 3.1 100 µA Low Level Output VOL 0.4 0.6 V Voltage High Level Supply ICCH 7 10 mA Current 9 15 8 13 mA VCC = 5.5 V, IOL = 13 mA (sinking), IF = 3.0 mA, VE = 2.0 V VE = 0.5 V** Dual Channel Products*** Low Level Supply Current ICCL High Level Enable Current** IEH -0.6 -1.6 mA VCC = 5.5 V, VE = 2.0 V Low Level Enable Current** IEL -0.9 -1.6 mA VCC = 5.5 V, VE = 0.5 V Input Forward Voltage VF 1.3 1.6 V 12 21 Temperature Coefficient of Forward Voltage 1.0 ∆VF /∆TA -1.25 VE = 0.5 V** Dual Channel Products*** IF = 4 mA mV/°C IF = 4 mA Input Reverse Breakdown Voltage BVR 3 5 V IR = 100 µA Input Capacitance CIN 60 pF f = 1 MHz, VF = 0 V *All typical values at TA = 25°C, VCC = 5 V **Single Channel Products only (HCPL-261A/261N/061A/061N) ***Dual Channel Products only (HCPL-263A/263N/063A/063N) VCC = 5.5 V, VO = 5.5 V, VF = 0.8 V, VE = 2.0 V Fig. Note 4 18 5, 8 4, 18 VCC = 5.5 V IF = 0 mA 4 VCC = 5.5 V IF = 3.0 mA 6 4 4 4 Switching Specifications Over recommended operating temperature (TA = -40°C to +85°C) unless otherwise specified. Parameter Symbol Min. Typ.* Max. Units Test Conditions Fig. Note 7, 10 18 Propagation Delay tPLH 52 100 ns Time to High Output Level IF = 3.5 mA VCC = 5.0 V, VE = Open, nsCL = 15 pF, RL = 350 Ω 9, 11, 12 4, 9, 18 Propagation Delay tPHL 53 100 Time to Low Output Level 9, 11, 12 4, 10, 18 45 ns 9, 13 17, 18 60 ns 24 11, 18 Input Current Threshold ITHL 1.5 3.0 mA High to Low Pulse Width Distortion PWD |tPHL - tPLH| 11 VCC = 5.5 V, VO = 0.6 V, IO >13 mA (Sinking) Propagation Delay Skew tPSK Output Rise Time tR 42 ns 9, 14 4, 18 Output Fall Time tF 12 ns 9, 14 4, 18 15, 16 12 15, 16 12 Propagation Delay tEHL 19 ns Time of Enable from VEH to VEL IF = 3.5 mA VCC = 5.0 V, VEL = 0 V, VEH = 3 V, CL = 15 pF, Propagation Delay tELH 30 ns Time of EnableRL = 350 Ω from VEL to VEH *All typical values at TA = 25°C, VCC = 5 V. Common Mode Transient Immunity Specifications, All values at TA = 25°C Parameter Device Symbol Min. Typ. Max. Units Output High Level Common Mode Transient Immunity Test Conditions HCPL-261A |CMH| 1 5 kV/µs VCM = 50 V HCPL-061A HCPL-263A HCPL-063A 4, 13, 15, 18 HCPL-263N 15 25 kV/µs HCPL-063N Using Avago 20 App Circuit 4, 13, 15 HCPL-261A |CML| 1 5 kV/µs VCM = 50 V HCPL-061A HCPL-263A HCPL-063A VCC = 5.0 V, 17 RL = 350 Ω, IF = 3.5 mA, VO(MAX) = 0.8 V TA = 25°C 4, 14, 15, 18 Using Avago 20 App Circuit 4, 14, 15 HCPL-261N HCPL-061N HCPL-263N 15 25 kV/µs HCPL-063N 5 kV/µs VCM = 1000 V VCC = 5.0 V, 17 RL = 350 Ω, IF = 0 mA, TA = 25°C VO(MIN) = 2 V HCPL-261N HCPL-061N 1 5 Note Output Low Level Common Mode Transient Immunity 1 Fig. kV/µs VCM = 1000 V Package Characteristics All Typicals at TA = 25°C Parameter Sym. Package* Min. Typ. Max. Units Test Conditions Fig. Note Input-Output VISO 3750 V rms Momentary With- OPT 020† 5000 stand Voltage** RH ≤ 50%, t = 1 min., TA = 25°C 5, 7 Input-Output Resistance Ω VI-O = 500 Vdc 4, 8 Input-Output CI-O 0.6 pF Capacitance f = 1 MHz, TA = 25°C 4, 8 Input-Input II-I Dual Channel 0.005 µA Insulation Leakage Current RH ≤ 45%, t = 5 s, VI-I = 500 V 19 Resistance (Input-Input) RI-O 10 12 5, 6 RI-I Dual Channel 1011 Ω 19 Capacitance CI-I (Input-Input) Dual 8-pin DIP 0.03 pF 19 Dual SO-8 f = 1 MHz 0.25 *Ratings apply to all devices except otherwise noted in the Package column. **The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table (if applicable), your equipment level safety specification or Avago Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.” †For 8-pin DIP package devices (HCPL-261A/261N/263A/263N) only. Notes: 1. Peaking circuits may be used which produce transient input currents up to 30 mA, 50 ns maximum pulse width, provided the average current does not exceed 10 mA. 2. 1 minute maximum. 3. Derate linearly above 80°C free-air temperature at a rate of 2.7 mW/°C for the SOIC-8 package. 4. Each channel. 5. Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together. 6. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 4500 VRMS for 1 second (leakage detection current limit, II-O ≤ 5 µA). This test is performed before the 100% production test for partial discharge (method b) shown in the IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table, if applicable. 7. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 6000 VRMS for 1 second (leakage detection current limit, II-O ≤ 5 µA). 8. Measured between the LED anode and cathode shorted together and pins 5 through 8 shorted together. 9. The tPLH propagation delay is measured from the 1.75 mA point on the falling edge of the input pulse to the 1.5 V point on the rising edge of the output pulse. 10. The tPHL propagation delay is measured from the 1.75 mA point on the rising edge of the input pulse to the 1.5 V point on the falling edge of the output pulse. 11. Propagation delay skew (tPSK) is equal to the worst case difference in tPLH and/or tPHL that will be seen between any two units under the same test conditions and operating temperature. 12. Single channel products only (HCPL-261A/261N/061A/061N). 13. Common mode transient immunity in a Logic High level is the maximum tolerable |dVCM/dt| of the common mode pulse, VCM, to assure that the output will remain in a Logic High state (i.e., Vo > 2.0 V). 14. Common mode transient immunity in a Logic Low level is the maximum tolerable |dVCM/dt| of the common mode pulse, VCM, to assure that the output will remain in a Logic Low state (i.e., VO < 0.8 V). 15. For sinusoidal voltages (|dVCM /dt|)max = πfCM VCM(P-P). 16. Bypassing of the power supply line is required with a 0.1 µF ceramic disc capacitor adjacent to each optocoupler as shown in Figure 19. Total lead length between both ends of the capacitor and the isolator pins should not exceed 10 mm. 17. Pulse Width Distortion (PWD) is defined as the difference between tPLH and tPHL for any given device. 18. No external pull up is required for a high logic state on the enable input of a single channel product. If the VE pin is not used, tying VE to VCC will result in improved CMR performance. 19. Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together. For dual channel parts only. 10 VCC = 5.5 V VO = 5.5 V VE = 2 V VF = 0.8 V 10 5 0 -60 -40 -20 0 20 40 60 80 100 TA – TEMPERATURE – C VOL – LOW LEVEL OUTPUT VOLTAGE – V VO – OUTPUT VOLTAGE – V RL = 350 Ω RL = 1 kΩ RL = 4 kW 1.0 0 0.5 1.0 1.5 40 20 0 -60 -40 -20 2.0 80 100 TA = 40 C TA = 25 C 0.1 0.01 1.0 1.1 1.2 IF + VF – 1.3 1.4 1.5 VF – FORWARD VOLTAGE – V Figure 6. Typical diode input forward current characteristic. HCPL-261A fig 6 VCC = 5.5 V VE = 2 V IF = 3.0 mA 0.5 IO = 16 mA IO = 12.8 mA 0.4 0.3 IO = 9.6 mA IO = 6.4 mA 0.2 -60 -40 -20 0 20 40 HCPL-261A/261N 60 80 100 +5 V 1 VCC 8 2 7 3 6 4 5 0.1 µF BYPASS RL *CL RM 60 TA = 85 C 1.0 Figure 8. Typical low level output voltage vs. temperature. HCPL-261A fig 8 HCPL-261A fig 7 INPUT MONITORING NODE 40 10.0 TA – TEMPERATURE – C Figure 7. Typical output voltage vs. forward input current. IF 20 0.6 IF – FORWARD INPUT CURRENT – mA PULSE GEN. Z O = 50 Ω t f = t r = 5 ns 0 HCPL-261A fig 5 2.0 0 60 Figure 5. Low level output current vs. temperature. 5.0 3.0 VCC = 5 V VE = 2 V VOL = 0.6 V IF = 3.5 mA TA – TEMPERATURE – C Figure 4. Typical high level output current vs. temperature. HCPL-261A fig 4 4.0 100.0 80 IF – INPUT FORWARD CURRENT – mA IOL – LOW LEVEL OUTPUT CURRENT – mA IOH – HIGH LEVEL OUTPUT CURRENT – µA 15 GND OUTPUT VO MONITORING NODE *CL IS APPROXIMATELY 15 pF WHICH INCLUDES PROBE AND STRAY WIRING CAPACITANCE. I F = 3.5 mA INPUT IF 90% I F = 1.75 mA t PHL 1.5 V trise tfall Figure 9. Test circuit for tPHL and tPLH. 11 HCPL-261A fig 9 VOH 10% 10% t PLH OUTPUT VO 90% HCPL-261A fig 9b (new) VOL 1.0 0.5 RL = 350 Ω RL = 1 kΩ RL = 4 kΩ VCC = 5 V VO = 0.6 V 0 -60 -40 -20 0 20 40 60 80 100 20 30 20 RL = 1 kΩ RL = 350 Ω 0 -60 -40 -20 0 20 40 60 80 100 TA – TEMPERATURE – C Figure 13. Typical pulse width distortion vs. temperature. HCPL-261A fig 13 TPLH RL = 350 kΩ 0 VCC = 5 V IF = 3.5 mA 20 40 60 80 100 HCPL-261A fig 11 tr, tf – RISE, FALL TIME – ns VCC = 5 V IF = 3.5 mA 40 TPHL RL = 350 Ω, 1 kΩ, 4 kΩ 40 160 RL = 4 kΩ 50 TPLH RL = 1 kΩ Figure 11. Typical propagation delay vs. temperature. 60 PWD – ns 60 TA – TEMPERATURE – C Figure 10. Typical input threshold current vs. temperature. HCPL-261A fig 10 12 80 0 -60 -40 -20 TA – TEMPERATURE – C 10 100 120 TPLH RL = 4 kΩ 140 VCC = 5 V IF = 3.5 mA trise tfall RL = 4 kΩ 120 60 RL = 1 kΩ 40 RL = 350 Ω 20 0 -60 -40 -20 RL = 350 Ω, 1 kΩ, 4 kΩ 0 20 40 60 80 100 TA – TEMPERATURE – C Figure 14. Typical rise and fall time vs. temperature. HCPL-261A fig 14 tp – PROPAGATION DELAY – ns 1.5 120 tp – PROPAGATION DELAY – ns ITH – INPUT THRESHOLD CURRENT – mA 2.0 100 TPLH RL = 4 kΩ 80 TPLH RL = 1 kΩ 60 TPLH RL = 350 Ω TPHL RL = 350 Ω, 1 kΩ, 4 kΩ 40 20 0 VCC = 5 V TA = 25 C 0 2 4 6 8 10 12 IF – PULSE INPUT CURRENT – mA Figure 12. Typical propagation delay vs. pulse input current. HCPL-261A fig 12 PULSE GEN. Z O = 50 Ω t f = t r = 5 ns INPUT VE MONITORING NODE HCPL-261A/261N VCC 8 2 7 3 6 0.1 µF BYPASS RL OUTPUT VO MONITORING NODE *C L 4 5 GND *CL IS APPROXIMATELY 15 pF WHICH INCLUDES PROBE AND STRAY WIRING CAPACITANCE. 3.0 V INPUT VE 1.5 V t EHL t ELH OUTPUT VO 1.5 V tE – ENABLE PROPAGATION DELAY – ns 3.5 mA IF +5 V 1 120 90 VCC = 5 V VEH = 3 V VEL = 0 V IF = 3.5 mA tELH, RL = 4 kΩ 60 tELH, RL = 1 kΩ 30 tELH, RL = 350 Ω tEHL, RL = 350 Ω, 1k Ω, 4 kΩ 0 -60 -40 -20 0 20 40 60 80 100 TA – TEMPERATURE – C Figure 15. Test circuit for tEHL and tELH. Figure 16. Typical enable propagation delay vs. temperature. HCPL-261A/-261N/-061A/-061N Only. HCPL-261A fig 16 HCPL-261A fig 15 HCPL-261A/261N IF A B VFF VCC 8 2 7 3 6 VCM VO + 350 Ω OUTPUT VO MONITORING NODE _ VCM (PEAK) 0V 5V SWITCH AT A: IF = 0 mA SWITCH AT B: IF = 3.5 mA VO 0.1 µF BYPASS GND 5 4 PULSE GEN. Z O = 50 Ω +5 V CM H VO (min.) VO (max.) 0.5 V CM L OUTPUT POWER – PS, INPUT CURRENT – IS V CM 1 800 HCPL-261A/261N OPTION 060 ONLY PS (mW) 700 IS (mA) 600 500 400 300 200 100 0 0 25 50 75 100 125 150 175 200 TS – CASE TEMPERATURE – C Figure 17. Test circuit for common mode transient immunity and typical waveforms. HCPL-261A Fig 17 13 Figure 18. Thermal derating curve, dependence of safety limiting value with case temperature per IEC/EN/DIN EN 60747-5-2. HCPL-261A fig 18 Application Information SINGLE CHANNEL PRODUCTS GND BUS (BACK) Common-Mode Rejection for HCPL261A/HCPL-261N Families: VCC BUS (FRONT) Figure 20 shows the recommended drive circuit for the HCPL-261N/261A for optimal common-mode rejection performance. Two main points to note are: N.C. ENABLE (IF USED) 0.1µF OUTPUT 1 N.C. 1. The enable pin is tied to VCC rather than floating (this applies to single-channel parts only). N.C. ENABLE (IF USED) 0.1µF N.C. 2. Two LED-current setting resistors are used instead of one. This is to balance ILED variation during common-mode transients. OUTPUT 2 If the enable pin is left floating, it is possible for common-mode transients to couple to the enable pin, resulting in common-mode failure. This failure mechanism only occurs when the LED is on and the output is in the Low State. It is identified as occurring when the transient output voltage rises above 0.8 V. Therefore, the enable pin should be connected to either VCC or logic-level high for best common-mode performance with the output low (CMRL). This failure mechanism is only present in single-channel parts (HCPL-261N, -261A, ‑061N, -061A) which have the enable function. 10 mm MAX. (SEE NOTE 16) DUAL CHANNEL PRODUCTS GND BUS (BACK) VCC BUS (FRONT) OUTPUT 1 0.1µF OUTPUT 2 10 mm MAX. (SEE NOTE 16) Figure 19. Recommended printed circuit board layout. * VCC 357 Ω (MAX.) 357 Ω (MAX.) 74LS04 OR ANY TOTEM-POLE OUTPUT LOGIC GATE HCPL-261A/261N 1 8 2 7 3 6 VO 5 GND 4 * SHIELD GND1 VCC+ 0.01 µF 350 Ω GND2 * HIGHER CMR MAY BE OBTAINABLE BY CONNECTING PINS 1, 4 TO INPUT GROUND (GND1). *Higher CMR may be obtainable by connecting pins 1, 4 to input ground (Gnd1). Figure 20. Recommended drive circuit for HCPL-261A/-261N families for high-CMR (similar for HCPL263A/-263N). HCPL-261A fig 19 14 Also, common-mode transients can capacitively couple from the LED anode (or cathode) to the output-side ground causing current to be shunted away from the LED (which can be bad if the LED is on) or conversely cause current to be injected into the LED (bad if the LED is meant to be off ). Figure 21 shows the parasitic capacitances which exists between LED anode/cathode and output ground (CLA and CLC). Also shown in Figure 21 on the input side is an ACequivalent circuit. CMR with Other Drive Circuits Table 1 indicates the directions of ILP and ILN flow depending on the direction of the common-mode transient. CMR performance with drive circuits other than that shown in Figure 20 may be enhanced by following these guidelines: For transients occurring when the LED is on, commonmode rejection (CMRL, since the output is in the “low” state) depends upon the amount of LED current drive (IF). For conditions where IF is close to the switching threshold (ITH), CMRL also depends on the extent which ILP and ILN balance each other. In other words, any condition where common-mode transients cause a momentary decrease in IF (i.e. when dVCM /dt>0 and |IFP| > |IFN|, referring to Table 1) will cause common-mode failure for transients which are fast enough. 1. Use of drive circuits where current is shunted from the LED in the LED “off” state (as shown in Figures 22 and 23). This is beneficial for good CMRH. 2. Use of IFH > 3.5 mA. This is good for high CMRL. Using any one of the drive circuits in Figures 22-24 with IF = 10 mA will result in a typical CMR of 8 kV/µs for the HCPL-261N family, as long as the PC board layout practices are followed. Figure 22 shows a circuit which can be used with any totem-pole-output TTL/LSTTL/HCMOS logic gate. The buffer PNP transistor allows the circuit to be used with logic devices which have low current-sinking capability. It also helps maintain the driving-gate power-supply current at a constant level to minimize ground shifting for other devices connected to the input-supply ground. Likewise for common-mode transients which occur when the LED is off (i.e. CMRH, since the output is “high”), if an imbalance between ILP and ILN results in a transient IF equal to or greater than the switching threshold of the optocoupler, the transient “signal” may cause the output to spike below 2 V (which constitutes a CMRH failure). By using the recommended circuit in Figure 20, good CMR can be achieved. (In the case of the -261N families, a minimum CMR of 15 kV/µs is guaranteed using this circuit.) The balanced ILED-setting resistors help equalize ILP and ILN to reduce the amount by which ILED is modulated from transient coupling through CLA and CLC. When using an open-collector TTL or open-drain CMOS logic gate, the circuit in Figure 23 may be used. When using a CMOS gate to drive the optocoupler, the circuit shown in Figure 24 may be used. The diode in parallel with the RLED speeds the turn-off of the optocoupler LED. VCC 1 1/2 RLED 1/2 RLED 8 2 7 VCC+ 0.01 µF 350 Ω ILP 3 4 CLA ILN 5 SHIELD + VCM 6 VO 15 pF CLC HCPL-261X 420 Ω (MAX) 74L504 (ANY TTL/CMOS GATE) 2N3906 (ANY PNP) 2 LED 3 GND 4 – Figure 21. AC equivalent circuit for HCPL-261X. Figure 22. TTL interface circuit for the HCPL-261A/-261N families. HCPL-�261A fig 20 HCPL-�261A fig 21 15 1 VCC VCC HCPL-261X 820 Ω 1 HCPL-261A/261N 1N4148 2 74HC00 (OR ANY OPEN-COLLECTOR/ OPEN-DRAIN LOGIC GATE) LED 3 74HC04 (OR ANY TOTEM-POLE OUTPUT LOGIC GATE) 750 Ω HCPL-�261A fig 22 LED 4 Figure 24. CMOS gate drive circuit for HCPL-261A/-261N families. Table 1. Effects of Common Mode Pulse Direction on Transient ILED If dVCM/dt Is: then ILP Flows: and ILN Flows: positive (>0) away from LED away from LED anode through CLA cathode through CLC negative (<0) toward LED toward LED anode through CLA cathode through CLC Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew Propagation delay is a figure of merit which describes how quickly a logic signal propagates through a system. The propagation delay from low to high (tPLH) is the amount of time required for an input signal to propagate to the output, causing the output to change from low to high. Similarly, the propagation delay from high to low (tPHL) is the amount of time required for the input signal to propagate to the output, causing the output to change from high to low (see Figure 9). Pulse-width distortion (PWD) results when tPLH and tPHL differ in value. PWD is defined as the difference between tPLH and tPHL and often determines the maximum data rate capability of a transmission system. PWD can be expressed in percent by dividing the PWD (in ns) by the minimum pulse width (in ns) being transmitted. Typically, PWD on the order of 20-30% of the minimum pulse width is tolerable; the exact figure depends on the particular application (RS232, RS422, T-1, etc.). Propagation delay skew, tPSK, is an important parameter to consider in parallel data applications where synchro- 2 3 4 Figure 23. TTL open-collector/open drain gate drive circuit for HCPL-261A/-261N families. 1 HCPL-�261A fig 23 If |ILP| < |ILN|, LED IF Current Is Momentarily: increased decreased If |ILP| > |ILN|, LED IF Current Is Momentarily: decreased increased nization of signals on parallel data lines is a concern. If the parallel data is being sent through a group of opto couplers, differences in propagation delays will cause the data to arrive at the outputs of the optocouplers at different times. If this difference in propagation delay is large enough it will determine the maximum rate at which parallel data can be sent through the optocouplers. Propagation delay skew is defined as the difference between the minimum and maximum propagation delays, either tPLH or tPHL, for any given group of optocouplers which are operating under the same conditions (i.e., the same drive current, supply voltage, output load, and operating temperature). As illustrated in Figure 25, if the inputs of a group of optocouplers are switched either ON or OFF at the same time, tPSK is the difference between the shortest propagation delay, either tPLH or tPHL, and the longest propagation delay, either tPLH or tPHL. As mentioned earlier, tPSK can determine the maximum parallel data transmission rate. Figure 26 is the timing diagram of a typical parallel data application with both the clock and the data lines being sent through optocouplers. The figure shows data and clock signals at the inputs and outputs of the optocouplers. To obtain the maximum data transmission rate, both edges of the clock signal are being used to clock the data; if only one edge were used, the clock signal would need to be twice as fast. Propagation delay skew represents the uncertainty of where an edge might be after being sent through an optocoupler. Figure 26 shows that there will be uncertainty in both the data and the clock lines. It is important that these two areas of uncertainty not overlap, otherwise the clock signal might arrive before all of the data outputs have settled, or some of the data outputs may start IF to change before the clock signal has arrived. From these considerations, the absolute minimum pulse width that can be sent through optocouplers in a parallel application is twice tPSK. A cautious design should use a slightly longer pulse width to ensure that any additional uncertainty in the rest of the circuit does not cause a problem. The tPSK specified optocouplers offer the advantages of guaranteed specifications for propagation delays, pulsewidth distortion, and propagation delay skew over the recommended temperature, input current, and power supply ranges. 50% 1.5 V VO TPHL IF 50% VO TPLH 1.5 V t PSK Figure 25. Illustration of propagation delay skew – tPSK. DATA INPUTS HCPL-261A fig 24 CLOCK DATA OUTPUTS t PSK CLOCK t PSK Figure 26. Parallel data transmission example. HCPL-2602 fig 17 For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0561EN AV02-0391 - December 6, 2007