ON NL27WZ07DTT1G Dual buffer with open drain output Datasheet

NL27WZ07
Dual Buffer with Open Drain
Outputs
The NL27WZ07 is a high performance dual buffer with open drain
outputs operating from a 1.65 to 5.5 V supply.
The internal circuit is composed of multiple stages, including an open
drain output which provides the capability to set output switching level.
This allows the NL27WZ07 to be used to interface 5 V circuits to circuits
of any voltage between VCC and 7.0 V using an external resistor and
power supply.
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MARKING
DIAGRAMS
Features
•
•
•
•
•
•
•
•
•
SC−88
DF SUFFIX
CASE 419B
Extremely High Speed: tPD 2.3 ns (typical) at VCC = 5.0 V
Designed for 1.65 V to 5.5 V VCC Operation, CMOS compatible
Over Voltage Tolerant Inputs
LVTTL Compatible − Interface Capability with 5.0 V TTL Logic
with VCC = 3.0 V
LVCMOS Compatible
24 mA Output Sink Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Chip Complexity: FET = 72; Equivalent Gate = 18
Pb−Free Packages are Available
M7d
Pin 1
d = Date Code
TSOP−6
DT SUFFIX
CASE 318G
M7d
Pin 1
d = Date Code
PIN ASSIGNMENT
IN A1
GND
IN A2
1
6
2
5
4
3
OUT Y1
VCC
1
IN A1
2
GND
3
IN A2
4
OUT Y2
5
VCC
6
OUT Y1
OUT Y2
FUNCTION TABLE
A Input
Figure 1. Pinout (Top View)
IN A1
1
OUT Y1
IN A2
1
OUT Y2
Y Output
L
H
L
Z
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Figure 2. Logic Symbol
 Semiconductor Components Industries, LLC, 2004
April, 2004 − Rev. 7
1
Publication Order Number:
NL27WZ07/D
NL27WZ07
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
0.5 to 7.0
V
0.5 ≤ VI ≤ 7.0
V
0.5 ≤ VO ≤ 7.0
V
VI < GND
50
mA
VO < GND
50
mA
DC Output Sink Current
50
mA
DC Supply Current per Supply Pin
100
mA
IGND
DC Ground Current per Ground Pin
100
mA
TSTG
Storage Temperature Range
65 to 150
°C
PD
Power Dissipation in Still Air
SC−88, TSOP−6
200
mW
JA
Thermal Resistance
SC−88, TSOP−6
333
°C/W
TL
Lead Temperature, 1 mm from case for 10 s
260
°C
TJ
Junction Temperature under Bias
150
°C
ILatch−Up
Latch−Up Performance
500
mA
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ESD Classification
VCC
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
ICC
Output in Z or LOW State (Note 1)
Above VCC and Below GND at 85°C (Note 5)
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Human Body Model (Note 3)
Machine Model (Note 4)
Charged Device Model (Note 5)
> 2000
> 200
N/A
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B.
3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Supply Voltage
VI
Input Voltage
VO
Output Voltage
TA
Operating Free−Air Temperature
t/V
Input Transition Rise or Fall Rate
Operating
Data Retention Only
(Z or LOW State)
VCC = 2.5 V 0.2 V
VCC =3.0 V 0.3 V
VCC =5.0 V 0.5 V
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2
Min
Max
Unit
1.65
1.5
5.5
5.5
V
0
5.5
V
0
5.5
V
40
85
°C
0
0
0
20
10
5
ns/V
NL27WZ07
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Condition
40°C ≤TA ≤ 85°C
TA = 25°C
VCC
(V)
Min
0.75 VCC
0.75 VCC
Typ
Max
Min
Max
VIH
High−Level Input Voltage
1.65 to 1.95
2.3 to 5.5
VIL
Low−Level Input Voltage
1.65 to 1.95
2.3 to 5.5
0.3 VCC
0.3 VCC
0.3 VCC
0.3 VCC
V
ILKG
Z−State Output Leakage
Current
VIN = VIL
VOUT = VCC or GND
2.3 to 5.5
5.0
10.0
A
VOL
Low−Level Output Voltage
VIN = VIL
IOL = 100 A
1.65 to 5.5
0.0
0.1
0.1
V
IOL = 4 mA
1.65
0.08
0.24
0.24
IIN
Input Leakage Current
IOFF
Power Off−Output
Leakage Current
ICC
Quiescent Supply Current
0.75 VCC
0.75 VCC
Unit
V
IOL = 8 mA
2.3
0.20
0.3
0.3
IOL = 12 mA
2.7
0.22
0.4
0.4
IOL = 16 mA
3.0
0.28
0.4
0.4
IOL = 24 mA
3.0
0.38
0.55
0.55
IOL = 32 mA
4.5
0.42
0.55
0.55
VIN or VOUT = VCC or
GND
0 to 5.5
0.1
1.0
A
VOUT = 5.5 V
0
1
10
A
VIN = VCC or GND
5.5
1
10
A
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AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 40°C ≤TA ≤ 85°C
TA = 25°C
Symbol
tPZL
tPLZ
Condition
VCC (V)
Min
Typ
Max
Min
Max
Unit
RL = R1= 5000 CL = 15 pF
1.8 0.15
1.8
5.3
11.5
1.8
12.0
ns
RL = R1= 500 CL = 50 pF
2.5 0.2
1.2
3.7
5.8
1.2
6.4
3.3 0.3
0.8
2.9
4.4
0.8
4.8
5.0 0.5
0.5
2.3
3.5
0.5
3.9
RL = R1= 5000 CL = 15 pF
1.8 0.15
1.8
5.3
11.5
1.8
12.0
RL = R1= 500 CL = 50 pF
2.5 0.2
1.2
2.8
5.8
1.2
6.4
3.3 0.3
0.8
2.1
4.4
0.8
4.8
5.0 0.5
0.5
1.4
3.5
0.5
3.9
Parameter
Propagation Delay
(Figure 3 and 4)
Propagation Delay
(Figure 3 and 4)
ns
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
Typical
Unit
CIN
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
2.5
pF
COUT
Output Capacitance
VCC = 5.5 V, VI = 0 V or VCC
4.0
pF
CPD
Power Dissipation Capacitance (Note 6)
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
4.0
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin ICC VCC.
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3
NL27WZ07
VCC
A
50%
GND
tPZL
tPLZ
HIGH
IMPEDANCE
50% VCC
Y
VOL 0.3 V
Figure 3. Switching Waveforms
VCC
VCC 2
R1
PULSE
GENERATOR
DUT
RT
CL
RL
RT = ZOUT of pulse generator (typically 50 )
Figure 4. Test Circuit
ORDERING INFORMATION
Device Nomenclature
Logic
Circuit
Indicator
No. of
Gates
per
Package
Temp
Range
Identifier
NL27WZ07DFT2
NL
2
NL27WZ07DFT2G
NL
NL27WZ07DTT1
NL27WZ07DTT1G
Device
Technology
Device
Function
Package
Suffix
Tape &
Reel
Suffix
Package Type
(Name/SOT#/
Common Name)
Shipping†
7
WZ
07
DF
T2
SC−88 / SOT−363
/ SC−70
178 mm (7”)
3000 Unit
2
7
WZ
07
DF
T2
SC−88 / SOT−363
/ SC−70
(Pb−Free)
178 mm (7”)
3000 Unit
NL
2
7
WZ
07
DT
T1
TSOP−6 / SOT−23
/ SC−59
178 mm (7”)
3000 Unit
NL
2
7
WZ
07
DT
T1
TSOP−6 / SOT−23
/ SC−59
(Pb−Free)
178 mm (7”)
3000 Unit
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NL27WZ07
PACKAGE DIMENSIONS
SC−88 (SOT−363)
DF SUFFIX
CASE 419B−02
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
A
G
6
5
4
1
2
3
DIM
A
B
C
D
G
H
J
K
N
S
−B−
S
D 6 PL
0.2 (0.008)
M
B
INCHES
MIN
MAX
0.071 0.087
0.045 0.053
0.031 0.043
0.004 0.012
0.026 BSC
−−− 0.004
0.004 0.010
0.004 0.012
0.008 REF
0.079 0.087
M
N
J
C
H
K
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
−−−
0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
NL27WZ07
PACKAGE DIMENSIONS
TSOP−6
DT SUFFIX
CASE 318G−02
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
A
L
6
S
1
5
4
2
3
B
MILLIMETERS
DIM MIN
MAX
A
2.90
3.10
B
1.30
1.70
C
0.90
1.10
D
0.25
0.50
G
0.85
1.05
H 0.013 0.100
J
0.10
0.26
K
0.20
0.60
L
1.25
1.55
M
0_
10 _
S
2.50
3.00
D
G
M
J
C
0.05 (0.002)
K
H
INCHES
MIN
MAX
0.1142 0.1220
0.0512 0.0669
0.0354 0.0433
0.0098 0.0197
0.0335 0.0413
0.0005 0.0040
0.0040 0.0102
0.0079 0.0236
0.0493 0.0610
0_
10 _
0.0985 0.1181
SOLDERING FOOTPRINT*
2.4
0.094
1.9
0.075
0.95
0.037
0.95
0.037
0.7
0.028
1.0
0.039
SCALE 10:1
mm inches
Figure 5. TSOP−6
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NL27WZ07/D
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