ALSC AS7C31025A-12TI 5v/3.3v 128k x 8 cmos sram (revolutionary pinout) Datasheet

January 2001
Advance Information
AS7C1025A
AS7C31025A
®
5V/3.3V 128K X 8 CMOS SRAM (Revolutionary pinout)
•
•
•
•
•
•
Latest 6T 0.25u CMOS technology
2.0V data retention
Easy memory expansion with CE, OE inputs
Center power and ground
TTL/LVTTL-compatible, three-state I/O
JEDEC-standard packages
- 32-pin, 300 mil SOJ
- 32-pin, 400 mil SOJ
- 32-pin, TSOP II
• ESD protection ≥ 2000 volts
• Latch-up current ≥ 200 mA
Features
•
•
•
•
•
AS7C1025A (5V version)
AS7C31025A (3.3V version)
Industrial and commercial temperatures
Organization: 131,072 x 8 bits
High speed
- 10/10/12/15/20 ns address access time
- 3/3/4/5 ns output enable access time
• Low power consumption: ACTIVE
- 660 mW (AS7C1025A) / max @ 10 ns (5V)
- 324 mW (AS7C31025A) / max @ 10 ns (3.3V)
• Low power consumption: STANDBY
- 55 mW (AS7C1025A) / max CMOS (5V)
- 36 mW (AS7C31025A) / max CMOS (3.3V)
Pin arrangement
Logic block diagram
VCC
GND
I/O7
A0
A1
A2
A3
CE
I/O0
I/O1
VCC
GND
I/O2
I/O3
WE
A4
A5
A6
A7
I/O0
Control
circuit
WE
OE
CE
A9
A10
A11
A12
A13
A14
A15
A16
Column decoder
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A16
A15
A14
A13
OE
I/O7
I/O6
GND
VCC
I/O5
I/O4
A12
A11
A10
A9
A8
32-pin SOJ (300 mil)
32-pin SOJ (400 mil)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
AS7C1025A
AS7C31025A
512×256×8
Array
(1,048,576)
Sense amp
A0
A1
A2
A3
A4
A5
A6
A7
A8
Row decoder
Input buffer
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
AS7C1025A
AS7C31025A
32-pin TSOP II
A0
A1
A2
A3
CE
I/O0
I/O1
VCC
GND
I/O2
I/O3
WE
A4
A5
A6
A7
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A16
A15
A14
A13
OE
I/O7
I/O6
GND
VCC
I/O5
I/O4
A12
A11
A10
A9
A8
Selection guide
AS7C1025A-10
AS7C31025A-10
AS7C1025A-12
AS7C31025A-12
AS7C1025A-15
AS7C31025A-15
AS7C1025A-20
AS7C31025A-20
Unit
Maximum address access time
10
12
15
20
ns
Maximum output enable access
time
3
3
4
5
ns
AS7C1025A
120
110
100
100
mA
AS7C31025A
90
80
80
80
mA
AS7C1025A
10
10
10
15
mA
AS7C31025A
10
10
10
15
mA
Maximum
operating
current
Maximum
CMOS standby
current
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AS7C1025A
AS7C31025A
®
Functional description
The AS7C1025A and AS7C31025A are high-performance CMOS 1,048,576-bit Static Random Access Memory (SRAM) devices organized as
131,072 x 8 bits. They are designed for memory applications where fast data access, low power, and simple interfacing are desired.
Equal address access and cycle times (tAA, tRC, tWC) of 10/12/15/20 ns with output enable access times (tOE) of 3/3/4/5 ns are ideal for
high-performance applications. The chip enable input CE permits easy memory and expansion with multiple-bank memory systems.
When CE is high the devices enter standby mode. The standard AS7C1025A is guaranteed not to exceed 55 mW power consumption in
standby mode. Both devices also offer 2.0V data retention.
A write cycle is accomplished by asserting write enable (WE) and chip enable (CE). Data on the input pins I/O0-I/O7 is written on the rising
edge of WE (write cycle 1) or CE (write cycle 2). To avoid bus contention, external devices should drive I/O pins only after outputs have been
disabled with output enable (OE) or write enable (WE).
A read cycle is accomplished by asserting output enable (OE) and chip enable (CE), with write enable (WE) high. The chips drive I/O pins
with the data word referenced by the input address. When either chip enable or output enable is inactive, or write enable is active, output
drivers stay in high-impedance mode.
All chip inputs and outputs are TTL-compatible, and operation is from a single 5V supply (AS7C1025A) or 3.3V supply (AS7C31025A). The
AS7C1025A and AS7C31025A are packaged in common industry standard packages.
Absolute maximum ratings
Parameter
Device
Symbol
Min
Max
Unit
AS7C1025A
Vt1
–0.50
+7.0
V
AS7C31025A
Vt1
–0.50
+5.0
V
Voltage on any pin relative to GND
Vt2
–0.50
VCC + 0.5
V
Power dissipation
PD
–
1.0
Voltage on VCC relative to GND
Storage temperature (plastic)
Tstg
–65
W
+150
o
C
o
C
Ambient temperature with VCC applied
Tbias
–55
+125
DC current into outputs (low)
IOUT
–
20
mA
NOTE: Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
Truth table
CE
WE
OE
Data
Mode
H
X
X
High Z
Standby (ISB, ISB1)
L
H
H
High Z
Output disable (ICC)
L
H
L
DOUT
Read (ICC)
L
L
X
DIN
Write (ICC)
Key: X = Don’t Care, L = Low, H = High
2/6/01; V.0.9
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AS7C1025A
AS7C31025A
®
Recommended operating conditions
Parameter
Supply voltage
Input voltage
Device
Symbol
Min
Nominal
Max
Unit
AS7C1025A
VCC
4.5
5.0
5.5
V
AS7C31025A
VCC
3.0
3.3
3.6
V
AS7C1025A
VIH
2.2
–
VCC + 0.5
V
AS7C31025A
VIH
2.0
–
VCC + 0.5
V
Both
VIL†
–0.5
–
0.8
V
70
o
C
85
o
C
commercial
Ambient operating temperature
0
TA
industrial
–
–40
TA
–
†
VIL min. = –3.0V for pulse width less than tRC/2.
DC operating characteristics (over the operating range)1
-10
-12
-15
-20
Parameter
Sym
Test conditions
Device
Min
Max
Min
Max
Min
Input
leakage
current
| ILI |
VCC = Max, VIN = GND to VCC
Both
–
1
–
1
–
1
–
1
µA
Output
leakage
current
| ILO |
VCC = Max, CE = VIH, Vout = GND
to VCC
Both
–
1
–
1
–
1
–
1
µA
AS7C1025A
–
120
–
110
–
100
–
100
AS7C31025A
–
90
–
80
–
80
–
80
AS7C1025A
–
30
–
25
–
20
–
20
AS7C31025A
–
30
–
25
–
20
–
20
Operating
power
supply
current
Standby
power
supply
current1
Output
voltage
Data
retention
current
Max Min Max Unit
ICC
CE = VIL, f = fMax, IOUT = 0 mA
ISB
CE = VIH, f = fMax, fOUT = 0
ISB1
CE ≥ VCC–0.2V, VIN ≤ 0.2V or VIN
≥ VCC –0.2V, f = 0, fOUT = 0
AS7C1025A
–
10
–
10
–
10
–
15
AS7C31025A
–
10
–
10
–
10
–
15
VOL
IOL = 8 mA, VCC = Min
AS7C1025A
–
.04
–
0.4
–
0.4
–
0.4
V
VOH
IOH = –4 mA, VCC = Min
AS7C31025A
2.4
2.4
–
2.4
–
2.4
–
V
VCC = 2.0V
AS7C1025A
–
1
–
1
–
1
5
mA
AS7C31025A
–
1
–
1
–
1
5
mA
ICCDR
–
Capacitance (f = 1 MHz, Ta = 25 oC, VCC = NOMINAL)2
Symbol
Signals
Test conditions
Max
Unit
Input capacitance
CIN
A, CE, WE, OE
VIN = 0V
5
pF
I/O capacitance
CI/O
I/O
VIN = VOUT = 0V
7
pF
2/6/01; V.0.9
mA
mA
CE ≥ VCC – 0.2V
VIN ≥ VCC – 0.2V or
VIN ≤ 0.2V
Parameter
mA
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Read cycle (over the operating range)3,9
-10
Parameter
Symbol
-12
Min Max Min
-15
-20
Max Min Max
Min
Max
Unit
Notes
Read cycle time
tRC
10
–
12
–
15
–
20
–
ns
Address access time
tAA
–
10
–
12
–
15
–
20
ns
3
Chip enable (CE) access time
tACE
–
10
–
12
–
15
–
20
ns
3
Output enable (OE) access time
tOE
–
3
–
3
–
4
–
5
ns
Output hold from address change
tOH
2
–
3
–
3
–
3
–
ns
5
CE Low to output in low Z
tCLZ
0
–
0
–
0
–
0
–
ns
4, 5
CE Low to output in high Z
tCHZ
–
3
–
3
–
4
–
5
ns
4, 5
OE Low to output in low Z
tOLZ
0
–
0
–
0
–
0
–
ns
4, 5
OE High to output in high Z
tOHZ
–
3
–
3
–
4
–
5
ns
4, 5
Power up time
tPU
0
–
0
–
0
–
0
–
ns
4, 5
Power down time
tPD
–
10
–
12
–
15
–
20
ns
4, 5
Key to switching waveforms
Rising input
Falling input
Undefined/don’t care
Read waveform 1 (address controlled)3,6,7,9
tRC
Address
tAA
tOH
DOUT
Data valid
Read waveform 2 (CE and OE controlled)3,6,8,9
tRC1
CE
tOE
OE
tACE
DOUT
Data valid
tCLZ
Supply
current
2/6/01; V.0.9
tOHZ
tCHZ
tOLZ
tPU
tPD
50%
50%
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ISB
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AS7C31025A
®
Write cycle (over the operating range)11
-10
Parameter
Symbol
Min
Write cycle time
tWC
10
Chip enable (CE) to write end
tCW
Address setup to write end
-12
Max Min
-15
-20
Max
Min
Max
Min
Max
Unit
12
–
15
–
20
–
ns
8
10
–
12
–
12
–
ns
tAW
8
9
–
10
–
12
–
ns
Address setup time
tAS
0
0
–
0
–
0
–
ns
Write pulse width
tWP
7
8
–
9
–
12
–
ns
Address hold from end of write
tAH
0
0
–
0
–
0
–
ns
Data valid to write end
tDW
5
6
–
8
–
10
–
ns
Data hold time
tDH
0
0
–
0
–
0
–
ns
4, 5
Write enable to output in high Z
tWZ
–
6
–
6
–
8
ns
4, 5
Output active from write end
tOW
1
–
1
–
2
–
ns
4, 5
6
1
Notes
Write waveform 1 (WE controlled)10,11
tWC
tAW
tAH
Address
tWP
WE
tAS
tDW
DIN
tDH
Data valid
tWZ
tOW
DOUT
Write waveform 2 (CE controlled)10,11
tAW
tWC
tAH
Address
tAS
tCW
CE
tWP
WE
tWZ
DIN
tDW
tDH
Data valid
DOUT
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Data retention characteristics (over the operating range)
Parameter
Symbol
VCC for data retention
VDR
Data retention current
ICCDR
Chip enable to data retention time
tCDR
Operation recovery time
Test conditions
VCC = 2.0V
CE ≥ VCC – 0.2V
VIN ≥ VCC – 0.2V or
VIN ≤ 0.2V
tR
| ILI |
Input leakage current
Min
Max
Unit
2.0
–
V
–
500
µA
0
–
ns
tRC
–
ns
–
1
µA
Data retention waveform
Data retention mode
VCC
VDR ≥ 2.0V
VCC
VCC
tCDR
VDR
VIH
CE
tR
VIH
AC test conditions
–
–
–
–
Output load: see Figure B or Figure C.
Input pulse level: GND to 3.0V. See Figure A.
Input rise and fall times: 2 ns. See Figure A.
Input and output timing reference levels: 1.5V.
Thevenin equivalent:
168W
DOUT
+1.728V (5V and 3.3V)
+5V
+3.3V
480W
+3.0V
GND
90%
10%
90%
2 ns
Figure A: Input pulse
10%
DOUT
255W
C(14)
GND
Figure B: 5V Output load
320W
DOUT
255W
C(14)
GND
Figure C: 3.3V Output load
Notes
1
2
3
4
5
6
7
8
9
10
11
12
13
During VCC power-up, a pull-up resistor to VCC on CE is required to meet ISB specification.
This parameter is sampled, but not 100% tested.
For test conditions, see AC Test Conditions, Figures A, B, and C.
tCLZ and tCHZ are specified with CL = 5pF, as in Figure C. Transition is measured ±500mV from steady-state voltage.
This parameter is guaranteed, but not 100% tested.
WE is High for read cycle.
CE and OE are Low for read cycle.
Address valid prior to or coincident with CE transition Low.
All read cycle timings are referenced from the last valid address to the first transitioning address.
CE or WE must be High during address transitions. Either CE or WE asserting high terminates a write cycle.
All write cycle timings are referenced from the last valid address to the first transitioning address.
NA.
C=30pF, except all high Z and low Z parameters, where C=5pF.
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AS7C1025A
AS7C31025A
®
Package dimensions
32-pin TSOP II (mm)
32-pin TSOP II
N
Symbol
Min
Max
A
–
1.2
A1
0.05
0.15
b
0.3
0.52
C
0.12
0.21
D
20.82
21.08
E1
10.03
10.29
E
11.56
11.96
N/2+1
E
E1
1
N/2
D
e
Seating plane
A
1.27 BSC
L
ZD
0.40
ZD
0.95 REF.
α
c
0.60
0°
5°
A1
b
L
α
c
32-pin SOJ
300 mil
Symbol
Min
Max
Min
Max
A
-
0.145
-
0.145
A1
0.025
-
0.025
-
A2
0.086
0.105
0.086
0.115
B
0.026
0.032
0.026
0.032
b
0.014
0.020
0.015
0.020
c
0.006
0.013
0.007
0.013
D
0.820
0.830
0.820
0.830
E
0.250
0.275
0.360
0.380
E1
0.292
0.305
0.395
0.405
E2
0.330
0.340
0.435
0.445
32-pin SOJ
300 mil/400 mil
D
e
E1 E2
B
Pin 1
A
A1
c
b
A2
32-pin SOJ
400 mil
Seating
Plane
e
0.050 BSC
0.050 BSC
E
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AS7C1025A
AS7C31025A
®
Ordering codes
Package \
Access time
Voltage
5V
TSOP II
3.3V
5V
300-mil SOJ
3.3V
5V
400-mil SOJ
3.3V
Temperature
10 ns
12 ns
15 ns
20 ns
Commercial
AS7C1025A-10TC
AS7C1025A-12TC
AS7C1025A-15TC
AS7C1025A-20TC
Industrial
AS7C1025A-10TI
AS7C1025A-12TI
AS7C1025A-15TI
AS7C1025A-20TI
Commercial
AS7C31025A-10TC
AS7C31025A-12TC
AS7C31025A-15TC
AS7C31025A-20TC
Industrial
AS7C31025A-10TI
AS7C31025A-12TI
AS7C31025A-15TI
AS7C31025A-20TI
Commercial
AS7C1025A-10TJC
AS7C1025A-12TJC
AS7C1025A-15TJC
AS7C1025A-20TJC
Industrial
AS7C1025A-10TJI
AS7C1025A-12TJI
AS7C1025A-15TJI
AS7C1025A-20TJI
Commercial
AS7C31025A-10TJC
AS7C31025A-12TJC
AS7C31025A-15TJC
AS7C31025A-20TJC
Industrial
AS7C31025A-10TJI
AS7C31025A-12TJI
AS7C31025A-15TJI
AS7C31025A-20TJI
Commercial
AS7C1025A-10JC
AS7C1025A-12JC
AS7C1025A-15JC
AS7C1025A-20JC
Industrial
AS7C1025A-10JI
AS7C1025A-12JI
AS7C1025A-15JI
AS7C1025A-20JI
Commercial
AS7C31025A-10JC
AS7C31025A-12JC
AS7C31025A-15JC
AS7C31025A-20JC
Industrial
AS7C31025A-10JI
AS7C31025A-12JI
AS7C31025A-15JI
AS7C31025A-20JI
Part numbering system
AS7C
X
1025
–XX
X
X
SRAM
prefix
Blank=5V CMOS
3=3.3V CMOS
Device
number
Access
time
Package:
T = TSOP II
J = SOJ
Temperature range
C = Commercial, 0°C to 70°C
I = Industrial, -40°C to 85°C
2/6/01; V.0.9
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product names may be the trademarks of their respective companies. Alliance reserves the right to make changes to this document and its products at any time without notice. Alliance assumes no
responsibility for any errors that may appear in this document. The data contained herein represents Alliance’s best data and/or estimates at the time of issuance. Alliance reserves the right to
change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this
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