PHILIPS BU2525AF Silicon diffused power transistor Datasheet

Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU2525AF
GENERAL DESCRIPTION
New generation, high-voltage, high-speed switching npn transistor in a plastic full-pack envelope intended for use in
horizontal deflection circuits of large screen colour television receivers up to 32 kHz.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
VCESM
VCEO
IC
ICM
Ptot
VCEsat
ICsat
tf
Collector-emitter voltage peak value
Collector-emitter voltage (open base)
Collector current (DC)
Collector current peak value
Total power dissipation
Collector-emitter saturation voltage
Collector saturation current
Fall time
VBE = 0 V
PINNING - SOT199
PIN
TYP.
MAX.
UNIT
8.0
0.2
1500
800
12
30
45
5.0
0.35
V
V
A
A
W
V
A
µs
Ths ≤ 25 ˚C
IC = 8.0 A; IB = 1.6 A
ICsat = 8.0 A; IB(end) = 1.1 A
PIN CONFIGURATION
SYMBOL
DESCRIPTION
1
base
2
collector
3
emitter
case isolated
c
case
b
1
2
e
3
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL
PARAMETER
CONDITIONS
VCESM
VCEO
IC
ICM
IB
IBM
-IB(AV)
-IBM
Ptot
Tstg
Tj
Collector-emitter voltage peak value
Collector-emitter voltage (open base)
Collector current (DC)
Collector current peak value
Base current (DC)
Base current peak value
Reverse base current
Reverse base current peak value 1
Total power dissipation
Storage temperature
Junction temperature
VBE = 0 V
average over any 20 ms period
Ths ≤ 25 ˚C
MIN.
MAX.
UNIT
-65
-
1500
800
12
30
8
12
200
7
45
150
150
V
V
A
A
A
A
mA
A
W
˚C
˚C
TYP.
MAX.
UNIT
THERMAL RESISTANCES
SYMBOL
PARAMETER
CONDITIONS
Rth j-hs
Junction to heatsink
without heatsink compound
-
3.7
K/W
Rth j-hs
Junction to heatsink
with heatsink compound
-
2.8
K/W
Rth j-a
Junction to ambient
in free air
35
-
K/W
1 Turn-off current.
September 1997
1
Rev 1.400
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU2525AF
ISOLATION LIMITING VALUE & CHARACTERISTIC
Ths = 25 ˚C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
Visol
Repetitive peak voltage from all
three terminals to external
heatsink
R.H. ≤ 65 % ; clean and dustfree
Cisol
Capacitance from T2 to external f = 1 MHz
heatsink
MIN.
TYP.
-
MAX.
UNIT
2500
V
-
22
-
pF
MIN.
TYP.
MAX.
UNIT
-
-
1.0
2.0
mA
mA
7.5
800
13.5
-
1.0
-
mA
V
V
5
13
7
5.0
1.1
9.5
V
V
STATIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
2
ICES
ICES
Collector cut-off current
IEBO
BVEBO
VCEOsust
Emitter cut-off current
Emitter-base breakdown voltage
Collector-emitter sustaining voltage
VCEsat
VBEsat
hFE
hFE
Collector-emitter saturation voltage
Base-emitter saturation voltage
DC current gain
VBE = 0 V; VCE = VCESMmax
VBE = 0 V; VCE = VCESMmax;
Tj = 125 ˚C
VEB = 7.5 V; IC = 0 A
IB = 1 mA
IB = 0 A; IC = 100 mA;
L = 25 mH
IC = 8.0 A; IB = 1.6 A
IC = 8.0 A; IB = 1.6 A
IC = 100 mA; VCE = 5 V
IC = 8 A; VCE = 5 V
DYNAMIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
TYP.
MAX.
UNIT
Cc
Collector capacitance
IE = 0 A; VCB = 10 V; f = 1 MHz
145
-
pF
Switching times (32 kHz line
deflection circuit)
ICsat = 8.0 A; LC = 260 µH; Cfb = 13 nF;
IB(end) = 1.1 A; LB = 2.5 µH; -VBB = 4 V;
(-dIB/dt = 1.6 A/µs)
3.0
0.2
4.0
0.35
µs
µs
ts
tf
Turn-off storage time
Turn-off fall time
2 Measured with half sine-wave voltage (curve tracer).
September 1997
2
Rev 1.400
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU2525AF
ICsat
+ 50v
90 %
100-200R
IC
10 %
Horizontal
tf
Oscilloscope
t
ts
IB
IBend
Vertical
t
1R
100R
6V
30-60 Hz
- IBM
Fig.1. Test circuit for VCEOsust.
Fig.4. Switching times definitions.
IC / mA
+ 150 v nominal
adjust for ICsat
Lc
250
200
LB
IBend
100
0
VCE / V
T.U.T.
Cfb
-VBB
min
VCEOsust
Fig.2. Oscilloscope display for VCEOsust.
TRANSISTOR
IC
Fig.5. Switching times test circuit.
ICsat
100
hFE
BU2525AF
DIODE
Tj = 25 C
5V
t
Tj = 125 C
IBend
IB
10
t
10us
1V
13us
32us
VCE
1
Fig.3. Switching times waveforms.
September 1997
0.1
10
1
100
IC / A
t
Fig.6. Typical DC current gain. hFE = f (IC)
parameter VCE
3
Rev 1.400
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
1.2
VBESAT / V
1.1
BU2525AF
BU2525AF
VCESAT / V
10
BU2525AF
Tj = 25 C
Tj = 25 C
Tj = 125 C
Tj = 125 C
1
0.9
8A
0.8
1
6A
IC/IB=
0.7
3
0.6
5A
4
0.5
IC = 4 A
5
0.4
0.1
1
IC / A
0.1
10
0.1
Fig.7. Typical base-emitter saturation voltage.
VBEsat = f (IC); parameter IC/IB
1
VCESAT / V
1
IB / A
Fig.10. Typical collector-emitter saturation voltage.
VCEsat = f (IB); parameter IC
BU2525AF
Eoff / uJ
1000
BU2525AF
IC = 8 A
IC/IB =
0.9
10
5
0.8
4
0.7
7A
3
0.6
100
0.5
Tj = 25 C
0.4
Tj = 125 C
0.3
0.2
0.1
0
1
0.1
10
100
10
0.1
IC / A
Fig.8. Typical collector-emitter saturation voltage.
VCEsat = f (IC); parameter IC/IB
1.2
VBESAT / V
BU2525AF
12
11
10
9
8
7
6
5
Tj = 125 C
1
0.9
IC=
0.8
6A
5A
4A
0.6
0
1
2
IB / A
3
4
BU2525AF
32 kHz
ts
IC =
8A
7A
0.1
1
IB / A
tf
10
Fig.12. Typical collector storage and fall time.
ts = f (IB); tf = f (IB); parameter IC; Tj = 85˚C; f = 32 kHz
Fig.9. Typical base-emitter saturation voltage.
VBEsat = f (IB); parameter IC
September 1997
ts, tf / us
4
3
2
1
0
8A
0.7
10
Fig.11. Typical turn-off losses. Tj = 85˚C
Eoff = f (IB); parameter IC; f = 32 kHz
Tj = 25 C
1.1
1
IB / A
4
Rev 1.400
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
Normalised Power Derating
PD%
120
BU2525AF
IC / A
with heatsink compound
110
BU2525AF
100
100
90
tp =
= 0.01
ICM
80
70
40 us
60
ICDC
50
40
10
30
20
100 us
10
0
0
20
40
60
80
Ths / C
100
120
140
Ptot
Fig.13. Normalised power dissipation.
PD% = 100⋅PD/PD 25˚C = f (Ths)
1
1 ms
10
Zth / (K/W)
BU2525AF
0.5
1
0.1
0.2
0.1
0.05
0.1
10 ms
DC
0.02
PD
0.01
tp
D=
tp
T
0.01
D=0
0.001
1E-06
t
T
1E-04
1E-02
t/s
1
Fig.14. Transient thermal impedance.
Zth j-hs = f(t); parameter D = tp/T
September 1997
10
100
1000 VCE / V
Fig.15. Forward bias safe operating area. Ths = 25 ˚C
ICDC & ICM = f(VCE); ICM single pulse; parameter tp
Second-breakdown limits independant of temperature.
Mounted with heatsink compound.
1E+00
5
Rev 1.400
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU2525AF
MECHANICAL DATA
Dimensions in mm
15.3 max
Net Mass: 5.5 g
5.2 max
3.1
3.3
0.7
7.3
3.2
o
45
6.2
5.8
21.5
max
seating
plane
3.5 max
not tinned
3.5
15.7
min
1
2
2.1 max
5.45
3
1.2
1.0
0.7 max
0.4 M
2.0
5.45
Fig.16. SOT199; The seating plane is electrically isolated from all terminals.
Notes
1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".
September 1997
6
Rev 1.400
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU2525AF
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
 Philips Electronics N.V. 1997
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
September 1997
7
Rev 1.400
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