HI-SINCERITY Spec. No. : HE200802 Issued Date : 2008.08.19 Revised Date :2009.11.06 Page No. : 1/4 MICROELECTRONICS CORP. HSBR10100CT Series to HSBR10150CT Series Schottky Barrier Rectifiers (Reverse Voltage 100V to150V, Forward Current 10A) TO-220AB Features • Low Forward Voltage Drop • High Current Capability • High Reliability • High Surge Current Capability • High ESD capability; TO-220FP Mechanical Data • Cases: TO-220 molded plastic body • Epoxy: UL 94V-0 rate flame retardant • Lead: Axial leads, solderable per MIL-STD-750, Method 2026 guaranteed • High temperature soldering guaranteed: 250°C/10seconds/.375”(9.5mm) lead lengths at 5lbs.(2.3kg) tension • Weight: 2.05gram Maximum Ratings & Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load. Derate current by 20%. Ratings Symbol HSBR HSBR HSBR HSBR 10100CTE 10100CTF 10150CTE 10150CTF Unit Repetitive Peak Reverse Voltage VRRM 100 150 V Surge Peak Reverse Voltage VRSM 70 105 V VDC 100 150 V Average Forward Rectified Current (TA=75 C) IFAV 10 10 A Peak Forward Surge Current, 50Hz Half o Sine-wave (TA=25 C) IFSM 175 175 A Repetitive Peak Forward C (f>15Hz) IFRM 5 5 A VF 0.85 0.90 V 0.2 0.2 mA 20 20 mA DC Blocking Voltage o Instantaneous Forward [email protected] o Leakage Current (TJ=25 C, VR=VRRM) o IR Leakage Current (TJ=100 C, VR=VRRM) Typical thermal resistance Operating Junction Temperature Range Storage Temperature Range HSBR10100CT Series ~HSBR10150CT Series RθJC 2.4 3.5 2.4 3.5 °C/W TJ -65 to +150 °C TSTG -65 to +150 °C HSMC Product Specification HI-SINCERITY Spec. No. : HE200802 Issued Date : 2008.08.19 Revised Date :2009.11.06 Page No. : 2/4 MICROELECTRONICS CORP. Characteristics Curve Maximum Non-repetitive Peak Forward Surge Current Typical Instantaneous Forward Characteristics 200 180 100V 1 Peak Forward Surge Current(A) IF,Forward Current 10 150V 0.1 0.01 160 T j=T jmax.8.3ms single half sine-wave(JEDEC Method) 140 120 100 ` 80 60 40 Ta=25℃ 20 0.001 0 0 0.2 0.4 0.6 0.8 VF,Forward Voltage(V) 1 1 100 Typical Reverse Characteristics Typical Reverse Characteristics Tj=150℃ 100V Tj=120℃ 0.1 Tj=100℃ Tj=75℃ 0.01 0.001 Tj=25℃ Instantaneous Reverse Curren 1 1 Instantaneous Reve Current(mA) 10 Number of Cycles at 50Hz 150V Tj=150℃ 0.1 Tj=125℃ Tj=100℃ 0.01 Tj=75℃ 0.001 Tj=25℃ 0.0001 0.0001 0 50 100 150 Percent of Rated Peak Reverse Voltage(V) 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage(V) 120 Forward Current Derating Curve Average Forward Curren 12 10 8 6 4 Resistive or Inductive Load 0.375"(9.5mm)lead length 2 0 0 25 50 75 100 125 150 175 Lead Temperature(℃) HSBR10100CT Series ~HSBR10150CT Series HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE200802 Issued Date : 2008.08.19 Revised Date :2009.11.06 Page No. : 3/4 TO-220AB Dimension Marking: A F B E C D H M I K 3 G N 2 O P J L Pin Style: 1.Anode 2.Cathode 3.Anode Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 1 Tab Note: Green label is used for pb-free packing DIM A B C D E F G H I J K L M N O P Min. 5.58 8.38 4.40 1.15 0.35 2.03 9.66 3.00 0.75 2.54 1.14 12.70 14.48 Max. 7.49 8.90 4.70 1.39 0.60 2.92 10.28 *16.25 *3.83 4.00 0.95 3.42 1.40 *2.54 14.27 15.87 *: Typical, Unit: mm 3-Lead TO-220AB Plastic Package HSMC Package Code: E Marking: A F B E C D H M I G N 2 1 Tab O P L K 3 J Note: Green label is used for pb-free packing Pin Style: 1.Anode 2.Cathode 3.Anode Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM A B C D E F G H I J K L M N O P Min. 5.58 8.38 4.40 1.15 0.35 2.03 9.66 3.00 0.75 2.54 1.14 12.70 14.48 Max. 7.49 8.90 4.70 1.39 0.60 2.92 10.28 *16.25 *3.83 4.00 0.95 3.42 1.40 *2.54 14.27 15.87 *: Typical, Unit: mm 3-Lead TO-220AB Plastic Package HSMC Package Code: E HSBR10100CT Series ~HSBR10150CT Series HSMC Product Specification HI-SINCERITY Spec. No. : HE200802 Issued Date : 2008.08.19 Revised Date :2009.11.06 Page No. : 4/4 MICROELECTRONICS CORP. TO-220FP Dimension A Marking: B α4 α1 E O C α2 D α3 G α5 I H J 3 N 2 F K 1 M L 3-Lead TO-220FP Plastic Package HSMC Package Code: F Inches Min. Max. 0.2480 0.2520 0.3386 0.3425 0.1673 0.1870 0.1043 0.1083 0.0230 0.0242 0.3980 0.4039 0.1083 0.1122 0.3386 0.3425 *0.1496 *0.0236 DIM A B C D E F G H I J Millimeters Min. Max. 6.30 6.40 8.60 8.70 4.25 4.75 2.65 2.75 0.58 0.61 10.11 10.26 2.75 2.85 8.60 8.70 *3.80 *0.60 Style: 1.Anode 2.Cathode 3.Anode DIM K L M N O α1 α2 α3 α4 α5 Inches Min. Max. *0.1004 0.5118 0.5906 0.5886 0.5925 *0.0669 0.1098 0.1114 -2° *5° *15° *5° *5° Millimeters Min. Max. *2.55 13.00 15.00 14.95 15.05 *1.70 2.79 2.83 *2° *5° *15° *5° *5° Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712 HSBR10100CT Series ~HSBR10150CT Series HSMC Product Specification