AMD AM29LV256MH123RPGI 256 megabit (16 m x 16-bit/32 m x 8-bit) mirrorbittm 3.0 volt-only uniform sector flash memory with versatilei/otm control Datasheet

Am29LV256M
Data Sheet
September 2003
The following document specifies Spansion memory products that are now offered by both Advanced
Micro Devices and Fujitsu. Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and
Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a Spansion product. Any
changes that have been made are the result of normal datasheet improvement and are noted in the
document revision summary, where supported. Future routine revisions will occur when appropriate,
and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
AMD and Fujitsu continue to support existing part numbers beginning with "Am" and "MBM". To order
these products, please use only the Ordering Part Numbers listed in this document.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about Spansion
memory solutions.
Publication Number 25263 Revision C
Amendment +3 Issue Date September 15, 2003
THIS PAGE LEFT INTENTIONALLY BLANK.
DATASHEET
Am29LV256M
256 Megabit (16 M x 16-Bit/32 M x 8-Bit) MirrorBitTM 3.0 Volt-only
Uniform Sector Flash Memory with VersatileI/OTM Control
DISTINCTIVE CHARACTERISTICS
ARCHITECTURAL ADVANTAGES
„ Single power supply operation
— 3 volt read, erase, and program operations
„ VersatileI/O control
— Device generates data output voltages and tolerates
data input voltages on the CE# and DQ inputs/outputs
as determined by the voltage on the VIO pin; operates
from 1.65 to 3.6 V
TM
„ Manufactured on 0.23 µm MirrorBit process
technology
„ SecSiTM (Secured Silicon) Sector region
— 128-word/256-byte sector for permanent, secure
identification through an 8-word/16-byte random
Electronic Serial Number, accessible through a
command sequence
— May be programmed and locked at the factory or by
the customer
„ Flexible sector architecture
— Five hundred twelve 32 Kword (64 Kbyte) sectors
„ Compatibility with JEDEC standards
— Provides pinout and software compatibility for
single-power supply flash, and superior inadvertent
write protection
„ Minimum 100,000 erase cycle guarantee per sector
„ 20-year data retention at 125°C
PERFORMANCE CHARACTERISTICS
„ High performance
— 100 ns access time
— 30 ns page read times
— 0.5 s typical sector erase time
— 15 µs typical effective write buffer word programming
time: 16-word/32-byte write buffer reduces overall
programming time for multiple-word updates
— 4-word/8-byte page read buffer
— 16-word/32-byte write buffer
„ Low power consumption (typical values at 3.0 V, 5
MHz)
— 13 mA typical active read current
— 50 mA typical erase/program current
— 1 µA typical standby mode current
„ Package options
— 56-pin TSOP
— 64-ball Fortified BGA
SOFTWARE & HARDWARE FEATURES
„ Software features
— Program Suspend & Resume: read other sectors
before programming operation is completed
— Erase Suspend & Resume: read/program other
sectors before an erase operation is completed
— Data# polling & toggle bits provide status
— Unlock Bypass Program command reduces overall
multiple-word or byte programming time
— CFI (Common Flash Interface) compliant: allows host
system to identify and accommodate multiple flash
devices
„ Hardware features
— Sector Group Protection: hardware-level method of
preventing write operations within a sector group
— Temporary Sector Group Unprotect: VID-level method
of changing code in locked sector groups
— WP#/ACC input accelerates programming time
(when high voltage is applied) for greater throughput
during system production. Protects first or last sector
regardless of sector protection settings
— Hardware reset input (RESET#) resets device
— Ready/Busy# output (RY/BY#) detects program or
erase cycle completion
This Data Sheet states AMD’s current technical specifications regarding the Products described herein. This Data
Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
Publication# 25263 Rev: C Amendment/+3
Issue Date: September 15, 2003
Refer to AMD’s Website (www.amd.com) for the latest information.
D A T A S H E E T
GENERAL DESCRIPTION
The Am29LV256M is a 256 Mbit, 3.0 volt single power
supply flash memory devices organized as 16,777,216
words or 33,554,432 bytes. The device has a 16-bit
wide data bus that can also function as an 8-bit wide
data bus by using the BYTE# input. The device can be
programmed either in the host system or in standard
EPROM programmers.
An access time of 100, 110, or 120 ns is available.
Note that each access time has a specific operating
voltage range (VCC) and an I/O voltage range (VIO), as
specified in the Product Selector Guide and the Ordering Information sections. The device is offered in a
56-pin TSOP or Fortified BGA package. Each device
has separate chip enable (CE#), write enable (WE#)
and output enable (OE#) controls.
Each device requires only a single 3.0 volt power
supply for both read and write functions. In addition to
a V CC input, a high-voltage accelerated program
(WP#/ACC) input provides shorter programming times
through increased current. This feature is intended to
facilitate factory throughput during system production,
but may also be used in the field if desired.
The device is entirely command set compatible with
the JEDEC single-power-supply Flash standard.
Commands are written to the device using standard
microprocessor write timing. Write cycles also internally latch addresses and data needed for the programming and erase operations.
The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting
the data contents of other sectors. The device is fully
erased when shipped from the factory.
Device programming and erasure are initiated through
command sequences. Once a program or erase operation has begun, the host system need only poll the
DQ7 (Data# Polling) or DQ6 (toggle) status bits or
monitor the Ready/Busy# (RY/BY#) output to determine whether the operation is complete. To facilitate
programming, an Unlock Bypass mode reduces command sequence overhead by requiring only two write
cycles to program data instead of four.
The VersatileI/O™ (VIO) control allows the host system to set the voltage levels that the device generates
and tolerates on the CE# control input and DQ I/Os to
the same voltage level that is asserted on the VIO pin.
Refer to the Ordering Information section for valid VIO
options.
Hardware data protection measures include a low
V CC detector that automatically inhibits write operations during power transitions. The hardware sector
group protection feature disables both program and
erase operations in any combination of sector groups
of memory. This can be achieved in-system or via programming equipment.
The Erase Suspend/Erase Resume feature allows
the host system to pause an erase operation in a
given sector to read or program any other sector and
then complete the erase operation. The Program
Suspend/Program Resume feature enables the host
system to pause a program operation in a given sector
to read any other sector and then complete the program operation.
The hardware RESET# pin terminates any operation
in progress and resets the device, after which it is then
ready for a new operation. The RESET# pin may be
tied to the system reset circuitry. A system reset would
thus also reset the device, enabling the host system to
read boot-up firmware from the Flash memory device.
The device reduces power consumption in the
standby mode when it detects specific voltage levels
on CE# and RESET#, or when addresses have been
stable for a specified period of time.
The SecSi TM (Secured Silicon) Sector provides a
128-word/256-byte area for code or data that can be
permanently protected. Once this sector is protected,
no further changes within the sector can occur.
The Write Protect (WP#/ACC) feature protects the
first or last sector by asserting a logic low on the WP#
pin.
AMD MirrorBit flash technology combines years of
Flash memory manufacturing experience to produce
the highest levels of quality, reliability and cost effectiveness. The device electrically erases all bits within a
sector simultaneously via hot-hole assisted erase. The
data is programmed using hot electron injection.
RELATED DOCUMENTS
For a comprehensive information on MirrorBit products, including migration information, data sheets, application notes, and software drivers, please see
www.amd.com → Flash Memory → Product Information→MirrorBit→Flash Information→Technical Documentation. The following is a partial list of documents
closely related to this product:
2
MirrorBit™ Flash Memory Write Buffer Programming
and Page Buffer Read
Implementing a Common Layout for AMD MirrorBit
and Intel StrataFlash Memory Devices
Migrating from Single-byte to Three-byte Device IDs
Am29LV256M
September 15, 2003
D A T A S H E E T
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . .
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . .
Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ordering Information . . . . . . . . . . . . . . . . . . . . . . .
Device Bus Operations . . . . . . . . . . . . . . . . . . . . .
4
4
5
7
7
8
9
Table 1. Device Bus Operations ....................................................... 9
Word/Byte Configuration .......................................................... 9
VersatileIOTM (VIO) Control ........................................................ 9
Requirements for Reading Array Data ................................... 10
Page Mode Read ............................................................................10
Writing Commands/Command Sequences ............................ 10
Write Buffer .....................................................................................10
Accelerated Program Operation ......................................................10
Autoselect Functions .......................................................................10
Standby Mode ........................................................................ 10
Automatic Sleep Mode ........................................................... 11
RESET#: Hardware Reset Pin ............................................... 11
Output Disable Mode .............................................................. 11
Table 2. Sector Address Table........................................................ 12
Autoselect Mode ..................................................................... 23
Table 3. Autoselect Codes, (High Voltage Method) ....................... 23
Sector Group Protection and Unprotection ............................. 24
Table 4. Sector Group Protection/Unprotection Address Table ..... 24
Write Protect (WP#) ................................................................ 26
Temporary Sector Group Unprotect ....................................... 26
Figure 1. Temporary Sector Group Unprotect Operation ................26
Figure 2. In-System Sector Group Protect/Unprotect Algorithms ...27
SecSi (Secured Silicon) Sector Flash Memory Region .......... 28
Table 5. SecSi Sector Contents...................................................... 28
................................................................................................ 29
Figure 3. SecSi Sector Protect Verify ..............................................29
Hardware Data Protection ...................................................... 29
Low VCC Write Inhibit .....................................................................29
Write Pulse “Glitch” Protection ........................................................29
Logical Inhibit ..................................................................................29
Power-Up Write Inhibit ....................................................................29
Common Flash Memory Interface (CFI) . . . . . . . 29
Table 6. CFI Query Identification String ..........................................30
Table 7. System Interface String..................................................... 30
Table 8. Device Geometry Definition ..............................................31
Table 9. Primary Vendor-Specific Extended Query ........................32
Command Definitions . . . . . . . . . . . . . . . . . . . . . 32
Reading Array Data ................................................................ 32
Reset Command ..................................................................... 33
Autoselect Command Sequence ............................................ 33
Enter SecSi Sector/Exit SecSi Sector Command Sequence .. 33
Word/Byte Program Command Sequence ............................. 33
Unlock Bypass Command Sequence ..............................................34
Write Buffer Programming ...............................................................34
Accelerated Program ......................................................................35
Figure 4. Write Buffer Programming Operation ...............................36
Figure 5. Program Operation ..........................................................37
Program Suspend/Program Resume Command Sequence ... 37
Figure 6. Program Suspend/Program Resume ...............................38
Chip Erase Command Sequence ........................................... 38
Sector Erase Command Sequence ........................................ 38
September 15, 2003
Table 10. Erase Operation ............................................................. 39
Erase Suspend/Erase Resume Commands ........................... 39
Command Definitions ............................................................. 40
Table 11. Command Definitions (x16 Mode, BYTE# = VIH) ........... 40
Table 12. Command Definitions (x8 Mode, BYTE# = VIL).............. 41
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 42
DQ7: Data# Polling ................................................................. 42
Figure 7. Data# Polling Algorithm .................................................. 42
RY/BY#: Ready/Busy# ............................................................ 43
DQ6: Toggle Bit I .................................................................... 43
Figure 8. Toggle Bit Algorithm ........................................................ 44
DQ2: Toggle Bit II ................................................................... 44
Reading Toggle Bits DQ6/DQ2 ............................................... 44
DQ5: Exceeded Timing Limits ................................................ 45
DQ3: Sector Erase Timer ....................................................... 45
DQ1: Write-to-Buffer Abort ..................................................... 45
Table 13. Write Operation Status................................................... 45
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 46
Figure 9. Maximum Negative Overshoot Waveform ..................... 46
Figure 10. Maximum Positive Overshoot Waveform ..................... 46
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 46
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 47
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Figure 11. Test Setup ..................................................................... 48
Table 14. Test Specifications ......................................................... 48
Key to Switching Waveforms. . . . . . . . . . . . . . . . 48
Figure 12. Input Waveforms and
Measurement Levels ...................................................................... 48
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 49
Read-Only Operations ............................................................ 49
Figure 13. Read Operation Timings ............................................... 49
Figure 14. Page Read Timings ...................................................... 50
Hardware Reset (RESET#) .................................................... 51
Figure 15. Reset Timings ............................................................... 51
Erase and Program Operations .............................................. 52
Figure 16. Program Operation Timings .......................................... 53
Figure 17. Accelerated Program Timing Diagram .......................... 53
Figure 18. Chip/Sector Erase Operation Timings .......................... 54
Figure 19. Data# Polling Timings (During Embedded Algorithms) . 55
Figure 20. Toggle Bit Timings (During Embedded Algorithms) ...... 56
Figure 21. DQ2 vs. DQ6 ................................................................. 56
Temporary Sector Unprotect .................................................. 57
Figure 22. Temporary Sector Group Unprotect Timing Diagram ... 57
Figure 23. Sector Group Protect and Unprotect Timing Diagram .. 58
Alternate CE# Controlled Erase and Program Operations ..... 59
Figure 24. Alternate CE# Controlled Write (Erase/Program)
Operation Timings .......................................................................... 60
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 60
Erase And Programming Performance. . . . . . . . 61
TSOP Pin and BGA Package Capacitance . . . . . 61
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 63
TS056/TSR056—56-Pin Standard/Reverse Thin Small Outline
Package (TSOP) ..................................................................... 63
LAC064—64-Ball Fortified Ball Grid Array
18 x 12 mm Package .............................................................. 64
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 65
Am29LV256M
3
D A T A S H E E T
PRODUCT SELECTOR GUIDE
Part Number
Speed/
Voltage
Option
Am29LV256M
Regulated Voltage Range
VCC = 3.0–3.6 V
103R
(Note 2)
(VIO = 2.7–3.6)
Full Voltage Range
VCC = 2.7–3.6 V
103
(Note 2)
(VIO = 2.7–3.6)
123R
(VIO = 1.65–3.6)
113R
(VIO = 1.65–3.6)
113
(Note 2)
(VIO = 1.65–3.6)
123
(Note 2)
(VIO = 1.65–3.6)
Max. Access Time (ns)
100
110
120
Max. CE# Access Time (ns)
100
110
120
Max. Page access time (tPACC)
30
30
40
30
40
Max. OE# Access Time (ns)
30
30
40
30
40
Notes:
1.
See “AC Characteristics” for full specifications.
2. Contact factory for availability and ordering information.
BLOCK DIAGRAM
DQ0–DQ15 (A-1)
RY/BY#
VCC
Sector Switches
VSS
Erase Voltage
Generator
RESET#
WE#
WP#/ACC
BYTE#
State
Control
Command
Register
PGM Voltage
Generator
Chip Enable
Output Enable
Logic
CE#
OE#
VCC Detector
4
Timer
Address Latch
STB
A23–A0
Input/Output
Buffers
VIO
Am29LV256M
STB
Data
Latch
Y-Decoder
Y-Gating
X-Decoder
Cell Matrix
September 15, 2003
D A T A S H E E T
CONNECTION DIAGRAMS
A23
A22
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
WE#
RESET#
A21
WP#/ACC
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
NC
NC
A16
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
NC
VIO
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
September 15, 2003
56-Pin Standard TSOP
56-Pin Reverse TSOP
Am29LV256M
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
NC
NC
A16
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
NC
VIO
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
A23
A22
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
WE#
RESET#
A21
WP#/ACC
RY/BY#
A18
A17
A7
A6
A5
A4
A3
A2
A1
NC
NC
5
D A T A S H E E T
CONNECTION DIAGRAMS
Fortified BGA
Top View, Balls Facing Down
A8
B8
C8
D8
E8
F8
G8
H8
NC
A22
A23
VIO
VSS
NC
NC
NC
A7
B7
C7
D7
E7
F7
G7
H7
A13
A12
A14
A15
A16
A6
B6
C6
D6
E6
F6
G6
H6
A9
A8
A10
A11
DQ7
DQ14
DQ13
DQ6
A5
B5
C5
D5
E5
F5
G5
H5
WE#
RESET#
A21
A19
DQ5
DQ12
VCC
DQ4
A4
B4
C4
D4
E4
F4
G4
H4
A18
A20
DQ2
DQ10
DQ11
DQ3
RY/BY# WP#/ACC
VSS
A3
B3
C3
D3
E3
F3
G3
H3
A7
A17
A6
A5
DQ0
DQ8
DQ9
DQ1
A2
B2
C2
D2
E2
F2
G2
H2
A3
A4
A2
A1
A0
CE#
OE#
VSS
A1
B1
C1
D1
E1
F1
G1
H1
NC
NC
NC
NC
NC
VIO
NC
NC
SPECIAL PACKAGE HANDLING
INSTRUCTIONS
Special handling is required for Flash Memory products
in molded packages (TSOP and BGA). The package
6
BYTE# DQ15/A-1
and/or data integrity may be compromised if the
package body is exposed to temperatures above
150°C for prolonged periods of time.
Am29LV256M
September 15, 2003
D A T A S H E E T
PIN DESCRIPTION
A23–A0
LOGIC SYMBOL
= 24 Address inputs
24
DQ14–DQ0 = 15 Data inputs/outputs
A23–A0
DQ15/A-1
= DQ15 (Data input/output, word mode),
A-1 (LSB Address input, byte mode)
CE#
CE#
= Chip Enable input
OE#
OE#
= Output Enable input
WE#
WE#
= Write Enable input
WP#/ACC
WP#/ACC
= Hardware Write Protect input;
Acceleration input
RESET#
RESET#
= Hardware Reset Pin input
BYTE#
= Selects 8-bit or 16-bit mode
RY/BY#
= Ready/Busy output
VCC
= 3.0 volt-only single power supply
(see Product Selector Guide for
speed options and voltage
supply tolerances)
VIO
= Output Buffer power
VSS
= Device Ground
NC
= Pin Not Connected Internally
September 15, 2003
VIO
16 or 8
DQ15–DQ0
(A-1)
RY/BY#
BYTE#
Am29LV256M
7
D A T A S H E E T
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
Am29LV256M
H
123R
PG
I
TEMPERATURE RANGE
I
= Industrial (–40°C to +85°C)
PACKAGE TYPE
E
= 56-Pin Thin Small Outline Package (TSOP) Standard Pinout (TS 056)
F
= 56-Pin Thin Small Outline Package (TSOP) Reverse Pinout (TSR056)
PG = 64-Ball Fortified Ball Grid Array,
1.0 mm pitch, 18 x 12 mm package (LAC064)
SPEED OPTION
See Product Selector Guide and Valid Combinations
SECTOR ARCHITECTURE AND SECTOR WRITE PROTECTION (WP# = VIL)
H
= Uniform sector device, highest address sector protected
L
= Uniform sector device, lowest address sector protected
DEVICE NUMBER/DESCRIPTION
Am29LV256MH/L
256 Megabit (16 M x 16-Bit/32 M x 8-Bit) MirrorBit Uniform Sector Flash Memory with VersatileIOTM Control
3.0 Volt-only Read, Program, and Erase
Valid Combinations for
TSOP Package
Am29LV256MH113R
Am29LV256ML113R
Am29LV256MH123R
Am29LV256ML123R
EI,
FI
Speed
(ns)
VIO
Range
110
1.65–3.6 V
120
1.65–3.6 V
Valid Combinations for
Fortified BGA Package
VCC
Range
Order Number
3.0–3.6 V
Am29LV256MH113R
Am29LV256ML113R
Am29LV256MH123R
Am29LV256ML123R
Package Marking
PGI
L256MH113R
L256ML113R
L256MH123R
L256ML123R
VCC
Speed
VIO
Range Range
(ns)
110
1.65–
3.6 V
120
1.65–
3.6 V
I
3.0–
3.6 V
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for
this device. Consult the local AMD sales office to confirm availability of specific
valid combinations and to check on newly released combinations.
Note:For 103, 103R, 110, and 120 speed option shown in product selector
guide, contact AMD for availability and ordering information.
Notes:
1. To select the product with ESN factory-locked into the SecSi Sector: 1) select the order number from the valid combinations
given above, 2)add designator “N” at the end of the order number, and 3) modify the speed option indicator as follows
[113R = 11R; 123R = 12R; 113, 123 = no change] Example: Am29LV256MH12RPGIN. For fortified BGA packages, the
designator “N” will also appear at the end of the package marking. Example: L256MH12RIN.
8
Am29LV256M
September 15, 2003
D A T A S H E E T
DEVICE BUS OPERATIONS
register serve as inputs to the internal state machine.
The state machine outputs dictate the function of the
device. Table 1 lists the device bus operations, the inputs and control levels they require, and the resulting
output. The following subsections describe each of
these operations in further detail.
This section describes the requirements and use of
the device bus operations, which are initiated through
the internal command register. The command register
itself does not occupy any addressable memory location. The register is a latch used to store the commands, along with the address and data information
needed to execute the command. The contents of the
Table 1.
Device Bus Operations
DQ8–DQ15
CE#
OE#
WE#
RESET#
WP#
ACC
Addresses
(Note 2)
DQ0–
DQ7
BYTE#
= VIH
Read
L
L
H
H
X
X
AIN
DOUT
DOUT
Write (Program/Erase)
L
H
L
H
(Note 3)
X
AIN
(Note 4) (Note 4)
Accelerated Program
L
H
L
H
(Note 3)
VHH
AIN
(Note 4) (Note 4)
VCC ±
0.3 V
X
X
VCC ±
0.3 V
X
H
X
High-Z
High-Z
High-Z
Output Disable
L
H
H
H
X
X
X
High-Z
High-Z
High-Z
Reset
X
X
X
L
X
X
X
High-Z
High-Z
High-Z
Sector Group Protect
(Note 2)
L
H
L
VID
H
X
SA, A6 =L,
A3=L, A2=L,
A1=H, A0=L
(Note 4)
X
X
Sector Group Unprotect
(Note 2)
L
H
L
VID
H
X
SA, A6=H,
A3=L, A2=L,
A1=H, A0=L
(Note 4)
X
X
Temporary Sector Group
Unprotect
X
X
X
VID
H
X
AIN
Operation
Standby
(Note 4) (Note 4)
BYTE#
= VIL
DQ8–DQ14
= High-Z,
DQ15 = A-1
High-Z
Legend: L = Logic Low = VIL, H = Logic High = VIH, VID = 11.5–12.5 V, VHH = 11.5–12.5V, X = Don’t Care, SA = Sector Address,
AIN = Address In, DIN = Data In, DOUT = Data Out
Notes:
1. Addresses are A23:A0 in word mode; A23:A-1 in byte mode. Sector addresses are A23:A15 in both modes.
2. The sector group protect and sector unprotect functions may also be implemented via programming equipment. See the “Sector
Group Protection and Unprotection” section.
3. If WP# = VIL, the first or last sector group remains protected. If WP# = VIH, the first or last sector will be protected or unprotected as
determined by the method described in “Write Protect (WP#)”. All sectors are unprotected when shipped from the factory (The
SecSi Sector may be factory protected depending on version ordered.)
4. DIN or DOUT as required by command sequence, data polling, or sector protect algorithm (see Figure 2).
Word/Byte Configuration
The BYTE# pin controls whether the device data I/O
pins operate in the byte or word configuration. If the
BYTE# pin is set at logic ‘1’, the device is in word configuration, DQ0–DQ15 are active and controlled by
CE# and OE#.
If the BYTE# pin is set at logic ‘0’, the device is in byte
configuration, and only data I/O pins DQ0–DQ7 are
active and controlled by CE# and OE#. The data I/O
September 15, 2003
pins DQ8–DQ14 are tri-stated, and the DQ15 pin is
used as an input for the LSB (A-1) address function.
VersatileIOTM (VIO) Control
The VersatileIOTM (VIO) control allows the host system
to set the voltage levels that the device generates and
tolerates on CE# and DQ I/Os to the same voltage
level that is asserted on VIO. See Ordering Information
for VIO options on this device.
Am29LV256M
9
D A T A S H E E T
For example, a VI/O of 1.65–3.6 volts allows for I/O at
the 1.8 or 3 volt levels, driving and receiving signals to
and from other 1.8 or 3 V devices on the same data
bus.
Requirements for Reading Array Data
To read array data from the outputs, the system must
drive the CE# and OE# pins to VIL. CE# is the power
control and selects the device. OE# is the output control and gates array data to the output pins. WE#
should remain at VIH.
The internal state machine is set for reading array data
upon device power-up, or after a hardware reset. This
ensures that no spurious alteration of the memory
content occurs during the power transition. No command is necessary in this mode to obtain array data.
Standard microprocessor read cycles that assert valid
addresses on the device address inputs produce valid
data on the device data outputs. The device remains
enabled for read access until the command register
contents are altered.
See “Reading Array Data” for more information. Refer
to the AC Read-Only Operations table for timing specifications and to Figure 13 for the timing diagram. Refer
to the DC Characteristics table for the active current
specification on reading array data.
Page Mode Read
The device is capable of fast page mode read and is
compatible with the page mode Mask ROM read operation. This mode provides faster read access speed
for random locations within a page. The page size of
the device is 4 words/8 bytes. The appropriate page is
selected by the higher address bits A(max)–A2. Address bits A1–A0 in word mode (A1–A-1 in byte mode)
determine the specific word within a page. This is an
asynchronous operation; the microprocessor supplies
the specific word location.
The random or initial page access is equal to tACC or
tCE and subsequent page read accesses (as long as
the locations specified by the microprocessor falls
within that page) is equivalent to tPACC. When CE# is
deasserted and reasserted for a subsequent access,
the access time is t ACC or t CE . Fast page mode accesses are obtained by keeping the “read-page addresses” constant and changing the “intra-read page”
addresses.
Writing Commands/Command Sequences
To write a command or command sequence (which includes programming data to the device and erasing
sectors of memory), the system must drive WE# and
CE# to VIL, and OE# to VIH.
The device features an Unlock Bypass mode to facilitate faster programming. Once the device enters the
10
Unlock Bypass mode, only two write cycles are required to program a word or byte, instead of four. The
“Word/Byte Program Command Sequence” section
has details on programming data to the device using
both standard and Unlock Bypass command sequences.
An erase operation can erase one sector, multiple sectors, or the entire device. Table 2 indicates the address
space that each sector occupies.
Refer to the DC Characteristics table for the active
current specification for the write mode. The AC Characteristics section contains timing specification tables
and timing diagrams for write operations.
Write Buffer
Write Buffer Programming allows the system write to a
maximum of 16 words/32 bytes in one programming
operation. This results in faster effective programming
time than the standard programming algorithms. See
“Write Buffer” for more information.
Accelerated Program Operation
The device offers accelerated program operations
through the ACC function. This is one of two functions
provided by the WP#/ACC pin. This function is primarily intended to allow faster manufacturing throughput
at the factory.
If the system asserts VHH on this pin, the device automatically enters the aforementioned Unlock Bypass
mode, temporarily unprotects any protected sector
groups, and uses the higher voltage on the pin to reduce the time required for program operations. The
system would use a two-cycle program command sequence as required by the Unlock Bypass mode. Removing VHH from the WP#/ACC pin returns the device
to normal operation. Note that the WP#/ACC pin must
not be at V HH for operations other than accelerated
programming, or device damage may result. WP# has
an internal pullup; when unconnected, WP# is at VIH.
Autoselect Functions
If the system writes the autoselect command sequence, the device enters the autoselect mode. The
system can then read autoselect codes from the internal register (which is separate from the memory array)
on DQ7–DQ0. Standard read cycle timings apply in
this mode. Refer to the Autoselect Mode and Autoselect Command Sequence sections for more information.
Standby Mode
When the system is not reading or writing to the device, it can place the device in the standby mode. In
this mode, current consumption is greatly reduced,
Am29LV256M
September 15, 2003
D A T A S H E E T
and the outputs are placed in the high impedance
state, independent of the OE# input.
The device enters the CMOS standby mode when the
CE# and RESET# pins are both held at VIO ± 0.3 V.
(Note that this is a more restricted voltage range than
VIH.) If CE# and RESET# are held at VIH, but not within
VIO ± 0.3 V, the device will be in the standby mode, but
the standby current will be greater. The device requires standard access time (t CE ) for read access
when the device is in either of these standby modes,
before it is ready to read data.
If the device is deselected during erasure or programming, the device draws active current until the
operation is completed.
Refer to the DC Characteristics table for the standby
current specification.
Automatic Sleep Mode
The automatic sleep mode minimizes Flash device energy consumption. The device automatically enables
this mode when addresses remain stable for tACC +
30 ns. The automatic sleep mode is independent of
the CE#, WE#, and OE# control signals. Standard address access timings provide new data when addresses are changed. While in sleep mode, output
data is latched and always available to the system.
Refer to the DC Characteristics table for the automatic
sleep mode current specification.
September 15, 2003
RESET#: Hardware Reset Pin
The RESET# pin provides a hardware method of resetting the device to reading array data. When the RESET# pin is driven low for at least a period of tRP, the
device immediately terminates any operation in
progress, tristates all output pins, and ignores all
read/write commands for the duration of the RESET#
pulse. The device also resets the internal state machine to reading array data. The operation that was interrupted should be reinitiated once the device is
ready to accept another command sequence, to ensure data integrity.
Current is reduced for the duration of the RESET#
pulse. When RESET# is held at VSS±0.3 V, the device
draws CMOS standby current (ICC4). If RESET# is held
at VIL but not within VSS±0.3 V, the standby current will
be greater.
The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the Flash
memory, enabling the system to read the boot-up firmware from the Flash memory.
Refer to the AC Characteristics tables for RESET# parameters and to Figure 15 for the timing diagram.
Output Disable Mode
When the OE# input is at VIH, output from the device is
disabled. The output pins are placed in the high
impedance state.
Am29LV256M
11
D A T A S H E E T
Table 2.
Sector
12
Sector Address Table
A23–A15
Sector Size
(Kbytes/Kwords)
8-bit
Address Range
(in hexadecimal)
16-bit
Address Range
(in hexadecimal)
SA0
0
0
0
0
0
0
0
0
0
64/32
0000000–000FFFF
000000–007FFF
SA1
0
0
0
0
0
0
0
0
1
64/32
0010000–001FFFF
008000–00FFFF
SA2
0
0
0
0
0
0
0
1
0
64/32
0020000–002FFFF
010000–017FFF
SA3
0
0
0
0
0
0
0
1
1
64/32
0030000–003FFFF
018000–01FFFF
SA4
0
0
0
0
0
0
1
0
0
64/32
0040000–004FFFF
020000–027FFF
SA5
0
0
0
0
0
0
1
0
1
64/32
0050000–005FFFF
028000–02FFFF
SA6
0
0
0
0
0
0
1
1
0
64/32
0060000–006FFFF
030000–037FFF
SA7
0
0
0
0
0
0
1
1
1
64/32
0070000–007FFFF
038000–03FFFF
SA8
0
0
0
0
0
1
0
0
0
64/32
0080000–008FFFF
040000–047FFF
SA9
0
0
0
0
0
1
0
0
1
64/32
0090000–009FFFF
048000–04FFFF
SA10
0
0
0
0
0
1
0
1
0
64/32
00A0000–00AFFFF
050000–057FFF
SA11
0
0
0
0
0
1
0
1
1
64/32
00B0000–00BFFFF
058000–05FFFF
SA12
0
0
0
0
0
1
1
0
0
64/32
00C0000–00CFFFF
060000–067FFF
SA13
0
0
0
0
0
1
1
0
1
64/32
00D0000–00DFFFF
068000–06FFFF
SA14
0
0
0
0
0
1
1
1
0
64/32
00E0000–00EFFFF
070000–077FFF
SA15
0
0
0
0
0
1
1
1
1
64/32
00F0000–00FFFFF
078000–07FFFF
SA16
0
0
0
0
1
0
0
0
0
64/32
0100000–010FFFF
080000–087FFF
SA17
0
0
0
0
1
0
0
0
1
64/32
0110000–011FFFF
088000–08FFFF
SA18
0
0
0
0
1
0
0
1
0
64/32
0120000–012FFFF
090000–097FFF
SA19
0
0
0
0
1
0
0
1
1
64/32
0130000–013FFFF
098000–09FFFF
SA20
0
0
0
0
1
0
1
0
0
64/32
0140000–014FFFF
0A0000–0A7FFF
SA21
0
0
0
0
1
0
1
0
1
64/32
0150000–015FFFF
0A8000–0AFFFF
SA22
0
0
0
0
1
0
1
1
0
64/32
0160000–016FFFF
0B0000–0B7FFF
SA23
0
0
0
0
1
0
1
1
1
64/32
0170000–017FFFF
0B8000–0BFFFF
SA24
0
0
0
0
1
1
0
0
0
64/32
0180000–018FFFF
0C0000–0C7FFF
SA25
0
0
0
0
1
1
0
0
1
64/32
0190000–019FFFF
0C8000–0CFFFF
SA26
0
0
0
0
1
1
0
1
0
64/32
01A0000–01AFFFF
0D0000–0D7FFF
SA27
0
0
0
0
1
1
0
1
1
64/32
01B0000–01BFFFF
0D8000–0DFFFF
SA28
0
0
0
0
1
1
1
0
0
64/32
01C0000–01CFFFF
0E0000–0E7FFF
SA29
0
0
0
0
1
1
1
0
1
64/32
01D0000–01DFFFF
0E8000–0EFFFF
SA30
0
0
0
0
1
1
1
1
0
64/32
01E0000–01EFFFF
0F0000–0F7FFF
SA31
0
0
0
0
1
1
1
1
1
64/32
01F0000–01FFFFF
0F8000–0FFFFF
SA32
0
0
0
1
0
0
0
0
0
64/32
0200000–020FFFF
100000–107FFF
SA33
0
0
0
1
0
0
0
0
1
64/32
0210000–021FFFF
108000–10FFFF
SA34
0
0
0
1
0
0
0
1
0
64/32
0220000–022FFFF
110000–117FFF
SA35
0
0
0
1
0
0
0
1
1
64/32
0230000–023FFFF
118000–11FFFF
SA36
0
0
0
1
0
0
1
0
0
64/32
0240000–024FFFF
120000–127FFF
SA37
0
0
0
1
0
0
1
0
1
64/32
0250000–025FFFF
128000–12FFFF
SA38
0
0
0
1
0
0
1
1
0
64/32
0260000–026FFFF
130000–137FFF
SA39
0
0
0
1
0
0
1
1
1
64/32
0270000–027FFFF
138000–13FFFF
SA40
0
0
0
1
0
1
0
0
0
64/32
0280000–028FFFF
140000–147FFF
SA41
0
0
0
1
0
1
0
0
1
64/32
0290000–029FFFF
148000–14FFFF
SA42
0
0
0
1
0
1
0
1
0
64/32
02A0000–02AFFFF
150000–157FFF
SA43
0
0
0
1
0
1
0
1
1
64/32
02B0000–02BFFFF
158000–15FFFF
SA44
0
0
0
1
0
1
1
0
0
64/32
02C0000–02CFFFF
160000–167FFF
SA45
0
0
0
1
0
1
1
0
1
64/32
02D0000–02DFFFF
168000–16FFFF
SA46
0
0
0
1
0
1
1
1
0
64/32
02E0000–02EFFFF
170000–177FFF
Am29LV256M
September 15, 2003
D A T A S H E E T
Table 2. Sector Address Table (Continued)
Sector
A23–A15
Sector Size
(Kbytes/Kwords)
8-bit
Address Range
(in hexadecimal)
16-bit
Address Range
(in hexadecimal)
SA47
0
0
0
1
0
1
1
1
1
64/32
02F0000–02FFFFF
178000–17FFFF
SA48
0
0
0
1
1
0
0
0
0
64/32
0300000–030FFFF
180000–187FFF
SA49
0
0
0
1
1
0
0
0
1
64/32
0310000–031FFFF
188000–18FFFF
SA50
0
0
0
1
1
0
0
1
0
64/32
0320000–032FFFF
190000–197FFF
SA51
0
0
0
1
1
0
0
1
1
64/32
0330000–033FFFF
198000–19FFFF
SA52
0
0
0
1
1
0
1
0
0
64/32
0340000–034FFFF
1A0000–1A7FFF
SA53
0
0
0
1
1
0
1
0
1
64/32
0350000–035FFFF
1A8000–1AFFFF
SA54
0
0
0
1
1
0
1
1
0
64/32
0360000–036FFFF
1B0000–1B7FFF
SA55
0
0
0
1
1
0
1
1
1
64/32
0370000–037FFFF
1B8000–1BFFFF
SA56
0
0
0
1
1
1
0
0
0
64/32
0380000–038FFFF
1C0000–1C7FFF
SA57
0
0
0
1
1
1
0
0
1
64/32
0390000–039FFFF
1C8000–1CFFFF
SA58
0
0
0
1
1
1
0
1
0
64/32
03A0000–03AFFFF
1D0000–1D7FFF
SA59
0
0
0
1
1
1
0
1
1
64/32
03B0000–03BFFFF
1D8000–1DFFFF
SA60
0
0
0
1
1
1
1
0
0
64/32
03C0000–03CFFFF
1E0000–1E7FFF
SA61
0
0
0
1
1
1
1
0
1
64/32
03D0000–03DFFFF
1E8000–1EFFFF
SA62
0
0
0
1
1
1
1
1
0
64/32
03E0000–03EFFFF
1F0000–1F7FFF
SA63
0
0
0
1
1
1
1
1
1
64/32
03F0000–03FFFFF
1F8000–1FFFFF
SA64
0
0
1
0
0
0
0
0
0
64/32
0400000–040FFFF
200000–207FFF
SA65
0
0
1
0
0
0
0
0
1
64/32
0410000–041FFFF
208000–20FFFF
SA66
0
0
1
0
0
0
0
1
0
64/32
0420000–042FFFF
210000–217FFF
SA67
0
0
1
0
0
0
0
1
1
64/32
0430000–043FFFF
218000–21FFFF
SA68
0
0
1
0
0
0
1
0
0
64/32
0440000–044FFFF
220000–227FFF
SA69
0
0
1
0
0
0
1
0
1
64/32
0450000–045FFFF
228000–22FFFF
SA70
0
0
1
0
0
0
1
1
0
64/32
0460000–046FFFF
230000–237FFF
SA71
0
0
1
0
0
0
1
1
1
64/32
0470000–047FFFF
238000–23FFFF
SA72
0
0
1
0
0
1
0
0
0
64/32
0480000–048FFFF
240000–247FFF
SA73
0
0
1
0
0
1
0
0
1
64/32
0490000–049FFFF
248000–24FFFF
SA74
0
0
1
0
0
1
0
1
0
64/32
04A0000–04AFFFF
250000–257FFF
SA75
0
0
1
0
0
1
0
1
1
64/32
04B0000–04BFFFF
258000–25FFFF
SA76
0
0
1
0
0
1
1
0
0
64/32
04C0000–04CFFFF
260000–267FFF
SA77
0
0
1
0
0
1
1
0
1
64/32
04D0000–04DFFFF
268000–26FFFF
SA78
0
0
1
0
0
1
1
1
0
64/32
04E0000–04EFFFF
270000–277FFF
SA79
0
0
1
0
0
1
1
1
1
64/32
04F0000–04FFFFF
278000–27FFFF
SA80
0
0
1
0
1
0
0
0
0
64/32
0500000–050FFFF
280000–287FFF
SA81
0
0
1
0
1
0
0
0
1
64/32
0510000–051FFFF
288000–28FFFF
SA82
0
0
1
0
1
0
0
1
0
64/32
0520000–052FFFF
290000–297FFF
SA83
0
0
1
0
1
0
0
1
1
64/32
0530000–053FFFF
298000–29FFFF
SA84
0
0
1
0
1
0
1
0
0
64/32
0540000–054FFFF
2A0000–2A7FFF
SA85
0
0
1
0
1
0
1
0
1
64/32
0550000–055FFFF
2A8000–2AFFFF
SA86
0
0
1
0
1
0
1
1
0
64/32
0560000–056FFFF
2B0000–2B7FFF
SA87
0
0
1
0
1
0
1
1
1
64/32
0570000–057FFFF
2B8000–2BFFFF
SA88
0
0
1
0
1
1
0
0
0
64/32
0580000–058FFFF
2C0000–2C7FFF
SA89
0
0
1
0
1
1
0
0
1
64/32
0590000–059FFFF
2C8000–2CFFFF
SA90
0
0
1
0
1
1
0
1
0
64/32
05A0000–05AFFFF
2D0000–2D7FFF
SA91
0
0
1
0
1
1
0
1
1
64/32
05B0000–05BFFFF
2D8000–2DFFFF
SA92
0
0
1
0
1
1
1
0
0
64/32
05C0000–05CFFFF
2E0000–2E7FFF
SA93
0
0
1
0
1
1
1
0
1
64/32
05D0000–05DFFFF
2E8000–2EFFFF
SA94
0
0
1
0
1
1
1
1
0
64/32
05E0000–05EFFFF
2F0000–2F7FFF
September 15, 2003
Am29LV256M
13
D A T A S H E E T
Table 2. Sector Address Table (Continued)
Sector
14
A23–A15
Sector Size
(Kbytes/Kwords)
8-bit
Address Range
(in hexadecimal)
16-bit
Address Range
(in hexadecimal)
SA95
0
0
1
0
1
1
1
1
1
64/32
05F0000–05FFFFF
2F8000–2FFFFF
SA96
0
0
1
1
0
0
0
0
0
64/32
0600000–060FFFF
300000–307FFF
SA97
0
0
1
1
0
0
0
0
1
64/32
0610000–061FFFF
308000–30FFFF
SA98
0
0
1
1
0
0
0
1
0
64/32
0620000–062FFFF
310000–317FFF
SA99
0
0
1
1
0
0
0
1
1
64/32
0630000–063FFFF
318000–31FFFF
SA100
0
0
1
1
0
0
1
0
0
64/32
0640000–064FFFF
320000–327FFF
SA101
0
0
1
1
0
0
1
0
1
64/32
0650000–065FFFF
328000–32FFFF
SA102
0
0
1
1
0
0
1
1
0
64/32
0660000–066FFFF
330000–337FFF
SA103
0
0
1
1
0
0
1
1
1
64/32
0670000–067FFFF
338000–33FFFF
SA104
0
0
1
1
0
1
0
0
0
64/32
0680000–068FFFF
340000–347FFF
SA105
0
0
1
1
0
1
0
0
1
64/32
0690000–069FFFF
348000–34FFFF
SA106
0
0
1
1
0
1
0
1
0
64/32
06A0000–06AFFFF
350000–357FFF
SA107
0
0
1
1
0
1
0
1
1
64/32
06B0000–06BFFFF
358000–35FFFF
SA108
0
0
1
1
0
1
1
0
0
64/32
06C0000–06CFFFF
360000–367FFF
SA109
0
0
1
1
0
1
1
0
1
64/32
06D0000–06DFFFF
368000–36FFFF
SA110
0
0
1
1
0
1
1
1
0
64/32
06E0000–06EFFFF
370000–377FFF
SA111
0
0
1
1
0
1
1
1
1
64/32
06F0000–06FFFFF
378000–37FFFF
SA112
0
0
1
1
1
0
0
0
0
64/32
0700000–070FFFF
380000–387FFF
SA113
0
0
1
1
1
0
0
0
1
64/32
0710000–071FFFF
388000–38FFFF
SA114
0
0
1
1
1
0
0
1
0
64/32
0720000–072FFFF
390000–397FFF
SA115
0
0
1
1
1
0
0
1
1
64/32
0730000–073FFFF
398000–39FFFF
SA116
0
0
1
1
1
0
1
0
0
64/32
0740000–074FFFF
3A0000–3A7FFF
SA117
0
0
1
1
1
0
1
0
1
64/32
0750000–075FFFF
3A8000–3AFFFF
SA118
0
0
1
1
1
0
1
1
0
64/32
0760000–076FFFF
3B0000–3B7FFF
SA119
0
0
1
1
1
0
1
1
1
64/32
0770000–077FFFF
3B8000–3BFFFF
SA120
0
0
1
1
1
1
0
0
0
64/32
0780000–078FFFF
3C0000–3C7FFF
SA121
0
0
1
1
1
1
0
0
1
64/32
0790000–079FFFF
3C8000–3CFFFF
SA122
0
0
1
1
1
1
0
1
0
64/32
07A0000–07AFFFF
3D0000–3D7FFF
SA123
0
0
1
1
1
1
0
1
1
64/32
07B0000–07BFFFF
3D8000–3DFFFF
SA124
0
0
1
1
1
1
1
0
0
64/32
07C0000–07CFFFF
3E0000–3E7FFF
SA125
0
0
1
1
1
1
1
0
1
64/32
07D0000–07DFFFF
3E8000–3EFFFF
SA126
0
0
1
1
1
1
1
1
0
64/32
07E0000–07EFFFF
3F0000–3F7FFF
SA127
0
0
1
1
1
1
1
1
1
64/32
07F0000–07FFFFF
3F8000–3FFFFF
SA128
0
1
0
0
0
0
0
0
0
64/32
0800000–080FFFF
400000–407FFF
SA129
0
1
0
0
0
0
0
0
1
64/32
0810000–081FFFF
408000–40FFFF
SA130
0
1
0
0
0
0
0
1
0
64/32
0820000–082FFFF
410000–417FFF
SA131
0
1
0
0
0
0
0
1
1
64/32
0830000–083FFFF
418000–41FFFF
SA132
0
1
0
0
0
0
1
0
0
64/32
0840000–084FFFF
420000–427FFF
SA133
0
1
0
0
0
0
1
0
1
64/32
0850000–085FFFF
428000–42FFFF
SA134
0
1
0
0
0
0
1
1
0
64/32
0860000–086FFFF
430000–437FFF
SA135
0
1
0
0
0
0
1
1
1
64/32
0870000–087FFFF
438000–43FFFF
SA136
0
1
0
0
0
1
0
0
0
64/32
0880000–088FFFF
440000–447FFF
SA137
0
1
0
0
0
1
0
0
1
64/32
0890000–089FFFF
448000–44FFFF
SA138
0
1
0
0
0
1
0
1
0
64/32
08A0000–08AFFFF
450000–457FFF
SA139
0
1
0
0
0
1
0
1
1
64/32
08B0000–08BFFFF
458000–45FFFF
SA140
0
1
0
0
0
1
1
0
0
64/32
08C0000–08CFFFF
460000–467FFF
SA141
0
1
0
0
0
1
1
0
1
64/32
08D0000–08DFFFF
468000–46FFFF
SA142
0
1
0
0
0
1
1
1
0
64/32
08E0000–08EFFFF
470000–477FFF
Am29LV256M
September 15, 2003
D A T A S H E E T
Table 2. Sector Address Table (Continued)
Sector
A23–A15
Sector Size
(Kbytes/Kwords)
8-bit
Address Range
(in hexadecimal)
16-bit
Address Range
(in hexadecimal)
SA143
0
1
0
0
0
1
1
1
1
64/32
08F0000–08FFFFF
478000–47FFFF
SA144
0
1
0
0
1
0
0
0
0
64/32
0900000–090FFFF
480000–487FFF
SA145
0
1
0
0
1
0
0
0
1
64/32
0910000–091FFFF
488000–48FFFF
SA146
0
1
0
0
1
0
0
1
0
64/32
0920000–092FFFF
490000–497FFF
SA147
0
1
0
0
1
0
0
1
1
64/32
0930000–093FFFF
498000–49FFFF
SA148
0
1
0
0
1
0
1
0
0
64/32
0940000–094FFFF
4A0000–4A7FFF
SA149
0
1
0
0
1
0
1
0
1
64/32
0950000–095FFFF
4A8000–4AFFFF
SA150
0
1
0
0
1
0
1
1
0
64/32
0960000–096FFFF
4B0000–4B7FFF
SA151
0
1
0
0
1
0
1
1
1
64/32
0970000–097FFFF
4B8000–4BFFFF
SA152
0
1
0
0
1
1
0
0
0
64/32
0980000–098FFFF
4C0000–4C7FFF
SA153
0
1
0
0
1
1
0
0
1
64/32
0990000–099FFFF
4C8000–4CFFFF
SA154
0
1
0
0
1
1
0
1
0
64/32
09A0000–09AFFFF
4D0000–4D7FFF
SA155
0
1
0
0
1
1
0
1
1
64/32
09B0000–09BFFFF
4D8000–4DFFFF
SA156
0
1
0
0
1
1
1
0
0
64/32
09C0000–09CFFFF
4E0000–4E7FFF
SA157
0
1
0
0
1
1
1
0
1
64/32
09D0000–09DFFFF
4E8000–4EFFFF
SA158
0
1
0
0
1
1
1
1
0
64/32
09E0000–09EFFFF
4F0000–4F7FFF
SA159
0
1
0
0
1
1
1
1
1
64/32
09F0000–09FFFFF
4F8000–4FFFFF
SA160
0
1
0
1
0
0
0
0
0
64/32
0A00000–0A0FFFF
500000–507FFF
SA161
0
1
0
1
0
0
0
0
1
64/32
0A10000–0A1FFFF
508000–50FFFF
SA162
0
1
0
1
0
0
0
1
0
64/32
0A20000–0A2FFFF
510000–517FFF
SA163
0
1
0
1
0
0
0
1
1
64/32
0A30000–0A3FFFF
518000–51FFFF
SA164
0
1
0
1
0
0
1
0
0
64/32
0A40000–0A4FFFF
520000–527FFF
SA165
0
1
0
1
0
0
1
0
1
64/32
0A50000–0A5FFFF
528000–52FFFF
SA166
0
1
0
1
0
0
1
1
0
64/32
0A60000–0A6FFFF
530000–537FFF
SA167
0
1
0
1
0
0
1
1
1
64/32
0A70000–0A7FFFF
538000–53FFFF
SA168
0
1
0
1
0
1
0
0
0
64/32
0A80000–0A8FFFF
540000–547FFF
SA169
0
1
0
1
0
1
0
0
1
64/32
0A90000–0A9FFFF
548000–54FFFF
SA170
0
1
0
1
0
1
0
1
0
64/32
0AA0000–0AAFFFF
550000–557FFF
SA171
0
1
0
1
0
1
0
1
1
64/32
0AB0000–0ABFFFF
558000–55FFFF
SA172
0
1
0
1
0
1
1
0
0
64/32
0AC0000–0ACFFFF
560000–567FFF
SA173
0
1
0
1
0
1
1
0
1
64/32
0AD0000–0ADFFFF
568000–56FFFF
SA174
0
1
0
1
0
1
1
1
0
64/32
0AE0000–0AEFFFF
570000–577FFF
SA175
0
1
0
1
0
1
1
1
1
64/32
0AF0000–0AFFFFF
578000–57FFFF
SA176
0
1
0
1
1
0
0
0
0
64/32
0B00000–0B0FFFF
580000–587FFF
SA177
0
1
0
1
1
0
0
0
1
64/32
0B10000–0B1FFFF
588000–58FFFF
SA178
0
1
0
1
1
0
0
1
0
64/32
0B20000–0B2FFFF
590000–597FFF
SA179
0
1
0
1
1
0
0
1
1
64/32
0B30000–0B3FFFF
598000–59FFFF
SA180
0
1
0
1
1
0
1
0
0
64/32
0B40000–0B4FFFF
5A0000–5A7FFF
SA181
0
1
0
1
1
0
1
0
1
64/32
0B50000–0B5FFFF
5A8000–5AFFFF
SA182
0
1
0
1
1
0
1
1
0
64/32
0B60000–0B6FFFF
5B0000–5B7FFF
SA183
0
1
0
1
1
0
1
1
1
64/32
0B70000–0B7FFFF
5B8000–5BFFFF
SA184
0
1
0
1
1
1
0
0
0
64/32
0B80000–0B8FFFF
5C0000–5C7FFF
SA185
0
1
0
1
1
1
0
0
1
64/32
0B90000–0B9FFFF
5C8000–5CFFFF
SA186
0
1
0
1
1
1
0
1
0
64/32
0BA0000–0BAFFFF
5D0000–5D7FFF
SA187
0
1
0
1
1
1
0
1
1
64/32
0BB0000–0BBFFFF
5D8000–5DFFFF
SA188
0
1
0
1
1
1
1
0
0
64/32
0BC0000–0BCFFFF
5E0000–5E7FFF
SA189
0
1
0
1
1
1
1
0
1
64/32
0BD0000–0BDFFFF
5E8000–5EFFFF
SA190
0
1
0
1
1
1
1
1
0
64/32
0BE0000–0BEFFFF
5F0000–5F7FFF
September 15, 2003
Am29LV256M
15
D A T A S H E E T
Table 2. Sector Address Table (Continued)
Sector
16
A23–A15
Sector Size
(Kbytes/Kwords)
8-bit
Address Range
(in hexadecimal)
16-bit
Address Range
(in hexadecimal)
SA191
0
1
0
1
1
1
1
1
1
64/32
0BF0000–0BFFFFF
5F8000–5FFFFF
SA192
0
1
1
0
0
0
0
0
0
64/32
0C00000–0C0FFFF
600000–607FFF
SA193
0
1
1
0
0
0
0
0
1
64/32
0C10000–0C1FFFF
608000–60FFFF
SA194
0
1
1
0
0
0
0
1
0
64/32
0C20000–0C2FFFF
610000–617FFF
SA195
0
1
1
0
0
0
0
1
1
64/32
0C30000–0C3FFFF
618000–61FFFF
SA196
0
1
1
0
0
0
1
0
0
64/32
0C40000–0C4FFFF
620000–627FFF
SA197
0
1
1
0
0
0
1
0
1
64/32
0C50000–0C5FFFF
628000–62FFFF
SA198
0
1
1
0
0
0
1
1
0
64/32
0C60000–0C6FFFF
630000–637FFF
SA199
0
1
1
0
0
0
1
1
1
64/32
0C70000–0C7FFFF
638000–63FFFF
SA200
0
1
1
0
0
1
0
0
0
64/32
0C80000–0C8FFFF
640000–647FFF
SA201
0
1
1
0
0
1
0
0
1
64/32
0C90000–0C9FFFF
648000–64FFFF
SA202
0
1
1
0
0
1
0
1
0
64/32
0CA0000–0CAFFFF
650000–657FFF
SA203
0
1
1
0
0
1
0
1
1
64/32
0CB0000–0CBFFFF
658000–65FFFF
SA204
0
1
1
0
0
1
1
0
0
64/32
0CC0000–0CCFFFF
660000–667FFF
SA205
0
1
1
0
0
1
1
0
1
64/32
0CD0000–0CDFFFF
668000–66FFFF
SA206
0
1
1
0
0
1
1
1
0
64/32
0CE0000–0CEFFFF
670000–677FFF
SA207
0
1
1
0
0
1
1
1
1
64/32
0CF0000–0CFFFFF
678000–67FFFF
SA208
0
1
1
0
1
0
0
0
0
64/32
0D00000–0D0FFFF
680000–687FFF
SA209
0
1
1
0
1
0
0
0
1
64/32
0D10000–0D1FFFF
688000–68FFFF
SA210
0
1
1
0
1
0
0
1
0
64/32
0D20000–0D2FFFF
690000–697FFF
SA211
0
1
1
0
1
0
0
1
1
64/32
0D30000–0D3FFFF
698000–69FFFF
SA212
0
1
1
0
1
0
1
0
0
64/32
0D40000–0D4FFFF
6A0000–6A7FFF
SA213
0
1
1
0
1
0
1
0
1
64/32
0D50000–0D5FFFF
6A8000–6AFFFF
SA214
0
1
1
0
1
0
1
1
0
64/32
0D60000–0D6FFFF
6B0000–6B7FFF
SA215
0
1
1
0
1
0
1
1
1
64/32
0D70000–0D7FFFF
6B8000–6BFFFF
SA216
0
1
1
0
1
1
0
0
0
64/32
0D80000–0D8FFFF
6C0000–6C7FFF
SA217
0
1
1
0
1
1
0
0
1
64/32
0D90000–0D9FFFF
6C8000–6CFFFF
SA218
0
1
1
0
1
1
0
1
0
64/32
0DA0000–0DAFFFF
6D0000–6D7FFF
SA219
0
1
1
0
1
1
0
1
1
64/32
0DB0000–0DBFFFF
6D8000–6DFFFF
SA220
0
1
1
0
1
1
1
0
0
64/32
0DC0000–0DCFFFF
6E0000–6E7FFF
SA221
0
1
1
0
1
1
1
0
1
64/32
0DD0000–0DDFFFF
6E8000–6EFFFF
SA222
0
1
1
0
1
1
1
1
0
64/32
0DE0000–0DEFFFF
6F0000–6F7FFF
SA223
0
1
1
0
1
1
1
1
1
64/32
0DF0000–0DFFFFF
6F8000–6FFFFF
SA224
0
1
1
1
0
0
0
0
0
64/32
0E00000–0E0FFFF
700000–707FFF
SA225
0
1
1
1
0
0
0
0
1
64/32
0E10000–0E1FFFF
708000–70FFFF
SA226
0
1
1
1
0
0
0
1
0
64/32
0E20000–0E2FFFF
710000–717FFF
SA227
0
1
1
1
0
0
0
1
1
64/32
0E30000–0E3FFFF
718000–71FFFF
SA228
0
1
1
1
0
0
1
0
0
64/32
0E40000–0E4FFFF
720000–727FFF
SA229
0
1
1
1
0
0
1
0
1
64/32
0E50000–0E5FFFF
728000–72FFFF
SA230
0
1
1
1
0
0
1
1
0
64/32
0E60000–0E6FFFF
730000–737FFF
SA231
0
1
1
1
0
0
1
1
1
64/32
0E70000–0E7FFFF
738000–73FFFF
SA232
0
1
1
1
0
1
0
0
0
64/32
0E80000–0E8FFFF
740000–747FFF
SA233
0
1
1
1
0
1
0
0
1
64/32
0E90000–0E9FFFF
748000–74FFFF
SA234
0
1
1
1
0
1
0
1
0
64/32
0EA0000–0EAFFFF
750000–757FFF
SA235
0
1
1
1
0
1
0
1
1
64/32
0EB0000–0EBFFFF
758000–75FFFF
SA236
0
1
1
1
0
1
1
0
0
64/32
0EC0000–0ECFFFF
760000–767FFF
SA237
0
1
1
1
0
1
1
0
1
64/32
0ED0000–0EDFFFF
768000–76FFFF
SA238
0
1
1
1
0
1
1
1
0
64/32
0EE0000–0EEFFFF
770000–777FFF
Am29LV256M
September 15, 2003
D A T A S H E E T
Table 2. Sector Address Table (Continued)
Sector
A23–A15
Sector Size
(Kbytes/Kwords)
8-bit
Address Range
(in hexadecimal)
16-bit
Address Range
(in hexadecimal)
SA239
0
1
1
1
0
1
1
1
1
64/32
0EF0000–0EFFFFF
778000–77FFFF
SA240
0
1
1
1
1
0
0
0
0
64/32
0F00000–0F0FFFF
780000–787FFF
SA241
0
1
1
1
1
0
0
0
1
64/32
0F10000–0F1FFFF
788000–78FFFF
SA242
0
1
1
1
1
0
0
1
0
64/32
0F20000–0F2FFFF
790000–797FFF
SA243
0
1
1
1
1
0
0
1
1
64/32
0F30000–0F3FFFF
798000–79FFFF
SA244
0
1
1
1
1
0
1
0
0
64/32
0F40000–0F4FFFF
7A0000–7A7FFF
SA245
0
1
1
1
1
0
1
0
1
64/32
0F50000–0F5FFFF
7A8000–7AFFFF
SA246
0
1
1
1
1
0
1
1
0
64/32
0F60000–0F6FFFF
7B0000–7B7FFF
SA247
0
1
1
1
1
0
1
1
1
64/32
0F70000–0F7FFFF
7B8000–7BFFFF
SA248
0
1
1
1
1
1
0
0
0
64/32
0F80000–0F8FFFF
7C0000–7C7FFF
SA249
0
1
1
1
1
1
0
0
1
64/32
0F90000–0F9FFFF
7C8000–7CFFFF
SA250
0
1
1
1
1
1
0
1
0
64/32
0FA0000–0FAFFFF
7D0000–7D7FFF
SA251
0
1
1
1
1
1
0
1
1
64/32
0FB0000–0FBFFFF
7D8000–7DFFFF
SA252
0
1
1
1
1
1
1
0
0
64/32
0FC0000–0FCFFFF
7E0000–7E7FFF
SA253
0
1
1
1
1
1
1
0
1
64/32
0FD0000–0FDFFFF
7E8000–7EFFFF
SA254
0
1
1
1
1
1
1
1
0
64/32
0FE0000–0FEFFFF
7F0000–7F7FFF
SA255
0
1
1
1
1
1
1
1
1
64/32
0FF0000–0FFFFFF
7F8000–7FFFFF
SA256
1
0
0
0
0
0
0
0
0
64/32
1000000–100FFFF
800000–807FFF
SA257
1
0
0
0
0
0
0
0
1
64/32
1010000–101FFFF
808000–80FFFF
SA258
1
0
0
0
0
0
0
1
0
64/32
1020000–102FFFF
810000–817FFF
SA259
1
0
0
0
0
0
0
1
1
64/32
1030000–103FFFF
818000–81FFFF
SA260
1
0
0
0
0
0
1
0
0
64/32
1040000–104FFFF
820000–827FFF
SA261
1
0
0
0
0
0
1
0
1
64/32
1050000–105FFFF
828000–82FFFF
SA262
1
0
0
0
0
0
1
1
0
64/32
1060000–106FFFF
830000–837FFF
SA263
1
0
0
0
0
0
1
1
1
64/32
1070000–107FFFF
838000–83FFFF
SA264
1
0
0
0
0
1
0
0
0
64/32
1080000–108FFFF
840000–847FFF
SA265
1
0
0
0
0
1
0
0
1
64/32
1090000–109FFFF
848000–84FFFF
SA266
1
0
0
0
0
1
0
1
0
64/32
10A0000–10AFFFF
850000–857FFF
SA267
1
0
0
0
0
1
0
1
1
64/32
10B0000–10BFFFF
858000–85FFFF
SA268
1
0
0
0
0
1
1
0
0
64/32
10C0000–10CFFFF
860000–867FFF
SA269
1
0
0
0
0
1
1
0
1
64/32
10D0000–10DFFFF
868000–86FFFF
SA270
1
0
0
0
0
1
1
1
0
64/32
10E0000–10EFFFF
870000–877FFF
SA271
1
0
0
0
0
1
1
1
1
64/32
10F0000–10FFFFF
878000–87FFFF
SA272
1
0
0
0
1
0
0
0
0
64/32
1100000–110FFFF
880000–887FFF
SA273
1
0
0
0
1
0
0
0
1
64/32
1110000–111FFFF
888000–88FFFF
SA274
1
0
0
0
1
0
0
1
0
64/32
1120000–112FFFF
890000–897FFF
SA275
1
0
0
0
1
0
0
1
1
64/32
1130000–113FFFF
898000–89FFFF
SA276
1
0
0
0
1
0
1
0
0
64/32
1140000–114FFFF
8A0000–8A7FFF
SA277
1
0
0
0
1
0
1
0
1
64/32
1150000–115FFFF
8A8000–8AFFFF
SA278
1
0
0
0
1
0
1
1
0
64/32
1160000–116FFFF
8B0000–8B7FFF
SA279
1
0
0
0
1
0
1
1
1
64/32
1170000–117FFFF
8B8000–8BFFFF
SA280
1
0
0
0
1
1
0
0
0
64/32
1180000–118FFFF
8C0000–8C7FFF
SA281
1
0
0
0
1
1
0
0
1
64/32
1190000–119FFFF
8C8000–8CFFFF
SA282
1
0
0
0
1
1
0
1
0
64/32
11A0000–11AFFFF
8D0000–8D7FFF
SA283
1
0
0
0
1
1
0
1
1
64/32
11B0000–11BFFFF
8D8000–8DFFFF
SA284
1
0
0
0
1
1
1
0
0
64/32
11C0000–11CFFFF
8E0000–8E7FFF
SA285
1
0
0
0
1
1
1
0
1
64/32
11D0000–11DFFFF
8E8000–8EFFFF
SA286
1
0
0
0
1
1
1
1
0
64/32
11E0000–11EFFFF
8F0000–8F7FFF
September 15, 2003
Am29LV256M
17
D A T A S H E E T
Table 2. Sector Address Table (Continued)
Sector
18
A23–A15
Sector Size
(Kbytes/Kwords)
8-bit
Address Range
(in hexadecimal)
16-bit
Address Range
(in hexadecimal)
SA287
1
0
0
0
1
1
1
1
1
64/32
11F0000–11FFFFF
8F8000–8FFFFF
SA288
1
0
0
1
0
0
0
0
0
64/32
1200000–120FFFF
900000–907FFF
SA289
1
0
0
1
0
0
0
0
1
64/32
1210000–121FFFF
908000–90FFFF
SA290
1
0
0
1
0
0
0
1
0
64/32
1220000–122FFFF
910000–917FFF
SA291
1
0
0
1
0
0
0
1
1
64/32
1230000–123FFFF
918000–91FFFF
SA292
1
0
0
1
0
0
1
0
0
64/32
1240000–124FFFF
920000–927FFF
SA293
1
0
0
1
0
0
1
0
1
64/32
1250000–125FFFF
928000–92FFFF
SA294
1
0
0
1
0
0
1
1
0
64/32
1260000–126FFFF
930000–937FFF
SA295
1
0
0
1
0
0
1
1
1
64/32
1270000–127FFFF
938000–93FFFF
SA296
1
0
0
1
0
1
0
0
0
64/32
1280000–128FFFF
940000–947FFF
SA297
1
0
0
1
0
1
0
0
1
64/32
1290000–129FFFF
948000–94FFFF
SA298
1
0
0
1
0
1
0
1
0
64/32
12A0000–12AFFFF
950000–957FFF
SA299
1
0
0
1
0
1
0
1
1
64/32
12B0000–12BFFFF
958000–95FFFF
SA300
1
0
0
1
0
1
1
0
0
64/32
12C0000–12CFFFF
960000–967FFF
SA301
1
0
0
1
0
1
1
0
1
64/32
12D0000–12DFFFF
968000–96FFFF
SA302
1
0
0
1
0
1
1
1
0
64/32
12E0000–12EFFFF
970000–977FFF
SA303
1
0
0
1
0
1
1
1
1
64/32
12F0000–12FFFFF
978000–97FFFF
SA304
1
0
0
1
1
0
0
0
0
64/32
1300000–130FFFF
980000–987FFF
SA305
1
0
0
1
1
0
0
0
1
64/32
1310000–131FFFF
988000–98FFFF
SA306
1
0
0
1
1
0
0
1
0
64/32
1320000–132FFFF
990000–997FFF
SA307
1
0
0
1
1
0
0
1
1
64/32
1330000–133FFFF
998000–99FFFF
SA308
1
0
0
1
1
0
1
0
0
64/32
1340000–134FFFF
9A0000–9A7FFF
SA309
1
0
0
1
1
0
1
0
1
64/32
1350000–135FFFF
9A8000–9AFFFF
SA310
1
0
0
1
1
0
1
1
0
64/32
1360000–136FFFF
9B0000–9B7FFF
SA311
1
0
0
1
1
0
1
1
1
64/32
1370000–137FFFF
9B8000–9BFFFF
SA312
1
0
0
1
1
1
0
0
0
64/32
1380000–138FFFF
9C0000–9C7FFF
SA313
1
0
0
1
1
1
0
0
1
64/32
1390000–139FFFF
9C8000–9CFFFF
SA314
1
0
0
1
1
1
0
1
0
64/32
13A0000–13AFFFF
9D0000–9D7FFF
SA315
1
0
0
1
1
1
0
1
1
64/32
13B0000–13BFFFF
9D8000–9DFFFF
SA316
1
0
0
1
1
1
1
0
0
64/32
13C0000–13CFFFF
9E0000–9E7FFF
SA317
1
0
0
1
1
1
1
0
1
64/32
13D0000–13DFFFF
9E8000–9EFFFF
SA318
1
0
0
1
1
1
1
1
0
64/32
13E0000–13EFFFF
9F0000–9F7FFF
SA319
1
0
0
1
1
1
1
1
1
64/32
13F0000–13FFFFF
9F8000–9FFFFF
SA320
1
0
1
0
0
0
0
0
0
64/32
1400000–140FFFF
A00000–A07FFF
SA321
1
0
1
0
0
0
0
0
1
64/32
1410000–141FFFF
A08000–A0FFFF
SA322
1
0
1
0
0
0
0
1
0
64/32
1420000–142FFFF
A10000–A17FFF
SA323
1
0
1
0
0
0
0
1
1
64/32
1430000–143FFFF
A18000–A1FFFF
SA324
1
0
1
0
0
0
1
0
0
64/32
1440000–144FFFF
A20000–A27FFF
SA325
1
0
1
0
0
0
1
0
1
64/32
1450000–145FFFF
A28000–A2FFFF
SA326
1
0
1
0
0
0
1
1
0
64/32
1460000–146FFFF
A30000–A37FFF
SA327
1
0
1
0
0
0
1
1
1
64/32
1470000–147FFFF
A38000–A3FFFF
SA328
1
0
1
0
0
1
0
0
0
64/32
1480000–148FFFF
A40000–A47FFF
SA329
1
0
1
0
0
1
0
0
1
64/32
1490000–149FFFF
A48000–A4FFFF
SA330
1
0
1
0
0
1
0
1
0
64/32
14A0000–14AFFFF
A50000–A57FFF
SA331
1
0
1
0
0
1
0
1
1
64/32
14B0000–14BFFFF
A58000–A5FFFF
SA332
1
0
1
0
0
1
1
0
0
64/32
14C0000–14CFFFF
A60000–A67FFF
SA333
1
0
1
0
0
1
1
0
1
64/32
14D0000–14DFFFF
A68000–A6FFFF
SA334
1
0
1
0
0
1
1
1
0
64/32
14E0000–14EFFFF
A70000–A77FFF
Am29LV256M
September 15, 2003
D A T A S H E E T
Table 2. Sector Address Table (Continued)
Sector
A23–A15
Sector Size
(Kbytes/Kwords)
8-bit
Address Range
(in hexadecimal)
16-bit
Address Range
(in hexadecimal)
SA335
1
0
1
0
0
1
1
1
1
64/32
14F0000–14FFFFF
A78000–A7FFFF
SA336
1
0
1
0
1
0
0
0
0
64/32
1500000–150FFFF
A80000–A87FFF
SA337
1
0
1
0
1
0
0
0
1
64/32
1510000–151FFFF
A88000–A8FFFF
SA338
1
0
1
0
1
0
0
1
0
64/32
1520000–152FFFF
A90000–A97FFF
SA339
1
0
1
0
1
0
0
1
1
64/32
1530000–153FFFF
A98000–A9FFFF
SA340
1
0
1
0
1
0
1
0
0
64/32
1540000–154FFFF
AA0000–AA7FFF
SA341
1
0
1
0
1
0
1
0
1
64/32
1550000–155FFFF
AA8000–AAFFFF
SA342
1
0
1
0
1
0
1
1
0
64/32
1560000–156FFFF
AB0000–AB7FFF
SA343
1
0
1
0
1
0
1
1
1
64/32
1570000–157FFFF
AB8000–ABFFFF
SA344
1
0
1
0
1
1
0
0
0
64/32
1580000–158FFFF
AC0000–AC7FFF
SA345
1
0
1
0
1
1
0
0
1
64/32
1590000–159FFFF
AC8000–ACFFFF
SA346
1
0
1
0
1
1
0
1
0
64/32
15A0000–15AFFFF
AD0000–AD7FFF
SA347
1
0
1
0
1
1
0
1
1
64/32
15B0000–15BFFFF
AD8000–ADFFFF
SA348
1
0
1
0
1
1
1
0
0
64/32
15C0000–15CFFFF
AE0000–AE7FFF
SA349
1
0
1
0
1
1
1
0
1
64/32
15D0000–15DFFFF
AE8000–AEFFFF
SA350
1
0
1
0
1
1
1
1
0
64/32
15E0000–15EFFFF
AF0000–AF7FFF
SA351
1
0
1
0
1
1
1
1
1
64/32
15F0000–15FFFFF
AF8000–AFFFFF
SA352
1
0
1
1
0
0
0
0
0
64/32
1600000–160FFFF
B00000–B07FFF
SA353
1
0
1
1
0
0
0
0
1
64/32
1610000–161FFFF
B08000–B0FFFF
SA354
1
0
1
1
0
0
0
1
0
64/32
1620000–162FFFF
B10000–B17FFF
SA355
1
0
1
1
0
0
0
1
1
64/32
1630000–163FFFF
B18000–B1FFFF
SA356
1
0
1
1
0
0
1
0
0
64/32
1640000–164FFFF
B20000–B27FFF
SA357
1
0
1
1
0
0
1
0
1
64/32
1650000–165FFFF
B28000–B2FFFF
SA358
1
0
1
1
0
0
1
1
0
64/32
1660000–166FFFF
B30000–B37FFF
SA359
1
0
1
1
0
0
1
1
1
64/32
1670000–167FFFF
B38000–B3FFFF
SA360
1
0
1
1
0
1
0
0
0
64/32
1680000–168FFFF
B40000–B47FFF
SA361
1
0
1
1
0
1
0
0
1
64/32
1690000–169FFFF
B48000–B4FFFF
SA362
1
0
1
1
0
1
0
1
0
64/32
16A0000–16AFFFF
B50000–B57FFF
SA363
1
0
1
1
0
1
0
1
1
64/32
16B0000–16BFFFF
B58000–B5FFFF
SA364
1
0
1
1
0
1
1
0
0
64/32
16C0000–16CFFFF
B60000–B67FFF
SA365
1
0
1
1
0
1
1
0
1
64/32
16D0000–16DFFFF
B68000–B6FFFF
SA366
1
0
1
1
0
1
1
1
0
64/32
16E0000–16EFFFF
B70000–B77FFF
SA367
1
0
1
1
0
1
1
1
1
64/32
16F0000–16FFFFF
B78000–B7FFFF
SA368
1
0
1
1
1
0
0
0
0
64/32
1700000–170FFFF
B80000–B87FFF
SA369
1
0
1
1
1
0
0
0
1
64/32
1710000–171FFFF
B88000–B8FFFF
SA370
1
0
1
1
1
0
0
1
0
64/32
1720000–172FFFF
B90000–B97FFF
SA371
1
0
1
1
1
0
0
1
1
64/32
1730000–173FFFF
B98000–B9FFFF
SA372
1
0
1
1
1
0
1
0
0
64/32
1740000–174FFFF
BA0000–BA7FFF
SA373
1
0
1
1
1
0
1
0
1
64/32
1750000–175FFFF
BA8000–BAFFFF
SA374
1
0
1
1
1
0
1
1
0
64/32
1760000–176FFFF
BB0000–BB7FFF
SA375
1
0
1
1
1
0
1
1
1
64/32
1770000–177FFFF
BB8000–BBFFFF
SA376
1
0
1
1
1
1
0
0
0
64/32
1780000–178FFFF
BC0000–BC7FFF
SA377
1
0
1
1
1
1
0
0
1
64/32
1790000–179FFFF
BC8000–BCFFFF
SA378
1
0
1
1
1
1
0
1
0
64/32
17A0000–17AFFFF
BD0000–BD7FFF
SA379
1
0
1
1
1
1
0
1
1
64/32
17B0000–17BFFFF
BD8000–BDFFFF
SA380
1
0
1
1
1
1
1
0
0
64/32
17C0000–17CFFFF
BE0000–BE7FFF
SA381
1
0
1
1
1
1
1
0
1
64/32
17D0000–17DFFFF
BE8000–BEFFFF
SA382
1
0
1
1
1
1
1
1
0
64/32
17E0000–17EFFFF
BF0000–BF7FFF
September 15, 2003
Am29LV256M
19
D A T A S H E E T
Table 2. Sector Address Table (Continued)
Sector
20
A23–A15
Sector Size
(Kbytes/Kwords)
8-bit
Address Range
(in hexadecimal)
16-bit
Address Range
(in hexadecimal)
SA383
1
0
1
1
1
1
1
1
1
64/32
17F0000–17FFFFF
BF8000–BFFFFF
SA384
1
1
0
0
0
0
0
0
0
64/32
1800000–180FFFF
C00000–C07FFF
SA385
1
1
0
0
0
0
0
0
1
64/32
1810000–181FFFF
C08000–C0FFFF
SA386
1
1
0
0
0
0
0
1
0
64/32
1820000–182FFFF
C10000–C17FFF
SA387
1
1
0
0
0
0
0
1
1
64/32
1830000–183FFFF
C18000–C1FFFF
SA388
1
1
0
0
0
0
1
0
0
64/32
1840000–184FFFF
C20000–C27FFF
SA389
1
1
0
0
0
0
1
0
1
64/32
1850000–185FFFF
C28000–C2FFFF
SA390
1
1
0
0
0
0
1
1
0
64/32
1860000–186FFFF
C30000–C37FFF
SA391
1
1
0
0
0
0
1
1
1
64/32
1870000–187FFFF
C38000–C3FFFF
SA392
1
1
0
0
0
1
0
0
0
64/32
1880000–188FFFF
C40000–C47FFF
SA393
1
1
0
0
0
1
0
0
1
64/32
1890000–189FFFF
C48000–C4FFFF
SA394
1
1
0
0
0
1
0
1
0
64/32
18A0000–18AFFFF
C50000–C57FFF
SA395
1
1
0
0
0
1
0
1
1
64/32
18B0000–18BFFFF
C58000–C5FFFF
SA396
1
1
0
0
0
1
1
0
0
64/32
18C0000–18CFFFF
C60000–C67FFF
SA397
1
1
0
0
0
1
1
0
1
64/32
18D0000–18DFFFF
C68000–C6FFFF
SA398
1
1
0
0
0
1
1
1
0
64/32
18E0000–18EFFFF
C70000–C77FFF
SA399
1
1
0
0
0
1
1
1
1
64/32
18F0000–18FFFFF
C78000–C7FFFF
SA400
1
1
0
0
1
0
0
0
0
64/32
1900000–190FFFF
C80000–C87FFF
SA401
1
1
0
0
1
0
0
0
1
64/32
1910000–191FFFF
C88000–C8FFFF
SA402
1
1
0
0
1
0
0
1
0
64/32
1920000–192FFFF
C90000–C97FFF
SA403
1
1
0
0
1
0
0
1
1
64/32
1930000–193FFFF
C98000–C9FFFF
SA404
1
1
0
0
1
0
1
0
0
64/32
1940000–194FFFF
CA0000–CA7FFF
SA405
1
1
0
0
1
0
1
0
1
64/32
1950000–195FFFF
CA8000–CAFFFF
SA406
1
1
0
0
1
0
1
1
0
64/32
1960000–196FFFF
CB0000–CB7FFF
SA407
1
1
0
0
1
0
1
1
1
64/32
1970000–197FFFF
CB8000–CBFFFF
SA408
1
1
0
0
1
1
0
0
0
64/32
1980000–198FFFF
CC0000–CC7FFF
SA409
1
1
0
0
1
1
0
0
1
64/32
1990000–199FFFF
CC8000–CCFFFF
SA410
1
1
0
0
1
1
0
1
0
64/32
19A0000–19AFFFF
CD0000–CD7FFF
SA411
1
1
0
0
1
1
0
1
1
64/32
19B0000–19BFFFF
CD8000–CDFFFF
SA412
1
1
0
0
1
1
1
0
0
64/32
19C0000–19CFFFF
CE0000–CE7FFF
SA413
1
1
0
0
1
1
1
0
1
64/32
19D0000–19DFFFF
CE8000–CEFFFF
SA414
1
1
0
0
1
1
1
1
0
64/32
19E0000–19EFFFF
CF0000–CF7FFF
SA415
1
1
0
0
1
1
1
1
1
64/32
19F0000–19FFFFF
CF8000–CFFFFF
SA416
1
1
0
1
0
0
0
0
0
64/32
1A00000–1A0FFFF
D00000–D07FFF
SA417
1
1
0
1
0
0
0
0
1
64/32
1A10000–1A1FFFF
D08000–D0FFFF
SA418
1
1
0
1
0
0
0
1
0
64/32
1A20000–1A2FFFF
D10000–D17FFF
SA419
1
1
0
1
0
0
0
1
1
64/32
1A30000–1A3FFFF
D18000–D1FFFF
SA420
1
1
0
1
0
0
1
0
0
64/32
1A40000–1A4FFFF
D20000–D27FFF
SA421
1
1
0
1
0
0
1
0
1
64/32
1A50000–1A5FFFF
D28000–D2FFFF
SA422
1
1
0
1
0
0
1
1
0
64/32
1A60000–1A6FFFF
D30000–D37FFF
SA423
1
1
0
1
0
0
1
1
1
64/32
1A70000–1A7FFFF
D38000–D3FFFF
SA424
1
1
0
1
0
1
0
0
0
64/32
1A80000–1A8FFFF
D40000–D47FFF
SA425
1
1
0
1
0
1
0
0
1
64/32
1A90000–1A9FFFF
D48000–D4FFFF
SA426
1
1
0
1
0
1
0
1
0
64/32
1AA0000–1AAFFFF
D50000–D57FFF
SA427
1
1
0
1
0
1
0
1
1
64/32
1AB0000–1ABFFFF
D58000–D5FFFF
SA428
1
1
0
1
0
1
1
0
0
64/32
1AC0000–1ACFFFF
D60000–D67FFF
SA429
1
1
0
1
0
1
1
0
1
64/32
1AD0000–1ADFFFF
D68000–D6FFFF
SA430
1
1
0
1
0
1
1
1
0
64/32
1AE0000–1AEFFFF
D70000–D77FFF
Am29LV256M
September 15, 2003
D A T A S H E E T
Table 2. Sector Address Table (Continued)
Sector
A23–A15
Sector Size
(Kbytes/Kwords)
8-bit
Address Range
(in hexadecimal)
16-bit
Address Range
(in hexadecimal)
SA431
1
1
0
1
0
1
1
1
1
64/32
1AF0000–1AFFFFF
D78000–D7FFFF
SA432
1
1
0
1
1
0
0
0
0
64/32
1B00000–1B0FFFF
D80000–D87FFF
SA433
1
1
0
1
1
0
0
0
1
64/32
1B10000–1B1FFFF
D88000–D8FFFF
SA434
1
1
0
1
1
0
0
1
0
64/32
1B20000–1B2FFFF
D90000–D97FFF
SA435
1
1
0
1
1
0
0
1
1
64/32
1B30000–1B3FFFF
D98000–D9FFFF
SA436
1
1
0
1
1
0
1
0
0
64/32
1B40000–1B4FFFF
DA0000–DA7FFF
SA437
1
1
0
1
1
0
1
0
1
64/32
1B50000–1B5FFFF
DA8000–DAFFFF
SA438
1
1
0
1
1
0
1
1
0
64/32
1B60000–1B6FFFF
DB0000–DB7FFF
SA439
1
1
0
1
1
0
1
1
1
64/32
1B70000–1B7FFFF
DB8000–DBFFFF
SA440
1
1
0
1
1
1
0
0
0
64/32
1B80000–1B8FFFF
DC0000–DC7FFF
SA441
1
1
0
1
1
1
0
0
1
64/32
1B90000–1B9FFFF
DC8000–DCFFFF
SA442
1
1
0
1
1
1
0
1
0
64/32
1BA0000–1BAFFFF
DD0000–DD7FFF
SA443
1
1
0
1
1
1
0
1
1
64/32
1BB0000–1BBFFFF
DD8000–DDFFFF
SA444
1
1
0
1
1
1
1
0
0
64/32
1BC0000–1BCFFFF
DE0000–DE7FFF
SA445
1
1
0
1
1
1
1
0
1
64/32
1BD0000–1BDFFFF
DE8000–DEFFFF
SA446
1
1
0
1
1
1
1
1
0
64/32
1BE0000–1BEFFFF
DF0000–DF7FFF
SA447
1
1
0
1
1
1
1
1
1
64/32
1BF0000–1BFFFFF
DF8000–DFFFFF
SA448
1
1
1
0
0
0
0
0
0
64/32
1C00000–1C0FFFF
E00000–E07FFF
SA449
1
1
1
0
0
0
0
0
1
64/32
1C10000–1C1FFFF
E08000–E0FFFF
SA450
1
1
1
0
0
0
0
1
0
64/32
1C20000–1C2FFFF
E10000–E17FFF
SA451
1
1
1
0
0
0
0
1
1
64/32
1C30000–1C3FFFF
E18000–E1FFFF
SA452
1
1
1
0
0
0
1
0
0
64/32
1C40000–1C4FFFF
E20000–E27FFF
SA453
1
1
1
0
0
0
1
0
1
64/32
1C50000–1C5FFFF
E28000–E2FFFF
SA454
1
1
1
0
0
0
1
1
0
64/32
1C60000–1C6FFFF
E30000–E37FFF
SA455
1
1
1
0
0
0
1
1
1
64/32
1C70000–1C7FFFF
E38000–E3FFFF
SA456
1
1
1
0
0
1
0
0
0
64/32
1C80000–1C8FFFF
E40000–E47FFF
SA457
1
1
1
0
0
1
0
0
1
64/32
1C90000–1C9FFFF
E48000–E4FFFF
SA458
1
1
1
0
0
1
0
1
0
64/32
1CA0000–1CAFFFF
E50000–E57FFF
SA459
1
1
1
0
0
1
0
1
1
64/32
1CB0000–1CBFFFF
E58000–E5FFFF
SA460
1
1
1
0
0
1
1
0
0
64/32
1CC0000–1CCFFFF
E60000–E67FFF
SA461
1
1
1
0
0
1
1
0
1
64/32
1CD0000–1CDFFFF
E68000–E6FFFF
SA462
1
1
1
0
0
1
1
1
0
64/32
1CE0000–1CEFFFF
E70000–E77FFF
SA463
1
1
1
0
0
1
1
1
1
64/32
1CF0000–1CFFFFF
E78000–E7FFFF
SA464
1
1
1
0
1
0
0
0
0
64/32
1D00000–1D0FFFF
E80000–E87FFF
SA465
1
1
1
0
1
0
0
0
1
64/32
1D10000–1D1FFFF
E88000–E8FFFF
SA466
1
1
1
0
1
0
0
1
0
64/32
1D20000–1D2FFFF
E90000–E97FFF
SA467
1
1
1
0
1
0
0
1
1
64/32
1D30000–1D3FFFF
E98000–E9FFFF
SA468
1
1
1
0
1
0
1
0
0
64/32
1D40000–1D4FFFF
EA0000–EA7FFF
SA469
1
1
1
0
1
0
1
0
1
64/32
1D50000–1D5FFFF
EA8000–EAFFFF
SA470
1
1
1
0
1
0
1
1
0
64/32
1D60000–1D6FFFF
EB0000–EB7FFF
SA471
1
1
1
0
1
0
1
1
1
64/32
1D70000–1D7FFFF
EB8000–EBFFFF
SA472
1
1
1
0
1
1
0
0
0
64/32
1D80000–1D8FFFF
EC0000–EC7FFF
SA473
1
1
1
0
1
1
0
0
1
64/32
1D90000–1D9FFFF
EC8000–ECFFFF
SA474
1
1
1
0
1
1
0
1
0
64/32
1DA0000–1DAFFFF
ED0000–ED7FFF
SA475
1
1
1
0
1
1
0
1
1
64/32
1DB0000–1DBFFFF
ED8000–EDFFFF
SA476
1
1
1
0
1
1
1
0
0
64/32
1DC0000–1DCFFFF
EE0000–EE7FFF
SA477
1
1
1
0
1
1
1
0
1
64/32
1DD0000–1DDFFFF
EE8000–EEFFFF
SA478
1
1
1
0
1
1
1
1
0
64/32
1DE0000–1DEFFFF
EF0000–EF7FFF
September 15, 2003
Am29LV256M
21
D A T A S H E E T
Table 2. Sector Address Table (Continued)
Sector
22
A23–A15
Sector Size
(Kbytes/Kwords)
8-bit
Address Range
(in hexadecimal)
16-bit
Address Range
(in hexadecimal)
SA479
1
1
1
0
1
1
1
1
1
64/32
1DF0000–1DFFFFF
EF8000–EFFFFF
SA480
1
1
1
1
0
0
0
0
0
64/32
1E00000–1E0FFFF
F00000–F07FFF
SA481
1
1
1
1
0
0
0
0
1
64/32
1E10000–1E1FFFF
F08000–F0FFFF
SA482
1
1
1
1
0
0
0
1
0
64/32
1E20000–1E2FFFF
F10000–F17FFF
SA483
1
1
1
1
0
0
0
1
1
64/32
1E30000–1E3FFFF
F18000–F1FFFF
SA484
1
1
1
1
0
0
1
0
0
64/32
1E40000–1E4FFFF
F20000–F27FFF
SA485
1
1
1
1
0
0
1
0
1
64/32
1E50000–1E5FFFF
F28000–F2FFFF
SA486
1
1
1
1
0
0
1
1
0
64/32
1E60000–1E6FFFF
F30000–F37FFF
SA487
1
1
1
1
0
0
1
1
1
64/32
1E70000–1E7FFFF
F38000–F3FFFF
SA488
1
1
1
1
0
1
0
0
0
64/32
1E80000–1E8FFFF
F40000–F47FFF
SA489
1
1
1
1
0
1
0
0
1
64/32
1E90000–1E9FFFF
F48000–F4FFFF
SA490
1
1
1
1
0
1
0
1
0
64/32
1EA0000–1EAFFFF
F50000–F57FFF
SA491
1
1
1
1
0
1
0
1
1
64/32
1EB0000–1EBFFFF
F58000–F5FFFF
SA492
1
1
1
1
0
1
1
0
0
64/32
1EC0000–1ECFFFF
F60000–F67FFF
SA493
1
1
1
1
0
1
1
0
1
64/32
1ED0000–1EDFFFF
F68000–F6FFFF
SA494
1
1
1
1
0
1
1
1
0
64/32
1EE0000–1EEFFFF
F70000–F77FFF
SA495
1
1
1
1
0
1
1
1
1
64/32
1EF0000–1EFFFFF
F78000–F7FFFF
SA496
1
1
1
1
1
0
0
0
0
64/32
1F00000–1F0FFFF
F80000–F87FFF
SA497
1
1
1
1
1
0
0
0
1
64/32
1F10000–1F1FFFF
F88000–F8FFFF
SA498
1
1
1
1
1
0
0
1
0
64/32
1F20000–1F2FFFF
F90000–F97FFF
SA499
1
1
1
1
1
0
0
1
1
64/32
1F30000–1F3FFFF
F98000–F9FFFF
SA500
1
1
1
1
1
0
1
0
0
64/32
1F40000–1F4FFFF
FA0000–FA7FFF
SA501
1
1
1
1
1
0
1
0
1
64/32
1F50000–1F5FFFF
FA8000–FAFFFF
SA502
1
1
1
1
1
0
1
1
0
64/32
1F60000–1F6FFFF
FB0000–FB7FFF
SA503
1
1
1
1
1
0
1
1
1
64/32
1F70000–1F7FFFF
FB8000–FBFFFF
SA504
1
1
1
1
1
1
0
0
0
64/32
1F80000–1F8FFFF
FC0000–FC7FFF
SA505
1
1
1
1
1
1
0
0
1
64/32
1F90000–1F9FFFF
FC8000–FCFFFF
SA506
1
1
1
1
1
1
0
1
0
64/32
1FA0000–1FAFFFF
FD0000–FD7FFF
SA507
1
1
1
1
1
1
0
1
1
64/32
1FB0000–1FBFFFF
FD8000–FDFFFF
SA508
1
1
1
1
1
1
1
0
0
64/32
1FC0000–1FCFFFF
FE0000–FE7FFF
SA509
1
1
1
1
1
1
1
0
1
64/32
1FD0000–1FDFFFF
FE8000–FEFFFF
SA510
1
1
1
1
1
1
1
1
0
64/32
1FE0000–1FEFFFF
FF0000–FF7FFF
SA511
1
1
1
1
1
1
1
1
1
64/32
1FF0000–1FFFFFF
FF8000–FFFFFF
Am29LV256M
September 15, 2003
D A T A S H E E T
Autoselect Mode
In addition, when verifying sector protection, the sector
address must appear on the appropriate highest order
address bits (see Table 2). Table 3 shows the remaining address bits that are don’t care. When all necessary bits have been set as required, the programming
equipment may then read the corresponding identifier
code on DQ7–DQ0.
The autoselect mode provides manufacturer and device identification, and sector group protection verification, through identifier codes output on DQ7–DQ0.
This mode is primarily intended for programming
equipment to automatically match a device to be programmed with its corresponding programming algorithm. However, the autoselect codes can also be
accessed in-system through the command register.
To access the autoselect codes in-system, the host
system can issue the autoselect command via the
command register, as shown in Tables 11 and 12. This
method does not require VID. Refer to the Autoselect
Command Sequence section for more information.
When using programming equipment, the autoselect
mode requires VID on address pin A9. Address pins
A6, A3, A2, A1, and A0 must be as shown in Table 3.
Table 3. Autoselect Codes, (High Voltage Method)
CE#
Manufacturer ID: AMD
L
Device ID
Description
OE# WE#
L
H
X
A8
to
A7
A6
A5
to
A4
A3
to
A2
A1
A0
X
VID
X
L
X
L
L
L
00
X
01h
L
L
H
22
X
7Eh
X
VID
H
H
L
22
X
12h
H
H
H
22
X
01h
Cycle 1
Cycle 2
L
L
H
X
DQ8 to DQ15
A9
A22 A14
to
to
A15 A10
X
L
X
Cycle 3
BYTE# BYTE#
= VIH
= VIL
DQ7 to DQ0
Sector Group
Protection Verification
L
L
H
SA
X
VID
X
L
X
L
H
L
X
X
01h (protected),
00h (unprotected)
SecSi Sector Indicator
Bit (DQ7), WP#
protects highest
address sector
L
L
H
X
X
VID
X
L
X
L
H
H
X
X
98h (factory locked),
18h (not factory locked)
SecSi Sector Indicator
Bit (DQ7), WP#
protects lowest
address sector
L
L
H
X
X
VID
X
L
X
L
H
H
X
X
88h (factory locked),
08h (not factory locked)
Legend: L = Logic Low = VIL, H = Logic High = VIH, SA = Sector Address, X = Don’t care.
September 15, 2003
Am29LV256M
23
D A T A S H E E T
Sector Group Protection and Unprotection
Sector Group
A23–A15
The hardware sector group protection feature disables
both program and erase operations in any sector
group. The hardware sector group unprotection feature re-enables both program and erase operations in
previously protected sector groups. Sector group protection/unprotection can be implemented via two
methods.
SA68–SA71
0010001xx
SA72–SA75
0010010xx
SA76–SA79
0010011xx
SA80–SA83
0010100xx
SA84–SA87
0010101xx
SA88–SA91
0010110xx
Sector group protection/unprotection requires VID on
the RESET# pin only, and can be implemented either
in-system or via programming equipment. Figure 2
shows the algorithms and Figure 23 shows the timing
diagram. For sector group unprotect, all unprotected
sector groups must first be protected prior to the first
sector group unprotect write cycle. Note that the sector group unprotect algorithm unprotects all sector
groups in parallel. All previously protected sector
groups must be individually re-protected.
SA92–SA95
0010111xx
The device is shipped with all sector groups unprotected. AMD offers the option of programming and
protecting sector groups at its factory prior to shipping
the device through AMD’s ExpressFlash™ Service.
Contact an AMD representative for details.
It is possible to determine whether a sector group is
protected or unprotected. See the Autoselect Mode
section for details.
Table 4. Sector Group Protection/Unprotection
Address Table
24
Sector Group
A23–A15
SA0
000000000
SA1
000000001
SA2
000000010
SA3
000000011
SA4–SA7
0000001xx
SA8–SA11
0000010xx
SA12–SA15
0000011xx
SA16–SA19
0000100xx
SA20–SA23
0000101xx
SA24–SA27
0000110xx
SA28–SA31
0000111xx
SA32–SA35
0001000xx
SA36–SA39
0001001xx
SA40–SA43
0001010xx
SA44–SA47
0001011xx
SA48–SA51
0001100xx
SA52–SA55
0001101xx
SA56–SA59
0001110xx
SA60–SA63
0001111xx
SA64–SA67
0010000xx
Am29LV256M
SA96–SA99
0011000xx
SA100–SA103
0011001xx
SA104–SA107
0011010xx
SA108–SA111
0011011xx
SA112–SA115
0011100xx
SA116–SA119
0011101xx
SA120–SA123
0011110xx
SA124–SA127
0011111xx
SA128–SA131
0100000xx
SA132–SA135
0100001xx
SA136–SA139
0100010xx
SA140–SA143
0100011xx
SA144–SA147
0100100xx
SA148–SA151
0100101xx
SA152–SA155
0100110xx
SA156–SA159
0100111xx
SA160–SA163
0101000xx
SA164–SA167
0101001xx
SA168–SA171
0101010xx
SA172–SA175
0101011xx
SA176–SA179
0101100xx
SA180–SA183
0101101xx
SA184–SA187
0101110xx
SA188–SA191
0101111xx
SA192–SA195
0110000xx
SA196–SA199
0110001xx
SA200–SA203
0110010xx
SA204–SA207
0110011xx
SA208–SA211
0110100xx
SA212–SA215
0110101xx
SA216–SA219
0110110xx
SA220–SA223
0110111xx
SA224–SA227
0111000xx
SA228–SA231
0111001xx
SA232–SA235
0111010xx
SA236–SA239
0111011xx
SA240–SA243
0111100xx
SA244–SA247
0111101xx
September 15, 2003
D A T A S H E E T
Sector Group
A23–A15
Sector Group
A23–A15
SA248–SA251
0111110xx
SA428–SA431
1101011xx
SA252–SA255
0111111xx
SA432–SA435
1101100xx
SA256–SA259
1000000xx
SA436–SA439
1101101xx
SA260–SA263
1000001xx
SA440–SA443
1101110xx
SA264–SA267
1000010xx
SA444–SA447
1101111xx
SA268–SA271
1000011xx
SA448–SA451
1110000xx
SA272–SA275
1000100xx
SA452–SA455
1110001xx
SA276–SA279
1000101xx
SA456–SA459
1110010xx
SA280–SA283
1000110xx
SA460–SA463
1110011xx
SA284–SA287
1000111xx
SA464–SA467
1110100xx
SA288–SA291
1001000xx
SA468–SA471
1110101xx
SA292–SA295
1001001xx
SA472–SA475
1110110xx
SA296–SA299
1001010xx
SA476–SA479
1110111xx
SA300–SA303
1001011xx
SA480–SA483
1111000xx
SA304–SA307
1001100xx
SA484–SA487
1111001xx
SA308–SA311
1001101xx
SA488–SA491
1111010xx
SA312–SA315
1001110xx
SA492–SA495
1111011xx
SA316–SA319
1001111xx
SA496–SA499
1111100xx
SA320–SA323
1010000xx
SA500–SA503
1111101xx
SA324–SA327
1010001xx
SA504–SA507
1111110xx
SA328–SA331
1010010xx
SA508
111111100
SA332–SA335
1010011xx
SA509
111111101
SA336–SA339
1010100xx
SA510
111111110
SA340–SA343
1010101xx
SA511
111111111
SA344–SA347
1010110xx
SA348–SA351
1010111xx
SA352–SA355
1011000xx
SA356–SA359
1011001xx
SA360–SA363
1011010xx
SA364–SA367
1011011xx
SA368–SA371
1011100xx
SA372–SA375
1011101xx
SA376–SA379
1011110xx
SA380–SA383
1011111xx
SA384–SA387
1100000xx
SA388–SA391
1100001xx
SA392–SA395
1100010xx
SA396–SA399
1100011xx
SA400–SA403
1100100xx
SA404–SA407
1100101xx
SA408–SA411
1100110xx
SA412–SA415
1100111xx
SA416–SA419
1101000xx
SA420–SA423
1101001xx
SA424–SA427
1101010xx
September 15, 2003
Am29LV256M
25
D A T A S H E E T
Write Protect (WP#)
The Write Protect function provides a hardware
method of protecting the first or last sector without
using V ID. Write Protect is one of two functions provided by the WP#/ACC input.
START
If the system asserts VIL on the WP#/ACC pin, the device disables program and erase functions in the first
or last sector independently of whether those sectors
were protected or unprotected using the method described in “Sector Group Protection and Unprotection”.
Note that if WP#/ACC is at VIL when the device is in
the standby mode, the maximum input load current is
increased. See the table in “DC Characteristics”.
RESET# = VID
(Note 1)
Perform Erase or
Program Operations
RESET# = VIH
If the system asserts VIH on the WP#/ACC pin, the device reverts to whether the first or last sector was previously set to be protected or unprotected using the
method described in “Sector Group Protection and
Unprotection”. Note that WP# has an internal pullup;
when unconnected, WP# is at VIH.
Temporary Sector Group Unprotect
This feature allows temporary unprotection of previously protected sector groups to change data in-system. The Sector Group Unprotect mode is activated by
setting the RESET# pin to VID. During this mode, formerly protected sector groups can be programmed or
erased by selecting the sector addresses. Once VID is
removed from the RESET# pin, all the previously protected sector groups are protected again. Figure 1
shows the algorithm, and Figure 22 shows the timing
diagrams, for this feature.
26
Temporary Sector Group
Unprotect Completed
(Note 2)
Notes:
1. All protected sector groups unprotected (If WP# = VIL,
the first or last sector will remain protected).
2. All previously protected sector groups are protected
once again.
Am29LV256M
Figure 1. Temporary Sector
Group Unprotect Operation
September 15, 2003
D A T A S H E E T
START
START
PLSCNT = 1
RESET# = VID
Wait 1 µs
Temporary Sector
Group Unprotect
Mode
No
PLSCNT = 1
Protect all sector
groups: The indicated
portion of the sector
group protect algorithm
must be performed for all
unprotected sector
groups prior to issuing
the first sector group
unprotect address
RESET# = VID
Wait 1 µs
First Write
Cycle = 60h?
First Write
Cycle = 60h?
Temporary Sector
Group Unprotect
Mode
Yes
Yes
Set up sector
group address
No
Sector Group Protect:
Write 60h to sector
group address with
A6 = 0, A1 = 1,
A0 = 0
All sector
groups
protected?
Yes
Set up first sector
group address
Sector Group
Unprotect:
Write 60h to sector
group address with
A6 = 1, A1 = 1,
A0 = 0
Wait 150 µs
Increment
PLSCNT
No
Verify Sector Group
Protect: Write 40h
to sector group
address twith A6 = 0,
A1 = 1, A0 = 0
Reset
PLSCNT = 1
Wait 15 ms
Read from
sector group address
with A6 = 0,
A1 = 1, A0 = 0
Verify Sector Group
Unprotect: Write
40h to sector group
address with
A6 = 1, A1 = 1,
A0 = 0
Increment
PLSCNT
No
No
PLSCNT
= 25?
Read from
sector group
address with A6 = 1,
A1 = 1, A0 = 0
Data = 01h?
Yes
No
Yes
Device failed
Protect
another
sector group?
Yes
PLSCNT
= 1000?
No
Yes
Remove VID
from RESET#
Device failed
Write reset
command
Sector Group
Protect
Algorithm
Sector Group
Protect complete
Set up
next sector group
address
No
Data = 00h?
Yes
Last sector
group
verified?
No
Yes
Sector Group
Unprotect
Algorithm
Remove VID
from RESET#
Write reset
command
Sector Group
Unprotect complete
Figure 2. In-System Sector Group Protect/Unprotect Algorithms
September 15, 2003
Am29LV256M
27
D A T A S H E E T
SecSi (Secured Silicon) Sector Flash
Memory Region
Customer Lockable: SecSi Sector NOT
Programmed or Protected At the Factory
The SecSi (Secured Silicon) Sector feature provides a
Flash memory region that enables permanent part
identification through an Electronic Serial Number
(ESN). The SecSi Sector is 256 bytes in length, and
uses a SecSi Sector Indicator Bit (DQ7) to indicate
whether or not the SecSi Sector is locked when
shipped from the factory. This bit is permanently set at
the factory and cannot be changed, which prevents
cloning of a factory locked part. This ensures the security of the ESN once the product is shipped to the field.
Unless otherwise specified, the device is shipped such
that the customer may program and protect the
256-byte SecSi sector.
AMD offers the device with the SecSi Sector either
customer lockable (standard shipping option) or factory locked (contact an AMD sales representative for
ordering information). The customer-lockable version
is shipped with the SecSi Sector unprotected, allowing
customers to program the sector after receiving the
device. The customer-lockable version also has the
SecSi Sector Indicator Bit permanently set to a “0.”
The factory-locked version is always protected when
shipped from the factory, and has the SecSi (Secured
Silicon) Sector Indicator Bit permanently set to a “1.”
Thus, the SecSi Sector Indicator Bit prevents customer-lockable devices from being used to replace devices that are factory locked. Note that the ACC
function and unlock bypass modes are not available
when the SecSi Sector is enabled.
The SecSi sector address space in this device is allocated as follows:
Table 5. SecSi Sector Contents
SecSi Sector
Address Range
000000h–000007h
000008h–00007Fh
Customer
Lockable
Determined by
customer
ESN Factory
Locked
ExpressFlash
Factory Locked
ESN
ESN or
determined by
customer
Unavailable
Determined by
customer
The system accesses the SecSi Sector through a
command sequence (see “Enter SecSi Sector/Exit
SecSi Sector Command Sequence”). After the system
has written the Enter SecSi Sector command sequence, it may read the SecSi Sector by using the addresses normally occupied by the first sector (SA0).
This mode of operation continues until the system issues the Exit SecSi Sector command sequence, or
until power is removed from the device. On power-up,
or following a hardware reset, the device reverts to
sending commands to sector SA0.
28
The system may program the SecSi Sector using the
write-buffer, accelerated and/or unlock bypass methods, in addition to the standard programming command sequence. See Command Definitions.
Programming and protecting the SecSi Sector must be
used with caution since, once protected, there is no
procedure available for unprotecting the SecSi Sector
area and none of the bits in the SecSi Sector memory
space can be modified in any way.
The SecSi Sector area can be protected using one of
the following procedures:
„ Write the three-cycle Enter SecSi Sector Region
command sequence, and then follow the in-system
sector protect algorithm as shown in Figure 2, except that RESET# may be at either VIH or VID. This
allows in-system protection of the SecSi Sector
without raising any device pin to a high voltage.
Note that this method is only applicable to the SecSi
Sector.
„ To verify the protect/unprotect status of the SecSi
Sector, follow the algorithm shown in Figure 3.
Once the SecSi Sector is programmed, locked and
verified, the system must write the Exit SecSi Sector
Region command sequence to return to reading and
writing within the remainder of the array.
Factory Locked: SecSi Sector Programmed and
Protected At the Factory
In devices with an ESN, the SecSi Sector is protected
when the device is shipped from the factory. The SecSi
Sector cannot be modified in any way. An ESN Factory
Locked device has an 16-byte random ESN at addresses 000000h–000007h. Please contact your local
AMD sales representative for details on ordering ESN
Factory Locked devices.
Customers may opt to have their code programmed by
AMD through the AMD ExpressFlash service (Express
Flash Factory Locked). The devices are then shipped
from AMD’s factory with the SecSi Sector permanently
locked. Contact an AMD representative for details on
using AMD’s ExpressFlash service.
Am29LV256M
September 15, 2003
D A T A S H E E T
for command definitions). In addition, the following
hardware data protection measures prevent accidental
erasure or programming, which might otherwise be
caused by spurious system level signals during VCC
power-up and power-down transitions, or from system
noise.
START
RESET# =
VIH or VID
Wait 1 µs
Write 60h to
any address
Write 40h to SecSi
Sector address
with A6 = 0,
A1 = 1, A0 = 0
Read from SecSi
Sector address
with A6 = 0,
A1 = 1, A0 = 0
If data = 00h,
SecSi Sector is
unprotected.
If data = 01h,
SecSi Sector is
protected.
Low VCC Write Inhibit
When VCC is less than VLKO, the device does not accept any write cycles. This protects data during VCC
power-up and power-down. The command register
and all internal program/erase circuits are disabled,
and the device resets to the read mode. Subsequent
writes are ignored until VCC is greater than VLKO. The
system must provide the proper signals to the control
pins to prevent unintentional writes when V CC is
greater than VLKO.
Remove VIH or VID
from RESET#
Write reset
command
Write Pulse “Glitch” Protection
SecSi Sector
Protect Verify
complete
Noise pulses of less than 5 ns (typical) on OE#, CE#
or WE# do not initiate a write cycle.
Logical Inhibit
Write cycles are inhibited by holding any one of OE# =
VIL, CE# = VIH or WE# = VIH. To initiate a write cycle,
CE# and WE# must be a logical zero while OE# is a
logical one.
Figure 3. SecSi Sector Protect Verify
Power-Up Write Inhibit
Hardware Data Protection
The command sequence requirement of unlock cycles
for programming or erasing provides data protection
against inadvertent writes (refer to Tables 11 and 12
If WE# = CE# = VIL and OE# = VIH during power up,
the device does not accept commands on the rising
edge of WE#. The internal state machine is automatically reset to the read mode on power-up.
COMMON FLASH MEMORY INTERFACE (CFI)
The Common Flash Interface (CFI) specification outlines device and host system software interrogation
handshake, which allows specific vendor-specified
software algorithms to be used for entire families of
devices. Software support can then be device-independent, JEDEC ID-independent, and forward- and
backward-compatible for the specified flash device
families. Flash vendors can standardize their existing
interfaces for long-term compatibility.
enters the CFI query mode, and the system can read
CFI data at the addresses given in Tables 6–9. The
system must write the reset command to return the
device to reading array data.
For further information, please refer to the CFI Specification and CFI Publication 100, available via the
World Wide Web at http://www.amd.com/flash/cfi. Alternatively, contact an AMD representative for copies
of these documents.
This device enters the CFI Query mode when the system writes the CFI Query command, 98h, to address
55h, any time the device is ready to read array data.
The system can read CFI information at the addresses
given in Tables 6–9. To terminate reading CFI data,
the system must write the reset command.
The system can also write the CFI query command
when the device is in the autoselect mode. The device
September 15, 2003
Am29LV256M
29
D A T A S H E E T
Table 6.
CFI Query Identification String
Addresses (x16)
Data
Description
10h
11h
12h
0051h
0052h
0059h
Query Unique ASCII string “QRY”
13h
14h
0002h
0000h
Primary OEM Command Set
15h
16h
0040h
0000h
Address for Primary Extended Table
17h
18h
0000h
0000h
Alternate OEM Command Set (00h = none exists)
19h
1Ah
0000h
0000h
Address for Alternate OEM Extended Table (00h = none exists)
Table 7.
System Interface String
Addresses (x16)
Data
1Bh
0027h
VCC Min. (write/erase)
D7–D4: volt, D3–D0: 100 millivolt
1Ch
0036h
VCC Max. (write/erase)
D7–D4: volt, D3–D0: 100 millivolt
1Dh
0000h
VPP Min. voltage (00h = no VPP pin present)
1Eh
0000h
VPP Max. voltage (00h = no VPP pin present)
1Fh
0007h
Typical timeout per single byte/word write 2N µs
20h
0007h
Typical timeout for Min. size buffer write 2N µs (00h = not supported)
21h
000Ah
Typical timeout per individual block erase 2N ms
22h
0000h
Typical timeout for full chip erase 2N ms (00h = not supported)
23h
0001h
Max. timeout for byte/word write 2N times typical
24h
0005h
Max. timeout for buffer write 2N times typical
25h
0004h
Max. timeout per individual block erase 2N times typical
26h
0000h
Max. timeout for full chip erase 2N times typical (00h = not supported)
30
Description
Am29LV256M
September 15, 2003
D A T A S H E E T
Table 8. Device Geometry Definition
Addresses (x16)
Data
Description
N
27h
0019h
Device Size = 2 byte
28h
29h
0002h
0000h
Flash Device Interface description (refer to CFI publication 100)
2Ah
2Bh
0005h
0000h
Max. number of byte in multi-byte write = 2N
(00h = not supported)
2Ch
0001h
Number of Erase Block Regions within device (01h = uniform device, 02h = boot
device)
2Dh
2Eh
2Fh
30h
00FFh
0001h
0000h
0001h
Erase Block Region 1 Information
(refer to the CFI specification or CFI publication 100)
31h
32h
33h
34h
0000h
0000h
0000h
0000h
Erase Block Region 2 Information (refer to CFI publication 100)
35h
36h
37h
38h
0000h
0000h
0000h
0000h
Erase Block Region 3 Information (refer to CFI publication 100)
39h
3Ah
3Bh
3Ch
0000h
0000h
0000h
0000h
Erase Block Region 4 Information (refer to CFI publication 100)
September 15, 2003
Am29LV256M
31
D A T A S H E E T
Table 9. Primary Vendor-Specific Extended Query
Addresses (x16)
Data
Description
40h
41h
42h
0050h
0052h
0049h
Query-unique ASCII string “PRI”
43h
0031h
Major version number, ASCII
44h
0033h
Minor version number, ASCII
45h
0008h
Address Sensitive Unlock (Bits 1-0)
0 = Required, 1 = Not Required
Process Technology (Bits 7-2) 0010b = 0.23 µm MirrorBit
46h
0002h
Erase Suspend
0 = Not Supported, 1 = To Read Only, 2 = To Read & Write
47h
0001h
Sector Protect
0 = Not Supported, X = Number of sectors in per group
48h
0001h
Sector Temporary Unprotect
00 = Not Supported, 01 = Supported
49h
0004h
Sector Protect/Unprotect scheme
04 = 29LV800 mode
4Ah
0000h
Simultaneous Operation
00 = Not Supported, X = Number of Sectors in Bank
4Bh
0000h
Burst Mode Type
00 = Not Supported, 01 = Supported
4Ch
0001h
Page Mode Type
00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page
4Dh
00B5h
4Eh
00C5h
4Fh
0004h/
0005h
50h
0001h
ACC (Acceleration) Supply Minimum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
ACC (Acceleration) Supply Maximum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
Top/Bottom Boot Sector Flag
00h = Uniform Device without WP# protect, 02h = Bottom Boot Device, 03h = Top
Boot Device, 04h = Uniform sectors bottom WP# protect, 05h = Uniform sectors top
WP# protect
Program Suspend
00h = Not Supported, 01h = Supported
COMMAND DEFINITIONS
Writing specific address and data commands or sequences into the command register initiates device operations. Tables 11 and 12 define the valid register
command sequences. Writing incorrect address and
data values or writing them in the improper sequence
may place the device in an unknown state. A reset
command is then required to return the device to reading array data.
All addresses are latched on the falling edge of WE#
or CE#, whichever happens later. All data is latched on
the rising edge of WE# or CE#, whichever happens
32
first. Refer to the AC Characteristics section for timing
diagrams.
Reading Array Data
The device is automatically set to reading array data
after device power-up. No commands are required to
retrieve data. The device is ready to read array data
after completing an Embedded Program or Embedded
Erase algorithm.
After the device accepts an Erase Suspend command,
the device enters the erase-suspend-read mode, after
which the sys tem can read data from any
Am29LV256M
September 15, 2003
D A T A S H E E T
non-erase-suspended sector. After completing a programming operation in the Erase Suspend mode, the
system may once again read array data with the same
exception. See the Erase Suspend/Erase Resume
Commands section for more information.
The system must issue the reset command to return
the device to the read (or erase-suspend-read) mode
if DQ5 goes high during an active program or erase
operation, or if the device is in the autoselect mode.
See the next section, Reset Command, for more information.
See also Requirements for Reading Array Data in the
Device Bus Operations section for more information.
The Read-Only Operations table provides the read parameters, and Figure 13 shows the timing diagram.
Reset Command
Writing the reset command resets the device to the
read or erase-suspend-read mode. Address bits are
don’t cares for this command.
The reset command may be written between the sequence cycles in an erase command sequence before
erasing begins. This resets the device to the read
mode. Once erasure begins, however, the device ignores reset commands until the operation is complete.
The reset command may be written between the
sequence cycles in a program command sequence
before programming begins. This resets the device to
the read mode. If the program command sequence is
written while the device is in the Erase Suspend mode,
writing the reset command returns the device to the
erase-suspend-read mode. Once programming begins, however, the device ignores reset commands
until the operation is complete.
The reset command may be written between the sequence cycles in an autoselect command sequence.
Once in the autoselect mode, the reset command
must be written to return to the read mode. If the device entered the autoselect mode while in the Erase
Suspend mode, writing the reset command returns the
device to the erase-suspend-read mode.
If DQ5 goes high during a program or erase operation,
writing the reset command returns the device to the
read mode (or erase-suspend-read mode if the device
was in Erase Suspend).
Note that if DQ1 goes high during a Write Buffer Programming operation, the system must write the
Write-to-Buffer-Abort Reset command sequence to
reset the device for the next operation.
Autoselect Command Sequence
The autoselect command sequence allows the host
system to access the manufacturer and device codes,
and determine whether or not a sector is protected.
September 15, 2003
Table 12 shows the address and data requirements.
This method is an alternative to that shown in Table 3,
which is intended for PROM programmers and requires V ID on address pin A9. The autoselect command sequence may be written to an address that is
either in the read or erase-suspend-read mode. The
autoselect command may not be written while the device is actively programming or erasing.
The autoselect command sequence is initiated by first
writing two unlock cycles. This is followed by a third
write cycle that contains the autoselect command. The
device then enters the autoselect mode. The system
may read at any address any number of times without
initiating another autoselect command sequence:
„ A read cycle at address XX00h returns the manufacturer code.
„ Three read cycles at addresses 01h, 0Eh, and 0Fh
return the device code.
„ A read cycle to an address containing a sector address (SA), and the address 02h on A7–A0 in word
mode returns 01h if the sector is protected, or 00h if
it is unprotected.
The system must write the reset command to return to
the read mode (or erase-suspend-read mode if the device was previously in Erase Suspend).
Enter SecSi Sector/Exit SecSi Sector
Command Sequence
The SecSi Sector region provides a secured data area
containing an 8-word/16-byte random Electronic Serial
Number (ESN). The system can access the SecSi
Sector region by issuing the three-cycle Enter SecSi
Sector command sequence. The device continues to
access the SecSi Sector region until the system issues the four-cycle Exit SecSi Sector command sequence. The Exit SecSi Sector command sequence
returns the device to normal operation. Tables 11 and
12 show the address and data requirements for both
command sequences. See also “SecSi (Secured Silicon) Sector Flash Memory Region” for further information. Note that the ACC function and unlock bypass
modes are not available when the SecSi Sector is enabled.
Word/Byte Program Command Sequence
Programming is a four-bus-cycle operation. The program command sequence is initiated by writing two
unlock write cycles, followed by the program set-up
command. The program address and data are written
next, which in turn initiate the Embedded Program algorithm. The system is not required to provide further
controls or timings. The device automatically provides
internally generated program pulses and verifies the
programmed cell margin. Tables 11 and 12 show the
Am29LV256M
33
D A T A S H E E T
address and data requirements for the word program
command sequence.
When the Embedded Program algorithm is complete,
the device then returns to the read mode and addresses are no longer latched. The system can determine the status of the program operation by using
DQ7 or DQ6. Refer to the Write Operation Status section for information on these status bits.
Any commands written to the device during the Embedded Program Algorithm are ignored. Note that the
SecSi Sector, autoselect, and CFI functions are unavailable when a program operation is in progress.
Note that a hardware reset immediately terminates
the program operation. The program command sequence should be reinitiated once the device has returned to the read mode, to ensure data integrity.
Programming is allowed in any sequence and across
sector boundaries. A bit cannot be programmed
from “0” back to a “1.” Attempting to do so may
cause the device to set DQ5 = 1, or cause the DQ7
and DQ6 status bits to indicate the operation was successful. However, a succeeding read will show that the
data is still “0.” Only erase operations can convert a
“0” to a “1.”
Unlock Bypass Command Sequence
The unlock bypass feature allows the system to program words to the device faster than using the standard program command sequence. The unlock
bypass command sequence is initiated by first writing
two unlock cycles. This is followed by a third write
cycle containing the unlock bypass command, 20h.
The device then enters the unlock bypass mode. A
two-cycle unlock bypass program command sequence
is all that is required to program in this mode. The first
cycle in this sequence contains the unlock bypass program command, A0h; the second cycle contains the
program address and data. Additional data is programmed in the same manner. This mode dispenses
with the initial two unlock cycles required in the standard program command sequence, resulting in faster
total programming time. Tables 11 and 12 show the requirements for the command sequence.
During the unlock bypass mode, only the Unlock Bypass Program and Unlock Bypass Reset commands
are valid. To exit the unlock bypass mode, the system
must issue the two-cycle unlock bypass reset command sequence. (See Table 9).
Write Buffer Programming
Write Buffer Programming allows the system write to a
maximum of 16 words/32 bytes in one programming
operation. This results in faster effective programming
time than the standard programming algorithms. The
Write Buffer Programming command sequence is initi-
34
ated by first writing two unlock cycles. This is followed
by a third write cycle containing the Write Buffer Load
command written at the Sector Address in which programming will occur. The fourth cycle writes the sector
address and the number of word locations, minus one,
to be programmed. For example, if the system will program 6 unique address locations, then 05h should be
written to the device. This tells the device how many
write buffer addresses will be loaded with data and
therefore when to expect the Program Buffer to Flash
command. The number of locations to program cannot
exceed the size of the write buffer or the operation will
abort.
The fifth cycle writes the first address location and
data to be programmed. The write-buffer-page is selected by address bits A MAX–A 4. All subsequent add r e s s / d a t a p a i r s m u s t fa l l w i t h i n t h e
selected-write-buffer-page. The system then writes the
remaining address/data pairs into the write buffer.
Write buffer locations may be loaded in any order.
The write-buffer-page address must be the same for
all address/data pairs loaded into the write buffer.
(This means Write Buffer Programming cannot be performed across multiple write-buffer pages. This also
means that Write Buffer Programming cannot be performed across multiple sectors. If the system attempts
to load programming data outside of the selected
write-buffer page, the operation will abort.
Note that if a Write Buffer address location is loaded
multiple times, the address/data pair counter will be
decremented for every data load operation. The host
s y s t e m mu s t t h e r e fo r e a c c o u n t fo r l o a d i n g a
write-buffer location more than once. The counter decrements for each data load operation, not for each
unique write-buffer-address location. Note also that if
an address location is loaded more than once into the
buffer, the final data loaded for that address will be
programmed.
Once the specified number of write buffer locations
have been loaded, the system must then write the Program Buffer to Flash command at the sector address.
Any other address and data combination aborts the
Write Buffer Programming operation. The device then
begins programming. Data polling should be used
while monitoring the last address location loaded into
the write buffer. DQ7, DQ6, DQ5, and DQ1 should be
monitored to determine the device status during Write
Buffer Programming.
The write-buffer programming operation can be suspended using the standard program suspend/resume
commands. Upon successful completion of the Write
Buffer Programming operation, the device is ready to
execute the next command.
The Write Buffer Programming Sequence can be
aborted in the following ways:
Am29LV256M
September 15, 2003
D A T A S H E E T
„ Load a value that is greater than the page buffer
size during the Number of Locations to Program
step.
„ Write to an address in a sector different than the
one specified during the Write-Buffer-Load command.
„ Write an Address/Data pair to a different
write-buffer-page than the one selected by the
Starting Address during the write buffer data loading stage of the operation.
„ Write data other than the Confirm Command after
the specified number of data load cycles.
The abort condition is indicated by DQ1 = 1, DQ7 =
DATA# (for the last address location loaded), DQ6 =
toggle, and DQ5=0. A Write-to-Buffer-Abort Reset
command sequence must be written to reset the device for the next operation. Note that the full 3-cycle
Write-to-Buffer-Abort Reset command sequence is required when using Write-Buffer-Programming features
in Unlock Bypass mode.
Programming is allowed in any sequence and across
sector boundaries. A bit cannot be programmed
September 15, 2003
from “0” back to a “1.” Attempting to do so may
cause the device to set DQ5 = 1, or cause the DQ7
and DQ6 status bits to indicate the operation was successful. However, a succeeding read will show that the
data is still “0.” Only erase operations can convert a
“0” to a “1.”
Accelerated Program
The device offers accelerated program operations
through the WP#/ACC pin. When the system asserts
VHH on the WP#/ACC pin, the device automatically enters the Unlock Bypass mode. The system may then
write the two-cycle Unlock Bypass program command
sequence. The device uses the higher voltage on the
WP#/ACC pin to accelerate the operation. Note that
the WP#/ACC pin must not be at VHH for operations
other than accelerated programming, or device damage may result. WP# has an internal pullup; when unconnected, WP# is at VIH.
Figure 5 illustrates the algorithm for the program operation. Refer to the Erase and Program Operations
table in the AC Characteristics section for parameters,
and Figure 16 for timing diagrams.
Am29LV256M
35
D A T A S H E E T
Write “Write to Buffer”
command and
Sector Address
Part of “Write to Buffer”
Command Sequence
Write number of addresses
to program minus 1(WC)
and Sector Address
Write first address/data
Yes
WC = 0 ?
No
Abort Write to
Buffer Operation?
Write to a different
sector address
Yes
Write to buffer ABORTED.
Must write “Write-to-buffer
Abort Reset” command
sequence to return
to read mode.
No
(Note 1) Write next address/data pair
WC = WC - 1
Write program buffer to
flash sector address
Notes:
1.
Read DQ15 - DQ0 at
Last Loaded Address
DQ7 and DQ15 = Data?
No
2. DQ7 may change simultaneously with DQ5.
Therefore, DQ7 should be verified.
3. If this flowchart location was reached because
DQ5= “1”, then the device FAILED. If this
flowchart location was reached because DQ1=
“1”, then the Write to Buffer operation was
ABORTED. In either case, the proper reset
command must be written before the device can
begin another operation. If DQ1=1, write the
Write-Buffer-Programming-Abort-Reset
command. if DQ5=1, write the Reset command.
Yes
No
No
DQ1 = 1?
When Sector Address is specified, any address in
the selected sector is acceptable. However, when
loading Write-Buffer address locations with data, all
addresses must fall within the selected Write-Buffer
Page.
DQ5 and DQ13 = 1?
4.
See Tables 11 and 12 for command sequences
required for write buffer programming.
Yes
Yes
Read DQ15 - DQ0 with
address = Last Loaded
Address
(Note 2)
DQ7 and DQ15 = Data?
Yes
No
(Note 3)
FAIL or ABORT
PASS
Figure 4. Write Buffer Programming Operation
36
Am29LV256M
September 15, 2003
D A T A S H E E T
Program Suspend/Program Resume
Command Sequence
The Program Suspend command allows the system to
interrupt a programming operation or a Write to Buffer
programming operation so that data can be read from
any non-suspended sector. When the Program Suspend command is written during a programming process, the device halts the program operation within 15
µs maximum (5µs typical) and updates the status bits.
Addresses are not required when writing the Program
Suspend command.
START
Write Program
Command Sequence
Data Poll
from System
Embedded
Program
algorithm
in progress
Verify Data?
Yes
Increment Address
No
Last Address?
Yes
Programming
Completed
Note: See Tables 11 and 12 for program command
sequence.
Figure 5. Program Operation
No
After the programming operation has been suspended, the system can read array data from any
non-suspended sector. The Program Suspend command may also be issued during a programming operation while an erase is suspended. In this case, data
may be read from any addresses not in Erase Suspend or Program Suspend. If a read is needed from
the SecSi Sector area (One-time Program area), then
user must use the proper command sequences to
enter and exit this region.
The system may also write the autoselect command
sequence when the device is in the Program Suspend
mode. The system can read as many autoselect
codes as required. When the device exits the autoselect mode, the device reverts to the Program Suspend
mode, and is ready for another valid operation. See
Autoselect Command Sequence for more information.
After the Program Resume command is written, the
device reverts to programming. The system can determine the status of the program operation using the
DQ7 or DQ6 status bits, just as in the standard program operation. See Write Operation Status for more
information.
The system must write the Program Resume command to exit the Program Suspend mode and continue the programming operation. Further writes of the
Resume command are ignored. Another Program
Suspend command can be written after the device has
resume programming.
September 15, 2003
Am29LV256M
37
D A T A S H E E T
When the Embedded Erase algorithm is complete, the
device returns to the read mode and addresses are no
longer latched. The system can determine the status
of the erase operation by using DQ7, DQ6, or DQ2.
Refer to the Write Operation Status section for information on these status bits.
Program Operation
or Write-to-Buffer
Sequence in Progress
Write address/data
XXXh/B0B0h
Write Program Suspend
Command Sequence
Command is also valid for
Erase-suspended-program
operations
Wait 15 ms
Read data as
required
No
Autoselect and SecSi Sector
read operations are also allowed
Data cannot be read from erase- or
program-suspended sectors
Done
reading?
Sector erase is a six bus cycle operation. The sector
erase command sequence is initiated by writing two
unlock cycles, followed by a set-up command. Two additional unlock cycles are written, and are then followed by the address of the sector to be erased, and
the sector erase command. Table 12 shows the address and data requirements for the sector erase command sequence.
Write Program Resume
Command Sequence
Device reverts to
operation prior to
Program Suspend
Figure 6.
Figure 10 illustrates the algorithm for the erase operation. Refer to the Erase and Program Operations tables in the AC Characteristics section for parameters,
and Figure 18 section for timing diagrams.
Sector Erase Command Sequence
Yes
Write address/data
XXXh/3030h
Any commands written during the chip erase operation
are ignored. However, note that a hardware reset immediately terminates the erase operation. If that occurs, the chip erase command sequence should be
reinitiated once the device has returned to reading
array data, to ensure data integrity.
Program Suspend/Program Resume
Chip Erase Command Sequence
Chip erase is a six bus cycle operation. The chip erase
command sequence is initiated by writing two unlock
cycles, followed by a set-up command. Two additional
unlock write cycles are then followed by the chip erase
command, which in turn invokes the Embedded Erase
algorithm. The device does not require the system to
preprogram prior to erase. The Embedded Erase algorithm automatically preprograms and verifies the entire
memory for an all zero data pattern prior to electrical
erase. The system is not required to provide any controls or timings during these operations. Tables 11 and
12 show the address and data requirements for the
chip erase command sequence.
The device does not require the system to preprogram
prior to erase. The Embedded Erase algorithm automatically programs and verifies the entire memory for
an all zero data pattern prior to electrical erase. The
system is not required to provide any controls or timings during these operations.
After the command sequence is written, a sector erase
time-out of 50 µs occurs. During the time-out period,
additional sector addresses and sector erase commands may be written. Loading the sector erase buffer
may be done in any sequence, and the number of sectors may be from one sector to all sectors. The time
between these additional cycles must be less than 50
µs, otherwise erasure may begin. Any sector erase
address and command following the exceeded
time-out may or may not be accepted. It is recommended that processor interrupts be disabled during
this time to ensure all commands are accepted. The
interrupts can be re-enabled after the last Sector
Erase command is written. Any command other than
Se ct o r Er ase o r E ras e Sus pe n d d u ri ng t h e
time-out period resets the device to the read
mode. The system must rewrite the command sequence and any additional addresses and commands.
Note that the SecSi Sector, autoselect, and CFI functions are unavailable when an erase operation in is
progress.
The system can monitor DQ3 to determine if the sector erase timer has timed out (See the section on DQ3:
38
Am29LV256M
September 15, 2003
D A T A S H E E T
Sector Erase Timer.). The time-out begins from the rising edge of the final WE# pulse in the command
sequence.
When the Embedded Erase algorithm is complete, the
device returns to reading array data and addresses
are no longer latched. The system can determine the
status of the erase operation by reading DQ7, DQ6, or
DQ2 in the erasing sector. Refer to the Write Operation Status section for information on these status bits.
Once the sector erase operation has begun, only the
Erase Suspend command is valid. All other commands are ignored. However, note that a hardware
reset immediately terminates the erase operation. If
that occurs, the sector erase command sequence
should be reinitiated once the device has returned to
reading array data, to ensure data integrity.
Figure 10 illustrates the algorithm for the erase operation. Refer to the Erase and Program Operations tables in the AC Characteristics section for parameters,
and Figure 18 section for timing diagrams.
START
Write Erase
Command Sequence
(Notes 1, 2)
Data Poll to Erasing
Bank from System
No
Erase Suspend/Erase Resume
Commands
The Erase Suspend command, B0h, allows the system to interrupt a sector erase operation and then read
data from, or program data to, any sector not selected
for erasure. This command is valid only during the
sector erase operation, including the 50 µs time-out
period during the sector erase command sequence.
The Erase Suspend command is ignored if written during the chip erase operation or Embedded Program
algorithm.
When the Erase Suspend command is written during
the sector erase operation, the device requires a typical of 5 µs (maximum of 20 µs) to suspend the erase
operation. However, when the Erase Suspend command is written during the sector erase time-out, the
device immediately terminates the time-out period and
suspends the erase operation.
After the erase operation has been suspended, the
device enters the erase-suspend-read mode. The system can read data from or program data to any sector
not selected for erasure. (The device “erase suspends” all sectors selected for erasure.) Reading at
any address within erase-suspended sectors produces status information on DQ7–DQ0. The system
can use DQ7, or DQ6 and DQ2 together, to determine
if a sector is actively erasing or is erase-suspended.
Refer to the Write Operation Status section for information on these status bits.
After an erase-suspended program operation is complete, the device returns to the erase-suspend-read
mode. The system can determine the status of the
program operation using the DQ7 or DQ6 status bits,
just as in the standard word program operation.
Refer to the Write Operation Status section for more
information.
Embedded
Erase
algorithm
in progress
Data = FFh?
In the erase-suspend-read mode, the system can also
issue the autoselect command sequence. Refer to the
Autoselect Mode and Autoselect Command Sequence
sections for details.
Yes
Erasure Completed
Notes:
1. See Tables 11 and 12 for program command sequence.
2. See the section on DQ3 for information on the sector
erase timer.
To resume the sector erase operation, the system
must write the Erase Resume command. Further
writes of the Resume command are ignored. Another
Erase Suspend command can be written after the chip
has resumed erasing.
Table 10. Erase Operation
September 15, 2003
Am29LV256M
39
D A T A S H E E T
Command Definitions
Table 11. Command Definitions (x16 Mode, BYTE# = VIH)
Cycles
Bus Cycles (Notes 2–5)
Addr
Read (Note 6)
1
RA
Reset (Note 7)
Command
Sequence
(Note 1)
First
Second
Data
RD
Addr
Data
Third
Addr
Fourth
Data
Addr
Fifth
Data
Sixth
Addr
Data
Addr
Data
X0E
2212
X0F
2201
XXX
F0
4
555
AA
2AA
55
555
90
X00
0001
Device ID (Note 9)
4
555
AA
2AA
55
555
90
X01
227E
SecSiTM Sector Factory Protect
(Note 10)
4
555
AA
2AA
55
555
90
X03
(Note 10)
Sector Group Protect Verify
(Note 12)
4
555
AA
2AA
55
555
90
(SA)X02
00/01
Enter SecSi Sector Region
3
555
AA
2AA
55
555
88
Exit SecSi Sector Region
4
555
AA
2AA
55
555
90
XXX
00
Program
4
555
AA
2AA
55
555
A0
PA
PD
Write to Buffer (Note 11)
3
555
AA
2AA
55
SA
25
SA
WC
PA
PD
WBL
PD
Program Buffer to Flash
1
SA
29
Autoselect (Note 8)
1
Manufacturer ID
Write to Buffer Abort Reset (Note 13)
3
555
AA
2AA
55
555
F0
Unlock Bypass
3
555
AA
2AA
55
555
20
Unlock Bypass Program (Note 14)
2
XXX
A0
PA
PD
Unlock Bypass Reset (Note 15)
2
XXX
90
XXX
00
Chip Erase
6
555
AA
2AA
55
555
80
555
AA
2AA
55
555
10
Sector Erase
6
555
AA
2AA
55
555
80
555
AA
2AA
55
SA
30
Program/Erase Suspend (Note 16)
1
XXX
B0
Program/Erase Resume (Note 17)
1
XXX
30
CFI Query (Note 18)
1
55
98
Legend:
X = Don’t care
RA = Read Address of the memory location to be read.
RD = Read Data read from location RA during read operation.
PA = Program Address. Addresses latch on the falling edge of the WE#
or CE# pulse, whichever happens later.
PD = Program Data for location PA. Data latches on the rising edge of
WE# or CE# pulse, whichever happens first.
Notes:
1. See Table 1 for description of bus operations.
2. All values are in hexadecimal.
SA = Sector Address of sector to be verified (in autoselect mode) or
erased. Address bits A23–A15 uniquely select any sector.
WBL = Write Buffer Location. Address must be within the same write
buffer page as PA.
WC = Word Count. Number of write buffer locations to load minus 1.
lowest address sector, the data is 88h for factory locked and 08h
for not factor locked.
3. Except for the read cycle and the fourth cycle of the autoselect
command sequence, all bus cycles are write cycles.
4. Data bits DQ15–DQ8 are don’t care in command sequences,
except for RD, PD and WC.
5. Unless otherwise noted, address bits A23–A11 are don’t cares.
6. No unlock or command cycles required when device is in read
mode.
7. The Reset command is required to return to the read mode (or to
the erase-suspend-read mode if previously in Erase Suspend)
when the device is in the autoselect mode, or if DQ5 goes high
while the device is providing status information.
8. The fourth cycle of the autoselect command sequence is a read
cycle. Data bits DQ15–DQ8 are don’t care. See the Autoselect
Command Sequence section for more information.
9. The device ID must be read in three cycles.
10. If WP# protects the highest address sector, the data is 98h for
factory locked and 18h for not factory locked. If WP# protects the
11. The total number of cycles in the command sequence is
determined by the number of words written to the write buffer. The
maximum number of cycles in the command sequence is 21.
12. The data is 00h for an unprotected sector and 01h for a protected
sector.
13. Command sequence resets device for next command after
aborted write-to-buffer operation.
14. The Unlock Bypass command is required prior to the Unlock
Bypass Program command.
15. The Unlock Bypass Reset command is required to return to the
read mode when the device is in the unlock bypass mode.
16. The system may read and program in non-erasing sectors, or
enter the autoselect mode, when in the Erase Suspend mode.
The Erase Suspend command is valid only during a sector erase
operation.
17. The Erase Resume command is valid only during the Erase
Suspend mode.
18. Command is valid when device is ready to read array data or when
device is in autoselect mode.
40
Am29LV256M
September 15, 2003
D A T A S H E E T
Table 12.
Command Definitions (x8 Mode, BYTE# = VIL)
Cycles
Bus Cycles (Notes 2–5)
Addr
Read (Note 6)
1
RA
Reset (Note 7)
Command
Sequence
(Note 1)
First
Second
Data
RD
Addr
Data
Third
Addr
Fourth
Data
Addr
Fifth
Data
XXX
F0
4
AAA
AA
555
55
AAA
90
X00
01
Device ID (Note 9)
4
AAA
AA
555
55
AAA
90
X02
7E
SecSiTM Sector Factory Protect
(Note 10)
4
AAA
AA
555
55
AAA
90
X06
(Note 10)
Sector Group Protect Verify
(Note 12)
4
AAA
AA
555
55
AAA
90
(SA)X04
00/01
Enter SecSi Sector Region
3
AAA
AA
555
55
AAA
88
Exit SecSi Sector Region
4
AAA
AA
555
55
AAA
90
XXX
00
Program
4
AAA
AA
555
55
AAA
A0
PA
PD
Write to Buffer (Note 11)
3
AAA
AA
555
55
SA
25
SA
BC
Program Buffer to Flash
1
SA
29
Autoselect (Note 8)
1
Manufacturer ID
Sixth
Addr
Data
Addr
Data
X1C
12
X1E
01
PA
PD
WBL
PD
Write to Buffer Abort Reset (Note 13)
3
AAA
AA
555
55
AAA
F0
Unlock Bypass
3
AAA
AA
555
55
AAA
20
Unlock Bypass Program (Note 14)
2
XXX
A0
PA
PD
Unlock Bypass Reset (Note 15)
2
XXX
90
XXX
00
Chip Erase
6
AAA
AA
555
55
AAA
80
AAA
AA
555
55
AAA
10
Sector Erase
6
AAA
AA
555
55
AAA
80
AAA
AA
555
55
SA
30
Program/Erase Suspend (Note 16)
1
XXX
B0
Program/Erase Resume (Note 17)
1
XXX
30
CFI Query (Note 18)
1
AA
98
Legend:
X = Don’t care
RA = Read Address of the memory location to be read.
RD = Read Data read from location RA during read operation.
PA = Program Address. Addresses latch on the falling edge of the WE#
or CE# pulse, whichever happens later.
PD = Program Data for location PA. Data latches on the rising edge of
WE# or CE# pulse, whichever happens first.
Notes:
1. See Table 1 for description of bus operations.
2. All values are in hexadecimal.
SA = Sector Address of sector to be verified (in autoselect mode) or
erased. Address bits A23–A15 uniquely select any sector.
WBL = Write Buffer Location. Address must be within the same write
buffer page as PA.
BC = Byte Count. Number of write buffer locations to load minus 1.
lowest address sector, the data is 88h for factory locked and 08h
for not factor locked.
3. Except for the read cycle and the fourth cycle of the autoselect
command sequence, all bus cycles are write cycles.
4. Data bits DQ15–DQ8 are don’t care in command sequences,
except for RD and PD.
5. Unless otherwise noted, address bits A22–A11 are don’t cares.
6. No unlock or command cycles required when device is in read
mode.
7. The Reset command is required to return to the read mode (or to
the erase-suspend-read mode if previously in Erase Suspend)
when the device is in the autoselect mode, or if DQ5 goes high
while the device is providing status information.
8. The fourth cycle of the autoselect command sequence is a read
cycle. Data bits DQ15–DQ8 are don’t care. See the Autoselect
Command Sequence section for more information.
9. The device ID must be read in three cycles.
10. If WP# protects the highest address sector, the data is 98h for
factory locked and 18h for not factory locked. If WP# protects the
11. The total number of cycles in the command sequence is
determined by the number of bytes written to the write buffer. The
maximum number of cycles in the command sequence is 37.
12. The data is 00h for an unprotected sector group and 01h for a
protected sector group.
13. Command sequence resets device for next command after
aborted write-to-buffer operation.
14. The Unlock Bypass command is required prior to the Unlock
Bypass Program command.
15. The Unlock Bypass Reset command is required to return to the
read mode when the device is in the unlock bypass mode.
16. The system may read and program in non-erasing sectors, or
enter the autoselect mode, when in the Erase Suspend mode.
The Erase Suspend command is valid only during a sector erase
operation.
17. The Erase Resume command is valid only during the Erase
Suspend mode.
18. Command is valid when device is ready to read array data or when
device is in autoselect mode.
September 15, 2003
Am29LV256M
41
D A T A S H E E T
WRITE OPERATION STATUS
The device provides several bits to determine the status of
a program or erase operation: DQ2, DQ3, DQ5, DQ6, and
DQ7. Table 13 and the following subsections describe the
function of these bits. DQ7 and DQ6 each offer a method for
determining whether a program or erase operation is complete or in progress. The device also provides a hardware-based output signal, RY/BY#, to determine
whether an Embedded Program or Erase operation is
in progress or has been completed.
valid data, the data outputs on DQ0–DQ6 may be still
invalid. Valid data on DQ0–DQ7 will appear on successive read cycles.
Table 13 shows the outputs for Data# Polling on DQ7.
Figure 7 shows the Data# Polling algorithm. Figure 19
in the AC Characteristics section shows the Data#
Polling timing diagram.
DQ7: Data# Polling
START
The Data# Polling bit, DQ7, indicates to the host system
whether an Embedded Program or Erase algorithm is in
progress or completed, or whether the device is in Erase
Suspend. Data# Polling is valid after the rising edge of the
final WE# pulse in the command sequence.
Read DQ15–DQ0
Addr = VA
During the Embedded Program algorithm, the device outputs on DQ7 the complement of the datum programmed to
DQ7. This DQ7 status also applies to programming during
Erase Suspend. When the Embedded Program algorithm is
complete, the device outputs the datum programmed to
DQ7. The system must provide the program address to
read valid status information on DQ7. If a program address
falls within a protected sector, Data# Polling on DQ7 is active for approximately 1 µs, then the device returns to the
read mode.
DQ7 and DQ15
= Data?
No
No
During the Embedded Erase algorithm, Data# Polling
produces a “0” on DQ7. When the Embedded Erase
algorithm is complete, or if the device enters the Erase
Suspend mode, Data# Polling produces a “1” on DQ7.
The system must provide an address within any of the
sectors selected for erasure to read valid status information on DQ7.
After an erase command sequence is written, if all
sectors selected for erasing are protected, Data# Polling on DQ7 is active for approximately 100 µs, then
the device returns to the read mode. If not all selected
sectors are protected, the Embedded Erase algorithm
erases the unprotected sectors, and ignores the selected sectors that are protected. However, if the system reads DQ7 at an address within a protected
sector, the status may not be valid.
Just prior to the completion of an Embedded Program
or Erase operation, DQ7 may change asynchronously
with DQ0–DQ6 while Output Enable (OE#) is asserted
low. That is, the device may change from providing
status information to valid data on DQ7. Depending on
when the system samples the DQ7 output, it may read
the status or valid data. Even if the device has completed the program or erase operation and DQ7 has
42
Yes
DQ5 and DQ13
= 1?
Yes
Read DQ15–DQ0
Addr = VA
DQ7 and DQ15
= Data?
Yes
No
FAIL
PASS
Notes:
1. VA = Valid address for programming. During a sector
erase operation, a valid address is any sector address
within the sector being erased. During chip erase, a
valid address is any non-protected sector address.
2. DQ7 should be rechecked even if DQ5 = “1” because
DQ7 may change simultaneously with DQ5.
Am29LV256M
Figure 7.
Data# Polling Algorithm
September 15, 2003
D A T A S H E E T
RY/BY#: Ready/Busy#
The RY/BY# is a dedicated, open-drain output pin
which indicates whether an Embedded Algorithm is in
progress or complete. The RY/BY# status is valid after
the rising edge of the final WE# pulse in the command
sequence. Since RY/BY# is an open-drain output, several RY/BY# pins can be tied together in parallel with a
pull-up resistor to VCC.
If the output is low (Busy), the device is actively erasing or programming. (This includes programming in
the Erase Suspend mode.) If the output is high
(Ready), the device is in the read mode, the standby
mode, or in the erase-suspend-read mode. Table 13
shows the outputs for RY/BY#.
DQ6: Toggle Bit I
Toggle Bit I on DQ6 indicates whether an Embedded
Program or Erase algorithm is in progress or complete, or whether the device has entered the Erase
Suspend mode. Toggle Bit I may be read at any address, and is valid after the rising edge of the final
WE# pulse in the command sequence (prior to the
program or erase operation), and during the sector
erase time-out.
During an Embedded Program or Erase algorithm operation, successive read cycles to any address cause
DQ6 to toggle. The system may use either OE# or
CE# to control the read cycles. When the operation is
complete, DQ6 stops toggling.
September 15, 2003
After an erase command sequence is written, if all sectors
selected for erasing are protected, DQ6 toggles for approximately 100 µs, then returns to reading array data. If not all
selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected.
The system can use DQ6 and DQ2 together to determine
whether a sector is actively erasing or is erase-suspended.
When the device is actively erasing (that is, the Embedded
Erase algorithm is in progress), DQ6 toggles. When the device enters the Erase Suspend mode, DQ6 stops toggling.
However, the system must also use DQ2 to determine
which sectors are erasing or erase-suspended. Alternatively, the system can use DQ7 (see the subsection on
DQ7: Data# Polling).
If a program address falls within a protected sector,
DQ6 toggles for approximately 1 µs after the program
command sequence is written, then returns to reading
array data.
DQ6 also toggles during the erase-suspend-program
mode, and stops toggling once the Embedded Program algorithm is complete.
Table 13 shows the outputs for Toggle Bit I on DQ6.
Figure 8 shows the toggle bit algorithm. Figure 20 in
the “AC Characteristics” section shows the toggle bit
timing diagrams. Figure 21 shows the differences between DQ2 and DQ6 in graphical form. See also the
subsection on DQ2: Toggle Bit II.
Am29LV256M
43
D A T A S H E E T
DQ2: Toggle Bit II
The “Toggle Bit II” on DQ2, when used with DQ6, indicates whether a particular sector is actively erasing
(that is, the Embedded Erase algorithm is in progress),
or whether that sector is erase-suspended. Toggle Bit
II is valid after the rising edge of the final WE# pulse in
the command sequence.
START
Read DQ7–DQ0
DQ2 toggles when the system reads at addresses
within those sectors that have been selected for erasure. (The system may use either OE# or CE# to control the read cycles.) But DQ2 cannot distinguish
whether the sector is actively erasing or is erase-suspended. DQ6, by comparison, indicates whether the
device is actively erasing, or is in Erase Suspend, but
cannot distinguish which sectors are selected for erasure. Thus, both status bits are required for sector and
mode information. Refer to Table 13 to compare outputs for DQ2 and DQ6.
Read DQ7–DQ0
Toggle Bit
= Toggle?
No
Yes
No
Figure 8 shows the toggle bit algorithm in flowchart
form, and the section “DQ2: Toggle Bit II” explains the
algorithm. See also the RY/BY#: Ready/Busy# subsection. Figure 20 shows the toggle bit timing diagram.
Figure 21 shows the differences between DQ2 and
DQ6 in graphical form.
DQ5 = 1?
Yes
Read DQ7–DQ0
Twice
Toggle Bit
= Toggle?
Reading Toggle Bits DQ6/DQ2
No
Yes
Program/Erase
Operation Not
Complete, Write
Reset Command
Program/Erase
Operation Complete
Note: The system should recheck the toggle bit even if
DQ5 = “1” because the toggle bit may stop toggling as DQ5
changes to “1.” See the subsections on DQ6 and DQ2 for
more information.
Figure 8. Toggle Bit Algorithm
Refer to Figure 8 for the following discussion. Whenever the system initially begins reading toggle bit status, it must read DQ7–DQ0 at least twice in a row to
determine whether a toggle bit is toggling. Typically,
the system would note and store the value of the toggle bit after the first read. After the second read, the
system would compare the new value of the toggle bit
with the first. If the toggle bit is not toggling, the device
has completed the program or erase operation. The
system can read array data on DQ7–DQ0 on the following read cycle.
However, if after the initial two read cycles, the system
determines that the toggle bit is still toggling, the system also should note whether the value of DQ5 is high
(see the section on DQ5). If it is, the system should
then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling
just as DQ5 went high. If the toggle bit is no longer
toggling, the device has successfully completed the
program or erase operation. If it is still toggling, the device did not completed the operation successfully, and
the system must write the reset command to return to
reading array data.
The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5 has
not gone high. The system may continue to monitor
the toggle bit and DQ5 through successive read cycles, determining the status as described in the previous paragraph. Alternatively, it may choose to perform
44
Am29LV256M
September 15, 2003
D A T A S H E E T
other system tasks. In this case, the system must start
at the beginning of the algorithm when it returns to determine the status of the operation (top of Figure 8).
DQ5: Exceeded Timing Limits
DQ5 indicates whether the program, erase, or
write-to-buffer time has exceeded a specified internal
pulse count limit. Under these conditions DQ5 produces a
“1,” indicating that the program or erase cycle was not successfully completed.
The device may output a “1” on DQ5 if the system tries
to program a “1” to a location that was previously programmed to “0.” Only an erase operation can
change a “0” back to a “1.” Under this condition, the
device halts the operation, and when the timing limit
has been exceeded, DQ5 produces a “1.”
In all these cases, the system must write the reset
command to return the device to the reading the array
(or to erase-suspend-read if the device was previously
in the erase-suspend-program mode).
DQ3: Sector Erase Timer
After writing a sector erase command sequence, the
system may read DQ3 to determine whether or not
erasure has begun. (The sector erase timer does not
apply to the chip erase command.) If additional
sectors are selected for erasure, the entire time-out
also applies after each additional sector erase com-
Table 13.
Standard
Mode
Program
Suspend
Mode
Erase
Suspend
Mode
Write-toBuffer
mand. When the time-out period is complete, DQ3
switches from a “0” to a “1.” If the time between additional sector erase commands from the system can be
assumed to be less than 50 µs, the system need not
monitor DQ3. See also the Sector Erase Command
Sequence section.
After the sector erase command is written, the system
should read the status of DQ7 (Data# Polling) or DQ6
(Toggle Bit I) to ensure that the device has accepted
the command sequence, and then read DQ3. If DQ3 is
“1,” the Embedded Erase algorithm has begun; all further commands (except Erase Suspend) are ignored
until the erase operation is complete. If DQ3 is “0,” the
device will accept additional sector erase commands.
To ensure the command has been accepted, the system software should check the status of DQ3 prior to
and following each subsequent sector erase command. If DQ3 is high on the second status check, the
last command might not have been accepted.
Table 13 shows the status of DQ3 relative to the other
status bits.
DQ1: Write-to-Buffer Abort
DQ1 indicates whether a Write-to-Buffer operation
was aborted. Under these conditions DQ1 produces a
“1”.
The
system
must
issue
the
Write-to-Buffer-Abort-Reset command sequence to return the device to reading array data. See Write Buffer
Write Operation Status
DQ7
Status
(Note 2)
Embedded Program Algorithm
DQ7#
Embedded Erase Algorithm
0
Program-Suspended
ProgramSector
Suspend
Non-Program
Read
Suspended Sector
Erase-Suspended
1
EraseSector
Suspend
Non-Erase Suspended
Read
Sector
Erase-Suspend-Program
DQ7#
(Embedded Program)
Busy (Note 3)
DQ7#
Abort (Note 4)
DQ7#
DQ6
Toggle
Toggle
No toggle
DQ5
(Note 1)
0
0
DQ3
N/A
1
DQ2
(Note 2)
No toggle
Toggle
DQ1
0
N/A
RY/BY#
0
0
Invalid (not allowed)
1
Data
1
0
N/A
Toggle
N/A
Data
1
1
Toggle
0
N/A
N/A
N/A
0
Toggle
Toggle
0
0
N/A
N/A
N/A
N/A
0
1
0
0
Notes:
1. DQ5 switches to ‘1’ when an Embedded Program, Embedded Erase, or Write-to-Buffer operation has exceeded the
maximum timing limits. Refer to the section on DQ5 for more information.
2. DQ7 and DQ2 require a valid address when reading status information. Refer to the appropriate subsection for further details.
3. The Data# Polling algorithm should be used to monitor the last loaded write-buffer address location.
4. DQ1 switches to ‘1’ when the device has aborted the write-to-buffer operation.
September 15, 2003
Am29LV256M
45
D A T A S H E E T
ABSOLUTE MAXIMUM RATINGS
Storage Temperature
Plastic Packages . . . . . . . . . . . . . . . –65°C to +150°C
Ambient Temperature
with Power Applied. . . . . . . . . . . . . . –65°C to +125°C
Voltage with Respect to Ground
VCC (Note 1) . . . . . . . . . . . . . . . . .–0.5 V to +4.0 V
20 ns
20 ns
+0.8 V
–0.5 V
–2.0 V
VIO . . . . . . . . . . . . . . . . . . . . . . . . .–0.5 V to +4.0 V
20 ns
A9, OE#, ACC, and RESET#
(Note 2) . . . . . . . . . . . . . . . . . . . .–0.5 V to +12.5 V
Figure 9. Maximum Negative
Overshoot Waveform
All other pins (Note 1) . . . . . . –0.5 V to VCC +0.5 V
Output Short Circuit Current (Note 3) . . . . . . 200 mA
Notes:
1. Minimum DC voltage on input or I/O pins is –0.5 V.
During voltage transitions, input or I/O pins may
overshoot V SS to –2.0 V for periods of up to 20 ns.
Maximum DC voltage on input or I/O pins is VCC +0.5 V.
See Figure 9. During voltage transitions, input or I/O pins
may overshoot to VCC +2.0 V for periods up to 20 ns. See
Figure 10.
2. Minimum DC input voltage on pins A9, OE#, ACC, and
RESET# is –0.5 V. During voltage transitions, A9, OE#,
ACC, and RESET# may overshoot V SS to –2.0 V for
periods of up to 20 ns. See Figure 9. Maximum DC input
voltage on pin A9, OE#, ACC, and RESET# is +12.5 V
which may overshoot to +14.0 V for periods up to 20 ns.
20 ns
VCC
+2.0 V
VCC
+0.5 V
2.0 V
20 ns
20 ns
Figure 10. Maximum Positive
Overshoot Waveform
3. No more than one output may be shorted to ground at a
time. Duration of the short circuit should not be greater
than one second.
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. This
is a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational sections of this data sheet is not implied.
Exposure of the device to absolute maximum rating
conditions for extended periods may affect device reliability.
OPERATING RANGES
Industrial (I) Devices
Ambient Temperature (TA) . . . . . . . . . –40°C to +85°C
Supply Voltages
VCC (regulated voltage range) . . . . . . . . . . . 3.0–3.6 V
VCC (full voltage range) . . . . . . . . . . . . . . . . 2.7–3.6 V
VIO (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . 1.65–3.6 V
Notes:
1. Operating ranges define those limits between which the
functionality of the device is guaranteed.
2. See Ordering Information section for valid VCC/VIO range
combinations. The I/Os will not operate at 3 V when
VIO=1.8 V.
46
Am29LV256M
September 15, 2003
D A T A S H E E T
DC CHARACTERISTICS
CMOS Compatible
Parameter
Symbol
Parameter Description
(Notes)
Test Conditions
ILI
Input Load Current (1)
VIN = VSS to VCC,
VCC = VCC max
ILIT
A9, ACC Input Load Current
VCC = VCC max; A9 = 12.5 V
ILO
Output Leakage Current
VOUT = VSS to VCC,
VCC = VCC max
ILR
Reset Leakage Current
VCC = VCC max; RESET# = 12.5 V
ICC1
VCC Active Read Current
(2, 3)
CE# = VIL, OE# = VIH,
ICC2
VCC Initial Page Read Current (2, 3) CE# = VIL, OE# = VIH
ICC3
VCC Intra-Page Read Current (2, 3)
CE# = VIL, OE# = VIH
ICC4
VCC Active Write Current (3, 4)
ICC5
Min
Typ
Max
Unit
±1.0
µA
35
µA
±1.0
µA
35
µA
1 MHz
3
34
5 MHz
13
43
1 MHz
4
50
10 MHz
40
80
10 MHz
3
20
33 MHz
6
40
CE# = VIL, OE# = VIH
50
60
mA
VCC Standby Current (3)
CE#, RESET# = VCC ± 0.3 V, WP# = VIH
1
5
µA
ICC6
VCC Reset Current (3)
RESET# = VSS ± 0.3 V, WP# = VIH
1
5
µA
ICC7
Automatic Sleep Mode (3, 5)
VIH = VCC ± 0.3 V; VIL = VSS ± 0.3 V,
WP# = VIH
1
5
µA
VIL1
Input Low Voltage 1(6, 7)
–0.5
0.8
V
VIH1
Input High Voltage 1 (6, 7)
1.9
VCC + 0.5
V
VIL2
Input Low Voltage 2 (6, 8)
–0.5
0.3 x VIO
V
VIH2
Input High Voltage 2 (6, 8)
1.9
VIO + 0.5
V
VHH
Voltage for ACC Program Acceleration
VCC = 2.7 –3.6 V
11.5
12.5
V
VID
Voltage for Autoselect and Temporary
Sector Unprotect
VCC = 2.7 –3.6 V
11.5
12.5
V
VOL
Output Low Voltage (10)
IOL = 4.0 mA, VCC = VCC min = VIO
0.15 x VIO
V
VOH1
Output High Voltage
VOH2
VLKO
mA
mA
mA
IOH = –2.0 mA, VCC = VCC min = VIO
0.85 VIO
V
IOH = –100 µA, VCC = VCC min = VIO
VIO–0.4
V
Low VCC Lock-Out Voltage (9)
2.3
Notes:
1. On the WP#/ACC pin only, the maximum input load current when
WP# = VIL is ± 5.0 µA.
2. The ICC current listed is typically less than 2 mA/MHz, with OE# at
VIH.
3. Maximum ICC specifications are tested with VCC = VCCmax.
2.5
V
5. Automatic sleep mode enables the low power mode when
addresses remain stable for tACC + 30 ns.
6. If VIO < VCC, maximum VIL for CE# and DQ I/Os is 0.3 VIO.
Maximum VIH for these connections is VIO + 0.3 V
7. VCC voltage requirements.
4. ICC active while Embedded Erase or Embedded Program is in
progress.
8. VIO voltage requirements.
9. Not 100% tested
10. Includes RY/BY#
September 15, 2003
Am29LV256M
47
D A T A S H E E T
TEST CONDITIONS
Table 14. Test Specifications
3.3 V
Test Condition
2.7 kΩ
Device
Under
Test
CL
6.2 kΩ
All Speeds
Output Load
1 TTL gate
Output Load Capacitance, CL
(including jig capacitance)
30
pF
Input Rise and Fall Times
5
ns
0.0–3.0
V
Input timing measurement
reference levels (See Note)
1.5
V
Output timing measurement
reference levels
0.5 VIO
V
Input Pulse Levels
Note: Diodes are IN3064 or equivalent.
Figure 11.
Unit
Note: If VIO < VCC, the reference level is 0.5 VIO.
Test Setup
KEY TO SWITCHING WAVEFORMS
WAVEFORM
INPUTS
OUTPUTS
Steady
Changing from H to L
Changing from L to H
3.0 V
Input
Don’t Care, Any Change Permitted
Changing, State Unknown
Does Not Apply
Center Line is High Impedance State (High Z)
1.5 V
Measurement Level
0.5 VIO V
Output
0.0 V
Note: If VIO < VCC, the input measurement reference level is 0.5 VIO.
Figure 12. Input Waveforms and
Measurement Levels
48
Am29LV256M
September 15, 2003
D A T A S H E E T
AC CHARACTERISTICS
Read-Only Operations
Parameter
Speed Options
JEDEC Std. Description
Test Setup
tAVAV
tRC Read Cycle Time (Note 1)
tAVQV
tACC Address to Output Delay
tELQV
tCE
Chip Enable to Output Delay
103, 103R
113R
113
123R
123
Unit
Min
100
110
120
ns
CE#,
OE# = VIL
Max
100
110
120
ns
OE# = VIL
Max
100
110
120
ns
Max
30
30
40
30
40
ns
Max
30
30
40
30
40
ns
tPACC Page Access Time
tGLQV
tOE Output Enable to Output Delay
tEHQZ
tDF
Chip Enable to Output High Z
(Note 1)
Max
16
ns
tGHQZ
tDF
Output Enable to Output High Z
(Note 1)
Max
16
ns
tAXQX
Output Hold Time From Addresses,
tOH CE# or OE#, Whichever Occurs
First
Min
0
ns
Read
Min
0
ns
Toggle and
Data# Polling
Min
10
ns
Output Enable
tOEH Hold Time
(Note 1)
Notes:
1.
Not 100% tested.
2. See Figure 11 and Table 14 for test specifications.
3.
AC specifications listed are tested with VIO = VCC. Contact AMD for information on AC operation with VIO ≠ VCC
tRC
Addresses Stable
Addresses
tACC
CE#
tRH
tRH
tDF
tOE
OE#
tOEH
WE#
tCE
tOH
HIGH Z
HIGH Z
Output Valid
Outputs
RESET#
RY/BY#
0V
Figure 13.
Read Operation Timings
t
September 15, 2003
Am29LV256M
49
D A T A S H E E T
AC CHARACTERISTICS
Same Page
AMax-A3
A2-A0*
Aa
Ab
tPACC
tACC
Data Bus
Qa
Ad
Ac
tPACC
Qb
tPACC
Qc
Qd
CE#
OE#
* Figure shows word mode. Addresses are A1–A-1 for byte mode.
Figure 14. Page Read Timings
50
Am29LV256M
September 15, 2003
D A T A S H E E T
AC CHARACTERISTICS
Hardware Reset (RESET#)
Parameter
JEDEC
Std.
Description
All Speed Options
Unit
tReady
RESET# Pin Low (During Embedded Algorithms)
to Read Mode (See Note)
Max
20
µs
tReady
RESET# Pin Low (NOT During Embedded
Algorithms) to Read Mode (See Note)
Max
500
ns
tRP
RESET# Pulse Width
Min
500
ns
tRH
Reset High Time Before Read (See Note)
Min
50
ns
tRPD
RESET# Low to Standby Mode
Min
20
µs
tRB
RY/BY# Recovery Time
Min
0
ns
Note:
1. Not 100% tested.
2. AC specifications listed are tested with VIO = VCC. Contact AMD for information on AC operation with VIO ≠ VCC.
RY/BY#
CE#, OE#
tRH
RESET#
tRP
tReady
Reset Timings NOT during Embedded Algorithms
Reset Timings during Embedded Algorithms
tReady
RY/BY#
tRB
CE#, OE#
RESET#
tRP
Figure 15.
September 15, 2003
Reset Timings
Am29LV256M
51
D A T A S H E E T
AC CHARACTERISTICS
Erase and Program Operations
Parameter
Speed Options
JEDEC
Std.
Description
tAVAV
tWC
Write Cycle Time (Note 1)
Min
tAVWL
tAS
Address Setup Time
Min
0
ns
tASO
Address Setup Time to OE# low during toggle bit polling
Min
15
ns
tAH
Address Hold Time
Min
45
ns
tAHT
Address Hold Time From CE# or OE# high
during toggle bit polling
Min
0
ns
tDVWH
tDS
Data Setup Time
Min
45
ns
tWHDX
tDH
Data Hold Time
Min
0
ns
tOEPH
Output Enable High during toggle bit polling
Min
20
ns
tGHWL
tGHWL
Read Recovery Time Before Write
(OE# High to WE# Low)
Min
0
ns
tELWL
tCS
CE# Setup Time
Min
0
ns
tWHEH
tCH
CE# Hold Time
Min
0
ns
tWLWH
tWP
Write Pulse Width
Min
35
ns
tWHDL
tWPH
Write Pulse Width High
Min
30
ns
Write Buffer Program Operation (Notes 2, 3)
Typ
240
µs
Per Byte
Typ
7.5
µs
Per Word
Typ
15
µs
Per Byte
Typ
6.25
µs
Per Word
Typ
12.5
µs
Byte
Typ
60
µs
Word
Typ
60
µs
Byte
Typ
54
µs
Word
Typ
54
µs
tWLAX
Effective Write Buffer Program Operation
(Notes 2, 4)
tWHWH1
tWHWH1
Accelerated Effective Write Buffer Program
Operation (Notes 2, 4)
Single Byte/Word
Program Operation (Note 2, 5)
Accelerated Single Byte/Word
Programming Operation (Note 2, 5)
tWHWH2
103, 103R
113, 113R
123, 123R
Unit
100
110
120
ns
tWHWH2
Sector Erase Operation (Note 2)
Typ
0.5
sec
tVHH
VHH Rise and Fall Time (Note 1)
Min
250
ns
tVCS
VCC Setup Time (Note 1)
Min
50
µs
tBUSY
Erase/Program Valid to RY/BY# Delay
Max
100
110
120
ns
Notes:
1. Not 100% tested.
2. See the “Erase And Programming Performance” section for more information.
3. For 1–16 words/1–32 bytes programmed.
4. Effective write buffer specification is based upon a 16-word/32-byte write buffer operation.
5. Byte/Word programming specification is based upon a single word/byte programming operation not utilizing the write buffer.
6. AC specifications listed are tested with VIO = VCC. Contact AMD for information on AC operation with VIO ≠ VCC.
52
Am29LV256M
September 15, 2003
D A T A S H E E T
AC CHARACTERISTICS
Program Command Sequence (last two cycles)
tAS
tWC
Addresses
Read Status Data (last two cycles)
555h
PA
PA
PA
tAH
CE#
tCH
OE#
tWHWH1
tWP
WE#
tWPH
tCS
tDS
tDH
A0A0h
Data
PD
Statu
tBUSY
DOUT
tRB
RY/BY#
VCC
tVCS
Notes:
1. PA = program address, PD = program data, DOUT is the true data at the program address.
2. Illustration shows device in word mode.
Figure 16. Program Operation Timings
VHH
ACC
VIL or VIH
VIL or VIH
tVHH
tVHH
Figure 17. Accelerated Program Timing Diagram
September 15, 2003
Am29LV256M
53
D A T A S H E E T
AC CHARACTERISTICS
Erase Command Sequence (last two cycles)
tAS
tWC
2AAh
Addresses
Read Status Data
VA
SA
555h for chip erase
VA
tAH
CE#
tCH
OE#
tWP
WE#
tWPH
tCS
tWHWH2
tDS
tDH
Data
5555h
In
Progress
3030h
Complete
10 for Chip Erase
tBUSY
tRB
RY/BY#
tVCS
VCC
Notes:
1. SA = sector address (for Sector Erase), VA = Valid Address for reading status data (see “Write Operation Status”.
2. These waveforms are for the word mode.
Figure 18.
54
Chip/Sector Erase Operation Timings
Am29LV256M
September 15, 2003
D A T A S H E E T
AC CHARACTERISTICS
tRC
Addresses
VA
VA
VA
tACC
tCE
CE#
tCH
tOE
OE#
tOEH
tDF
WE#
tOH
DQ15 and DQ7
DQ14–DQ8, DQ6–DQ0
Complement
Complement
Status Data
Status Data
True
True
Valid Data
Valid Data
High Z
High Z
tBUSY
RY/BY#
Note: VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array data
read cycle.
Figure 19.
September 15, 2003
Data# Polling Timings (During Embedded Algorithms)
Am29LV256M
55
D A T A S H E E T
AC CHARACTERISTICS
tAHT
tAS
Addresses
tAHT
tASO
CE#
tCEPH
tOEH
WE#
tOEPH
OE#
tDH
DQ6 & DQ14/
DQ2 & DQ10
tOE
Valid Data
Valid
Status
Valid
Status
Valid
Status
(first read)
(second read)
(stops toggling)
Valid Data
RY/BY#
Note: VA = Valid address; not required for DQ6. Illustration shows first two status cycle after command sequence, last status
read cycle, and array data read cycle
Figure 20. Toggle Bit Timings (During Embedded Algorithms)
Enter
Embedded
Erasing
WE#
Erase
Suspend
Erase
Enter Erase
Suspend Program
Erase
Suspend
Program
Erase Suspend
Read
Erase
Resume
Erase Suspend
Read
Erase
Erase
Complete
DQ6
DQ2
Note: DQ2 toggles only when read at an address within an erase-suspended sector. The system may use OE# or CE# to toggle
DQ2 and DQ6.
Figure 21.
56
DQ2 vs. DQ6
Am29LV256M
September 15, 2003
D A T A S H E E T
AC CHARACTERISTICS
Temporary Sector Unprotect
Parameter
JEDEC
Std
Description
tVIDR
VID Rise and Fall Time (See Note)
tRSP
RESET# Setup Time for Temporary Sector
Unprotect
All Speed Options
Unit
Min
500
ns
Min
4
µs
Note: Not 100% tested.
VID
RESET#
VID
VSS, VIL,
or VIH
VSS, VIL,
or VIH
tVIDR
tVIDR
Program or Erase Command Sequence
CE#
WE#
tRRB
tRSP
RY/BY#
Figure 22.
September 15, 2003
Temporary Sector Group Unprotect Timing Diagram
Am29LV256M
57
D A T A S H E E T
AC CHARACTERISTICS
VID
VIH
RESET#
SA, A6,
A1, A0
Valid*
Valid*
Sector Group Protect or Unprotect
Data
6060h
6060h
Valid*
Verify
4040h
Status
Sector Group Protect: 150 µs,
Sector Group Unprotect: 15 ms
1 µs
CE#
WE#
OE#
* For sector group protect, A6 = 0, A1 = 1, A0 = 0. For sector group unprotect, A6 = 1, A1 = 1, A0 = 0.
Figure 23. Sector Group Protect and Unprotect Timing Diagram
58
Am29LV256M
September 15, 2003
D A T A S H E E T
AC CHARACTERISTICS
Alternate CE# Controlled Erase and Program Operations
Parameter
Speed Options
JEDEC
Std.
Description
tAVAV
tWC
Write Cycle Time (Note 1)
Min
tAVWL
tAS
Address Setup Time
Min
0
ns
tELAX
tAH
Address Hold Time
Min
45
ns
tDVEH
tDS
Data Setup Time
Min
45
ns
tEHDX
tDH
Data Hold Time
Min
0
ns
tGHEL
tGHEL
Read Recovery Time Before Write
(OE# High to WE# Low)
Min
0
ns
tWLEL
tWS
WE# Setup Time
Min
0
ns
tEHWH
tWH
WE# Hold Time
Min
0
ns
tELEH
tCP
CE# Pulse Width
Min
45
ns
tEHEL
tCPH
CE# Pulse Width High
Min
30
ns
Write Buffer Program Operation (Notes 2, 3)
Typ
240
µs
Per Byte
Typ
7.5
µs
Per Word
Typ
15
µs
Per Byte
Typ
6.25
µs
Per Word
Typ
12.5
µs
Byte
Typ
60
µs
Word
Typ
60
µs
Byte
Typ
54
µs
Word
Typ
54
µs
Typ
0.5
sec
Effective Write Buffer Program Operation
(Notes 2, 4)
tWHWH1
tWHWH1
Effective Accelerated Write Buffer
Program Operation (Notes 2, 4)
Single Byte/Word
Program Operation (Note 2, 5)
Accelerated Single Byte/Word
Programming Operation
(Note 2, 5)
tWHWH2
tWHWH2
Sector Erase Operation (Note 2)
103, 103R
113, 113R
123, 123R
Unit
100
110
120
ns
Notes:
1. Not 100% tested.
2. See the “Erase And Programming Performance” section for more information.
3. For 1–16 words/1–32 bytes programmed.
4. Effective write buffer specification is based upon a 16-word/32-byte write buffer operation.
5. Byte/Word programming specification is based upon a single word/byte programming operation not utilizing the write buffer.
6. AC specifications listed are tested with VIO = VCC. Contact AMD for information on AC operation with VIO ≠ VCC
September 15, 2003
Am29LV256M
59
D A T A S H E E T
AC CHARACTERISTICS
PA for program
SA for sector erase
555 for chip erase
555 for program
2AA for erase
Data# Polling
Addresses
PA
tWC
tAS
tAH
tWH
WE#
tGHEL
OE#
tWHWH1 or 2
tCP
CE#
tWS
tCPH
tBUSY
tDS
tDH
DQ7#,
DQ15
Data
tRH
DOUT
A0A0 for program PD for program
5555 for erase
3030 for sector erase
1010 for chip erase
RESET#
RY/BY#
Notes:
1. Figure indicates last two bus cycles of a program or erase operation.
2. PA = program address, SA = sector address, PD = program data.
3. DQ7# is the complement of the data written to the device. DOUT is the data written to the device.
4. Waveforms are for the word mode.
Figure 24. Alternate CE# Controlled Write (Erase/Program)
Operation Timings
LATCHUP CHARACTERISTICS
Description
Min
Max
Input voltage with respect to VSS on all pins except I/O pins
(including A9, OE#, and RESET#)
–1.0 V
12.5 V
Input voltage with respect to VSS on all I/O pins
–1.0 V
VCC + 1.0 V
–100 mA
+100 mA
VCC Current
Note: Includes all pins except VCC. Test conditions: VCC = 3.0 V, one pin at a time.
60
Am29LV256M
September 15, 2003
D A T A S H E E T
ERASE AND PROGRAMMING PERFORMANCE
Parameter
Typ (Note 1)
Max (Note 2)
Unit
Comments
Sector Erase Time
0.5
3.5
sec
Chip Erase Time
256
512
sec
Excludes 00h programming
prior to erasure (Note 6)
Byte
60
600
µs
Word
60
600
µs
Byte
54
540
µs
Word
54
540
µs
240
1200
µs
Per Byte
7.5
38
µs
Per Word
15
75
µs
200
1040
µs
Per Byte
6.25
33
µs
Per Word
12.5
65
µs
252
584
sec
Single Byte/Word
Program Time (Note 3)
Accelerated Single Byte/Word
Program Time
(Note 3)
Total Write Buffer Program
Time (Note 4)
Effective Write Buffer Program
Time (Note 5)
Total Accelerated Write Buffer
Program Time (Note 4)
Effective Accelerated Write
Buffer Program Time
(Note 5)
Chip Program Time
Excludes system level
overhead (Note 7)
Notes:
1. Typical program and erase times assume the following conditions: 25°C, 3.0 V VCC. Programming specifications assume
that all bits are programmed to 00h.
2. Maximum values are measured at VCC = 3.0, worst case temperature. Maximum values are valid up to and including 100,000
program/erase cycles.
3. Byte/Word programming specification is based upon a single word/byte programming operation not utilizing the write buffer.
4. For 1-16 words or 1-32 bytes programmed in a single write buffer programming operation.
5. Effective write buffer specification is based upon a 16-word/32-byte write buffer operation.
6. In the pre-programming step of the Embedded Erase algorithm, all bits are programmed to 00h before erasure.
7. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Table
11 for further information on command definitions.
8. The device has a minimum erase and program cycle endurance of 100,000 cycles.
TSOP PIN AND BGA PACKAGE CAPACITANCE
Parameter Symbol
Parameter Description
CIN
Input Capacitance
COUT
Output Capacitance
CIN2
Control Pin Capacitance
Test Setup
VIN = 0
VOUT = 0
VIN = 0
Typ
Max
Unit
TSOP
6
7.5
pF
BGA
4.2
5
pF
TSOP
8.5
12
pF
BGA
5.4
6.5
pF
TSOP
7.5
9
pF
BGA
3.9
4.7
pF
Notes:
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0 MHz.
September 15, 2003
Am29LV256M
61
D A T A S H E E T
DATA RETENTION
Parameter Description
Test Conditions
Min
Unit
150°C
10
Years
125°C
20
Years
Minimum Pattern Data Retention Time
62
Am29LV256M
September 15, 2003
D A T A S H E E T
PHYSICAL DIMENSIONS
TS056/TSR056—56-Pin Standard/Reverse Thin Small Outline Package (TSOP)
PACKAGE
JEDEC
SYMBOL
NOTES:
TS/TSR 56
MO-142 (B) EC
MIN.
NOM.
MAX.
1
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982.)
A
---
---
1.20
2
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
A1
0.05
---
0.15
3
PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN), INK OR LASER MARK.
A2
0.95
1.00
1.05
4
b1
0.17
0.20
0.23
b
c1
0.17
0.10
0.22
---
0.27
0.16
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS
DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE
LEADS ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
5
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
MOLD PROTUSION IS 0.15 mm PER SIDE.
6
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE
DAMBAR PROTUSION SHALL BE 0.08 mm TOTAL IN EXCESS OF b
DIMENSION AT MAX MATERIAL CONDITION. MINIMUM SPACE BETWEEN
PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 mm.
7
THESE DIMESIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN
0.10 mm AND 0.25 mm FROM THE LEAD TIP.
8.
LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE
SEATING PLANE.
9
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
c
0.10
---
0.21
D
19.90
20.00
20.20
D1
18.30
18.40
18.50
E
13.90
14.00
14.10
0.50 BASIC
e
L
0.50
0.60
0.70
O
0˚
3˚
5˚
R
0.08
---
0.20
N
September 15, 2003
56
3160\38.10A
Am29LV256M
63
D A T A S H E E T
PHYSICAL DIMENSIONS
LAC064—64-Ball Fortified Ball Grid Array
18 x 12 mm Package
D
0.20 C
2X
D1
A
eD
H
G
F
E
D
C
B
A
8
7
7
SE
6
eE
5
E1
E
3
φ0
.50
1.00±0.5
4
2
1
A1 CORNER ID.
(INK OR LASER)
1.00±0.5
A1
CORNER
B
6
0.20 C
2X
TOP VIEW
A1
CORNER
NXφb
SD
7
φ 0.25 M C A B
φ 0.10 M C
BOTTOM VIEW
0.25 C
A
A2
SEATING PLANE
A1
C
0.15 C
SIDE VIEW
NOTES:
PACKAGE
LAC 064
JEDEC
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
N/A
2. ALL DIMENSIONS ARE IN MILLIMETERS.
18.00 mm x 12.00 mm
PACKAGE
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
SYMBOL
MIN
NOM
MAX
A
---
---
1.40
NOTE
A1
0.40
---
---
STANDOFF
A2
0.60
---
---
BODY THICKNESS
4.
PROFILE HEIGHT
D
18.00 BSC.
BODY SIZE
E
12.00 BSC.
BODY SIZE
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
D1
7.00 BSC.
MATRIX FOOTPRINT
E1
7.00 BSC.
MATRIX FOOTPRINT
MD
8
MATRIX SIZE D DIRECTION
ME
8
MATRIX SIZE E DIRECTION
N
64
BALL COUNT
φb
0.50
0.60
0.70
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
BALL DIAMETER
eD
1.00 BSC.
BALL PITCH - D DIRECTION
eE
1.00 BSC.
BALL PITCH - E DIRECTION
SD / SE
0.50 BSC.
SOLDER BALL PLACEMENT
NONE
e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
DEPOPULATED SOLDER BALLS
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
3243 \ 16-038.12d
64
Am29LV256M
September 15, 2003
D A T A S H E E T
REVISION SUMMARY
Revision A (August 3, 2001)
Revision B+2 (September 9, 2002)
Initial release as abbreviated Advance Information
data sheet.
Product Selector Guide, Ordering Information,
Read-Only Operations, Erase and Program
Operations, and Alternate CE# Controlled Erase
and Program Operations
Revision A+1 (September 12, 2001)
Ordering Information
Changed package part number designation from WH
to PC.
Physical Dimensions
Added regulated OPNs.
Changed all OPNs that end with 4 or 9 to end with 3 or
8.
Added the TS056 and LAA064 packages.
Changed all package markings that contain combinations that end with 4 or 9 to end with 3 or 8.
Revision A+2 (October 3, 2001)
CFI
Global
Modified wording of last paragraph to read: “reading
array data.”
Corrected title from 64 Mbit to 256 Mbit. Added 120 ns
speed option.
Distinctive Characteristics
Program Suspend/Program Resume Command
Sequence
SecSiTM (Secured Silicon) Sector region: Corrected
64-byte to 256-byte.
Changed 15 µs typical to maximum and added 5 µs
typical.
Connection Diagram
Erase Suspend/Erase Resume Commands
Modified Fortified BGA ball grid to an 8 x 8 ball matrix.
Changed RFU (reserved for future use) balls to NC
(No Connection).
Changed typical from 20 µs to 5 µs and added a maximum of 20 µs.
Ordering Information
Added final package drawing.
Changed operating voltage range on 90 ns speed option to 3.0–3.6 V.
Revision B+3 (October 23, 2002)
Pin Description
SecSi (Secured Silicon) Sector Flash
Memory Region
Added A-1 description.
LAC064—64-Ball Fortified Ball Grid Array
Added x8 address range.
Revision A+3 (March 25, 2002)
Physical Dimensions
Clarified description of Enhanced VersatileIO control.
Modified drawing to show the actual number of balls
on device package.
Physical Dimensions
Revision B+4 (November 6, 2002)
Added drawing that shows both TS056 and TSR056
specifications.
Global
Revision B (July 1, 2002)
Removed the Enhanced VI/O option and changed it to
VI/O only.
Distinctive Characteristics
Expanded data sheet to full specification version.
Product Selector Guide
Revision B+1 (July 10, 2002)
Removed the 98R, 108, 108R, 118, 118R, 128, and
128R Speed Options.
Ordering Information, Physical Dimensions
Corrected package description to LAC064, 18 x 12
mm Fortified BGA.
Modified Note #2.
DC Characteristics table
Moved VIO from far left side of the block diagram and
moved it to Input/Output Buffers.
Deleted IACC specification.
Ordering Information
Modified Order numbers and package markings to reflect the removal of speed options.
September 15, 2003
Am29LV256M
65
D A T A S H E E T
Table 4. SecSi Sector Contents
Figure 6. Program Suspend/Program Resume
Added x8 and x16
Change wait time to 15 µs.
Operating Ranges
Operating Ranges
Changed the VIO supply range to 1.65–3.6 V.
Corrected typos in VIO ranges.
Erase and Programming Performance
Removed full voltage range.
Changed the typicals and/or maximums of Chip Erase
Time, Effective Write Buffer Program Time, and Program Time to TBD.
CMOS Compatible
Changed VIH1 and VIH2 minimum to 1.9.
Removed typos in notes.
Customer Lockable: SecSi Sector NOT
Programmed or Protected at the factory.
Read-Only Characteristics
Added second bullet, SecSi sector-protect verify text
and figure 3.
Added note #3.
Hardware Reset, Erase and Program Operations,
Temporary Sector Unprotect, and Alternate CE#
Controlled Erase and Program Operations
Table 7. Device Geometry Definition
Changed the x16 data for 2Dh to 00FFh.
SecSi Sector Flash Memory Region, and Enter
SecSi Sector/Exit SecSi Sector Command
Sequence
Added Note.
Revision C (February 14, 2003)
Noted that the ACC function and unlock bypass modes
are not available when the SecSi sector is enabled.
Byte/Word Program Command Sequence, Sector
Erase Command Sequence, and Chip Erase Command Sequence
Distinctive Characteristics
Corrected performance characteristics.
Product Selector Guide
Removed 93R speed option.
Noted that the SecSi Sector, autoselect, and CFI
functions are unavailable when a program or erase
operation is in progress.
Added note 2.
Common Flash Memory Interface (CFI)
Corrected Valid Combination to reflect speed option
changes.
Changed CFI website address.
Ordering Information
Added Note.
Revision B+5 (November 11, 2002)
AC Characteristics
Product Selector Guide and Read Only Operations
Removed 93, 93R speed option.
Added a 30 ns Page Access time and Output Enable
Access time to the 113R and 123R Speed Options.
Added Note
Revision B+6 (December 2, 2002)
Global
Input values in the tWHWH1 and tWHWH2 parameters in
the Erase and Program Options table that were previously TBD. Also added notes 5 and 6.
Product Selector Guide
Input values in the tWHWH1 and tWHWH2 parameters in
the Alternate CE# Controlled Erase and Program Options table that were previously TBD. Also added
notes 5.
Added VIOs to table and removed Note #2
Erase and Programming Performance
Ordering Information
Input values into table that were previously TBD.
Corrected typos in VIO ranges.
Added note 4.
Added Sector Group Protection and added Table 4.
Removed Note.
66
Am29LV256M
September 15, 2003
D A T A S H E E T
Revision C+1 (May 28, 2003)
Revision C+3 (September 15, 2003)
Global
Ordering Information
Converted to full datasheet version.
Added OPN note for ESN feature.
Modified SecSi Sector Flash Memory Region section
to include ESN references.
Tables 11 & 12 Command Definitions
Erase and Programming Performance
Input values into table that were previously TBD.
Changed definition BA to XXX for Program/Erase Suspend (Note 16) and for Program/Erase Resume (Note
17).
Modified notes.
Program Suspend/Program Resume Command
Sequence
CMOS Compatible
Removed - program suspended sector is required
when writing this command.
Corrected typos in table.
AC Characteristics - Hardware Reset
Erase and Program Operations and Alternate CE#
Controlled Erase and Program Operations
Changed the typical for the Accelerated Effective
Write Buffer Program Operation for Byte and Word to
6.25 and 12.5.
Added information for tRB.
AC Characteristics - Erase and Program
Operations
Added information for tBUSY.
Revision C+2 (June 11, 2003)
Global
Modified speed grades available.
Trademarks
Copyright © 2003 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
ExpressFlash is a trademark of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
September 15, 2003
Am29LV256M
67
Representatives in U.S. and Canada
Sales Offices and Representatives
North America
ALABAMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 5 6 ) 8 3 0 - 9 1 9 2
ARIZONA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 6 0 2 ) 24 2 - 4 4 0 0
CALIFORNIA,
Irvine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 4 9 ) 4 5 0 - 7 5 0 0
Sunnyvale . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 0 8 ) 7 3 2 - 24 0 0
COLORADO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 3 0 3 ) 74 1 - 2 9 0 0
CONNECTICUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 0 3 ) 2 6 4 - 7 8 0 0
FLORIDA,
Clearwater . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 2 7 ) 7 9 3 - 0 0 5 5
Miami (Lakes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 3 0 5 ) 8 2 0 - 1 1 1 3
GEORGIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 7 0 ) 8 1 4 - 0 2 2 4
ILLINOIS,
Chicago . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 6 3 0 ) 7 7 3 - 4 4 2 2
MASSACHUSETTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 8 1 ) 2 1 3 - 6 4 0 0
MICHIGAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 4 8 ) 4 7 1 - 6 2 9 4
MINNESOTA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 6 1 2 ) 74 5 - 0 0 0 5
NEW JERSEY,
Chatham . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 7 3 ) 7 0 1 - 1 7 7 7
NEW YORK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 1 6 ) 4 2 5 - 8 0 5 0
NORTH CAROLINA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 1 9 ) 8 4 0 - 8 0 8 0
OREGON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 5 0 3 ) 24 5 - 0 0 8 0
PENNSYLVANIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 1 5 ) 3 4 0 - 1 1 8 7
SOUTH DAKOTA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 6 0 5 ) 69 2 - 5 7 7 7
TEXAS,
Austin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 5 1 2 ) 3 4 6 - 7 8 3 0
Dallas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 7 2 ) 9 8 5 - 1 3 4 4
Houston . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 8 1 ) 3 76 - 8 0 8 4
VIRGINIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 0 3 ) 7 3 6 - 9 5 6 8
International
AUSTRALIA, North Ryde . . . . . . . . . . . . . . . . . . . . . . . T E L ( 6 1 ) 2 - 8 8 - 7 7 7 - 2 2 2
BELGIUM, Antwerpen . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 2 ) 3 - 2 4 8 - 4 3 - 0 0
BRAZIL, San Paulo . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 5 5 ) 1 1 - 5 5 0 1 - 2 1 0 5
CHINA,
Beijing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 6 ) 1 0 - 6 5 1 0 - 2 1 8 8
Shanghai . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 6 ) 2 1 - 6 3 5 - 0 0 8 3 8
Shenzhen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 6 ) 7 5 5 - 24 6 - 1 5 5 0
FINLAND, Helsinki . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 5 8 ) 8 8 1 - 3 1 1 7
FRANCE, Paris . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 3 ) - 1 - 4 9 7 5 1 0 1 0
GERMANY,
Bad Homburg . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 9 ) - 6 1 7 2 - 9 2 6 7 0
Munich . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 9 ) - 8 9 - 4 5 0 5 3 0
HONG KONG, Causeway Bay . . . . . . . . . . . . . . . . . . . T E L ( 8 5 ) 2 - 2 9 5 6 - 0 3 8 8
ITALY, Milan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 9 ) - 0 2 - 3 8 1 9 6 1
INDIA, New Delhi . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 9 1 ) 1 1 - 6 2 3 - 8 6 2 0
JAPAN,
Osaka . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 1 ) 6 - 6 2 4 3 - 3 2 5 0
Tokyo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 1 ) 3 - 3 3 4 6 - 7 6 0 0
KOREA, Seoul . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 2 ) 2 - 3 4 6 8 - 2 6 0 0
RUSSIA, Moscow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(7)-095-795-06-22
SWEDEN, Stockholm . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 6 ) 8 - 5 62 - 5 4 0 - 0 0
TAIWAN,Taipei . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 8 6 ) 2 - 8 7 7 3 - 1 5 5 5
UNITED KINGDOM,
Frimley . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 4 ) 1 2 76 - 8 0 3 1 0 0
Haydock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 4 ) 1 9 4 2 - 2 7 2 8 8 8
Advanced Micro Devices reserves the right to make changes in its product without notice
in order to improve design or performance characteristics.The performance
characteristics listed in this document are guaranteed by specific tests, guard banding,
design and other practices common to the industry. For specific testing details, contact
your local AMD sales representative.The company assumes no responsibility for the use of
any circuits described herein.
© Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD Arrow logo and combination thereof, are trademarks of
Advanced Micro Devices, Inc. Other product names are for informational purposes only
and may be trademarks of their respective companies.
es
ARIZONA,
Tempe - Centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 8 0 ) 8 3 9 - 2 3 2 0
CALIFORNIA,
Calabasas - Centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 8 1 8 ) 8 7 8 - 5 8 0 0
Irvine - Centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 4 9 ) 2 6 1 - 2 1 2 3
San Diego - Centaur. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 8 5 8 ) 2 7 8 - 4 9 5 0
Santa Clara - Fourfront. . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 0 8 ) 3 5 0 - 4 8 0 0
CANADA,
Burnaby, B.C. - Davetek Marketing. . . . . . . . . . . . . . . . . . . . ( 6 0 4 ) 4 3 0 - 3 6 8 0
Calgary, Alberta - Davetek Marketing. . . . . . . . . . . . . . . . . ( 4 0 3 ) 2 8 3 - 3 5 7 7
Kanata, Ontario - J-Squared Tech. . . . . . . . . . . . . . . . . . . . ( 6 1 3 ) 5 9 2 - 9 5 4 0
Mississauga, Ontario - J-Squared Tech. . . . . . . . . . . . . . . . . . ( 9 0 5 ) 6 7 2 - 2 0 3 0
St Laurent, Quebec - J-Squared Tech. . . . . . . . . . . . . . . . ( 5 1 4 ) 7 4 7 - 1 2 1 1
COLORADO,
Golden - Compass Marketing . . . . . . . . . . . . . . . . . . . . . . ( 3 0 3 ) 2 7 7 - 0 4 5 6
FLORIDA,
Melbourne - Marathon Technical Sales . . . . . . . . . . . . . . . . ( 3 2 1 ) 7 2 8 - 7 7 0 6
Ft. Lauderdale - Marathon Technical Sales . . . . . . . . . . . . . . ( 9 5 4 ) 5 2 7 - 4 9 4 9
Orlando - Marathon Technical Sales . . . . . . . . . . . . . . . . . . ( 4 0 7 ) 8 7 2 - 5 7 7 5
St. Petersburg - Marathon Technical Sales . . . . . . . . . . . . . . ( 7 2 7 ) 8 9 4 - 3 6 0 3
GEORGIA,
Duluth - Quantum Marketing . . . . . . . . . . . . . . . . . . . . . ( 6 7 8 ) 5 8 4 - 1 1 2 8
ILLINOIS,
Skokie - Industrial Reps, Inc. . . . . . . . . . . . . . . . . . . . . . . . . ( 8 4 7 ) 9 6 7 - 8 4 3 0
INDIANA,
Kokomo - SAI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 6 5 ) 4 5 7 - 7 2 4 1
IOWA,
Cedar Rapids - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . ( 3 1 9 ) 2 9 4 - 1 0 0 0
KANSAS,
Lenexa - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 1 3 ) 4 6 9 - 1 3 1 2
MASSACHUSETTS,
Burlington - Synergy Associates . . . . . . . . . . . . . . . . . . . . . ( 7 8 1 ) 2 3 8 - 0 8 7 0
MICHIGAN,
Brighton - SAI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 8 1 0 ) 2 2 7 - 0 0 0 7
MINNESOTA,
St. Paul - Cahill, Schmitz & Cahill, Inc. . . . . . . . . . . . . . . . . . ( 6 5 1 ) 69 9 - 0 2 0 0
MISSOURI,
St. Louis - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . . . . . ( 3 1 4 ) 9 9 7 - 4 5 5 8
NEW JERSEY,
Mt. Laurel - SJ Associates . . . . . . . . . . . . . . . . . . . . . . . . . ( 8 5 6 ) 8 6 6 - 1 2 3 4
NEW YORK,
Buffalo - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 1 6 ) 7 4 1 - 7 1 1 6
East Syracuse - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . ( 3 1 5 ) 4 3 7 - 8 3 4 3
Pittsford - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 1 6 ) 5 8 6 - 3 6 6 0
Rockville Centre - SJ Associates . . . . . . . . . . . . . . . . . . . . ( 5 1 6 ) 5 3 6 - 4 2 4 2
NORTH CAROLINA,
Raleigh - Quantum Marketing . . . . . . . . . . . . . . . . . . . . . . ( 9 1 9 ) 8 4 6 - 5 7 2 8
OHIO,
Middleburg Hts - Dolfuss Root & Co. . . . . . . . . . . . . . . . . ( 4 4 0 ) 8 1 6 - 1 6 6 0
Powell - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . . . . . ( 6 1 4 ) 7 8 1 - 0 7 2 5
Vandalia - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . . . . ( 9 3 7 ) 8 9 8 - 9 6 1 0
Westerville - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . ( 6 1 4 ) 5 2 3 - 1 9 9 0
OREGON,
Lake Oswego - I Squared, Inc. . . . . . . . . . . . . . . . . . . . . . . ( 5 0 3 ) 6 7 0 - 0 5 5 7
UTAH,
Murray - Front Range Marketing . . . . . . . . . . . . . . . . . . . . ( 8 0 1 ) 2 8 8 - 2 5 0 0
VIRGINIA,
Glen Burnie - Coherent Solution, Inc. . . . . . . . . . . . . . . . . ( 4 1 0 ) 7 6 1 - 2 2 5 5
WASHINGTON,
Kirkland - I Squared, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 2 5 ) 8 2 2 - 9 2 2 0
WISCONSIN,
Pewaukee - Industrial Representatives . . . . . . . . . . . . . . . . ( 2 6 2 ) 5 74 - 9 3 9 3
Representatives in Latin America
ARGENTINA,
Capital Federal Argentina/WW Rep. . . . . . . . . . . . . . . . . . . .54-11)4373-0655
CHILE,
Santiago - LatinRep/WWRep. . . . . . . . . . . . . . . . . . . . . . . . . .(+562)264-0993
COLUMBIA,
Bogota - Dimser. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 5 7 1 ) 4 1 0 - 4 1 8 2
MEXICO,
Guadalajara - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . . ( 5 2 3 ) 8 1 7 - 3 9 0 0
Mexico City - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . . ( 5 2 5 ) 7 5 2 - 2 7 2 7
Monterrey - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . . . ( 5 2 8 ) 3 69 - 6 8 2 8
PUERTO RICO,
Boqueron - Infitronics. . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 8 7 ) 8 5 1 - 6 0 0 0
One AMD Place, P.O. Box 3453, Sunnyvale, CA 94088-3453 408-732-2400
TWX 910-339-9280 TELEX 34-6306 800-538-8450 http://www.amd.com
©2003 Advanced Micro Devices, Inc.
01/03
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