MC74HC4020A 14−Stage Binary Ripple Counter High−Performance Silicon−Gate CMOS The MC74C4020A is identical in pinout to the standard CMOS MC14020B. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. This device consists of 14 master−slave flip−flops with 12 stages brought out to pins. The output of each flip−flop feeds the next and the frequency at each output is half of that of the preceding one. Reset is asynchronous and active−high. State changes of the Q outputs do not occur simultaneously because of internal ripple delays. Therefore, decoded output signals are subject to decoding spikes and may have to be gated with the Clock of the HC4020A for some designs. Features • • • • • • • • http://onsemi.com MARKING DIAGRAMS 16 PDIP−16 N SUFFIX CASE 648 16 1 1 16 SOIC−16 D SUFFIX CASE 751B 16 Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1 mA High Noise Immunity Characteristic of CMOS Devices In Compliance With JEDEC Standard No. 7A Requirements Chip Complexity: 398 FETs or 99.5 Equivalent Gates Pb−Free Packages are Available* MC74HC4020AN AWLYYWWG 1 HC4020AG AWLYWW 1 16 16 1 TSSOP−16 DT SUFFIX CASE 948F HC40 20A ALYWG G 1 16 16 1 SOEIAJ−16 F SUFFIX CASE 966 74HC4020A ALYWG 1 A = Assembly Location L, WL = Wafer Lot Y, YY = Year W, WW = Work Week G = Pb−Free Package G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2005 June, 2005 − Rev. 4 1 Publication Order Number: MC74HC4020A/D MC74HC4020A FUNCTION TABLE Clock Reset 9 7 5 4 6 13 12 14 15 1 2 3 10 11 Q1 Q4 Q5 Q6 Q7 Q8 Q9 Q10 Q11 Q12 Q13 Q14 Pin 16 = VCC Pin 8 = GND Figure 1. Logic Diagram Clock Reset X L L H Output State No Charge Advance to Next State All Outputs Are Low VCC Q11 Q10 Q8 Q9 16 15 14 13 12 Reset Clock 11 10 Q1 9 1 2 3 4 5 6 7 Q12 Q13 Q14 Q6 Q5 Q7 Q4 8 GND Figure 2. Pinout: 16−Lead Plastic Package (Top View) ORDERING INFORMATION Package Shipping † MC74HC4020AN PDIP−16 500 Units / Rail MC74HC4020ANG PDIP−16 (Pb−Free) 500 Units / Rail MC74HC4020AD SOIC−16 48 Units / Rail MC74HC4020ADG SOIC−16 (Pb−Free) 48 Units / Rail MC74HC4020ADR2 SOIC−16 2500 Units / Reel MC74HC4020ADR2G SOIC−16 (Pb−Free) 2500 Units / Reel MC74HC4020ADTR2 TSSOP−16* 2500 Units / Reel MC74HC4020ADTR2G TSSOP−16* 2500 Units / Reel MC74HC4020AF SOEIAJ−16 50 Units / Rail MC74HC4020AFG SOEIAJ−16 (Pb−Free) 50 Units / Rail MC74HC4020AFEL SOEIAJ−16 2000 Units / Reel MC74HC4020AFELG SOEIAJ−16 (Pb−Free) 2000 Units / Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 2 MC74HC4020A ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ MAXIMUM RATINGS Symbol Parameter Value Unit – 0.5 to + 7.0 V DC Input Voltage (Referenced to GND) – 0.5 to VCC + 0.5 V DC Output Voltage (Referenced to GND) – 0.5 to VCC + 0.5 V VCC DC Supply Voltage (Referenced to GND) Vin Vout Iin DC Input Current, per Pin ± 20 mA Iout DC Output Current, per Pin ± 25 mA ICC DC Supply Current, VCC and GND Pins ± 50 mA PD Power Dissipation in Still Air 750 500 450 mW Tstg Storage Temperature Range – 65 to + 150 _C TL Lead Temperature, 1 mm from Case for 10 Seconds Plastic DIP, SOIC or TSSOP Package Plastic DIP† SOIC Package† TSSOP Package† This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. _C 260 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. †Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: − 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ RECOMMENDED OPERATING CONDITIONS Symbol VCC Vin, Vout Parameter Min DC Supply Voltage (Referenced to GND) Max Unit 2.0 6.0 V 0 VCC V – 55 + 125 _C 0 0 0 0 1000 600 500 400 ns DC Input Voltage, Output Voltage (Referenced to GND) TA Operating Temperature Range, All Package Types tr, tf Input Rise/Fall Time (Figure 1) VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 6.0 V DC CHARACTERISTICS (Voltages Referenced to GND) Symbol Parameter Condition Guaranteed Limit VCC V −55 to 25°C ≤85°C ≤125°C Unit VIH Minimum High−Level Input Voltage Vout = 0.1V or VCC −0.1V |Iout| ≤ 20mA 2.0 3.0 4.5 6.0 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 V VIL Maximum Low−Level Input Voltage Vout = 0.1V or VCC − 0.1V |Iout| ≤ 20mA 2.0 3.0 4.5 6.0 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 V VOH Minimum High−Level Output Voltage Vin = VIH or VIL |Iout| ≤ 20mA 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 V 3.0 4.5 6.0 2.48 3.98 5.48 2.34 3.84 5.34 2.20 3.70 5.20 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 |Iout| ≤ 2.4mA |Iout| ≤ 4.0mA |Iout| ≤ 5.2mA Vin =VIH or VIL VOL Maximum Low−Level Output Voltage Vin = VIH or VIL |Iout| ≤ 20mA http://onsemi.com 3 V MC74HC4020A DC CHARACTERISTICS (Voltages Referenced to GND) Symbol Parameter Condition |Iout| ≤ 2.4mA |Iout| ≤ 4.0mA |Iout| ≤ 5.2mA Vin = VIH or VIL Guaranteed Limit VCC V −55 to 25°C ≤85°C ≤125°C 3.0 4.5 6.0 0.26 0.26 0.26 0.33 0.33 0.33 0.40 0.40 0.40 Unit Iin Maximum Input Leakage Current Vin = VCC or GND 6.0 ±0.1 ±1.0 ±1.0 mA ICC Maximum Quiescent Supply Current (per Package) Vin = VCC or GND Iout = 0mA 6.0 4 40 160 mA NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). AC CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns) Symbol Parameter Guaranteed Limit VCC V −55 to 25°C ≤85°C ≤125°C Unit fmax Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4) 2.0 3.0 4.5 6.0 10 15 30 50 9.0 14 28 50 8.0 12 25 40 MHz tPLH, tPHL Maximum Propagation Delay, Clock to Q1* (Figures 1 and 4) 2.0 3.0 4.5 6.0 96 63 31 25 106 71 36 30 115 88 40 35 ns tPHL Maximum Propagation Delay, Reset to Any Q (Figures 2 and 4) 2.0 3.0 4.5 6.0 45 30 30 26 52 36 35 32 65 40 40 35 ns tPLH, tPHL Maximum Propagation Delay, Qn to Qn+1 (Figures 3 and 4) 2.0 3.0 4.5 6.0 69 40 17 14 80 45 21 15 90 50 28 22 ns tTLH, tTHL Maximum Output Transition Time, Any Output (Figures 1 and 4) 2.0 3.0 4.5 6.0 75 27 15 13 95 32 19 15 110 36 22 19 ns 10 10 10 pF Cin Maximum Input Capacitance NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). * For TA = 25°C and CL = 50 pF, typical propagation delay from Clock to other Q outputs may be calculated with the following equations: VCC = 2.0 V: tP = [93.7 + 59.3 (n−1)] ns VCC = 4.5 V: tP = [30.25 + 14.6 (n−1)] ns VCC = 3.0 V: tP = [61.5 + 34.4 (n−1)] ns VCC = 6.0 V: tP = [24.4 + 12 (n−1)] ns Typical @ 25°C, VCC = 5.0 V CPD 38 Power Dissipation Capacitance (Per Package)* * Used to determine the no−load dynamic power consumption: PD = CPD VCC ON Semiconductor High−Speed CMOS Data Book (DL129/D). 2f + I http://onsemi.com 4 CC pF VCC . For load considerations, see Chapter 2 of the MC74HC4020A TIMING REQUIREMENTS (Input tr = tf = 6 ns) VCC V Guaranteed Limit −55 to 25°C ≤85°C ≤125°C Unit trec Minimum Recovery Time, Reset Inactive to Clock (Figure 2) 2.0 3.0 4.5 6.0 30 20 5 4 40 25 8 6 50 30 12 9 ns tw Minimum Pulse Width, Clock (Figure 1) 2.0 3.0 4.5 6.0 70 40 15 13 80 45 19 16 90 50 24 20 ns tw Minimum Pulse Width, Reset (Figure 2) 2.0 3.0 4.5 6.0 70 40 15 13 80 45 19 16 90 50 24 20 ns Maximum Input Rise and Fall Times (Figure 1) 2.0 3.0 4.5 6.0 1000 800 500 400 1000 800 500 400 1000 800 500 400 ns Symbol tr, tf Parameter NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). PIN DESCRIPTIONS INPUTS Clock (Pin 10) OUTPUTS Q1, Q4—Q14 (Pins 9, 7, 5, 4, 6, 13, 12, 14, 15, 1, 2, 3) Negative−edge triggering clock input. A high−to−low transition on this input advances the state of the counter. Active−high outputs. Each Qn output divides the Clock input frequency by 2N. Reset (Pin 11) Active−high reset. A high level applied to this input asynchronously resets the counter to its zero state, thus forcing all Q outputs low. SWITCHING WAVEFORMS tf tr VCC 90% 50% 10% Clock 50% trec GND tw 1/fMAX tPLH Q1 VCC Clock tw Reset tPHL 90% 50% 10% Any Q tTHL Figure 3. 50% Figure 4. http://onsemi.com 5 VCC 50% tPHL tTLH GND GND MC74HC4020A SWITCHING WAVEFORMS (continued) TEST POINT Qn VCC tPLH Qn+1 OUTPUT 50% DEVICE UNDER TEST GND tPHL C L* 50% *Includes all probe and jig capacitance Figure 5. Figure 6. Test Circuit Q1 Q4 9 Clock 10 7 5 Q12 Q13 Q14 1 2 3 C Q C Q C Q C Q C Q C C Q C Q C Q C Q C Q C R Reset Q5 R 11 Q6 = Pin 4 Q7 = Pin 6 Q8 = Pin 13 Q9 = Pin 12 Q10 = Pin 14 Q11 = Pin 15 Figure 7. Expanded Logic Diagram http://onsemi.com 6 VCC = Pin 16 GND = Pin 8 Q MC74HC4020A 1 Clock 2 4 8 16 32 64 128 256 512 1024 2048 4096 8192 16384 Reset Q4 Q5 Q6 Q7 Q8 Q9 Q10 Q12 Q13 Q14 Figure 8. Timing Diagram APPLICATIONS INFORMATION Time−Base Generator feeds the HC4020A. Selecting outputs Q5, Q10, Q11, and Q12 causes a reset every 3600 clocks. The HC20 decodes the counter outputs, produces a single (narrow) output pulse, and resets the binary counter. The resulting output frequency is 1.0 pulse/minute. A 60Hz sinewave obtained through a 1.0 Megohm resistor connected directly to a standard 120 Vac power line is applied to the input of the MC54/74HC14A, Schmitt-trigger inverter. The HC14A squares−up the input waveform and VCC 1.0M 120Vac 60Hz VCC 1/6 of HC14A HC4020A Clock ≥20pF Q5 Q10 Q11 Q12 NOTE: 13 12 10 1/2 HC20 9 Ground MUST be isolated by a transformer or opto−isolator for safety reasons. Figure 9. Time−Base Generator http://onsemi.com 7 8 1 2 4 5 1/2 HC20 6 1.0 Pulse/Minute Output MC74HC4020A PACKAGE DIMENSIONS PDIP−16 N SUFFIX CASE 648−08 ISSUE T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. −A− 16 9 1 8 B F C L DIM A B C D F G H J K L M S S −T− SEATING PLANE K H D M J G 16 PL 0.25 (0.010) T A M M INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 SOIC−16 D SUFFIX CASE 751B−05 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− 16 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A S http://onsemi.com 8 DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 MC74HC4020A PACKAGE DIMENSIONS TSSOP−16 DT SUFFIX CASE 948F−01 ISSUE A 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S ÇÇÇ ÉÉÉ ÇÇÇ ÉÉÉ ÇÇÇ K K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. 8 1 N 0.15 (0.006) T U S 0.25 (0.010) A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. M N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE H D DETAIL E G http://onsemi.com 9 DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74HC4020A PACKAGE DIMENSIONS SOEIAJ−16 F SUFFIX CASE 966−01 ISSUE O 16 LE 9 Q1 M_ E HE 1 8 L DETAIL P Z D e VIEW P A DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) c NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). M 0.10 (0.004) MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 0.78 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.031 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: [email protected] http://onsemi.com 10 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. MC74HC4020A/D