FPF1205 / FPF1206 IntelliMAX™ Advanced Load Switch Features Description 1.2V to 4.0V Input Voltage Operating Range Slew Rate Control with tR: 110µs The FPF1205/06 is an ultra-small IntelliMAX load switch with integrated P-channel switch and analog control features. Internal slew-rate control prevents inrush current and the resulting excessive voltage drop on power rail. The input voltage range operates from 1.2V to 4.0V to provide power-disconnect capability for post-regulated power rails in portable and consumer products. The low shut-off current of 1µA (maximum) allows power designs to meet standby and off-power drain specifications. ™ Typical RON: 75mΩ at VIN=3.3V 110mΩ at VIN=1.8V 240mΩ at VIN=1.2V Output Discharge Function on FPF1206 Low <1.5µA Quiescent Current The FPF1205/06 is controlled by an active-HIGH logic input (ON pin) compatible with standard CMOS GPIO circuitry found on Field Programmable Gate Array (FPGA) and embedded processors. The FPF1205/06 is available in a 0.76mm x 0.76mm 4-bump Wafer-Level Chip-Scale Package (WLCSP). Extra Low <100nA Off Supply Current ESD Protected: Above 7000V HBM, 2000V CDM GPIO/CMOS-Compatible Enable Circuitry 4-Bump WLCSP, 0.76mm x 0.76mm, 0.4mm Pitch Applications Mobile Devices and Smart Phones Portable Media Devices Ultra-Portable / Mobile Computing Advanced Notebook, UMPC, MID Portable Medical Devices GPS and Navigation Equipment Ordering Information Part Number Top Marking Switch (Typical) at 3.3VIN Output Discharge ON Pin Activity tR Package FPF1205UCX QK 75mΩ NA Active HIGH 110µs FPF1206UCX QL 75mΩ 65Ω Active HIGH 110µs 4-Ball WLCSP, 0.76mm x 0.76mm, 0.4mm Pitch © 2010 Fairchild Semiconductor Corporation FPF1205 / FPF1206 • Rev. 1.0.0 www.fairchildsemi.com FPF1205 / FPF1206 — IntelliMAX™ Advanced Load Switch December 2010 FPF1205 / FPF1206 — IntelliMAX™ Advanced Load Switch Application Diagram Figure 1. Typical Application Notes: 1. CIN=1μF, X5R, 0603 (for example, Murata GRM185R60J105KE26). 2. COUT=0.1μF, X5R, 0805 (for example, Murata GRM216R61A105KA01). Functional Block Diagram VIN VOUT FPF1205/06 CONTROL LOGIC ON Turn-On Slew Rate Controlled Driver Output Discharge (Optional) ESD Protection GND Figure 2. Functional Block Diagram (Output Discharge for FPF1206 Only) © 2010 Fairchild Semiconductor Corporation FPF1205 / FPF1206 • Rev. 1.0.0 www.fairchildsemi.com 2 Figure 3. WLCSP Bumps Facing Up (Top View) Figure 4. WLCSP Bumps Facing Down (Bottom View) VOUT A1 A2 VIN VIN A2 A1 VOUT GND B1 B2 ON ON B2 B1 GND Figure 5. Pin Assignments (Top View) Figure 6. Pin Assignments (Bottom View) Pin Definitions Pin # Name Description A1 VOUT Switch Output A2 VIN B1 GND B2 ON FPF1205 / FPF1206 — IntelliMAX™ Advanced Load Switch Pin Configurations Supply Input, Input to the power switch Ground ON/OFF control, active HIGH © 2010 Fairchild Semiconductor Corporation FPF1205 / FPF1206 • Rev. 1.0.0 www.fairchildsemi.com 3 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit -0.3 4.2 V VIN VIN, VOUT, VON to GND ISW Maximum Continuous Switch Current 1.2 A PD Power Dissipation at TA=25°C 1.0 W TSTG Storage Junction Temperature -65 +150 °C TA Operating Temperature Range -40 +85 °C ΘJA Thermal Resistance, Junction-to-Ambient ESD (3,4) Electrostatic Discharge Capability 1S2P with One Thermal Via 110 1S2P without Thermal Via 95 Human Body Model, JESD22-A114 7 Charged Device Model, JESD22-C101 2 °C/W kV Notes: 3. Measured using 2S2P JEDEC std. PCB. 4. Measured using 2S2P JEDEC PCB COLD PLATE Method. FPF1205 / FPF1206 — IntelliMAX™ Advanced Load Switch Absolute Maximum Ratings Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Unit VIN Supply Voltage 1.2 4.0 V TA Ambient Operating Temperature -40 +85 °C © 2010 Fairchild Semiconductor Corporation FPF1205 / FPF1206 • Rev. 1.0.0 www.fairchildsemi.com 4 Unless otherwise noted, VIN=1.2 to 4.0V and TA=-40 to +85°C. Typical values are at VIN=3.3V and TA=25°C. Symbol Parameter Conditions Min. Typ. Max. Unit 4.0 V Basic Operation VIN Supply Voltage 1.2 IQ(OFF) Off Supply Current VON=GND, VOUT=Open, VIN=4V ISD Shutdown Current VON=GND, VOUT=GND IQ Quiescent Current IOUT=0mA RON On Resistance 100 nA 1 μA 1.5 μA VIN=3.3V, IOUT=200mA, TA=25°C 75 100 VIN=1.8V, IOUT=200mA, TA=25°C 110 150 VIN=1.2V, IOUT=200mA, TA=25°C 240 300 VIN=1.8V, IOUT=200mA, TA=85°C 160 200 VIN=3.3V, VON=0V, IFORCE=20mA, TA=25°C, FPF1206 65 110 mΩ RPD Output Discharge RPULL DOWN VIH On Input Logic HIGH Voltage VIL On Input Logic LOW Voltage VIN=1.2V to 4.0V 0.75 V ION On Input Leakage VON=VIN or GND 1 μA Dynamic Characteristics tDON VIN=1.5V to 4.0V 1.1 (6) Turn-On Delay (6) tR VOUT Rise Time Turn-On Time tDOFF Turn-Off Delay (6) VIN=3.3V, RL=10Ω, CL=0.1µF, TA=25°C (6) (6) VOUT Fall Time (6) tOFF Turn-Off Time tDOFF Turn-Off Delay tF VOUT Fall Time (6) tOFF Turn-Off Time tDOFF Turn-Off Delay tF VOUT Fall Time tOFF 0.9 V (5) tON tF VIN <1.5V Ω Turn-Off Time (6) VIN=3.3V, RL=10Ω, CL=0.1µF, TA=25°C, FPF1205 VIN=3.3V, RL=500Ω, CL=0.1µF, TA=25°C, FPF1205 VIN=3.3V, RL=500Ω, CL=0.1µF, (7) TA=25°C, FPF1206 110 110 FPF1205 / FPF1206 — IntelliMAX™ Advanced Load Switch Electrical Characteristics μs 220 7 2 μs 9 10 95 μs 105 7.0 10.5 μs 17.5 Notes: 5. These parameters are guaranteed by design and characterization; not production tested. 6. tDON/tDOFF/tR/tF are defined in Figure 24. 7. Output discharge path is enabled during device off. © 2010 Fairchild Semiconductor Corporation FPF1205 / FPF1206 • Rev. 1.0.0 www.fairchildsemi.com 5 1.00 ON = 0V 0.90 ON = 0V 0.90 VIN SHUTDOWN CURRENT (μA) VIN SHUTDOWN CURRENT (μA) 1.00 0.80 0.70 0.60 0.50 0.40 0.30 VIN = 4.0V VIN = 3.3V 0.20 VIN = 1.2V 0.10 0.00 0.80 0.70 0.60 0.50 0.40 0.30 85°C 0.20 -40°C 0.10 25°C 0.00 -40 -15 10 35 60 85 1.0 1.5 2.0 TJ, JUNCTION TEMPERATURE (°C) 0.30 ON = 0V 0.25 0.20 0.15 0.10 VIN = 3.3V VIN = 1.2V 0.00 4.0 4.5 5.0 5.5 ON = 0V 0.25 0.20 0.15 -40°C 0.10 25°C 0.05 85°C 0.00 -40 -15 10 35 60 85 1.0 1.5 2.0 TJ, JUNCTION TEMPERATURE (°C) 2.5 3.0 3.5 4.0 4.5 5.0 5.5 SUPPLY VOLTAGE (V) Figure 9. Off Supply Current vs. Temperature (FPF1205, VOUT Floating) Figure 10. Off Supply Current vs. Supply Voltage (FPF1205, VOUT Floating) 1.40 1.80 ON = VIN 1.60 1.20 VIN = 4.0V 1.00 SUPPLY CURRENT (μA) SUPPLY CURRENT (μA) 3.5 Figure 8. Shutdown Current vs. Supply Voltage OFF SUPPLY CURRENT (μA) OFF SUPPLY CURRENT (μA) 0.30 0.05 3.0 SUPPLY VOLTAGE (V) Figure 7. Shutdown Current vs. Temperature VIN = 4.0V 2.5 FPF1205 / FPF1206 — IntelliMAX™ Advanced Load Switch Typical Performance Characteristics 0.80 VIN = 3.3V 0.60 0.40 VIN = 1.2V 0.20 ON = VIN 1.40 1.20 25°C 1.00 85°C 0.80 -40°C 0.60 0.40 0.20 0.00 0.00 -40 -15 10 35 60 85 1.0 TJ, JUNCTION TEMPERATURE (°C) 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 SUPPLY VOLTAGE (V) Figure 11. Quiescent Current vs. Temperature © 2010 Fairchild Semiconductor Corporation FPF1205 / FPF1206 • Rev. 1.0.0 1.5 Figure 12. Quiescent Current vs. Supply Voltage www.fairchildsemi.com 6 160 160 VIN = 1.2V 120 100 80 VIN = 3.3V 60 40 ON = VIN IOUT = 200mA 140 ON RESISTANCE (mΩ) ON RESISTANCE (mΩ) 140 VIN = 4.0V 0 100 80 85°C 60 25°C 40 -40°C ON = VIN IOUT = 200mA 20 120 20 0 -40 -15 10 35 60 85 1.2 1.7 2.2 TJ, JUNCTION TEMPERATURE (°C) ON INPUT LOGIC VOLTAGE (V) 3.2 3.7 4.2 4.7 5.2 SUPPLY VOLTAGE (V) Figure 13. RON vs. Temperature 1.20 2.7 Figure 14. RON vs. Supply Voltage 25°C 1.15 1.10 1.05 1.00 VIH 0.95 0.90 VIL 0.85 FPF1205 / FPF1206 — IntelliMAX™ Advanced Load Switch Typical Performance Characteristics 0.80 0.75 0.70 1.0 1.5 2.0 2.5 3.0 3.5 4.0 SUPPLY VOLTAGE (V) Figure 15. ON-Pin Threshold vs. VIN 100 1000 VIN = 3.3V CL = 0.1µF RL = 10Ω VIN = 3.3V CL = 0.1µF RL = 10Ω 90 ON/OFF DELAY TIME (µs) RISE/FALL TIME (us) Figure 16. Load Current vs. VIN-VOUT tR 100 10 tF 80 tdon 70 60 50 40 30 20 tdoff 10 1 0 -40 -15 10 35 60 85 -40 TJ, JUNCTION TEMPERATURE (°C) 10 35 60 85 TJ, JUNCTION TEMPERATURE (°C) Figure 17. VOUT Rise and Fall Time vs. Temperature at RL=10Ω © 2010 Fairchild Semiconductor Corporation FPF1205 / FPF1206 • Rev. 1.0.0 -15 Figure 18. VOUT Turn-On and Turn-Off Delay vs. Temperature at RL=10Ω www.fairchildsemi.com 7 100 90 90 85 80 75 tR 70 65 60 VIN = 3.3V CL = 0.1µF RL = 500Ω 55 50 -40 -15 10 VIN = 3.3V CL = 0.1µF RL = 500Ω 80 tF ON/OFF DELAY TIME (µs) RISE/FALL TIME (μs) 95 35 60 70 tdon 60 50 40 30 20 tdoff 10 0 85 -40 -15 TJ, JUNCTION TEMPERATURE (°C) 10 35 60 85 TJ, JUNCTION TEMPERATURE (°C) Figure 19. VOUT Rise and Fall Time vs. Temperature at RL=500Ω Figure 20. VOUT Turn-On and Turn-Off Delay vs. Temperature at RL=500Ω Figure 21. Turn-On Response (VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=10Ω) Figure 22. Turn-Off Response (VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=10Ω) 90% VOUT FPF1205 / FPF1206 — IntelliMAX™ Advanced Load Switch Typical Performance Characteristics 90% 10% 10% tR tF 3.3V 50% 50% VON 90% 10% VOUT tDON Figure 23. Turn-Off Response (FPF1205 = No Output Pull-Down Resistor) (VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=500Ω) tDOFF Figure 24. Timing Diagram Notes: 8. tON=tR + tDON. 9. tOFF=tF + tDOFF. © 2010 Fairchild Semiconductor Corporation FPF1205 / FPF1206 • Rev. 1.0.0 www.fairchildsemi.com 8 The FPF1205 and FPF1206 are low-RON P-channel load switches with controlled turn-on. The core of each device is a 50mΩ P-channel MOSFET and controller capable of functioning over a wide input operating range of 1.2 - 4.0V. The ON pin, an active HIGH GIOP / CMOS-compatible input, controls the state of the switch. board inductance from forcing VOUT below GND when the switch is on. CIN greater than COUT is highly recommended. COUT greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN. The FPF1206 contains a 65Ω on-chip load resistor for quick output discharge when the switch is turned off. Board Layout For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effect that parasitic trace inductance may have on normal and short-circuit operation. Using wide traces or large copper planes for all pins (VIN, VOUT, ON, and GND) helps minimize the parasitic electrical effects along with minimizing the case ambient thermal impedance. However, the VOUT pin of FPF1206 should not connect directly the battery source due to the discharge mechanism of the load switch. Input Capacitor To limit the voltage drop on the input supply caused by transient inrush current when the switch turns on into a discharged load capacitor or short-circuit, a capacitor must be placed between the VIN and GND pins. A 1µF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher-value CIN can be used to reduce the voltage drop in higher-current applications. Output Capacitor A 0.1µF capacitor, COUT, should be placed between the VOUT and GND pins. This capacitor prevents parasitic Figure 25. Typical Application © 2010 Fairchild Semiconductor Corporation FPF1205 / FPF1206 • Rev. 1.0.0 www.fairchildsemi.com 9 FPF1205 / FPF1206 — IntelliMAX™ Advanced Load Switch Operation and Application Description FPF1205 / FPF1206 — IntelliMAX™ Advanced Load Switch Physical Dimensions 0.03 C 2X F E A 0.40 B Ø0.20 Cu Pad A1 0.40 D BALL A1 INDEX AREA Ø0.30 Solder Mask 0.03 C 2X TOP VIEW RECOMMENDED LAND PATTERN (NSMD PAD TYPE) 0.06 C 0.292±0.018 0.539 0.461 0.05 C C E 0.208±0.021 SEATING PLANE SIDE VIEWS D NOTES: A. NO JEDEC REGISTRATION APPLIES. 0.005 B. DIMENSIONS ARE IN MILLIMETERS. C A B Ø0.260±0.020 4X 0.40 B A 0.40 C. DIMENSIONS AND TOLERANCE PER ASME Y14.5M, 1994. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. (Y)±0.018 F 1 2 E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS ±39 MICRONS (461-539 MICRONS). (X)±0.018 F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. BOTTOM VIEW G. DRAWING FILNAME: MKT-UC004AFrev1. Figure 26. 4 Ball, 0.76 x 0.76 mm Wafer-Level Chip-Scale WLCSP Packaging Product-Specific Dimensions Product D E X Y FPF1205UCX 760µm ± 30µm 760µm ± 30µm 0.180mm± 0.018µm 0.180mm± 0.018µm FPF1206UCX 760µm ± 30µm 760um ± 30µm 0.180mm± 0.018µm 0.180mm± 0.018µm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawing: http://www.fairchildsemi.com/packaging/. © 2010 Fairchild Semiconductor Corporation FPF1205 / FPF1206 • Rev. 1.0.0 www.fairchildsemi.com 10 FPF1205 / FPF1206 — IntelliMAX™ Advanced Load Switch © 2010 Fairchild Semiconductor Corporation FPF1205 / FPF1206 • Rev. 1.0.0 www.fairchildsemi.com 11