3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MT230A-UR-A 3.0mm ROUND LED LAMP ATTENTION OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES 3.0mm ROUND LED LAMP MT230A-UR-A Description This super red lamp is made with AlGaAs/AlGaAs chip and red clear epoxy resin. 8 . 3 3.0 4.8 1.3 24.0 MIN. 1.5TYP. 1.0 MAX. 2.54±0.1 A K Notes: 1. All dimensions are in mm. 2. Tolerance is ± 0.25mm unless otherwise noted. Description LED Chip Part No. MT230A-UR-A Material Emitting Color AlGaAs/AlGaAs Super red VER.: 01 Lens Color Red clear Date: 2007/11/02 Page: 1/5 MT230A-UR-A 3.0mm ROUND LED LAMP Absolute Maximum Ratings at Ta=25℃ Parameter Symbol Rating Unit Power Dissipation PD 72 mW Reverse Voltage VR 4 V D.C. Forward Current If 30 mA Reverse (Leakage) Current Ir 100 μA If(Peak) 100 mA Operating Temperature Range Topr. -40 to +95 ℃ Storage Temperature Range Tstg. -40 to +100 ℃ Soldering Temperature(1.6mm from body) Tsol Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Dip Soldering : 260℃ for 5 sec. Hand Soldering : 350℃ for 3 sec. Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Max. Unit Luminous Intensity IV If=20mA 200 400 770 mcd Forward Voltage Vf If=20mA 1.9 2.4 V Peak Wavelength λp If=20mA 660 nm Dominant Wavelength λd If=20mA 643 nm Reverse (Leakage) Current Ir Vr=4V 2θ1/2 If=20mA 35 deg ∆λ If=20mA 20 nm Viewing Angle Spectrum Line Halfwidth 100 µA Notes:1. The datas tested by IS tester. 2. Customer’s special requirements are also welcome. VER.: 01 Date: 2007/11/02 Page: 2/5 3.0mm ROUND LED LAMP MT230A-UR-A Typical Electrical / Optical Characteristics Curves : 50 Relative Luminous Intensity 500 Forward Current IF(mA) 40 30 20 10 1.2 1.6 2.0 2.4 2.8 400 300 200 100 0 3.2 Applied Voltage (V) 20.0 10.0 0.0 30.0 Forward Current (mA) FORWARD CURRENT VS.APPLIED VOLTAGE FORWARD CURRENT VS. LUMINOUS INTENSITY 0° 20° 10° Forward Current IF(mA) 50 30° 40 40° 30 1.0 50° 0.9 20 60° 0.8 70° 80° 90° 10 0.7 0 20 40 60 Temperature (℃) 80 100 FORWARD CURRENT VS. AMBIENT TEMPERATURE 0.5 0.3 0.1 0.2 0.4 0.6 RADIATION DIAGRAM VER.: 01 Date: 2007/11/02 Page: 3/5 MT230A-UR-A 3.0mm ROUND LED LAMP Specifications for Bin Grading: Iv(mcd) BIN MIN. MAX. N 200 280 P 280 390 Q 390 550 R 550 770 Specifications for Vf Group: Vf(V) Group MIN. MAX. V1 1.6 1.8 V2 1.8 2.0 V3 2.0 2.2 V4 2.2 2.4 *Majority VF bins are highlighted in Yellow. VER.: 01 Date: 2007/11/02 Page: 4/5 MT230A-UR-A 3.0mm ROUND LED LAMP Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130℃. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), <Same for products with terminal leads> (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Solder dip: Preheat: 90℃ max. (Backside of PCB), Within 60 seconds Solder bath: 260±5℃ (Solder temperature), Within 5 seconds (3) Soldering iron : 350℃ max. (Temperature of soldering iron tip), Within 3 seconds 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120℃ max. Baking time: Within 60 seconds If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 01 Date: 2007/11/02 Page: 5/5