CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299B – APRIL 2000 – REVISED MARCH 2003 D D D D CD54AC163 . . . F PACKAGE CD74AC163 . . . E OR M PACKAGE (TOP VIEW) Internal Look-Ahead for Fast Counting Carry Output for n-Bit Cascading Synchronous Counting Synchronously Programmable CLR CLK A B C D ENP GND description/ordering information 1 16 2 15 3 14 4 13 VCC RCO QA QB QC QD ENT LOAD The ’AC163 devices are 4-bit binary counters. 12 5 These synchronous, presettable counters feature 11 6 an internal carry look-ahead for application in 10 7 high-speed counting designs. Synchronous 9 8 operation is provided by having all flip-flops clocked simultaneously so that the outputs change, coincident with each other, when instructed by the count-enable (ENP, ENT) inputs and internal gating. This mode of operation eliminates the output counting spikes normally associated with synchronous (ripple-clock) counters. A buffered clock (CLK) input triggers the four flip-flops on the rising (positive-going) edge of the clock waveform. The counters are fully programmable; that is, they can be preset to any number between 0 and 9 or 15. Presetting is synchronous; therefore, setting up a low level at the load input disables the counter and causes the outputs to agree with the setup data after the next clock pulse, regardless of the levels of the enable inputs. The clear function is synchronous. A low level at the clear (CLR) input sets all four of the flip-flop outputs low after the next low-to-high transition of CLK, regardless of the levels of the enable inputs. This synchronous clear allows the count length to be modified easily by decoding the Q outputs for the maximum count desired. The active-low output of the gate used for decoding is connected to CLR to synchronously clear the counter to 0000 (LLLL). The carry look-ahead circuitry provides for cascading counters for n-bit synchronous applications without additional gating. ENP, ENT, and a ripple-carry output (RCO) are instrumental in accomplishing this function. Both ENP and ENT must be high to count, and ENT is fed forward to enable RCO. Enabling RCO produces a high-level pulse while the count is maximum (9 or 15, with QA high). This high-level overflow ripple-carry pulse can be used to enable successive cascaded stages. Transitions at ENP or ENT are allowed, regardless of the level of CLK. These devices feature a fully independent clock circuit. Changes at control inputs (ENP, ENT, or LOAD) that modify the operating mode have no effect on the contents of the counter until clocking occurs. The function of the counter (whether enabled, disabled, loading, or counting) is dictated solely by the conditions meeting the stable setup and hold times. ORDERING INFORMATION PDIP – E –55°C 55°C to 125°C ORDERABLE PART NUMBER PACKAGE† TA SOIC – M Tube CD74AC163E Tube CD74AC163M Tape and reel CD74AC163M96 TOP-SIDE MARKING CD74AC163E AC163M CDIP – F Tube CD54AC163F3A CD54AC163F3A † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299B – APRIL 2000 – REVISED MARCH 2003 FUNCTION TABLE INPUTS OUTPUTS CLR CLK ENP ENT LOAD A,B,C,D Qn RCO L ↑ X X X X L L h ↑ X X l l L L h ↑ X X l h H Note 1 h ↑ h h h X Count Note 1 h X l X h X Note 1 h X X l h X qn qn L FUNCTION Reset (clear) Parallel load Count Inhibit H = high level, L = low level, X = don’t care, h = high level one setup time prior to the CLK low-to-high transition, l = low level one setup time prior to the CLK low-to-high transition, q = the state of the referenced output prior to the CLK low-to-high transition, and ↑ = CLK low-to-high transition. NOTE 1: The RCO output is high when ENT is high and the counter is at terminal count (HHHH). 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299B – APRIL 2000 – REVISED MARCH 2003 logic diagram (positive logic) LOAD ENT ENP 9 10 15 LD† 7 RCO CK† CLK CLR 2 1 CK LD R A B C D M1 G2 1, 2T/1C3 G4 3D 4R 3 M1 G2 1, 2T/1C3 G4 3D 4R 4 M1 G2 1, 2T/1C3 G4 3D 4R 5 M1 G2 1, 2T/1C3 G4 3D 4R 6 14 13 12 11 QA QB QC QD † For simplicity, routing of complementary signals LD and CK is not shown on this overall logic diagram. The uses of these signals are shown on the logic diagram of the D/T flip-flops. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299B – APRIL 2000 – REVISED MARCH 2003 logic symbol, each D/T flip-flop LD (Load) M1 TE (Toggle Enable) G2 CK (Clock) 1, 2T/1C3 G4 D (Inverted Data) 3D R (Inverted Reset) 4R Q (Output) logic diagram, each D/T flip-flop (positive logic) CK LD TE LD† TG TG LD† Q TG TG CK† D TG CK† R † The origins of LD and CK are shown in the logic diagram of the overall device. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CK† TG CK† CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299B – APRIL 2000 – REVISED MARCH 2003 typical clear, preset, count, and inhibit sequence The following sequence is illustrated below: 1. Clear outputs to zero (synchronous) 2. Preset to binary 12 3. Count to 13, 14, 15, 0, 1, and 2 4. Inhibit CLR LOAD A Data Inputs B C D CLK ENP ENT QA Data Outputs QB QC QD RCO 12 13 14 15 0 1 Count 2 Inhibit Sync Preset Clear POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299B – APRIL 2000 – REVISED MARCH 2003 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA Package thermal impedance, θJA (see Note 3): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 3. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 4) TA = 25°C VCC VIH Supply voltage High-level input voltage –55°C to 125°C –40°C to 85°C UNIT MIN MAX MIN MAX MIN MAX 1.5 5.5 1.5 5.5 1.5 5.5 VCC = 1.5 V VCC = 3 V 1.2 1.2 1.2 2.1 2.1 2.1 VCC = 5.5 V VCC = 1.5 V 3.85 3.85 0.3 0.9 0.9 0.9 VI VO Input voltage 0 Output voltage 0 IOH IOL High-level output current –24 Low-level output current 24 ∆t/∆v Input transition rise or fall rate 1.65 VCC = 1.5 V to 3 V VCC = 3.6 V to 5.5 V 3.85 0.3 Low-level input voltage VCC = 3 V VCC = 5.5 V V 0.3 VIL VCC VCC 1.65 0 V 1.65 VCC VCC V –24 –24 mA 24 24 mA 50 50 50 20 20 20 0 VCC VCC V 0 0 V ns NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299B – APRIL 2000 – REVISED MARCH 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN IOH = –50 µA VOH VI = VIH or VIL IOH = –4 mA IOH = –24 mA IOH = –50 mA† IOH = –75 mA† IOL = 50 µA VOL II ICC VI = VIH or VIL VI = VCC or GND VI = VCC or GND, –55°C to 125°C TA = 25°C MAX MIN –40°C to 85°C MAX MIN 1.5 V 1.4 1.4 1.4 2.9 3V 2.9 2.9 4.5 V 4.4 4.4 4.4 3V 2.58 2.4 2.48 4.5 V 3.94 3.7 3.8 5.5 V – 3.85 – 5.5 V – – 3.85 UNIT MAX V 1.5 V 0.1 0.1 0.1 3V 0.1 0.1 0.1 4.5 V 0.1 0.1 0.1 V IOL = 12 mA IOL = 24 mA IOL = 50 mA† 3V 0.36 0.5 0.44 4.5 V 0.36 0.5 0.44 5.5 V – 1.65 – IOL = 75 mA† 5.5 V – – 1.65 5.5 V ±0.1 ±1 ±1 µA 8 160 80 µA 10 10 10 IO = 0 5.5 V Ci pF † Test one output at a time, not exceeding 1-second duration. Measurement is made by forcing indicated current and measuring voltage to minimize power dissipation. Test verifies a minimum 50-Ω transmission-line drive capability at 85°C and 75-Ω transmission-line drive capability at 125°C. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299B – APRIL 2000 – REVISED MARCH 2003 timing requirements over recommended operating free-air temperature range (unless otherwise noted) VCC –55°C to 125°C MIN fclock tw Clock frequency Pulse duration CLK high or low A, B, C, or D ENP or ENT tsu ↑ Setup time, time before CLK↑ LOAD low A, B, C, or D ENP or ENT th Hold time time, after CLK↑ ↑ LOAD low CLR inactive 8 POST OFFICE BOX 655303 MAX MIN UNIT MAX 1.5 V 7 3.3 V ± 0.3 V 64 73 5 V ± 0.5 V 90 103 8 1.5 V 69 61 3.3 V ± 0.3 V 7.7 6.8 5 V ± 0.5 V 5.5 4.8 1.5 V 63 55 3.3 V ± 0.3 V 7 6.1 5 V ± 0.5 V 5 4.4 1.5 V 63 55 3.3 V ± 0.3 V 9.6 8.2 5 V ± 0.5 V 5 4.4 1.5 V 75 66 3.3 V ± 0.3 V 8.4 7.4 6 5.3 5 V ± 0.5 V CLR inactive –40°C to 85°C 1.5 V 75 66 3.3 V ± 0.3 V 8.4 7.4 5 V ± 0.5 V 6 5.3 1.5 V 0 0 3.3 V ± 0.3 V 0 0 5 V ± 0.5 V 0 0 1.5 V 0 0 3.3 V ± 0.3 V 0 0 5 V ± 0.5 V 0 0 1.5 V 0 0 3.3 V ± 0.3 V 0 0 5 V ± 0.5 V 0 0 1.5 V 0 0 3.3 V ± 0.3 V 0 0 5 V ± 0.5 V 0 0 • DALLAS, TEXAS 75265 MHz ns ns ns CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299B – APRIL 2000 – REVISED MARCH 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) fmax RCO VCC MIN Any Q 3.3 V ± 0.3 V 64 73 5 V ± 0.5 V 90 103 1.5 V – 209 3.3 V ± 0.3 V RCO UNIT MAX 8 – MHz 190 6 23.4 6 21 4.3 16.7 4.3 15.2 – 207 – 188 3.3 V ± 0.3 V 5.9 23.1 5.9 21 5 V ± 0.5 V 4.2 16.5 4.2 15 – 129 – 117 3.3 V ± 0.3 V 3.6 14.4 3.7 13.1 5 V ± 0.5 V 2.6 10.3 2.7 9.4 TEST CONDITIONS TYP 1.5 V ENT MIN 7 1.5 V tpd MAX –40°C to 85°C 1.5 V 5 V ± 0.5 V CLK –55°C to 125°C ns operating characteristics, TA = 25°C PARAMETER Cpd Power dissipation capacitance No load POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 66 UNIT pF 9 CD54AC163, CD74AC163 4-BIT SYNCHRONOUS BINARY COUNTERS SCHS299B – APRIL 2000 – REVISED MARCH 2003 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 R1 = 500 Ω From Output Under Test Open GND R2 = 500 Ω CL = 50 pF (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND tw VCC NOTE: When VCC = 1.5 V, R1 and R2 = 1 kΩ. Input 50% VCC 50% VCC LOAD CIRCUIT 0V VOLTAGE WAVEFORMS PULSE DURATION VCC CLR Input VCC Reference Input 50% VCC 0V 50% VCC 0V tsu trec VCC Data Input 50% 10% 50% VCC CLK 0V th 90% 90% tr VCC 50% VCC 50% VCC tPLH tPHL 0V In-Phase Output 50% 10% 90% 90% tr tPHL Out-of-Phase Output tf VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES VOLTAGE WAVEFORMS RECOVERY TIME Input VCC 50% VCC 10% 0 V 90% tPLH 50% VCC 10% tf 50% 10% VCC Output Control VOH Output 50% VCC Waveform 1 10% VOL S1 at 2 × V CC tf (see Note B) 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES 50% VCC 50% VCC 0V tPLZ tPZL 50% VCC tPZH Output Waveform 2 S1 at Open (see Note B) 50% VCC ≈VCC VOL + 0.3 V VOL tPHZ VOH VOH – 0.3 V ≈0 V VOLTAGE WAVEFORMS OUTPUT ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns. Phase relationships between waveforms are arbitrary. D. For clock inputs, fmax is measured with the input duty cycle at 50%. E. The outputs are measured one at a time with one input transition per measurement. F. tPLH and tPHL are the same as tpd. G. tPZL and tPZH are the same as ten. H. tPLZ and tPHZ are the same as tdis. I. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CD54AC163F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 CD54AC163F3A CD74AC163E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74AC163E CD74AC163EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74AC163E CD74AC163M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC163M CD74AC163M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC163M CD74AC163MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC163M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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OTHER QUALIFIED VERSIONS OF CD54AC163, CD74AC163 : • Catalog: CD74AC163 • Military: CD54AC163 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device CD74AC163M96 Package Package Pins Type Drawing SOIC D 16 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 6.5 10.3 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74AC163M96 SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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