High Power Chip Resistors / Wide Terminal Type High Power Chip Resistors / Wide Terminal Type 2512, 2010, 1206, 0805 Type: ERJ A1, B1, B2, B3 ■ Features ■ Recommended Applications ● High solder-joint reliability by wide terminal construction ● Excellent heat dissipation characteristics by wide terminal construction ● Automotive electronic circuits including ECUs (Electrical control unit), anti-lock breaking systems and air-bag systems ● Current sensing for power supply circuits in a variety of equipment ■ Explanation of Part Numbers Product Code Thick Film Chip Resistors 1 2 3 4 5 6 7 8 9 10 11 E R J A 1 A J 1 0 2 U Resistance Value Region A 10 < R B 0.22 < R <10 C 0.01 < R < 0.22 D 0.005 < R < 0.01 Size, Power Rating Type : inches Power R. 1.33 W A1 : 2512 1W B1 : 2010 0.5 W B2 : 1206 0.33 W, B3 : 0805 0.5 W (R < 1 ) Resistance Tolerance ✽F ±1% G ±2% J ±5% Code V U Packaging Methods Packaging Punched Carrier Taping 4 mm pitch Embossed Carrier Taping 4 mm pitch Type ERJB2 ERJB3 ERJA1 ERJB1 Resistance Value The first two digits are significant figures of resistance and the third one denotes number of zeros following. Decimal point is expressed by “R”. (ex.) 222 2.2 k 4R7 4.7 ✽ F : ±1 % more than 100 m (ERJA1) ±1 % more than 10 m (ERJB1, ERJB2) ±1 % more than 20 m (ERJB3) ● If the case of Resistance value is lower than 100 m 1 2 3 4 5 6 7 8 9 10 11 12 E R J A 1 C J R 0 1 5 U Product Code Thick Film Chip Resistors Size, Power Rating Type : inches Power R. A1 : 2512 1.33 W B1 : 2010 1W B2 : 1206 0.5 W 0.33 W, B3 : 0805 0.5 W (R < 1 ) Resistance Value Region Resistance Tolerance ✽ F ±1% G ±2% J ±5% C 0.01 < R < 0.22 D 0.005 < R < 0.01 Code V U Packaging Methods Packaging Punched Carrier Taping 4 mm pitch Embossed Carrier Taping 4 mm pitch Type ERJB2 ERJB3 ERJA1 ERJB1 Resistance Value Decimal point is expressed by “R” with three figures following it. (ex.) R015 0.015 = 15 m ✽ F : ±1 % more than 100 m (ERJA1) ±1 % more than 10 m (ERJB1, ERJB2) ±1 % more than 20 m (ERJB3) Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Oct. 2008 High Power Chip Resistors / Wide Terminal Type ■ Construction (Example : ERJA1 type) Protective coating Electrode (Outer) Thick film Alumina substrate resistive element Electrode (Inner) Electrode (Between) ■ Dimensions in mm (not to scale) ERJA1 type ERJB1 type A1 10–φD L W a B1 W B1 l03 a 102 P T T L b B2 C B2 b A2 L W T A1 B1 Dimensions (mm) 6.40±0.20 3.20±0.20 0.55±0.10 0.70±0.20 0.45±0.20 R20 T b b b b aa Rl0 L W ERJB3 type T a L W ERJB2 type C 0.4 min. a A2 B2 P φD Dimensions (mm) 0.70±0.20 1.25±0.15 1.27±0.10 0.30+0.10 –0.20 L W T a b Dimensions (mm) 5.00±0.20 2.50±0.20 0.55±0.20 0.25±0.20 0.90±0.20 (Unit : mm) L W T a b 0.30±0.20 5 m<R<10 m 0.30±0.20 10 m<R<220 m 3.20±0.20 1.60±0.15 0.65±0.15 0.50±0.20 220 m<R<1 M 0.20±0.20 L W T a b Dimensions (mm) 2.00±0.10 1.25±0.10 0.50±0.10 0.25±0.15 0.40±0.15 Mass (Weight) [1000 pcs.] : 40 g (ERJA1 type) : 27 g (ERJB1 type) : 11 g (ERJB2 type) : 4.8 g (ERJB3 type) <Marking Configuration> Resistance value is shown by three or four figures. The marking is indicated on products with a resistance of 10 ohm higher. ■ Circuit Configuration ERJA1 type R R R ERJB1 type R R R R R ERJB2 type ERJB3 type R Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. R R Oct. 2008 High Power Chip Resistors / Wide Terminal Type ■ Ratings ERJA1 (2512) Type (inches) Power Rating at 70 °C (W) ✽ ±1 ✽, ±2 , ±5 ±1 % more than 100 m 1.33 ✽ ERJB2 (1206) （ 10 m to 10 k (E24 series standard) Resistance Range () Resistance Tolerance (%) ERJB1 (2010) ERJB3 (0805) 5 m to 1 M 20 m to 10 5 m to 9 m : 1 m step (E24 series standard) 10 m to 1 M : E24 series standard ） ±1 ✽, ±2 , ±5 ±1 % more than 10 m 1 ±1, ±2, ±5 0.33, 0.5 (R < 1 ) 0.5 Limiting Element Voltage (Maximum RCWV) (1) (V) 200 150 Maximum Overload Voltage (2) (V) 400 200 R <22 m Temperature Coefficient Resistance (T.C.R.) 22 m< R <47 m ±350 47 m< R <100 m 100 m< R <1 1 <R ±350 0 to +300 ±200 0 to +200 R <56 m : 0 to +300 56 m < R < 1.2 : 0 to +200 0 to +150 (±1 % products) 1.2 < R < 10 : ±100 (±1 % products) ±200 (±2 %, ±5 % products) 0 to +200 (±2 %, ±5 % products) ±100 (±1 % products) ±200 (±2 %, ±5 % products) ±150 0 to +150 ±100 (±1 % products) ±200 (±2 %, ±5 % products) Category Temperature Range (Operating Temperature Range) (°C) –55 to +155 Power Derating Curve For resistors operated in ambient temperature above 70 °C, power rating shall be derated in accordance with the figure on the right. Rated Load (%) (1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV=Power Rating Resistance Values, or Limiting Element Voltage (max. RCWV) listed above, whichever less. (2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 Power Rating or max. Overload Voltage listed above whichever less. 100 70 °C –55 °C 80 60 40 20 155 °C 0 –60 –40 –20 0 20 40 60 80 100 120 140 160 180 Ambient Temperature (°C) Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Oct. 2008 High Power Chip Resistors / Wide Terminal Type ■ Packaging Methods (Taping) ● Standard Quantity Type (inches) ERJA1 (2512) ERJB1 (2010) ERJB2 (1206) ERJB3 (0805) Kind of Taping Pitch (P1) Quantity 4000 pcs./reel Embossed Carrier Taping 4 mm 5000 pcs./reel Punched Carrier Taping ● Carrier Tape (Unit : mm) Embossed Carrier T T P1 φD0 P0 P2 B W F E Punched Carrier A φD1 (Only Emboss) Type ERJA1 ERJB1 ERJB2 ERJB3 A 3.50±0.20 2.80±0.20 2.00±0.15 1.65±0.15 B W F ±0.20 6.80 12.00±0.30 5.50±0.20 5.30±0.20 3.60±0.15 8.00±0.15 3.50±0.05 2.50±0.20 8.00±0.20 E P1 P2 φD0 P0 T 1.10±0.20 1.00±0.20 0.84±0.10 0.84±0.05 ±0.20 1.75 ±0.10 4.00 ±0.05 ±0.10 2.00 4.00 +0.10 –0 1.50 ±0.10 1.75 ● Taping Reel φD1 1.50+0.10 –0 — — (Unit : mm) φA Type T φB φC W ERJA1 ERJB1 φC φB ERJB2 13.0 ±0.10 15.4±0.20 180.0 +0 –3.0 60 min. 13.0 ±1.0 9.0 ±0.10 11.4±0.10 ERJB3 φA T W ■ Recommended Land Pattern ● ERJA1 type ● ERJB1 type 6.4 Land pattern 1.7 1.3 Land pattern 0.75 1.3 0.6 1.7 5.0 Unit : mm Unit : mm ● ERJB2 type ● ERJB3 type 3.2 Land pattern Unit : mm 0.85 0.55 0.85 0.95 0.70 0.95 2.0 Land pattern Unit : mm Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Jul. 2008 High Power Chip Resistors / Wide Terminal Type ■ Recommended Soldering Conditions Recommendations and precautions are described below. ● Recommended soldering conditions for reflow · Reflow soldering shall be performed a maximum of two times. · Please contact us for additional information when used in conditions other than those specified. · Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. Temperature Peak Preheating Heating For soldering (Example : Sn/Pb) Preheating Main heating Peak Temperature 140 °C to 160 °C Above 200 °C 235 ± 5 °C Time 60 s to 120 s 30 s to 40 s max. 10 s For lead-free soldering (Example : Sn/Ag/Cu) Temperature Time Preheating 150 °C to 180 °C 60 s to 120 s Main heating Above 230 °C 30 s to 40 s Peak max. 260 °C max. 10 s Time ● Recommended soldering conditions for flow Preheating Soldering For soldering Temperature Time 140 °C to 180 °C 60 s to 120 s 245 ± 5 °C 20 s to 30 s For lead-free soldering Temperature Time 150 °C to 180 °C 60 s to 120 s max. 260 °C max. 10 s Safety Precautions The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors shown on page ER2 of this catalog. 1. Take measures against mechanical stress during and after mounting of High Power Chip Resistors (hereafter called the resistors) so as not to damage their electrodes and protective coatings. 2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired. 3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance and/or reliability. 4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.). 5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder. 6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Jul. 2008 Safety Precautions (Common precautions for Fixed Resistors) • When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice. • Do not use the products beyond the specifications described in this catalog. • This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. • Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ✽ Systems equipped with a protection circuit and a protection device ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use • These products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. AV equipment, home electric ap plianc es, offi ce equipment, information and com mu ni cation equipment) • These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials • These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. • Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products . • Note that non- cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the performance or reliability of the products. • Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 ° C and a relative humidity of 45 % to 85 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Oct. 2007 – ER3 –