ATMEL ATA6837-PXQW High temperature hex half-bridge driver with serial input control Datasheet

Features
• Six Half-bridge Outputs Formed by Six High-side and Six Low-side Drivers
• Capable of Switching all Kinds of Loads (Such as DC Motors, Bulbs, Resistors,
•
•
•
•
•
•
•
•
•
•
•
•
Capacitors and Inductors)
RDSon Typically 1.0Ω at 25°C, Maximum 2.2Ω at 200°C
Up to 650-mA Output Current
Very Low Quiescent Current IS < 20 µA in Standby Mode
Outputs Short-circuit Protected
Overtemperature Prewarning and Protection
Undervoltage Protection
Various Diagnosis Functions Such as Shorted Output, Open Load, Overtemperature
and Power Supply Fail
Serial Data Interface
Operation Voltage up to 40V
Daisy Chaining Possible
Serial Interface 5V Compatible, up to 2 MHz Clock Frequency
QFN24 Package
1. Description
The ATA6837 is designed for high-temperature applications. In mechatronic solutions,
for example, turbo charger or exhaust gas recirculation systems, many flaps have to
be controlled by DC motor driver ICs which are located very close to the hot engine or
actuator and where ambient temperatures up to 150°C are usual. Due to the advantages of SOI technology, junction temperatures up to 200°C are allowed. This enables
new cost-effective board design possibilities to achieve complex mechatronic
solutions.
High
Temperature
Hex Half-bridge
Driver with
Serial Input
Control
ATA6837
Preliminary
The ATA6837 is a fully protected hex half-bridge driver, used to control up to 6 different loads by a microcontroller in automotive and industrial applications.
Each of the six high-side and six low-side drivers is capable of driving currents up to
650 mA. The drivers are internally connected to form 6 half-bridges and can be controlled separately from a standard serial data interface. Therefore, all kinds of loads,
such as bulbs, resistors, capacitors and inductors, can be combined. The IC especially supports the application of H-bridges to drive DC motors.
Protection is guaranteed in terms of short-circuit conditions, overtemperature and
undervoltage. Various diagnosis functions and a very low quiescent current in standby
mode make a wide range of applications possible.
Automotive qualification referring to conducted interferences, EMC protection and
ESD protection gives added value and enhanced quality for the exacting requirements
of automotive applications.
4953D–AUTO–10/08
Figure 1-1.
Block Diagram QFN24
S
I
S
C
T
O
L
D
H
S
6
L
S
6
H
S
5
L
S
5
H
S
4
L
S
4
H
S
3
L
S
3
H
S
2
L
S
2
H
S
1
L
S
1
S
R
R
3, 4
VS
Input register
Ouput register
DI
19
P
S
F
I
N
H
S
C
D
H
S
6
Serial interface
L
S
6
H
S
5
L
S
5
H
S
4
L
S
4
H
S
3
L
S
3
H
S
2
L
S
2
H
S
1
Charge
pump
L
S
1
T
P
CLK
18
CS
17
INH
Fault
Detect
Fault
Detect
Fault
Detect
Fault
Detect
Fault
Detect
UV
protection
Fault
Detect
14
12
Control
logic
DO
13
VCC
Power on
reset
24
GND
Fault
Detect
Fault
Detect
Fault
Detect
Fault
Detect
Fault
Detect
16
Fault
Detect
GND
Thermal
protection
15
GND
7
11
OUT1
2
8
5
2
OUT2
OUT3
OUT4
23
OUT5
20
GND
OUT6
ATA6837 [Preliminary]
4953D–AUTO–10/08
ATA6837 [Preliminary]
2. Pin Configuration
Pinning QFN 24, 5 × 5, 0.65 mm pitch
NC
OUT5
OUT5 SENSE
OUT6 SENSE
OUT6
DI
Figure 2-1.
1
2
3
4
5
6
24 23 22 21 20 19
18
17
16
15
14
13
7 8 9 10 11 12
CLK
CS
GND SENSE
NC
VCC
DO
NC
OUT2
OUT2 SENSE
OUT1 SENSE
OUT1
INH
OUT4 SENSE
OUT4
VS
VS
OUT3
OUT3 SENSE
Note:
Table 2-1.
Date code (Y = Year above 2000, WW = week number)
Product name
Wafer lot number
Assembly sub-lot number
Pin Description QFN24
Pin
1
YWW
ATAxyz
ZZZZZ
AL
Symbol
Function
OUT4 SENSE Only for testability in final test
Half-bridge output 4; formed by internally connected power MOS high-side switch 4 and low-side switch 4
with internal reverse diodes; short circuit protection; overtemperature protection; diagnosis for short and
open load
2
OUT4
3
VS
Power supply output stages HS4, HS5 and HS6
4
VS
Power supply output stages HS1, HS2 and HS3
5
6
OUT3
Output 3; see pin 1
OUT3 SENSE Only for testability in final test
7
NC
8
OUT2
Internal bond to GND
Output 2; see pin 1
9
OUT2 SENSE Only for testability in final test
10
OUT1 SENSE Only for testability in final test
11
OUT1
12
INH
Inhibit input; 5V logic input with internal pull down; low = standby, high = normal operation
13
DO
Serial data output; 5V CMOS logic level tri-state output for output (status) register data; sends 16-bit status
information to the microcontroller (LSB is transferred first). Output will remain tri-stated unless device is
selected by CS = low, therefore, several ICs can operate on one data output line only
14
VCC
15
16
NC
Output 1; see pin 1
Logic supply voltage (5V)
Internal bond to GND
GND SENSE Ground; reference potential; internal connection to the lead frame; cooling tab
3
4953D–AUTO–10/08
Table 2-1.
4
Pin Description QFN24 (Continued)
Pin
Symbol
Function
17
CS
Chip select input; 5V CMOS logic level input with internal pull up;
low = serial communication is enabled, high = disabled
18
CLK
Serial clock input; 5V CMOS logic level input with internal pull down;
controls serial data input interface and internal shift register (fmax = 2 MHz)
19
DI
20
OUT6
Serial data input; 5V CMOS logic level input with internal pull down; receives serial data from the control
device; DI expects a 16-bit control word with LSB being transferred first
Output 6; see pin 1
21
OUT6 SENSE Only for testability in final test
22
OUT5 SENSE Only for testability in final test
23
OUT5
24
NC
Output 5; see pin 1
Internal bond to GND
ATA6837 [Preliminary]
4953D–AUTO–10/08
ATA6837 [Preliminary]
3. Functional Description
3.1
Serial Interface
Data transfer starts with the falling edge of the CS signal. Data must appear at DI synchronized
to CLK and is accepted on the falling edge of the CLK signal. LSB (bit 0, SRR) has to be transferred first. Execution of new input data is enabled on the rising edge of the CS signal. When CS
is high, pin DO is in a tri-state condition. This output is enabled on the falling edge of CS. Output
data will change their state with the rising edge of CLK and stay stable until the next rising edge
of CLK appears. LSB (bit 0, TP) is transferred first.
Figure 3-1.
Data Transfer Input Data Protocol
CS
DI
SRR
0
LS1
HS1
LS2
1
2
3
SLS1
SHS1
SLS2
HS2
LS3
HS3
LS4
4
5
6
7
8
9
10
SHS2
SLS3
SHS3
SLS4
SHS4
SLS5
SHS5
HS4
LS5
HS5
LS6
11
HS6
12
SCT
OLD
13
14
SI
15
CLK
DO
TP
Table 3-1.
SLS6
SHS6
SCD
INH
PSF
Input Data Protocol
Bit
Input Register
Function
0
SRR
Status register reset (high = reset; the bits PSF, SCD and
overtemperature shutdown in the output data register are set to low)
1
LS1
Controls output LS1 (high = switch output LS1 on)
2
HS1
Controls output HS1 (high = switch output HS1 on)
3
LS2
See LS1
4
HS2
See HS1
5
LS3
See LS1
6
HS3
See HS1
7
LS4
See LS1
8
HS4
See HS1
9
LS5
See LS1
10
HS5
See HS1
11
LS6
See LS1
12
HS6
See HS1
13
OLD
Open load detection (low = on)
14
SCT
Programmable time delay for short circuit
(shutdown delay high/low = 12 ms/1.5 ms)
15
SI
Software inhibit; low = standby, high = normal operation
(data transfer is not affected by standby function because the digital
part is still powered)
5
4953D–AUTO–10/08
Table 3-2.
Bit
Output (Status)
Register
0
TP
Status HS1
Normal operation: high = output is on, low = output is off
Open-load detection: high = open load, low = no open load
(correct load condition is detected if the corresponding output is
switched off)
3
Status LS2
Description see LS1
4
Status HS2
Description see HS1
5
Status LS3
Description see LS1
6
Status HS3
Description see HS1
7
Status LS4
Description see LS1
8
Status HS4
Description see HS1
9
Status LS5
Description see LS1
10
Status HS5
Description see HS1
11
Status LS6
Description see LS1
12
Status HS6
Description see HS1
13
SCD
Short circuit detected: set high, when at least one output is switched off
by a short circuit condition
14
INH
Inhibit: this bit is controlled by software (bit SI in input register) and
hardware inhibit (pin INH). High = standby, low = normal operation
15
PSF
Power supply fail: undervoltage at pin VS detected
Note:
Bit 0 to 15 = high: overtemperature shutdown
Status of the Input Register After Power on Reset
Bit 15 Bit 14
(SI)
(SCT)
6
Temperature prewarning: high = warning
(overtemperature shutdown see remark below)
Status LS1
2
H
Function
Normal operation: high = output is on, low = output is off
Open-load detection: high = open load, low = no open load
(correct load condition is detected if the corresponding output is
switched off)
1
Table 3-3.
Output Data Protocol
H
Bit 13
(OLD)
Bit 12
(HS6)
Bit 11
(LS6)
Bit 10
(HS5)
Bit 9
(LS5)
Bit 8
(HS4)
Bit 7
(LS4)
Bit 6
(HS3)
Bit 5
(LS3)
Bit 4
(HS2)
Bit 3
(LS2)
H
L
L
L
L
L
L
L
L
L
L
Bit 2 Bit 1
(HS1) (LS1)
L
L
Bit 0
(SRR)
L
ATA6837 [Preliminary]
4953D–AUTO–10/08
ATA6837 [Preliminary]
3.2
Power-supply Fail
In case of undervoltage at pin VS, an internal timer is started. When during a permanent undervoltage the delay time (tdUV) is reached, the power supply fail bit (PSF) in the output register is
set and all outputs are disabled. When normal voltage is present again, the outputs are enabled
immediately. The PSF bit remains high until it is reset by the SRR bit in the input register.
3.3
Open-load Detection
If the open-load detection bit (OLD) is set to low, a pull-up current for each high-side switch and
a pull-down current for each low-side switch is turned on (open-load detection current IHS1-6,
ILS1-6). If VVS – VHS1-6 or VLS1-6 is lower than the open-load detection threshold (open-load condition), the corresponding bit of the output in the output register is set to high. Switching on an
output stage with OLD bit set to low disables the open load function for this output.
3.4
Overtemperature Protection
If the junction temperature exceeds the thermal prewarning threshold, TjPW set, the temperature
prewarning bit (TP) in the output register is set. When the temperature falls below the thermal
prewarning threshold, TjPW reset, the bit TP is reset. The TP bit can be read without transferring
a complete 16-bit data word: with CS = high to low, the state of TP appears at pin DO. After the
microcontroller has read this information, CS is set high and the data transfer is interrupted without affecting the state of the input and output registers.
If the junction temperature exceeds the thermal shutdown threshold, Tj switch off, the outputs are
disabled and all bits in the output register are set high. The outputs can be enabled again when
the temperature falls below the thermal shutdown threshold, Tj switch on, and when a high has
been written to the SRR bit in the input register. Thermal prewarning and shutdown threshold
have hysteresis.
3.5
Short-circuit Protection
The output currents are limited by a current regulator. Current limitation takes place when the
overcurrent limitation and shutdown threshold (IHS1-6, ILS1-6) are reached. Simultaneously, an
internal timer is started. The shorted output is disabled when during a permanent short the delay
time (tdSd) programmed by the short-circuit timer bit (SCT) is reached. Additionally, the short-circuit detection bit (SCD) is set. If the temperature prewarning bit TP in the output register is set
during a short, the shorted output is disabled immediately and SCD bit is set. By writing a high to
the SRR bit in the input register, the SCD bit is reset and the disabled outputs are enabled.
3.6
Inhibit
There are two ways to inhibit the ATA6837:
• Set bit SI in the input register to 0
• Switch pin INH to 0V
In both cases, all output stages are turned off but the serial interface stays active. The output
stages can be activated again by bit SI = 1 (when INH = VCC) or by pin INH switched back to
VCC (when SI = 1).
7
4953D–AUTO–10/08
4. Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
All values refer to GND pins.
Parameters
Pin
Symbol
Value
Unit
Supply voltage
3, 4
VVS
–0.3 to +40
V
Supply voltage t < 0.5s; IS > –2A
3, 4
VVS
–1
V
⏐
Supply voltage difference
VS_pin3 – VS_pin4⏐
3, 4
ΔVVS
150
mV
Logic supply voltage
14
VVCC
–0.3 to +7
V
17 - 19
VDI, VCLK, VCS
–0.3 to VVCC +0.3
V
13
VDO
–0.3 to VVCC +0.3
V
12, 17 - 19
IINH, IDI, ICLK, ICS
–10 to +10
mA
Output current
13
IDO
–10 to +10
mA
Output current
2, 5, 8, 11, 20, 23
IOUT1 to IOUT6
Internally limited, see
“Output Specification” in
Section 7. on page 9
Junction temperature range
Tj
–40 to +200
Storage temperature range
TSTG
–55 to +200
°C
Ambient temperature range
Ta
–40 to +150
°C
Logic input voltage
Logic output voltage
Input current
°C
5. Thermal Resistance
Table 5-1.
QFN24: Depends on the PCB-board
Parameter
Test Conditions
Junction pin
Pin
Symbol
16
Junction ambient
Min.
Typ.
Max.
Unit
RthJP
<5
K/W
RthJA
35
K/W
6. Operating Range
Parameter
Test Conditions
Pin
Symbol
Min.
Max.
Unit
VVS
VUV(1)
Typ.
40
V
Supply voltage
3, 4
Logic supply voltage
14
VVCC
4.75
5.25
V
12 , 17 - 19
VINH, VDI, VCLK,
VCS
–0.3
VVCC
V
2
MHz
+200
°C
Logic input voltage
Serial interface clock
frequency
fCLK
Junction temperature
range
Tj
8
–40
ATA6837 [Preliminary]
4953D–AUTO–10/08
ATA6837 [Preliminary]
7. Electrical Characteristics
7.5V < VS < 40V; 4.75V < VCC < 5.25V; INH = High; –40°C < Tj < 200°C, Ta ≤ 150°C; unless otherwise specified, all values refer to GND
pins.
No.
1
Parameters
Test Conditions
Pin
Symbol
3, 4
Min.
Typ.
Max.
Unit
Type*
IVS
20
µA
A
40
µA
A
1.2
mA
A
Current Consumption
1.1
Total quiescent current
(VS and all outputs to
VS)
VS = 33V
VCC = 0V or
VCC = 5V, bit SI = low or
VCC = 5V, pin INH = low
Output pins to VS and
GND
1.2
Quiescent current (VCC)
4.75V < VVCC < 5.25V,
INH or bit SI = low
14
IVCC
1.3
Supply current (VS)
VVS < 28V normal
operation, all output
stages off
3, 4
IVS
1.4
Supply current (VS)
VVS < 28V normal
operation, all output low
stages on, no load
3, 4
IVS
10
mA
A
1.5
Supply current (VS)
VVS < 28V normal
operation, all output
high stages on, no load
3, 4
IVS
16
mA
A
1.6
Supply current (VCC)
4.75V < VVCC < 5.25V,
normal operation
14
IVCC
200
µA
A
45
kHz
A
2
2.1
3
Internal Oscillator Frequency
Frequency (time base for
delay timers)
fOSC
19
VVCC
2.3
2.7
3.0
V
A
tdPor
20
95
180
µs
A
5.5
7.0
V
A
V
A
21
ms
A
Undervoltage Detection, Power-on Reset
3.1
Power-on reset threshold
3.2
Power-on reset delay
time
3.3
Undervoltage detection
threshold
14
VUV
3.4
Undervoltage detection
hysteresis
14
ΔVUV
3.5
Undervoltage detection
delay
4
0.8
14
After switching on VVCC
0.4
tdUV
7
Thermal Prewarning and Shutdown
4.1
Thermal prewarning
TjPWset
170
195
220
°C
B
4.2
Thermal prewarning
TjPWreset
155
180
205
°C
B
4.3
Thermal prewarning
hysteresis
TjPW
K
B
4.4
Thermal shutdown
Tj switch off
200
225
250
°C
B
4.5
Thermal shutdown
Tj switch on
185
210
235
°C
B
4.6
Thermal shutdown
hysteresis
Tj switch off
K
B
15
15
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Notes:
1. Delay time between rising edge of input signal at pin CS after data transmission and switch on/off output stages to 90% of
final level. Device not in standby for t > 1 ms.
9
4953D–AUTO–10/08
7. Electrical Characteristics (Continued)
7.5V < VS < 40V; 4.75V < VCC < 5.25V; INH = High; –40°C < Tj < 200°C, Ta ≤ 150°C; unless otherwise specified, all values refer to GND
pins.
No.
Parameters
4.7
Ratio thermal
shutdown/thermal
prewarning
4.8
5
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
Tj switch off/
1.05
1.2
B
1.05
1.2
A
TjPW set
Ratio thermal
shutdown/thermal
prewarning
Tj switch on/
TjPW reset
Output Specification (LS1-LS6, HS1-HS6) 7.5V < VVS < 40V
5.1
On resistance
IOut = 600 mA
2, 5, 8,
11, 20,
23
RDS OnL
2.2
Ω
A
5.2
On resistance
IOut = –600 mA
2, 5, 8,
11, 20,
23
RDS OnH
2.2
Ω
A
5.3
High-side output leakage
VOut1-6 = 0V
current (total quiescent
all output stages off
current see 1.1)
2, 5, 8,
11, 20,
23
IOut1-6
µA
A
5.4
Low-side output leakage
VOut1-6 = VS
current (total quiescent
all output stages off
current see 1.1)
2, 5, 8,
11, 20,
23
IOut1-6
250
µA
A
5.5
Inductive shutdown
energy
2, 5, 8,
11, 20,
23
Woutx
15
mJ
D
5.6
Overcurrent limitation
VVS ≤ 13V
and shutdown threshold
2, 5, 8,
11, 20,
23
ILS1-6
650
950
1400
mA
A
5.7
Overcurrent limitation
VVS ≤ 13V
and shutdown threshold
2, 5, 8,
11, 20,
23
IHS1-6
–1400
–950
–650
mA
A
5.8
Overcurrent limitation
20V < VVS < 40V
and shutdown threshold
2, 5, 8,
11, 20,
23
ILS1-6
650
950
1600
mA
C
5.9
Overcurrent limitation
20V < VVS < 40V
and shutdown threshold
2, 5, 8,
11, 20,
23
IHS1-6
–1600
–950
–650
mA
C
5.10
Overcurrent shutdown
delay time
Input register
bit 14 (SCT) = low
tdSd
0.9
1.5
2.1
ms
A
5.11
Overcurrent shutdown
delay time
Input register
bit 14 (SCT) =High
tdSd
7
12
17
ms
A
5.12
High-side open load
detection current
Input register bit 13
(OLD) = low, output off
2, 5, 8,
11, 20,
23
IOut1-3H
–1.6
–0.3
mA
A
5.13
Low-side open load
detection current
Input register bit 13
(OLD) = low, output off
2, 5, 8,
11, 20,
23
IOut1-3L
0.3
1.6
mA
A
–60
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Notes:
10
1. Delay time between rising edge of input signal at pin CS after data transmission and switch on/off output stages to 90% of
final level. Device not in standby for t > 1 ms.
ATA6837 [Preliminary]
4953D–AUTO–10/08
ATA6837 [Preliminary]
7. Electrical Characteristics (Continued)
7.5V < VS < 40V; 4.75V < VCC < 5.25V; INH = High; –40°C < Tj < 200°C, Ta ≤ 150°C; unless otherwise specified, all values refer to GND
pins.
No.
Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
2, 5, 8,
11, 20,
23
IOLoutLX/
IOLoutHX
1.05
1.2
2
Unit
Type*
5.14
Open load detection
current ratio
5.15
High-side open load
detection voltage
Input register bit 13
(OLD) = low, output off
2, 5, 8,
11, 20,
23
VOut1-6H
0.5
2.5
V
A
5.16
Low-side open load
detection voltage
Input register bit 13
(OLD) = low, output off
2, 5, 8,
11, 20,
23
VOut1-6L
0.5
2.2
V
A
5.17
High-side output switch
on delay(1)
VVS = 13V
RLoad = 30Ω
tdon
20
µs
A
5.18
Low-side output switch
on delay(1)
VVS = 13V
RLoad = 30Ω
tdon
20
µs
A
5.19
High-side output switch
off delay(1)
VVS =13V
RLoad = 30Ω
tdoff
20
µs
A
5.20
Low-side output switch
off delay(1)
VVS =13V
RLoad = 30Ω
tdoff
3
µs
A
5.21
Dead time between
V =13V
corresponding high- and VS
RLoad = 30Ω
low-side switches
6
tdon – tdoff
1
µs
A
0.3 ×
VVCC
V
A
0.7 ×
VVCC
V
A
Inhibit Input
6.1
Input voltage low-level
threshold
12
VIL
6.2
Input voltage high-level
threshold
12
VIH
6.3
Hysteresis of input
voltage
12
ΔVI
100
700
mV
A
6.4
Pull-down current
IPD
10
80
µA
A
0.3 ×
VVCC
V
A
0.7 ×
VVCC
V
A
7
VINH = VVCC
Serial Interface: Logic Inputs DI, CLK, CS
7.1
Input voltage low-level
threshold
17 - 19
VIL
7.2
Input voltage high-level
threshold
17 - 19
VIH
7.3
Hysteresis of input
voltage
17 - 19
ΔVI
50
500
mV
A
7.4
Pull-down current pin DI,
VDI, VCLK = VVCC
CLK
18 - 19
IPDSI
2
50
µA
A
7.5
Pull-up current pin CS
17
IPUSI
–50
–2
µA
A
13
VDOL
0.5
V
A
V
A
µA
A
VCS= 0V
8
Serial Interface: Logic Output DO
8.1
Output voltage low level IOL = 3 mA
8.2
Output voltage high level IOL = –1 mA
8.3
Leakage current
(tri-state)
VCS = VVCC,
0V < VDO < VVCC
13
VDOH
VVCC –
0.7V
13
IDO
–10
10
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Notes:
1. Delay time between rising edge of input signal at pin CS after data transmission and switch on/off output stages to 90% of
final level. Device not in standby for t > 1 ms.
11
4953D–AUTO–10/08
8. Serial Interface: Timing
Parameters
Test Conditions
Pin
Timing Chart No.
Symbol
DO enable after CS falling edge CDO = 100 pF
13
1
tENDO
200
ns
DO disable after CS rising edge CDO = 100 pF
13
2
tDISDO
200
ns
DO fall time
CDO = 100 pF
13
-
tDOf
100
ns
DO rise time
CDO = 100 pF
13
-
tDOr
100
ns
DO valid time
CDO = 100 pF
13
10
tDOVal
200
ns
17
4
tCSSethl
225
CS setup time
Min. Typ. Max. Unit
ns
17
8
tCSSetlh
225
ns
CS high time
Input register bit 14 (SCT) = high
17
9
tCSh
17
ms
CS high time
Input register bit 14 (SCT) = low
17
9
tCSh
2.1
ms
18
5
tCLKh
225
ns
CLK low time
18
6
tCLKl
225
ns
CLK period time
18
-
tCLKp
500
ns
CLK setup time
18
7
tCLKSethl
225
ns
CLK setup time
18
3
tCLKSetlh
225
ns
DI setup time
19
11
tDIset
40
ns
DI hold time
19
12
tDIHold
40
ns
CS setup time
CLK high time
12
ATA6837 [Preliminary]
4953D–AUTO–10/08
ATA6837 [Preliminary]
Figure 8-1.
Serial Interface Timing Diagram with Chart Numbers
1
2
CS
DO
9
CS
4
7
CLK
5
3
6
8
DI
11
CLK
10
12
DO
Inputs DI, CLK, CS: High level = 0.7 × VCC, low level = 0.2 × VCC
Output DO: High level = 0.8 × VCC, low level = 0.2 × VCC
13
4953D–AUTO–10/08
9. Noise and Surge Immunity
Parameters
Test Conditions
Value
Conducted interferences
ISO 7637-1
Level 4(1)
Interference suppression
VDE 0879 Part 2
Level 5
ESD (Human Body Model)
ESD S 5.1
4 kV
CDM (Charge Device Model)
ESD STM5.3
500V
MM (Machine Model)
ESD STM5.2
200V
1. Test pulse 5: Vvbmax = 40V
Note:
10. Application Circuit
Figure 10-1. Application Circuit
S
I
VCC
O
L
D
H
S
6
L
S
6
H
S
5
L
S
5
H
S
4
L
S
4
H
S
3
L
S
3
H
S
2
L
S
2
H
S
1
L
S
1
VS
S
R
R
BYT41D
VS
Input register
Ouput register
Trigger
Reset
U5021M Enable
Watchdog
S
C
T
Vbatt
24V
+
Serial interface
Charge
pump
GND
DI
P
S
F
I
N
H
S
C
D
H
S
6
L
S
6
H
S
5
L
S
5
H
S
4
L
S
4
H
S
3
L
S
3
H
S
2
L
S
2
H
S
1
L
S
1
T
P
GND
GND
CLK
Microcontroller
GND
CS
Fault
Detect
Fault
Detect
Fault
Detect
Fault
Detect
Fault
Detect
VCC
UV
protection
Fault
Detect
INH
Control
logic
DO
VCC
Power on
reset
VCC
5V
+
GND
VCC
Fault
Detect
Fault
Detect
Fault
Detect
Fault
Detect
Fault
Detect
Fault
Detect
GND
Thermal
protection
GND
GND
OUT1
M
14
OUT2
OUT3
M
M
OUT4
M
OUT5
OUT6
M
ATA6837 [Preliminary]
4953D–AUTO–10/08
ATA6837 [Preliminary]
10.1
Application Notes
• Connect the blocking capacitors at VCC and VS as close as possible to the power supply and
GND pins.
• Recommended value for capacitors at VS:
Electrolytic capacitor C > 22 µF in parallel with a ceramic capacitor C = 100 nF. Value for
electrolytic capacitor depends on external loads, conducted interferences and
reverse-conducting current IHSX (see Section 4. “Absolute Maximum Ratings” on page 8).
• Recommended value for capacitors at VCC:
Electrolytic capacitor C > 10 µF in parallel with a ceramic capacitor C = 100 nF.
• To reduce thermal resistance, place cooling areas on the PCB as close as possible to GND
pins and to the die paddle in QFN24.
15
4953D–AUTO–10/08
11. Ordering Information
Extended Type Number
Package
ATA6837-PXQW
Remarks
QFN24
Taped and reeled, Pb-free
12. Package Information
Package: QFN 24 - 5 x 5
Exposed pad 3.6 x 3.6
(acc. JEDEC OUTLINE No. MO-220)
Dimensions in mm
Not indicated tolerances ±0.05
5
0.9±0.1
+0
3.6
0.05-0.05
24
19
1
24
0.4
18
0.3
6
1
technical drawings
according to DIN
specifications
13
6
12
7
0.65 nom.
Drawing-No.: 6.543-5122.01-4
Issue: 1; 15.11.05
16
3.25
ATA6837 [Preliminary]
4953D–AUTO–10/08
ATA6837 [Preliminary]
13. Revision History
Please note that the following page numbers referred to in this section refer to the specific revision
mentioned, not to this document.
Revision No.
4953D-AUTO-10/08
History
•
•
•
•
•
•
Features on page 1 changed
Table 2-1 “Pin Description QFN24” on pages 3 to 4 changed
Section 4 “Abs.Max.Ratings” on page 8 changed
Section 5 “Thermal Resistance” on page 8 changed
Section 6 “Operating Range” on page 8 changed
Section 7 “Electrical Characteristics” numbers 1.1, 1.2, 1.6, 4.1 to 4.7,
5.3, 5.4 and 5.6 to 5.9 on pages 9 to 10 changed
• Section 8 “Serial Interface: Timing” on page 12 changed
• Section 9 “Noise and Surge Immunity” on page 16 changed
• Section 11 “Ordering Information” on page 14 changed
4953C-AUTO-09/07
• Section 7 “Electrical Characteristics” numbers 5.15 and 5.16 on page 10
changed
• Section 9 “Noise and Surge Immunity” on page 14 changed
4953B-AUTO-07/07
• Put datasheet in a new template
• Section 7 “Electrical Characteristics” numbers 1.5, 3.1, 5.15 and 8.2 on
pages 9 to 11 changed
17
4953D–AUTO–10/08
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4953D–AUTO–10/08