CHA6005-QEG 8-12GHz High Power Amplifier GaAs Monolithic Microwave IC Description The CHA6005-QEG is a high power amplifier monolithic circuit, which integrates two stages and produces 31.5dBm output power associated to a high power added efficiency of 33%. It is designed for a wide range of applications, from professional to commercial communication systems. The circuit is manufactured with a pHEMT process, 0.25µm gate length, via holes through the substrate, air bridges and electron beam gate lithography. It is supplied in a RoHS compliant SMD package. 50 Main Features 0.7 45 40 0.6 35 30 0.5 25 20 0.4 15 10 Idrain @ 1dBcomp (A) Pout @ 1dBcomp (dBm) & Linear Gain (dB) ■ High power: 31.5dBm ■ High PAE: 33% ■ Frequency band: 8-12GHz ■ Linear gain: 20dB ■ DC bias: VD=8Volt@Id=420mA ■ 24L-QFN4x5 ■ MSL3 0.3 5 Pout_1dBcomp Linear Gain ID (A) 0 0.2 7 8 9 10 11 Frequency (GHz) 12 13 Main Electrical Characteristics Tamb.= +25°C Symbol Parameter Freq Frequency range G Linear Gain P1dB Output Power @ 1dB comp. PAE1dB Power Added Efficiency @ 1dB comp. Ref. : DSCHA6005-QEG5070 – 11 Mar 15 1/12 Min 8 Typ Max 12 20 31.5 33 Unit GHz dB dBm % Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHA6005-QEG 8-12GHz High Power Amplifier Electrical Characteristics Tamb.= +25°C, VD1,2 = +8.0V Symbol Parameter Min Freq Operating frequency 8 G Small signal gain RLin Input Return Loss RLout Output Return Loss P1dB Output power @ 1dBcomp P3dB Output power @ 3dBcomp PAE1dB Power Added Efficiency @ 1dBcomp PAE3dB Power Added Efficiency @ 3dBcomp Id_1dBcomp Supply drain current @ 1dBcomp Id_3dBcomp Supply drain current @ 3dBcomp Idq Supply quiescent current VG Gate supply voltage These values are representative of onboard measurements and are plan as defined in the paragraph "Definition of reference planes ". Ref. : DSCHA6005-QEG5070 – 11 Mar 15 2/12 Typ Max 12 Unit GHz 19.5 dB 14 dB 10 dB 31.5 dBm 32 dBm 33 % 35 % 500 mA 550 mA 420 mA -0.7 V defined in the reference Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHA6005-QEG 8-12GHz High Power Amplifier Absolute Maximum Ratings (1) Tamb.= +25°C Symbol Parameter Values Unit VD Drain bias voltage 9.0 V Id Drain bias current 700 mA VG Gate bias voltage -0.25 V Pin Maximum peak input power overdrive +18 dBm Tj Junction temperature 175 °C Ta Operating temperature range -40 to +85 °C Tstg Storage temperature range -55 to +150 °C (1) Operation of this device above anyone of these parameters may cause permanent damage. Typical Bias Conditions Tamb.= +25°C Symbol Pad No VD1,2 17, 13 VG12 18 Parameter Drain supply voltage Gate supply voltage Ref. : DSCHA6005-QEG5070 – 11 Mar 15 3/12 Values 8 -0.7 Unit V V Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHA6005-QEG 8-12GHz High Power Amplifier Device Thermal Performances All the figures given in this section are obtained assuming that the QFN device is only cooled down by conduction through the package thermal pad (no convection mode considered). The temperature is monitored at the package back-side interface (Tcase) as shown below. The system maximum temperature must be adjusted in order to guarantee that Tcase remains below the maximum value specified in the next table. So, the system PCB must be designed to comply with this requirement. A derating must be applied on the dissipated power if the Tcase temperature cannot be maintained below the maximum temperature specified (see the curve Pdiss. Max) in order to guarantee the nominal device life time (MTTF). DEVICE THERMAL SPECIFICATION : CHA6005-QEG Recommended max. junction temperature (Tj max) : 173 Tj absolute maximum rating for 20 years minimum life time : 175 Max. continuous dissipated power (Pdiss. Max.) : 2.9 => Pdiss. Max. derating above Tcase(1)= 85 °C : 33 (2) Junction-Case thermal resistance (Rth J-C) : <30 Minimum Tcase operating temperature(3) : -40 Maximum Tcase operating temperature(3) : 85 Minimum storage temperature : -55 Maximum storage temperature : 150 °C °C W mW/°C °C/W °C °C °C °C (1) Derating at junctio n temperature co nstant = Tj max. (2) Rth J-C is calculated fo r a wo rst case co nsidering the ho t t e s t junc t io n o f the M M IC and all the devices biased. (3) Tcase=P ackage back side temperature measured under the die-attach-pad (see the drawing belo w). 3.5 2.5 2 1.5 1 0.5 Pdiss. Max. @Tj <Tj max (W) 0 -50 -25 0 25 50 75 100 125 150 175 Pdiss. Max. @Tj <Tj max (W) 3 Tcase Example: QFN 16L 3x3 Location of temperature reference point (Tcase) on package's bottom side Tcase (°C) 6.4 Ref. : DSCHA6005-QEG5070 – 11 Mar 15 4/12 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHA6005-QEG 8-12GHz High Power Amplifier Typical Board Measurements Temperature : -40, +25, +85°C VD1,2 = 8V, Id (Quiescent) = 420mA, CW mode Linear Gain versus Frequency and Temperature 25 24 Linear Gain (dB) 23 22 21 20 19 18 17 -40 C 16 +85 C +25 C 15 7 8 9 10 11 12 13 Frequency (GHz) Output Power at 3dBcomp versus Frequency and Temperature 35 34 33 Pout (dBm) 32 31 30 29 28 Temp=-40 C & Pin=13dBm 27 Temp=+25 C & Pin=15dBm 26 Temp=+85 C & Pin=17dBm 25 7 8 9 10 11 12 13 Frequency (GHz) Ref. : DSCHA6005-QEG5070 – 11 Mar 15 5/12 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHA6005-QEG 8-12GHz High Power Amplifier Typical Board Measurements Temperature : -40, +25, +85°C VD1,2 = 8V, Id (Quiescent) = 420mA, CW mode Power added efficiency at 3dBcomp versus Frequency and Temperature 50 45 40 PAE (%) 35 30 25 20 15 Temp=-40 C & Pin=13dBm 10 Temp=+25 C & Pin=15dBm 5 Temp=+85 C & Pin=17dBm 0 7 8 9 10 11 12 13 Frequency (GHz) Drain current at 3 dBcomp versus Frequency and Temperature 1.0 0.9 Drain current (A) 0.8 0.7 0.6 0.5 0.4 0.3 Temp=-40°C & Pin=13dBm 0.2 Temp=+25°C & Pin=15dBm 0.1 Temp=+85°C & Pin=17dBm 0.0 7 8 Ref. : DSCHA6005-QEG5070 – 11 Mar 15 9 10 11 Frequency (GHz) 6/12 12 13 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHA6005-QEG 8-12GHz High Power Amplifier Typical Board Measurements Temperature : +25°C VD1,2 = 8V, Id (Quiescent) = 420mA, CW mode Output Power versus Input Power and Frequency Power added efficiency versus Input Power and Frequency Ref. : DSCHA6005-QEG5070 – 11 Mar 15 7/12 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHA6005-QEG 8-12GHz High Power Amplifier Package Outline (1) Matt tin, Lead Free Units : From the standard : (Green) mm JEDEC MO-220 (VGHD) GND 1- Nc 13- VD2 2- Nc 14- Nc 3- Nc 15- Gnd (2) 4- Nc 16- Nc 255- Nc 17- VD1 6- Nc 18- VG1 7- Nc 19- Nc 8- Nc 20- Nc (2) 9- Gnd 21- Gnd (2) 10- RF OUT 22- RF IN (2) 11- Gnd 23- Gnd (2) 12- Nc 24- Nc (1) The package outline drawing included to this data-sheet is given for indication. Refer to the application note AN0017 (http://www.ums-gaas.com) for exact package dimensions. (2) It is strongly recommended to ground all pins marked “Gnd” through the PCB board. Ensure that the PCB board is designed to provide the best possible ground to the package. Ref. : DSCHA6005-QEG5070 – 11 Mar 15 8/12 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHA6005-QEG 8-12GHz High Power Amplifier Definition of the Reference Planes The reference planes used for measurements given above are symmetrical from the axis of the package (see drawing beside). The input and output reference planes are located at 3.7mm offset (input wise and output wise respectively) from this axis. Then, the given Sij parameters incorporate the land pattern of the evaluation motherboard recommended in paragraph "Evaluation mother board". Ref. : DSCHA6005-QEG5070 – 11 Mar 15 9/12 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHA6005-QEG 8-12GHz High Power Amplifier Evaluation Mother Board ■ Compatible with the proposed footprint. ■ Based on typically Ro4003 / 8mils or equivalent. ■ Using a micro-strip to coplanar transition to access the package. ■ Recommended for the implementation of this product on a module board. ■ Decoupling capacitors of 100pF + 10nF recommended on VG12, VD1,2 in CW mode. ■ Decoupling capacitors of 100pF + 10nF recommended on VG12 in pulsed drain mode. ■ Decoupling capacitors of 100pF + 10nF recommended on VD1,2 in pulsed drain mode. ■ See application note AN0017 for details. Recommended Test fixture for measurements over temperature range 10nF 100pF Ref. : DSCHA6005-QEG5070 – 11 Mar 15 100pF 100pF 10/12 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHA6005-QEG 8-12GHz High Power Amplifier DC Schematic 8V, 420mA VG1 VD1 VG2 VD2 400 Ω 400 Ω 400 Ω 400 Ω OUT IN Package Information Parameter Package body material Lead finish MSL Rating Ref. : DSCHA6005-QEG5070 – 11 Mar 15 Value RoHS-compliant Low stress Injection Molded Plastic 100% matte tin ( Sn) MSL3 11/12 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 CHA6005-QEG 8-12GHz High Power Amplifier Recommended package footprint Refer to the application note AN0017 available at http://www.ums-gaas.com for package foot print recommendations and exact package dimensions. SMD mounting procedure For the mounting process standard techniques involving solder paste and a suitable reflow process can be used. For further details, see application note AN0017 available at http://www.ums-gaas.com. Recommended environmental management UMS products are compliant with the regulation in particular with the directives RoHS N°2011/65 and REACh N°1907/2006. More environmental data are available in the application note AN0019 also available at http://www.ums-gaas.com. Recommended ESD management Refer to the application note AN0020 available at http://www.ums-gaas.com for ESD sensitivity and handling recommendations for the UMS package products. Recommended thermal management Refer to the application note AN0018 available at http://www.ums-gaas.com for thermal management recommendations. Ordering Information QFN Package: CHA6005-QEG/XY Stick: XY = 20 Tape & reel: XY = 21 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHA6005-QEG5070 – 11 Mar 15 12/12 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34