TI1 MSP430F5509IRGCR Mixed-signal microcontroller Datasheet

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MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
SLAS645J – JULY 2009 – REVISED APRIL 2015
MSP430F5510, MSP430F550x Mixed-Signal Microcontrollers
1 Device Overview
1.1
Features
1
• Low Supply-Voltage Range:
3.6 V Down to 1.8 V
• Ultra-Low-Power Consumption
– Active Mode (AM)
All System Clocks Active
• 195 µA/MHz at 8 MHz, 3 V, Flash Program
Execution (Typical)
• 115 µA/MHz at 8 MHz, 3 V, RAM Program
Execution (Typical)
– Standby Mode (LPM3)
• Real-Time Clock (RTC) With Crystal,
Watchdog, and Supply Supervisor
Operational, Full RAM Retention, Fast
Wakeup:
1.9 µA at 2.2 V, 2.1 µA at 3 V (Typical)
• Low-Power Oscillator (VLO), GeneralPurpose Counter, Watchdog, and Supply
Supervisor Operational, Full RAM Retention,
Fast Wakeup:
1.4 µA at 3 V (Typical)
– Off Mode (LPM4)
Full RAM Retention, Supply Supervisor
Operational, Fast Wakeup:
1.1 µA at 3 V (Typical)
– Shutdown Mode (LPM4.5)
0.18 µA at 3 V (Typical)
• Wakeup From Standby in Less Than 5 µs
• 16-Bit RISC Architecture, Extended Memory, up to
25-MHz System Clock
• Flexible Power-Management System
– Fully Integrated LDO With Programmable
Regulated Core Supply Voltage
– Supply Voltage Supervision, Monitoring, and
Brownout
• Unified Clock System
– FLL Control Loop for Frequency Stabilization
– Low-Power Low-Frequency Internal Clock
Source (VLO)
– Low-Frequency Trimmed Internal Reference
Source (REFO)
1.2
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
– 32-kHz Watch Crystals (XT1)
– High-Frequency Crystals up to 32 MHz (XT2)
16-Bit Timer TA0, Timer_A With Five
Capture/Compare Registers
16-Bit Timer TA1, Timer_A With Three
Capture/Compare Registers
16-Bit Timer TA2, Timer_A With Three
Capture/Compare Registers
16-Bit Timer TB0, Timer_B With Seven
Capture/Compare Shadow Registers
Two Universal Serial Communication Interfaces
(USCIs)
– USCI_A0 and USCI_A1 Each Support:
• Enhanced UART Supports Auto-Baudrate
Detection
• IrDA Encoder and Decoder
• Synchronous SPI
– USCI_B0 and USCI_B1 Each Support:
• I2C
• Synchronous SPI
Full-Speed Universal Serial Bus (USB)
– Integrated USB-PHY
– Integrated 3.3-V and 1.8-V USB Power System
– Integrated USB-PLL
– Eight Input and Eight Output Endpoints
10-Bit Analog-to-Digital Converter (ADC) With
Window Comparator
Comparator
Hardware Multiplier Supports 32-Bit Operations
Serial Onboard Programming, No External
Programming Voltage Needed
Three-Channel Internal DMA
Basic Timer With RTC Feature
Section 3 Summarizes Family Members
For Complete Module Descriptions, See the
MSP430x5xx and MSP430x6xx Family User's
Guide (SLAU208)
Applications
Analog and Digital Sensor Systems
Data Loggers
•
•
Connectivity to USB Hosts
Wireless Headsets
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
SLAS645J – JULY 2009 – REVISED APRIL 2015
1.3
www.ti.com
Description
The Texas Instruments MSP430™ family of ultra-low-power microcontrollers consists of several devices
featuring different sets of peripherals targeted for various applications. The architecture, combined with
extensive low-power modes, is optimized to achieve extended battery life in portable measurement
applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators
that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows the device to
wake up from low-power modes to active mode in less than 5 µs.
The MSP430F5510, MSP430F5509, and MSP430F5508 devices are microcontroller configurations with
integrated USB and PHY supporting USB 2.0, four 16-bit timers, a high-performance 10-bit analog-todigital converter (ADC), two universal serial communication interfaces (USCIs) (1), a hardware multiplier,
DMA, a real-time clock (RTC) module with alarm capabilities, and 31 or 47 I/O pins.
The MSP430F5507, MSP430F5506, MSP430F5505, and MSP430F5504 devices are microcontroller
configurations with integrated USB and PHY supporting USB 2.0, four 16-bit timers, a high-performance
10-bit ADC, one USCI, a hardware multiplier, DMA, an RTC module with alarm capabilities, and 31 I/O
pins.
The MSP430F5503, MSP430F5502, MSP430F5501, and MSP430F5500 devices include all of the
MSP430F5507, MSP430F5506, MSP430F5505, and MSP430F5504 peripherals, except that they have a
comparator instead of the 10-bit ADC.
Typical applications include analog and digital sensor systems and data loggers that require connectivity
to various USB hosts.
(1)
In the 48-pin packages, the USCI functions that are pinned out are limited to what the user configures on port 4 with the port mapping
controller. It may not be possible to bring out all functions simultaneously.
Device Information (1)
PACKAGE
BODY SIZE (2)
MSP430F5510RGC
VQFN (64)
9 mm × 9 mm
MSP430F5510ZQE
BGA (80)
5 mm × 5 mm
MSP430F5510PT
LQFP (48)
7 mm × 7 mm
MSP430F5510RGZ
VQFN (48)
7 mm × 7 mm
PART NUMBER
(1)
(2)
2
For the most current part, package, and ordering information for all available devices, see the Package
Option Addendum in Section 8, or see the TI website at www.ti.com.
The sizes shown here are approximations. For the package dimensions with tolerances, see the
Mechanical Data in Section 8.
Device Overview
Copyright © 2009–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505
MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
www.ti.com
1.4
SLAS645J – JULY 2009 – REVISED APRIL 2015
Functional Block Diagrams
Figure 1-1 shows the functional block diagram for the MSP430F5510, MSP430F5509, and MSP430F5508
devices in the RGC and ZQE packages.
XIN XOUT RST/NMI
DVCC
DVSS VCORE
AVCC
AVSS
P1.x
XT2IN
XT2OUT
Unified
Clock
System
ACLK
SMCLK
MCLK
CPUXV2
and
Working
Registers
32KB
24KB
16KB
4KB+2KB
Flash
RAM
Power
Management
LDO
SVM/SVS
Brownout
SYS
Watchdog
Port Map
Control
(P4)
PA
P2.x
P3.x
PB
P4.x
P5.x
PC
P6.x
I/O Ports
P1/P2
2×8 I/Os
Interrupt
& Wakeup
I/O Ports
P3/P4
1×5 I/Os
1×8 I/Os
I/O Ports
P5/P6
1×6 I/Os
1×8 I/Os
PA
1×16 I/Os
PB
1×13 I/Os
PC
1×14 I/Os
REF
COMP_B
ADC10_A
10 Bit
200 KSPS
12 Channels
(10 ext/ 2 int)
Window
Comparator
MAB
DMA
MDB
3 Channel
EEM
(S:3+1)
USCI0,1
TA0
JTAG/
SBW
Interface
MPY32
TA1
Timer_A
5 CC
Registers
Timer_A
3 CC
Registers
TA2
Timer_A
3 CC
Registers
TB0
Timer_B
7 CC
Registers
RTC_A
CRC16
Ax: UART,
IrDA, SPI
Bx: SPI, I2C
Full-speed
USB
USB-PHY
USB-LDO
USB-PLL
DP,DM,PUR
Figure 1-1. Functional Block Diagram – MSP430F5510IRGC, MSP430F5509IRGC, MSP430F5508IRGC,
MSP430F5510IZQE, MSP430F5509IZQE, MSP430F5508IZQE
Figure 1-2 shows the functional block diagram for the MSP430F5510, MSP430F5509, and MSP430F5508
devices in the RGZ and PT packages.
XIN XOUT RST/NMI
DVCC
DVSS VCORE
AVCC
AVSS
P1.x
XT2IN
XT2OUT
Unified
Clock
System
ACLK
SMCLK
Flash
MCLK
CPUXV2
and
Working
Registers
32KB
24KB
16KB
4KB+2KB
RAM
Power
Management
LDO
SVM, SVS,
Brownout
SYS
Watchdog
Port Map
Control
(P4)
PA
P2.x
I/O Ports
P1, P2
1×8 I/Os
1×1 I/Os
Interrupt,
Wakeup
PA
1×9 I/Os
PB
P4.x
P5.x
PC
P6.x
I/O Ports
P4
1×8 I/Os
I/O Ports
P5, P6
1×6 I/Os
1×4 I/Os
PB
1×8 I/Os
PC
1×10 I/Os
REF
COMP_B
ADC10_A
10 Bit
200 ksps
8 Channels
(6 ext, 2 int)
Window
Comparator
MAB
DMA
MDB
3 Channel
EEM
(S:3+1)
USCI0,1
JTAG,
SBW
Interface
TA0
MPY32
Timer_A
5 CC
Registers
TA1
Timer_A
3 CC
Registers
TA2
Timer_A
3 CC
Registers
TB0
Timer_B
7 CC
Registers
RTC_A
CRC16
Ax: UART,
IrDA, SPI
Bx: SPI, I2C
Full-Speed
USB
USB-PHY
USB-LDO
USB-PLL
DP,DM,PUR
NOTE: See Table 3-1 for limitations on the simultaneous availability of USCI module signals.
Figure 1-2. Functional Block Diagram – MSP430F5510IRGZ, MSP430F5509IRGZ, MSP430F5508IRGZ,
MSP430F5510IPT, MSP430F5509IPT, MSP430F5508IPT
Device Overview
Submit Documentation Feedback
Product Folder Links: MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505
MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
Copyright © 2009–2015, Texas Instruments Incorporated
3
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
SLAS645J – JULY 2009 – REVISED APRIL 2015
www.ti.com
Figure 1-3 shows the functional block diagram for the MSP430F5507, MSP430F5506, and MSP430F5505
devices in the RGZ package and the MSP430F5504 device in the RGZ and PT packages.
XIN XOUT RST/NMI
DVCC
DVSS VCORE
AVCC
AVSS
P1.x
XT2IN
XT2OUT
Unified
Clock
System
ACLK
SMCLK
MCLK
CPUXV2
and
Working
Registers
32KB
24KB
16KB
8KB
4KB+2KB
Power
Management
LDO
SVM, SVS,
Brownout
RAM
Flash
SYS
Watchdog
Port Map
Control
(P4)
PA
P2.x
I/O Ports
P1, P2
1×8 I/Os
1×1 I/Os
Interrupt,
Wakeup
PA
1×9 I/Os
PB
P4.x
P5.x
PC
P6.x
I/O Ports
P4
1×8 I/Os
I/O Ports
P5, P6
1×6 I/Os
1×4 I/Os
PB
1×8 I/Os
PC
1×10 I/Os
REF
ADC10_A
10 Bit
200 ksps
8 Channels
(6 int, 2 ext)
Window
Comparator
MAB
DMA
MDB
3 Channel
EEM
(S:3+1)
USCI1
TA0
JTAG,
SBW
Interface
MPY32
TA1
Timer_A
5 CC
Registers
Timer_A
3 CC
Registers
TA2
Timer_A
3 CC
Registers
TB0
Timer_B
7 CC
Registers
RTC_A
CRC16
A1: UART,
IrDA, SPI
B1: SPI, I2C
Full-Speed
USB
USB-PHY
USB-LDO
USB-PLL
DP,DM,PUR
Figure 1-3. Functional Block Diagram – MSP430F5507IRGZ, MSP430F5506IRGZ, MSP430F5505IRGZ,
MSP430F5504IRGZ, MSP430F5504IPT
Figure 1-4 shows the functional block diagram for the MSP430F5503, MSP430F5502, MSP430F5501, and
MSP430F5500 devices in the RGZ package.
XIN XOUT RST/NMI
DVCC
DVSS VCORE
AVCC
AVSS
P1.x
XT2IN
XT2OUT
Unified
Clock
System
ACLK
SMCLK
MCLK
CPUXV2
and
Working
Registers
32KB
24KB
16KB
8KB
4KB+2KB
RAM
Flash
Power
Management
LDO
SVM, SVS,
Brownout
SYS
Watchdog
Port Map
Control
(P4)
PA
P2.x
I/O Ports
P1, P2
1×8 I/Os
1×1 I/Os
Interrupt,
Wakeup
PA
1×9 I/Os
PB
P4.x
P5.x
PC
P6.x
I/O Ports
P4
1×8 I/Os
I/O Ports
P5, P6
1×6 I/Os
1×4 I/Os
PB
1×8 I/Os
PC
1×10 I/Os
REF
COMP_B
MAB
DMA
MDB
3 Channel
EEM
(S:3+1)
JTAG,
SBW
Interface
TA0
MPY32
Timer_A
5 CC
Registers
TA1
Timer_A
3 CC
Registers
TA2
Timer_A
3 CC
Registers
USCI1
TB0
Timer_B
7 CC
Registers
RTC_A
CRC16
A1: UART,
IrDA, SPI
B1: SPI, I2C
Full-Speed
USB
USB-PHY
USB-LDO
USB-PLL
DP,DM,PUR
Figure 1-4. Functional Block Diagram – MSP430F5503IRGZ, MSP430F5502IRGZ, MSP430F5501IRGZ,
MSP430F5500IRGZ
4
Device Overview
Copyright © 2009–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505
MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
www.ti.com
SLAS645J – JULY 2009 – REVISED APRIL 2015
Table of Contents
1
Device Overview ......................................... 1
5
PMM, SVM Low Side ............................... 33
Wake-up Times From Low-Power Modes and
Reset ................................................ 33
Description ............................................ 2
5.27
Timer_A
Functional Block Diagrams ........................... 3
5.28
5.29
Timer_B ............................................. 33
USCI (UART Mode) Recommended Operating
Conditions ........................................... 34
5.30
5.31
USCI (UART Mode) ................................. 34
USCI (SPI Master Mode) Recommended Operating
Conditions ........................................... 34
5.32
USCI (SPI Master Mode)............................ 34
5.33
USCI (SPI Slave Mode) ............................. 36
5.34
5.35
USCI (I2C Mode) .................................... 38
10-Bit ADC, Power Supply and Input Range
Conditions ........................................... 39
5.36
10-Bit ADC, Timing Parameters
5.37
10-Bit ADC, Linearity Parameters................... 40
5.38
REF, External Reference
5.39
REF, Built-In Reference ............................. 41
5.40
Comparator B ....................................... 42
5.41
Ports PU.0 and PU.1 ................................ 43
5.42
USB-Output Ports DP and DM ...................... 45
5.43
USB-Input Ports DP and DM........................ 45
Features .............................................. 1
1.2
Applications ........................................... 1
1.3
1.4
2
3
4
5.25
5.26
1.1
Revision History ......................................... 6
Device Comparison ..................................... 7
Terminal Configuration and Functions .............. 8
4.1
Pin Diagrams ......................................... 8
4.2
Signal Descriptions .................................. 13
Specifications ........................................... 17
5.1
Absolute Maximum Ratings ......................... 17
5.2
ESD Ratings
5.3
5.4
Recommended Operating Conditions ............... 17
Active Mode Supply Current Into VCC Excluding
External Current ..................................... 19
Low-Power Mode Supply Currents (Into VCC)
Excluding External Current.......................... 20
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
5.14
........................................
Thermal Packaging Characteristics .................
Schmitt-Trigger Inputs – General-Purpose I/O
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to
P4.7)
(P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3,
RST/NMI) ............................................
Inputs – Ports P1 and P2
(P1.0 to P1.7, P2.0 to P2.7).........................
Leakage Current – General-Purpose I/O
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to
P4.7)
(P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3,
RST/NMI) ............................................
Outputs – General-Purpose I/O (Full Drive Strength)
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to
P4.7, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3) .....
Outputs – General-Purpose I/O (Reduced Drive
Strength)
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to
P4.7, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3) .....
Output Frequency – General-Purpose I/O
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to
P4.7, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3) .....
Typical Characteristics – Outputs, Reduced Drive
Strength (PxDS.y = 0) ...............................
Typical Characteristics – Outputs, Full Drive
Strength (PxDS.y = 1) ...............................
17
21
22
6
22
22
23
23
24
25
5.15
Crystal Oscillator, XT1, Low-Frequency Mode ...... 26
5.16
5.17
Crystal Oscillator, XT2 .............................. 27
Internal Very-Low-Power Low-Frequency Oscillator
(VLO) ................................................ 28
Internal Reference, Low-Frequency Oscillator
(REFO) .............................................. 28
5.18
5.19
DCO Frequency ..................................... 29
5.20
PMM, Brown-Out Reset (BOR)
5.21
PMM, Core Voltage ................................. 30
5.22
PMM, SVS High Side ............................... 31
5.23
PMM, SVM High Side ............................... 32
5.24
PMM, SVS Low Side ................................ 32
.....................
7
30
8
....................
...........................
39
40
USB-PWR (USB Power System)
Mechanical, Packaging, and Orderable
Information ............................................. 102
Table of Contents
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MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
Copyright © 2009–2015, Texas Instruments Incorporated
33
................... 45
5.45 USB-PLL (USB Phase Locked Loop) ............... 46
5.46 Flash Memory ....................................... 46
5.47 JTAG and Spy-Bi-Wire Interface .................... 46
Detailed Description ................................... 47
6.1
CPU (Link to User's Guide) ......................... 47
6.2
Operating Modes .................................... 48
6.3
Interrupt Vector Addresses.......................... 49
6.4
Memory Organization ............................... 50
6.5
Bootstrap Loader (BSL) ............................. 51
6.6
JTAG Operation ..................................... 52
6.7
Flash Memory (Link to User's Guide) ............... 52
6.8
RAM (Link to User's Guide) ......................... 53
6.9
Peripherals .......................................... 53
6.10 Peripheral File Map ................................. 63
6.11 Input/Output Schematics ............................ 75
6.12 Device Descriptors .................................. 92
Device and Documentation Support ............... 98
7.1
Device Support ...................................... 98
7.2
Documentation Support ............................ 101
7.3
Related Links ...................................... 101
7.4
Community Resources............................. 102
7.5
Trademarks ........................................ 102
7.6
Electrostatic Discharge Caution ................... 102
7.7
Export Control Notice .............................. 102
7.8
Glossary............................................ 102
5.44
22
.............................................
5
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
SLAS645J – JULY 2009 – REVISED APRIL 2015
www.ti.com
2 Revision History
Changes from Revision I (November 2013) to Revision J
•
•
•
•
•
•
•
•
•
•
•
•
•
•
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•
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6
Page
Document format and layout changes throughout, including addition of section numbering ............................... 1
Added Device Information table .................................................................................................... 2
Added Section 1.4 and moved all functional block diagrams to it .............................................................. 3
Changed Figure 1-2 to show two USCIs and added note about signal access limitations ................................. 3
Added Section 3 and moved Table 3-1 to it ....................................................................................... 7
For 48-pin options on F5510, F5509, and F5508, changed to two USCIs with note about port mapping limitations. .. 7
Added "with port interrupt" to P2.7 description .................................................................................. 14
Added Section 5 and moved all electrical specifications to it ................................................................. 17
Added Section 5.2, ESD Ratings.................................................................................................. 17
Moved Section 5.6, Thermal Characteristics ................................................................................... 21
Changed the TYP value of CL,eff with Test Conditions of "XTS = 0, XCAPx = 0" from 2 pF to 1 pF ..................... 26
Added "CVeREF+ = 20 pF" to Test Conditions for EI.............................................................................. 40
In Test Conditions for ED, EO, EG, and ET: changed from "(VeREF+ – VeREF–)min ≤ (VeREF+ – VeREF–)" to
"1.4 V ≤ (VeREF+ – VeREF–)"; changed from "CVREF+" to "CVeREF+" .............................................................. 40
Added "ADC10SREFx = 11b" to Test Conditions for EG and ET .............................................................. 40
Changed MIN value of AVCC(min) with Test Conditions of "REFVSEL = {0} for 1.5 V" from 2.2 V to 1.8 V .............. 41
Changed the value of CBREFACC in both Test Conditions for IAVCC_REF; changed first row from 0 to 1; changed
second row from 1 to 0 ............................................................................................................. 42
Changed P5.3 figure (added P5SEL.2 and XT2BYPASS inputs with AND and OR gates) ............................... 83
Changed P5SEL.3 column from X to 0 for "P5.3 (I/O)" rows .................................................................. 83
Changed P5.5 figure (added P5SEL.5 input and OR gate) ................................................................... 85
Changed P5SEL.5 column from X to 0 for "P5.5 (I/O)" rows .................................................................. 85
Added ZQE and PT packages to Table 6-57 header row ..................................................................... 92
In Table 6-58, removed second USCI and corrected first USCI device descriptor value .................................. 95
Added Section 7 and moved Tools Support, Device Nomenclature, ESD Caution, and Trademarks sections to it ... 98
Added Section 8 ................................................................................................................... 102
Revision History
Copyright © 2009–2015, Texas Instruments Incorporated
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Product Folder Links: MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505
MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
www.ti.com
SLAS645J – JULY 2009 – REVISED APRIL 2015
3 Device Comparison
Table 3-1 summarizes the available family members.
Table 3-1. Family Members (1) (2)
USCI
DEVICE
PROGRAM
MEMORY
(KB)
SRAM
(KB) (3)
Timer_A (4)
Timer_B (5)
MSP430F5510
32
4+2
5, 3, 3
7
MSP430F5509
MSP430F5508
24
16
4+2
4+2
5, 3, 3
5, 3, 3
CHANNEL A: CHANNEL B:
UART, LIN,
SPI, I2C
IrDA, SPI
ADC10_A
(CH)
Comp_B
(CH)
I/O
PACKAGE
TYPE
2
2
10 ext, 2 int
8
47
64 RGC,
80 ZQE
2 (6)
2 (6)
6 ext, 2 int
4
31
48 PT,
48 RGZ
2
2
10 ext, 2 int
8
47
64 RGC,
80 ZQE
2 (6)
2 (6)
6 ext, 2 int
4
31
48 PT,
48 RGZ,
2
2
10 ext, 2 int
8
47
64 RGC,
80 ZQE
2 (6)
2 (6)
6 ext, 2 int
4
31
48 PT,
48 RGZ,
7
7
MSP430F5507
32
4+2
5, 3, 3
7
1
1
6 ext, 2 int
-
31
48 RGZ
MSP430F5506
24
4+2
5, 3, 3
7
1
1
6 ext, 2 int
-
31
48 RGZ
MSP430F5505
16
4+2
5, 3, 3
7
1
1
6 ext, 2 int
-
31
48 RGZ
MSP430F5504
8
4+2
5, 3, 3
7
1
1
6 ext, 2 int
-
31
48 PT,
48 RGZ
MSP430F5503
32
4+2
5, 3, 3
7
1
1
-
4
31
48 RGZ
MSP430F5502
24
4+2
5, 3, 3
7
1
1
-
4
31
48 RGZ
MSP430F5501
16
4+2
5, 3, 3
7
1
1
-
4
31
48 RGZ
MSP430F5500
8
4+2
5, 3, 3
7
1
1
-
4
31
48 RGZ
(1)
(2)
(3)
(4)
(5)
(6)
For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 8,
or see the TI website at www.ti.com.
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/packaging.
The additional 2KB USB SRAM that is listed can be used as general-purpose SRAM when USB is not in use.
Each number in the sequence represents an instantiation of Timer_A with its associated number of capture compare registers and PWM
output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_A, the first
instantiation having 3 and the second instantiation having 5 capture compare registers and PWM output generators, respectively.
Each number in the sequence represents an instantiation of Timer_B with its associated number of capture compare registers and PWM
output generators available. For example, a number sequence of 3, 5 would represent two instantiations of Timer_B, the first
instantiation having 3 and the second instantiation having 5 capture compare registers and PWM output generators, respectively.
Two USCIs are available; however, pinned out functions are limited to what the user configures on port 4 with the port mapping
controller (see Section 6.9.2). It may not be possible to bring out all functions simultaneously.
Device Comparison
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MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
Copyright © 2009–2015, Texas Instruments Incorporated
7
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
SLAS645J – JULY 2009 – REVISED APRIL 2015
www.ti.com
4 Terminal Configuration and Functions
4.1
Pin Diagrams
VSSU
PU.0/DP
PUR
PU.1/DM
VBUS
VUSB
V18
AVSS2
P5.2/XT2IN
P5.3/XT2OUT
TEST/SBWTCK
PJ.0/TDO
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
RST/NMI/SBWTDIO
Figure 4-1 shows the pinout for the MSP430F5510, MSP430F5509, and MSP430F5508 devices in the
RGC package.
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
P6.0/CB0/A0
1
48
P4.7/PM_NONE
P6.1/CB1/A1
2
47
P4.6/PM_NONE
P6.2/CB2/A2
3
46
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P6.3/CB3/A3
4
45
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P6.4/CB4/A4
5
44
P4.3/PM_UCB1CLK/PM_UCA1STE
P6.5/CB5/A5
6
43
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P6.6/CB6/A6
7
42
P4.1/PM_UCB1SIMO/PM_UCB1SDA
41
P4.0/PM_UCB1STE/PM_UCA1CLK
P6.7/CB7/A7
MSP430F5510IRGC
MSP430F5509IRGC
MSP430F5508IRGC
8
P5.0/A8/VeREF+
9
40
DVCC2
P5.1/A9/VeREF-
10
39
DVSS2
AVCC1
11
38
P3.4/UCA0RXD/UCA0SOMI
P5.4/XIN
12
37
P3.3/UCA0TXD/UCA0SIMO
P5.5/XOUT
13
36
P3.2/UCB0CLK/UCA0STE
P2.5/TA2.2
P2.7/UCB0STE/UCA0CLK
P2.6/RTCCLK/DMAE0
P2.4/TA2.1
P2.3/TA2.0
P2.2/TA2CLK/SMCLK
P2.1/TA1.2
P2.0/TA1.1
P1.7/TA1.0
P1.6/TA1CLK/CBOUT
P1.5/TA0.4
16
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
P1.4/TA0.3
DVSS1
P1.3/TA0.2
P3.0/UCB0SIMO/UCB0SDA
P1.2/TA0.1
P3.1/UCB0SOMI/UCB0SCL
34
P1.1/TA0.0
35
15
P1.0/TA0CLK/ACLK
14
VCORE
AVSS1
DVCC1
NOTE: TI recommends connection of the exposed thermal pad to VSS.
Figure 4-1. 64-Pin RGC Package (Top View) – F5510, F5509, F5508
8
Terminal Configuration and Functions
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
www.ti.com
SLAS645J – JULY 2009 – REVISED APRIL 2015
Figure 4-2 shows the pinout for the MSP430F5510, MSP430F5509, and MSP430F5508 devices in the
ZQE package.
ZQE PACKAGE
(TOP VIEW)
A1
A2
A3
A4
A5
A6
A7
A8
A9
B1
B2
B3
B4
B5
B6
B7
B8
B9
C1
C2
C4
C5
C6
C7
C8
C9
D1
D2
D3
D4
D5
D6
D7
D8
D9
E1
E2
E3
E4
E5
E6
E7
E8
E9
F1
F2
F3
F4
F5
F6
F7
F8
F9
G1
G2
G3
G4
G5
G6
G7
G8
G9
H1
H2
H3
H4
H5
H6
H7
H8
H9
J1
J2
J3
J4
J5
J6
J7
J8
J9
Figure 4-2. 80-Pin ZQE Package (Top View) – F5510, F5509, F5508
Terminal Configuration and Functions
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MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
Copyright © 2009–2015, Texas Instruments Incorporated
9
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
SLAS645J – JULY 2009 – REVISED APRIL 2015
www.ti.com
VSSU
PU.0/DP
PUR
PU.1/DM
VBUS
VUSB
V18
AVSS2
P5.2/XT2IN
P5.3/XT2OUT
TEST/SBWTCK
RST/NMI/SBWTDIO
Figure 4-3 shows the pinout for the MSP430F5510, MSP430F5509, and MSP430F5508 devices in the
RGZ and PT packages.
48 47 46 45 44 43 42 41 40 39 38 37
P6.0/CB0/A0
1
36
P4.7/PM_NONE
P6.1/CB1/A1
2
35
P4.6/PM_NONE
P6.2/CB2/A2
3
34
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P6.3/CB3/A3
4
33
P4.4/PM_UCA1TXD/PM_UCA1SIMO
32
P4.3/PM_UCB1CLK/PM_UCA1STE
31
P4.2/PM_UCB1SOMI/PM_UCB1SCL
30
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P5.0/A8/VeREF+
5
P5.1/A9/VeREF-
6
AVCC1
7
MSP430F5510IRGZ
MSP430F5509IRGZ
MSP430F5508IRGZ
MSP430F5510IPT
MSP430F5509IPT
MSP430F5508IPT
PJ.3/TCK
PJ.2/TMS
PJ.0/TDO
26
12
25
13 14 15 16 17 18 19 20 21 22 23 24
PJ.1/TDI/TCLK
11
DVSS1
P2.0/TA1.1
DVCC1
P1.7/TA1.0
DVSS2
P1.6/TA1CLK/CBOUT
27
P1.5/TA0.4
10
P1.4/TA0.3
AVSS1
P1.3/TA0.2
DVCC2
P1.2/TA0.1
P4.0/PM_UCB1STE/PM_UCA1CLK
28
P1.1/TA0.0
29
9
VCORE
8
P1.0/TA0CLK/ACLK
P5.4/XIN
P5.5/XOUT
NOTE: TI recommends connection of the exposed thermal pad to VSS.
Figure 4-3. 48-Pin RGZ or PT Package (Top View) – F5510, F5509, F5508
10
Terminal Configuration and Functions
Copyright © 2009–2015, Texas Instruments Incorporated
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Product Folder Links: MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505
MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
www.ti.com
SLAS645J – JULY 2009 – REVISED APRIL 2015
VSSU
PU.0/DP
PUR
PU.1/DM
VBUS
VUSB
V18
AVSS2
P5.2/XT2IN
P5.3/XT2OUT
TEST/SBWTCK
RST/NMI/SBWTDIO
Figure 4-4 shows the pinout for the MSP430F5507, MSP430F5506, MSP430F5505 devices in the RGZ
package and the MSP430F5504 device in the RGZ and PT packages.
48 47 46 45 44 43 42 41 40 39 38 37
P6.0/A0
1
36
P4.7/PM_NONE
P6.1/A1
2
35
P4.6/PM_NONE
P6.2/A2
3
34
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P6.3/A3
4
33
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P5.0/A8/VeREF+
5
32
P4.3/PM_UCB1CLK/PM_UCA1STE
P5.1/A9/VeREF-
6
31
P4.2/PM_UCB1SOMI/PM_UCB1SCL
AVCC1
7
30
P4.1/PM_UCB1SIMO/PM_UCB1SDA
MSP430F5507IRGZ
MSP430F5506IRGZ
MSP430F5505IRGZ
MSP430F5504IRGZ
MSP430F5504IPT
PJ.3/TCK
PJ.2/TMS
PJ.0/TDO
26
12
25
13 14 15 16 17 18 19 20 21 22 23 24
PJ.1/TDI/TCLK
11
DVSS1
P2.0/TA1.1
DVCC1
P1.7/TA1.0
DVSS2
P1.6/TA1CLK
27
P1.5/TA0.4
10
P1.4/TA0.3
AVSS1
P1.3/TA0.2
DVCC2
P1.2/TA0.1
P4.0/PM_UCB1STE/PM_UCA1CLK
28
P1.1/TA0.0
29
9
VCORE
8
P1.0/TA0CLK/ACLK
P5.4/XIN
P5.5/XOUT
NOTE: TI recommends connection of the exposed thermal pad to VSS.
Figure 4-4. 48-Pin RGZ or PT Package (Top View) – F5507, F5506, F5505, F5504
Terminal Configuration and Functions
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MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
Copyright © 2009–2015, Texas Instruments Incorporated
11
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
SLAS645J – JULY 2009 – REVISED APRIL 2015
www.ti.com
VSSU
PU.0/DP
PUR
PU.1/DM
VBUS
VUSB
V18
AVSS2
P5.2/XT2IN
P5.3/XT2OUT
TEST/SBWTCK
RST/NMI/SBWTDIO
Figure 4-5 shows the pinout for the MSP430F5503, MSP430F5502, MSP430F5501, and MSP430F5500
devices in the RGZ package.
48 47 46 45 44 43 42 41 40 39 38 37
P6.0/CB0
1
36
P4.7/PM_NONE
P6.1/CB1
2
35
P4.6/PM_NONE
P6.2/CB2
3
34
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P6.3/CB3
4
33
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P5.0
5
32
P4.3/PM_UCB1CLK/PM_UCA1STE
31
P4.2/PM_UCB1SOMI/PM_UCB1SCL
30
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P5.1
6
AVCC1
7
MSP430F5503IRGZ
MSP430F5502IRGZ
MSP430F5501IRGZ
MSP430F5500IRGZ
PJ.3/TCK
PJ.2/TMS
PJ.1/TDI/TCLK
26
12
25
13 14 15 16 17 18 19 20 21 22 23 24
PJ.0/TDO
11
DVSS1
P2.0/TA1.1
DVCC1
P1.7/TA1.0
DVSS2
P1.5/TA0.4
27
P1.6/TA1CLK/CBOUT
10
P1.4/TA0.3
AVSS1
P1.3/TA0.2
DVCC2
P1.2/TA0.1
P4.0/PM_UCB1STE/PM_UCA1CLK
28
P1.1/TA0.0
29
9
P1.0/TA0CLK/ACLK
8
VCORE
P5.4/XIN
P5.5/XOUT
NOTE: TI recommends connection of the exposed thermal pad to VSS.
Figure 4-5. 48-Pin RGZ Package (Top View) – F5503, F5502, F5501, F5500
12
Terminal Configuration and Functions
Copyright © 2009–2015, Texas Instruments Incorporated
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Product Folder Links: MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505
MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
www.ti.com
4.2
SLAS645J – JULY 2009 – REVISED APRIL 2015
Signal Descriptions
Table 4-1 describes the signals for all device variants and package options.
Table 4-1. Terminal Functions
TERMINAL
NO.
NAME
RGC
RGZ,
PT
I/O (1)
DESCRIPTION
ZQE
General-purpose digital I/O
P6.4/CB4/A4
5
N/A
C1
I/O
Comparator_B input CB4 (not available on PT and RGZ package devices)
Analog input A4 – ADC (not available on PT and RGZ package devices)
General-purpose digital I/O
P6.5/CB5/A5
6
N/A
D2
I/O
Comparator_B input CB5 (not available on PT and RGZ package devices)
Analog input A5 – ADC (not available on PT and RGZ package devices)
General-purpose digital I/O
P6.6/CB6/A6
7
N/A
D1
I/O
Comparator_B input CB6 (not available on PT and RGZ package devices)
Analog input A6 – ADC (not available on PT and RGZ package devices)
General-purpose digital I/O
P6.7/CB7/A7
8
N/A
D3
I/O
Comparator_B input CB7 (not available on PT and RGZ package devices)
Analog input A7 – ADC (not available on PT and RGZ package devices)
General-purpose digital I/O
P5.0/A8/VeREF+
9
5
E1
I/O
Analog input A8 – ADC (not available on F5503, F5502, F5501, F5500
devices)
Input for an external reference voltage to the ADC (not available on F5503,
F5502, F5501, F5500 devices)
General-purpose digital I/O
P5.1/A9/VeREF-
10
6
E2
I/O
Analog input A9 – ADC (not available on F5503, F5502, F5501, F5500
devices)
Negative terminal for an externally provided ADC reference (not available
on F5503, F5502, F5501, F5500 devices)
AVCC1
11
7
F2
P5.4/XIN
12
8
F1
I/O
P5.5/XOUT
13
9
G1
I/O
AVSS1
14
10
G2
Analog ground supply
DVCC1
15
11
H1
Digital power supply
16
12
J1
Digital ground supply
17
13
J2
Regulated core power supply output (internal use only, no external current
loading)
18
14
H2
DVSS1
VCORE
(2)
Analog power supply
General-purpose digital I/O
Input terminal for crystal oscillator XT1
General-purpose digital I/O
Output terminal of crystal oscillator XT1
General-purpose digital I/O with port interrupt
P1.0/TA0CLK/ACLK
I/O
TA0 clock signal TA0CLK input
ACLK output (divided by 1, 2, 4, 8, 16, or 32)
General-purpose digital I/O with port interrupt
P1.1/TA0.0
19
15
H3
I/O
TA0 CCR0 capture: CCI0A input, compare: Out0 output
BSL transmit output
General-purpose digital I/O with port interrupt
P1.2/TA0.1
20
16
J3
I/O
TA0 CCR1 capture: CCI1A input, compare: Out1 output
BSL receive input
(1)
(2)
I = input, O = output, N/A = not available
VCORE is for internal use only. No external current loading is possible. VCORE should only be connected to the recommended
capacitor value, CVCORE (see Section 5.3).
Terminal Configuration and Functions
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MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
Copyright © 2009–2015, Texas Instruments Incorporated
13
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
SLAS645J – JULY 2009 – REVISED APRIL 2015
www.ti.com
Table 4-1. Terminal Functions (continued)
TERMINAL
NO.
NAME
I/O (1)
RGC
RGZ,
PT
ZQE
P1.3/TA0.2
21
17
G4
I/O
P1.4/TA0.3
22
18
H4
I/O
P1.5/TA0.4
23
19
J4
I/O
P1.6/TA1CLK/CBOUT
24
20
G5
I/O
DESCRIPTION
General-purpose digital I/O with port interrupt
TA0 CCR2 capture: CCI2A input, compare: Out2 output
General-purpose digital I/O with port interrupt
TA0 CCR3 capture: CCI3A input compare: Out3 output
General-purpose digital I/O with port interrupt
TA0 CCR4 capture: CCI4A input, compare: Out4 output
General-purpose digital I/O with port interrupt
TA1 clock signal TA1CLK input
Comparator_B output
P1.7/TA1.0
25
21
H5
I/O
P2.0/TA1.1
26
22
J5
I/O
P2.1/TA1.2
27
N/A
G6
I/O
P2.2/TA2CLK/SMCLK
28
N/A
J6
I/O
General-purpose digital I/O with port interrupt
TA1 CCR0 capture: CCI0A input, compare: Out0 output
General-purpose digital I/O with port interrupt
TA1 CCR1 capture: CCI1A input, compare: Out1 output
General-purpose digital I/O with port interrupt
TA1 CCR2 capture: CCI2A input, compare: Out2 output
General-purpose digital I/O with port interrupt
TA2 clock signal TA2CLK input
SMCLK output
P2.3/TA2.0
29
N/A
H6
I/O
P2.4/TA2.1
30
N/A
J7
I/O
P2.5/TA2.2
31
N/A
J8
I/O
General-purpose digital I/O with port interrupt
TA2 CCR0 capture: CCI0A input, compare: Out0 output
General-purpose digital I/O with port interrupt
TA2 CCR1 capture: CCI1A input, compare: Out1 output
General-purpose digital I/O with port interrupt
TA2 CCR2 capture: CCI2A input, compare: Out2 output
General-purpose digital I/O with port interrupt
P2.6/RTCCLK/DMAE0
32
N/A
J9
I/O
RTC clock output for calibration
DMA external trigger input
General-purpose digital I/O with port interrupt
P2.7/UCB0STE/UCA0CLK
33
N/A
H7
I/O
Slave transmit enable – USCI_B0 SPI mode
Clock signal input – USCI_A0 SPI slave mode
Clock signal output – USCI_A0 SPI master mode
General-purpose digital I/O
P3.0/UCB0SIMO/UCB0SDA
34
N/A
H8
I/O
Slave in, master out – USCI_B0 SPI mode
I2C data – USCI_B0 I2C mode
General-purpose digital I/O
P3.1/UCB0SOMI/UCB0SCL
35
N/A
H9
I/O
Slave out, master in – USCI_B0 SPI mode
I2C clock – USCI_B0 I2C mode
General-purpose digital I/O
P3.2/UCB0CLK/UCA0STE
36
N/A
G8
I/O
Clock signal input – USCI_B0 SPI slave mode
Clock signal output – USCI_B0 SPI master mode
Slave transmit enable – USCI_A0 SPI mode
General-purpose digital I/O
P3.3/UCA0TXD/UCA0SIMO
37
N/A
G9
I/O
Transmit data – USCI_A0 UART mode
Slave in, master out – USCI_A0 SPI mode
14
Terminal Configuration and Functions
Copyright © 2009–2015, Texas Instruments Incorporated
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SLAS645J – JULY 2009 – REVISED APRIL 2015
Table 4-1. Terminal Functions (continued)
TERMINAL
NO.
NAME
RGC
RGZ,
PT
I/O (1)
DESCRIPTION
ZQE
General-purpose digital I/O
P3.4/UCA0RXD/UCA0SOMI
38
N/A
G7
I/O
Receive data – USCI_A0 UART mode
Slave out, master in – USCI_A0 SPI mode
General-purpose digital I/O with reconfigurable port mapping secondary
function
P4.0/PM_UCB1STE/
PM_UCA1CLK
41
29
E8
I/O
Default mapping: Slave transmit enable – USCI_B1 SPI mode
Default mapping: Clock signal input – USCI_A1 SPI slave mode
Default mapping: Clock signal output – USCI_A1 SPI master mode
P4.1/PM_UCB1SIMO/
PM_UCB1SDA
General-purpose digital I/O with reconfigurable port mapping secondary
function
42
30
E7
I/O
Default mapping: Slave in, master out – USCI_B1 SPI mode
Default mapping: I2C data – USCI_B1 I2C mode
P4.2/PM_UCB1SOMI/
PM_UCB1SCL
General-purpose digital I/O with reconfigurable port mapping secondary
function
43
31
D9
I/O
Default mapping: Slave out, master in – USCI_B1 SPI mode
Default mapping: I2C clock – USCI_B1 I2C mode
General-purpose digital I/O with reconfigurable port mapping secondary
function
P4.3/PM_UCB1CLK/
PM_UCA1STE
44
DVSS2
39
27
F9
Digital ground supply
DVCC2
40
28
E9
Digital power supply
32
D8
I/O
Default mapping: Clock signal input – USCI_B1 SPI slave mode
Default mapping: Clock signal output – USCI_B1 SPI master mode
Default mapping: Slave transmit enable – USCI_A1 SPI mode
P4.4/PM_UCA1TXD/
PM_UCA1SIMO
General-purpose digital I/O with reconfigurable port mapping secondary
function
45
33
D7
I/O
Default mapping: Transmit data – USCI_A1 UART mode
Default mapping: Slave in, master out – USCI_A1 SPI mode
P4.5/PM_UCA1RXD/
PM_UCA1SOMI
General-purpose digital I/O with reconfigurable port mapping secondary
function
46
34
C9
I/O
Default mapping: Receive data – USCI_A1 UART mode
Default mapping: Slave out, master in – USCI_A1 SPI mode
P4.6/PM_NONE
47
35
C8
I/O
General-purpose digital I/O with reconfigurable port mapping secondary
function
Default mapping: no secondary function
P4.7/PM_NONE
48
36
C7
I/O
General-purpose digital I/O with reconfigurable port mapping secondary
function
Default mapping: no secondary function
VSSU
49
37
B8,
B9
PU.0/DP
50
38
A9
I/O
PUR
51
39
B7
I/O
PU.1/DM
52
40
A8
I/O
VBUS
53
41
A7
USB LDO input (connect to USB power source)
VUSB
54
42
A6
USB LDO output
USB PHY ground supply
General-purpose digital I/O - controlled by USB control register
USB data terminal DP
USB pullup resistor pin (open drain). The voltage level at the PUR pin is
used to invoke the default USB BSL. Recommended 1-MΩ resistor to
ground. See Section 6.5.1 for more information.
General-purpose digital I/O - controlled by USB control register
USB data terminal DM
Terminal Configuration and Functions
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Table 4-1. Terminal Functions (continued)
TERMINAL
NO.
NAME
I/O (1)
DESCRIPTION
RGC
RGZ,
PT
ZQE
V18
55
43
B6
USB regulated power (internal use only, no external current loading)
AVSS2
56
44
A5
Analog ground supply
P5.2/XT2IN
57
45
B5
I/O
P5.3/XT2OUT
58
46
B4
I/O
TEST/SBWTCK
59
47
A4
I
PJ.0/TDO
60
23
C5
I/O
General-purpose digital I/O
Input terminal for crystal oscillator XT2
General-purpose digital I/O
Output terminal of crystal oscillator XT2
Test mode pin – select digital I/O on JTAG pins
Spy-By-Wire input clock
General-purpose digital I/O
Test data output port
General-purpose digital I/O
PJ.1/TDI/TCLK
61
24
C4
I/O
Test data input
Test clock input
PJ.2/TMS
62
25
A3
I/O
PJ.3/TCK
63
26
B3
I/O
General-purpose digital I/O
Test mode select
General-purpose digital I/O
Test clock
Reset input, active low (3)
RST/NMI/SBWTDIO
64
48
A2
I/O
Nonmaskable interrupt input
Spy-By-Wire data input/output
General-purpose digital I/O
P6.0/CB0/A0
1
1
A1
I/O
Comparator_B input CB0 (not available on F5507, F5506, F5505, F5504
devices)
Analog input A0 – ADC (not available on F5503, F5502, F5501, F5500
devices)
General-purpose digital I/O
P6.1/CB1/A1
2
2
B2
I/O
Comparator_B input CB1 (not available on F5507, F5506, F5505, F5504
devices)
Analog input A1 – ADC (not available on F5503, F5502, F5501, F5500
devices)
General-purpose digital I/O
P6.2/CB2/A2
3
3
B1
I/O
Comparator_B input CB2 (not available on F5507, F5506, F5505, F5504
devices)
Analog input A2 – ADC (not available on F5503, F5502, F5501, F5500
devices)
General-purpose digital I/O
P6.3/CB3/A3
4
4
C2
I/O
Comparator_B input CB3 (not available on F5507, F5506, F5505, F5504
devices)
Analog input A3 – ADC (not available on F5503, F5502, F5501, F5500
devices)
Reserved
N/A
N/A
(4)
QFN Pad
Pad
Pad
N/A
(3)
(4)
16
Reserved. Connect to ground.
Exposed QFN package pad (not available on PT package devices). TI
recommends connecting to VSS.
When this pin is configured as reset, the internal pullup resistor is enabled by default.
C6, D4, D5, D6, E3, E4, E5, E6, F3, F4, F5, F6, F7, F8, G3 are reserved and should be connected to ground.
Terminal Configuration and Functions
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SLAS645J – JULY 2009 – REVISED APRIL 2015
5 Specifications
Absolute Maximum Ratings (1)
5.1
over operating free-air temperature range (unless otherwise noted)
Voltage applied at VCC to VSS
Voltage applied to any pin (excluding VCORE, VBUS, V18)
(2)
MIN
MAX
–0.3
4.1
–0.3
VCC + 0.3
Diode current at any device pin
Maximum junction temperature, TJ
Storage temperature, Tstg (3)
(1)
(2)
(3)
–55
mA
95
°C
150
°C
ESD Ratings
V(ESD)
5.3
V
±2
VALUE
(2)
V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to VSS. VCORE is for internal device use only. No external dc loading or voltage should be applied.
Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
5.2
(1)
UNIT
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±1000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±250
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as
±1000 V may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±250 V
may actually have higher performance.
Recommended Operating Conditions
Typical values are specified at VCC = 3.3 V and TA = 25°C (unless otherwise noted)
MIN
Supply voltage during program execution and flash
programming(AVCC = DVCC) (1) (2)
VCC
Supply voltage during USB operation, USB PLL disabled,
USB_EN = 1, UPLLEN = 0
VCC,USB
Supply voltage during USB operation, USB PLL enabled (3),
USB_EN = 1, UPLLEN = 1
3.6
PMMCOREVx = 0, 1
2.0
3.6
PMMCOREVx = 0, 1, 2
2.2
3.6
PMMCOREVx = 0, 1, 2, 3
2.4
3.6
PMMCOREVx = 0
1.8
3.6
PMMCOREVx = 0, 1
2.0
3.6
PMMCOREVx = 0, 1, 2
2.2
3.6
PMMCOREVx = 0, 1, 2, 3
2.4
3.6
PMMCOREVx = 2
2.2
3.6
PMMCOREVx = 2, 3
2.4
Supply voltage (AVSS = DVSS1/2 = DVSS)
TA
Operating free-air temperature
I version
–40
TJ
Operating junction temperature
I version
–40
CVCORE
Capacitor at VCORE (4)
CDVCC/
CVCORE
Capacitor ratio of DVCC to VCORE
(2)
(3)
(4)
MAX
1.8
VSS
(1)
NOM
PMMCOREVx = 0
UNIT
V
V
3.6
0
V
85
85
470
°C
°C
nF
10
TI recommends powering AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be
tolerated during power up and operation.
The minimum supply voltage is defined by the supervisor SVS levels when it is enabled. See the Section 5.22 threshold parameters for
the exact values and further details.
USB operation with USB PLL enabled requires PMMCOREVx ≥ 2 for proper operation.
A capacitor tolerance of ±20% or better is required.
Specifications
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SLAS645J – JULY 2009 – REVISED APRIL 2015
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Recommended Operating Conditions (continued)
Typical values are specified at VCC = 3.3 V and TA = 25°C (unless otherwise noted)
MIN
Processor frequency (maximum MCLK frequency) (5)
(see Figure 5-1)
fSYSTEM
fSYSTEM_USB
Minimum processor frequency for USB operation
USB_wait
Wait state cycles during USB operation
(5)
NOM
MAX
PMMCOREVx = 0,
1.8 V ≤ VCC ≤ 3.6 V
(default condition)
0
8.0
PMMCOREVx = 1,
2.0 V ≤ VCC ≤ 3.6 V
0
12.0
PMMCOREVx = 2,
2.2 V ≤ VCC ≤ 3.6 V
0
20.0
PMMCOREVx = 3,
2.4 V ≤ VCC ≤ 3.6 V
0
25.0
1.5
UNIT
MHz
MHz
16
cycles
Modules may have a different maximum input clock specification. See the specification of the respective module in this data sheet.
25
System Frequency - MHz
3
20
2
2, 3
1
1, 2
1, 2, 3
0, 1
0, 1, 2
0, 1, 2, 3
12
8
0
0
1.8
2.0
2.2
2.4
3.6
Supply Voltage - V
The numbers within the fields denote the supported PMMCOREVx settings.
Figure 5-1. Maximum System Frequency
18
Specifications
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MSP430F5510, MSP430F5509, MSP430F5508
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MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
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5.4
SLAS645J – JULY 2009 – REVISED APRIL 2015
Active Mode Supply Current Into VCC Excluding External Current
over recommended operating free-air temperature (unless otherwise noted) (1)
(2) (3)
FREQUENCY (fDCO = fMCLK = fSMCLK)
PARAMETER
IAM,
IAM,
(1)
(2)
(3)
Flash
RAM
EXECUTION
MEMORY
Flash
RAM
VCC
PMMCOREVx
3V
3V
1 MHz
8 MHz
12 MHz
TYP
MAX
1.74
2.58
2.78
1.91
20 MHz
TYP
MAX
TYP
MAX
0
0.25
0.27
1.55
1.68
1
0.28
2
0.30
3
0.32
0
0.17
1
0.19
1.03
1.54
2
0.20
1.16
1.73
2.84
3
0.21
1.24
1.87
3.1
2.09
0.19
0.91
TYP
MAX
2.84
4.68
5.06
3.10
5.13
25 MHz
TYP
UNIT
MAX
mA
6.0
6.5
1.00
1.67
mA
3.11
3.9
4.3
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
Characterized with program executing typical data processing. USB disabled (VUSBEN = 0, SLDOEN = 0).
fACLK = 32786 Hz, fDCO = fMCLK = fSMCLK at specified frequency.
XTS = CPUOFF = SCG0 = SCG1 = OSCOFF = SMCLKOFF = 0.
Specifications
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SLAS645J – JULY 2009 – REVISED APRIL 2015
5.5
www.ti.com
Low-Power Mode Supply Currents (Into VCC) Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
ILPM0,1MHz
Low-power mode 0 (3) (4)
ILPM2
Low-power mode 2 (5) (4)
ILPM4
0
73
77
85
80
85
97
3V
3
79
83
92
88
95
105
2.2 V
0
6.5
6.5
8
7.5
8
11
3V
3
7.0
7.0
9
7.9
8.9
13
0
1.60
1.90
2.6
3.4
1
1.65
2.00
2.7
3.6
2
1.75
2.15
2.9
3.8
0
1.8
2.1
2.8
3.6
1
1.9
2.3
2.9
3.8
2
2.0
2.4
3.0
4.0
3
2.0
2.5
3.0
3.1
4.0
6.5
0
1.1
1.3
1.8
1.9
2.7
5.0
1
1.1
1.4
2.0
2.8
2
1.2
1.5
2.1
2.9
3
1.3
1.5
2.0
2.2
3.0
5.5
0
0.9
1.1
1.5
1.8
2.5
4.8
1
1.1
1.2
2.0
2.6
2
1.2
1.2
2.1
2.7
3
1.3
1.3
1.6
2.2
2.8
5.0
ILPM4.5
(1)
(2)
0.15
0.18
0.35
0.26
0.45
0.80
(3)
(4)
(5)
(6)
(7)
(8)
(9)
20
3V
Low-power mode 4 (8) (4)
Low-power mode 4.5
(9)
85°C
2.2 V
Low-power mode 3,
crystal mode (6) (4)
Low-power mode 3,
VLO mode (7) (4)
60°C
PMMCOREVx
3V
ILPM3,VLO
25°C
VCC
2.2 V
ILPM3,XT1LF
–40°C
(2)
3V
3V
TYP
MAX
TYP
MAX
2.6
TYP
MAX
TYP
MAX
6.0
UNIT
µA
µA
µA
µA
µA
µA
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
Current for watchdog timer clocked by SMCLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 (LPM0); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 1 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0).
Current for brownout, high side supervisor (SVSH) normal mode included. Low side supervisor and monitors disabled (SVSL, SVML).
High-side monitor disabled (SVMH). RAM retention enabled.
Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 (LPM2); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 0 MHz; DCO setting
= 1 MHz operation, DCO bias generator enabled.
USB disabled (VUSBEN = 0, SLDOEN = 0)
Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0)
Current for watchdog timer and RTC clocked by ACLK included. ACLK = VLO.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = fVLO, fMCLK = fSMCLK = fDCO = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0)
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 (LPM4); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
USB disabled (VUSBEN = 0, SLDOEN = 0)
Internal regulator disabled. No data retention.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1, PMMREGOFF = 1 (LPM4.5); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
Specifications
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5.6
SLAS645J – JULY 2009 – REVISED APRIL 2015
Thermal Packaging Characteristics
VALUE (1)
PARAMETER
Junction-to-ambient thermal resistance, still air (2)
θJA
Junction-to-case (top) thermal resistance (3)
θJC(TOP)
θJC(BOTTOM)
θJB
(1)
(2)
(3)
(4)
(5)
Junction-to-case (bottom) thermal resistance (4)
Junction-to-board thermal resistance (5)
VQFN (RGC)
30
VQFN (RGZ)
28.6
LQFP (PT)
62.8
BGA (ZQE)
55.5
VQFN (RGC)
15.6
VQFN (RGZ)
14.4
LQFP (PT)
18.2
BGA (ZQE)
21.2
VQFN(RGC)
1.6
VQFN (RGZ)
1.6
LQFP (PT)
N/A
BGA (ZQE)
N/A
VQFN (RGC)
8.9
VQFN (RGZ)
5.5
LQFP (PT)
28.3
BGA (ZQE)
19.3
UNIT
°C/W
°C/W
°C/W
°C/W
N/A = not applicable
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case(top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard
test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-case(bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
Specifications
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Schmitt-Trigger Inputs – General-Purpose I/O (1)
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7)
(P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3, RST/NMI)
5.7
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIT+
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input voltage hysteresis (VIT+ – VIT–)
RPull
Pullup or pulldown resistor (2)
For pullup: VIN = VSS
For pulldown: VIN = VCC
CI
Input capacitance
VIN = VSS or VCC
(1)
(2)
VCC
MIN
1.8 V
0.80
TYP
1.40
3V
1.50
2.10
1.8 V
0.45
1.00
3V
0.75
1.65
1.8 V
0.3
0.85
3V
0.4
1.0
20
35
MAX
UNIT
V
V
V
50
kΩ
5
pF
Same parametrics apply to clock input pin when crystal bypass mode is used on XT1 (XIN) or XT2 (XT2IN).
Also applies to the RST pin when its pullup or pullup resistor is enabled.
Inputs – Ports P1 and P2 (1)
(P1.0 to P1.7, P2.0 to P2.7)
5.8
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
t(int)
(1)
(2)
External interrupt timing
(2)
TEST CONDITIONS
VCC
Port P1, P2: P1.x to P2.x, External trigger pulse duration
to set interrupt flag
2.2 V, 3 V
MIN
MAX
UNIT
20
ns
Some devices may contain additional ports with interrupts. See the block diagram and terminal function descriptions.
An external signal sets the interrupt flag every time the minimum interrupt pulse duration t(int) is met. It may be set by trigger signals
shorter than t(int).
5.9
Leakage Current – General-Purpose I/O
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7)
(P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3, RST/NMI)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Ilkg(Px.y)
(1)
(2)
TEST CONDITIONS
VCC
(1) (2)
High-impedance leakage current
MIN
1.8 V, 3 V
MAX
UNIT
±50
nA
The leakage current is measured with VSS or VCC applied to the corresponding pins, unless otherwise noted.
The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup or pulldown resistor is
disabled.
5.10 Outputs – General-Purpose I/O (Full Drive Strength)
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, PJ.0
to PJ.3)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
I(OHmax) = –3 mA
VOH
High-level output voltage
I(OHmax) = –10 mA (2)
I(OHmax) = –5 mA (1)
I(OHmax) = –15 mA (2)
I(OLmax) = 3 mA
VOL
Low-level output voltage
(2)
22
1.8 V
3V
(1)
I(OLmax) = 10 mA (2)
I(OLmax) = 5 mA (1)
I(OLmax) = 15 mA (2)
(1)
VCC
(1)
1.8 V
3V
MIN
MAX
VCC – 0.25
VCC
VCC – 0.60
VCC
VCC – 0.25
VCC
VCC – 0.60
VCC
VSS
VSS + 0.25
VSS
VSS + 0.60
VSS
VSS + 0.25
VSS
VSS + 0.60
UNIT
V
V
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±48 mA to hold the maximum voltage drop
specified.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±100 mA to hold the maximum voltage
drop specified.
Specifications
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5.11 Outputs – General-Purpose I/O (Reduced Drive Strength)
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, PJ.0
to PJ.3)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
I(OHmax) = –1 mA (2)
VOH
1.8 V
I(OHmax) = –3 mA (3)
High-level output voltage
I(OHmax) = –2 mA
VCC
(2)
3V
I(OHmax) = –6 mA (3)
I(OLmax) = 1 mA (2)
VOL
I(OLmax) = 2 mA (2)
(3)
VCC
VCC – 0.60
VCC
VCC – 0.25
VCC
VCC – 0.60
VCC
VSS
VSS + 0.25
VSS
VSS + 0.60
VSS
VSS + 0.25
VSS
VSS + 0.60
3V
I(OLmax) = 6 mA (3)
(1)
(2)
MAX
1.8 V
I(OLmax) = 3 mA (3)
Low-level output voltage
MIN
VCC – 0.25
UNIT
V
V
Selecting reduced drive strength may reduce EMI.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±48 mA to hold the maximum voltage drop
specified.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined, should not exceed ±100 mA to hold the maximum voltage
drop specified.
5.12 Output Frequency – General-Purpose I/O
(P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, PJ.0
to PJ.3)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
(1) (2)
Port output frequency
(with load)
fPx.y
fPort_CLK
(1)
(2)
Clock output frequency
ACLK
SMCLK
MCLK
CL = 20 pF (2)
VCC = 1.8 V
PMMCOREVx = 0
16
VCC = 3 V
PMMCOREVx = 3
25
VCC = 1.8 V
PMMCOREVx = 0
16
VCC = 3 V
PMMCOREVx = 3
25
MHz
MHz
A resistive divider with 2 × R1 between VCC and VSS is used as load. The output is connected to the center tap of the divider. For full
drive strength, R1 = 550 Ω. For reduced drive strength, R1 = 1.6 kΩ. CL = 20 pF is connected to the output to VSS.
The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency.
Specifications
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5.13 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
8.0
VCC = 3.0 V
Px.y
IOL – Typical Low-Level Output Current – mA
IOL – Typical Low-Level Output Current – mA
25.0
TA = 25°C
20.0
TA = 85°C
15.0
10.0
5.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VOL – Low-Level Output Voltage – V
Figure 5-2. Typical Low-Level Output Current vs Low-Level
Output Voltage
IOH – Typical High-Level Output Current – mA
IOH – Typical High-Level Output Current – mA
-5.0
-10.0
TA = 85°C
TA = 25°C
3.0
2.0
1.0
0.5
1.0
1.5
2.0
VCC = 1.8 V
Px.y
-1.0
-2.0
-3.0
-4.0
TA = 85°C
-5.0
-6.0
TA = 25°C
-7.0
-8.0
-25.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VOH – High-Level Output Voltage – V
Figure 5-4. Typical High-Level Output Current vs High-Level
Output Voltage
24
4.0
0.0
VCC = 3.0 V
Px.y
-20.0
5.0
VOL – Low-Level Output Voltage – V
Figure 5-3. Typical Low-Level Output Current vs Low-Level
Output Voltage
0.0
-15.0
TA = 85°C
6.0
0.0
0.0
3.5
TA = 25°C
VCC = 1.8 V
Px.y
7.0
Specifications
0.0
0.5
1.0
1.5
2.0
VOH – High-Level Output Voltage – V
Figure 5-5. Typical High-Level Output Current vs High-Level
Output Voltage
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5.14 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TA = 25°C
VCC = 3.0 V
Px.y
55.0
50.0
IOL – Typical Low-Level Output Current – mA
IOL – Typical Low-Level Output Current – mA
60.0
TA = 85°C
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
IOH – Typical High-Level Output Current – mA
IOH – Typical High-Level Output Current – mA
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
-40.0
-45.0
TA = 85°C
-55.0
TA = 25°C
-60.0
0.0
TA = 85°C
16
12
8
4
0.5
1.0
1.5
2.0
0
VCC = 3.0 V
Px.y
-50.0
TA = 25°C
20
VOL – Low-Level Output Voltage – V
Figure 5-7. Typical Low-Level Output Current vs Low-Level
Output Voltage
0.0
-5.0
VCC = 1.8 V
Px.y
0
0.0
3.5
VOL – Low-Level Output Voltage – V
Figure 5-6. Typical Low-Level Output Current vs Low-Level
Output Voltage
24
0.5
VCC = 1.8 V
Px.y
-4
-8
-12
TA = 85°C
-16
TA = 25°C
-20
1.0
1.5
2.0
2.5
3.0
3.5
VOH – High-Level Output Voltage – V
Figure 5-8. Typical High-Level Output Current vs High-Level
Output Voltage
0.0
0.5
1.0
1.5
VOH – High-Level Output Voltage – V
Figure 5-9. Typical High-Level Output Current vs High-Level
Output Voltage
Specifications
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5.15 Crystal Oscillator, XT1, Low-Frequency Mode (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 1,
TA = 25°C
ΔIDVCC.LF
Differential XT1 oscillator crystal
current consumption from lowest
drive setting, LF mode
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 2,
TA = 25°C
0.170
32768
XTS = 0, XT1BYPASS = 0
fXT1,LF,SW
XT1 oscillator logic-level squarewave input frequency, LF mode
XTS = 0, XT1BYPASS = 1 (2)
OALF
3V
0.290
XT1 oscillator crystal frequency,
LF mode
(3)
10
CL,eff
fFault,LF
tSTART,LF
210
XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 1,
fXT1,LF = 32768 Hz, CL,eff = 12 pF
300
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
26
XTS = 0, XCAPx = 2
8.5
XTS = 0, XCAPx = 3
12.0
Oscillator fault frequency,
LF mode (7)
XTS = 0 (8)
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 0,
TA = 25°C, CL,eff = 6 pF
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3,
TA = 25°C, CL,eff = 12 pF
µA
Hz
50
kHz
1
5.5
Duty cycle, LF mode
UNIT
kΩ
XTS = 0, XCAPx = 1
XTS = 0, Measured at ACLK,
fXT1,LF = 32768 Hz
Start-up time, LF mode
32.768
XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 0,
fXT1,LF = 32768 Hz, CL,eff = 6 pF
XTS = 0, XCAPx = 0 (6)
Integrated effective load
capacitance, LF mode (5)
MAX
0.075
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3,
TA = 25°C
fXT1,LF0
Oscillation allowance for
LF crystals (4)
TYP
pF
30%
70%
10
10000
Hz
1000
3V
ms
500
To improve EMI on the XT1 oscillator, the following guidelines should be observed.
• Keep the trace between the device and the crystal as short as possible.
• Design a good ground plane around the oscillator pins.
• Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
• Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
• Use assembly materials and processes that avoid any parasitic load on the oscillator XIN and XOUT pins.
• If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
When XT1BYPASS is set, XT1 circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in
the Schmitt-trigger Inputs section of this datasheet.
Maximum frequency of operation of the entire device cannot be exceeded.
Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the
XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following
guidelines, but should be evaluated based on the actual crystal selected for the application:
• For XT1DRIVEx = 0, CL,eff ≤ 6 pF.
• For XT1DRIVEx = 1, 6 pF ≤ CL,eff ≤ 9 pF.
• For XT1DRIVEx = 2, 6 pF ≤ CL,eff ≤ 10 pF.
• For XT1DRIVEx = 3, CL,eff ≥ 6 pF.
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, TI recommends verifying the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies between the MIN and MAX specifications might set the flag.
Measured with logic-level input frequency but also applies to operation with crystals.
Specifications
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5.16 Crystal Oscillator, XT2
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
VCC
MIN
fOSC = 4 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 0, TA = 25°C
IDVCC.XT2
XT2 oscillator crystal current
consumption
fOSC = 12 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 1, TA = 25°C
fOSC = 20 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 2, TA = 25°C
(2)
TYP
MAX
UNIT
200
260
3V
µA
325
fOSC = 32 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 3, TA = 25°C
450
fXT2,HF0
XT2 oscillator crystal
frequency, mode 0
XT2DRIVEx = 0, XT2BYPASS = 0 (3)
4
8
MHz
fXT2,HF1
XT2 oscillator crystal
frequency, mode 1
XT2DRIVEx = 1, XT2BYPASS = 0 (3)
8
16
MHz
fXT2,HF2
XT2 oscillator crystal
frequency, mode 2
XT2DRIVEx = 2, XT2BYPASS = 0 (3)
16
24
MHz
fXT2,HF3
XT2 oscillator crystal
frequency, mode 3
XT2DRIVEx = 3, XT2BYPASS = 0 (3)
24
32
MHz
fXT2,HF,SW
XT2 oscillator logic-level
square-wave input frequency,
bypass mode
XT2BYPASS = 1 (4)
0.7
32
MHz
OAHF
tSTART,HF
CL,eff
fFault,HF
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
Oscillation allowance for
HF crystals (5)
Start-up time
Integrated effective load
capacitance, HF mode (6)
(3)
XT2DRIVEx = 0, XT2BYPASS = 0,
fXT2,HF0 = 6 MHz, CL,eff = 15 pF
450
XT2DRIVEx = 1, XT2BYPASS = 0,
fXT2,HF1 = 12 MHz, CL,eff = 15 pF
320
XT2DRIVEx = 2, XT2BYPASS = 0,
fXT2,HF2 = 20 MHz, CL,eff = 15 pF
200
XT2DRIVEx = 3, XT2BYPASS = 0,
fXT2,HF3 = 32 MHz, CL,eff = 15 pF
200
fOSC = 6 MHz,
XT2BYPASS = 0, XT2DRIVEx = 0,
TA = 25°C, CL,eff = 15 pF
0.5
fOSC = 20 MHz
XT2BYPASS = 0, XT2DRIVEx = 2,
TA = 25°C, CL,eff = 15 pF
Ω
3V
ms
0.3
1
(1)
Duty cycle
Measured at ACLK, fXT2,HF2 = 20 MHz
Oscillator fault frequency (7)
XT2BYPASS = 1 (8)
40%
30
50%
pF
60%
300
kHz
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
To improve EMI on the XT2 oscillator the following guidelines should be observed.
• Keep the traces between the device and the crystal as short as possible.
• Design a good ground plane around the oscillator pins.
• Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT.
• Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.
• Use assembly materials and processes that avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.
• If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
This represents the maximum frequency that can be input to the device externally. Maximum frequency achievable on the device
operation is based on the frequencies present on ACLK, MCLK, and SMCLK cannot be exceed for a given range of operation.
When XT2BYPASS is set, the XT2 circuit is automatically powered down. Input signal is a digital square wave with parametrics defined
in the Schmitt-trigger Inputs section of this datasheet.
Oscillation allowance is based on a safety factor of 5 for recommended crystals.
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, TI recommends verifying the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies between the MIN and MAX specifications might set the flag.
Measured with logic-level input frequency but also applies to operation with crystals.
Specifications
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5.17 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
fVLO
VLO frequency
Measured at ACLK
1.8 V to 3.6 V
dfVLO/dT
VLO frequency temperature drift
Measured at ACLK (1)
1.8 V to 3.6 V
Measured at ACLK (2)
1.8 V to 3.6 V
Measured at ACLK
1.8 V to 3.6 V
dfVLO/dVCC VLO frequency supply voltage drift
Duty cycle
(1)
(2)
MIN
TYP
MAX
6
9.4
14
0.5
50%
kHz
%/°C
4
40%
UNIT
%/V
60%
Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 V to 3.6 V) – MIN(1.8 V to 3.6 V)) / MIN(1.8 V to 3.6 V) / (3.6 V – 1.8 V)
5.18 Internal Reference, Low-Frequency Oscillator (REFO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
IREFO
fREFO
TEST CONDITIONS
VCC
MIN
TYP
1.8 V to 3.6 V
3
REFO frequency calibrated
Measured at ACLK
1.8 V to 3.6 V
32768
Full temperature range
1.8 V to 3.6 V
±3.5%
3V
±1.5%
REFO absolute tolerance calibrated
TA = 25°C
(1)
dfREFO/dT
REFO frequency temperature drift
Measured at ACLK
1.8 V to 3.6 V
0.01
dfREFO/dVCC
REFO frequency supply voltage drift
Measured at ACLK (2)
1.8 V to 3.6 V
1.0
Duty cycle
Measured at ACLK
1.8 V to 3.6 V
REFO start-up time
40%/60% duty cycle
1.8 V to 3.6 V
tSTART
(1)
(2)
28
MAX
REFO oscillator current consumption TA = 25°C
40%
50%
UNIT
µA
Hz
%/°C
%/V
60%
25
µs
Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 V to 3.6 V) – MIN(1.8 V to 3.6 V)) / MIN(1.8 V to 3.6 V) / (3.6 V – 1.8 V)
Specifications
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5.19 DCO Frequency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
(1)
MIN
TYP
MAX
UNIT
fDCO(0,0)
DCO frequency (0, 0)
DCORSELx = 0, DCOx = 0, MODx = 0
0.07
0.20
MHz
fDCO(0,31)
DCO frequency (0, 31) (1)
DCORSELx = 0, DCOx = 31, MODx = 0
0.70
1.70
MHz
fDCO(1,0)
DCO frequency (1, 0) (1)
DCORSELx = 1, DCOx = 0, MODx = 0
0.15
0.36
MHz
fDCO(1,31)
DCO frequency (1, 31) (1)
DCORSELx = 1, DCOx = 31, MODx = 0
1.47
3.45
MHz
(1)
fDCO(2,0)
DCO frequency (2, 0)
DCORSELx = 2, DCOx = 0, MODx = 0
0.32
0.75
MHz
fDCO(2,31)
DCO frequency (2, 31) (1)
DCORSELx = 2, DCOx = 31, MODx = 0
3.17
7.38
MHz
fDCO(3,0)
DCO frequency (3, 0) (1)
DCORSELx = 3, DCOx = 0, MODx = 0
0.64
1.51
MHz
(1)
fDCO(3,31)
DCO frequency (3, 31)
DCORSELx = 3, DCOx = 31, MODx = 0
6.07
14.0
MHz
fDCO(4,0)
DCO frequency (4, 0) (1)
DCORSELx = 4, DCOx = 0, MODx = 0
1.3
3.2
MHz
fDCO(4,31)
DCO frequency (4, 31) (1)
DCORSELx = 4, DCOx = 31, MODx = 0
12.3
28.2
MHz
(1)
fDCO(5,0)
DCO frequency (5, 0)
DCORSELx = 5, DCOx = 0, MODx = 0
2.5
6.0
MHz
fDCO(5,31)
DCO frequency (5, 31) (1)
DCORSELx = 5, DCOx = 31, MODx = 0
23.7
54.1
MHz
fDCO(6,0)
DCO frequency (6, 0) (1)
DCORSELx = 6, DCOx = 0, MODx = 0
4.6
10.7
MHz
fDCO(6,31)
DCO frequency (6, 31) (1)
DCORSELx = 6, DCOx = 31, MODx = 0
39.0
88.0
MHz
(1)
fDCO(7,0)
DCO frequency (7, 0)
DCORSELx = 7, DCOx = 0, MODx = 0
8.5
19.6
MHz
fDCO(7,31)
DCO frequency (7, 31) (1)
DCORSELx = 7, DCOx = 31, MODx = 0
60
135
MHz
SDCORSEL
Frequency step between range
DCORSEL and DCORSEL + 1
SRSEL = fDCO(DCORSEL+1,DCO)/fDCO(DCORSEL,DCO)
1.2
2.3
ratio
SDCO
Frequency step between tap
DCO and DCO + 1
SDCO = fDCO(DCORSEL,DCO+1)/fDCO(DCORSEL,DCO)
1.02
1.12
ratio
Duty cycle
Measured at SMCLK
40%
DCO frequency temperature
drift (2)
dfDCO/dT
dfDCO/dVCC
(1)
(2)
(3)
DCO frequency voltage drift
(3)
50%
60%
fDCO = 1 MHz,
0.1
%/°C
fDCO = 1 MHz
1.9
%/V
When selecting the proper DCO frequency range (DCORSELx), the target DCO frequency, fDCO, should be set to reside within the
range of fDCO(n, 0),MAX ≤ fDCO ≤ fDCO(n, 31),MIN, where fDCO(n, 0),MAX represents the maximum frequency specified for the DCO frequency,
range n, tap 0 (DCOx = 0) and fDCO(n,31),MIN represents the minimum frequency specified for the DCO frequency, range n, tap 31
(DCOx = 31). This ensures that the target DCO frequency resides within the range selected. It should also be noted that if the actual
fDCO frequency for the selected range causes the FLL or the application to select tap 0 or 31, the DCO fault flag is set to report that the
selected range is at its minimum or maximum tap setting.
Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C) / (85°C – (–40°C))
Calculated using the box method: (MAX(1.8 V to 3.6 V) – MIN(1.8 V to 3.6 V)) / MIN(1.8 V to 3.6 V) / (3.6 V – 1.8 V)
Typical DCO Frequency, VCC = 3.0 V, TA = 25°C
100
fDCO – MHz
10
DCOx = 31
1
0.1
DCOx = 0
0
1
2
3
4
5
6
7
DCORSEL
Figure 5-10. Typical DCO frequency
Specifications
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5.20 PMM, Brown-Out Reset (BOR)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V(DVCC_BOR_IT–)
BORH on voltage,
DVCC falling level
| dDVCC/dt | < 3 V/s
V(DVCC_BOR_IT+)
BORH off voltage,
DVCC rising level
| dDVCC/dt | < 3 V/s
V(DVCC_BOR_hys)
BORH hysteresis
tRESET
Pulse duration required at
RST/NMI pin to accept a
reset
MIN
0.80
TYP
1.30
60
MAX
UNIT
1.45
V
1.50
V
250
mV
2
µs
5.21 PMM, Core Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VCORE3(AM)
Core voltage, active mode,
PMMCOREV = 3
2.4 V ≤ DVCC ≤ 3.6 V
1.90
V
VCORE2(AM)
Core voltage, active mode,
PMMCOREV = 2
2.2 V ≤ DVCC ≤ 3.6 V
1.80
V
VCORE1(AM)
Core voltage, active mode,
PMMCOREV = 1
2.0 V ≤ DVCC ≤ 3.6 V
1.60
V
VCORE0(AM)
Core voltage, active mode,
PMMCOREV = 0
1.8 V ≤ DVCC ≤ 3.6 V
1.40
V
VCORE3(LPM)
Core voltage, low-current mode,
PMMCOREV = 3
2.4 V ≤ DVCC ≤ 3.6 V
1.94
V
VCORE2(LPM)
Core voltage, low-current mode,
PMMCOREV = 2
2.2 V ≤ DVCC ≤ 3.6 V
1.84
V
VCORE1(LPM)
Core voltage, low-current mode,
PMMCOREV = 1
2.0 V ≤ DVCC ≤ 3.6 V
1.64
V
VCORE0(LPM)
Core voltage, low-current mode,
PMMCOREV = 0
1.8 V ≤ DVCC ≤ 3.6 V
1.44
V
30
Specifications
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5.22 PMM, SVS High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SVSHE = 0, DVCC = 3.6 V
I(SVSH)
SVS current consumption
V(SVSH_IT+)
tpd(SVSH)
t(SVSH)
dVDVCC/dt
(1)
SVSH on voltage level (1)
SVSH off voltage level (1)
SVSH propagation delay
SVSH on or off delay time
MAX
0
SVSHE = 1, DVCC = 3.6 V, SVSHFP = 0
1.5
µA
SVSHE = 1, SVSHRVL = 0
1.57
1.68
1.78
SVSHE = 1, SVSHRVL = 1
1.79
1.88
1.98
SVSHE = 1, SVSHRVL = 2
1.98
2.08
2.21
SVSHE = 1, SVSHRVL = 3
2.10
2.18
2.31
SVSHE = 1, SVSMHRRL = 0
1.62
1.74
1.85
SVSHE = 1, SVSMHRRL = 1
1.88
1.94
2.07
SVSHE = 1, SVSMHRRL = 2
2.07
2.14
2.28
SVSHE = 1, SVSMHRRL = 3
2.20
2.30
2.42
SVSHE = 1, SVSMHRRL = 4
2.32
2.40
2.55
SVSHE = 1, SVSMHRRL = 5
2.52
2.70
2.88
SVSHE = 1, SVSMHRRL = 6
2.90
3.10
3.23
SVSHE = 1, SVSMHRRL = 7
2.90
3.10
3.23
SVSHE = 1, dVDVCC/dt = 10 mV/µs,
SVSHFP = 1
2.5
SVSHE = 1, dVDVCC/dt = 1 mV/µs,
SVSHFP = 0
20
V
V
µs
SVSHE = 0 → 1
SVSHFP = 1
12.5
SVSHE = 0 → 1
SVSHFP = 0
100
DVCC rise time
UNIT
nA
200
SVSHE = 1, DVCC = 3.6 V, SVSHFP = 1
V(SVSH_IT–)
TYP
µs
0
1000
V/s
The SVSH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208) on recommended settings and use.
Specifications
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5.23 PMM, SVM High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SVMHE = 0, DVCC = 3.6 V
I(SVMH)
SVMH current consumption
SVMH on or off voltage level
1.5
tpd(SVMH)
t(SVMH)
(1)
SVMH propagation delay
SVMH on or off delay time
µA
SVMHE = 1, SVSMHRRL = 0
1.62
1.74
1.85
SVMHE = 1, SVSMHRRL = 1
1.88
1.94
2.07
SVMHE = 1, SVSMHRRL = 2
2.07
2.14
2.28
SVMHE = 1, SVSMHRRL = 3
2.20
2.30
2.42
SVMHE = 1, SVSMHRRL = 4
2.32
2.40
2.55
SVMHE = 1, SVSMHRRL = 5
2.52
2.70
2.88
SVMHE = 1, SVSMHRRL = 6
2.90
3.10
3.23
SVMHE = 1, SVSMHRRL = 7
2.90
3.10
3.23
SVMHE = 1, SVMHOVPE = 1
UNIT
nA
200
SVMHE = 1, DVCC = 3.6 V, SVMHFP = 1
V(SVMH)
MAX
0
SVMHE = 1, DVCC = 3.6 V, SVMHFP = 0
(1)
TYP
V
3.75
SVMHE = 1, dVDVCC/dt = 10 mV/µs,
SVMHFP = 1
2.5
SVMHE = 1, dVDVCC/dt = 1 mV/µs,
SVMHFP = 0
20
µs
SVMHE = 0 → 1, SVMHFP = 1
12.5
SVMHE = 0 → 1, SVMHFP = 0
100
µs
The SVMH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208) on recommended settings and use.
5.24 PMM, SVS Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SVSLE = 0, PMMCOREV = 2
I(SVSL)
SVSL current consumption
tpd(SVSL)
t(SVSL)
32
SVSL propagation delay
SVSL on or off delay time
Specifications
TYP
MAX
0
SVSLE = 1, PMMCOREV = 2, SVSLFP = 0
200
SVSLE = 1, PMMCOREV = 2, SVSLFP = 1
2.0
SVSLE = 1, dVCORE/dt = 10 mV/µs,
SVSLFP = 1
2.5
SVSLE = 1, dVCORE/dt = 1 mV/µs,
SVSLFP = 0
20
UNIT
nA
µA
µs
SVSLE = 0 → 1, SVSLFP = 1
12.5
SVSLE = 0 → 1, SVSLFP = 0
100
µs
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5.25 PMM, SVM Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
SVMLE = 0, PMMCOREV = 2
I(SVML)
SVML current consumption
tpd(SVML)
SVML propagation delay
t(SVML)
SVML on or off delay time
MAX
UNIT
0
SVMLE = 1, PMMCOREV = 2, SVMLFP = 0
200
SVMLE = 1, PMMCOREV = 2, SVMLFP = 1
1.5
SVMLE = 1, dVCORE/dt = 10 mV/µs, SVMLFP = 1
2.5
SVMLE = 1, dVCORE/dt = 1 mV/µs, SVMLFP = 0
20
SVMLE = 0 → 1, SVMLFP = 1
12.5
SVMLE = 0 → 1, SVMLFP = 0
100
nA
µA
µs
µs
5.26 Wake-up Times From Low-Power Modes and Reset
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
tWAKE-UPFAST
tWAKE-UPSLOW
tWAKE-UPLPM5
tWAKE-UPRESET
(1)
(2)
(3)
TEST CONDITIONS
MIN
TYP MAX UNIT
fMCLK ≥ 4.0 MHz
5
fMCLK < 4.0 MHz
6
Wake-up time from LPM2, LPM3, or
LPM4 to active mode (1)
PMMCOREV = SVSMLRRL = n
(where n = 0, 1, 2, or 3),
SVSLFP = 1
Wake-up time from LPM2, LPM3 or
LPM4 to active mode (2)
PMMCOREV = SVSMLRRL = n
(where n = 0, 1, 2, or 3), SVSLFP = 0
µs
150
165
µs
Wake-up time from LPM4.5 to active
mode (3)
2
3
ms
Wake-up time from RST or BOR event to
active mode (3)
2
3
ms
This value represents the time from the wake-up event to the first active edge of MCLK. The wake-up time depends on the performance
mode of the low-side supervisor (SVSL) and low-side monitor (SVML). Fastest wake-up times are possible with SVSLand SVML in full
performance mode or disabled when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while
operating in LPM2, LPM3, and LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx
and MSP430x6xx Family User's Guide (SLAU208).
This value represents the time from the wake-up event to the first active edge of MCLK. The wake-up time depends on the performance
mode of the low-side supervisor (SVSL) and low-side monitor (SVML). In this case, the SVSLand SVML are in normal mode (low current)
mode when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while operating in LPM2, LPM3, and
LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the MSP430x5xx and MSP430x6xx Family User's
Guide (SLAU208).
This value represents the time from the wake-up event to the reset vector execution.
5.27 Timer_A
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
fTA
Timer_A input clock frequency
Internal: SMCLK, ACLK
External: TACLK
Duty cycle = 50% ± 10%
1.8 V, 3 V
tTA,cap
Timer_A capture timing
All capture inputs,
Minimum pulse duration required for
capture.
1.8 V, 3 V
MIN
MAX
UNIT
25
MHz
20
ns
5.28 Timer_B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
fTB
Timer_B input clock frequency
Internal: SMCLK, ACLK
External: TBCLK
Duty cycle = 50% ± 10%
1.8 V, 3 V
tTB,cap
Timer_B capture timing
All capture inputs, Minimum pulse
duration required for capture
1.8 V, 3 V
MIN
MAX
UNIT
25
MHz
20
Specifications
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5.29 USCI (UART Mode) Recommended Operating Conditions
PARAMETER
fUSCI
USCI input clock frequency
fBITCLK
BITCLK clock frequency
(equals baud rate in MBaud)
CONDITIONS
VCC
MIN
Internal: SMCLK, ACLK
External: UCLK
Duty cycle = 50% ± 10%
MAX
UNIT
fSYSTEM
MHz
1
MHz
UNIT
5.30 USCI (UART Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
UART receive deglitch time (1)
tτ
(1)
TEST CONDITIONS
VCC
MIN
MAX
2.2 V
50
600
3V
50
600
ns
Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To ensure that pulses are
correctly recognized, their duration should exceed the maximum specification of the deglitch time.
5.31 USCI (SPI Master Mode) Recommended Operating Conditions
PARAMETER
fUSCI
USCI input clock frequency
CONDITIONS
VCC
MIN
Internal: SMCLK, ACLK
Duty cycle = 50% ± 10%
MAX
UNIT
fSYSTEM
MHz
MAX
UNIT
fSYSTEM
MHz
5.32 USCI (SPI Master Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(see Note (1), Figure 5-11 and Figure 5-12)
PARAMETER
fUSCI
USCI input clock frequency
TEST CONDITIONS
PMMCOREV = 0
tSU,MI
SOMI input data setup time
PMMCOREV = 3
PMMCOREV = 0
tHD,MI
SOMI input data hold time
PMMCOREV = 3
tVALID,MO
SIMO output data valid time (2)
(2)
(3)
34
1.8 V
55
3V
38
2.4 V
30
3V
25
1.8 V
0
3V
0
2.4 V
0
3V
0
TYP
ns
ns
UCLK edge to SIMO valid,
CL = 20 pF, PMMCOREV = 0
20
3V
18
UCLK edge to SIMO valid,
CL = 20 pF, PMMCOREV = 3
2.4 V
16
3V
15
SIMO output data hold time (3)
CL = 20 pF, PMMCOREV = 3
(1)
MIN
1.8 V
CL = 20 pF, PMMCOREV = 0
tHD,MO
VCC
SMCLK, ACLK
Duty cycle = 50% ± 10%
1.8 V
ns
–10
3V
–8
2.4 V
–10
3V
–8
ns
fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(USCI) + tSU,SI(Slave), tSU,MI(USCI) + tVALID,SO(Slave)).
For the slave parameters tSU,SI(Slave) and tVALID,SO(Slave), see the SPI parameters of the attached slave.
Specifies the time to drive the next valid data to the SIMO output after the output changing UCLK clock edge. See the timing diagrams
in Figure 5-11 and Figure 5-12.
Specifies how long data on the SIMO output is valid after the output changing UCLK clock edge. Negative values indicate that the data
on the SIMO output can become invalid before the output changing clock edge observed on UCLK. See the timing diagrams in Figure 511 and Figure 5-12.
Specifications
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SLAS645J – JULY 2009 – REVISED APRIL 2015
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tSU,MI
tHD,MI
SOMI
tHD,MO
tVALID,MO
SIMO
Figure 5-11. SPI Master Mode, CKPH = 0
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tSU,MI
tHD,MI
SOMI
tHD,MO
tVALID,MO
SIMO
Figure 5-12. SPI Master Mode, CKPH = 1
Specifications
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5.33 USCI (SPI Slave Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(see Note (1), Figure 5-13 and Figure 5-14)
PARAMETER
TEST CONDITIONS
PMMCOREV = 0
tSTE,LEAD
STE lead time, STE low to clock
PMMCOREV = 3
PMMCOREV = 0
tSTE,LAG
STE lag time, Last clock to STE high
PMMCOREV = 3
PMMCOREV = 0
tSTE,ACC
STE access time, STE low to SOMI data out
PMMCOREV = 3
PMMCOREV = 0
STE disable time, STE high to SOMI high
impedance
tSTE,DIS
PMMCOREV = 3
PMMCOREV = 0
tSU,SI
SIMO input data setup time
PMMCOREV = 3
PMMCOREV = 0
tHD,SI
SIMO input data hold time
PMMCOREV = 3
tVALID,SO
tHD,SO
(1)
(2)
(3)
36
SOMI output data valid time (2)
SOMI output data hold time (3)
VCC
MIN
1.8 V
11
3V
8
2.4 V
7
3V
6
1.8 V
3
3V
3
2.4 V
3
3V
3
TYP
MAX
ns
ns
1.8 V
66
3V
50
2.4 V
36
3V
30
1.8 V
30
3V
23
2.4 V
16
3V
UNIT
ns
ns
13
1.8 V
5
3V
5
2.4 V
2
3V
2
1.8 V
5
3V
5
2.4 V
5
3V
5
ns
ns
UCLK edge to SOMI valid,
CL = 20 pF,
PMMCOREV = 0
1.8 V
76
3V
60
UCLK edge to SOMI valid,
CL = 20 pF,
PMMCOREV = 3
2.4 V
44
3V
40
CL = 20 pF,
PMMCOREV = 0
1.8 V
18
3V
12
CL = 20 pF,
PMMCOREV = 3
2.4 V
10
3V
8
ns
ns
fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(Master) + tSU,SI(USCI), tSU,MI(Master) + tVALID,SO(USCI)).
For the master parameters tSU,MI(Master) and tVALID,MO(Master), see the SPI parameters of the attached slave.
Specifies the time to drive the next valid data to the SOMI output after the output changing UCLK clock edge. See the timing diagrams
in Figure 5-11 and Figure 5-12.
Specifies how long data on the SOMI output is valid after the output changing UCLK clock edge. See the timing diagrams in Figure 5-11
and Figure 5-12.
Specifications
Copyright © 2009–2015, Texas Instruments Incorporated
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SLAS645J – JULY 2009 – REVISED APRIL 2015
tSTE,LEAD
tSTE,LAG
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tSU,SI
tLO/HI
tHD,SI
SIMO
tHD,SO
tVALID,SO
tSTE,ACC
tSTE,DIS
SOMI
Figure 5-13. SPI Slave Mode, CKPH = 0
tSTE,LAG
tSTE,LEAD
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tHD,SI
tSU,SI
SIMO
tSTE,ACC
tHD,MO
tVALID,SO
tSTE,DIS
SOMI
Figure 5-14. SPI Slave Mode, CKPH = 1
Specifications
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Copyright © 2009–2015, Texas Instruments Incorporated
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5.34 USCI (I2C Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5-15)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
Internal: SMCLK, ACLK
External: UCLK
Duty cycle = 50% ± 10%
MAX
UNIT
fSYSTEM
MHz
400
kHz
fUSCI
USCI input clock frequency
fSCL
SCL clock frequency
tHD,STA
Hold time (repeated) START
tSU,STA
Setup time for a repeated START
tHD,DAT
Data hold time
2.2 V, 3 V
0
ns
tSU,DAT
Data setup time
2.2 V, 3 V
250
ns
2.2 V, 3 V
fSCL ≤ 100 kHz
fSCL > 100 kHz
fSCL ≤ 100 kHz
fSCL > 100 kHz
fSCL ≤ 100 kHz
tSU,STO
Setup time for STOP
tSP
Pulse duration of spikes suppressed by input filter
fSCL > 100 kHz
tSU,STA
tHD,STA
2.2 V, 3 V
2.2 V, 3 V
2.2 V, 3 V
0
4.0
µs
0.6
4.7
µs
0.6
4.0
µs
0.6
2.2 V
50
600
3V
50
600
tHD,STA
ns
tBUF
SDA
tLOW
tHIGH
tSP
SCL
tSU,DAT
tSU,STO
tHD,DAT
Figure 5-15. I2C Mode Timing
38
Specifications
Copyright © 2009–2015, Texas Instruments Incorporated
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SLAS645J – JULY 2009 – REVISED APRIL 2015
5.35 10-Bit ADC, Power Supply and Input Range Conditions
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
VCC
AVCC
Analog supply voltage
AVCC and DVCC are connected together,
AVSS and DVSS are connected together,
V(AVSS) = V(DVSS) = 0 V
V(Ax)
Analog input voltage range (2)
All ADC10_A pins: P1.0 to P1.5 and P3.6 and P3.7
terminals
Operating supply current into
AVCC terminal, REF module
and reference buffer off
fADC10CLK = 5 MHz, ADC10ON = 1, REFON = 0,
SHT0 = 0, SHT1 = 0, ADC10DIV = 0, ADC10SREF
= 00
Operating supply current into
AVCC terminal, REF module
on, reference buffer on
MIN
TYP
MAX
1.8
3.6
V
0
AVCC
V
2.2 V
60
100
3V
75
110
fADC10CLK = 5 MHz, ADC10ON = 1, REFON = 1,
SHT0 = 0, SHT1 = 0, ADC10DIV = 0, ADC10SREF
= 01
3V
113
150
Operating supply current into
AVCC terminal, REF module
off, reference buffer on
fADC10CLK = 5 MHz, ADC10ON = 1, REFON = 0,
SHT0 = 0, SHT1 = 0, ADC10DIV = 0, ADC10SREF
= 10, VEREF = 2.5 V
3V
105
140
Operating supply current into
AVCC terminal, REF module
off, reference buffer off
fADC10CLK = 5 MHz, ADC10ON = 1, REFON = 0,
SHT0 = 0, SHT1 = 0, ADC10DIV = 0, ADC10SREF
= 11, VEREF = 2.5 V
3V
70
110
CI
Input capacitance
Only one terminal Ax can be selected at one time
from the pad to the ADC10_A capacitor array
including wiring and pad.
2.2 V
3.5
RI
Input MUX ON resistance
IADC10_A
(1)
(2)
UNIT
µA
pF
AVCC > 2.0V, 0 V ≤ VAx ≤ AVCC
36
1.8V < AVCC < 2.0V, 0 V ≤ VAx ≤ AVCC
96
kΩ
The leakage current is defined in the leakage current table with P6.x/Ax parameter.
The analog input voltage range must be within the selected reference voltage range VR+ to VR– for valid conversion results. The external
reference voltage requires decoupling capacitors. Two decoupling capacitors, 10 µF and 100 nF, should be connected to VeREF to
decouple the dynamic current required for an external reference source if it is used for the ADC10_A. Also see the MSP430x5xx and
MSP430x6xx Family User's Guide (SLAU208).
5.36 10-Bit ADC, Timing Parameters
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VCC
MIN
TYP
MAX
UNIT
For specified performance of ADC10_A linearity
parameters
2.2 V, 3 V
0.45
5
5.5
MHz
Internal ADC10_A
oscillator (1)
ADC10DIV = 0, fADC10CLK = fADC10OSC
2.2 V, 3 V
4.2
4.8
5.4
MHz
2.2 V, 3 V
2.4
Conversion time
REFON = 0, Internal oscillator, 12 ADC10CLK
cycles, 10-bit mode
fADC10OSC = 4 MHz to 5 MHz
fADC10CLK
fADC10OSC
tCONVERT
TEST CONDITIONS
µs
External fADC10CLK from ACLK, MCLK or SMCLK,
ADC10SSEL ≠ 0
tADC10ON
Turn on settling time of
the ADC
tSample
Sampling time
(1)
(2)
(3)
(4)
See
3.0
(2)
(3)
100
RS = 1000 Ω, RI = 96 kΩ, CI = 3.5 pF (4)
1.8 V
3
RS = 1000 Ω, RI = 36 kΩ, CI = 3.5 pF (4)
3V
1
ns
µs
The ADC10OSC is sourced directly from MODOSC inside the UCS.
12 × ADC10DIV × 1/fADC10CLK
The condition is that the error in a conversion started after tADC10ON is less than ±0.5 LSB. The reference and input signal are already
settled.
Approximately eight Tau (τ) are required for an error of less than ±0.5 LSB
Specifications
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5.37 10-Bit ADC, Linearity Parameters
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
1.4 V ≤ (VeREF+ – VeREF–) ≤ 1.6 V, CVeREF+ = 20 pF
VCC
MIN
TYP
MAX
±1.0
UNIT
EI
Integral
linearity error
ED
Differential
linearity error
1.4 V ≤ (VeREF+ – VeREF–), CVeREF+ = 20 pF
2.2 V, 3 V
±1.0
LSB
EO
Offset error
1.4 V ≤ (VeREF+ – VeREF–), CVeREF+ = 20 pF,
Internal impedance of source RS < 100 Ω
2.2 V, 3 V
±1.0
LSB
EG
Gain error
1.4 V ≤ (VeREF+ – VeREF–), CVeREF+ = 20 pF,
ADC10SREFx = 11b
2.2 V, 3 V
±1.0
LSB
ET
Total unadjusted
error
1.4 V ≤ (VeREF+ – VeREF–), CVeREF+ = 20 pF,
ADC10SREFx = 11b
2.2 V, 3 V
±2.0
LSB
MAX
UNIT
1.6 V < (VeREF+ – VeREF–) ≤ VAVCC, CVeREF+ = 20 pF
2.2 V, 3 V
±1.0
±1.0
LSB
5.38 REF, External Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
VeREF+
Positive external reference
VeREF+ > VeREF–
voltage input
(2)
1.4
AVCC
V
VeREF–
Negative external
reference voltage input
VeREF+ > VeREF–
(3)
0
1.2
V
(VeREF+ –
VeREF–)
Differential external
reference voltage input
VeREF+ > VeREF–
(4)
1.4
AVCC
V
IVeREF+
IVeREF–
Static input current
CVeREF+/(1)
(2)
(3)
(4)
(5)
40
Capacitance at VeREF+
or VeREF- terminal
1.4 V ≤ VeREF+ ≤ VAVCC , VeREF– = 0 V,
fADC10CLK = 5 MHz, ADC10SHTx = 0x0001,
Conversion rate 200 ksps
2.2 V, 3 V
1.4 V ≤ VeREF+ ≤ VAVCC , VeREF– = 0 V,
fADC10CLK = 5 MHZ, ADC10SHTX = 0x1000,
Conversion rate 20 ksps
2.2 V, 3 V
(5)
±8.5
±26
µA
±1
10
µF
The external reference is used during ADC conversion to charge and discharge the capacitance array. The input capacitance, CI, is also
the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the
recommendations on analog-source impedance to allow the charge to settle for 10-bit accuracy.
The accuracy limits the minimum positive external reference voltage. Lower reference voltage levels may be applied with reduced
accuracy requirements.
The accuracy limits the maximum negative external reference voltage. Higher reference voltage levels may be applied with reduced
accuracy requirements.
The accuracy limits minimum external differential reference voltage. Lower differential reference voltage levels may be applied with
reduced accuracy requirements.
Two decoupling capacitors, 10 µF and 100 nF, should be connected to VeREF to decouple the dynamic current required for an external
reference source if it is used for the ADC10_A. Also see the MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208).
Specifications
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MSP430F5510, MSP430F5509, MSP430F5508
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5.39 REF, Built-In Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
Positive built-in reference
voltage
VREF+
AVCC minimum voltage,
Positive built-in reference
active
AVCC(min)
Operating supply current
into AVCC terminal (2)
IREF+
TEST CONDITIONS
VCC
MIN
TYP
MAX
REFVSEL = {2} for 2.5 V, REFON = 1
3V
2.51
±1.5%
REFVSEL = {1} for 2.0 V, REFON = 1
3V
1.99
±1.5%
REFVSEL = {0} for 1.5 V, REFON = 1
2.2 V, 3 V
UNIT
V
1.5 ±1.5%
REFVSEL = {0} for 1.5 V
1.8
REFVSEL = {1} for 2.0 V
2.2
REFVSEL = {2} for 2.5 V
2.7
V
fADC10CLK = 5.0 MHz,
REFON = 1, REFBURST = 0,
REFVSEL = {2} for 2.5 V
3V
18
24
fADC10CLK = 5.0 MHz,
REFON = 1, REFBURST = 0,
REFVSEL = {1} for 2.0 V
3V
15.5
21
fADC10CLK = 5.0 MHz,
REFON = 1, REFBURST = 0,
REFVSEL = {0} for 1.5 V
3V
13.5
21
30
50
2.2 V
20
22
3V
20
22
2.2 V
770
3V
770
µA
TCREF+
Temperature coefficient of
built-in reference (3)
IVREF+ = 0 A,
REFVSEL = {0, 1, 2}, REFON = 1
ISENSOR
Operating supply current
into AVCC terminal (4)
REFON = 0, INCH = 0Ah,
ADC10ON = N/A, TA = 30°C
VSENSOR
See
VMID
AVCC divider at channel 11
ADC10ON = 1, INCH = 0Bh,
VMID is approximately 0.5 × VAVCC
tSENSOR(sample)
Sample time required if
channel 10 is selected (6)
ADC10ON = 1, INCH = 0Ah,
Error of conversion result ≤ 1 LSB
30
µs
tVMID(sample)
Sample time required if
channel 11 is selected (7)
ADC10ON = 1, INCH = 0Bh,
Error of conversion result ≤ 1 LSB
1
µs
PSRR_DC
Power supply rejection ratio
(dc)
AVCC = AVCC (min) – AVCC(max),
TA = 25°C,
REFVSEL = {0, 1, 2}, REFON = 1
120
µV/V
PSRR_AC
Power supply rejection ratio
(ac)
AVCC = AVCC (min) – AVCC(max),
TA = 25°C, f = 1 kHz, ΔVpp = 100 mV,
REFVSEL = {0, 1, 2}, REFON = 1
6.4
mV/V
tSETTLE
Settling time of reference
voltage (8)
AVCC = AVCC (min) – AVCC(max),
REFVSEL = {0, 1, 2}, REFON = 0 → 1
75
µs
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(5)
ADC10ON = 1, INCH = 0Ah, TA = 30°C
ppm/
°C
µA
mV
2.2 V
1.06
1.1
1.14
3V
1.46
1.5
1.54
V
The leakage current is defined in the leakage current table with P6.x/Ax parameter.
The internal reference current is supplied from terminal AVCC. Consumption is independent of the ADC10ON control bit, unless a
conversion is active. The REFON bit enables to settle the built-in reference before starting an A/D conversion.
Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C)/(85°C – (–40°C)).
The sensor current ISENSOR is consumed if (ADC10ON = 1 and REFON = 1) or (ADC10ON = 1 and INCH = 0Ah and sample signal is
high). When REFON = 1, ISENSOR is already included in IREF+.
The temperature sensor offset can be as much as ±20°C. TI recommends a single-point calibration to minimize the offset error of the
built-in temperature sensor.
The typical equivalent impedance of the sensor is 51 kΩ. The sample time required includes the sensor on-time tSENSOR(on).
The on-time tVMID(on) is included in the sampling time tVMID(sample); no additional on time is needed.
The condition is that the error in a conversion started after tREFON is less than ±0.5 LSB.
Specifications
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5.40 Comparator B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VCC
TEST CONDITIONS
VCC
Supply voltage
MIN
TYP
1.8
3.6
1.8 V
IAVCC_COMP
IAVCC_REF
CBPWRMD = 00, CBON = 1, CBRSx = 00
Comparator operating
supply current into AVCC,
Excludes reference
CBPWRMD = 01, CBON = 1, CBRSx = 00
resistor ladder
Quiescent current of
resistor ladder into AVCC,
Includes REF module
current
VIC
Common mode input
range
VOFFSET
Input offset voltage
CIN
Input capacitance
RSIN
Series input resistance
Propagation delay,
response time
tPD
Propagation delay with
filter active
tPD,filter
tEN_CMP
Comparator enable time
30
50
3V
40
65
2.2 V,
3V
10
17
CBPWRMD = 10, CBON = 1, CBRSx = 00
2.2 V,
3V
0.1
0.5
CBREFACC = 1, CBREFLx = 01,
CBRSx = 10, REFON = 0, CBON = 0
2.2 V,
3V
10
17
CBREFACC = 0, CBREFLx = 01,
CBRSx = 10, REFON = 0, CBON = 0
2.2 V,
3V
VCC - 1
±20
CBPWRMD = 01, 10
±10
5
ON - switch closed
3
50
CBPWRMD = 01, CBF = 0
600
CBPWRMD = 10, CBF = 0
50
CBPWRMD = 00, CBON = 1, CBF = 1,
CBFDLY = 00
0.35
0.6
1.0
CBPWRMD = 00, CBON = 1, CBF = 1,
CBFDLY = 01
0.6
1.0
1.8
CBPWRMD = 00, CBON = 1, CBF = 1,
CBFDLY = 10
1.0
1.8
3.4
CBPWRMD = 00, CBON = 1, CBF = 1,
CBFDLY = 11
1.8
3.4
6.5
kΩ
1
2
ns
µs
µs
CBON = 0 to CBON = 1
CBPWRMD = 00, 01
µs
CBON = 0 to CBON = 1
CBPWRMD = 10
VIN = reference into resistor ladder,
n = 0 to 31
mV
MΩ
450
Reference voltage for a
given tap
V
pF
4
CBPWRMD = 00, CBF = 0
VCB_REF
Specifications
µA
22
CBPWRMD = 00
Resistor reference enable
CBON = 0 to CBON = 1
time
V
µA
0
OFF - switch opened
UNIT
40
2.2 V
tEN_REF
42
MAX
1.5
VIN ×
(n+0.5)
/32
1
1.5
µs
VIN ×
(n+1)
/32
VIN ×
(n+1.5)
/32
V
Copyright © 2009–2015, Texas Instruments Incorporated
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SLAS645J – JULY 2009 – REVISED APRIL 2015
5.41 Ports PU.0 and PU.1
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
VUSB = 3.3 V ± 10%, IOH = –25 mA.
See Figure 5-17 for typical characteristics
VOL
Low-level output voltage
VUSB = 3.3 V ± 10%, IOL = 25 mA.
See Figure 5-16 for typical characteristics
VIH
High-level input voltage
VUSB = 3.3 V ± 10%
See Figure 5-18 for typical characteristics
VIL
Low-level input voltage
VUSB = 3.3 V ± 10%
See Figure 5-18 for typical characteristics
MIN
MAX
2.4
V
0.4
2.0
V
V
0.8
Specifications
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Copyright © 2009–2015, Texas Instruments Incorporated
UNIT
V
43
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
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TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
90
VCC = 3.0 V
TA = 25 ºC
IOL - Typical Low-Level Output Current - mA
80
VCC = 3.0 V
TA = 85 ºC
VCC = 1.8 V
TA = 25 ºC
70
60
50
VCC = 1.8 V
TA = 85 ºC
40
30
20
10
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
VOL - Low-Level Output Voltage - V
Figure 5-16. Ports PU.0, PU.1 Typical Low-Level Output Characteristics
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
0
IOH - Typical High-Level Output Current - mA
-10
-20
-30
VCC = 1.8 V
TA = 85 ºC
-40
-50
VCC = 3.0 V
TA = 85 ºC
-60
VCC = 1.8 V
TA = 25 ºC
-70
VCC = 3.0 V
TA = 25 ºC
-80
-90
0.5
1
1.5
2
2.5
3
VOH - High-Level Output Voltage - V
Figure 5-17. Ports PU.0, PU.1 Typical High-Level Output Characteristics
TYPICAL PU.0, PU.1 INPUT THRESHOLD
2.0
T A = 25 °C, 85 °C
1.8
VIT+ , postive-going input threshold
Input Threshold - V
1.6
1.4
1.2
VIT- , negative-going input threshold
1.0
0.8
0.6
0.4
0.2
0.0
1.8
2.2
2.6
3
3.4
VUSB Supply Voltage, V USB - V
Figure 5-18. Ports PU.0, PU.1 Typical Input Threshold Characteristics
44
Specifications
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
www.ti.com
SLAS645J – JULY 2009 – REVISED APRIL 2015
5.42 USB-Output Ports DP and DM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
VOH
D+, D- single ended
USB 2.0 load conditions
2.8
3.6
VOL
D+, D- single ended
USB 2.0 load conditions
0
0.3
V
V
Z(DRV)
D+, D- impedance
Including external series resistor of 27 Ω
28
44
Ω
tRISE
Rise time
Full speed, differential, CL = 50 pF,
10%/90%, Rpu on D+
4
20
ns
tFALL
Fall time
Full speed, differential, CL = 50 pF,
10%/90%, Rpu on D+
4
20
ns
UNIT
5.43 USB-Input Ports DP and DM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
MIN
MAX
VCM
Differential input common mode range
PARAMETER
0.8
2.5
ZIN
Input impedance
300
VCRS
Crossover voltage
1.3
VIL
Static SE input logic low level
VIH
Static SE input logic high level
VDI
Differential input voltage
V
kΩ
2.0
V
0.8
V
2.0
V
0.2
V
MAX
UNIT
3.75
V
5.5
V
±9%
V
5.44 USB-PWR (USB Power System)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
VLAUNCH
VBUS detection threshold
VBUS
USB bus voltage
VUSB
USB LDO output voltage
3.3
V18
Internal USB voltage (1)
1.8
IUSB_EXT
Maximum external current from VUSB
terminal (2)
Normal operation
3.76
USB LDO is on
(3)
12
mA
100
mA
250
µA
IDET
USB LDO current overload detection
ISUSPEND
Operating supply current into VBUS
terminal (4)
IUSB_LDO
USB LDO on,
Operating supply current into VBUS terminal, USB 1.8-V LDO disabled,
Represents the current of the 3.3-V LDO only VBUS = 5 V,
USBDETEN = 0 or 1
1.8 V, 3 V
60
µA
IVBUS_DETECT
USB LDO disabled,
Operating supply current into VBUS terminal,
USB 1.8-V LDO disabled,
Represents the current of the VBUS
VBUS > VLAUNCH,
detection logic
USBDETEN = 1
1.8 V, 3 V
30
µA
CBUS
VBUS terminal recommended capacitance
4.7
µF
CUSB
VUSB terminal recommended capacitance
220
nF
C18
V18 terminal recommended capacitance
220
nF
tENABLE
Settling time VUSB and V18
RPUR
Pullup resistance of PUR terminal (5)
(1)
(2)
(3)
(4)
(5)
60
V
USB LDO on,
USB PLL disabled
Within 2%, recommended
capacitances
70
110
2
ms
150
Ω
This voltage is for internal use only. No external DC loading should be applied.
This represents additional current that can be supplied to the application from the VUSB terminal beyond the needs of the USB
operation.
A current overload is detected when the total current supplied from the USB LDO, including IUSB_EXT, exceeds this value.
Does not include current contribution of Rpu and Rpd as outlined in the USB specification.
This value, in series with an external resistor between PUR and D+, produces the Rpu as outlined in the USB specification.
Specifications
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Copyright © 2009–2015, Texas Instruments Incorporated
45
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
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SLAS645J – JULY 2009 – REVISED APRIL 2015
www.ti.com
5.45 USB-PLL (USB Phase Locked Loop)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
IPLL
Operating supply current
fPLL
PLL frequency
fUPD
PLL reference frequency
tLOCK
PLL lock time
tJitter
PLL jitter
MIN
TYP MAX
7
48
UNIT
mA
MHz
1.5
3
MHz
2
ms
1000
ps
5.46 Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST
CONDITIONS
PARAMETER
DVCC(PGM/ERASE) Program and erase supply voltage
MIN
TYP
UNIT
3.6
V
200
ns
3
5
mA
Supply current from DVCC during erase
2
6.5
mA
Supply current from DVCC during mass erase or bank erase
2
6.5
mA
16
ms
tREADMARGIN
Read access time during margin mode
IPGM
Supply current from DVCC during program
IERASE
IMERASE, IBANK
tCPT
Cumulative program time
1.8
MAX
See
(1)
4
Program and erase endurance
10
5
10
cycles
tRetention
Data retention duration
TJ = 25°C
100
tWord
Word or byte program time
See
(2)
64
85
years
µs
0
Block program time for first byte or word
See
(2)
49
65
µs
tBlock,
1–(N–1)
Block program time for each additional byte or word, except for last
byte or word
See
(2)
37
49
µs
tBlock,
N
Block program time for last byte or word
See
(2)
55
73
µs
Erase time for segment, mass erase, and bank erase when
available.
See
(2)
23
32
ms
tBlock,
tErase
(1)
(2)
The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming
methods: individual word write, individual byte write, and block write modes.
These values are hardwired into the flash controller's state machine.
5.47 JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
MAX
UNIT
fSBW
Spy-Bi-Wire input frequency
PARAMETER
2.2 V, 3 V
0
20
MHz
tSBW,Low
Spy-Bi-Wire low clock pulse duration
2.2 V, 3 V
0.025
15
µs
1
µs
15
100
0
5
MHz
10
MHz
80
kΩ
tSBW, En
Spy-Bi-Wire enable time (TEST high to acceptance of first clock edge)
tSBW,Rst
Spy-Bi-Wire return to normal operation time
fTCK
TCK input frequency for 4-wire JTAG (2)
Rinternal
Internal pulldown resistance on TEST
(1)
(2)
46
VCC
(1)
MIN
TYP
2.2 V, 3 V
2.2 V
3V
0
2.2 V, 3 V
45
60
µs
Tools that access the Spy-Bi-Wire interface need to wait for the tSBW,En time after pulling the TEST/SBWTCK pin high before applying
the first SBWTCK clock edge.
fTCK may be restricted to meet the timing requirements of the module selected.
Specifications
Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
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SLAS645J – JULY 2009 – REVISED APRIL 2015
6 Detailed Description
6.1
CPU (Link to User's Guide)
The MSP430 CPU has a 16-bit RISC architecture that is highly transparent to the application. All
operations, other than program-flow instructions, are performed as register operations in conjunction with
seven addressing modes for source operand and four addressing modes for destination operand.
The CPU is integrated with 16 registers that provide reduced instruction execution time. The register-toregister operation execution time is one cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as program counter, stack pointer, status register, and
constant generator, respectively. The remaining registers are general-purpose registers.
Peripherals are connected to the CPU using data, address, and control buses and can be handled with all
instructions.
The instruction set consists of the original 51 instructions with three formats and seven address modes
and additional instructions for the expanded address range. Each instruction can operate on word and
byte data.
Program Counter
PC/R0
Stack Pointer
SP/R1
Status Register
Constant Generator
SR/CG1/R2
CG2/R3
General-Purpose Register
R4
General-Purpose Register
R5
General-Purpose Register
R6
General-Purpose Register
R7
General-Purpose Register
R8
General-Purpose Register
R9
General-Purpose Register
R10
General-Purpose Register
R11
General-Purpose Register
R12
General-Purpose Register
R13
General-Purpose Register
R14
General-Purpose Register
R15
Detailed Description
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Copyright © 2009–2015, Texas Instruments Incorporated
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MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
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SLAS645J – JULY 2009 – REVISED APRIL 2015
6.2
www.ti.com
Operating Modes
The MSP430 devices have one active mode and six software selectable low-power modes of operation.
An interrupt event can wake up the device from any of the low-power modes, service the request, and
restore back to the low-power mode on return from the interrupt program.
The following seven operating modes can be configured by software:
• Active mode (AM)
– All clocks are active
• Low-power mode 0 (LPM0)
– CPU is disabled
– ACLK and SMCLK remain active
– MCLK is disabled
– FLL loop control remains active
• Low-power mode 1 (LPM1)
– CPU is disabled
– FLL loop control is disabled
– ACLK and SMCLK remain active
– MCLK is disabled
• Low-power mode 2 (LPM2)
– CPU is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DCO dc generator remains enabled
– ACLK remains active
• Low-power mode 3 (LPM3)
– CPU is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DCO's dc generator is disabled
– ACLK remains active
• Low-power mode 4 (LPM4)
– CPU is disabled
– ACLK is disabled
– MCLK, FLL loop control, and DCOCLK are disabled
– DCO dc generator is disabled
– Crystal oscillator is stopped
– Complete data retention
• Low-power mode 4.5 (LPM4.5)
– Internal regulator disabled
– No data retention
– Wake-up signal from RST/NMI, P1, and P2.
48
Detailed Description
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MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
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6.3
SLAS645J – JULY 2009 – REVISED APRIL 2015
Interrupt Vector Addresses
The interrupt vectors and the power-up start address are located in the address range 0FFFFh to 0FF80h.
The vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence.
Table 6-1. Interrupt Sources, Flags, and Vectors
INTERRUPT SOURCE
System Reset
Power-Up
External Reset
Watchdog Time-out, Password
Violation
Flash Memory Password Violation
INTERRUPT FLAG
WDTIFG, KEYV (SYSRSTIV) (1)
(2)
SYSTEM
INTERRUPT
WORD
ADDRESS
PRIORITY
Reset
0FFFEh
63, highest
System NMI
PMM
Vacant Memory Access
JTAG Mailbox
SVMLIFG, SVMHIFG, DLYLIFG, DLYHIFG,
VLRLIFG, VLRHIFG, VMAIFG, JMBNIFG,
JMBOUTIFG (SYSSNIV) (1)
(Non)maskable
0FFFCh
62
User NMI
NMI
Oscillator Fault
Flash Memory Access Violation
NMIIFG, OFIFG, ACCVIFG, BUSIFG
(SYSUNIV) (1) (2)
(Non)maskable
0FFFAh
61
Maskable
0FFF8h
60
Maskable
0FFF6h
59
Comp_B
Comparator B interrupt flags (CBIV) (1)
TB0
TB0CCR0 CCIFG0
(3)
(3)
TB0
TB0CCR1 CCIFG1 to TB0CCR6 CCIFG6,
TB0IFG (TB0IV) (1) (3)
Maskable
0FFF4h
58
Watchdog Timer_A Interval Timer
Mode
WDTIFG
Maskable
0FFF2h
57
USCI_A0 Receive or Transmit
UCA0RXIFG, UCA0TXIFG (UCA0IV) (1)
USCI_B0 Receive or Transmit
UCB0RXIFG, UCB0TXIFG (UCB0IV)
ADC10_A
ADC10IFG0 (1)
TA0
TA0
USB_UBM
DMA
0FFF0h
56
Maskable
0FFEEh
55
Maskable
0FFECh
54
Maskable
0FFEAh
53
Maskable
0FFE8h
52
Maskable
0FFE6h
51
(3) (4)
TA0CCR0 CCIFG0
(3)
USB interrupts (USBIV) (1)
(3)
DMA0IFG, DMA1IFG, DMA2IFG (DMAIV)
(1) (3)
Maskable
0FFE4h
50
TA1
TA1CCR0 CCIFG0 (3)
Maskable
0FFE2h
49
TA1
TA1CCR1 CCIFG1 to TA1CCR2 CCIFG2,
TA1IFG (TA1IV) (1) (3)
Maskable
0FFE0h
48
I/O Port P1
P1IFG.0 to P1IFG.7 (P1IV) (1)
Maskable
0FFDEh
47
USCI_A1 Receive or Transmit
UCA1RXIFG, UCA1TXIFG (UCA1IV) (1)
(3)
Maskable
0FFDCh
46
USCI_B1 Receive or Transmit
UCB1RXIFG, UCB1TXIFG (UCB1IV) (1)
(3)
Maskable
0FFDAh
45
Maskable
0FFD8h
44
Maskable
0FFD6h
43
Maskable
0FFD4h
42
Maskable
0FFD2h
41
0FFD0h
40
TA2
I/O Port P2
RTC_A
TA2CCR0 CCIFG0
(3)
(3)
TA2CCR1 CCIFG1 to TA2CCR2 CCIFG2,
TA2IFG (TA2IV) (1) (3)
P2IFG.0 to P2IFG.7 (P2IV) (1)
(3)
RTCRDYIFG, RTCTEVIFG, RTCAIFG,
RT0PSIFG, RT1PSIFG (RTCIV) (1) (3)
Reserved
(3)
(4)
(5)
Maskable
TA0CCR1 CCIFG1 to TA0CCR4 CCIFG4,
TA0IFG (TA0IV) (1) (3)
TA2
(1)
(2)
(3)
(1) (3)
Reserved
(5)
⋮
⋮
0FF80h
0, lowest
Multiple source flags
A reset is generated if the CPU tries to fetch instructions from within peripheral space or vacant memory space.
(Non)maskable: the individual interrupt-enable bit can disable an interrupt event, but the general-interrupt enable cannot disable it.
Interrupt flags are located in the module.
Only on devices with ADC, otherwise reserved.
Reserved interrupt vectors at addresses are not used in this device and can be used for regular program code if necessary. To maintain
compatibility with other devices, TI recommends reserving these locations.
Detailed Description
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Copyright © 2009–2015, Texas Instruments Incorporated
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SLAS645J – JULY 2009 – REVISED APRIL 2015
6.4
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Memory Organization
Table 6-2. Memory Organization (1)
Memory (flash)
Main: interrupt vector
Main: code memory
MSP430F5504
MSP430F5500
MSP430F5508
MSP430F5505
MSP430F5501
MSP430F5509
MSP430F5506
MSP430F5502
MSP430F5510
MSP430F5507
MSP430F5503
Total Size
8KB
00FFFFh–00FF80h
00FFFFh-00E000h
16KB
00FFFFh–00FF80h
00FFFFh-00C000h
24KB
00FFFFh–00FF80h
00FFFFh-00A000h
32KB
00FFFFh–00FF80h
00FFFFh-008000h
Sector 1
2KB
0033FFh–002C00h
2KB
0033FFh–002C00h
2KB
0033FFh–002C00h
2KB
0033FFh–002C00h
Sector 0
2KB
002BFFh–002400h
2KB
002BFFh–002400h
2KB
002BFFh–002400h
2KB
002BFFh–002400h
2KB
0023FFh–001C00h
2KB
0023FFh–001C00h
2KB
0023FFh–001C00h
2KB
0023FFh–001C00h
Info A
128 B
0019FFh–001980h
128 B
0019FFh–001980h
128 B
0019FFh–001980h
128 B
0019FFh–001980h
Info B
128 B
00197Fh–001900h
128 B
00197Fh–001900h
128 B
00197Fh–001900h
128 B
00197Fh–001900h
Info C
128 B
0018FFh–001880h
128 B
0018FFh–001880h
128 B
0018FFh–001880h
128 B
0018FFh–001880h
Info D
128 B
00187Fh–001800h
128 B
00187Fh–001800h
128 B
00187Fh–001800h
128 B
00187Fh–001800h
BSL 3
512 B
0017FFh–001600h
512 B
0017FFh–001600h
512 B
0017FFh–001600h
512 B
0017FFh–001600h
BSL 2
512 B
0015FFh–001400h
512 B
0015FFh–001400h
512 B
0015FFh–001400h
512 B
0015FFh–001400h
BSL 1
512 B
0013FFh–001200h
512 B
0013FFh–001200h
512 B
0013FFh–001200h
512 B
0013FFh–001200h
BSL 0
512 B
0011FFh–001000h
512 B
0011FFh–001000h
512 B
0011FFh–001000h
512 B
0011FFh–001000h
4KB
000FFFh–0h
4KB
000FFFh–0h
4KB
000FFFh–0h
4KB
000FFFh–0h
RAM
USB RAM (2)
Information memory
(flash)
Bootstrap loader (BSL)
memory (flash)
Peripherals
(1)
(2)
50
Size
N/A = Not available
USB RAM can be used as general purpose RAM when not used for USB operation.
Detailed Description
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MSP430F5510, MSP430F5509, MSP430F5508
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6.5
SLAS645J – JULY 2009 – REVISED APRIL 2015
Bootstrap Loader (BSL)
The BSL enables users to program the flash memory or RAM using various serial interfaces. Access to
the device memory via the BSL is protected by an user-defined password. For complete description of the
features of the BSL and its implementation, see the MSP430 Programming Via the Bootstrap Loader
User's Guide (SLAU319).
6.5.1
USB BSL
All devices come preprogrammed with the USB BSL. Use of the USB BSL requires external access to the
six pins shown in Table 6-3. In addition to these pins, the application must support external components
necessary for normal USB operation (for example, proper crystal on XT2IN and XT2OUT and proper
decoupling). For further details on interfacing to development tools and device programmers, see the
MSP430 Hardware Tools User's Guide (SLAU278).
Table 6-3. USB BSL Pin Requirements and Functions
DEVICE SIGNAL
BSL FUNCTION
RST/NMI/SBWTDIO
Entry sequence signal
PU.0/DP
USB data terminal DP
PU.1/DM
USB data terminal DM
PUR
USB pullup resistor terminal
VBUS
USB bus power supply
VSSU
USB ground supply
NOTE
The default USB BSL evaluates the logic level of the PUR pin after a BOR reset. If it is
pulled high externally, then the BSL is invoked. Therefore, unless the BSL should be
invoked, it is important to keep PUR pulled low after a BOR reset, even if BSL or USB is
never used. TI recommends applying a 1-MΩ resistor to ground.
6.5.2
UART BSL
A UART BSL is also available that can be programmed by the user into the BSL memory by replacing the
pre-programmed factory-supplied USB BSL. Use of the UART BSL requires external access to the six
pins shown in Table 6-4. For further details on interfacing to development tools and device programmers,
see the MSP430 Hardware Tools User's Guide (SLAU278).
Table 6-4. UART BSL Pin Requirements and Functions
DEVICE SIGNAL
BSL FUNCTION
RST/NMI/SBWTDIO
Entry sequence signal
TEST/SBWTCK
Entry sequence signal
P1.1
Data transmit
P1.2
Data receive
VCC
Power supply
VSS
Ground supply
Detailed Description
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6.6
6.6.1
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JTAG Operation
JTAG Standard Interface
The MSP430 family supports the standard JTAG interface, which requires four signals for sending and
receiving data. The JTAG signals are shared with general-purpose I/Os. The TEST/SBWTCK pin is used
to enable the JTAG signals. In addition to these signals, the RST/NMI/SBWTDIO is required to interface
with MSP430 development tools and device programmers. The JTAG pin requirements are shown in
Table 6-5. For further details on interfacing to development tools and device programmers, see the
MSP430 Hardware Tools User's Guide (SLAU278). For complete description of the features of the JTAG
interface and its implementation, see the MSP430 Memory Programming via the JTAG Interface User's
Guide (SLAU320).
Table 6-5. JTAG Pin Requirements and Functions
6.6.2
DEVICE SIGNAL
DIRECTION
FUNCTION
PJ.3/TCK
IN
JTAG clock input
PJ.2/TMS
IN
JTAG state control
PJ.1/TDI/TCLK
IN
JTAG data input, TCLK input
PJ.0/TDO
OUT
JTAG data output
TEST/SBWTCK
IN
Enable JTAG pins
RST/NMI/SBWTDIO
IN
External reset
VCC
Power supply
VSS
Ground supply
Spy-Bi-Wire Interface
In addition to the standard JTAG interface, the MSP430 family supports the two-wire Spy-Bi-Wire
interface. Spy-Bi-Wire can be used to interface with MSP430 development tools and device programmers.
The Spy-Bi-Wire interface pin requirements are shown in Table 6-6. For further details on interfacing to
development tools and device programmers, see the MSP430 Hardware Tools User's Guide (SLAU278).
For complete description of the features of the JTAG interface and its implementation, see the MSP430
Memory Programming via the JTAG Interface User's Guide (SLAU320).
Table 6-6. Spy-Bi-Wire Pin Requirements and Functions
6.7
DEVICE SIGNAL
DIRECTION
FUNCTION
TEST/SBWTCK
IN
Spy-Bi-Wire clock input
RST/NMI/SBWTDIO
IN, OUT
Spy-Bi-Wire data input/output
VCC
Power supply
VSS
Ground supply
Flash Memory (Link to User's Guide)
The flash memory can be programmed via the JTAG port, Spy-Bi-Wire (SBW), the BSL, or in-system by
the CPU. The CPU can perform single-byte, single-word, and long-word writes to the flash memory.
Features of the flash memory include:
• Flash memory has n segments of main memory and four segments of information memory (A to D) of
128 bytes each. Each segment in main memory is 512 bytes in size.
• Segments 0 to n may be erased in one step, or each segment may be individually erased.
• Segments A to D can be erased individually, or as a group with segments 0 to n. Segments A to D are
also called information memory.
• Segment A can be locked separately.
52
Detailed Description
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6.8
SLAS645J – JULY 2009 – REVISED APRIL 2015
RAM (Link to User's Guide)
The RAM is made up of n sectors. Each sector can be completely powered down to save leakage,
however all data is lost. Features of the RAM include:
• RAM has n sectors. The size of a sector can be found in Section 6.4.
• Each sector 0 to n can be completely disabled; however, data retention is lost.
• Each sector 0 to n automatically enters low-power retention mode when possible.
• For devices that contain USB memory, the USB memory can be used as normal RAM if USB is not
required.
6.9
Peripherals
Peripherals are connected to the CPU through data, address, and control buses. Peripherals can be
handled using all instructions. For complete module descriptions, see the MSP430x5xx and MSP430x6xx
Family User's Guide (SLAU208).
6.9.1
Digital I/O (Link to User's Guide)
There are up to six 8-bit I/O ports implemented: For 64-pin options, P1, P2, P4, P6, and are complete, P5
is reduced to 6-bit I/O and P3 to 5-bit I/O. For 48-pin options, P6 is reduced to 4-bit I/O, P2 to 1-bit I/O,
and P3 is completely removed. Port PJ contains four individual I/O ports, common to all devices.
• All individual I/O bits are independently programmable.
• Any combination of input, output, and interrupt conditions is possible.
• Pullup or pulldown on all ports is programmable.
• Drive strength on all ports is programmable.
• Edge-selectable interrupt and LPM4.5 wake-up input capability is available for all bits of ports P1 and
P2.
• Read and write access to port-control registers is supported by all instructions.
• Ports can be accessed byte-wise (P1 through P6) or word-wise in pairs (PA through PC).
6.9.2
Port Mapping Controller (Link to User's Guide)
The port mapping controller allows the flexible and reconfigurable mapping of digital functions to port P4.
Table 6-7. Port Mapping, Mnemonics and Functions
VALUE
PxMAPy MNEMONIC
INPUT PIN FUNCTION
OUTPUT PIN FUNCTION
0
PM_NONE
None
DVSS
PM_CBOUT0
-
Comparator_B output
PM_TB0CLK
TB0 clock input
1
2
PM_ADC10CLK
-
PM_DMAE0
DMAE0 input
ADC10CLK
PM_SVMOUT
-
PM_TB0OUTH
TB0 high impedance input TB0OUTH
4
PM_TB0CCR0A
TB0 CCR0 capture input CCI0A
TB0 CCR0 compare output Out0
5
PM_TB0CCR1A
TB0 CCR1 capture input CCI1A
TB0 CCR1 compare output Out1
6
PM_TB0CCR2A
TB0 CCR2 capture input CCI2A
TB0 CCR2 compare output Out2
7
PM_TB0CCR3A
TB0 CCR3 capture input CCI3A
TB0 CCR3 compare output Out3
8
PM_TB0CCR4A
TB0 CCR4 capture input CCI4A
TB0 CCR4 compare output Out4
9
PM_TB0CCR5A
TB0 CCR5 capture input CCI5A
TB0 CCR5 compare output Out5
10
PM_TB0CCR6A
TB0 CCR6 capture input CCI6A
TB0 CCR6 compare output Out6
3
11
SVM output
PM_UCA1RXD
USCI_A1 UART RXD (Direction controlled by USCI - input)
PM_UCA1SOMI
USCI_A1 SPI slave out master in (direction controlled by USCI)
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Table 6-7. Port Mapping, Mnemonics and Functions (continued)
VALUE
12
13
14
15
16
17
INPUT PIN FUNCTION
OUTPUT PIN FUNCTION
PM_UCA1TXD
USCI_A1 UART TXD (Direction controlled by USCI - output)
PM_UCA1SIMO
USCI_A1 SPI slave in master out (direction controlled by USCI)
PM_UCA1CLK
USCI_A1 clock input/output (direction controlled by USCI)
PM_UCB1STE
USCI_B1 SPI slave transmit enable (direction controlled by USCI)
PM_UCB1SOMI
USCI_B1 SPI slave out master in (direction controlled by USCI)
PM_UCB1SCL
USCI_B1 I2C clock (open drain and direction controlled by USCI)
PM_UCB1SIMO
USCI_B1 SPI slave in master out (direction controlled by USCI)
PM_UCB1SDA
USCI_B1 I2C data (open drain and direction controlled by USCI)
PM_UCB1CLK
USCI_B1 clock input/output (direction controlled by USCI)
PM_UCA1STE
USCI_A1 SPI slave transmit enable (direction controlled by USCI)
PM_CBOUT1
None
18
PM_MCLK
None
MCLK
19
PM_RTCCLK
None
RTCCLK output
20
21
22
23
24
25
26 - 30
31 (0FFh) (1)
(1)
PxMAPy MNEMONIC
Comparator_B output
PM_UCA0RXD
USCI_A0 UART RXD (Direction controlled by USCI - input)
PM_UCA0SOMI
USCI_A0 SPI slave out master in (direction controlled by USCI)
PM_UCA0TXD
USCI_A0 UART TXD (Direction controlled by USCI - output)
PM_UCA0SIMO
USCI_A0 SPI slave in master out (direction controlled by USCI)
PM_UCA0CLK
USCI_A0 clock input/output (direction controlled by USCI)
PM_UCB0STE
USCI_B0 SPI slave transmit enable (direction controlled by USCI)
PM_UCB0SOMI
USCI_B0 SPI slave out master in (direction controlled by USCI)
PM_UCB0SCL
USCI_B0 I2C clock (open drain and direction controlled by USCI)
PM_UCB0SIMO
USCI_B0 SPI slave in master out (direction controlled by USCI)
PM_UCB0SDA
USCI_B0 I2C data (open drain and direction controlled by USCI)
PM_UCB0CLK
USCI_B0 clock input/output (direction controlled by USCI)
PM_UCA0STE
USCI_A0 SPI slave transmit enable (direction controlled by USCI)
Reserved
None
DVSS
Disables the output driver and the input Schmitt-trigger to prevent parasitic
cross currents when applying analog signals.
PM_ANALOG
The value of the PM_ANALOG mnemonic is set to 0FFh. The port mapping registers are only 5 bits wide and the upper bits are ignored
resulting in a read out value of 31.
Table 6-8. Default Mapping
54
PIN
PxMAPy MNEMONIC
P4.0/P4MAP0
PM_UCB1STE/PM_UCA1CLK
USCI_B1 SPI slave transmit enable (direction controlled by USCI)
USCI_A1 clock input/output (direction controlled by USCI)
P4.1/P4MAP1
PM_UCB1SIMO/PM_UCB1SDA
USCI_B1 SPI slave in master out (direction controlled by USCI)
USCI_B1 I2C data (open drain and direction controlled by USCI)
P4.2/P4MAP2
PM_UCB1SOMI/PM_UCB1SCL
USCI_B1 SPI slave out master in (direction controlled by USCI)
USCI_B1 I2C clock (open drain and direction controlled by USCI)
P4.3/P4MAP3
PM_UCB1CLK/PM_UCA1STE
USCI_A1 SPI slave transmit enable (direction controlled by USCI)
USCI_B1 clock input/output (direction controlled by USCI)
P4.4/P4MAP4
PM_UCA1TXD/PM_UCA1SIMO
USCI_A1 UART TXD (Direction controlled by USCI - output)
USCI_A1 SPI slave in master out (direction controlled by USCI)
P4.5/P4MAP5
PM_UCA1RXD/PM_UCA1SOMI
USCI_A1 UART RXD (Direction controlled by USCI - input)
USCI_A1 SPI slave out master in (direction controlled by USCI)
P4.6/P4MAP6
PM_NONE
None
DVSS
P4.7/P4MAP7
PM_NONE
None
DVSS
Detailed Description
INPUT PIN FUNCTION
OUTPUT PIN FUNCTION
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6.9.3
SLAS645J – JULY 2009 – REVISED APRIL 2015
Oscillator and System Clock (Link to User's Guide)
The clock system in the MSP430F550x family of devices is supported by the Unified Clock System (UCS)
module that includes support for a 32-kHz watch crystal oscillator (XT1 LF mode; XT1 HF mode is not
supported), an internal very-low-power low-frequency oscillator (VLO), an internal trimmed low-frequency
oscillator (REFO), an integrated internal digitally controlled oscillator (DCO), and a high-frequency crystal
oscillator XT2. The UCS module is designed to meet the requirements of both low system cost and low
power consumption. The UCS module features digital frequency locked loop (FLL) hardware that, in
conjunction with a digital modulator, stabilizes the DCO frequency to a programmable multiple of the
selected FLL reference frequency. The internal DCO provides a fast turnon clock source and stabilizes in
less than 5 µs. The UCS module provides the following clock signals:
• Auxiliary clock (ACLK), sourced from a 32-kHz watch crystal (XT1), a high-frequency crystal (XT2), the
internal low-frequency oscillator (VLO), the trimmed low-frequency oscillator (REFO), or the internal
digitally-controlled oscillator DCO.
• Main clock (MCLK), the system clock used by the CPU. MCLK can be sourced by same sources made
available to ACLK.
• Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules. SMCLK can be
sourced by same sources made available to ACLK.
• ACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, ACLK/8, ACLK/16, ACLK/32.
6.9.4
Power-Management Module (PMM) (Link to User's Guide)
The PMM includes an integrated voltage regulator that supplies the core voltage to the device and
contains programmable output levels to provide for power optimization. The PMM also includes supply
voltage supervisor (SVS) and supply voltage monitoring (SVM) circuitry, as well as brownout protection.
The brownout circuit is implemented to provide the proper internal reset signal to the device during poweron and power-off. The SVS and SVM circuitry detects if the supply voltage drops below a user-selectable
level and supports both supply voltage supervision (the device is automatically reset) and supply voltage
monitoring (the device is not automatically reset). SVS and SVM circuitry is available on the primary
supply and core supply.
6.9.5
Hardware Multiplier (MPY) (Link to User's Guide)
The multiplication operation is supported by a dedicated peripheral module. The module performs
operations with 32-bit, 24-bit, 16-bit, and 8-bit operands. The module supports signed and unsigned
multiplication as well as signed and unsigned multiply-and-accumulate operations.
6.9.6
Real-Time Clock (RTC_A) (Link to User's Guide)
The RTC_A module can be used as a general-purpose 32-bit counter (counter mode) or as an integrated
real-time clock (RTC) (calendar mode). In counter mode, the RTC_A also includes two independent 8-bit
timers that can be cascaded to form a 16-bit timer/counter. Both timers can be read and written by
software. Calendar mode integrates an internal calendar which compensates for months with less than
31 days and includes leap year correction. The RTC_A also supports flexible alarm functions and offsetcalibration hardware.
6.9.7
Watchdog Timer (WDT_A) (Link to User's Guide)
The primary function of the WDT_A module is to perform a controlled system restart after a software
problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog function
is not needed in an application, the module can be configured as an interval timer and can generate
interrupts at selected time intervals.
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6.9.8
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System Module (SYS) (Link to User's Guide)
The SYS module handles many of the system functions within the device. These include power on reset
and power up clear handling, NMI source selection and management, reset interrupt vector generators,
boot strap loader entry mechanisms, as well as, configuration management (device descriptors). It also
includes a data exchange mechanism via JTAG called a JTAG mailbox that can be used in the
application.
Table 6-9. System Module Interrupt Vector Registers
INTERRUPT VECTOR REGISTER
ADDRESS
INTERRUPT EVENT
VALUE
SYSRSTIV, System Reset
019Eh
No interrupt pending
00h
Brownout (BOR)
02h
SYSSNIV, System NMI
SYSUNIV, User NMI
56
Detailed Description
019Ch
019Ah
RST/NMI (POR)
04h
PMMSWBOR (BOR)
06h
Wakeup from LPMx.5
08h
Security violation (BOR)
0Ah
SVSL (POR)
0Ch
SVSH (POR)
0Eh
SVML_OVP (POR)
10h
SVMH_OVP (POR)
12h
PMMSWPOR (POR)
14h
WDT time-out (PUC)
16h
WDT password violation (PUC)
18h
KEYV flash password violation (PUC)
1Ah
Reserved
1Ch
Peripheral area fetch (PUC)
1Eh
PMM password violation (PUC)
20h
Reserved
22h to 3Eh
No interrupt pending
00h
SVMLIFG
02h
SVMHIFG
04h
SVSMLDLYIFG
06h
SVSMHDLYIFG
08h
VMAIFG
0Ah
JMBINIFG
0Ch
JMBOUTIFG
0Eh
SVMLVLRIFG
10h
SVMHVLRIFG
12h
Reserved
14h to 1Eh
No interrupt pending
00h
NMIFG
02h
OFIFG
04h
ACCVIFG
06h
Reserved
08h
Reserved
0Ah to 1Eh
PRIORITY
Highest
Lowest
Highest
Lowest
Highest
Lowest
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6.9.9
SLAS645J – JULY 2009 – REVISED APRIL 2015
DMA Controller (Link to User's Guide)
The DMA controller allows movement of data from one memory address to another without CPU
intervention. For example, the DMA controller can be used to move data from the ADC10_A conversion
register to RAM. Using the DMA controller can increase the throughput of peripheral modules. The DMA
controller reduces system power consumption by allowing the CPU to remain in sleep mode, without
having to awaken to move data to or from a peripheral.
The USB timestamp generator also uses the DMA trigger assignments described in Table 6-10.
Table 6-10. DMA Trigger Assignments (1)
TRIGGER
(1)
(2)
CHANNEL
0
1
2
0
DMAREQ
DMAREQ
DMAREQ
1
TA0CCR0 CCIFG
TA0CCR0 CCIFG
TA0CCR0 CCIFG
2
TA0CCR2 CCIFG
TA0CCR2 CCIFG
TA0CCR2 CCIFG
3
TA1CCR0 CCIFG
TA1CCR0 CCIFG
TA1CCR0 CCIFG
4
TA1CCR2 CCIFG
TA1CCR2 CCIFG
TA1CCR2 CCIFG
5
TA2CCR0 CCIFG
TA2CCR0 CCIFG
TA2CCR0 CCIFG
6
TA2CCR2 CCIFG
TA2CCR2 CCIFG
TA2CCR2 CCIFG
7
TB0CCR0 CCIFG
TB0CCR0 CCIFG
TB0CCR0 CCIFG
8
TB0CCR2 CCIFG
TB0CCR2 CCIFG
TB0CCR2 CCIFG
9
Reserved
Reserved
Reserved
10
Reserved
Reserved
Reserved
11
Reserved
Reserved
Reserved
12
Reserved
Reserved
Reserved
13
Reserved
Reserved
Reserved
14
Reserved
Reserved
Reserved
15
Reserved
Reserved
Reserved
16
UCA0RXIFG
UCA0RXIFG
UCA0RXIFG
17
UCA0TXIFG
UCA0TXIFG
UCA0TXIFG
18
UCB0RXIFG
UCB0RXIFG
UCB0RXIFG
19
UCB0TXIFG
UCB0TXIFG
UCB0TXIFG
20
UCA1RXIFG
UCA1RXIFG
UCA1RXIFG
21
UCA1TXIFG
UCA1TXIFG
UCA1TXIFG
22
UCB1RXIFG
UCB1RXIFG
UCB1RXIFG
23
UCB1TXIFG
UCB1TXIFG
UCB1TXIFG
24
ADC10IFG0 (2)
ADC10IFG0 (2)
ADC10IFG0 (2)
25
Reserved
Reserved
Reserved
26
Reserved
Reserved
Reserved
27
USB FNRXD
USB FNRXD
USB FNRXD
28
USB ready
USB ready
USB ready
29
MPY ready
MPY ready
MPY ready
30
DMA2IFG
DMA0IFG
DMA1IFG
31
DMAE0
DMAE0
DMAE0
If a reserved trigger source is selected, no Trigger1 is generated.
Only on devices with ADC. Reserved on devices without ADC.
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6.9.10 Universal Serial Communication Interface (USCI) (Links to User's Guide: UART
Mode, SPI Mode, I2C Mode)
The USCI modules are used for serial data communication. The USCI module supports synchronous
communication protocols such as SPI (3-pin or 4-pin) and I2C, and asynchronous communication
protocols such as UART, enhanced UART with automatic baudrate detection, and IrDA. Each USCI
module contains two portions, A and B.
The USCI_An module provides support for SPI (3-pin or 4-pin), UART, enhanced UART, or IrDA.
The USCI_Bn module provides support for SPI (3-pin or 4-pin) or I2C.
The MSP430F55xx series includes two complete USCI modules (n = 0, 1).
6.9.11 TA0 (Link to User's Guide)
TA0 is a 16-bit timer/counter (Timer_A type) with five capture/compare registers. TA0 can support multiple
capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities. Interrupts
may be generated from the counter on overflow conditions and from each of the capture/compare
registers.
Table 6-11. TA0 Signal Connections
INPUT PIN NUMBER
RGC, ZQE
RGZ, PT
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
18, H2-P1.0
14-P1.0
TA0CLK
TACLK
ACLK
(internal)
ACLK
SMCLK
(internal)
SMCLK
18, H2-P1.0
14-P1.0
TA0CLK
TACLK
19, H3-P1.1
15-P1.1
TA0.0
CCI0A
DVSS
CCI0B
DVSS
GND
20, J3-P1.2
21, G4-P1.3
22, H4-P1.4
23, J4-P1.5
16-P1.2
17-P1.3
18-P1.4
19-P1.5
(1)
Only on devices with ADC.
58
Detailed Description
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
CCR0
TA0
OUTPUT PIN NUMBER
RGC, ZQE
RGZ, PT
19, H3-P1.1
15-P1.1
TA0.0
DVCC
VCC
TA0.1
CCI1A
20, J3-P1.2
16-P1.2
CBOUT
(internal)
CCI1B
ADC10
(internal) (1)
ADC10SHSx =
{1}
ADC10
(internal) (1)
ADC10SHSx =
{1}
DVSS
GND
21, G4-P1.3
17-P1.3
22, H4-P1.4
18-P1.4
23, J4-P1.5
19-P1.5
DVCC
VCC
TA0.2
CCI2A
ACLK
(internal)
CCI2B
DVSS
GND
DVCC
VCC
TA0.3
CCI3A
DVSS
CCI3B
DVSS
GND
DVCC
VCC
TA0.4
CCI4A
DVSS
CCI4B
DVSS
GND
DVCC
VCC
CCR1
CCR2
CCR3
CCR4
TA1
TA2
TA3
TA4
TA0.1
TA0.2
TA0.3
TA0.4
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6.9.12 TA1 (Link to User's Guide)
TA1 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. TA1 can support
multiple capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the
capture/compare registers.
Table 6-12. TA1 Signal Connections
INPUT PIN NUMBER
RGC, ZQE
RGZ, PT
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
24, G5-P1.6
20-P1.6
TA1CLK
TACLK
ACLK
(internal)
ACLK
SMCLK
(internal)
SMCLK
24, G5-P1.6
20-P1.6
TA1CLK
TACLK
25, H5-P1.7
21-P1.7
TA1.0
CCI0A
DVSS
CCI0B
DVSS
GND
26, J5-P2.0
27, G6-P2.1
22-P2.0
DVCC
VCC
TA1.1
CCI1A
CBOUT
(internal)
CCI1B
DVSS
GND
DVCC
VCC
TA1.2
CCI2A
ACLK
(internal)
CCI2B
DVSS
GND
DVCC
VCC
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
CCR0
CCR1
TA0
TA1
OUTPUT PIN NUMBER
RGC, ZQE
RGZ, PT
25, H5-P1.7
21-P1.7
26, J5-P2.0
22-P2.0
TA1.0
TA1.1
27, G6-P2.1
CCR2
TA2
TA1.2
Detailed Description
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6.9.13 TA2 (Link to User's Guide)
TA2 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. TA2 can support
multiple capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the
capture/compare registers.
Table 6-13. TA2 Signal Connections
INPUT PIN NUMBER
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
TA2CLK
TACLK
ACLK
(internal)
ACLK
SMCLK
(internal)
SMCLK
28, J6-P2.2
TA2CLK
TACLK
29, H6-P2.3
TA2.0
CCI0A
DVSS
CCI0B
DVSS
GND
RGC, ZQE
RGZ, PT
28, J6-P2.2
30, J7-P2.4
31, J8-P2.5
60
Detailed Description
DVCC
VCC
TA2.1
CCI1A
CBOUT
(internal)
CCI1B
DVSS
GND
DVCC
VCC
TA2.2
CCI2A
ACLK
(internal)
CCI2B
DVSS
GND
DVCC
VCC
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
OUTPUT PIN NUMBER
RGC, ZQE
RGZ, PT
29, H6-P2.3
CCR0
TA0
TA2.0
30, J7-P2.4
CCR1
TA1
TA2.1
31, J8-P2.5
CCR2
TA2
TA2.2
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6.9.14 TB0 (Link to User's Guide)
TB0 is a 16-bit timer/counter (Timer_B type) with seven capture/compare registers. TB0 can support
multiple capture/compares, PWM outputs, and interval timing. It also has extensive interrupt capabilities.
Interrupts may be generated from the counter on overflow conditions and from each of the
capture/compare registers.
Table 6-14. TB0 Signal Connections
INPUT PIN NUMBER
RGC, ZQE
(1)
(2)
(1)
RGZ, PT
(1)
DEVICE
INPUT
SIGNAL
MODULE
INPUT
SIGNAL
TB0CLK
TBCLK
ACLK
(internal)
ACLK
SMCLK
(internal)
SMCLK
TB0CLK
TBCLK
TB0.0
CCI0A
TB0.0
CCI0B
DVSS
GND
DVCC
VCC
TB0.1
CCI1A
CBOUT
(internal)
CCI1B
DVSS
GND
DVCC
VCC
TB0.2
CCI2A
TB0.2
CCI2B
DVSS
GND
DVCC
VCC
TB0.3
CCI3A
TB0.3
CCI3B
DVSS
GND
DVCC
VCC
TB0.4
CCI4A
TB0.4
CCI4B
DVSS
GND
DVCC
VCC
TB0.5
CCI5A
TB0.5
CCI5B
DVSS
GND
DVCC
VCC
TB0.6
CCI6A
ACLK
(internal)
CCI6B
DVSS
GND
DVCC
VCC
MODULE
BLOCK
MODULE
OUTPUT
SIGNAL
DEVICE
OUTPUT
SIGNAL
Timer
NA
NA
CCR0
TB0
TB0.0
CCR1
TB1
TB0.1
CCR2
TB2
TB0.2
CCR3
TB3
TB0.3
CCR4
TB4
TB0.4
CCR5
TB5
TB0.5
CCR6
TB6
TB0.6
OUTPUT PIN NUMBER
RGC, ZQE (1)
RGZ, PT (1)
ADC10
(internal) (2)
ADC10SHSx =
{2}
ADC10
(internal) (2)
ADC10SHSx =
{2}
ADC10 (internal)
ADC10SHSx =
{3}
ADC10 (internal)
ADC10SHSx =
{3}
Timer functions selectable via the port mapping controller.
Only on devices with ADC.
Detailed Description
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6.9.15 Comparator_B (Link to User's Guide)
The primary function of the Comparator_B module is to support precision slope analog-to-digital
conversions, battery voltage supervision, and monitoring of external analog signals.
6.9.16 ADC10_A (Link to User's Guide)
The ADC10_A module supports fast 10-bit analog-to-digital conversions. The module implements a 10-bit
SAR core, sample select control, reference generator, and a conversion result buffer. A window
comparator with lower and upper limits allows CPU-independent result monitoring with three window
comparator interrupt flags.
6.9.17 CRC16 (Link to User's Guide)
The CRC16 module produces a signature based on a sequence of entered data values and can be used
for data checking purposes. The CRC16 module signature is based on the CRC-CCITT standard.
6.9.18 Reference (REF) Voltage Reference (Link to User's Guide)
The REF module is responsible for generation of all critical reference voltages that can be used by the
various analog peripherals in the device.
6.9.19 Universal Serial Bus (USB) (Link to User's Guide)
The USB module is a fully integrated USB interface that is compliant with the USB 2.0 specification. The
module supports full-speed operation of control, interrupt, and bulk transfers. The module includes an
integrated LDO, PHY, and PLL. The PLL is highly flexible and supports a wide range of input clock
frequencies. USB RAM, when not used for USB communication, can be used by the system.
6.9.20 Embedded Emulation Module (EEM) (S Version) (Link to User's Guide)
The EEM supports real-time in-system debugging. The S version of the EEM has the following features:
• Three hardware triggers or breakpoints on memory access
• One hardware trigger or breakpoint on CPU register write access
• Up to four hardware triggers can be combined to form complex triggers or breakpoints
• One cycle counter
• Clock control on module level
62
Detailed Description
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SLAS645J – JULY 2009 – REVISED APRIL 2015
6.10 Peripheral File Map
Table 6-15. Peripherals
MODULE NAME
BASE ADDRESS
OFFSET ADDRESS
RANGE
Special Functions (see Table 6-16)
0100h
000h-01Fh
PMM (see Table 6-17)
0120h
000h-010h
Flash Control (see Table 6-18)
0140h
000h-00Fh
CRC16 (see Table 6-19)
0150h
000h-007h
RAM Control (see Table 6-20)
0158h
000h-001h
Watchdog (see Table 6-21)
015Ch
000h-001h
UCS (see Table 6-22)
0160h
000h-01Fh
SYS (see Table 6-23)
0180h
000h-01Fh
Shared Reference (see Table 6-24)
01B0h
000h-001h
Port Mapping Control (see Table 6-25)
01C0h
000h-002h
Port Mapping Port P4 (see Table 6-25)
01E0h
000h-007h
Port P1, P2 (see Table 6-26)
0200h
000h-01Fh
Port P3, P4 (see Table 6-27)
0220h
000h-00Bh
Port P5, P6 (see Table 6-28)
0240h
000h-00Bh
Port PJ (see Table 6-29)
0320h
000h-01Fh
TA0 (see Table 6-30)
0340h
000h-02Eh
TA1 (see Table 6-31)
0380h
000h-02Eh
TB0 (see Table 6-32)
03C0h
000h-02Eh
TA2 (see Table 6-33)
0400h
000h-02Eh
Real-Time Clock (RTC_A) (see Table 6-34)
04A0h
000h-01Bh
32-bit Hardware Multiplier (see Table 6-35)
04C0h
000h-02Fh
DMA General Control (see Table 6-36)
0500h
000h-00Fh
DMA Channel 0 (see Table 6-36)
0510h
000h-00Ah
DMA Channel 1 (see Table 6-36)
0520h
000h-00Ah
DMA Channel 2 (see Table 6-36)
0530h
000h-00Ah
USCI_A0 (see Table 6-37)
05C0h
000h-01Fh
USCI_B0 (see Table 6-38)
05E0h
000h-01Fh
USCI_A1 (see Table 6-39)
0600h
000h-01Fh
USCI_B1 (see Table 6-40)
0620h
000h-01Fh
ADC10_A (see Table 6-41)
0740h
000h-01Fh
000h-00Fh
Comparator_B (see Table 6-42)
08C0h
USB configuration (see Table 6-43)
0900h
000h-014h
USB control (see Table 6-44)
0920h
000h-01Fh
Detailed Description
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Table 6-16. Special Function Registers (Base Address: 0100h)
REGISTER DESCRIPTION
REGISTER
OFFSET
SFR interrupt enable
SFRIE1
00h
SFR interrupt flag
SFRIFG1
02h
SFR reset pin control
SFRRPCR
04h
Table 6-17. PMM Registers (Base Address: 0120h)
REGISTER DESCRIPTION
REGISTER
OFFSET
PMM Control 0
PMMCTL0
00h
PMM control 1
PMMCTL1
02h
SVS high side control
SVSMHCTL
04h
SVS low side control
SVSMLCTL
06h
PMM interrupt flags
PMMIFG
0Ch
PMM interrupt enable
PMMIE
0Eh
PMM power mode 5 control
PM5CTL0
10h
Table 6-18. Flash Control Registers (Base Address: 0140h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Flash control 1
FCTL1
00h
Flash control 3
FCTL3
04h
Flash control 4
FCTL4
06h
Table 6-19. CRC16 Registers (Base Address: 0150h)
REGISTER DESCRIPTION
REGISTER
OFFSET
CRC data input
CRC16DI
00h
CRC data input reverse byte
CRCDIRB
02h
CRC initialization and result
CRCINIRES
04h
CRC result reverse byte
CRCRESR
06h
Table 6-20. RAM Control Registers (Base Address: 0158h)
REGISTER DESCRIPTION
RAM control 0
REGISTER
RCCTL0
OFFSET
00h
Table 6-21. Watchdog Registers (Base Address: 015Ch)
REGISTER DESCRIPTION
Watchdog timer control
64
Detailed Description
REGISTER
WDTCTL
OFFSET
00h
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Table 6-22. UCS Registers (Base Address: 0160h)
REGISTER DESCRIPTION
REGISTER
OFFSET
UCS control 0
UCSCTL0
00h
UCS control 1
UCSCTL1
02h
UCS control 2
UCSCTL2
04h
UCS control 3
UCSCTL3
06h
UCS control 4
UCSCTL4
08h
UCS control 5
UCSCTL5
0Ah
UCS control 6
UCSCTL6
0Ch
UCS control 7
UCSCTL7
0Eh
UCS control 8
UCSCTL8
10h
Table 6-23. SYS Registers (Base Address: 0180h)
REGISTER DESCRIPTION
REGISTER
OFFSET
System control
SYSCTL
00h
Bootstrap loader configuration area
SYSBSLC
02h
JTAG mailbox control
SYSJMBC
06h
JTAG mailbox input 0
SYSJMBI0
08h
JTAG mailbox input 1
SYSJMBI1
0Ah
JTAG mailbox output 0
SYSJMBO0
0Ch
JTAG mailbox output 1
SYSJMBO1
0Eh
Bus Error vector generator
SYSBERRIV
18h
User NMI vector generator
SYSUNIV
1Ah
System NMI vector generator
SYSSNIV
1Ch
Reset vector generator
SYSRSTIV
1Eh
Table 6-24. Shared Reference Registers (Base Address: 01B0h)
REGISTER DESCRIPTION
Shared reference control
REGISTER
REFCTL
OFFSET
00h
Table 6-25. Port Mapping Registers
(Base Address of Port Mapping Control: 01C0h, Port P4: 01E0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port mapping key/ID register
PMAPKEYID
00h
Port mapping control register
PMAPCTL
02h
Port P4.0 mapping register
P4MAP0
00h
Port P4.1 mapping register
P4MAP1
01h
Port P4.2 mapping register
P4MAP2
02h
Port P4.3 mapping register
P4MAP3
03h
Port P4.4 mapping register
P4MAP4
04h
Port P4.5 mapping register
P4MAP5
05h
Port P4.6 mapping register
P4MAP6
06h
Port P4.7 mapping register
P4MAP7
07h
Detailed Description
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Table 6-26. Port P1, P2 Registers (Base Address: 0200h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P1 input
P1IN
00h
Port P1 output
P1OUT
02h
Port P1 direction
P1DIR
04h
Port P1 pullup/pulldown enable
P1REN
06h
Port P1 drive strength
P1DS
08h
Port P1 selection
P1SEL
0Ah
Port P1 interrupt vector word
P1IV
0Eh
Port P1 interrupt edge select
P1IES
18h
Port P1 interrupt enable
P1IE
1Ah
Port P1 interrupt flag
P1IFG
1Ch
Port P2 input
P2IN
01h
Port P2 output
P2OUT
03h
Port P2 direction
P2DIR
05h
Port P2 pullup/pulldown enable
P2REN
07h
Port P2 drive strength
P2DS
09h
Port P2 selection
P2SEL
0Bh
Port P2 interrupt vector word
P2IV
1Eh
Port P2 interrupt edge select
P2IES
19h
Port P2 interrupt enable
P2IE
1Bh
Port P2 interrupt flag
P2IFG
1Dh
Table 6-27. Port P3, P4 Registers (Base Address: 0220h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P3 input
P3IN
00h
Port P3 output
P3OUT
02h
Port P3 direction
P3DIR
04h
Port P3 pullup/pulldown enable
P3REN
06h
Port P3 drive strength
P3DS
08h
Port P3 selection
P3SEL
0Ah
Port P4 input
P4IN
01h
Port P4 output
P4OUT
03h
Port P4 direction
P4DIR
05h
Port P4 pullup/pulldown enable
P4REN
07h
Port P4 drive strength
P4DS
09h
Port P4 selection
P4SEL
0Bh
66
Detailed Description
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MSP430F5510, MSP430F5509, MSP430F5508
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Table 6-28. Port P5, P6 Registers (Base Address: 0240h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P5 input
P5IN
00h
Port P5 output
P5OUT
02h
Port P5 direction
P5DIR
04h
Port P5 pullup/pulldown enable
P5REN
06h
Port P5 drive strength
P5DS
08h
Port P5 selection
P5SEL
0Ah
Port P6 input
P6IN
01h
Port P6 output
P6OUT
03h
Port P6 direction
P6DIR
05h
Port P6 pullup/pulldown enable
P6REN
07h
Port P6 drive strength
P6DS
09h
Port P6 selection
P6SEL
0Bh
Table 6-29. Port J Registers (Base Address: 0320h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port PJ input
PJIN
00h
Port PJ output
PJOUT
02h
Port PJ direction
PJDIR
04h
Port PJ pullup/pulldown enable
PJREN
06h
Port PJ drive strength
PJDS
08h
Table 6-30. TA0 Registers (Base Address: 0340h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA0 control
TA0CTL
00h
Capture/compare control 0
TA0CCTL0
02h
Capture/compare control 1
TA0CCTL1
04h
Capture/compare control 2
TA0CCTL2
06h
Capture/compare control 3
TA0CCTL3
08h
Capture/compare control 4
TA0CCTL4
0Ah
TA0 counter register
TA0R
10h
Capture/compare register 0
TA0CCR0
12h
Capture/compare register 1
TA0CCR1
14h
Capture/compare register 2
TA0CCR2
16h
Capture/compare register 3
TA0CCR3
18h
Capture/compare register 4
TA0CCR4
1Ah
TA0 expansion register 0
TA0EX0
20h
TA0 interrupt vector
TA0IV
2Eh
Detailed Description
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Table 6-31. TA1 Registers (Base Address: 0380h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA1 control
TA1CTL
00h
Capture/compare control 0
TA1CCTL0
02h
Capture/compare control 1
TA1CCTL1
04h
Capture/compare control 2
TA1CCTL2
06h
TA1 counter register
TA1R
10h
Capture/compare register 0
TA1CCR0
12h
Capture/compare register 1
TA1CCR1
14h
Capture/compare register 2
TA1CCR2
16h
TA1 expansion register 0
TA1EX0
20h
TA1 interrupt vector
TA1IV
2Eh
Table 6-32. TB0 Registers (Base Address: 03C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TB0 control
TB0CTL
00h
Capture/compare control 0
TB0CCTL0
02h
Capture/compare control 1
TB0CCTL1
04h
Capture/compare control 2
TB0CCTL2
06h
Capture/compare control 3
TB0CCTL3
08h
Capture/compare control 4
TB0CCTL4
0Ah
Capture/compare control 5
TB0CCTL5
0Ch
Capture/compare control 6
TB0CCTL6
0Eh
TB0 register
TB0R
10h
Capture/compare register 0
TB0CCR0
12h
Capture/compare register 1
TB0CCR1
14h
Capture/compare register 2
TB0CCR2
16h
Capture/compare register 3
TB0CCR3
18h
Capture/compare register 4
TB0CCR4
1Ah
Capture/compare register 5
TB0CCR5
1Ch
Capture/compare register 6
TB0CCR6
1Eh
TB0 expansion register 0
TB0EX0
20h
TB0 interrupt vector
TB0IV
2Eh
Table 6-33. TA2 Registers (Base Address: 0400h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA2 control
TA2CTL
00h
Capture/compare control 0
TA2CCTL0
02h
Capture/compare control 1
TA2CCTL1
04h
Capture/compare control 2
TA2CCTL2
06h
TA2 counter register
TA2R
10h
Capture/compare register 0
TA2CCR0
12h
Capture/compare register 1
TA2CCR1
14h
Capture/compare register 2
TA2CCR2
16h
TA2 expansion register 0
TA2EX0
20h
TA2 interrupt vector
TA2IV
2Eh
68
Detailed Description
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MSP430F5510, MSP430F5509, MSP430F5508
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Table 6-34. Real-Time Clock Registers (Base Address: 04A0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
RTC control 0
RTCCTL0
00h
RTC control 1
RTCCTL1
01h
RTC control 2
RTCCTL2
02h
RTC control 3
RTCCTL3
03h
RTC prescaler 0 control
RTCPS0CTL
08h
RTC prescaler 1 control
RTCPS1CTL
0Ah
RTC prescaler 0
RTCPS0
0Ch
RTC prescaler 1
RTCPS1
0Dh
RTC interrupt vector word
RTCIV
0Eh
RTC seconds/counter register 1
RTCSEC/RTCNT1
10h
RTC minutes/counter register 2
RTCMIN/RTCNT2
11h
RTC hours/counter register 3
RTCHOUR/RTCNT3
12h
RTC day of week/counter register 4
RTCDOW/RTCNT4
13h
RTC days
RTCDAY
14h
RTC month
RTCMON
15h
RTC year low
RTCYEARL
16h
RTC year high
RTCYEARH
17h
RTC alarm minutes
RTCAMIN
18h
RTC alarm hours
RTCAHOUR
19h
RTC alarm day of week
RTCADOW
1Ah
RTC alarm days
RTCADAY
1Bh
Detailed Description
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Table 6-35. 32-Bit Hardware Multiplier Registers (Base Address: 04C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
16-bit operand 1 – multiply
MPY
00h
16-bit operand 1 – signed multiply
MPYS
02h
16-bit operand 1 – multiply accumulate
MAC
04h
16-bit operand 1 – signed multiply accumulate
MACS
06h
16-bit operand 2
OP2
08h
16 × 16 result low word
RESLO
0Ah
16 × 16 result high word
RESHI
0Ch
16 × 16 sum extension register
SUMEXT
0Eh
32-bit operand 1 – multiply low word
MPY32L
10h
32-bit operand 1 – multiply high word
MPY32H
12h
32-bit operand 1 – signed multiply low word
MPYS32L
14h
32-bit operand 1 – signed multiply high word
MPYS32H
16h
32-bit operand 1 – multiply accumulate low word
MAC32L
18h
32-bit operand 1 – multiply accumulate high word
MAC32H
1Ah
32-bit operand 1 – signed multiply accumulate low word
MACS32L
1Ch
32-bit operand 1 – signed multiply accumulate high word
MACS32H
1Eh
32-bit operand 2 – low word
OP2L
20h
32-bit operand 2 – high word
OP2H
22h
32 × 32 result 0 – least significant word
RES0
24h
32 × 32 result 1
RES1
26h
32 × 32 result 2
RES2
28h
32 × 32 result 3 – most significant word
RES3
2Ah
MPY32 control register 0
MPY32CTL0
2Ch
70
Detailed Description
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MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
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SLAS645J – JULY 2009 – REVISED APRIL 2015
Table 6-36. DMA Registers (Base Address DMA General Control: 0500h,
DMA Channel 0: 0510h, DMA Channel 1: 0520h, DMA Channel 2: 0530h)
REGISTER DESCRIPTION
REGISTER
OFFSET
DMA channel 0 control
DMA0CTL
00h
DMA channel 0 source address low
DMA0SAL
02h
DMA channel 0 source address high
DMA0SAH
04h
DMA channel 0 destination address low
DMA0DAL
06h
DMA channel 0 destination address high
DMA0DAH
08h
DMA channel 0 transfer size
DMA0SZ
0Ah
DMA channel 1 control
DMA1CTL
00h
DMA channel 1 source address low
DMA1SAL
02h
DMA channel 1 source address high
DMA1SAH
04h
DMA channel 1 destination address low
DMA1DAL
06h
DMA channel 1 destination address high
DMA1DAH
08h
DMA channel 1 transfer size
DMA1SZ
0Ah
DMA channel 2 control
DMA2CTL
00h
DMA channel 2 source address low
DMA2SAL
02h
DMA channel 2 source address high
DMA2SAH
04h
DMA channel 2 destination address low
DMA2DAL
06h
DMA channel 2 destination address high
DMA2DAH
08h
DMA channel 2 transfer size
DMA2SZ
0Ah
DMA module control 0
DMACTL0
00h
DMA module control 1
DMACTL1
02h
DMA module control 2
DMACTL2
04h
DMA module control 3
DMACTL3
06h
DMA module control 4
DMACTL4
08h
DMA interrupt vector
DMAIV
0Ah
Table 6-37. USCI_A0 Registers (Base Address: 05C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI control 1
UCA0CTL1
00h
USCI control 0
UCA0CTL0
01h
USCI baud rate 0
UCA0BR0
06h
USCI baud rate 1
UCA0BR1
07h
USCI modulation control
UCA0MCTL
08h
USCI status
UCA0STAT
0Ah
USCI receive buffer
UCA0RXBUF
0Ch
USCI transmit buffer
UCA0TXBUF
0Eh
USCI LIN control
UCA0ABCTL
10h
USCI IrDA transmit control
UCA0IRTCTL
12h
USCI IrDA receive control
UCA0IRRCTL
13h
USCI interrupt enable
UCA0IE
1Ch
USCI interrupt flags
UCA0IFG
1Dh
USCI interrupt vector word
UCA0IV
1Eh
Detailed Description
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Table 6-38. USCI_B0 Registers (Base Address: 05E0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI synchronous control 1
UCB0CTL1
00h
USCI synchronous control 0
UCB0CTL0
01h
USCI synchronous bit rate 0
UCB0BR0
06h
USCI synchronous bit rate 1
UCB0BR1
07h
USCI synchronous status
UCB0STAT
0Ah
USCI synchronous receive buffer
UCB0RXBUF
0Ch
USCI synchronous transmit buffer
UCB0TXBUF
0Eh
USCI I2C own address
UCB0I2COA
10h
USCI I2C slave address
UCB0I2CSA
12h
USCI interrupt enable
UCB0IE
1Ch
USCI interrupt flags
UCB0IFG
1Dh
USCI interrupt vector word
UCB0IV
1Eh
Table 6-39. USCI_A1 Registers (Base Address: 0600h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI control 1
UCA1CTL1
00h
USCI control 0
UCA1CTL0
01h
USCI baud rate 0
UCA1BR0
06h
USCI baud rate 1
UCA1BR1
07h
USCI modulation control
UCA1MCTL
08h
USCI status
UCA1STAT
0Ah
USCI receive buffer
UCA1RXBUF
0Ch
USCI transmit buffer
UCA1TXBUF
0Eh
USCI LIN control
UCA1ABCTL
10h
USCI IrDA transmit control
UCA1IRTCTL
12h
USCI IrDA receive control
UCA1IRRCTL
13h
USCI interrupt enable
UCA1IE
1Ch
USCI interrupt flags
UCA1IFG
1Dh
USCI interrupt vector word
UCA1IV
1Eh
Table 6-40. USCI_B1 Registers (Base Address: 0620h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI synchronous control 1
UCB1CTL1
00h
USCI synchronous control 0
UCB1CTL0
01h
USCI synchronous bit rate 0
UCB1BR0
06h
USCI synchronous bit rate 1
UCB1BR1
07h
USCI synchronous status
UCB1STAT
0Ah
USCI synchronous receive buffer
UCB1RXBUF
0Ch
USCI synchronous transmit buffer
UCB1TXBUF
0Eh
USCI I2C own address
UCB1I2COA
10h
USCI I2C slave address
UCB1I2CSA
12h
USCI interrupt enable
UCB1IE
1Ch
USCI interrupt flags
UCB1IFG
1Dh
USCI interrupt vector word
UCB1IV
1Eh
72
Detailed Description
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MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
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SLAS645J – JULY 2009 – REVISED APRIL 2015
Table 6-41. ADC10_A Registers (Base Address: 0740h)
REGISTER DESCRIPTION
REGISTER
OFFSET
ADC10_A Control register 0
ADC10CTL0
00h
ADC10_A Control register 1
ADC10CTL1
02h
ADC10_A Control register 2
ADC10CTL2
04h
ADC10_A Window Comparator Low Threshold
ADC10LO
06h
ADC10_A Window Comparator High Threshold
ADC10HI
08h
ADC10_A Memory Control Register 0
ADC10MCTL0
0Ah
ADC10_A Conversion Memory Register
ADC10MEM0
12h
ADC10_A Interrupt Enable
ADC10IE
1Ah
ADC10_A Interrupt Flags
ADC10IGH
1Ch
ADC10_A Interrupt Vector Word
ADC10IV
1Eh
Table 6-42. Comparator_B Registers (Base Address: 08C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Comp_B control register 0
CBCTL0
00h
Comp_B control register 1
CBCTL1
02h
Comp_B control register 2
CBCTL2
04h
Comp_B control register 3
CBCTL3
06h
Comp_B interrupt register
CBINT
0Ch
Comp_B interrupt vector word
CBIV
0Eh
Table 6-43. USB Configuration Registers (Base Address: 0900h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USB key/ID
USBKEYID
00h
USB module configuration
USBCNF
02h
USB PHY control
USBPHYCTL
04h
USB power control
USBPWRCTL
08h
USB PLL control
USBPLLCTL
10h
USB PLL divider
USBPLLDIV
12h
USB PLL interrupts
USBPLLIR
14h
Detailed Description
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Table 6-44. USB Control Registers (Base Address: 0920h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Input endpoint#0 configuration
IEPCNF_0
00h
Input endpoint #0 byte count
IEPCNT_0
01h
Output endpoint#0 configuration
OEPCNF_0
02h
Output endpoint #0 byte count
OEPCNT_0
03h
Input endpoint interrupt enables
IEPIE
0Eh
Output endpoint interrupt enables
OEPIE
0Fh
Input endpoint interrupt flags
IEPIFG
10h
Output endpoint interrupt flags
OEPIFG
11h
USB interrupt vector
USBIV
12h
USB maintenance
MAINT
16h
Time stamp
TSREG
18h
USB frame number
USBFN
1Ah
USB control
USBCTL
1Ch
USB interrupt enables
USBIE
1Dh
USB interrupt flags
USBIFG
1Eh
Function address
FUNADR
1Fh
74
Detailed Description
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MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
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SLAS645J – JULY 2009 – REVISED APRIL 2015
6.11 Input/Output Schematics
6.11.1 Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
Pad Logic
P1REN.x
P1DIR.x
0
From module
1
P1OUT.x
0
From module
1
0
DVCC
1
1
Direction
0: Input
1: Output
P1DS.x
0: Low drive
1: High drive
P1SEL.x
P1IN.x
EN
To module
DVSS
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
D
P1IE.x
EN
P1IRQ.x
Q
P1IFG.x
P1SEL.x
P1IES.x
Set
Interrupt
Edge
Select
Detailed Description
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SLAS645J – JULY 2009 – REVISED APRIL 2015
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Table 6-45. Port P1 (P1.0 to P1.7) Pin Functions
PIN NAME (P1.x)
P1.0/TA0CLK/ACLK
x
0
FUNCTION
P1DIR.x
P1SEL.x
P1.0 (I/O)
I: 0; O: 1
0
TA0CLK
0
1
ACLK
P1.1/TA0.0
1
P1.1 (I/O)
TA0.CCI0A
TA0.0
P1.2/TA0.1
2
P1.2 (I/O)
TA0.CCI1A
TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
76
Detailed Description
3
4
5
6
7
CONTROL BITS OR SIGNALS
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
TA0.CCI2A
0
1
TA0.2
1
1
P1.3 (I/O)
P1.4 (I/O)
I: 0; O: 1
0
TA0.CCI3A
0
1
TA0.3
1
1
P1.5 (I/O)
I: 0; O: 1
0
TA0.CCI4A
0
1
TA0.4
1
1
P1.6 (I/O)
I: 0; O: 1
0
TA1CLK
0
1
CBOUT comparator B
1
1
I: 0; O: 1
0
TA1.CCI0A
0
1
TA1.0
1
1
P1.7 (I/O)
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MSP430F5510, MSP430F5509, MSP430F5508
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MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
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6.11.2 Port P2, P2.0 to P2.7, Input/Output With Schmitt Trigger
Pad Logic
P2REN.x
P2DIR.x
0
From module
1
P2OUT.x
0
From module
1
0
DVCC
1
1
Direction
0: Input
1: Output
P2DS.x
0: Low drive
1: High drive
P2SEL.x
P2IN.x
EN
To module
DVSS
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UB0STE/UCA0CLK
D
P2IE.x
EN
To module
Q
P2IFG.x
P2SEL.x
P2IES.x
Set
Interrupt
Edge
Select
Detailed Description
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SLAS645J – JULY 2009 – REVISED APRIL 2015
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Table 6-46. Port P2 (P2.0 to P2.7) Pin Functions
PIN NAME (P2.x)
P2.0/TA1.1
x
0
FUNCTION
P2.0 (I/O)
TA1.CCI1A
TA1.1
P2.1/TA1.2
1
P2.1 (I/O)
TA1.CCI2A
TA1.2
P2.2/TA2CLK/SMCLK
2
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UCB0STE/UCA0CLK
3
4
5
6
7
78
P2SEL.x
0
0
1
1
1
I: 0; O: 1
0
0
1
1
1
I: 0; O: 1
0
TA2CLK
0
1
1
1
I: 0; O: 1
0
TA2.CCI0A
0
1
TA2.0
1
1
P2.3 (I/O)
P2.4 (I/O)
I: 0; O: 1
0
TA2.CCI1A
0
1
TA2.1
1
1
P2.5 (I/O)
I: 0; O: 1
0
TA2.CCI2A
0
1
TA2.2
1
1
P2.6 (I/O)
I: 0; O: 1
0
DMAE0
0
1
RTCCLK
1
1
P2.7 (I/O)
I: 0; O: 1
0
X
1
UCB0STE/UCA0CLK
(1)
(2)
(3)
P2DIR.x
I: 0; O: 1
P2.2 (I/O)
SMCLK
P2.3/TA2.0
CONTROL BITS OR SIGNALS (1)
(2) (3)
X = Don't care
The pin direction is controlled by the USCI module.
UCA0CLK function takes precedence over UCB0STE function. If the pin is required as UCA0CLK input or output, USCI_B0 is forced to
3-wire SPI mode if 4-wire SPI mode is selected.
Detailed Description
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MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
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SLAS645J – JULY 2009 – REVISED APRIL 2015
6.11.3 Port P3, P3.0 to P3.4, Input/Output With Schmitt Trigger
Pad Logic
P3REN.x
P3DIR.x
0
From module
1
P3OUT.x
0
From module
1
DVSS
0
DVCC
1
1
Direction
0: Input
1: Output
P3DS.x
0: Low drive
1: High drive
P3SEL.x
P3IN.x
P3.0/UCB0SIMO/UCB0SDA
P3.1/UCB0SOMI/UCB0SCL
P3.2/UCB0CLK/UCA0STE
P3.3/UCA0TXD/UCA0SIMO
P3.4/UCA0RXD/UCA0SOMI
EN
To module
D
Table 6-47. Port P3 (P3.0 to P3.7) Pin Functions
PIN NAME (P3.x)
x
P3.0/UCB0SIMO/UCB0SDA
0
FUNCTION
P3.0 (I/O)
UCB0SIMO/UCB0SDA (2)
P3.1/UCB0SOMI/UCB0SCL
1
P3.1 (I/O)
UCB0SOMI/UCB0SCL
P3.2/UCB0CLK/UCA0STE
2
(2) (3)
P3.2 (I/O)
UCB0CLK/UCA0STE (2)
P3.3/UCA0TXD/UCA0SIMO
3
4
(4)
P3.3 (I/O)
UCA0TXD/UCA0SIMO
P3.4/UCA0RXD/UCA0SOMI
(2)
P3.4 (I/O)
UCA0RXD/UCA0SOMI (2)
(1)
(2)
(3)
(4)
(3)
CONTROL BITS OR SIGNALS (1)
P3DIR.x
P3SEL.x
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
X = Don't care
The pin direction is controlled by the USCI module.
If the I2C functionality is selected, the output drives only the logical 0 to VSS level.
UCB0CLK function takes precedence over UCA0STE function. If the pin is required as UCB0CLK input or output, USCI_A0 is forced to
3-wire SPI mode if 4-wire SPI mode is selected.
Detailed Description
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6.11.4 Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger
Pad Logic
P4REN.x
P4DIR.x
0
from Port Mapping Control
1
P4OUT.x
0
from Port Mapping Control
1
DVSS
0
DVCC
1
1
Direction
0: Input
1: Output
P4.0/P4MAP0
P4.1/P4MAP1
P4.2/P4MAP2
P4.3/P4MAP3
P4.4/P4MAP4
P4.5/P4MAP5
P4.6/P4MAP6
P4.7/P4MAP7
P4DS.x
0: Low drive
1: High drive
P4SEL.x
P4IN.x
EN
D
to Port Mapping Control
Table 6-48. Port P4 (P4.0 to P4.7) Pin Functions
PIN NAME (P4.x)
P4.0/P4MAP0
x
0
FUNCTION
P4.0 (I/O)
Mapped secondary digital function
P4.1/P4MAP1
1
P4.1 (I/O)
Mapped secondary digital function
P4.2/P4MAP2
2
P4.3/P4MAP3
3
P4.2 (I/O)
Mapped secondary digital function
P4.3 (I/O)
Mapped secondary digital function
P4.4/P4MAP4
4
P4.4 (I/O)
Mapped secondary digital function
P4.5/P4MAP5
5
P4.5 (I/O)
Mapped secondary digital function
P4.6/P4MAP6
6
P4.6 (I/O)
Mapped secondary digital function
P4.7/P4MAP7
7
P4.7 (I/O)
Mapped secondary digital function
(1)
80
CONTROL BITS OR SIGNALS
P4DIR.x (1)
P4SEL.x
I: 0; O: 1
0
X
X
1
≤ 30
I: 0; O: 1
0
X
X
1
≤ 30
I: 0; O: 1
0
X
≤ 30
P4MAPx
X
1
I: 0; O: 1
0
X
X
1
≤ 30
I: 0; O: 1
0
X
X
1
≤ 30
I: 0; O: 1
0
X
X
1
≤ 30
I: 0; O: 1
0
X
X
1
≤ 30
I: 0; O: 1
0
X
X
1
≤ 30
The direction of some mapped secondary functions are controlled directly by the module. See Table 6-7 for specific direction control
information of mapped secondary functions.
Detailed Description
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SLAS645J – JULY 2009 – REVISED APRIL 2015
6.11.5 Port P5, P5.0 and P5.1, Input/Output With Schmitt Trigger
Pad Logic
to/from Reference
to ADC10
INCHx = x
P5REN.x
P5DIR.x
DVSS
0
DVCC
1
1
0
1
P5OUT.x
0
From module
1
P5.0/(A8/VeREF+)
P5.1/(A9/VeREF–)
P5DS.x
0: Low drive
1: High drive
P5SEL.x
P5IN.x
Bus
Keeper
EN
To module
D
Table 6-49. Port P5 (P5.0 and P5.1) Pin Functions
PIN NAME (P5.x)
P5.0/A8/VeREF+
(2)
x
0
FUNCTION
P5.0 (I/O)
(3)
A8/VeREF+ (4)
P5.1/A9/VeREF– (5)
1
P5.1 (I/O) (3)
A9/VeREF–
(1)
(2)
(3)
(4)
(5)
(6)
(6)
CONTROL BITS OR SIGNALS (1)
P5DIR.x
P5SEL.x
I: 0; O: 1
0
X
1
I: 0; O: 1
0
X
1
X = Don't care
VeREF+ available on devices with ADC10_A.
Default condition
Setting the P5SEL.0 bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying analog
signals. An external voltage can be applied to VeREF+ and used as the reference for the ADC10_A when available.
VeREF- available on devices with ADC10_A.
Setting the P5SEL.1 bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying analog
signals. An external voltage can be applied to VeREF- and used as the reference for the ADC10_A when available.
Detailed Description
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6.11.6 Port P5, P5.2, Input/Output With Schmitt Trigger
Pad Logic
To XT2
P5REN.2
P5DIR.2
DVSS
0
DVCC
1
1
0
1
P5OUT.2
0
Module X OUT
1
P5DS.2
0: Low drive
1: High drive
P5SEL.2
P5.2/XT2IN
P5IN.2
EN
Module X IN
82
Detailed Description
Bus
Keeper
D
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MSP430F5510, MSP430F5509, MSP430F5508
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MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
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SLAS645J – JULY 2009 – REVISED APRIL 2015
6.11.7 Port P5, P5.3, Input/Output With Schmitt Trigger
Pad Logic
To XT2
P5REN.3
P5DIR.3
DVSS
0
DVCC
1
1
0
1
P5OUT.3
0
Module X OUT
1
P5.3/XT2OUT
P5DS.3
0: Low drive
1: High drive
P5SEL.2
XT2BYPASS
P5SEL.3
P5IN.3
Bus
Keeper
EN
Module X IN
D
Table 6-50. Port P5 (P5.2, P5.3) Pin Functions
PIN NAME (P5.x)
P5.2/XT2IN
x
2
FUNCTION
P5DIR.x
P5SEL.2
P5SEL.3
XT2BYPASS
I: 0; O: 1
0
X
X
X
1
X
0
X
1
X
1
I: 0; O: 1
0
0
X
XT2OUT crystal mode (3)
X
1
X
0
P5.3 (I/O) (3)
X
1
0
1
P5.2 (I/O)
XT2IN crystal mode
(2)
XT2IN bypass mode (2)
P5.3/XT2OUT
(1)
(2)
(3)
3
CONTROL BITS OR SIGNALS (1)
P5.3 (I/O)
X = Don't care
Setting P5SEL.2 causes the general-purpose I/O to be disabled. Pending the setting of XT2BYPASS, P5.2 is configured for crystal
mode or bypass mode.
Setting P5SEL.2 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P5.3 can be used as
general-purpose I/O.
Detailed Description
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6.11.8 Port P5, P5.4 and P5.5 Input/Output With Schmitt Trigger
Pad Logic
to XT1
P5REN.4
P5DIR.4
DVSS
0
DVCC
1
1
0
1
P5OUT.4
0
Module X OUT
1
P5DS.4
0: Low drive
1: High drive
P5SEL.4
P5.4/XIN
P5IN.4
EN
Module X IN
84
Detailed Description
Bus
Keeper
D
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MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
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SLAS645J – JULY 2009 – REVISED APRIL 2015
Pad Logic
to XT1
P5REN.5
P5DIR.5
0
DVSS
0
DVCC
1
1
1
P5OUT.5
0
Module X OUT
1
P5.5/XOUT
P5DS.5
0: Low drive
1: High drive
P5SEL.4
XT1BYPASS
P5SEL.5
P5IN.5
Bus
Keeper
EN
Module X IN
D
Table 6-51. Port P5 (P5.4 and P5.5) Pin Functions
PIN NAME (P7.x)
P5.4/XIN
4
P5.5/XOUT
(1)
(2)
(3)
x
5
FUNCTION
CONTROL BITS OR SIGNALS (1)
P5DIR.x
P5SEL.4
P5SEL.5
XT1BYPASS
I: 0; O: 1
0
X
X
XIN crystal mode (2)
X
1
X
0
XIN bypass mode (2)
X
1
X
1
P5.4 (I/O)
P5.5 (I/O)
I: 0; O: 1
0
0
X
XOUT crystal mode (3)
X
1
X
0
P5.5 (I/O) (3)
X
1
0
1
X = Don't care
Setting P5SEL.4 causes the general-purpose I/O to be disabled. Pending the setting of XT1BYPASS, P5.4 is configured for crystal
mode or bypass mode.
Setting P5SEL.4 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P5.5 can be used as
general-purpose I/O.
Detailed Description
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6.11.9 Port P6, P6.0 to P6.7, Input/Output With Schmitt Trigger
Pad Logic
to ADC10
INCHx = x
to Comparator_B
from Comparator_B
CBPD.x
P6REN.x
P6DIR.x
0
0
From module
1
0
DVCC
1
P6DS.x
0: Low drive
1: High drive
P6SEL.x
P6IN.x
EN
To module
86
Detailed Description
1
Direction
0: Input
1: Output
1
P6OUT.x
DVSS
D
Bus
Keeper
P6.0/CB0/(A0)
P6.1/CB1/(A1)
P6.2/CB2/(A2)
P6.3/CB3/(A3)
P6.4/CB4/(A4)
P6.5/CB5/(A5)
P6.6/CB6/(A6)
P6.7/CB7/(A7)
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MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
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SLAS645J – JULY 2009 – REVISED APRIL 2015
Table 6-52. Port P6 (P6.0 to P6.7) Pin Functions
PIN NAME (P6.x)
P6.0/CB0/(A0)
x
0
FUNCTION
P6.0 (I/O)
A0 (only on devices with ADC)
CB0 (1)
P6.1/CB1/(A1)
1
P6.1 (I/O)
A1 (only on devices with ADC)
CB1 (1)
P6.2/CB2/(A2)
2
P6.2 (I/O)
A2 (only on devices with ADC)
CB2 (1)
P6.3/CB3/(A3)
P6.4/CB4/(A4)
P6.5/CB5/(A5)
P6.6/CB6/(A6)
3
4
5
6
(1)
0
CBPD
0
X
1
X
1
X
X
I: 0; O: 1
0
0
X
1
X
1
X
X
I: 0; O: 1
0
0
X
1
X
1
X
X
0
0
A3 (only on devices with ADC)
X
1
X
CB3 (1)
X
X
1
P6.4 (I/O)
I: 0; O: 1
0
0
A4 (only on devices with ADC)
X
1
X
CB4 (1)
X
X
1
P6.5 (I/O)
I: 0; O: 1
0
0
A5 (only on devices with ADC)
X
1
X
CB5 (1)
X
X
1
I: 0; O: 1
0
0
X
1
X
X
X
1
I: 0; O: 1
0
0
P6.6 (I/O)
CB6 (1)
7
P6SEL.x
I: 0; O: 1
I: 0; O: 1
P6.3 (I/O)
A6 (only on devices with ADC)
P6.7/CB7/(A7)
CONTROL BITS OR SIGNALS
P6DIR.x
P6.7 (I/O)
A7 (only on devices with ADC)
X
1
X
CB7 (1)
X
X
1
Setting the CBPD.x bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying analog
signals. Selecting the CBx input pin to the comparator multiplexer with the CBx bits automatically disables output driver and input buffer
for that pin, regardless of the state of the associated CBPD.x bit.
Detailed Description
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SLAS645J – JULY 2009 – REVISED APRIL 2015
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6.11.10 Port PU.0/DP, PU.1/DM, PUR USB Ports
PUSEL
PUOPE
USB output enable
PUOUT0
USB DP output
VUSB
VSSU
Pad Logic
0
1
0
PU.0/
DP
1
PUIN0
USB DP input
PUIPE
.
PUIN1
USB DM input
PUOUT1
0
USB DM output
1
PU.1/
DM
VUSB
VSSU
Pad Logic
PUREN
“1”
PUR
PUSEL
PURIN
88
Detailed Description
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MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
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SLAS645J – JULY 2009 – REVISED APRIL 2015
Table 6-53. Port PU.0/DP, PU.1/DM Output Functions (1)
CONTROL BITS
(1)
(2)
PIN NAME
PUSEL
PUOPE
PUOUT1
PUOUT0
PU.1/DM
PU.0/DP
0
0
X
X
Output disabled
Output disabled
0
1
0
0
Output low
Output low
0
1
0
1
Output low
Output high
0
1
1
0
Output high
Output low
0
1
1
1
Output high
Output high
1
X
X
X
DM (2)
DP (2)
PU.1/DM and PU.0/DP inputs and outputs are supplied from VUSB. VUSB can be generated by the device using the integrated 3.3-V
LDO when enabled. VUSB can also be supplied externally when the 3.3-V LDO is not being used and is disabled.
Output state set by the USB module.
Table 6-54. Port PU.0/DP, PU.1/DM Input Functions (1)
CONTROL BITS
(1)
PIN NAME
PUSEL
PUIPE
PU.1/DM
PU.0/DP
0
0
Input disabled
Input disabled
0
1
Input enabled
Input enabled
1
X
DM input
DP input
PU.1/DM and PU.0/DP inputs and outputs are supplied from VUSB. VUSB can be generated by the
device using the integrated 3.3-V LDO when enabled. VUSB can also be supplied externally when the
3.3-V LDO is not being used and is disabled.
Table 6-55. Port PUR Input Functions
CONTROL BITS
FUNCTION
PUSEL
PUREN
0
0
Input disabled
Pullup disabled
0
1
Input disabled
Pullup enabled
1
0
Input enabled
Pullup disabled
1
1
Input enabled
Pullup enabled
Detailed Description
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6.11.11 Port J, J.0 JTAG pin TDO, Input/Output With Schmitt Trigger or Output
Pad Logic
PJREN.0
PJDIR.0
0
DVCC
1
PJOUT.0
0
From JTAG
1
DVSS
0
DVCC
1
1
PJ.0/TDO
PJDS.0
0: Low drive
1: High drive
From JTAG
PJIN.0
EN
D
6.11.12 Port J, J.1 to J.3 JTAG pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt
Trigger or Output
Pad Logic
PJREN.x
PJDIR.x
0
DVSS
1
PJOUT.x
0
From JTAG
1
DVSS
0
DVCC
1
PJDS.x
0: Low drive
1: High drive
From JTAG
1
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
PJIN.x
EN
To JTAG
90
Detailed Description
D
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MSP430F5510, MSP430F5509, MSP430F5508
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MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
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Table 6-56. Port PJ (PJ.0 to PJ.3) Pin Functions
PIN NAME (PJ.x)
x
FUNCTION
CONTROL BITS OR
SIGNALS (1)
PJDIR.x
PJ.0/TDO
0
PJ.0 (I/O) (2)
I: 0; O: 1
TDO (3)
PJ.1/TDI/TCLK
1
X
PJ.1 (I/O) (2)
TDI/TCLK (3)
PJ.2/TMS
2
PJ.2 (I/O)
TMS (3)
PJ.3/TCK
3
(4)
(2)
(4)
PJ.3 (I/O) (2)
TCK (3)
(1)
(2)
(3)
(4)
I: 0; O: 1
(4)
X
I: 0; O: 1
X
I: 0; O: 1
X
X = Don't care
Default condition
The pin direction is controlled by the JTAG module.
In JTAG mode, pullups are activated automatically on TMS, TCK, and TDI/TCLK. PJREN.x are do not care.
Detailed Description
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MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
SLAS645J – JULY 2009 – REVISED APRIL 2015
www.ti.com
6.12 Device Descriptors
Table 6-57 lists the complete contents of the device descriptor tag-length-value (TLV) structure for each
device type.
Table 6-57. F5504 to F5510 Device Descriptor Table
Info Block
Die Record
ADC10
Calibration
REF
Calibration
Peripheral
Descriptor
(1)
92
(1)
F5510
RGC,
ZQE
F5510
RGZ,
PT
F5509
RGC,
ZQE
F5509
RGZ,
PT
F5508
RGC,
ZQE
F5508
RGZ,
PT
F5507
F5506
F5505
F5504
VALUE
VALUE
VALUE
VALUE
VALUE
VALUE
VALUE
VALUE
VALUE
VALUE
06h
06h
06h
06h
06h
06h
06h
06h
06h
06h
1
06h
06h
06h
06h
06h
06h
06h
06h
06h
06h
01A02h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Device ID
01A04h
1
31h
31h
3Ah
3Ah
39h
39h
38h
37h
36h
35h
Device ID
01A05h
1
80h
80h
80h
80h
80h
80h
80h
80h
80h
80h
Hardware revision
01A06h
1
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Firmware revision
01A07h
1
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Die Record Tag
01A08h
1
08h
08h
08h
08h
08h
08h
08h
08h
08h
08h
Die Record length
01A09h
1
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
DESCRIPTION
ADDRESS
SIZE
(bytes)
Info length
01A00h
1
CRC length
01A01h
CRC value
Lot/Wafer ID
01A0Ah
4
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Die X position
01A0Eh
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Die Y position
01A10h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Test results
01A12h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC10 Calibration
Tag
01A14h
1
13h
13h
13h
13h
13h
13h
13h
13h
13h
13h
ADC10 Calibration
length
01A15h
1
10h
10h
10h
10h
10h
10h
10h
10h
10h
10h
ADC Gain Factor
01A16h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC Offset
01A18h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 1.5-V Reference
Temp. Sensor 30°C
01A1Ah
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 1.5-V Reference
Temp. Sensor 85°C
01A1Ch
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 2.0-V Reference
Temp. Sensor 30°C
01A1Eh
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 2.0-V Reference
Temp. Sensor 85°C
01A20h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 2.5-V Reference
Temp. Sensor 30°C
01A22h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
ADC 2.5-V Reference
Temp. Sensor 85°C
01A24h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
REF Calibration Tag
01A26h
1
12h
12h
12h
12h
12h
12h
12h
12h
12h
12h
REF Calibration length
01A27h
1
06h
06h
06h
06h
06h
06h
06h
06h
06h
06h
REF 1.5-V Reference
Factor
01A28h
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
REF 2.0-V Reference
Factor
01A2Ah
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
REF 2.5-V Reference
Factor
01A2Ch
2
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
per unit
Peripheral Descriptor
Tag
01A2Eh
1
02h
02h
02h
02h
02h
02h
02h
02h
02h
02h
Peripheral Descriptor
Length
01A2Fh
1
61h
61h
62h
62h
61h
61h
5Dh
5Eh
5Dh
5Dh
Memory 1
2
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
Memory 2
2
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
N/A = Not applicable
Detailed Description
Copyright © 2009–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505
MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
www.ti.com
SLAS645J – JULY 2009 – REVISED APRIL 2015
Table 6-57. F5504 to F5510 Device Descriptor Table (1) (continued)
DESCRIPTION
ADDRESS
SIZE
(bytes)
F5510
RGC,
ZQE
F5510
RGZ,
PT
F5509
RGC,
ZQE
F5509
RGZ,
PT
F5508
RGC,
ZQE
F5508
RGZ,
PT
F5507
F5506
F5505
F5504
VALUE
VALUE
VALUE
VALUE
VALUE
VALUE
VALUE
VALUE
VALUE
VALUE
0Eh
2Ah
0Eh
2Ah
00Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
Memory 3
2
0Eh
2Ah
Memory 4
2
12h
2Ch
12h
2Ch
12h
2Ch
12h
2Ch
12h
2Ch
12h
2Ch
12h
2Ch
12h
2Ch
12h
2Ch
12h
2Ch
Memory 5
2
40h
92h
40h
92h
50h
91h
50h
91h
60h
90h
60h
90h
40h
92h
50h
91h
60h
90h
70h
8Eh
N/A
Memory 6
N/A
N/A
8Eh
8Eh
N/A
N/A
N/A
8Eh
N/A
delimiter
1
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
Peripheral count
1
20h
20h
20h
20h
20h
20h
1Eh
1Eh
1Eh
1Eh
MSP430CPUXV2
2
00h
23h
00h
23h
00h
23h
00h
23h
00h
23h
00h
23h
00h
23h
00h
23h
00h
23h
00h
23h
JTAG
2
00h
09h
00h
09h
00h
09h
00h
09h
00h
09h
00h
09h
00h
09h
00h
09h
00h
09h
00h
09h
SBW
2
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
EEM-S
2
00h
03h
00h
03h
00h
03h
00h
03h
00h
03h
00h
03h
00h
03h
00h
03h
00h
03h
00h
03h
TI BSL
2
00h
FCh
00h
FCh
00h
FCh
00h
FCh
00h
FCh
00h
FCh
00h
FCh
00h
FCh
00h
FCh
00h
FCh
SFR
2
10h
41h
10h
41h
10h
41h
10h
41h
10h
41h
10h
41h
10h
41h
10h
41h
10h
41h
10h
41h
PMM
2
02h
30h
02h
30h
02h
30h
02h
30h
02h
30h
02h
30h
02h
30h
02h
30h
02h
30h
02h
30h
FCTL
2
02h
38h
02h
38h
02h
38h
02h
38h
02h
38h
02h
38h
02h
38h
02h
38h
02h
38h
02h
38h
CRC16
2
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
CRC16_RB
2
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
RAMCTL
2
00h
44h
00h
44h
00h
44h
00h
44h
00h
44h
00h
44h
00h
44h
00h
44h
00h
44h
00h
44h
WDT_A
2
00h
40h
00h
40h
00h
40h
00h
40h
00h
40h
00h
40h
00h
40h
00h
40h
00h
40h
00h
40h
UCS
2
01h
48h
01h
48h
01h
48h
01h
48h
01h
48h
01h
48h
01h
48h
01h
48h
01h
48h
01h
48h
SYS
2
02h
42h
02h
42h
02h
42h
02h
42h
02h
42h
02h
42h
02h
42h
02h
42h
02h
42h
02h
42h
REF
2
03h
A0h
03h
A0h
03h
A0h
03h
A0h
03h
A0h
03h
A0h
03h
A0h
03h
A0h
03h
A0h
03h
A0h
Port Mapping
2
01h
10h
01h
10h
01h
10h
01h
10h
01h
10h
01h
10h
01h
10h
01h
10h
01h
10h
01h
10h
Port 1/2
2
04h
51h
04h
51h
04h
51h
04h
51h
04h
51h
04h
51h
04h
51h
04h
51h
04h
51h
04h
51h
Port 3/4
2
02h
52h
02h
52h
02h
52h
02h
52h
02h
52h
02h
52h
02h
52h
02h
52h
02h
52h
02h
52h
Port 5/6
2
02h
53h
02h
53h
02h
53h
02h
53h
02h
53h
02h
53h
02h
53h
02h
53h
02h
53h
02h
53h
JTAG
2
0Eh
5Fh
0Eh
5Fh
0Eh
5Fh
0Eh
5Fh
0Eh
5Fh
0Eh
5Fh
0Eh
5Fh
0Eh
5Fh
0Eh
5Fh
0Eh
5Fh
TA0
2
02h
62h
02h
62h
02h
62h
02h
62h
02h
62h
02h
62h
02h
62h
02h
62h
02h
62h
02h
62h
TA1
2
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
TB0
2
04h
67h
04h
67h
04h
67h
04h
67h
04h
67h
04h
67h
04h
67h
04h
67h
04h
67h
04h
67h
TA2
2
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
04h
61h
RTC
2
0Ah
68h
0Ah
68h
0Ah
68h
0Ah
68h
0Ah
68h
0Ah
68h
0Ah
68h
0Ah
68h
0Ah
68h
0Ah
68h
Detailed Description
Submit Documentation Feedback
Product Folder Links: MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505
MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
Copyright © 2009–2015, Texas Instruments Incorporated
93
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
SLAS645J – JULY 2009 – REVISED APRIL 2015
www.ti.com
Table 6-57. F5504 to F5510 Device Descriptor Table (1) (continued)
DESCRIPTION
Interrupts
94
ADDRESS
SIZE
(bytes)
F5510
RGC,
ZQE
F5510
RGZ,
PT
F5509
RGC,
ZQE
F5509
RGZ,
PT
F5508
RGC,
ZQE
F5508
RGZ,
PT
F5507
F5506
F5505
F5504
VALUE
VALUE
VALUE
VALUE
VALUE
VALUE
VALUE
VALUE
VALUE
VALUE
02h
85h
02h
85h
02h
85h
02h
85h
02h
85h
02h
85h
02h
85h
02h
85h
02h
85h
MPY32
2
02h
85h
DMA-3
2
04h
47h
04h
47h
04h
47h
04h
47h
04h
47h
04h
47h
04h
47h
04h
47h
04h
47h
04h
47h
USCI_A/B
2
0Ch
90h
0Ch
90h
0Ch
90h
0Ch
90h
0Ch
90h
0Ch
90h
10h
90h
10h
90h
10h
90h
10h
90h
USCI_A/B
2
04h
90h
04h
90h
04h
90h
04h
90h
04h
90h
04h
90h
N/A
N/A
N/A
N/A
ADC10_A
2
14h
D3h
14h
D3h
14h
D3h
14h
D3h
14h
D3h
14h
D3h
14h
D3h
14h
D3h
14h
D3h
14h
D3h
COMP_B
2
18h
A8h
18h
A8h
18h
A8h
18h
A8h
18h
A8h
18h
A8h
N/A
N/A
N/A
N/A
USB
2
04h
98h
04h
98h
04h
98h
04h
98h
04h
98h
04h
98h
1Ch
98h
1Ch
98h
1Ch
98h
1Ch
98h
COMP_B
1
A8h
A8h
A8h
A8h
A8h
A8h
01h
01h
01h
01h
TB0.CCIFG0
1
64h
64h
64h
64h
64h
64h
64h
64h
64h
64h
TB0.CCIFG1..6
1
65h
65h
65h
65h
65h
65h
65h
65h
65h
65h
WDTIFG
1
40h
40h
40h
40h
40h
40h
40h
40h
40h
40h
USCI_A0
1
90h
90h
90h
90h
90h
90h
01h
01h
01h
01h
USCI_B0
1
91h
91h
91h
91h
91h
91h
01h
01h
01h
01h
ADC10_A
1
D0h
D0h
D0h
D0h
D0h
D0h
D0h
D0h
D0h
D0h
TA0.CCIFG0
1
60h
60h
60h
60h
60h
60h
60h
60h
60h
60h
TA0.CCIFG1..4
1
61h
61h
61h
61h
61h
61h
61h
61h
61h
61h
USB
1
98h
98h
98h
98h
98h
98h
98h
98h
98h
98h
DMA
1
46h
46h
46h
46h
46h
46h
46h
46h
46h
46h
TA1.CCIFG0
1
62h
62h
62h
62h
62h
62h
62h
62h
62h
62h
TA1.CCIFG1..2
1
63h
63h
63h
63h
63h
63h
63h
63h
63h
63h
P1
1
50h
50h
50h
50h
50h
50h
50h
50h
50h
50h
USCI_A1
1
92h
92h
92h
92h
92h
92h
92h
92h
92h
92h
USCI_B1
1
93h
93h
93h
93h
93h
93h
93h
93h
93h
93h
TA1.CCIFG0
1
66h
66h
66h
66h
66h
66h
66h
66h
66h
66h
TA1.CCIFG1..2
1
67h
67h
67h
67h
67h
67h
67h
67h
67h
67h
P2
1
51h
51h
51h
51h
51h
51h
51h
51h
51h
51h
RTC_A
1
68h
68h
68h
68h
68h
68h
68h
68h
68h
68h
delimiter
1
00h
00h
00h
00h
00h
00h
00h
00h
00h
00h
Detailed Description
Copyright © 2009–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505
MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
www.ti.com
SLAS645J – JULY 2009 – REVISED APRIL 2015
Table 6-58. F5500 to F5503 Device Descriptor Table (1)
Info Block
Die Record
ADDRESS
SIZE
(bytes)
F5503
F5502
F5501
F5500
VALUE
VALUE
VALUE
VALUE
06h
Info length
01A00h
1
06h
06h
06h
CRC length
01A01h
1
06h
06h
06h
06h
CRC value
01A02h
2
per unit
per unit
per unit
per unit
Device ID
01A04h
1
34h
33h
32h
3Bh
Device ID
01A05h
1
80h
80h
80h
80h
Hardware revision
01A06h
1
per unit
per unit
per unit
per unit
Firmware revision
01A07h
1
per unit
per unit
per unit
per unit
Die Record Tag
01A08h
1
08h
08h
08h
08h
Die Record length
01A09h
1
0Ah
0Ah
0Ah
0Ah
Lot/Wafer ID
01A0Ah
4
per unit
per unit
per unit
per unit
Die X position
01A0Eh
2
per unit
per unit
per unit
per unit
Die Y position
01A10h
2
per unit
per unit
per unit
per unit
Test results
01A12h
2
per unit
per unit
per unit
per unit
Empty Tag
01A14h
1
05h
05h
05h
05h
Empty Tag length
01A15h
1
10h
10h
10h
10h
REF Calibration Tag
01A26h
1
12h
12h
12h
12h
REF Calibration length
01A27h
1
06h
06h
06h
06h
REF 1.5-V Reference Factor
01A28h
2
per unit
per unit
per unit
per unit
REF 2.0-V Reference Factor
01A2Ah
2
per unit
per unit
per unit
per unit
REF 2.5-V Reference Factor
01A2Ch
2
per unit
per unit
per unit
per unit
Peripheral Descriptor Tag
01A2Eh
1
02h
02h
02h
02h
Peripheral Descriptor Length
01A2Fh
1
5Dh
5Eh
5Dh
5Dh
Memory 1
2
08h
8Ah
08h
8Ah
08h
8Ah
08h
8Ah
Memory 2
2
0Ch
86h
0Ch
86h
0Ch
86h
0Ch
86h
Memory 3
2
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
0Eh
2Ah
Memory 4
2
12h
2Ch
12h
2Ch
12h
2Ch
12h
2Ch
Memory 5
2
40h
92h
50h
91
60h
90h
70h
8Eh
Memory 6
1
N/A
8E
N/A
N/A
delimiter
1
00h
00h
00h
00h
Peripheral count
1
1Eh
1Eh
1Eh
1Eh
MSP430CPUXV2
2
00h
23h
00h
23h
00h
23h
00h
23h
JTAG
2
00h
09h
00h
09h
00h
09h
00h
09h
SBW
2
00h
0Fh
00h
0Fh
00h
0Fh
00h
0Fh
EEM-S
2
00h
03h
00h
03h
00h
03h
00h
03h
TI BSL
2
00h
FCh
00h
FCh
00h
FCh
00h
FCh
SFR
2
10h
41h
10h
41h
10h
41h
10h
41h
PMM
2
02h
30h
02h
30h
02h
30h
02h
30h
FCTL
2
02h
38h
02h
38h
02h
38h
02h
38h
CRC16
2
01h
3Ch
01h
3Ch
01h
3Ch
01h
3Ch
ADC10 Calibration
REF Calibration
Peripheral
Descriptor
(1)
DESCRIPTION
N/A = Not applicable
Detailed Description
Submit Documentation Feedback
Product Folder Links: MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505
MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
Copyright © 2009–2015, Texas Instruments Incorporated
95
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
SLAS645J – JULY 2009 – REVISED APRIL 2015
www.ti.com
Table 6-58. F5500 to F5503 Device Descriptor Table(1) (continued)
DESCRIPTION
Interrupts
96
Detailed Description
ADDRESS
SIZE
(bytes)
F5503
F5502
F5501
F5500
VALUE
VALUE
VALUE
VALUE
CRC16_RB
2
00h
3Dh
00h
3Dh
00h
3Dh
00h
3Dh
RAMCTL
2
00h
44h
00h
44h
00h
44h
00h
44h
WDT_A
2
00h
40h
00h
40h
00h
40h
00h
40h
UCS
2
01h
48h
01h
48h
01h
48h
01h
48h
SYS
2
02h
42h
02h
42h
02h
42h
02h
42h
REF
2
03h
A0h
03h
A0h
03h
A0h
03h
A0h
Port Mapping
2
01h
10h
01h
10h
01h
10h
01h
10h
Port 1/2
2
04h
51h
04h
51h
04h
51h
04h
51h
Port 3/4
2
02h
52h
02h
52h
02h
52h
02h
52h
Port 5/6
2
02h
53h
02h
53h
02h
53h
02h
53h
JTAG
2
0Eh
5Fh
0Eh
5Fh
0Eh
5Fh
0Eh
5Fh
TA0
2
02h
62h
02h
62h
02h
62h
02h
62h
TA1
2
04h
61h
04h
61h
04h
61h
04h
61h
TB0
2
04h
67h
04h
67h
04h
67h
04h
67h
TA2
2
04h
61h
04h
61h
04h
61h
04h
61h
RTC
2
0Ah
68h
0Ah
68h
0Ah
68h
0Ah
68h
MPY32
2
02h
85h
02h
85h
02h
85h
02h
85h
DMA-3
2
04h
47h
04h
47h
04h
47h
04h
47h
USCI_A/B
2
10h
90h
10h
90h
10h
90h
10h
90h
ADC10_A
2
N/A
N/A
N/A
N/A
COMP_B
2
2Ch
A8h
2Ch
A8h
2Ch
A8h
2Ch
A8h
USB
2
04h
98h
04h
98h
04h
98h
04h
98h
COMP_B
1
A8h
A8h
A8h
A8h
TB0.CCIFG0
1
64h
64h
64h
64h
TB0.CCIFG1..6
1
65h
65h
65h
65h
WDTIFG
1
40h
40h
40h
40h
USCI_A0
1
01h
01h
01h
01h
USCI_B0
1
01h
01h
01h
01h
ADC10_A
1
01h
01h
01h
01h
TA0.CCIFG0
1
60h
60h
60h
60h
TA0.CCIFG1..4
1
61h
61h
61h
61h
USB
1
98h
98h
98h
98h
DMA
1
46h
46h
46h
46h
TA1.CCIFG0
1
62h
62h
62h
62h
TA1.CCIFG1..2
1
63h
63h
63h
63h
P1
1
50h
50h
50h
50h
Copyright © 2009–2015, Texas Instruments Incorporated
Submit Documentation Feedback
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MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
www.ti.com
SLAS645J – JULY 2009 – REVISED APRIL 2015
Table 6-58. F5500 to F5503 Device Descriptor Table(1) (continued)
SIZE
(bytes)
F5503
F5502
F5501
F5500
VALUE
VALUE
VALUE
VALUE
USCI_A1
1
92h
92h
92h
92h
USCI_B1
1
93h
93h
93h
93h
TA1.CCIFG0
1
66h
66h
66h
66h
TA1.CCIFG1..2
1
67h
67h
67h
67h
P2
1
51h
51h
51h
51h
RTC_A
1
68h
68h
68h
68h
delimiter
1
00h
00h
00h
00h
DESCRIPTION
ADDRESS
Detailed Description
Submit Documentation Feedback
Product Folder Links: MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505
MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
Copyright © 2009–2015, Texas Instruments Incorporated
97
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
SLAS645J – JULY 2009 – REVISED APRIL 2015
www.ti.com
7 Device and Documentation Support
7.1
Device Support
7.1.1
Getting Started
For an introduction to the MSP430™ family of devices and the tools and libraries that are available to help
with your development, visit the Getting Started page.
7.1.2
Development Tools Support
All MSP430™ microcontrollers are supported by a wide variety of software and hardware development
tools. Tools are available from TI and various third parties. See them all at www.ti.com/msp430tools.
7.1.2.1
Hardware Features
See the Code Composer Studio for MSP430 User's Guide (SLAU157) for details on the available features.
MSP430
Architecture
4-Wire
JTAG
2-Wire
JTAG
Breakpoints
(N)
Range
Breakpoints
Clock
Control
State
Sequencer
Trace
Buffer
LPMx.5
Debugging
Support
MSP430Xv2
Yes
Yes
3
Yes
Yes
No
No
No
7.1.2.2
Recommended Hardware Options
7.1.2.2.1 Target Socket Boards
The target socket boards allow easy programming and debugging of the device using JTAG. They also
feature header pin outs for prototyping. Target socket boards are orderable individually or as a kit with the
JTAG programmer and debugger included. The following table shows the compatible target boards and
the supported packages.
Package
Target Board and Programmer Bundle
Target Board Only
64-pin VQFN (RGC)
MSP-FET430U64USB
MSP-TS430RGC64USB
7.1.2.2.2 Experimenter Boards
Experimenter Boards and Evaluation kits are available for some MSP430 devices. These kits feature
additional hardware components and connectivity for full system evaluation and prototyping. See
www.ti.com/msp430tools for details.
7.1.2.2.3 Debugging and Programming Tools
Hardware programming and debugging tools are available from TI and from its third party suppliers. See
the full list of available tools at www.ti.com/msp430tools.
7.1.2.2.4 Production Programmers
The production programmers expedite loading firmware to devices by programming several devices
simultaneously.
Part Number
PC Port
MSP-GANG
Serial and USB
7.1.2.3
Features
Provider
Program up to eight devices at a time. Works with PC or standalone.
Texas Instruments
Recommended Software Options
7.1.2.3.1 Integrated Development Environments
Software development tools are available from TI or from third parties. Open source solutions are also
available.
This device is supported by Code Composer Studio™ IDE (CCS).
98
Device and Documentation Support
Copyright © 2009–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505
MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
www.ti.com
SLAS645J – JULY 2009 – REVISED APRIL 2015
7.1.2.3.2 MSP430Ware
MSP430Ware is a collection of code examples, data sheets, and other design resources for all MSP430
devices delivered in a convenient package. In addition to providing a complete collection of existing
MSP430 design resources, MSP430Ware also includes a high-level API called MSP430 Driver Library.
This library makes it easy to program MSP430 hardware. MSP430Ware is available as a component of
CCS or as a standalone package.
7.1.2.3.3 MSP430 USB Developer's Package
MSP430 USB Developer's Package is an easy-to-use USB stack implementation for the MSP430
microcontrollers.
7.1.2.3.4 Command-Line Programmer
MSP430 Flasher is an open-source, shell-based interface for programming MSP430 microcontrollers
through a FET programmer or eZ430 using JTAG or Spy-Bi-Wire (SBW) communication. MSP430 Flasher
can be used to download binary files (.txt or .hex) files directly to the MSP430 microcontroller without the
need for an IDE.
7.1.3
Device and Development Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
MSP430 MCU devices and support tools. Each MSP430 MCU commercial family member has one of
three prefixes: MSP, PMS, or XMS (for example, MSP430F5438A). TI recommends two of three possible
prefix designators for its support tools: MSP and MSPX. These prefixes represent evolutionary stages of
product development from engineering prototypes (with XMS for devices and MSPX for tools) through fully
qualified production devices and tools (with MSP for devices and MSP for tools).
Device development evolutionary flow:
XMS – Experimental device that is not necessarily representative of the electrical specifications for the
final device
PMS – Final silicon die that conforms to the electrical specifications for the device but has not completed
quality and reliability verification
MSP – Fully qualified production device
Support tool development evolutionary flow:
MSPX – Development-support product that has not yet completed TI's internal qualification testing.
MSP – Fully-qualified development-support product
XMS and PMS devices and MSPX development-support tools are shipped against the following
disclaimer:
"Developmental product is intended for internal evaluation purposes."
MSP devices and MSP development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (XMS and PMS) have a greater failure rate than the standard
production devices. TI recommends that these devices not be used in any production system because
their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, PZP) and temperature range (for example, T). Figure 7-1 provides a legend
for reading the complete device name for any family member.
Device and Documentation Support
Submit Documentation Feedback
Product Folder Links: MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505
MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
Copyright © 2009–2015, Texas Instruments Incorporated
99
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
SLAS645J – JULY 2009 – REVISED APRIL 2015
www.ti.com
MSP 430 F 5 438 A I ZQW T XX
Processor Family
Optional: Additional Features
430 MCU Platform
Optional: Tape and Reel
Device Type
Packaging
Series
Feature Set
Processor Family
430 MCU Platform
Optional: Temperature Range
Optional: A = Revision
CC = Embedded RF Radio
MSP = Mixed-Signal Processor
XMS = Experimental Silicon
PMS = Prototype Device
TI’s Low-Power Microcontroller Platform
Device Type
Memory Type
C = ROM
F = Flash
FR = FRAM
G = Flash or FRAM (Value Line)
L = No Nonvolatile Memory
Specialized Application
AFE = Analog Front End
BT = Preprogrammed with Bluetooth
BQ = Contactless Power
CG = ROM Medical
FE = Flash Energy Meter
FG = Flash Medical
FW = Flash Electronic Flow Meter
Series
1 Series = Up to 8 MHz
2 Series = Up to 16 MHz
3 Series = Legacy
4 Series = Up to 16 MHz with LCD
5 Series = Up to 25 MHz
6 Series = Up to 25 MHz with LCD
0 = Low-Voltage Series
Feature Set
Various Levels of Integration Within a Series
Optional: A = Revision
N/A
Optional: Temperature Range S = 0°C to 50°C
C = 0°C to 70°C
I = –40°C to 85°C
T = –40°C to 105°C
Packaging
http://www.ti.com/packaging
Optional: Tape and Reel
T = Small Reel
R = Large Reel
No Markings = Tube or Tray
Optional: Additional Features -EP = Enhanced Product (–40°C to 105°C)
-HT = Extreme Temperature Parts (–55°C to 150°C)
-Q1 = Automotive Q100 Qualified
Figure 7-1. Device Nomenclature
100
Device and Documentation Support
Copyright © 2009–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505
MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
www.ti.com
7.2
SLAS645J – JULY 2009 – REVISED APRIL 2015
Documentation Support
The following documents describe the MSP430F5310 and MSP430F530x devices. Copies of these
documents are available on the Internet at www.ti.com.
7.3
SLAU208
MSP430x5xx and MSP430x6xx Family User's Guide. Detailed information on the modules
and peripherals available in this device family.
SLAZ301
MSP430F5510 Device Erratasheet. Describes the known exceptions to the functional
specifications for the MSP430F5510 device.
SLAZ300
MSP430F5509 Device Erratasheet. Describes the known exceptions to the functional
specifications for the MSP430F5509 device.
SLAZ299
MSP430F5508 Device Erratasheet. Describes the known exceptions to the functional
specifications for the MSP430F5508 device.
SLAZ298
MSP430F5507 Device Erratasheet. Describes the known exceptions to the functional
specifications for the MSP430F5507 device.
SLAZ297
MSP430F5506 Device Erratasheet. Describes the known exceptions to the functional
specifications for the MSP430F5506 device.
SLAZ296
MSP430F5505 Device Erratasheet. Describes the known exceptions to the functional
specifications for the MSP430F5505 device.
SLAZ295
MSP430F5504 Device Erratasheet. Describes the known exceptions to the functional
specifications for the MSP430F5504 device.
SLAZ294
MSP430F5503 Device Erratasheet. Describes the known exceptions to the functional
specifications for the MSP430F5503 device.
SLAZ293
MSP430F5502 Device Erratasheet. Describes the known exceptions to the functional
specifications for the MSP430F5502 device.
SLAZ292
MSP430F5501 Device Erratasheet. Describes the known exceptions to the functional
specifications for the MSP430F5501 device.
SLAZ291
MSP430F5500 Device Erratasheet. Describes the known exceptions to the functional
specifications for the MSP430F5500 device.
Related Links
Table 7-1 lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 7-1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
MSP430F5510
Click here
Click here
Click here
Click here
Click here
MSP430F5509
Click here
Click here
Click here
Click here
Click here
MSP430F5508
Click here
Click here
Click here
Click here
Click here
MSP430F5507
Click here
Click here
Click here
Click here
Click here
MSP430F5506
Click here
Click here
Click here
Click here
Click here
MSP430F5505
Click here
Click here
Click here
Click here
Click here
MSP430F5504
Click here
Click here
Click here
Click here
Click here
MSP430F5503
Click here
Click here
Click here
Click here
Click here
MSP430F5502
Click here
Click here
Click here
Click here
Click here
MSP430F5501
Click here
Click here
Click here
Click here
Click here
MSP430F5500
Click here
Click here
Click here
Click here
Click here
Device and Documentation Support
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MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
Copyright © 2009–2015, Texas Instruments Incorporated
101
MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
SLAS645J – JULY 2009 – REVISED APRIL 2015
7.4
www.ti.com
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Community
TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At
e2e.ti.com, you can ask questions, share knowledge, explore ideas, and help solve problems with fellow
engineers.
TI Embedded Processors Wiki
Texas Instruments Embedded Processors Wiki. Established to help developers get started with embedded
processors from Texas Instruments and to foster innovation and growth of general knowledge about the
hardware and software surrounding these devices.
7.5
Trademarks
MSP430, Code Composer Studio, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
7.6
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
7.7
Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from disclosing party under
nondisclosure obligations (if any), or any direct product of such technology, to any destination to which
such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior
authorization from U.S. Department of Commerce and other competent Government authorities to the
extent required by those laws.
7.8
Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
8 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
102
Mechanical, Packaging, and Orderable Information
Copyright © 2009–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505
MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500
PACKAGE OPTION ADDENDUM
www.ti.com
17-Feb-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MSP430F5500IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5500
MSP430F5500IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5500
MSP430F5501IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5501
MSP430F5501IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5501
MSP430F5502IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5502
MSP430F5502IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5502
MSP430F5503IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5503
MSP430F5503IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5503
MSP430F5504IPT
ACTIVE
LQFP
PT
48
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5504
MSP430F5504IPTR
ACTIVE
LQFP
PT
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5504
MSP430F5504IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5504
MSP430F5504IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5504
MSP430F5505IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5505
MSP430F5505IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5505
MSP430F5506IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5506
MSP430F5506IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5506
MSP430F5507IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5507
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
17-Feb-2015
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MSP430F5507IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5507
MSP430F5508IPT
ACTIVE
LQFP
PT
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5508
MSP430F5508IPTR
ACTIVE
LQFP
PT
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5508
MSP430F5508IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5508
MSP430F5508IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5508
MSP430F5508IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5508
MSP430F5508IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5508
MSP430F5508IZQE
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
360
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5508
MSP430F5508IZQER
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5508
MSP430F5509IPT
ACTIVE
LQFP
PT
48
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5509
MSP430F5509IPTR
ACTIVE
LQFP
PT
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5509
MSP430F5509IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5509
MSP430F5509IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5509
MSP430F5509IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5509
MSP430F5509IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5509
MSP430F5509IZQE
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
360
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5509
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
17-Feb-2015
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MSP430F5509IZQER
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5509
MSP430F5510IPT
ACTIVE
LQFP
PT
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5510
MSP430F5510IPTR
ACTIVE
LQFP
PT
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5510
MSP430F5510IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5510
MSP430F5510IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430F5510
MSP430F5510IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5510
MSP430F5510IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
M430
F5510
MSP430F5510IZQE
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
360
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5510
MSP430F5510IZQER
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQE
80
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
M430F5510
XMS430F5510IRGCR
OBSOLETE
VQFN
RGC
64
TBD
Call TI
Call TI
-40 to 85
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Feb-2015
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Jul-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
MSP430F5500IRGZT
VQFN
RGZ
48
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
MSP430F5501IRGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
MSP430F5502IRGZR
VQFN
RGZ
48
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
MSP430F5502IRGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
MSP430F5503IRGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
MSP430F5504IPTR
LQFP
PT
48
1000
330.0
16.4
9.6
9.6
1.9
12.0
16.0
Q2
MSP430F5504IRGZR
VQFN
RGZ
48
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
MSP430F5504IRGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
MSP430F5505IRGZR
VQFN
RGZ
48
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
MSP430F5505IRGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
MSP430F5506IRGZR
VQFN
RGZ
48
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
MSP430F5506IRGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
MSP430F5507IRGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
MSP430F5508IPTR
LQFP
PT
48
1000
330.0
16.4
9.6
9.6
1.9
12.0
16.0
Q2
MSP430F5508IRGCR
VQFN
RGC
64
2000
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
MSP430F5508IRGCT
VQFN
RGC
64
250
180.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
MSP430F5508IRGZR
VQFN
RGZ
48
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
MSP430F5508IRGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Jul-2015
Device
MSP430F5508IZQER
Package Package Pins
Type Drawing
BGA MI
CROSTA
R JUNI
OR
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
ZQE
80
2500
330.0
12.4
5.3
5.3
1.5
8.0
12.0
Q1
MSP430F5509IPTR
LQFP
PT
48
1000
330.0
16.4
9.6
9.6
1.9
12.0
16.0
Q2
MSP430F5509IRGCR
VQFN
RGC
64
2000
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
MSP430F5509IRGCT
VQFN
RGC
64
250
180.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
MSP430F5509IRGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
ZQE
80
2500
330.0
12.4
5.3
5.3
1.5
8.0
12.0
Q1
MSP430F5509IZQER
BGA MI
CROSTA
R JUNI
OR
MSP430F5510IPTR
LQFP
PT
48
1000
330.0
16.4
9.6
9.6
1.9
12.0
16.0
Q2
MSP430F5510IRGCR
VQFN
RGC
64
2000
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
MSP430F5510IRGCT
VQFN
RGC
64
250
180.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
MSP430F5510IRGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
ZQE
80
2500
330.0
12.4
5.3
5.3
1.5
8.0
12.0
Q1
MSP430F5510IZQER
BGA MI
CROSTA
R JUNI
OR
*All dimensions are nominal
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Jul-2015
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MSP430F5500IRGZT
VQFN
RGZ
48
250
210.0
185.0
35.0
MSP430F5501IRGZT
VQFN
RGZ
48
250
210.0
185.0
35.0
MSP430F5502IRGZR
VQFN
RGZ
48
2500
367.0
367.0
38.0
MSP430F5502IRGZT
VQFN
RGZ
48
250
210.0
185.0
35.0
MSP430F5503IRGZT
VQFN
RGZ
48
250
210.0
185.0
35.0
MSP430F5504IPTR
LQFP
PT
48
1000
367.0
367.0
38.0
MSP430F5504IRGZR
VQFN
RGZ
48
2500
367.0
367.0
38.0
MSP430F5504IRGZT
VQFN
RGZ
48
250
210.0
185.0
35.0
MSP430F5505IRGZR
VQFN
RGZ
48
2500
367.0
367.0
38.0
MSP430F5505IRGZT
VQFN
RGZ
48
250
210.0
185.0
35.0
MSP430F5506IRGZR
VQFN
RGZ
48
2500
367.0
367.0
38.0
MSP430F5506IRGZT
VQFN
RGZ
48
250
210.0
185.0
35.0
MSP430F5507IRGZT
VQFN
RGZ
48
250
210.0
185.0
35.0
MSP430F5508IPTR
LQFP
PT
48
1000
367.0
367.0
38.0
MSP430F5508IRGCR
VQFN
RGC
64
2000
367.0
367.0
38.0
MSP430F5508IRGCT
VQFN
RGC
64
250
210.0
185.0
35.0
MSP430F5508IRGZR
VQFN
RGZ
48
2500
367.0
367.0
38.0
MSP430F5508IRGZT
VQFN
RGZ
48
250
210.0
185.0
35.0
MSP430F5508IZQER
BGA MICROSTAR
JUNIOR
ZQE
80
2500
338.1
338.1
20.6
MSP430F5509IPTR
LQFP
PT
48
1000
367.0
367.0
38.0
MSP430F5509IRGCR
VQFN
RGC
64
2000
367.0
367.0
38.0
MSP430F5509IRGCT
VQFN
RGC
64
250
210.0
185.0
35.0
MSP430F5509IRGZT
VQFN
RGZ
48
250
210.0
185.0
35.0
MSP430F5509IZQER
BGA MICROSTAR
JUNIOR
ZQE
80
2500
338.1
338.1
20.6
MSP430F5510IPTR
LQFP
PT
48
1000
367.0
367.0
38.0
MSP430F5510IRGCR
VQFN
RGC
64
2000
367.0
367.0
38.0
MSP430F5510IRGCT
VQFN
RGC
64
250
210.0
185.0
35.0
MSP430F5510IRGZT
VQFN
RGZ
48
250
210.0
185.0
35.0
MSP430F5510IZQER
BGA MICROSTAR
JUNIOR
ZQE
80
2500
338.1
338.1
20.6
Pack Materials-Page 3
MECHANICAL DATA
MTQF003A – OCTOBER 1994 – REVISED DECEMBER 1996
PT (S-PQFP-G48)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
36
0,08 M
25
37
24
48
13
0,13 NOM
1
12
5,50 TYP
7,20
SQ
6,80
9,20
SQ
8,80
Gage Plane
0,25
0,05 MIN
1,45
1,35
Seating Plane
1,60 MAX
0°– 7°
0,75
0,45
0,10
4040052 / C 11/96
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Falls within JEDEC MS-026
This may also be a thermally enhanced plastic package with leads conected to the die pads.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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www.ti.com/audio
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www.ti.com/computers
DLP® Products
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RFID
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www.ti.com/omap
TI E2E Community
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