TI CC1010-RTR1 Single chip very low power rf transceiver with 8051-compatible microcontroller Datasheet

CC1010
CC1010
Single Chip Very Low Power RF Transceiver with
8051-Compatible Microcontroller
Applications
• Very low power UHF wireless data
transmitters and receivers
• 315 / 433 / 868 and 915 MHz ISM/SRD
band systems
• Home automation and security
• AMR – Automatic Meter Reading
• RKE – Remote Keyless Entry with
acknowledgement
• Low power telemetry
• Toys
Product Description
The CC1010 is a true single-chip UHF
transceiver with an integrated high
performance 8051 microcontroller with 32
kB of Flash program memory. The RF
transceiver can be programmed for
operation in the 300 – 1000 MHz range,
and is designed for very low power
wireless applications.
The CC1010 together with a few external
passive
components
constitutes
a
powerful embedded system with wireless
communication capabilities.
CC1010 is based on Chipcon’s SmartRF®02
technology in 0.35 µm CMOS.
Key Features
• 300-1000 MHz RF Transceiver
• Very low current consumption (9.1
mA in RX)
• High sensitivity (typically -107 dBm)
• Programmable output power up to
+10 dBm
• Data rate up to 76.8 kbps
• Very few external components
• Fast PLL settling allowing frequency
hopping protocols
• RSSI
• EN 300 220 and FCC CFR47 part
15 compliant
• 8051-Compatible Microcontroller
• Typically 2.5 times the performance
of a standard 8051
• 32 kB Flash, 2048 + 128 Byte SRAM
• 3 channel 10 bit ADC, 4 timers / 2
PWMs, 2 UARTs, RTC, Watchdog,
SPI, DES encryption, 26 general I/O
pins
• In-circuit interactive debugging is
supported for the Keil µVision2 IDE
through a simple serial interface.
• 2.7 - 3.6 V supply voltage
• 64-lead TQFP
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CC1010
Table Of Contents
1.
FEATURES..................................................................................................................... 4
2.
ABSOLUTE MAXIMUM RATINGS ................................................................................ 5
3.
RECOMMENDED OPERATING CONDITIONS............................................................. 5
4.
DC CHARACTERISTICS ............................................................................................... 6
5.
ELECTRICAL SPECIFICATIONS.................................................................................. 7
6.
ADC ................................................................................................................................ 8
7.
RF SECTION, GENERAL .............................................................................................. 8
8.
RF TRANSMIT SECTION .............................................................................................. 9
9.
RF RECEIVE SECTION ............................................................................................... 10
10.
IF SECTION.................................................................................................................. 11
11.
FREQUENCY SYNTHESIZER SECTION.................................................................... 12
12.
PIN CONFIGURATION ................................................................................................ 13
13.
PIN DESCRIPTION ...................................................................................................... 15
14.
BLOCK DIAGRAM....................................................................................................... 18
15.
8051 CORE .................................................................................................................. 19
15.1
GENERAL DESCRIPTION ............................................................................................ 19
15.2
RESET..................................................................................................................... 19
15.3
MEMORY MAP ......................................................................................................... 20
15.4
CPU REGISTERS ..................................................................................................... 23
15.5
INSTRUCTION SET SUMMARY .................................................................................... 24
15.6
INTERRUPTS ............................................................................................................ 28
15.7
EXTERNAL INTERRUPTS ............................................................................................ 32
15.8
MAIN CRYSTAL OSCILLATOR..................................................................................... 32
15.9
POWER AND CLOCK MODES ..................................................................................... 34
15.10 FLASH PROGRAM MEMORY ...................................................................................... 37
15.11 SPI FLASH PROGRAMMING....................................................................................... 37
15.12 SERIAL PROGRAMMING ALGORITHM .......................................................................... 37
15.13 8051 FLASH PROGRAMMING .................................................................................... 42
15.14 FLASH POWER CONTROL ......................................................................................... 44
15.15 IN CIRCUIT DEBUGGING............................................................................................ 44
15.16 CHIP VERSION / REVISION ........................................................................................ 45
16.
8051 PERIPHERALS ................................................................................................... 47
16.1
GENERAL PURPOSE I/O ........................................................................................... 47
16.2
TIMER 0 / TIMER 1.................................................................................................... 52
16.3
TIMER 2 / 3 WITH PWM ............................................................................................ 59
16.4
POWER ON RESET (BROWN-OUT DETECTION) .......................................................... 62
16.5
WATCHDOG TIMER................................................................................................... 63
16.6
REAL-TIME CLOCK ................................................................................................... 65
16.7
SERIAL PORT 0 AND 1 .............................................................................................. 66
16.8
SPI MASTER ........................................................................................................... 71
16.9
DES ENCRYPTION / DECRYPTION ............................................................................. 75
16.10 RANDOM BIT GENERATION ....................................................................................... 78
16.11 ADC ....................................................................................................................... 79
17.
RF TRANSCEIVER ...................................................................................................... 83
17.1
GENERAL DESCRIPTION ............................................................................................ 83
17.2
RF TRANSCEIVER BLOCK DIAGRAM .......................................................................... 83
17.3
RF APPLICATION CIRCUIT ........................................................................................ 85
17.4
TRANSCEIVER CONFIGURATION OVERVIEW ............................................................... 88
17.5
RF TRANSCEIVER RX/TX CONTROL AND POWER MANAGEMENT ................................. 89
17.6
DATA MODEM AND DATA MODES .............................................................................. 91
17.7
BAUD RATES ............................................................................................................ 94
17.8
TRANSMITTING AND RECEIVING DATA ........................................................................ 95
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CC1010
17.9
DEMODULATION AND DATA DECISION ......................................................................... 97
17.10 SYNCHRONIZATION AND PREAMBLE DETECTION ....................................................... 102
17.11 RECEIVER SENSITIVITY VERSUS DATA RATE AND FREQUENCY SEPARATION ................ 105
17.12 FREQUENCY PROGRAMMING ................................................................................... 107
17.13 LOCK INDICATION ................................................................................................... 110
17.14 RECOMMENDED SETTINGS FOR ISM FREQUENCIES ................................................. 111
17.15 VCO ..................................................................................................................... 113
17.16 VCO AND PLL SELF-CALIBRATION .......................................................................... 113
17.17 VCO, LNA AND BUFFER CURRENT CONTROL ........................................................... 118
17.18 INPUT / OUTPUT MATCHING .................................................................................... 120
17.19 OUTPUT POWER PROGRAMMING ............................................................................ 123
17.20 RSSI OUTPUT ....................................................................................................... 126
17.21 IF OUTPUT ............................................................................................................. 127
17.22 OPTIONAL LC FILTER ............................................................................................. 128
18.
RESERVED REGISTERS AND TEST REGISTERS ................................................. 129
19.
SYSTEM CONSIDERATIONS AND GUIDELINES ................................................... 131
19.1
SRD REGULATIONS................................................................................................ 131
19.2
LOW COST SYSTEMS .............................................................................................. 131
19.3
BATTERY OPERATED SYSTEMS................................................................................ 131
19.4
NARROW-BAND SYSTEMS ....................................................................................... 131
19.5
HIGH RELIABILITY SYSTEMS .................................................................................... 131
19.6
FREQUENCY HOPPING SPREAD SPECTRUM SYSTEMS................................................ 132
19.7
SOFTWARE ............................................................................................................ 132
19.8
DEVELOPMENT TOOLS ............................................................................................ 132
19.9
PA “SPLATTERING”................................................................................................. 132
19.10 PCB LAYOUT RECOMMENDATIONS ......................................................................... 133
19.11 ANTENNA CONSIDERATIONS ................................................................................... 133
20.
PACKAGE DESCRIPTION (TQFP-64)...................................................................... 135
21.
SOLDERING INFORMATION .................................................................................... 136
22.
PACKAGE MARKING................................................................................................ 137
22.1
STANDARD LEADED ................................................................................................ 137
22.2
ROHS COMPLIANT PB-FREE ................................................................................... 137
23.
RECOMMENDED PCB FOOTPRINT ........................................................................ 138
24.
PACKAGE THERMAL COEFFICIENTS.................................................................... 138
25.
TRAY SPECIFICATION ............................................................................................. 139
26.
CARRIER TAPE AND REEL SPECIFICATION ........................................................ 139
27.
LIST OF ABBREVIATIONS ....................................................................................... 140
28.
SFR SUMMARY ......................................................................................................... 141
29.
ALPHABETIC REGISTER INDEX ............................................................................. 145
30.
ORDERING INFORMATION ...................................................................................... 148
31.
GENERAL INFORMATION........................................................................................ 149
31.1
DOCUMENT HISTORY ............................................................................................. 149
31.2
PRODUCT STATUS DEFINITIONS.............................................................................. 150
31.3
DISCLAIMER........................................................................................................... 150
31.4
TRADEMARKS ........................................................................................................ 150
31.5
LIFE SUPPORT POLICY ........................................................................................... 150
32.
ADDRESS INFORMATION........................................................................................ 152
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CC1010
1. Features
Fully Integrated UHF RF Transceiver
• Programmable frequency in the
range 300 – 1000 MHz
• High sensitivity (typically -107 dBm
at 2.4 kBaud)
• Programmable output power –20 to
+10 dBm
• Very low current consumption (RX:
9.1 mA)
• Very few external components
required and no external RF switch
or IF filter required
• Single port antenna connection
• Fast PLL settling allows frequency
hopping protocols
• FSK modulation with a data rate of
up to 76.8 kBaud
• Manchester or NRZ coding and
decoding of data performed in
hardware. Byte delineation of data
can be performed in hardware to
lessen the processor burden
• RSSI output which can be sampled
by on-chip ADC
• Complies with EN 300 220 and FCC
CFR47 part 15
High-Performance and Low-Power
8051-Compatible Microcontroller
• Optimised 8051-core which typically
gives 2.5x the performance of a
standard 8051
• Dual data pointers
• Idle and sleep modes
• In-circuit interactive debugging is
supported for the Keil µVision IDE
through a simple serial interface
Data and Non-volatile Program Memory
• 32 kB of non-volatile Flash memory
in-system programmable through a
simple SPI interface or by the 8051
core.
• Typical Flash memory endurance:
20 000 write/erase cycles
• Programmable read and write lock of
portions of Flash memory for software
security
• 2048 + 128 Byte of internal SRAM
Hardware DES Encryption / Decryption
• DES supported in hardware
• Output Feedback Mode or Cipher
Feedback Mode DES to avoid the
requirement that data length must
be a multiple of eight bytes
Peripheral Features
• Power On Reset / Brown-Out
Detection
• Three channel, max 23 kSample/s,
10 bit ADC
• Programmable watchdog timer.
• Real time clock with 32 kHz crystal
oscillator
• Two timers / pulse counters and two
timers / pulse width modulators
• Two programmable serial UARTs.
• Master SPI interface
• 26 configurable general-purpose
I/O-pins
• Random bit generator in hardware
Low Power
• 8051 core and peripherals can use
the RTC's 32 kHz clock
• Idle and sleep modes for reduced
power consumption. System can
wake up on interrupt or when ADC
input exceeds a set threshold
• Low-power fully static CMOS design
Operating Conditions
• 2.7 - 3.6 V supply voltage
• -40 - 85 °C operational temperature
• 3 - 24 MHz crystal (up to 50 ppm)
for the main crystal oscillator
Packaging
• 64-lead TQFP
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CC1010
2. Absolute Maximum Ratings
Under no circumstances must the absolute maximum ratings given in Table 1 be violated.
Stress exceeding one or more of the limiting values may cause permanent damage to the
device.
Parameter
Supply voltage, VDD
Voltage on any pin
Min.
-0.3
-0.3
Input RF level
Storage temperature range
Storage temperature range
-50
-40
Lead temperature
Max.
5.0
VDD+0.3,
max 5.0
10
150
125
Units
V
V
260
°C
dBm
°C
°C
Condition
Un-programmed device
Programmed device, data
retention > 0.49 years at
125°C
T = 10 s
Table 1. Absolute Maximum Ratings
Caution! ESD sensitive device.
Precaution should be used when handling
the device in order to prevent permanent
damage.
3. Recommended Operating Conditions
Tc = -40 to 85°C, VDD = 2.7 to 3.6 V if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
Supply voltage, DVDD, AVDD
2.7
3.3
3.6
V
Supply voltage during
normal operation
Supply voltage, DVDD, AVDD
2.7
3.6
V
Supply voltage during
program/erase Flash
memory
Operating temperature, free-air
-40
85
°C
Main oscillator frequency
3
24
MHz
RTC oscillator frequency
32768
Hz
Table 2. Recommended Operating Conditions
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CC1010
4. DC Characteristics
The DC Characteristics of CC1010 are listed in Table 3 below.
Tc = 25°C, VDD = 3.3 V if nothing else stated
Digital Inputs/Outputs
Min
Max
Unit
Condition
Logic "0" input voltage
0
0.3*VDD
V
Logic "1" input voltage
0.7*VDD
VDD
V
Logic "0" output voltage
0
0.4
V
Logic "1" output voltage
2.5
VDD
V
Logic "0" output voltage
0
0.4
V
Logic "1" output voltage
2.5
VDD
V
Logic "0" input current
NA
-1
µA
Output current -2.0 mA,
ports P0.3-P0.0, P1.7P1.0, P2.7-P2.4, P2.2P2.0
Output current 2.0mA,
ports P0.3-P0.0, P1.7P1.0, P2.7-P2.4, P2.2P2.0
Output current -8.0 mA,
port P2.3
Output current 8.0mA,
port P2.3
Input signal equals GND
Logic "1" input current
NA
1
µA
Input signal equals VDD
Table 3. DC Characteristics
Supply current [mA]
25
20
15
10
5
0
0
4
8
12
16
20
24
Frequency [MHz]
Figure 1. Typical CPU core supply current vs. clock frequency
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CC1010
5. Electrical Specifications
Tc = 25°C, VDD = 3.3 V if nothing else stated
All electrical specifications are measured on Chipcon’s CC1010EM reference design.
Parameter
Min.
Typ.
Max.
Unit
Condition
Power on reset (POR) voltage
2.7
2.9
3.1
V
Tc = -40 to 85°C
Brown out voltage
2.7
2.9
3.1
V
Tc = -40 to 85°C
RTC start-up time
160
ms
Current consumption MCU,
Active mode
14.8
1.3
mA
mA
14.7456 MHz, main oscillator
32 kHz, RTC oscillator
See page 33 for explanation
of modes. See Figure 1 page
6 for supply current vs. clock
frequency
Current consumption MCU, Idle
mode
12.8
29.4
mA
µA
14.7456 MHz, main oscillator
32 kHz, RTC oscillator
Current consumption, Power
Down mode
Current consumption, Poweron reset circuit (when enabled)
Current consumption Main
crystal oscillator
Current consumption RF
Transceiver, Receive mode,
433/868 MHz
0.2
1
µA
34
uA
67
µA
14.7456 MHz crystal
9.1/
11.9
mA
Current for RF transceiver
alone
Current consumption RF
Transceiver, Transmit mode,
433/868 MHz
P=0.01 mW (-20 dBm)
5.3/8.6
mA
P=0.3 mW (-5 dBm)
8.9/13.8
mA
P=1 mW (0 dBm)
10.4/17
mA
P=2.5 mW (4 dBm)
24.8/
23.5
mA
P=10 mW (10 dBm)
26.6/NA
mA
32 kHz oscillator crystal load
capacitance
12
pF
The output power is delivered
to a single-ended 50Ω load,
see also page 123. Current is
for RF transceiver alone
Table 4. Electrical specifications
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CC1010
6. ADC
Parameter
Min.
Typ.
Max.
Unit
Condition
Number of bits
10
bits
Differential Nonlinearity (DNL)
+/-0.2
LSB
VDD is reference voltage
Integral Nonlinearity (INL)
+/-1.3
LSB
VDD is reference voltage
Offset
3
LSB
7 Hz test tone
Total Harmonic Distortion
(THD)
59
dB
7 Hz test tone
SINAD
54
9
dB
bits
7 Hz test tone
Internal reference tolerance
± 10
%
Conversion time
44
Clock frequency
32
External reference voltage
Input voltage
µs
250
250
kHz
1.3
2.7
V
Vref
V
0
When ADC is operated at 250
kHz
250 kHz recommended for full
10-bit performance
External reference voltage
should never exceed 2.7 V. It
is recommended to use a
reference voltage close to 1.3
V to have the best possible
linearity.
Table 5. ADC characteristics
7. RF section, general
Parameter
Min.
RF Frequency Range
Data rate
Typ.
Max.
Unit
Condition
300
1000
MHz
Programmable in steps of
< 250 Hz
0.6
76.8
kBaud
NRZ or Manchester encoding.
76.8 kBaud equals 76.8 kbps
using NRZ coding. See page
94
Table 6 General RF characteristics
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CC1010
8. RF transmit section
Parameter
Min.
Typ.
Max.
Unit
Condition
Binary FSK frequency
separation
0
64
65
kHz
The frequency corresponding
to the digital "0" is denoted f0,
while f1 corresponds to a
digital "1".
The frequency separation is
f1-f0. The RF carrier
frequency, fc, is then given by
fc=(f0+f1)/2.
(The frequency deviation is
given by fd=+/-(f1-f0)/2 )
The frequency separation is
programmable in 250 Hz
steps. Separations up to 65
kHz are guaranteed at 1 MHz
reference frequency. Larger
separations can be achieved
at higher reference
frequencies
Output power
433 / 868 MHz
-20
0
10/4
dBm
Delivered to single-ended 50
Ω load.
The output power is
programmable, see page 123
Ω
Transmit mode, optimum load
impedance. For matching
details see “Input/ output
matching” p.120
RF output impedance
433 / 868 MHz
140/80
Harmonics
nd
2 harmonic, 433 / 868 MHz
3rd harmonic, 433 / 868 MHz
-7/-15
-27/-29
dBm
Conducted measur at
maximum output power. An
external LC filter should be
used to reduce harmonics
emission to comply with SRD
requirements. See p.128
Table 7. RF transmit characteristics
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CC1010
9. RF receive section
Parameter
Min.
Receiver Sensitivity,
433 / 868 MHz
Typ.
Max.
-107/
-106
Unit
Condition
dBm
2.4 kBaud, Manchester coded
data, 64 kHz frequency
separation, BER = 10-3
See Table 33 and Table
34page 105 for typical
sensitivity figures at other
data rates.
System noise bandwidth
30
kHz
Cascaded noise figure
433/868 MHz
12/13
dB
Saturation (maximum input
level)
10
2.4 kBaud, Manchester coded
data
dBm
2.4 kBaud, Manchester coded
-3
data, BER = 10
Input IP3
-1
-26
dBm
dBm
76.8 kBaud NRZ, BER = 10-3
From LNA to IF output
Blocking
40
dBc
At +/- 1 MHz
LO leakage
-57
dBm
Input impedance
Ω
Ω
Ω
Ω
90-j13
68-j24
36-j11
36-j13
Receive mode, series
equivalent
at 315 MHz
at 433 MHz
at 868 MHz
at 915 MHz
For matching details see
“Input/ output matching” p.
120.
Turn on time
11
128
Baud
The demodulator settling
time, which is programmable,
determines the turn-on time.
See page 97 for details.
Table 8. RF receive characteristics
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CC1010
10. IF section
Parameter
Min.
Intermediate frequency (IF)
433/868 MHz
Typ.
Max.
150/
130
10.7
IF bandwidth (noise bandwidth)
RSSI dynamic range
175
-105
Unit
Condition
kHz
Internal IF filter
MHz
External IF filter
kHz
-60
dBm
RSSI 3-dB bandwidth
RSSI accuracy
260
±6
kHz
dB
RSSI linearity
±2
dB
868 MHz CW, -70 dBm
See p. 126 for details
Table 9 IF characteristics
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CC1010
11. Frequency synthesizer section
Parameter
Min.
Crystal Oscillator Frequency
3
Typ.
Crystal frequency accuracy
requirement
± 50
± 25
Crystal operation
Parallel
Crystal load capacitance
12
12
12
12
20
16
16
12
Max.
Unit
Condition
24
MHz
Crystal frequency can be 3-4,
6-8 or 9-24 MHz.
Recommended frequencies
are 3.6864, 7.3728, 11.0592,
14.7456, 18.4320 and
22.1184 MHz. See page 32
for details
ppm
433 MHz
868 MHz
The crystal frequency
accuracy and drift (ageing
and temperature
dependency) will determine
the frequency accuracy of the
transmitted signal.
C171 and C181 are loading
capacitors
30
30
16
16
pF
pF
pF
pF
3-4 MHz, 20 pF recommended
6-8 MHz, 16 pF recommended
9-16 MHz, 16 pF recommended
16-24 MHz, 12 pF recommended
Crystal oscillator start-up time
5
1.5
2
ms
ms
ms
3.6864 MHz, 16 pF load
7.3728 MHz, 16 pF load
16 MHz, 16 pF load
Output signal phase noise
-85
dBc/Hz
At 100 kHz offset from carrier
PLL lock time (RX / TX turn
time)
200
µs
PLL turn-on time
250
µs
Table 10. Frequency synthesizer characteristics
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CC1010
DGND
DVDD
P0.2 (MISO)
P0.3
P1.5
P1.6
P1.7
P2.6
P2.7
PROG
RESET
DVDD
AD0
(Top view)
AD1
AD2 (RSSI/IF)
AGND
12. Pin Configuration
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
AVDD 1
48 P3.0 (RXD0)
47 P3.1 (TXD0)
46 P3.2 (INT0)
RF_IN 4
45 P2.5
RF_OUT 5
44 P2.4
CC1010
AVDD 2
AGND 3
AVDD 6
AGND 7
AGND 8
AGND 9
L1 10
L2 11
AVDD 12
CHP_OUT 13
43 DVDD
42 P2.3
41 DGND
40 DVDD
39 P2.2
38 P1.4
37 P1.3
36 P1.2
R_BIAS 14
35 P1.1
AVDD 15
34 P0.1 (MOSI)
AGND 16
33 P0.0 (SCK)
Pin
#
1
2
3
4
Pin name
DGND
(INT1) P3.3
(PWM2) P3.4
(PWM3) P3.5
(TXD1) P2.1
(RXD1) P2.0
P1.0
POR_E
DGND
AGND
DGND
XOSC32_Q1
XOSC32_Q2
XOSC_Q2
XOSC_Q1
AGND
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Pin type
Description
AVDD
AVDD
AGND
RF_IN
Alternate
function
-
Power (A)
Power (A)
Power (A)
RF input
5
6
7
8
9
10
RF_OUT
AVDD
AGND
AGND
AGND
L1
-
RF output
Power (A)
Power (A)
Power (A)
Power (A)
Analog
11
L2
-
Analog
12
AVDD
-
Power (A)
Power supply ADC
Power supply Mixer and IF
Ground connection Mixer and IF
RF signal input from antenna (external ACcoupling)
RF signal output to antenna
Power supply LNA and PA
Ground connection LNA and PA
Ground connection PA
Ground connection VCO and prescaler
Connection #1 for external VCO tank
inductor
Connection #2 for external VCO tank
inductor
Power supply VCO and prescaler
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CC1010
Pin
#
13
Pin name
Pin type
Description
CHP_OUT
Alternate
function
-
Analog output
14
R_BIAS
-
Analog
15
16
17
18
AVDD
AGND
AGND
XOSC_Q1
-
Power (A)
Power (A)
Power (A)
Analog input
19
20
-
Analog output
Analog output
-
Analog input
32 kHz crystal pin1 or external clock input
22
23
24
25
XOSC_Q2
XOSC32_Q
2
XOSC32_Q
1
AGND
DGND
DGND
POR_E
Charge pump current output when external
loop filter is used
Connection for external precision bias
resistor (82 kΩ, ± 1%)
Power supply misc. analog modules
Ground connection misc. analog modules
Analog ground connection
3-24 MHz crystal, pin 1 or external clock
input
3-24 MHz crystal, pin 2
32 kHz crystal pin2
-
Power (A)
Power (D)
Power (D)
Digital input
26
27
28
29
P1.0
P2.0
P2.1
P3.5
Digital high-Z I/O
Digital high-Z I/O
Digital high-Z I/O
Digital high-Z I/O
30
P3.4
RXD1 (I)
TXD1 (O)
PWM3 (O)
T1 (I)
PWM2 (O)
T0 (I)
31
P3.3
INT1 (I)
Digital high-Z I/O
32
33
DGND
P0.0
SCK (O)
SCK (I)
Power (D)
Digital high-Z I/O
34
P0.1
MO (O)
SI (I)
Digital high-Z I/O
35
36
37
38
39
P1.1
P1.2
P1.3
P1.4
P2.2
-
40
41
42
DVDD
DGND
P2.3
-
43
44
45
46
DVDD
P2.4
P2.5
P3.2
-
Digital high-Z I/O
Digital high-Z I/O
Digital high-Z I/O
Digital high-Z I/O
Digital high-Z I/O
(Schmitt trigger
input)
Power (D)
Power (D)
Digital high-Z I/O (8
mA)
Power (D)
Digital high-Z I/O
Digital high-Z I/O
Digital high-Z I/O
Analog ground connection
Digital ground connection
Digital ground connection
Power-on reset enable.
0: Disable internal power-on reset module
1: Enable internal power-on reset module
8051 port 1, bit 0
8051 port 2, bit 0 or RX of serial port 1
8051 port 2, bit 1 or TX of serial port 1
8051 port 3, bit 5 or pulse width modulator
3's output or Timer / Counter 1 external input
8051 port 3, bit 4 or pulse width modulator
2's output or Timer / Counter 0 external input
8051 port 3, bit 3 or interrupt 1 input
configurable as level or edge sensitive
Ground connection digital part
8051 port 0, bit 0 or SPI master interface
serial clock output or Flash programming
SPI slave clock input.
8051 port 0, bit 1 or SPI interface master
output or Flash programming SPI slave
serial data input
8051 port 1, bit 1
8051 port 1, bit 2
8051 port 1, bit 3
8051 port 1, bit 4
8051 port 2, bit 2
47
48
49
50
P3.1
P3.0
DGND
DVDD
TXD0 (O)
RXD0 (I)
-
21
INT0 (I)
Digital high-Z I/O
Digital high-Z I/O
Digital high-Z I/O
Power (D)
Power (D)
Digital power supply
Ground connection digital part
8051 port 2, bit 3
Digital power supply
8051 port 2, bit 4
8051 port 2, bit 5
8051 port 3, bit 2 or interrupt 0 input
configurable as level or edge sensitive
8051 port 3, bit 1 or TX of serial port 0
8051 port 3, bit 0 or RX of serial port 1
Digital ground connection
Digital power supply
SWRS047
Page 14 of 152
CC1010
Pin
#
51
Pin name
52
53
54
55
56
57
58
P0.3
P1.5
P1.6
P1.7
P2.6
P2.7
59
Alternate
function
MI (I)
SO (O)
Pin type
Description
Digital high-Z I/O
PROG
-
Digital high-Z I/O
Digital high-Z I/O
Digital high-Z I/O
Digital high-Z I/O
Digital high-Z I/O
Digital high-Z I/O
Digital input
8051 port 0, bit 2 or SPI interface master
input or Flash programming SPI slave serial
data output
8051 port 0, bit 3
8051 port 1, bit 5
8051 port 1, bit 6
8051 port 1, bit 7
8051 port 2, bit 6
8051 port 2, bit 7
Flash program enable pad, active low
RESET
-
Digital input (pull-up) System reset pin, active low
P0.2
60
61
62
63
DVDD
AD0
AD1
AD2
RSSI (O),
IF (O)
Power (D)
Analog input
Analog input
Analog input/output
64
AGND
-
Power (A)
Digital power supply
ADC input channel 0
ADC input channel 1
ADC input channel 2, RSSI (Receiver signal
strength indicator) output, or IF output when
using external demodulator
Analog ground connection ADC
A = Analog, D = Digital, I = input, O= Output
13. Pin description
AVDD, DVDD
Supply voltages for analog and digital
modules respectively. All supply pins
should be decoupled by capacitors. In
particular, the digital and analog supply
domains should be properly decoupled
from each other (a ferrite bead can be
used to prevent high-frequency noise from
coupling from one supply domain to
another). The placement and size of
decoupling capacitors and supply filtering
are critical with respect to LO leakage and
sensitivity. Chipcon’s reference layout
designs should be used (available from
Chipcon’s website). See also page 133 for
layout recommendations.
AGND, DGND
Ground for analog and digital modules
respectively. Normally one common
ground plane is recommended. If two
separate analog and digital grounds are
used they should be interconnected in one
place, and one place only.
RFIN
This is the RF input, internally connected
to the low noise amplifier (LNA). The
signal source (antenna) should be
matched to the input impedance. A DC
ground is needed for LNA biasing.
RFOUT
This is the RF output, internally connected
to the power amplifier (PA). The external
load (antenna) should be matched to the
output
impedance
(optimum
load
impedance). This pin must be DC coupled
to AVDD for PA biasing (open drain
output).
L1, L2
Connection to internal voltage controlled
oscillator (VCO). An inductor should be
connected between these pins. The
inductor value will determine the VCO
tuning range. The inductor should be place
very close to the pins in order to minimize
paracitic inductance.
CHP_OUT
Charge Pump output. If the RF transceiver
is configured for external loop filter this is
the current output from the charge pump.
Normally the internal loop filter should be
used and this pin should be left open (not
connected).
SWRS047
Page 15 of 152
CC1010
RBIAS
Current output from internal band gap cell
bias generator. A precision resistor (82
kΩ, ±1%) should be connected between
this pin and ground to set the correct bias
current level.
XOSC_Q1, XOSC_Q2
These are the main oscillator connection
pins. An external crystal should be
connected between these pins, and load
capacitors should be connected between
each pin and ground. If an external
oscillator is used, the clock signal should
be connected to the XOSC_Q1 pin, and
XOSC_Q2 should be left open (not
connected).
XOSC32_Q1, XOSC32_Q2
These are the real time clock (RTC)
oscillator connection pins. An external
crystal should be connected between
these pins, and load capacitors should be
connected between each pin and ground.
If an external oscillator is used, the clock
signal should be connected to the
XOSC32_Q1 pin, and XOSC32_Q2
should be left open (not connected).
POR_E
Enable signal for the on-chip power-on
reset module. The power-on reset is
enabled when POR_E is connected to
DVDD and disabled when connected to
DGND.
PROG
Active low Flash programming enable pin.
When this signal is active (driven to DGND)
a Flash programmer can be connected to
the SPI interface. Under normal operation
it must be driven to DVDD.
RESET
Active low asynchronous system reset. It
has an internal pull-up resistor and can be
left unconnected during normal operation.
AD0, AD1
Analog inputs to A/D converter channels 0
and 1 respectively. When not used these
pins can be left open (not connected).
AD2 (RSSI/IF)
Analog input to A/D converter channel 2.
This pin can also be configured to be RSSI
output or IF output. The pin is configured
by the FREND register. When not used this
pin can be left open (not connected).
PORT 0
Port 0 is a 4-bit (P0.3-P0.0) bi-directional
CMOS I/O port with 2 mA drivers. A
direction register (P0DIR) controls whether
each pin is an output or input and the
register P0 is used to read the input or
control the logical value of the output.
Pins P0.0 - P0.2 can be configured to
become a master SPI interface in register
SPCR and will then override P0(2:0),
P0DIR(2) and P0DIR(1).
Used as SPI interface, P0.0 is SCK,
P0.1 is MOSI, and P0.2 is MISO.
PORT 1
Port 1 is an 8-bit (P1.7-P1.0) bidirectional CMOS I/O port with 2 mA
drivers. A direction register (P1DIR)
controls whether each pin is an output or
input and the register P1 is used to read
the input or control the logical value of the
output.
PORT 2
Port 2 is an 8-bit (P2.7-P2.0) bidirectional CMOS I/O port with 2 mA
drivers, except for P2.3 that has an 8 mA
output buffer. A direction register (P2DIR)
controls whether each pin is an output or
input and the register P2 is used to read
the input or control the logical value of the
output.
Pins P2.0 and P2.1 can be configured to
become the RXD1 and TXD1 pin,
respectively, of UART 1.
Pin P2.2 has a Schmitt-trigger input
stage. Note that while this pin does have
hysteresis, it will draw a large input current
(~0.5 mA) if the input voltage is close to
VDD/2.
PORT 3
Port 3 is a 6-bit (P3.5-P3.0) bi-directional
CMOS I/O port with 2 mA drivers. A
direction register (P3DIR) controls whether
each pin is an output or input. The register
P3 is used to read the input or control the
logical value of the output.
SWRS047
Page 16 of 152
CC1010
Pins P3.0 and P3.1 can be configured to
become the RXD0 and TXD0 pin,
respectively, of UART 0.
Pins P3.2 and P3.3 are connected to the
external interrupt inputs INT0 and INT1 ,
respectively, and can cause interrupts if
the corresponding interrupt enable flags
are set in register IE. The interrupts inputs
can be configured to be either levelsensitive or edge-sensitive.
Pins P3.4 and P3.5 can be configured to
become the pulse width modulator (PWM)
outputs of Timer/PWM 2 and Timer/PWM
3, respectively. When pulse width
modulation is enabled the corresponding
bits in P3DIR and P3 are overridden.
SWRS047
Page 17 of 152
CC1010
14. Block Diagram
The CC1010 Block Diagram is shown in Figure 2 below.
Programmable I/O (General purpose or alternate function)
Port 0
Port 2
POR_E
Power-on
reset
RAM Arbiter
DES Module
FLASH
Programming DMA
Port 1
32 kB
FLASH
Port 3
Timers/
PWMs
128 byte
SRAM
8051 core
Timers/
Counters
Interrupt
Controller
Watchdog
Timer
Reset
Generation
RESET
2048 byte
SRAM
General
purpose I/O
PROG
UARTs
UARTs
SPI
Realtime
Clock
Special Function
Registers
(SFRs)
AD0
AD1
AD2
(RSSI/IF)
32 kHz crystal
ADC
System
clock
MUX
Clock
Multiplexer
RF Transceiver
IF
MIXER
RF_IN
RSSI
IF stage
LNA
MODEM
CODEC, Bit synchronizer,
Serializer/Deserializer
:N.n
Bias
Bias resistor
RF_OUT
PA
LPF
VCO
CHP
PD
:R
Main Crystal
Oscillator
3-24 MHz crystal
L1
L2
CHP_OUT
VCO inductor
Figure 2. CC1010 Block Diagram
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Page 18 of 152
CC1010
15. 8051 Core
15.1 General description
The CC1010 microcontroller core is based
on
the
industry-standard
8051
architecture. The MCU core is 8-bit, with
program and data memory located in
separate memory spaces (Harvard
architecture). The internal registers are
organised as four banks of 8 registers
each. The instruction set supports direct,
indirect and register addressing modes.
Program memory can be addressed using
indexed addressing. The core registers
are comprised of an accumulator, a stack
pointer and dual data pointer registers in
addition to the general registers.
Data memory is split into internal and
external RAM. The name "external RAM"
is in fact misleading since in the case of
the CC1010 all the RAM is internal to the
chip. The difference between external and
internal is that external RAM can only be
accessed by a few instructions. Therefore,
frequently-accessed variables as well as
the stack should be kept in internal RAM.
The various peripherals are controlled
through Special Function Registers
(SFRs) located in the internal RAM space.
The 8051 core is instruction set
compatible with the industry standard
8051. It also has one additional instruction,
TRAP, to enable advanced in-circuitdebugging features. This is described on
page 44.
The instruction cycle time is 4 clock
cycles, which typically gives a 2.5X
average reduction in instruction execution
time over the original Intel 8051.
Peripheral units, including general purpose
I/O, 2 standard 8051 timers, 2 extra timers
with PWM functionality, a watchdog timer,
a real-time clock, an SPI master interface,
hardware DES encryption, a true random
bit generator and ADC are all described
from page 47 and out. Dual data pointers
are available for faster data transfer.
15.2 Reset
CC1010 must be reset at start-up. There
are several sources for reset in CC1010 :
•
External reset pin, RESET . Applying
a low signal to this pin at any time will
reset almost all registers in CC1010.
Exceptions can be found in Table 41
on page 144. The input is
asynchronous and is synchronised
internally, so that the reset can be
released independent of the timing of
the active clock signal. If the main
crystal oscillator is inactive, the reset
input should be held long enough for
the oscillator to start up and stabilize.
See Electrical Specifications page 7
for oscillator start-up timing.
•
Power On Reset (POR). The internal
POR module can generate reset upon
power-up. Special requirements for
power consumption or power supply
voltage may require an external POR
module, as described in the Power On
Reset (Brown-Out Detection) section
at page 62.
•
Brown-out detection reset. The POR
will also detect low supply voltage and
generate a reset.
•
Watchdog timer reset. The watchdog
timer can generate a reset, as
described in the section on page 63.
•
ADC reset. The ADC module can be
programmed to generate a reset
signal if its inputs exceed a
programmed threshold. See the ADC
section on page 79 for details.
The POR and ADC reset signals will be
held for 1024 clock periods after the signal
is released. This will ensure a safe clock
start-up if the crystal oscillator is currently
not running.
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Page 19 of 152
CC1010
15.3 Memory Map
The CC1010 memory map is shown in
Figure 3.
from (to) the address pointed to by the
currently selected data pointer.
CC1010 has 2 blocks of RAM on chip. This
The instructions MOVX A, @Ri and MOVX
@Ri, A moves data to (from) the
accumulator, from (to) the address given
by the memory page address register
MPAGE and the register Ri (R0 or R1).
MPAGE gives the 8 most significant
address bits, while the register Ri gives
the 8 least significant bits. In many 8051
implementations, this type of external
RAM access is performed using P2 to give
the most significant address bits. Existing
software may therefore have to be
adapted to make use of MPAGE instead of
P2.
includes the 128 bytes Internal RAM and
the 2048 bytes External RAM. (The 2048byte RAM will be referred to as External
RAM, although it is on-chip. Direct access
to off-chip RAM is not implemented.)
Access to the internal RAM is performed
using the MOV instruction. MOV A, @Ri,
MOV @Ri, A and MOV @Ri, #data use
indirect addressing. MOV A, direct,
MOV Rn, direct, MOV direct, A,
MOV direct, Rn, MOV direct,
direct and MOV direct, #data use
direct addressing. MOV @Ri, direct
uses indirect and direct addressing.
All direct addressing instructions can also
be used to access the SFRs. CC1010 also
implements the option to access SFRs
indirectly, as described in the In Circuit
Debugging section on page 44. CC1010 has
dual data pointers to external RAM,
provided in the 16 bit registers DPTR0 and
DPTR1 (SFRs DPH0, DPL0, DPH1 and
DPL1). If a high-level language compilator
is used, it should be set up to make use of
both pointers for better performance. The
data pointer is selected through DPS.SEL.
Access to the external RAM is performed
using the MOVX instruction and indirect
addressing using either the 16 bit data
pointers or the 8 bit registers R0 or R1
together with MPAGE. MOVX A, @DPTR
and
MOVX
@DPTR,
A
moves data to (from) the accumulator,
The program memory can be read using
the MOVC A, @A+DPTR and MOVC A,
@A+PC instructions, which moves a byte
from the program memory address given
by A+DPTR or A+PC respectively. The
program memory can not be written using
MOV commands, but uses the method
described in the 8051 Flash Programming
section on page 42.
CC1010 also provides a possibility to stretch
the access cycle to external RAM, through
CKCON.MD(2:0) (see page 55). The
default value for CKCON.MD is "001". It is
recommended to set CKCON.MD to "000"
for faster RAM access.
SWRS047
Page 20 of 152
CC1010
Flash Program
Memory
0x7FFF
External RAM
0x7FF
Internal RAM / SFR
0xFF
Accesible
through indirect
addressing
Accesible
through indirect
addressing
Special Function
Registers (SFR),
accessible
through Direct
Addressing
0x7F
Internal RAM
Accessible
through Direct
and Indirect
Addressing
0x00
0x00
0x00
Figure 3. Memory Map
DPL0 (0x82) - Data Pointer 0, low byte
Bit
7:0
Name
DPL0(7:0)
R/W
R/W
Reset value
0x00
Description
Data Pointer 0, low byte
DPH0 (0x83) - Data Pointer 0, high byte
Bit
0
Name
DPH0(7:0)
R/W
R/W
Reset value
0x00
Description
Data Pointer 0, high byte
DPL1 (0x84) - Data Pointer 1, low byte
Bit
7:0
Name
DPL1(7:0)
R/W
R/W
Reset value
0x00
Description
Data Pointer 1, low byte
DPH1 (0x85) - Data Pointer 1, high byte
Bit
7:0
Name
DPH1(7:0)
R/W
R/W
Reset value
0x00
Description
Data Pointer 1, high byte
SWRS047
Page 21 of 152
CC1010
DPS (0x86) - Data Pointer Select
Bit
7:1
0
Name
R/W
R0
R/W
SEL
Reset value
0x00
0x00
Description
Reserved, read as 0
Data Pointer Select for external RAM access
0 : DPH0 and DPL0 are used
1 : DPH1 and DPL1 are used
MPAGE (0x92) - Memory Page Select Register
Bit
7:0
Name
MPAGE(7:0)
R/W
R/W
Reset value
0x00
Description
Memory Page
A total of 119 Special Function Registers
(SFRs)
are
accessible
from
the
microcontroller core. The names and
addresses of all SFRs are listed in Table
11. All standard 8051 registers are
available, in addition to SFRs which are
CC1010 specific, controlling modules such
as the RF Transceiver, DES encryption,
ADC and Real-Time Clock.
0/8
0xF8
0xF0
0xE8
0xE0
0xD8
0xD0
0xC8
0xC0
0xB8
0xB0
0xA8
0xA0
0x98
0x90
0x88
0x80
EIP
B
EIE
ACC
EICON
PSW
RFMAIN
SCON1
IP
P3
IE
P2
SCON0
P1
TCON
P0
1/9
TEST0
FSHAPE7
FSDELAY
CURRENT
MODEM2
X32CON
RFBUF
SBUF1
RDATA
TCON2
SPCR
SBUF0
EXIF
TMOD
SP
2/A
TEST1
FSHAPE6
FSEP0
PA_POW
MODEM1
WDT
FREQ_0A
RFCON
RADRL
T2PRE
SPDR
MPAGE
TL0
DPL0
3/B
TEST2
FSHAPE5
FSEP1
PLL
MODEM0
PDET
FREQ_1A
CRPCON
RADRH
T3PRE
SPSR
ADCON
TL1
DPH0
All SFRs will be described in the following
sections. A more detailed overview is
provided in Table 41 on page 144, which
also includes all reset values. SFRs with
addresses ending with 0 or 8 (leftmost
column of Table 11) are bit adressable.
4/C
5/D
TEST3
FSHAPE4
FSCTRL
LOCK
MATCH
BSYNC
FREQ_2A
CRPKEY
CRPINI4
CRPINI0
T2
P0DIR
ADDATL
TH0
DPL1
TEST4
FSHAPE3
RTCON
CAL
FLTIM
FREQ_0B
CRPDAT
CRPINI5
CRPINI1
T3
P1DIR
ADDATH
TH1
DPH1
6/E
7/F
TEST5
FSHAPE2
FREND
PRESCALER
FREQ_1B
CRPCNT
CRPINI6
CRPINI2
FLADR
P2DIR
ADCON2
CKCON
DPS
TEST6
FSHAPE1
TESTMUX
RESERVED
FREQ_2B
RANCON
CRPINI7
CRPINI3
FLCON
P3DIR
CHVER
ADTRH
PCON
Table 11 CC1010 SFR Overview
SWRS047
Page 22 of 152
CC1010
15.4 CPU Registers
CC1010 provides 4 register banks of 8
registers each. These register banks are
mapped in the the internal data memory
(see the Memory section on page 33) at
addresses 0x00 - 0x07, 0x08 - 0x0F, 0x10
- 0x17 and 0x18 - 0x1F. Each register
bank contains the 8 8-bit registers R0
through R7. The different register banks
are selected through the Program Status
Word PSW.RS(1:0) as shown below.
PSW also contains carry, overflow and
parity flags that reflect the current CPU
state.
In addition, the CPU uses the accumulator
register A (accessed via the SFR space as
ACC), B (for multiplication and division) and
the stack pointer SP. These registers are
shown below. Note that the hardware
stack pointer SP is increased when
pushing and decreased when popping
data, unlike many other microcontroller
architectures.
PSW (0xD0) - Program Status Word
Bit
7
Name
CY
R/W
R/W
Reset value
0
6
AC
R/W
0
5
4
3
F0
RS1
RS0
R/W
R/W
R/W
0
0
0
2
OV
R/W
0
1
0
F1
P
R/W
R/W
0
0
Description
Carry Flag, set to 1 when the last arithmetic
operation resulted in a carry (during addition) or
borrow (during subtraction), otherwise cleared to
0 by all arithmetic operations. CY is also used for
rotation instructions.
Auxiliary carry flag. Set to 1 when the last
arithmetic operation resulted in a carry into
(during addition) or borrow from (during
subtraction) the high order nibble, otherwise
cleared to 0 by all arithmetic operations.
Flag 0 (Available to the user for general purpose)
Register bank select.
RS1 RS0 Working register bank and address
0
0
Bank0
0x00-0x07
0
1
Bank1
0x08-0x0F
1
0
Bank2
0x10-0x17
1
1
Bank3
0x18-0x1F
Overflow flag. Set to 1 when the last arithmetic
operation resulted in a carry (addition), borrow
(subtraction), or overflow (multiply or divide).
Otherwise, the bit cleared to 0 by all arithmetic
operations.
Flag 1 (Available to the user for general purpose)
Parity flag. Set to 1 when the modulo-2 sum of
the 8 bits in the accumulator is 1 (odd parity),
cleared to 0 on even parity.
ACC (0xE0) - Accumulator Register
Bit
7:0
Name
ACC(7:0)
R/W
R/W
Reset value
0x00
Description
Accumulator
R/W
R/W
Reset value
0x00
Description
B is used for multiplication and division
B (0xF0) - B Register
Bit
7:0
Name
B(7:0)
SWRS047
Page 23 of 152
CC1010
SP (0x81) - Stack Pointer
Bit
7:0
Name
SP(7:0)
R/W
R/W
Reset value
0x07
Description
Stack Pointer, used for pushing and poping data
to and from the stack. Note that the reset value
for SP is 0x07
15.5 Instruction Set Summary
The 8051 instruction set is summarised in
Table 12 below. All mnemonics are
Copyright © Intel Corporation 1980.
One non-standard 8051 instruction, TRAP,
with opcode 0xA5 is included to enable
setting of breakpoints. This instruction is
described in the In Circuit Debugging
section at page 44. Symbols used in the
table are:
•
A - Accumulator
•
AB - Register pair A and B
•
B - Multiplication register
•
C - Carry flag
•
DPTR - Data pointer
•
Rn - Register R0 - R7
•
PC - Program counter
•
direct - 8-bit data address (Internal
RAM 0x00 - 0x7F, SFRs 0x80-0xFF)
•
@Ri - Internal register pointed to by R0
or R1 (except MOVX)
bit - Direct bit address
•
#data - 8-bit constant
•
#data 16 - 16-bit constant
•
addr 16 - 16-bit destination address
•
addr 11 - 11-bit destination address,
used by ACALL and AJMP. The branch
will be within the same 2 kB block of
program memory of the first byte of
the following instruction.
The ‘Bytes’ column shows the number of
bytes of Flash memory used. Further, the
number of instruction cycles is shown.
Each instruction cycle requires four clock
cycles. The 4 rightmost columns shows
which flags in the program status word
PSW (see page 23) are affected by the
instructions.
AC
OV
P
Arithmetic
Add register to A
Add direct byte to A
Add data memory to A
Add immediate to A
Add register to A with carry
Add direct byte to A with carry
Add data memory to A with carry
Add immediate to A with carry
Subtract register from A with
borrow
Subtract direct byte from A with
borrow
CY
Description
Hex Opcode
SUBB A, direct
•
Instr. Cycles
ADD A, Rn
ADD A, direct
ADD A, @Ri
ADD A, #data
ADDC A, Rn
ADDC A, direct
ADDC A, @Ri
ADDC A, #data
SUBB A, Rn
rel - Two's complement offset byte
used by SJMP and conditional jumps
Bytes
Mnemonic
•
1
2
1
2
1
2
1
2
1
1
2
1
2
1
2
1
2
1
28-2F
25
26-27
24
38-3F
35
36-37
34
98-9F
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
2
2
95
x
x
x
x
SWRS047
Page 24 of 152
ANL
ANL
ANL
ANL
ANL
ANL
ORL
ORL
ORL
ORL
ORL
ORL
XRL
XRL
XRL
XRL
XRL
XRL
A, Rn
A, direct
A, @Ri
A, #data
direct, A
direct, #data
A, Rn
A, direct
A, @Ri
A, #data
direct, A
direct, #data
A, Rn
A, direct
A, @Ri
A, #data
direct, A
direct, #data
CLR A
CPL A
SWAP A
RL A
RLC A
RR A
RRC A
P
Move direct byte to A
INC A
INC Rn
INC direct
INC @Ri
DEC A
DEC Rn
DEC direct
DEC @Ri
INC DPTR
MUL AB
DIV AB
DA A
OV
MOV A, direct
SUBB A, #data
AC
MOV A, Rn
Subtract data memory from A with
borrow
Subtract immediate from A with
borrow
Increment A
Increment register
Increment direct byte
Increment data memory
Decrement A
Decrement register
Decrement direct byte
Decrement data memory
Increment data pointer
Multiply A by B
Divide A by B
Decimal adjust A
Logical
AND register to A
AND direct byte to A
AND data memory to A
AND immediate to A
AND A to direct byte
AND immediate data to direct byte
OR register to A
OR direct byte to A
OR data memory to A
OR immediate to A
OR A to direct byte
OR immediate data to direct byte
Exclusive-OR register to A
Exclusive-OR direct byte to A
Exclusive-OR data memory to A
Exclusive-OR immediate to A
Exclusive-OR A to direct byte
Exclusive-OR immediate to direct
byte
Clear A
Complement A
Swap nibbles of A
Rotate A left
Rotate A left through carry
Rotate A right
Rotate A right through carry
Data Transfer
Move register to A
CY
SUBB A, @Ri
Hex Opcode
Description
Instr. Cycles
Mnemonic
Bytes
CC1010
1
1
96-97
x
x
x
x
2
2
94
x
x
x
x
1
1
2
1
1
1
2
1
1
1
1
1
1
1
2
1
1
1
2
1
3
5
5
1
04
08-0F
05
06-07
14
18-1F
15
16-17
A3
A4
84
D4
1
2
1
2
2
3
1
2
1
2
2
3
1
2
1
2
2
3
1
2
1
2
2
3
1
2
1
2
2
3
1
2
1
2
2
3
58-5F
55
56-57
54
52
53
48-4F
45
46-47
44
42
43
68-6F
65
66-67
64
62
63
x
x
x
x
1
1
1
1
1
1
1
1
1
1
1
1
1
1
E4
F4
C4
23
33
03
13
x
x
1
1
2
2
E8EF
E5
SWRS047
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Page 25 of 152
1
1
MOV A, #data
MOV Rn, A
MOV Rn, direct
Move immediate to A
Move A to register
Move direct byte to register
2
1
2
2
1
2
MOV Rn, #data
MOV direct, A
MOV direct, Rn
MOV direct,
direct
MOV direct, @Ri
MOV direct, #data
MOV @Ri, A
MOV @Ri, direct
Move immediate to register
Move A to direct byte
Move register to direct byte
Move direct byte to direct byte
2
2
2
3
2
2
2
3
E6E7
74
F8-FF
A8AF
78-7F
F5
88-8F
85
Move data memory to direct byte
Move immediate to direct byte
MOV A to data memory
Move direct byte to data memory
2
3
1
2
2
3
1
2
MOV @Ri, #data
MOV DPTR, #data
MOVC A, @A+DPTR
2
3
1
2
3
3
MOVC A, @A+PC
MOVX A, @Ri
Move immediate to data memory
Move immediate to data pointer
Move code byte relative DPTR to
A
Move code byte relative PC to A
Move external data (A8) to A
1
1
3
2-9
MOVX A, @DPTR
MOVX @Ri, A
MOVX @DPTR, A
PUSH direct
POP direct
XCH A, Rn
Move external data (A16) to A
Move A to external data (A8)
Move A to external data (A16)
Push direct byte onto stack
Pop direct byte from stack
Exchange A and register
1
1
1
2
2
1
2-9
2-9
2-9
2
2
1
XCH A, direct
XCH A, @Ri
Exchange A and direct byte
Exchange A and data memory
2
1
2
1
XCHD A, @Ri
Exchange A and data memory
nibble
Boolean
Clear carry
Clear direct bit
Set carry
Set direct bit
Complement carry
Complement direct bit
AND direct bit to carry
AND direct bit inverse to carry
OR direct bit to carry
OR direct bit inverse to carry
Move direct bit to carry
Move carry to direct bit
1
1
1
2
1
2
1
2
2
2
2
2
2
2
1
2
1
2
1
2
2
2
2
2
2
2
CLR C
CLR bit
SETB C
SETB bit
CPL C
CPL bit
ANL C, bit
ANL C, /bit
ORL C, bit
ORL C, /bit
MOV C, bit
MOV bit, C
SWRS047
x
x
86-87
75
F6-F7
A6A7
76-77
90
93
x
83
E2E3
E0
F2-F3
F0
C0
D0
C8CF
C5
C6C7
D6D7
C3
C2
D3
D2
B3
B2
82
B0
72
A0
A2
92
P
Hex Opcode
Move data memory to A
OV
Instr. Cycles
MOV A, @Ri
AC
Description
CY
Mnemonic
Bytes
CC1010
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Page 26 of 152
CC1010
DJNZ Rn, rel
DJNZ direct, rel
NOP
TRAP
11-F1
12
22
32
01-E1
02
80
40
50
20
30
10
73
60
70
B5
x
3
4
B4
x
3
4
x
3
4
2
3
3
4
B8BF
B6B7
D8DF
D5
1
1
1
3
00
A5
x
Table 12. Instruction Set Summary
SWRS047
Page 27 of 152
P
3
4
4
4
3
4
3
3
3
4
4
4
3
3
3
4
OV
2
3
1
1
2
3
2
2
2
3
3
3
1
2
2
3
AC
CY
CJNE @Ri, #d, rel
Hex Opcode
CJNE Rn, #d, rel
Branching
Absolute call to subroutine
Long call to subroutine
Return from subroutine
Return from interrupt
Absolute jump unconditional
Long jump unconditional
Short jump (relative address)
Jump on carry = 1
Jump on carry = 0
Jump on direct bit = 1
Jump on direct bit = 0
Jump on direct bit = 1 and clear
Jump indirect relative DPTR
Jump on accumulator = 0
Jump on accumulator /= 0
Compare A and direct, jump
relative if not equal
Compare A and immediate, jump
relative if not equal
Compare reg and immediate,
jump relative if not equal
Compare ind and immediate, jump
relative if not equal
Decrement register, jump relative
if not zero
Decrement direct byte, jump
relative if not zero
Misc.
No operation
Set EICON.FDIF = 1, used for
breakpoints
Instr. Cycles
ACALL addr 11
LCALL addr 16
RET
RETI
AJMP addr 11
LJMP addr 16
SJMP rel
JC rel
JNC rel
JB bit, rel
JNB bit, rel
JBC bit, rel
JMP @A+DPTR
JZ rel
JNZ rel
CJNE A, direct,
rel
CJNE A, #d, rel
Description
Bytes
Mnemonic
CC1010
15.6 Interrupts
In CC1010 there are a total of 15 interrupt
sources, which share 12 interrupt lines.
These are all shown in Table 13. Each
interrupt’s natural priority, interrupt vector,
Interrupt
Flash / Debug interrupt
External Interrupt 0
Timer 0 Interrupt
External Interrupt 1
Timer 1 Interrupt
Serial Port 0 Transmit Interrupt
Serial Port 0 Receive Interrupt
Serial Port 1 Transmit Interrupt
Serial Port 1 Receive Interrupt
RF Transmit / Receive Interrupt
Timer 2 Interrupt
ADC Interrupt
interrupt enable and interrupt flag, is also
shown in the table, and will be described
below.
Natural
Priority
0
Priority
Control
-
Interrupt
Vector
0x33
Interrupt
Enable
Interrupt Flag
0x03
0x0B
0x13
0x1B
0x23
EICON.
FDIE
IE.EX0
IE.ET0
IE.EX1
IE.ET1
IE.ES0
IP.PS1
0x3B
IE.ES1
EIP.PRF
EIP.PT2
EIP.PAD
0x43
0x4B
0x53
EIE.RFIE
EIE.ET2
EIE.ADIE
and ADCON2.
ADCIE
EICON.
FDIF
TCON.IE0 (*)
TCON.TF0 (*)
TCON.IE1 (*)
TCON.TF1 (*)
SCON0.TI_0
SCON0.RI_0
SCON1.TI_1
SCON1.TI_1
EXIF.RFIF
EXIF.TF2
EXIF.ADIF
1
2
3
4
5
IP.PX0
IP.PT0
IP.PX1
IP.PT1
IP.PS0
6
7
8
9
DES Encryption / Decryption
Interrupt
EIP.PT3
EIP.PRTC
(*)
- Interrupt flag is cleared by hardware.
Timer 3 Interrupt
Realtime Clock Interrupt
10
11
0x5B
0x63
and
EIE.ADIE
ADCON2.
ADCIF
EXIF.ADIF
and
and
CRPCON.
CRPIE
EIE.ET3
EIE.RTCIE
CRPCON.
CRPIF
EXIF.TF3
EICON.RTCIF
Table 13. CC1010 Interrupt overview
15.6.1
Interrupt Masking
IE.EA is the global interrupt enable for all
interrupts, except the Flash / Debug
interrupt. When IE.EA is set, each
interrupt is masked by the interrupt enable
bits listed in Table 13. When IE.EA is
cleared, all interrupts are masked, except
the Flash / Debug interrupt, which has its
own interrupt mask bit, EICON.FDIE.
15.6.2
Interrupt Processing
When an enabled interrupt occurs, the
CPU jumps to the address of the interrupt
service routine (ISR) associated with that
interrupt, as shown in Table 13. Most
interrupts can also be initiated by setting
the associated interrupt flag from software.
CC1010 executes the ISR to completion
unless another interrupt set at a higher
interrupt level occurs. Each ISR ends with
a RETI (return from interrupt) instruction.
After executing the RETI, CC1010 returns
to the next instruction that would have
been executed if the interrupt had not
occurred.
CC1010 always completes the instruction in
progress before servicing an interrupt. If
the instruction in progress is RETI, or a
write access to any of the IP, IE, EIP, or
EIE SFRs, CC1010 completes one
additional instruction before servicing the
interrupt.
SWRS047
Page 28 of 152
CC1010
IE (0xA8) - Interrupt Enable Register
Bit
7
Name
EA
R/W
R/W
Reset value
0
6
ES1
R/W
0
5
4
ES0
R/W
R/W
0
0
3
ET1
R/W
0
2
EX1
R/W
0
1
ET0
R/W
0
0
EX0
R/W
0
Description
Global Interrupt enable / disable
0 : All interrupts except the Flash / debug
interrupt are disabled
1 : Each interrupt is enabled by its individual
masking bit
Serial Port 1 interrupt enable / disable
0 : Interrupt is disabled
1 : Interrupt is enabled, when also EA is set
Reserved for future use
Serial Port 0 interrupt enable / disable
0 : Interrupt is disabled
1 : Interrupt is enabled, when also EA is set
Timer 1 interrupt enable / disable
0 : Interrupt is disabled
1 : Interrupt is enabled, when also EA is set
External interrupt 1 (from P3.3) enable / disable
0 : Interrupt is disabled
1 : Interrupt is enabled, when also EA is set
Timer 0 interrupt enable / disable
0 : Interrupt is disabled
1 : Interrupt is enabled, when also EA is set
External interrupt 0 (from P3.2) enable / disable
0 : Interrupt is disabled
1 : Interrupt is enabled, when also EA is set
EIE (0xE8) - Extended Interrupt Enable Register
Bit
7
6
5
4
Name
RTCIE
R/W
R1
R1
R1
R/W
Reset value
1
1
1
0
3
ET3
R/W
0
2
ADIE
R/W
0
1
ET2
R/W
0
0
RFIE
R/W
0
Description
Reserved, read as 1
Reserved, read as 1
Reserved, read as 1
Realtime Clock interrupt enable / disable
0 : Interrupt is disabled
1 : Interrupt is enabled, when also EA is set
Timer 3 interrupt enable / disable
0 : Interrupt is disabled
1 : Interrupt is enabled, when also EA is set
ADC / DES interrupt enable / disable
0 : Interrupt is disabled
1 : Interrupt is enabled, when also EA is set
Timer 2 interrupt enable / disable
0 : Interrupt is disabled
1 : Interrupt is enabled, when also EA is set
RF Interrupt enable / disable
0 : Interrupt is disabled
1 : Interrupt is enabled, when also EA is set
SWRS047
Page 29 of 152
CC1010
EICON (0xD8) - Extended Interrupt Control
Bit
7
Name
SMOD1
R/W
R/W
Reset value
0
6
5
FDIE
R1
R/W
1
0
4
FDIF
R/W
0
3
RTCIF
R/W
0
2
1
0
-
R0
R0
R0
0
0
0
Description
Serial Port 1 baud rate doubler enable / disable
0 : Serial Port 1 baud rate is normal
1 : Serial Port 1 baud rate is doubled
Reserved, read as 1
Flash / Debug interrupt enable
0 : Interrupt is disabled
1 : Interrupt is enabled (independent of IE.EA)
Flash / Debug interrupt flag
FDIF is set by hardware when an 8051-initiated write to
Flash program memory is completed or a TRAP instruction
is executed. FDIF may also be set by software. FDIF
must be cleared by software before exiting the ISR.
Real-time clock interrupt flag
RTCIF is set by hardware when an interrupt request is
generated from the real-time clock. RTCIF may also be set
by software. RTCIF must be cleared by software before
exiting the ISR.
Reserved, read as 0
Reserved, read as 0
Reserved, read as 0
EXIF (0x91) - Extended Interrupt Flag
Bit
7
Name
TF3
R/W
R/W
Reset value
0
6
ADIF
R/W
0
5
TF2
R/W
0
4
RFIF
R/W
0
3
2
1
0
-
R1
R0
R0
R0
1
0
0
0
Description
Timer 3 interrupt flag.
TF3 is set by hardware when an interrupt request is
generated from Timer 3. TF3 may also be set by software.
TF3 must be cleared by software before exiting the ISR.
ADC / DES Interrupt flag.
ADIF is set by hardware when an interrupt request is
generated from the ADC block (ADCON2.ADCIF) or by the
DES Encryption / Decryption block (CRPCON.CRPIF).
These interrupts must also be enabled by setting
ADCON2.ADCIE and CRPCON.CRPIE. ADIF may also
be set by software. ADIF must be cleared by software
before exiting the ISR
Timer 2 interrupt flag.
TF2 is set by hardware when an interrupt request is
generated from Timer 2. TF2 may also be set by software.
TF2 must be cleared by software before exiting the ISR
RF Transmit / receive interrupt flag.
RFIF is set by hardware when an interrupt request is
generated from the RF transceiver block. RFIF may also
be set by software. RFIF must be cleared by software
before exiting the ISR.
Reserved, read as 1
Reserved, read as 0
Reserved, read as 0
Reserved, read as 0
SWRS047
Page 30 of 152
CC1010
15.6.3
Interrupt Priority
Interrupts are prioritised in two stages:
Interrupt level and natural priority. The
interrupt level (low, high or highest) takes
precedence over the natural priority.
The Flash / Debug Interrupt, if enabled,
always has the highest priority and is the
only interrupt that can have the highest
priority. All other interrupts can be
assigned either low or high priority, set by
the registers IP and EIP listed below.
Two interrupts with the same interrupt
priority that occur simultaneously are
resolved through their natural priority. The
natural priority is shown in Table 13. The
interrupt having the lowest natural priority
will be serviced first.
Once an interrupt is being serviced, only
an interrupt of higher priority level can
interrupt the service routine of the interrupt
currently being serviced.
IP (0xB8) - Interrupt Priority Register
Bit
7
6
Name
PS1
R/W
R1
R/W
Reset value
1
0
5
4
PS0
R/W
R/W
0
0
3
PT1
R/W
0
2
PX1
R/W
0
1
PT0
R/W
0
0
PX0
R/W
0
Description
Reserved, read as 1
Serial Port 1 interrupt priority control
0 : Interrupt has low priority
1 : Interrupt has high priority
Reserved for future use
Serial Port 0 interrupt priority control
0 : Interrupt has low priority
1 : Interrupt has high priority
Timer 1 interrupt priority control
0 : Interrupt has low priority
1 : Interrupt has high priority
External Interrupt 1 (from P3.3) interrupt priority control
0 : Interrupt has low priority
1 : Interrupt has high priority
Timer 0 interrupt priority control
0 : Interrupt has low priority
1 : Interrupt has high priority
External Interrupt 0 (from P3.2) interrupt priority control
0 : Interrupt has low priority
1 : Interrupt has high priority
EIP (0xF8) - Extended Interrupt Priority Register
Bit
7
6
5
4
Name
PRTC
R/W
R1
R1
R1
R/W
Reset value
1
1
1
0
3
PT3
R/W
0
2
PAD
R/W
0
1
PT2
R/W
0
0
PRF
R/W
0
Description
Reserved, read as 1
Reserved, read as 1
Reserved, read as 1
Realtime Clock interrupt priority control
0 : Interrupt has low priority
1 : Interrupt has high priority
Timer 3 interrupt priority control
0 : Interrupt has low priority
1 : Interrupt has high priority
ADC / DES interrupt priority control
0 : Interrupt has low priority
1 : Interrupt has high priority
Timer 2 interrupt priority control
0 : Interrupt has low priority
1 : Interrupt has high priority
0 : Interrupt has low priority
1 : Interrupt has high priority
SWRS047
Page 31 of 152
CC1010
15.7 External interrupts
Two external interrupt pins are available in
the CC1010. They are located on pins P3.2
and P3.3, and can be set up to be either
level- or edge sensitive by setting the IT1
and IT2 bits in the TCON register (see
page 54 for more information). When the
external interrupts are activated in the IE
register, any pulse longer than 8 clock
cycles will always generate an interrupt.
The CC1010 will wake up from Idle mode
when an external interrupt pin is activated,
but the external interrupt pins cannot wake
the CC1010 from Power-Down mode.
15.8 Main Crystal Oscillator
An external clock signal or the main crystal
oscillator can be used as main frequency
reference and microcontroller clock signal.
An external clock signal should be
connected to XOSC_Q1, while XOSC_Q2
should be left open.
The parasitic capacitance is constituted by
pin input capacitance and PCB stray
capacitance. Typically the total parasitic
capacitance is 3-5pF. A trimming capacitor
may be placed across C171 for initial
tuning if necessary.
The microcontroller core and main
oscillator will operate at any frequency in
the range 3 - 24 MHz. However, the
crystal frequency should be in the range 34, 6-8 or 9-24 MHz because the crystal
frequency is used as reference for the
data rate in the RF transceiver part (as
well as other internal functions). The
following frequencies are recommended
as they will provide “standard” data rates:
3.6864, 7.3728, 11.0592, 14.7456,
18.4320 and 22.1184 MHz. The selected
crystal frequency range must be set in
MODEM0.XOSC_FREQ(2:0) in order to
get the correct data rate (see page 93).
The crystal oscillator is of an advanced
amplitude-regulated type. A high current is
used to start up the oscillations. When the
amplitude builds up, the current is reduced
to what is necessary to maintain a 600
mVpp amplitude. This ensures a fast startup, keeps the current consumption and the
drive level to a minimum and makes the
oscillator insensitive to ESR variations. As
long as you follow the crystal loading
capacitance requirements, do not worry
about ESR or drive levels (a typical drive
level is 4 µW for 3 MHz).
Using the main crystal oscillator, the
crystal must be connected between the
pins XOSC_Q1 and XOSC_Q2. The
oscillator is designed for parallel mode
operation of the crystal. In addition loading
capacitors (C171 and C181) for the crystal
are required. The loading capacitor values
depend on the total load capacitance, CL,
specified for the crystal. The total load
capacitance seen between the crystal
terminals should equal CL for the crystal to
oscillate at the specified frequency.
CL =
1
1
1
+
C171 C181
+ C parasitic
The main crystal oscillator circuit is shown
in Figure 4. Typical component values for
different values of CL are given in Table
14. Recommended load capacitance
versus frequency is given in Table 10 on
page 12.
The initial tolerance, temperature drift,
ageing and load pulling should be carefully
specified in order to meet the required
frequency
accuracy
in
a
certain
application. By specifying the total
expected frequency accuracy in SmartRF®
Studio together with data rate and
frequency separation, the software will
calculate the total bandwidth and compare
to the available IF bandwidth. Any
contradictions will be reported by the
software and a more accurate crystal will
be recommended if required.
SWRS047
Page 32 of 152
CC1010
XOSC_Q1
XOSC_Q2
XTAL
C181
C171
Figure 4. Crystal oscillator circuit
Item
C171
C181
CL= 12 pF
15 pF
15 pF
CL= 20 pF
30 pF
30 pF
Table 14. Crystal oscillator component values
SWRS047
Page 33 of 152
CC1010
15.9 Power and Clock Modes
Several power modes are defined to save
power when running CC1010. The modes
are described below. See also Table 15.
15.9.1
Active Mode
In active mode the 8051 is running
normally, executing instructions from the
Flash program memory. The clock used in
this mode could either be the main crystal
oscillator, or it could be the 32 kHz
oscillator. The current consumption
depends on the actual frequency used.
15.9.2
Idle Mode
After completing the instruction that sets
the PCON.IDLE bit, Idle Mode is entered.
In Idle Mode, the 8051 processing is
stopped and internal registers maintain
their current data, but all peripherals are
still running.
15.9.3
Power-Down Mode
After completing the instruction that sets
the PCON.STOP bit, the controller core and
the peripherals are stopped. In PowerDown Mode, the clock trees of the 8051
and peripherals are disabled. Only the
ADC clock tree is running. This enables
the ADC to generate reset as will be
described in the ADC section.
Note that the PCON.STOP bit does not
affect the clock oscillators; these will still
be running if they are switched on when
entering Power-Down Mode.
To ensure minimum power-consumption,
the ADC should be switched off and
Power-down mode should be entered by
switching off the oscillators instead of
using the PCON.STOP bit.
There are 3 ways to exit Idle Mode:
There are 2 ways to exit Power Down
Mode:
•
•
Activate any reset condition. All
registers are then reset, and program
execution will resume when the reset
condition
is
cleared.
Program
execution will then resume from
address 0x0000.
•
Turn the power off and on. The Power
On Reset module should then be
enabled, or an external reset signal
should be applied during power up.
•
•
Activate any enabled interrupt. This
clears the IDLE bit, terminating Idle
Mode, and executes the ISR
associated with the received interrupt.
The RETI instruction at the end of the
ISR causes the 8051 to return to the
instruction following the one that
enabled Idle Mode.
Activate any reset condition. All
registers are then reset, and program
execution will resume from address
0x0000 when the reset condition is
cleared.
Turn the power off and on. The Power
On Reset module should then be
enabled, or an external reset signal
should be applied during power up.
More information about minimising the
power consumption of the CC1010 can be
found in Application Note AN017 Low
Power Systems Using The CC1010.
SWRS047
Page 34 of 152
CC1010
Mode
Active
Idle
Core
Peripherals
Main osc.
Main osc.
RTC osc.
(32 kHz)
Stopped
RTC osc.
(32 kHz)
Main osc.
Stopped
RTC osc.
(32 kHz)
ADC Off
ADC On
(32 kHz)
Stopped
Typical current
consumption1
14.8 mA at
14.7456 MHz
1.3 mA
Writing SFR
12.8 mA at
14.7456 MHz
29.4 uA
Interrupt
Reset
Power off/on
200 uA
ADC value exceeds threshold
Reset
Power off/on
Reset
Power off/on
Power-Down
Stopped
Stopped
0.2 uA
Exit condition
Writing SFR
Note 1: Flash duty-cycle reduction is used for all modes
Table 15. Operating modes summary
15.9.4
Clock Modes
The 8051 and its peripherals can be run
on both the main crystal oscillator (Clock
Mode 0) and the 32.768 kHz oscillator
(Clock Mode 1). The clock mode is set in
X32CON.CMODE.
15.9.5
Entering Clock Mode 1 from
Clock Mode 0
After reset, the 8051 and its peripherals
are running on the main crystal oscillator,
and the 32.768 kHz oscillator is in power
down. To enter Clock Mode 1, the 32.768
kHz oscillator must first be powered up.
This requires clearing X32CON.X32_PD
and then waiting at least 160 ms, after
which X32CON.CMODE can be set to enter
Clock Mode 1.
If an external 32.768 kHz clock source is
already available in the system, this clock
can be applied to the XOSC32_Q1 pin after
setting the X32CON.X32_BYPASS bit.
After 2 to 3 clock periods on the 32.768
kHz oscillator, a glitch free transition has
been made from the main crystal oscillator
to the 32.768 kHz oscillator. If desired, the
main crystal oscillator can then be set in
power down to save more power by
setting
RFMAIN.CORE_PD
and
RFMAIN.BIAS_PD.
This
has
the
disadvantage that a later transition from
Clock Mode 1 to Clock Mode 0 will require
the main crystal oscillator to be powered
up again.
Since the Flash program memory draws a
static current, Idle Mode together with
Flash Power Control (see page 44) should
be applied for maximum power saving in
Clock Mode 1.
The RF receiver cannot be activated in
Clock Mode 1.
15.9.6
Entering Clock Mode 0 from
Clock Mode 1
To enter Clock Mode 0 from Clock Mode
1, the main crystal oscillator must first be
set in power up (if powered down). This
requires clearing RFMAIN.CORE_PD and
RFMAIN.BIAS_PD and then waiting at
least 5 ms (depend on main oscillator
frequency, see Electrical Specifications
page 7). If the oscillator is already
powered up, no waiting is required.
Clearing X32CON.CMODE will then cause a
glitch free transition from Clock Mode 1 to
Clock Mode 0 after 2 to 3 clock periods on
the main crystal oscillator.
15.9.7
Flash Power Control
The Flash program memory current
consumption can be controlled as
described in the Flash Power Control
section on page 44.
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CC1010
PCON (0x87) - Power Control Register
Bit
7
Name
SMOD0
R/W
R/W
Reset value
0
6
5
4
3
GF1
R/W
R1
R1
R/W
0
1
1
0
2
GF0
R/W
0
1
STOP
R/W
0
0
IDLE
R/W
0
Description
Serial Port 0 baud rate doubler enable.
0 : Serial Port 0 baud rate is not doubled
1 : Serial Port 0 baud rate is doubled
Reserved
Reserved, read as 1
Reserved, read as 1
General purpose flag 1. Bit-addressable, general
purpose flag for software control.
General purpose flag 0. Bit-addressable, general
purpose flag for software control.
Power Down (Stop) mode select. Setting the STOP bit
places CC1010 core and peripherals in Stop Mode.
Idle mode select. Setting the IDLE bit places CC1010
in Idle Mode (core is stopped but peripherals are
running).
X32CON (0xD1) - 32.768 kHz Crystal Oscillator Control Register
Bit
7
6
5
4
3
2
Name
X32_BYPASS
R/W
R0
R0
R0
R0
R0
R/W
Reset value
0
0
0
0
0
0
1
X32_PD
R/W
1
0
CMODE
R/W
0
Description
Reserved, read as 0
Reserved, read as 0
Reserved, read as 0
Reserved, read as 0
Reserved, read as 0
32.768 kHz oscillator bypass control signal
0 : The internal 32.768 kHz oscillator is used to
generate the 32.768kHz clock
1 : The internal 32.768 kHz oscillator is bypassed, and
an external clock signal can be applied to the
XOSC32_Q1 pin.
32.768 kHz oscillator power down signal
0 : The oscillator is powered up
1 : The oscillator is powered down (default after reset)
Select different Clock Modes for the 8051 and its
peripherals.
0 : Clock Mode 0 is selected (default after reset)
1 : Clock Mode 1 is selected
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CC1010
15.10 Flash Program Memory
CC1010 has 32 kBytes of on-chip Flash
program memory. It is divided into 256
pages of 128 bytes each. It can be
programmed / erased through a serial SPI
interface or page-by-page from the 8051
as described in the following sections.
others. It can also prevent parts of the
Flash memory from being modified by
software, such as a boot loader that
should remain unchanged. Other parts of
the Flash may still be updated by the boot
loader.
The endurance for the Flash program
memory is typically 20.000 erase / write
cycles.
For the security of the Flash protection,
please refer to the disclaimer at the end of
this document.
The Flash program memory can be locked
for further reading / writing by setting
appropriate lock bits through the serial
interface. Chip erase must be performed
to unlock the memory. This provides a way
to prevent software from being copied by
Erasing a Flash page takes 10-20 ms
depending on the FLTIM register. Writing
to a Flash page takes 5-10 ms.
15.11 SPI Flash Programming
The on-chip Flash program memory can
be programmed using the SPI Flash
programming protocol described in this
section.
SPI Flash programming is enabled when
the pin PROG is held low. This enables the
SPI slave, using the pins SCK (P0.0) as
the clock input, SI (P0.1) as the serial
data input and SO (P0.2) as the serial
data output.
A Windows based Flash programmer is
also available free of charge at the
Chipcon web site.
15.12 Serial Programming Algorithm
When writing serial data to the SPI
interface, data is clocked at the rising edge
of SCK. When reading data from the SPI
interface, data is clocked at the falling
edge of SCK, see Figure 5.
1. Apply power between VDD and DGND
while SCK is set to ‘0’. If a crystal is not
connected between XOSC_Q1 and
XOSC_Q2 apply a clock signal to the
XOSC_Q1 pin.
2. Give RESET a negative pulse of at
least one XOSC period.
3. Set PROG low.
4. Send the Programming Enable
command. Check that the slave is
synchronised by verifying that the
second byte of the instruction is
echoed back when issuing the third
byte. If the second byte did not echo,
issue a positive pulse on SCK and try
again. In the worst case it will take 32
attempts to synchronise.
5. Send the Set Write Cycle Time
command according to the device
clock oscillator frequency. c*16*clock
period must be between 20-40us for
safe flash programming.
6. If a chip erase is performed wait
450ms after the instruction before
issuing Write.
7. Flash memory is programmed one
page at a time. Each page consists of
128 bytes. Load all bytes of the page
that is to be programmed with the
Load Program Memory Page
instruction.
8. When all bytes of a page has been
loaded issue Write Program Memory
Page with the page address. The write
operation finishes within 5.4ms.
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CC1010
Reading an address while writing will
return 0xFF. This can be used for polling
to determine when a page write is finished.
When a read instruction returns anything
other than $FF all flash write operations
have finished.
Instruction
Byte 1
Byte 2
15.12.1 SPI Flash Programming
Instructions
9 instructions are defined to perform the
serial Flash programming. These are
shown in Table 16.
Byte 3
Byte 4
Operation
xxxx xxxx
Enable serial
programming after
Programming
Enable
1010 1100
Set Flash
Timing
1010 1100
0101 1101
xxxx xxxx
xxii iiii
Set the Flash timing
register
Chip Erase
1010 1100
100x xxxx
xxxx xxxx
xxxx xxxx
Chip erase. Clears all
pages, including the
lock bits.
Load Program
Memory Page
0100 H000
xxxx xxxx
bbbb bbxx
iiii iiii
Load data i to
Programming Buffer at
address b:H
Write Program
Memory Page
0100 1100
aaaa aaaa
xxxx xxxx
xxxx xxxx
Write the loaded page
at address a.
Read Program
Memory
0010 H000
aaaa aaaa
bbbb bbxx
oooo oooo
Read data o at address
a:b:H
0101 0011
xxxx xxxx
PROG is set low
Write Lock Bits
1010 1100
111x xxxx
xxxx xxxx
iiii iiii
Write Lock Bits. Bits
written will be ANDed
together with the
existing lock bits.
Read Lock
Bits
0101 1000
xxxx xxxx
xxxx xxxx
oooo oooo
Read lock bits.
Read
Signature Byte
0011 0000
xxxx xxxx
xxxx xsss
oooo oooo
Read signature byte o
at address s
a: Page address
b: Even byte address
H: Odd or even (high or low) byte
c: Clock timing bits
s: Signature byte address
i: Input data
o: Output data
x: Don’t care
Table 16. SPI Flash Programming Instructions
Each instruction is sent in the order bytes
1 to 4, most significant bits first. All 4 bytes
must be sent, even if the last bits are 'x'.
The timing for the SPI interface is shown
in Figure 5. All timing parameters are
listed in Table 17.
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CC1010
Tsck, high
Tsck, low
Tsck, rise
Tsck, fall
SCK (P0.0)
7
SI (P0.1)
6
7
SO (P0.2)
5
6
Tsi, setup
4
5
3
4
2
3
Tsi, hold
1
2
0
1
0
Tso, delay
Figure 5. SPI Flash Programming Timing
Symbol
Fsck
Tsck, high
Tsck, low
Tsck, rise
Tsck, fall
Tsi, setup
Min
4 ⋅ TXOSC
4 ⋅ TXOSC
TXOSC
Max
fXOSC / 8
TXOSC /2
TXOSC /2
-
Tsi, hold
TXOSC
-
Tso, delay
-
TXOSC
Units
ns
ns
Conditions
The minimum time SCK must be held high
The minimum time SCK must be held low
The maximum rise time on SCK
The maximum fall time on SCK
The minimum setup time for SI before the positive edge
on SCK
The minimum hold time for SI after the positive edge on
SCK
The delay from the negative edge on SCK to valid data
on SO
Table 17. SPI Flash Programming Timing Parameters
15.12.2 Programming Enable
Programming Enable is always the first
instruction to be sent. It must be sent to
synchronise the data flow and enable
CC1010 to receive further instructions.
Synchronisation is achieved when byte 2
of the instruction (0x53) is echoed back
from the SPI interface as byte 3. If
synchronisation is not achieved, byte 3 will
return all zeros. In this case, an extra clock
pulse should be inserted on SCK, and the
Programming Enable instruction should be
resent. If synchronisation is not successful
within 32 attempts, Programming Enable
is unsuccessful and further debugging is
needed.
15.12.3 Set Flash Timing
The Set Flash Timing instruction is needed
to generate internal timing for the Flash
module. FLTIM must be set in instruction
byte 4 so that:
f XOSC
f
≤ FLTIM ≤ XOSC
0.8MHz
0.4 MHz
It is recommended to set FLTIM to the
smallest number satisfying the equation
above, to reduce the time needed for
Flash programming. For a 3.6864 MHz
crystal, FLTIM should be set to 5.
15.12.4 Chip Erase
The Chip Erase instruction erases all data
in the Flash memory, including the lock
bits. All bits will be set high.
Wait 450 ms (depending on Set Flash
Timing) after sending the Chip Erase
instruction
before
issuing
a
new
instruction.
15.12.5 Load Program Memory Page
The Load Program Memory Page
instruction is used to load the 128 bytes of
data in a page to a buffer in RAM. Each
instruction writes one byte to the 7 bit
address specified in the instruction.
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CC1010
15.12.6 Write Program Memory Page
The Write Program Memory Page
instruction writes the 128 bytes buffered
through the Load Program Memory Page
instructions to Flash memory.
After issuing this command, wait 5.4 ms
for it to complete. It is also possible to use
the Read Program Memory instruction to
poll when the program memory has been
written. When writing is in progress, all
read instructions will return 0xFF. Reading
an address containing data different from
0xFF can then be used to check when the
write is completed.
Bit
7:3
4
Name
BBLOCK
3:1
LSIZE[2:0]
0
SPIRE
15.12.7 Read Program Memory
The Flash program memory can be read
back byte by byte using the Read Program
Memory instruction. The data is returned
in byte 4 of the instruction.
Wait at least 9 ⋅ TXOSC between the last
negative transition on SCK for byte 3
before issuing the first positive edge on
SCK for byte 4 to receive valid data.
15.12.8 Write Lock Bits
The reading (through SPI) and writing to
the Flash program memory can be
disabled by setting the lock bits as
described in this section. This should be
used for software protection.
The lock bits are set using the Write Lock
Bits instruction. A block of programmable
size at the top of the Flash program
memory can be locked for writing using
the LSIZE bits. Page 0 can be
independently locked for writing by using
the BBLOCK bit. Reading data through the
SPI interface can be disabled using the
SPIRE bit.
Function
Reserved, write as '0'
Boot Block Lock
0 : Page 0 is write
protected
1 : Page 0 is writeable,
unless LSIZE is 000
Lock Size, sets the size of
the upper Flash area which
is write protected. Byte
sizes and page numbers
are listed below:
000 : 32768 (All pages)
001 : 16384 (page 128255)
010 : 8192 (page 192-255)
011 : 4096 (page 224-255)
100 : 2048 (page 240-255)
101 : 1024 (page 248-255)
110 : 512 (page 252-255)
111 : 0 (no pages)
SPI Read Flash Enable /
Disable
0 : SPI Interface returns all
zeros on the Read
Program Memory
instruction
1 : SPI Interface returns
valid Flash data on the
Read Program Memory
instruction
Table 18. Flash Lock Bits
Lock bits can only be erased (set high) by
issuing the Chip Erase instruction. If
multiple Write Lock Bits instructions are
issued without chip erase in between,
each lock bit will be AND-ed together with
the previously written lock bits.
In effect, this means that it is not possible
to unlock the Flash program memory
without also erasing it.
The effect of the different lock size bits are
illustrated in Figure 6.
The detailed description of all lock bits is
given in Table 18.
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0x4000
0x0000
130
129
128
127
126
2
1
0
LSIZE = 111
LSIZE = 101
LSIZE = 110
LOCKED
LSIZE = 100
LOCKED
UNLOCKED
UNLOCKED
LSIZE = 010
LSIZE = 000
LSIZE = 001
LSIZE = 011
LOCKED
LOCKED
LOCKED
UNLOCKED
UNLOCKED
0x6000
194
193
192
191
190
signature byte address is issued, and the
value is then returned as byte 4.
Signature
byte address
000
001
010
011
100
Value
0x7F
0x7F
0x7F
0x9E
0x95
101
0x00
Meaing
JEDEC manufacturer
ID, identifies Chipcon
AS as the
manufacturer.
Identifies 32 kBytes
of Flash memory
Identifies CC1010
Table 19. Signature Bytes
UNLOCKED
0x7000
226
225
224
223
222
UNLOCKED
0x7800
242
241
240
239
238
LOCKED
0x7C00
LOCKED
0x7E00
255
254
253
252
251
250
249
248
247
246
UNLOCKED
0x7FFF
Page number
Address
CC1010
Page 0 is locked when BBLOCK is cleared
Figure 6. Flash Lock Bits illustration
Wait at least 9 ⋅ TXOSC between the last
negative transition on SCK for byte 3
before issuing the first positive edge on
SCK for byte 4 to receive valid data, as
with the Read Program Memory
instruction.
15.12.11 SPI Flash Programming
Initialisation
CC1010 must be set into the Flash
programming mode to allow SPI Flash
operations. This is done as follows:
•
Apply power between all DVDD and
DGND pins.
•
Hold PROG low.
•
If a crystal is connected between
XOSC_Q1 and XOSC_Q2, hold RESET
15.12.9 Read Lock Bits
low and wait for the oscillator to start
up. Crystal oscillator start-up times are
given in Table 10. Release RESET
The lock bits described in the previous
section can be read through the SPI
interface by using the Read Lock Bits
instruction. The instruction will return the 8
lock bits in byte 4 of the instruction.
Wait at least 9 ⋅ TXOSC between the last
negative transition on SCK for byte 3
before issuing the first positive edge on
SCK for byte 4 to receive valid data, as
with the Read Program Memory
instruction.
The lock bits can only be read through the
SPI interface, and not from the 8051 core.
15.12.10 Read Signature Byte
A 6 byte chip signature can be read
through the SPI interface using the Read
Signature Byte instruction. The 3 bit
and wait at least 4 crystal oscillator
periods.
•
If a crystal is not connected between
XOSC_Q1 and XOSC_Q2, hold RESET
low and apply a clock signal to
XOSC_Q1. Release RESET after at
least 3 clock periods, and then wait at
least 4 clock periods.
•
Execute the Programming Enable
instruction to complete the SPI Flash
programming Initialisation.
CC1010 is now ready to be programmed, as
described in the next section.
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CC1010
15.12.12 Programming the Flash Memory
•
After the initialisation is completed, SPI
programming can be performed as follows:
Repeat the loading and writing of each
new page.
•
Programming can be verified using the
Read Program Memory instruction.
•
Set the lock bits using the Write Lock
Bits instruction.
•
Lock bits can be verified by using the
Read Lock Bits instruction.
•
Disable all interrupts except the Flash
/ Debug interrupt, which must be
enabled (through EICON.FDIE).
•
Store the 128 bytes of data to be
written in the external data memory.
The address of the first byte in the
buffer must be a multiple of 128.
•
Write the 4 most significant bits of the
RAM
buffer
address
to
FLCON.RMADR(3:0). Also set the bit
FLCON.WRFLASH.
•
Set the 8051 in Idle Mode by setting
PCON.IDLE. The Flash page is then
automatically
erased
and
programmed.
•
Device identity can be verified using
the Read Signature Byte instruction.
•
Perform Chip Erase.
•
Load one page into the buffer using
the Load Program Memory Page
instruction.
•
Write the buffer to Flash by using the
Write
Program
Memory
Page
instruction.
15.13 8051 Flash Programming
Each of the 256 pages (128 bytes each) in
Flash
program
memory
can
be
programmed individually from the 8051.
The 8051 must be set in Idle Mode while
programming the Flash, since it has no
access to the program memory while the
writing is in progress.
The step for writing a page to Flash is
described as follows:
•
Set the correct write cycle time,
according to the current crystal
oscillator frequency, in the FLTIM
SFR. This number is used to generate
the timing to the on-chip Flash
interface, as was also done with SPI
Flash programming. It must be set so
that:
f XOSC
f
≤ FLTIM ≤ XOSC
0.8MHz
0.4 MHz
•
The time used for programming a
Flash page is strongly dependent on
the setting in FLTIM. It is therefore
recommended to set FLTIM as low as
possible, as with the SPI Flash
programming.
•
Write the desired Flash page number
to the FLADR register.
The sequence of the above steps is not
important. Flash programming is started
whenever entering Idle Mode while
FLCON.WRFLASH is set.
A Flash / Debug interrupt will be generated
when the page write operation is
completed, which will get the 8051 out of
Idle Mode. An ISR must be present to
service the Flash / Debug interrupt.
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CC1010
FLADR (0xAE) - Flash Write Address Register
Bit
7:0
Name
FLADR(7:0)
R/W
R/W
Reset value
0x00
Description
The number of of the Flash page to be written (8 MSB
of the byte address)
FLCON (0xAF) - Flash Write Control Register
Bit
7
6:5
Name
R/W
R0
R/W
Reset value
0
00
4
WRFLASH
R/W
0
3:0
RMADR(3:0)
R/W
0x0
FLASH_LP
(1:0)
Description
Reserved, read as 0
Flash Low Power control bits
00 : The Flash module is always active.
01 : The Flash module enters standby mode when the
8051 is put in Idle mode or Stop mode
10 : The Flash module enters standby mode between
instruction fetches and when the 8051 is put in Idle
Mode or Stop Mode.
11 : Reserved for future use.
Write Flash Start bit
Starting a Flash page programming is done by first
setting this bit and then setting the 8051 in Idle Mode.
If the WRFLASH bit is cleared before Idle Mode is
entered, no programming is performed.
RAM Buffer address
RMADR(3:0) contains the 4 most significant bits of
the RAM address where the data is buffered before
writing to Flash
FLTIM (0xDD) - Flash Write Timing Register
Bit
7:0
Name
FLTIM(7:0)
R/W
R/W
Reset value
0x0A
If an attempt is made to write data to a
Flash page which is locked (see the
previous section), a Flash / Debug
interrupt will be generated immediately
after Idle Mode is entered. No data will be
written.
It is not possible to read or write the Flash
lock bits from the 8051.
Description
Flash Write Timing control
FLTIM must be set as described in this section prior
to using the 8051 Flash programming.
15.13.1 Example Code
Example C code writing data buffered at
address 0x100-0x17F in external RAM to
the second page in Flash (address 0x0800x0FF) is shown below. The system clock
frequency is assumed to be 3.6864 MHz.
An interrupt service routine must be
present at address 0x33, which clears the
interrupt flag EICON.FDIF and returns
from the interrupt (RETI).
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CC1010
FLTIM=0x05;
/*
FLADR=0x01;
/*
EICON|=0x20;
/*
IE&= ~0x80;
/*
FLCON=0x10 | (0x100
/*
PCON|=0x01;
/*
Set Flash timing for 3.6864 MHz clock frequency */
Write data to the second page in Flash */
Enable Flash interrupt */
Disable other interrupts */
>> 7);
Enable Flash writing, RAM buffer from addr. 0x100 */
Enter Idle Mode to start Flash writing.
15.14 Flash Power Control
The Flash module can be set into different
power modes using the control bits
FLCON.FLASH_LP(1:0) introduced in
the previous section.
After reset, the Flash module is always
active, drawing a static current of
approximately 2.5 mA (at nominal
operating conditions). However, to save
power the Flash module can be set in a
power-down mode between instructions in
Active mode, and always in Idle or PowerDown mode. This will save approximately
1.5 mA of the Flash current consumption
during operation in Active mode, and 2.5
mA during Idle or Power-Down mode.
15.15 In Circuit Debugging
In order to facilitate a software monitor for
in-circuit debugging/emulation capabilities
a number of hardware support features
have been implemented:
A breakpoint instruction has been added
to the 8051's instruction set. The
instruction, given the mnemonic TRAP, is a
single byte instruction with the opcode
0xA5. In the original 8051 the 0xA5
opcode is executed as a NOP instruction
(opcode 0x00.) In the modified core this
instruction raises a highest-level interrupt
(Flash / Debug) by setting the
corresponding interrupt flag EICON.FDIF
and waiting a sufficient number of
instruction cycles to allow the interrupt to
take effect before the next instruction.
The TRAP instruction can thus be written
over the first byte (opcode) of any other
instruction, the execution of which then will
result in a branch to a software debugging
monitor in the highest priority interrupt
service routine.
Single-stepping through instructions is
supported since exactly one instruction is
executed if an interrupt condition exists
when returning from an interrupt service
routine. Thus, single-stepping can be
accomplished simply by not clearing the
corresponding interrupt flag in the interrupt
service routine associated with the
software monitor.
A second serial port has been added to
enable debugging communication with a
host PC without disrupting applications
that use the main serial port for other
purposes.
Setting breakpoints and executing the
instructions which have a breakpoint
attached involves writing new data to the
Flash instruction memory several times.
Since the Flash memory can only
withstand 20000 (typical) erase/writecycles a simple instruction replacement
mechanism has been implemented. This
feature allows the surveillance of an
address in the instruction memory space
as defined in registers RADRL and RADRH.
When this address is encountered on the
Flash program memory address bus, the
data returned on the data bus is replaced
by the contents of register RDATA. Setting
RADRH=RADRL=0
disables
the
replacement mechanism.
This instruction replacement mechanism
can be used in different ways:
•
A simple way of setting a single soft
(not stored in FLASH) breakpoint, by
setting RDATA to 0xA5 (the TRAP
instruction) and RADR to the
breakpoint address.
•
A simple way of restoring the original
opcode byte of an instruction which
has been subjected to a hard (stored
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CC1010
in Flash) breakpoint, so that it can be
executed (in single-step mode).
•
SFRs (hardware registers) can
normally only be addressed directly
(i.e. by hardwiring the specific address
into
the
corresponding
MOV
instruction.) This would make code in
a debug monitor, which returns the
value of SFRs to a PC rather bloated.
Using the instruction replacement
mechanism on the operand byte of the
move instruction instead of the opcode
byte, allows indirect addressing of
SFRs.
Chipcon provides software for in-circuit
debugging, which may be downloaded
from the Chipcon homepage. This
software uses the RESERVED register,
which can then not be used for other
purposes. If in-circuit debugging is not
required, the RESERVED register shown
below may be used for any purpose.
Writing to it will have no effect on the
operation of CC1010.
Great caution should be used when the
RADR is written. Since the address
consists of two bytes (RADRL and RADRH),
there will be a short interval where the
address is not valid as only one of the
bytes are written at a time. If this
intermediate address point to the very
same location as of the code modifying the
RADR, a malfunction will occur. One
possible work-around is to first write
RADRH to a value pointing to a memory
location not used by the code.
RESERVED (0xE7) - Reserved register, used by Chipcon debugger software
Bit
7:0
Name
RESERVED(7:0)
R/W
R/W
Reset value
0x00
Description
Reserved register, which is used by Chipcon
debugger software. RESERVED may be used for
other purposes if Chipcon’s debugger software is
not needed.
RDATA (0xB9) - Replacement Data
Bit
7:0
Name
RDATA(7:0)
R/W
R/W
Reset value
0x00
Description
Replacement data.
Used to replace the byte at program memory
address RADR with the data from RDATA, if
RADR > 0.
RADRH (0xBB) - Replacement address, high byte
Bit
7:0
Name
RADR(15:8)
R/W
R/W
Reset value
0x00
Description
Replacement address, high byte.
Used to replace the byte at program memory
address RADR with the data from RDATA, if
RADR > 0.
RADRL (0xBA) - Replacement address, low byte
Bit
7:0
Name
RADR(7:0)
R/W
R/W
Reset value
0x00
Description
Replacement address, low byte.
Used to replace the byte at program memory
address RADR with the data from RDATA, if
RADR > 0
15.16 Chip Version / Revision
CC1010 has a SFR register CHVER that can
be read to decide the chip type and
current revision. The register description is
shown below.
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CC1010
CHVER (0x9F) - Chip Version / Revision Register
Bit
7:2
1:0
Name
CHIP_TYPE
CHIP_REV
R/W
R
R
Reset value
0x00
0x01
Description
CHIP_TYPE is a read-only status word, which
gives the type number of the chip.
000000 : CC1010
000001 - 111111 : Reserved for future use
CHIP_REV is a read only status word, which gives
the chip revision number of the chip. Current chip
revision is 01
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CC1010
16. 8051 Peripherals
CC1010 offers the following peripherals
•
Real-time clock
units controlled by the 8051-compatible
core:
•
SPI master
•
•
Hardware DES encryption / decryption
•
Random bit generator
10-bit ADC
Four general-purpose I/O ports, with
26 I/O pins in total.
•
Two standard 8051 timers
•
•
Two timers with PWM functionality
•
Watchdog timer
These modules are described in the
following sections.
16.1 General Purpose I/O
Four general purpose I/O-ports are
available: P0, P1, P2 and P3. Table 20
shows each port and the pins on each
port.
Each port is associated with two registers:
The port register (P0, P1, P2, or P3) and
the direction register (P0DIR, P1DIR,
P2DIR, or P3DIR).
Each bit in the Px registers has its
associated bit in the direction registers
PxDIR. Setting PxDIR.y will make Px.y
an input which can be read in Px(y). All
pins are inputs after reset. Clearing
PxDIR.y will make the pin Px.y output
the data from the register Px(y). All Px
and PxDIR register descriptions are
shown from page 49.
The structure for a single I/O-bit y on port
x is shown in Figure 7. Some ports have
alternate functions (such as the SPI
interface), which are enabled through
other registers (such as SPCR.SPE).
These alternate functions may or may not
override the direction setting from PxDIR
as shown.
When reading the Px registers, data is
read from the directly from the pin. When
using a read-modify-write instruction such
as
ANL Px, #0x01, the output register
value is read and modified regardless of
the setting in PxDIR.
Writing to the Px registers writes to the
output register, and sets the I/O pin state.
Using a read-modify-write operation reads
from the output register, modifies the value
according to the instruction executed and
writes the result back into the output
register, modifying the I/O pin state
accordingly.
In practice, this means that the mov
instruction should only be used when
writing to all the pins in the port. To modify
only a few pins, use a read-modify-write
instruction. Also, be careful of using
constructs in C or another high-level
language that result in a mov from the Px
registers, modify the result and write it
back (without using read-modify-write
instructions), as this will cause problems if
not all I/O pins in the port are configured
as outputs. In C, the |=, &= and ^=
operators should be used to set, clear and
toggle pins respectively.
The CC1010 ports deviate from the
standard 8051-port in the following ways:
•
No pull-ups / pull-downs on pins
•
Dedicated direction bits in PxDIR
registers
•
CMOS output levels on all ports
All general-purpose I/O pins are rated to
sink or source 2 mA, except pin P2.3,
which is rated to sink or source 8 mA.
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CC1010
Port
P0
P1
P2
P3
Available
pins
P0.0
P0.1
P0.2
P0.3
P1.0
P1.1
P1.2
P1.3
P1.4
P1.5
P1.6
P1.7
P2.0
P2.1
P2.2
P2.3
P2.4
P2.5
P2.6
P2.7
P3.0
P3.1
P3.2
P3.3
P3.4
P3.5
Normal operation
SCK, SPI Serial Clock output
MO, SPI Master Output
MI, SPI Master Input
-
RXD1, Serial port 1 input
TXD1, Serial port 1 output
-
RXD0, Serial port 0 input
TXD0, Serial port 0 output
INT0 , External interrupt 0
Alternate Function
Flash Programming
SCK, SPI Serial Clock Input
SI, SPI Slave Input
SO, SPI Slave Output
-
INT1 , External interrupt 1
T0, Counter input 0 to Timer 0, or
PWM2, PWM output from Timer 2
T1, Counter input 1 to Timer 1, or
PWM3, PWM output from Timer 3
-
Table 20. Available I/O-Ports
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CC1010
Alternate function enable
Alternate function static
direction or PxDIR.y
PxDIR.y
1
Alternate data
S
0
Read output register enable
1
Internal Data Bus
D
S
Px.y PAD
Q
0
Output register
Read Pin Enable
Figure 7. Port x bit y structure
P0 (0x80) - Port 0 Data Register
Bit
7
6
5
4
3
2
1
0
Name
P0_3
P0_2
P0_1
P0_0
R/W
R0
R0
R0
R0
R/W
R/W
R/W
R/W
Reset value
0
0
0
0
1
1
1
1
Description
Reserved, read as 0
Reserved, read as 0
Reserved, read as 0
Reserved, read as 0
Data of port 0, bits 0 to 3.
P1 (0x90) - Port 1 Data Register
Bit
7
6
5
4
3
2
1
0
Name
P1_7
P1_6
P1_5
P1_4
P1_3
P1_2
P1_1
P1_0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset value
1
1
1
1
1
1
1
1
Description
Data of port 1, bits 0 to 7.
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CC1010
P2 (0xA0) - Port 2 Data Register
Bit
7
6
5
4
3
2
1
0
Name
P2_7
P2_6
P2_5
P2_4
P2_3
P2_2
P2_1
P2_0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset value
1
1
1
1
1
1
1
1
Description
Data of port 2, bits 0 to 7
P3 (0xB0) - Port 3 Data Register
Bit
7
6
5
4
3
2
1
0
Name
P3_5
P3_4
P3_3
P3_2
P3_1
P3_0
R/W
R0
R0
R/W
R/W
R/W
R/W
R/W
R/W
Reset value
0
0
1
1
1
1
1
1
Description
Reserved, read as 0
Reserved, read as 0
Data of port 3, bits 0 to 5
P0DIR (0xA4) - Port 0 Direction Register
Bit
7
6
5
4
3
2
1
0
Name
P0DIR_3
P0DIR_2
P0DIR_1
P0DIR_0
R/W
R0
R0
R0
R0
R/W
R/W
R/W
R/W
Reset value
0
0
0
0
1
1
1
1
Description
Reserved, read as 0
Reserved, read as 0
Reserved, read as 0
Reserved, read as 0
Port 0 direction register, bit 0 to 3. Each bit sets the
direction of the associated pin on Port 0.
0 : Associated pin is an output
1 : Associated pin is an input
P1DIR (0xA5) - Port 1 Direction Register
Bit
7
6
5
4
3
2
1
0
Name
P1DIR_7
P1DIR_6
P1DIR_5
P1DIR_4
P1DIR_3
P1DIR_2
P1DIR_1
P1DIR_0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset value
1
1
1
1
1
1
1
1
Description
Port 1 direction register, bit 0 to 7. Each bit sets the
direction of the associated pin on Port 1.
0 : Associated pin is an output
1 : Associated pin is an input
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CC1010
P2DIR (0xA6) - Port 2 Direction Register
Bit
7
6
5
4
3
2
1
0
Name
P2DIR_7
P2DIR_6
P2DIR_5
P2DIR_4
P2DIR_3
P2DIR_2
P2DIR_1
P2DIR_0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset value
1
1
1
1
1
1
1
1
Description
Port 2 direction register, bit 0 to 7. Each bit sets the
direction of the associated pin on Port 2.
0 : Associated pin is an output
1 : Associated pin is an input
P3DIR (0xA7) - Port 3 Direction Register
Bit
7
6
5
4
3
2
1
0
Name
P3DIR_5
P3DIR_4
P3DIR_3
P3DIR_2
P3DIR_1
P3DIR_0
R/W
R0
R0
R/W
R/W
R/W
R/W
R/W
R/W
Reset value
0
0
1
1
1
1
1
1
Description
Reserved, read as 0
Reserved, read as 0
Port 3 direction register, bit 0 to 7. Each bit sets the
direction of the associated pin on Port 3.
0 : Associated pin is an output
1 : Associated pin is an input
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CC1010
16.2 Timer 0 / Timer 1
CC1010
contains two standard 8051
timers/counters (Timer 0 and Timer 1)
which can operate as either a timer with a
clock rate based on the system clock (as
defined by the current clock mode), or as
an event counter clocked by the T0 (P3.4
for Timer 0) or T1 (P3.5 for Timer 1)
inputs.
Each Timer / Counter has a 16-bit register
which is readable and writeable through
TL0 and TH0 for Timer / Counter 0 and
TL1 and TH1 for Timer / Counter 1. These
registers are described below.
TL0 (0x8A) - Timer / Counter 0 Low byte counter value
Bit
7:0
Name
TL0(7:0)
R/W
R/W
Reset value
0x00
Description
Timer / Counter 0, low byte counter value
TL1 (0x8B) - Timer / Counter 1 Low byte counter value
Bit
7:0
Name
TL1(7:0)
R/W
R/W
Reset value
0x00
Description
Timer / Counter 1, low byte counter value
TH0 (0x8C) - Timer / Counter 0 High byte counter value
Bit
7:0
Name
TH0(7:0)
R/W
R/W
Reset value
0x00
Description
Timer / Counter 0, high byte counter value
TH1 (0x8D) - Timer / Counter 1 High byte counter value
Bit
7:0
Name
TH1(7:0)
16.2.1
R/W
R/W
Reset value
0x00
Description
Timer / Counter 1, high byte counter value
Timer / Counter 0 and 1 Modes
Timer / Counter 0 and 1 can individually
be programmed to operate in one out of
four different modes, controllable through
the registers TMOD and TCON. They are as
follows:
•
13-bit timer / counter (Mode 0)
•
16-bit timer / counter (Mode 1)
•
8-bit timer / counter with auto-reload
(Mode 2)
•
Two 8-bit timers / counters (Mode 3,
Timer 0 only)
See the register descriptions for TMOD and
TCON on the following pages.
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CC1010
TMOD (0x89) - Timer / Counter 0 and 1 Mode register
Bit
7
Name
GATE1
R/W
R/W
Reset value
0
Description
Timer / Counter 1 gate control
0 : Timer / Counter 1 will clock only when TCON.TR1 is set.
1 : Timer / Counter 1 will clock only when TCON.TR1 is set
and the INT0 input is high.
6
C/ T 1
R/W
0
5
4
M1.1
M1.0
R/W
R/W
0
0
3
GATE0
R/W
0
Counter / Timer select for Counter / Timer 1
0 : Timer 1 is clocked by the system clock divided by 4 or 12,
depending on the state of CKCON.T1M (see page 55)
1 : Timer 1 is clocked by the T1 pin.
Timer / Counter 1 mode select bits
00 : 13-bit counter
01 : 16-bit counter
10 : 8-bit counter with auto-reload
11 : Timer 1 off
Timer / Counter 0 gate control
0 : Timer / Counter 0 will clock only when TCON.TR0 is set.
1 : Timer / Counter 0 will clock only when TCON.TR0 is set
and the INT0 input is high.
2
C/ T 0
R/W
0
1
0
M0.1
M0.0
R/W
R/W
0
0
Counter / Timer select for Counter / Timer 0
0 : Timer 0 is clocked by the system clock divided by 4 or 12,
depending on the state of CKCON.T0M (see page 55)
1 : Timer 0 is clocked by the T0 pin.
Timer / Counter 0 mode select bits
00 : 13-bit counter
01 : 16-bit counter
10 : 8-bit counter with auto-reload
11 : Two 8-bit counters
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CC1010
TCON (0x88) - Timer / Counter 0 and 1 control register
Bit
7
Name
TF1
R/W
R/W
Reset value
0
6
TR1
R/W
0
5
TF0
R/W
0
4
TR0
R/W
0
3
IE1
R/W0
0
Description
Timer 1 overflow flag. TF1 is set to 1 by hardware when the
Timer 1 count overflows and is cleared by hardware when the
8051 vectors to the interrupt service routine.
Timer 1 run control bit
0 : Timer / Counter 1 is disabled
1 : Timer / Counter 1 is enabled
Timer 0 overflow flag. TF0 is set to 1 by hardware when the
Timer 0 count overflows and is cleared by hardware when the
8051 vectors to the interrupt service routine.
Timer 0 run control bit
0 : Timer / Counter 0 is disabled
1 : Timer / Counter 0 is enabled
External interrupt 1 edge detect (interrupt flag)
If external interrupt 1 is configured to be edge sensitive
(TCON.IT1 = 1), IE1 is set by hardware when a negative
edge is detected on the INT1 pin and is cleared by hardware
when the 8051 vectors to the corresponding interrupt service
routine. In edge-sensitive mode, IE1 can also be set by
software.
If external interrupt 1 is configured to be level-sensitive
(TCON.IT1 = 0), IE1 is set when the INT1 pin is low and
cleared when the INT1 pin is high. In level-sensitive mode,
2
IT1
R/W
0
software cannot write to IE1.
External interrupt 1 type select.
0 : The INT1 interrupt is triggered when INT1 is low (level
sensitive).
1 : The INT1 interrupt is triggered on the falling edge (edge
1
IE0
R/W0
0
sensitive)
External interrupt 0 edge detect (interrupt flag)
If external interrupt 0 is configured to be edge sensitive
(TCON.IT0 = 1), IE0 is set by hardware when a negative
edge is detected on the INT0 pin and is cleared by hardware
when the 8051 vectors to the corresponding interrupt service
routine. In edge-sensitive mode, IE0 can also be set by
software.
If external interrupt 0 is configured to be level-sensitive
(TCON.IT0 = 0), IE0 is set when the INT0 pin is low and
cleared when the INT0 pin is high. In level-sensitive mode,
0
IT0
R/W
0
software cannot write to IE0.
External interrupt 0 type select.
0 : The INT0 interrupt is triggered when INT0 is low (level
sensitive).
1 : The INT0 interrupt is triggered on the falling edge (edge
sensitive)
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CC1010
CKCON (0x8E) - Timer Clock rate Control Register
Bit
7
6
5
4
Name
T1M
R/W
R0
R0
R0
R/W
Reset value
0
0
0
0
3
T0M
R/W
0
2:0
MD(2:0)
R/W
001
16.2.2
Description
Reserved, read as 0
Reserved, read as 0
Reserved, read as 0
Timer 1 clock select. T1M has no effect in counter mode.
0 : Timer 1 uses the µC clock divided by 12 (for
compatibility with the 80C32)
1 : Timer 1 uses the µC clock divided by 4
Timer 0 clock select. T0M has no effect in counter mode.
0 : Timer 0 uses the µC clock divided by 12 (for
compatibility with the 80C32)
1 : Timer 0 uses the µC clock divided by 4
MD(2:0) controls the memory stretch cycles when
accessing the external RAM. The reset value is 001, but
for faster access to external RAM, MD(2:0) should
always be written 000.
Mode 0
Mode 0 operation is illustrated for timer or
counter 0 and 1 in Figure 8. The timer /
counter uses bit 0 to 4 of TL0 / TL1 and all
8 bits of TH0 / TH1 as a 13 bit counter.
TCON.TR0 / TCON.TR1 must be set to
enable the Timer / Counter.
The C/T bit in TMOD selects the Timer or
Counter clock source as described.
Transitions are counted from the selected
source, as long as TMOD.GATE0 /
TMOD.GATE1 is 0, or TMOD.GATE0 /
TMOD.GATE1 is 1 and the corresponding
interrupt
pin
( INT0 / INT1 )
is
When the 13-bit count increments from
0x1FFF (all ones), the counter rolls over to
all zeros. The overflow flag TCON.TF0 /
TCON.TF1 is then set.
The 3 most significant bits in TL0 / TL1
are undetermined in Mode 0, and should
be masked by software for evaluation.
In Mode 0, the timer timeout period is
determined by:
T=
(12 − 8 ⋅ CKCON .TxM )(8192 − THx : TLx )
f xosc
where THx:TLx is the contents of the
THx:TLx registers if this is reloaded in the
interrupt handler, or 0 if no reload is done.
deasserted.
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CC1010
Divide by 12
0
System Clk
Divide by 4
1
T0M / T1M
0
C/T0 / C/T1
1
T0 / T1
TL0 / TL1
TR0 / TR1
Clock
0
1
2
3
4
5
6
7
5
6
7
Mode 0
GATE0 / GATE1
Mode 1
INT0 / INT1
TH0 / TH1
0
1
2
3
4
Timer 0 / Timer 1
interrupt request
TF0 / TF1
Figure 8. Mode 0 and Mode 1 operation for Timer / Counter 0 or 1
16.2.3
Mode 1
Mode 1 operation is illustrated for Timer /
Counter 0 and 1 in Figure 8. The counter
is configured as a 16-bit counter, as
compared to the 13 bits in Mode 0, and all
bits in TL0 or TL1 are thus used. The
counter overflows when the count
increments from 0xFFFF.
Otherwise, Mode 1 operation is the same
as Mode 0.
In Mode 1, the timer timeout period is
determined
by:
(12 − 8 ⋅ CKCON .TxM )(65536 − THx : TLx )
T=
f xosc
16.2.4
Mode 2
Mode 2 operation is illustrated for Timer /
Counter 0 and 1 in Figure 9. Mode 2
operates as an 8-bit counter with
automatic reload of the start value.
The Timer / Counter is controlled as for
Mode 0 and Mode 1, but when TL0 / TL1
overflows, TH0 / TH1 is loaded into TL0 /
TL1.
In Mode 2, the timer timeout period is
determined by:
T=
(12 − 8 ⋅ CKCON .TxM )(256 − THx )
f xosc
where THx:TLx is the contents of the
THx:TLx registers if this is reloaded in the
interrupt handler, or 0 if no reload is done.
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CC1010
Divide by 12
0
System Clk
Divide by 4
1
T0M / T1M
0
C/T0 / C/T1
1
T0 / T1
TL0 / TL1
TR0 / TR1
Clock
Reload
Mux
GATE0 / GATE1
TH0 / TH1
INT0 / INT1
TF0 / TF1
Timer 0 / Timer 1
interrupt request
Figure 9. Mode 2 operation for Timer / Counter 0 or 1
16.2.5
Mode 3
In Mode 3, which is illustrated in Figure 10,
Timer 0 is operated as two separate 8-bit
counters and Timer 1 stops counting and
holds its value.
TL0 is configured as an 8-bit counter
controlled by the normal Timer 0 control
bits. It counts either clock cycles divided
by 4 or by 12 (as given by CKCON.T0M), or
high to low transitions on T0 (as given by
TMOD.C/ T 0). It is also possible to use
the GATE function for TL0 to set INT0 as
count enable.
TH0 is locked into a timer function, and
takes over the use of TR1 and TF1 from
Timer 1. It counts clock cycles divided by 4
or 12 (as given by CKCON.T1M). TH0 may
then generate Timer 1 interrupts.
still be used for baud rate generation and
the Timer 1 count values are still available
in the TL1 and TH1 registers.
Control of Timer 1 when Timer 0 is in
mode 3 is done through the Timer 1 mode
bits. To turn Timer 1 on, set Timer 1 to
mode 0, 1 or 2. To turn Timer 1 off, set it
to mode 3. Timer 1 can count clock cycles
divided by 4 or 12 or high to low transitions
on the T1 pin. The GATE function is also
available.
In Mode 3, the timer timeout periods are
determined by:
T=
(12 − 8 ⋅ CKCON .TxM )(256 − TYx)
f xosc
where TYx is the contents of the THx or
TLx register if this is reloaded in the
interrupt handler, or 0 if no reload is done.
Timer 1 has limited usage when Timer 0 is
in mode 3. This is because Timer 0 uses
the Timer 1 control bit TR1 and the
interrupt flag TF1. However, Timer 1 can
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CC1010
Clock
TR1
TH0
Divide by 12
µC Clk
Divide by 4
0 T0M
1
0
C/T0
1
TF1
T0
Timer 1 interrupt
request
TL0
TR0
Clock
GATE0
TF0
Timer 0 interrupt
request
INT0
Figure 10. Mode 3 operation for Timer / Counter 0
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CC1010
16.3 Timer 2 / 3 with PWM
CC1010 also features two timers with pulse
width modulation (PWM) outputs. Each
timer can generate interrupts, as
described in the Interrupts section on page
28. The timers are individually set in one
of two modes, timer mode or PWM mode.
This is controlled through the bits M2 and
M3 in the TCON2 control register shown
below.
Timer 2 and Timer 3 are enabled
individually through the bits TCON2.TR2
and TCON2.TR3.
TCON2 (0xA9) - Timer Control register 2
Bit
7
6
5
4
3
Name
TR3
R/W
R0
R0
R0
R0
R/W
Reset value
0
0
0
0
0
2
M3
R/W
0
1
TR2
R/W
0
0
M2
R/W
0
16.3.1
Description
Reserved, read as 0
Reserved, read as 0
Reserved, read as 0
Reserved, read as 0
Timer 3 run control
0 : Timer 3 is disabled. The Timer 3 counter is cleared.
1 : Timer 3 is enabled.
Timer 3 mode control.
0 : Timer 3 is in timer mode.
1 : Timer 3 is in PWM mode. P3.5 is set to be an output,
overriding P3DIR(5)
Timer 2 run control
0 : Timer 2 is disabled. The Timer 2 counter is cleared.
1 : Timer 2 is enabled.
Timer 2 mode control.
0 : Timer 2 is in timer mode.
1 : Timer 2 is in PWM mode. P3.4 is set to be an output,
overriding P3DIR(4)
Timer Mode
Timer 2 / Timer 3 can be set in Timer
Mode by clearing the bit TCON2.M2 /
TCON2.M3. Timer Mode operation is
illustrated in Figure 11. The 16 bit counter
is preloaded with T2 and T2PRE (or T3
and T3PRE) as shown. When disabling the
timer through clearing TCON2.TR2 (or
TCON2.TR3) the counter is also
preloaded. The counter value cannot be
read by software.
When the counter underflows (decrements
from a zero value), it is loaded with the
contents of T2 / T3 and T2PRE / T3PRE,
and the interrupt request bit EXIF.TF2 /
EXIF.TF3 is set by hardware. The
interrupt request must be cleared by
software.
In Timer mode, interrupts are generated
with an interval as given by TnINT , where
n⊆{2,3} :
TnInt =
255 ⋅ (TnPRE ⋅ 256 + Tn + 1)
f system
As long as TnPRE and Tn are set before
TCON.TRn, the first interrupt is generated
TnINT after enabling the timer and then with
TnINT intervals.
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CC1010
Timer 2 (or Timer 3)
16 bit counter
System
Clock
Divide
by 255
Clk
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
Mux
0
1
2
3
4
Underflow
EXIF.TF2
(or EXIF.TF3)
Mux
5
6
7
0
1
T2 (or T3)
2
3
4
5
6
Timer 2
(or Timer 3)
interrupt request
7
T2PRE (or T3PRE)
TR2
(or TR3)
Figure 11. Timer Mode operation for Timer 2 / Timer 3
T2PRE (0xAA) - Timer 2 Prescaler Control
Bit
7:0
Name
T2PRE(7:0)
R/W
R/W
Reset value
0x00
Description
Timer 2 Prescaler Control.
In Timer Mode, T2PRE sets the 8 most significant bits of
the 16-bit counter reload value. In PWM Mode, T2PRE
sets the prescaler value that sets the PWM period.
T3PRE (0xAB) - Timer 3 Prescaler Control
Bit
7:0
Name
T3PRE(7:0)
R/W
R/W
Reset value
0x00
Description
Timer 3 Prescaler Control.
In Timer Mode, T3PRE sets the 8 most significant bits of
the 16-bit counter reload value. In PWM Mode, T3PRE
sets the prescaler value that sets the PWM period.
T2 (0xAC) - Timer 2 Low byte counter value
Bit
7:0
Name
T2(7:0)
R/W
R/W
Reset value
0x00
Description
In Timer Mode, T2 sets the 8 least significant bits of the
16-bit counter reload value. In PWM Mode T2 sets the
PWM duty cycle.
T3 (0xAD) - Timer 3 Low byte counter value
Bit
7:0
Name
T3(7:0)
16.3.2
R/W
R/W
Reset value
0x00
Description
In Timer Mode, T3 sets the 8 least significant bits of the
16-bit counter reload value. In PWM Mode T3 sets the
PWM duty cycle.
PWM Mode
Timer 2 /Timer 3 can be set in PWM Mode
by setting the bit TCON2.M2 / TCON2.M3.
The pins P3.4 / P3.5 are then enabled as
outputs, overriding the port direction bit
P3DIR.4 / P3DIR.5. The port direction is
overridden independent of the timer run
control bit TCON2.TR2 / TCON2.TR3.
Interrupts are not generated in PWM
mode.
P3.4 is the PWM output for timer 2, P3.5
is the PWM output for Timer 3.
The PWM operation is illustrated in Figure
13. The PWM period TnPWM for timer n is
set by TnPRE:
TnPWM =
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255 ⋅ (TnPRE + 1)
f system
Page 60 of 152
CC1010
The PWM “high” state duration TnhPWM for
timer n is set by Tn:
TnhPWM =
This means that in PWM mode, setting Tn
to 0 produces a constant low output and
setting Tn to 255 produces a constant high
output. The timing of the PWM outputs is
illustrated in Figure 12.
Tn ⋅ (TnPRE + 1)
f system
TnPWM
TnPWM
PWMn
Output
TnhPWM
TnhPWM
Figure 12. PWM Timing illustration
Timer 2 or Timer 3
System Clk
Divide by
TnPRE + 1
8 bit counter
(counts 0-254)
A
PWM output
A>B?
TnPWM
B
Figure 13. PWM operation for Timer 2 / Timer 3
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CC1010
16.4 Power On Reset (Brown-Out Detection)
The Power On Reset functionality detects
power-on and brown-out situations, and
includes glitch immunity and hysteresis for
noise and transient stability.
The power on reset functionality is
disabled using the dedicated POR_E pin.
Grounding POR_E will disable the internal
power on reset. An external power-on-
reset module should then be connected to
the external RESET pin.
The Power On Reset and Brown-Out
Detection voltage levels are specified in
the Electrical Specifications section at
page 7.
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CC1010
16.5 Watchdog Timer
CC1010 includes an 8-bit watchdog timer
that is clocked by the system clock. The
clock is divided by a number in the range
from 2048 to 16384, controllable through
WDT.WDTPRE(1:0). The divided clock
controls an 8-bit timer, which generates
system reset upon overflow. A block
diagram for the Watchdog Timer is shown
in Figure 14.
Chipcon recommends that the watchdog
timer should be disabled when the CC1010
is clocked from the 32 kHz oscillator
(Clock mode 1).
Note that the watchdog timer is not active
in Power-down mode, and therefore
cannot wake up the CC1010 from PowerDown mode.
WDT (0xD2) - Watchdog Timer Control Register
Bit
7
6
5
4
Name
WDTSE
R/W
R0
R0
R0
R/W
Reset value
0
0
0
0
3
WDTEN
R/W
1
2
WDTCLR
R0/
W
0
1:0
WDTPRE.1
R/W
11
Description
Reserved, read as 0
Reserved, read as 0
Reserved, read as 0
Watchdog Timer Stop Enable, used to disable the
watchdog timer
Watchdog Timer Enable / Disable
0 : The watchdog timer is disabled
1 : The watchdog timer is enabled
The watchdog timer is enabled after reset. To disable the
watchdog timer, WDTSE must be used as described in this
section.
Watchdog timer clear signal. WDTCLR must periodically
be set to prevent the watchdog timer from resetting the
system. WDTCLR is cleared by hardware, and is thus
always read 0.
0 : Normal watchdog operation
1 : Watchdog timer is cleared.
Watchdog timer prescaler control. WDTPRE(1:0)
controls the division of the main crystal oscillator clock to
generate the watchdog timer clock.
00 : fWDT = fXOSC / 2048
01 : fWDT = fXOSC / 4096
10 : fWDT = fXOSC / 8192
11 : fWDT = fXOSC / 16384
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CC1010
Enable
Clear
/16384
/8192
/4096
Watchdog Prescaler
/2048
System clock
WDTPRE(1:0)
WDTCLR
Enable
Clear
Overflow
8 Bit Watchdog Counter
WDTEN
System
Reset
Figure 14. Watchdog Timer
Setting different prescaler settings,
combined with different Main Crystal
Oscillator frequencies, generates reset at
an interval of:
WDTPRE.1
WDTPRE.0
Division Rate
0
0
1
1
0
1
0
1
2048
4096
8192
16384
256 ⋅ 2 (11+WDTPRE )
f system
The intervals for the maximum and
minimum clock frequencies are shown in
Table 21 below.
Reset timing, given
fXOSC = 3MHz
175 ms
350 ms
699 ms
1400 ms
Reset timing, given
fXOSC = 24MHz
21.8 ms
43.7 ms
87.4 ms
175 ms
Table 21. Watchdog Timer timing
16.5.1
Disabling the Watchdog Timer
The Watchdog Timer is enabled after
system reset, through the Watchdog Timer
enable flag WDT.WDTEN. To disable the
Watchdog Timer, this flag must be
cleared. However, clearing this flag
requires the user to first set the flag
WDT.WDTSE,
and
then
clearing
WDT.WDTEN within 16 system clock
periods (preferably in the next instruction).
If interrupts are enabled while disabling
the Watchdog Timer, the user must make
sure that WDT.WDTEN is actually cleared.
This could for instance be done as follows:
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CC1010
while (WDT & 0x08) {
WDT |= 0x10; // Set WDTSE
WDT &= ~0x08; // Clear WDTEN
}
16.5.2
Enabling the Watchdog Timer
Enabling the Watchdog Timer is simply
done by setting WDT.WDTEN. Using the
WDT.WDTSE control bit is not required.
16.6 Real-time Clock
The real-time clock can generate
interrupts with intervals ranging from 1 to
127 seconds. It is connected to the 32.768
kHz crystal oscillator, which is disabled
after reset. It must be enabled as
described in the section on page 33. An
external 32.768 kHz clock signal can also
be applied, as described.
The interrupt interval is programmed in the
range from 1 through 127 seconds by
setting RTCON.RT(6:0). The timer is
enabled by setting RTCON.RTEN. The first
interrupt will be generated RT seconds
after RTEN is set.
The real-time clock interrupt must be
enabled as described in the Interrupts
section on page 28.
The RTC oscillator circuit is shown in
Figure 15. The loading capacitors values
can be calculated as described for the
main crystal oscillator at page 32.
RTCON (0xED) – Real-time Clock Control Register
Bit
7
Name
RTEN
R/W
R/W
Reset value
0
6:0
RT(6:0)
R/W
0x00
Description
Real-time Clock Enable / Disable
0 : Real-time Clock is disabled
1 : Real-time Clock is enabled
Real-time Clock interrupt interval control. RT(6:0) gives
the desired interrupt interval in seconds. RT(6:0) must be
between 1 and 127.
XOSC32_Q1
XOSC32_Q2
XTAL
32.768 kHz
C12
C13
Figure 15. RTC oscillator circuit
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CC1010
16.7 Serial Port 0 and 1
Two serial ports, serial port 0 and 1, are
implemented. They are controlled through
the SCON0 and SCON1 control register.
The data is buffered in SBUF0 and SBUF1.
Serial port 0 may be used for general
purpose serial communication. Timer 1
may be used to generate different baud
rates. Serial port 1 is primarily for use with
an in-circuit-debugger, but can also be
used
for
general
purpose
serial
communication. A block diagram is shown
in Figure 16.
must be configured in a certain way in
order to allow serial communication. This
is summarized in Table 22.
The mode is set in SCON0.SMx_0 /
SCON1.SMx_0.
To
receive
data,
SCON0.REN_0 / SCON1.REN_1 must be
enabled for the ports. Separate transmit
and receive interrupt flags are available in
SCON0.TI_0 / RI_0 and SCON1.TI_1 /
RI_1. Note that the baud rate also
depends on the Clock Mode selected (see
page 35).
The general-I/O ports that map to the
same physical pins as the serial ports
Data Bus
Write SBUF
Read SBUF
SBUF0/SBUF1
(Transmit)
TXD0/TXD1
SBUF0/SBUF1
(Receive)
Mode 0
Transmit
Load SBUF
Receive
Shift Register
RXD0/RXD1
Interrupt
Request
RI_0/RI_1
TI_0/TI_1
SCON0/SCON1
RX
Mode 0
Mode 1-3
UART0
P3.0
x
x
P3.1
1
x
P3DIR.0
1
1
P3DIR.1
0
x
UART1
P2.0
x
x
P2.1
1
x
P2DIR.0
1
1
P2DIR.1
0
x
TX
Figure 16. Serial ports block diagram
Mode 0
Mode 1-3
1
x
1
1
0
x
0
0
1
x
1
1
0
x
0
0
Table 22. Configuration of general purpose I/O for UART0 and UART1
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CC1010
SBUF0 (0x99) - Serial Port 0, data buffer
Bit
7:0
Name
SBUF0(7:0)
R/W
R/W
Reset value
0x00
Description
Serial Port 0, data buffer.
SBUF1 (0xC1) – Serial Port 1, data buffer
Bit
7:0
Name
SBUF1(7:0)
R/W
R/W
Reset value
0x00
Description
Serial Port 1, data buffer
SCON0 (0x98) - Serial Port 0 Control Register
Bit
7
Name
SM0_0
R/W
R/W
Reset value
0
6
SM1_0
R/W
0
5
SM2_0
R/W
0
4
REN_0
R/W
0
3
TB8_0
R/W
0
2
RB8_0
R/W
0
1
TI_0
R/W
0
0
RI_0
R/W
0
Description
Serial Port 0 mode bits, decoded as:
SM0_0 SM1_0 Mode
0
0
0 (Synchronous half duplex)
0
1
1 (Asynchronous full duplex, start + stop bit)
1
0
2 (Asynchronous full duplex, start + stop bit,
9th data bit)
1
1
3 (Asynchronous full duplex, start + stop bit,
9th data bit)
Multiprocessor communication enable. In modes 2 and 3
SM2_0 = 1 enables the multiprocessor communication feature:
In mode 2 or 3 RI_0 will not be activated if the received 9th bit
is 0. If SM2_0 = 1 in mode 1, RI_0 will only be activated if a
valid stop bit is received. In mode 0 SM2_0 establishes the
baud rate: when SM2_0 = 0 the baud rate is clk / 12; when
SM2_0 = 1 the baud rate is clk / 4.
Receive enable. When REN_0 = 1 reception is enabled.
Defines the state of the 9th data bit transmitted in modes 2 and
3.
In modes 2 and 3 RB8_0 indicates the state of the 9th bit
received. In mode 1 RB8_0 indicates the state of the received
stop bit. In mode 0 RB8_0 is not used.
Transmit interrupt flag. Indicates that the transmit data word
has been shifted out. In mode 0 TI_0 is set at the end of the
8th data bit. In all other modes TI_0 is set when the stop bit is
placed on the TXD0 pin. TI_0 must be cleared by the
software.
Receive interrupt flag. Indicates that a serial data word has
been received. In mode 0 RI_0 is set at the end of the 8th
data bit. In mode 1 RI_0 is set after the last sample of the
incoming stop bit, subject to the state of SM2_0. In modes 2
and 3 RI_0 is set at the end of the last sample of RB8_0.
RI_0 must be cleared by the software.
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CC1010
SCON1 (0xC0) - Serial Port 1 Control Register
Bit
7
Name
SM0_1
R/W
R/W
Reset value
0
6
SM1_1
R/W
0
5
SM2_1
R/W
0
4
REN_1
R/W
0
3
TB8_1
R/W
0
2
RB8_1
R/W
0
1
TI_1
R/W
0
0
RI_1
R/W
0
16.7.1
Description
Serial Port 1 mode bits, decoded as:
SM0_1 SM1_1 Mode
0
0
0 (Synchronous half duplex)
0
1
1 (Asynchronous full duplex, start + stop bit)
1
0
2 (Asynchronous full duplex, start + stop bit,
9th data bit)
1
1
3 (Asynchronous full duplex, start + stop bit,
9th data bit)
Multiprocessor communication enable. In modes 2 and 3
SM2_1 = 1 enables the multiprocessor communication feature:
In mode 2 or 3 RI_1 will not be activated if the received 9th bit
is 0. If SM2_1 = 1 in mode 1 RI_1 will only be activated if a
valid stop bit is received. In mode 0 SM2_1 establishes the
baud rate: when SM2_1 = 0 the baud rate is clk / 12; when
SM2_1= 1 the baud rate is clk / 4.
Receive enable. When REN_1 = 1 reception is enabled.
Defines the state of the 9th data bit transmitted in modes 2 and
3.
In modes 2 and 3 RB8_1 indicates the state of the 9th bit
received. In mode 1 RB8_1 indicates the state of the received
stop bit. In mode 0 RB8_1 is not used.
Transmit interrupt flag. Indicates that the transmit data word
has been shifted out. In mode 0 TI_1 is set at the end of the
8th data bit. In all other modes TI_1 is set when the stop bit is
placed on the TXD1 pin. TI_1 must be cleared by the
software.
Receive interrupt flag. Indicates that a serial data word has
been received. In mode 0 RI_1 is set at the end of the 8th
data bit. In mode 1 RI_1 is set after the last sample of the
incoming stop bit, subject to the state of SM2_1. In modes 2
and 3 RI_1 is set at the end of the last sample of RB8_1.
RI_1 must be cleared by the software.
MODE 0
Serial mode 0 provides synchronous, halfduplex serial communication. For serial
port 0, pin RXD0 (P3.0) is used for data
input and output while TXD0 (P3.1)
provides the bit clock for both transmit and
receive.
For
serial
port
1
the
corresponding pins are RXD1 (P2.0) and
TXD1 (P2.1).
The serial mode 0 baud rate is set by
SCON0.SM2_0 / SCON1.SM2_1. If this bit
is cleared, the baud rate is the system
clock divided by 4. If the bit is set, the
system clock is divided by 12.
Data transmission begins when an
instruction writes to the SBUF0 (or SBUF1)
register. The serial port shifts the data byte
out, LSB first, at the selected baud rate.
Data reception starts when SCON0.REN_0
/ SCON1.REN_1 is set and the receive
interrupt flag SCON0.RI_0 / SCON1.RI_1
is cleared. The bit clock is activated and
the UART shifts data in on each rising
edge of the bit clock, until 8 bits have been
received. Immediately after the 8th bit is
shifted in, the receive interrupt flag is set
and reception stops until the software
clears the flag.
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CC1010
The clock output is high when the serial
port is idle. In reception, data is shifted in
on the rising edge of the clock. In
Baudrate
(kBaud)
Fxosc =
3.6864
MHz
1/255
1/253
1/250
1/244
1/232
1/208
57.6
19.2
9.6
4.8
2.4
1.2
Fxosc =
7.3728
MHz
1/254
1/250
1/244
1/232
1/208
1/160
Fxosc =
11.0592
MHz
0/255
0/253
0/250
0/244
0/232
0/208
transmission, each new bit is set on the
falling edge of the clock.
T1M/TH1
Fxosc =
14.7456
MHz
1/252
0/252
0/248
0/240
0/224
0/192
Fxosc =
18.4320
MHz
1/251
1/241
1/226
1/196
1/136
1/16
Fxosc =
22.1184
MHz
1/250
1/238
1/220
1/184
1/112
0/160
Table 23. Baud rate examples (SMODx=1)
16.7.2
MODE1
Mode 1 provides standard asynchronous
full duplex communication, using a total of
10 bits: 1 start bit, 8 data bits and 1 stop
bit. For receive operations, the stop bit is
stored
in
SCON0.RB8_0
(or
SCON1.RB8_1). Data bits are received
and transmitted with their LSB first.
The baud rate for mode 1 is a function of
timer 1 overflow. Each time the timer
increments from its maximum count
(0xFF), a clock pulse is sent to the baud
rate circuit, to be further divided by 16 or
32
as
set
by
PCON.SMOD0
/
EICON.SMOD1 to give the baud rate:
Baud Rate =
2 SMODx
⋅ Timer 1 overflow
32
As can be seen from the equation above,
if both serial ports are in use
simultaneously, the baud rate is equal or
different by a factor 2.
It is common to use Timer 1 in Mode 2 (8bit counter with auto-reload) for baud rate
generation, although any timer mode can
be used. The Timer 1 reload value is
stored in the TH1 register, which makes
the complete baudrate using mode 2:
f system
2SMODx
Baud Rate =
⋅
32
(12 − 8 ⋅ T1M) ⋅ ( 256 − TH1)
T1M in the above equation is in register
CKCON (see page 55), and controls the
initial division in Timer 1 between 4 and
12.
Some example baud rates and reload
values are shown in Table 23. The setting
for other baud rates and oscillator
frequencies can be determined by using
the above equation.
To transmit data in mode 1, write data to
SBUF0 / SBUF1. Transmission is then
performed on TXD0 / TXD1 in the following
order: start bit, 8 data bits (LSB first) and
then the stop bit.
Reception begins on the falling edge of a
start bit received on RXD0 / RXD1, if
reception is enabled in SCON0.REN_0 /
SCON1.REN_1. The data input is sampled
16 times per baud for any baud rate. Each
bit decision is performed as a majority
decision between 3 successive samples in
the middle of each baud. If the majority
decision is not equal to zero for the start
bit, the serial port will stop reception and
wait for a new start bit.
When the majority decision is made for the
stop-bit, the following conditions must be
met:
•
RI_0 / RI_1 is 0
•
If SM2_0 / SM2_1 is set, the state of
the stop bit must be one
If these conditions are met, the received
data is buffered in SBUF0 / SBUF1, the
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Page 69 of 152
CC1010
received stop bit is stored in RB8_0 /
RB8_1) and the receive interrupt flag is
set. If not, the received data is lost and
RB8_0 / RB8_1 and the receive interrupt
flag remains unchanged.
16.7.3
MODE2
Mode 2 provides asynchronous full-duplex
communication using a total of 11 bits: 1
start bit, 8 data bits, a programmable 9th
bit and 1 stop bit. The data bits are
transmitted and received LSB first.
The mode 2 baud rate is either fsystem/32 or
fsystem/64, set by PCON.SMOD0 (or
EICON.SMOD1). The baud rate is then:
2 SMODx
Baud Rate =
⋅ f system
64
To transmit data in mode 1, write data to
SBUF0 / SBUF1. Transmission is then
performed on pin TXD0 / TXD1 in the
following order: start bit, 8 data bits (LSB
first), 9th bit (from TB8_0 / TB8_1) and
then the stop bit. The transmit interrupt
flag TI_0 / TI_1 is set when the stop bit
is placed on the transmit pin.
Reception must be enabled by setting
REN_0 / REN_1. It is then initiated by the
falling edge of a start bit received on RXD0
/ RXD1. The input pin is sampled 16 times
per baud. Majority decision is made, as
with mode 1. When the majority decision is
made for the stop-bit, the following
conditions must be met:
•
RI_0 / RI_1 is 0
•
If SM2_0 / SM2_1 is set, the 9th bit
and the stop bit must be one.
If these conditions are met, the received
data is buffered in SBUF0 / SBUF1, the
received stop bit is stored in RB8_0 /
RB8_1 and the receive interrupt flag RI_0
/ RI_1 is set. If not, the received data is
lost and RB8 and the receive interrupt flag
remains unchanged.
16.7.4
MODE 3
Mode 3 provides asynchronous, fullduplex communication, using a total of 11
bits (as with mode 2): 1 start bit, 8 data
bits, a programmable 9th bit and 1 stop bit.
The data bits are transmitted and received
LSB first.
Transmission and reception in mode 3 is
identical to mode 2, except for the baud
rate generation, which is identical to mode
1.
16.7.5
Multiprocessor Communications
The multiprocessor communication feature
is enabled in mode2 and mode 3, when
the SM2_0 / SM2_1 bit is set. The 9th bit
received is then stored in RB8_0 / RB8_1
and the interrupt bit is only set if this bit is
1.
An address byte can then be transmitted,
with the 9th bit set, to generate an
interrupt on all slaves. The slave(s) with
the correct address (decoded in software)
may then clear SM2_0 / SM2_1 to receive
the rest of the data, which is transmitted
with the 9th bit low. All other slaves will
then ignore the data received.
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CC1010
16.8 SPI Master
The SPI master interface allows CC1010 to
communicate with peripheral devices such
as an external serial EEPROM interface. It
has a programmable data rate up to 3
MHz, depending on the frequency of the
main crystal.
The SPI master interface is controlled
using the SPCR register shown below.
Setting SPCR.SPE enables the SPI
interface. Pins P0.0, P0.1 and P0.2 are
then reconfigured as the serial clock
output SCK, the serial data output pin MO
and the serial data input pin MI. The
direction bits set in P0DIR(0) and
P0DIR(2) are then ignored, setting SCK
as an output and MI as an input. The
direction bit P0DIR(1) still determines the
direction of the master data output pin MO.
This allows the SPI master to
communicate with a bi-directional data
line. P0DIR(1) should then be cleared
when transmitting and set when receiving
data, with MO and MI connected together
externally.
For normal full-duplex
operation of the SPI master, P0DIR(1)
must be cleared to set MO as an output.
Any other general purpose I/O-pin may be
used for slave select signals to the
peripheral modules.
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CC1010
SPCR (0xA1) - SPI Control Register
Bit
Name
7
6
5
SPE
R/W
R0
R/W
R/W
0
Reset value
0
0
0
4
DORD
R/W
0
3
CPOL
R/W
0
2
CPHA
R/W
0
Description
Reserved, read as 0
Reserved, write 0
SPI Enable.
0 : SPI interface is disabled
1 : SPI interface is enabled
Data Order
0 : Least significant bit (LSB) is transmitted / received first
1 : Most significant bit (MSB) is transmitted / received first
Clock Polarity
0 : SCK has negative clock polarity
1 : SCK has positive clock polarity
Clock Phase
0 : Data is output on DO when SCK goes from CPOL to
CPOL and is sampled from DI when SCK goes from
CPOL to CPOL
1 : Data is output on DO when SCK goes from CPOL to
CPOL and is sampled from DI when SCK goes from
CPOL to CPOL
1:0
SPR(1:0)
R/W
0
SPI Data Rate.
SPR(1:0)
00 : SCK clock frequency = fXOSC / 8
01 : SCK clock frequency = fXOSC / 16
10 : SCK clock frequency = fXOSC / 32
11 : SCK clock frequency = fXOSC / 64
SPDR (0xA2) - SPI Data Register
Bit
7:0
Name
SPDR(7:0)
R/W
R/W
Reset value
0x00
Description
SPI Data Register
Writing to SPDR when SPCR.SPE is set will initiate a
data transmission. Reading SPDR will read the data
input buffer, which is only updated after each completed
transmission.
SPSR (0xA3) - SPI Status Register
Bit
7:2
1
Name
SPA
R/W
R0
R
Reset value
0x00
0
0
WCOL
R
0
Writing data to SPDR when SPCR.SPE is
set will initiate a data transmission. 8 bits
Description
Reserved, read as 0
SPI Active status bit
0 : The SPI interface is currently not transmitting data
1 : The SPI interface is currently transmitting data
Write collision flag. This flag is updated by hardware
when SPDR is written.
0 : The previous write to SPDR did not generate a data
collision.
1 : The previous write to SPDR generated a data
collision
are transmitted and received with the data
order, clock polarity, clock phase and data
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CC1010
rate as set by SPCR.DORD, SPCR.CPOL,
SPCR.CPHA and SPCR.SPR.
Reading data from SPDR will read the
input buffer, which is only updated after
each complete transmission. This means
that a new byte can be written to SPDR
before reading the newly received byte in
order to maximise the data rate.
If data is written to SPDR while a
transmission is in progress, this is
regarded as a collision. After each new
byte written to SPDR, the write collision flag
SPSR.WCOL is updated. If a collision
occurs, the data written to SPDR is ignored
and the data must be written to SPDR
again for it to be sent.
It is also possible to check the SPI status
bit, SPSR.SPA, before writing to SPDR to
avoid collisions. This bit is set only when
data is being transmitted.
SPI timing, data order, clock polarity and
clock phase are shown in Figure 18.
It is also possible to use the master SPI
interface to interface with a two-pin serial
interface that uses a bi-directional data
line (such as the interface used by the
Chipcon CC1000 RF transceiver). In this
case, you would connect the MO and MI
pins together on your PCB, as shown in
Figure 17. In the software, the P0DIR.1 bit
must be set correctly according to whether
data is being written or read.
MO
DIO
MI
CC1010
DCLK
SCK
Two-wire
peripheral
Figure 17. Two-wire serial interface
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CC1010
SPDR is written by 8051 here,
while SPCR.SPE is active
SCK
(CPOL=0, CPHA=0)
SCK
(CPOL=0, CPHA=1)
SCK
(CPOL=1, CPHA=0)
SCK
(CPOL=1, CPHA=1)
MO / MI
0
1
2
3
4
5
6
7
7
6
5
4
3
2
1
0
DORD=0
MO / MI
DORD=1
SPSR.SPA
SPDR read by 8051
Data received during last byte transmission
New data
SPSR.WCOL is set if SPDR is written here
Figure 18. SPI Data Flow
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CC1010
16.9 DES Encryption / Decryption
DES encryption / decryption is supported
by hardware in CC1010. Blocks of data
ranging from 1 to 256 bytes can be
encrypted / decrypted in one operation by
the DES module. Multiple encryption /
decryption operations can also be used on
larger data blocks.
Encryption is the process of encoding an
information bit stream to secure the data
content. The DES algorithm is a common,
simple and well-established encryption
routine. An encryption key of 56 bits is
used to encrypt the message. The receiver
must use the exact same key to decrypt
the message, otherwise the message will
be scrambled. The encryption and
decryption operations in the DES
algorithm are symmetrical operations with
the same computational requirements.
The operations produce the same number
of output bytes as input bytes. The
strength of an encryption algorithm is
determined by the number of bits in the
key, the more the better. The DES
algorithm offers a low to medium level of
security. If higher levels of security are
required, a triple DES algorithm can be
used. Triple DES can be achieved by
running the DES algorithm three times
sequentially using three different 56-bit
encryption keys. The keys must be used in
reverse order when decrypting.
The DES algorithm works internally on
entities of 8 bytes. The Output Feedback
Mode (OFB) and Cipher Feedback Mode
(CFB) are DES modes of operation that
permit data lengths that are not a multiple
of eight bytes. The operation mode is
selected through the CRPCON.CRPMD
control bit. The same DES mode of
operation must be used both for
encryption and decryption to yield correct
results. CFB is recommended, as it is
more secure than OFB.
CRPCON.ENCDEC should be cleared when
encrypting data and set when decrypting
data.
56 bit DES keys are stored in external
RAM, as shown in Table 24. The location
is given by the register CRPKEY,
containing the 8 most significant address
bits. New keys are loaded only at the
beginning of an encryption / decryption if
CRPCON.LOADKEYS is set. If not, the
same keys as used in the previous run will
be used again.
The DES keys do not contain parity bits. If
DES keys with parity bits are given, the
parity bits must be removed before
performing encryption / decryption. The
keys are therefore stored as 7 successive
bytes in RAM.
After running the DES, a output block O of
length CRPCNT bytes is generated by
encrypting / decrypting the input block I of
same length as O using key K1 as follows:
O=EK1(I)
(encryption)
O=DK1(I)
(decryption)
The following is an example on how to use
the single DES algorithm hardware in
CC1010. First the 56-bit encryption key
must be stored in the external RAM. Then
the CRPKEY register must be written to
point to the start of the encryption key.
Note that the encryption key must start on
a RAM address location divisible by 8.
Then the data bit stream to encrypt must
be stored in the external RAM. The data
bit stream must consist of at least 1 byte
up to a maximum of 256 bytes, and it must
also start on a RAM address location
divisible by 8. The CRPDAT register must
be written to point to the start of the data
bit stream, and CRPCNT must be written to
give the number of bytes to be encrypted.
Then
the
CRPINI0,
CRPINI1,
CRPINI2,
CRPINI3,
CRPINI4,
CRPINI5,
CRPINI6,
CRPINI7
registers must be written to contain the
DES initialisation vector used in the OFB
and CFB modes of operation. For
simplicity it can be set to all zeros. Note
that the initialisation vector must be the
same for both encryption and decryption to
yield correct results. To initiate the
encryption the CRPCON register must be
written. The bits in this register select
encryption/decryption, feedback mode,
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CC1010
and DES interrupt enable. When the
encryption
has
been
completed,
CRPCON.CRPEN goes low and the DES
interrupt flag is set. The external RAM will
now contain the encrypted data bit stream
Key
K1
in the same location as the input data
bytes were originally put. To perform the
reverse operation, write CRPCON again
with the CRPCON.ENCDEC bit set.
First RAM Location
8 ⋅ CRPKEY
Last RAM Location
8 ⋅ CRPKEY+6
Table 24. DES key location in RAM
Encryption / decryption is done in-place,
i.e. each byte of data read from external
RAM for encryption / decryption will be
written back to the same location after
encryption / decryption as described
above. The input and output blocks must
start on an address which is a multiple of
eight. CRPDAT then gives the 8 most
significant address bits to the first data
byte.
Encryption / decryption is started when
CRPCON.CRPEN is set. When the
encryption / decryption is completed,
CRPCON.CRPEN is cleared by hardware
and the interrupt flag CRPCON.CRPIF is
set. If CRPCON.CRPIE is set, the interrupt
flag EXIF.ADIF is also set, which will
generate an interrupt if EIE.ADIE is set.
(See the Interrupts section on page 28 for
details on interrupts.)
The encryption / decryption initialization
vector should be written to registers
CRPINI0 to CRPINI7. These registers
must be written prior to encrypting /
decrypting a new block of data, as they
are modified by hardware. They should be
left
unchanged
between
multiple
encryption / decryption operations for DES
blocks larger than 256 bytes. A zero value
initialisation vector can be used, or
additional security can be effected by
using the initialisation vector as an
additional key.
The duration of a DES encryption /
decryption operation is shown in Table 25.
Accessing external RAM from the 8051
while encrypting / decrypting may delay
the operation slightly since the access is
multiplexed.
Mode
Single DES
DES keys stored in Flash memory will be
protected by the Flash memory read
protection. For the security of the Flash
protection, please refer to the disclaimer at
the end of this document.
Duration (clock cycles)
2+25⋅#Data Bytes +21⋅LOADKEYS
Table 25. DES Encryption / Decryption duration
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CC1010
CRPCON (0xC3) - Encryption / Decryption Control Register
Bit
7
6
Name
CRPIE
R/W
R0
R/W
Reset value
0
0
5
CRPIF
R/W
0
4
LOADKEYS
R/W
0
3
CRPMD
R/W
0
2
ENCDEC
R/W
0
1
0
TRIDES
CRPEN
R/W0
R/W1
0
0
Description
Reserved, read as 0
Encryption / Decryption interrupt enable flag. In order for
CRPIF to raise an interrupt, EIE.ADIE must also be
set.
Encryption / Decryption interrupt flag.
CRPIF is set by hardware when an encryption /
decryption is completed. CRPIF must be cleared by
software. Because the encryption /decryption shares an
interrupt line with the ADC, EXIF.ADIF must also be
cleared by software before exiting the interrupt service
routine. EXIF.ADIF should be cleared before CRPIF,
so that the 8051 is ready to receive a new interrupt
immediately after CRPIF is cleared.
Enable / disable loading of keys at start up.
0 : New keys are not loaded at encryption / decryption
start up. The same keys as used during the previous
encryption / decryption will be used again.
1 : New keys are loaded from RAM at encryption /
decryption start up. The key RAM location is given by
CRPKEY.
OFB / CFB Mode
0 : OFB (Output Feedback Mode) is selected
1 : CFB (Cipher Feedback Mode) is selected
Encryption / Decryption select
0 : Encryption is selected
1 : Decryption is selected
Reserved, write 0
Encryption / Decryption start and status bit.
When set by software, encryption / decryption is
initiated. It cannot be cleared by software, but will be
cleared by hardware when the encryption / decryption is
completed.
CRPKEY (0xC4) - Encryption / Decryption Key Location Register
Bit
7:0
Name
CRPKEY(7:0)
R/W
R/W
Reset value
0x00
Description
CRPKEY(7:0) gives the 8 most significant bits of the
external RAM location of the DES keys. The keys are
located in RAM as given in Table 24.
CRPDAT (0xC5) - Encryption / Decryption Data Location Register
Bit
7:0
Name
CRPDAT(7:0)
R/W
R/W
Reset value
0x00
Description
CRPDAT(7:0) gives the 8 most significant bits of
the external RAM address of the first byte to be
encrypted / decrypted. The 3 least significant address
bits are all zeros.
CRPCNT (0xC6) – Encryption / Decryption Counter
Bit
7:0
Name
CRPCNT(7:0)
R/W
R/W
Reset value
0x00
Description
CRPCNT(7:0) gives the number of bytes to be
encrypted / decrypted. If CRPCNT=0, 256 bytes are
encrypted / decrypted.
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CC1010
CRPINIn, n∈{0..7} (0xB4-0xB7, 0xBC-0xBF) - DES Initialisation Vector
Bit
7:0
Name
R/W
R/W
CRPINIn
(7:0)
Reset value
0x00
Description
The 8 registers CRPINIn, n ∈{0..7}, contains the 64
bit DES initialisation vector. Bits 8⋅n-1 down to 8⋅n are
located in register CRPINIn
16.10 Random Bit Generation
CC1010 can generate real random bit
sequences to be used as encryption keys,
seed for a software pseudo random
generator or other purposes. The data is
generated from amplifying noise in the RF
receiver path.
To enable random bit generation, set
RANCON.RANEN
and
clear
RFMAIN.RX_PD. Wait at least 1 ms before
reading data from RANCON.RANBIT. The
period between reads should be at least
10 µs for the data to be as random as
possible.
For applications requiring guaranteed DC
free data, software should process the
generated data, for example by xor'ing two
successive bits.
The random data generated has a
relatively white spectrum, but tones have
been observed when the random bit
generator has been enabled for more than
one second. If this is not sufficient for the
application to generate the random bits
required, the random bit generator should
be disabled and enabled following the
procedure
described
above
before
generating more data.
RANCON (0xC7) - Random Bit Generator Control Register
Bit
7:2
1
Name
RANEN
R/W
R0
R/W
Reset value
0x00
0
0
RANBIT
R
0
Description
Reserved, read as 0
Random Bit Generator Enable
0 : Random Bit Generator is disabled.
1 : Random Bit Generator is enabled. RFMAIN.RX_PD
must also be cleared to generate random bits.
RANBIT returns one random bit, generated from the RF
receiver path.
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CC1010
16.11 ADC
The on-chip 10-bit ADC is controlled by
the registers ADCON and ADCON2.
Three analog pins can be sampled,
selected by ADCON.ADADR. This register
is also used to select the AD1 pin as
external reference (when using AD0).
When the AD1 pin is used as external
reference, only two ADC inputs are
available.
The ADC output is unipolar, with an output
value of 0 corresponding to 0V and 1023
corresponding to the reference voltage
(1.25 V or VDD depending on the setting
of the ADCREF bit).
The analog reference voltage is controlled
by ADCON.ADCREF. ADCON.AD_PD should
be set when the ADC is not used in order
to save power. A conversion can be
started 5 µs after clearing the bit when
using VDD or an external reference, or
100 µs afterwards when using the internal
1.25V reference.
The input impedance of the ADC is a
3.2pF switched capacitor that samples the
input signal once for each conversion.
The average input impedance is thus:
Rin =
1
C * fs
Average input impedances for minimum
and maximum sampling frequencies are
shown in Table 26.
fclk
250 kHz
32 kHz
fs
22.7 kHz
2.9 kHz
Rin
~14 MΩ
~107 MΩ
Table 26. ADC input impedance vs.
sampling frequency
The average input impedance accounts for
the average input current to the ADC, but
cannot be used for estimation of
conversion errors due to voltage division
between the source impedance and the
ADC input impedance. For that purpose
the charging time of the sample capacitor
must be considered.
In each conversion cycle, the input signal
is sampled on the sample capacitor during
one half-clock period. During this time, the
accuracy of the voltage on the capacitor
must reach at least ½ LSB accuracy in
order to get the full accuracy of the
conversion. Charging of the capacitor
follows the Caharing formula:
V = Vin * (1 − e
R=
−t / τ
−t
⎛
V
C * ln⎜⎜1 −
⎝ Vin
−t
⎛
⎞
RC ⎟
⎜
) = Vin * ⎜1 − e ⎟ ⇒
⎝
⎠
⎞
⎟⎟
⎠
=
2 f clk
−1
* C * ln (err )
The result of this formula is the maximum
output resistance of the source, for a given
ADC clock frequency and accuracy. 30%
safety margin should be used, due to nonperfect duty cycle etc., i.e. a maximum
output resistance 30% less than calculated
should be used.
For ½ LSB accuracy in the charging, Table
27 shows the maximum output resistance
that should be used for the source at
maximum and minimum ADC clock
frequencies.
fclk
250 kHz
32 kHz
Rmax
57 kΩ
450 kΩ
Table 27. Maximum source impedance
for ADC
The ADC can be operated in 4 modes
controlled by ADCON.ADCM. Each ADC
sample conversion takes 11 ADC clock
cycles. In Clock Mode 1, when
X32CON.CMODE is set, the 32 kHz clock is
applied directly to the ADC. The
conversion time is then 344 µs. In Clock
Mode 0 the ADC clock input is derived
from the main oscillator clock using the
divider selected by ADCON2.ADCDIV. The
register must be set so that the resulting
ADC clock frequency is less than or equal
to 250 kHz. If the clock frequency is equal
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CC1010
to 250 kHz, then the conversion time is 44
µs.
In
single-conversion
mode
each
conversion is initiated by setting the
ADCON.ADCRUN control bit. The ADC
interrupt
flags
EXIF.ADIF
and
ADCON2.ADCIF are set by hardware if the
8 MSB of the latest sampled value is
greater than or equal to the threshold
value stored in the ADTRH register. An
interrupt service routine is then executed if
the interrupt enable flags EIE.ADIE and
ADCON2.ADCIE are set. To always get an
interrupt upon completion of a conversion,
ADTRH should be set to 0. The
ADCON.ADCRUN control bit is cleared by
hardware when the conversion is finished.
In the multi-conversion modes the ADC
starts a new conversion every 11th ADC
clock cycle. All multi-conversion modes
can
be
stopped
by
clearing
ADCON.ADCRUN, after which the ADC will
abort its current conversion and then stop.
In all modes an action is taken when the 8
MSB of the latest sample value is greater
than or equal to the value written in
ADTRH; these are:
Multi-conversion, continuous. When the
threshold comparison holds true (value ≥
ADTRH⋅ 4) an interrupt is generated and
the corresponding interrupt service routine
is then executed if the interrupt enable
flags EIE.ADIE and ADCON2.ADCIE are
set. The ADC will continue its conversions
regardless of the result of the threshold
comparison. To always get an interrupt
upon completion of a conversion, ADTRH
should be set to 0.
Multi-conversion, stopping. When the
threshold comparison holds true (value ≥
ADTRH⋅ 4) an interrupt is generated and
the corresponding interrupt service routine
is then executed if the interrupt enable
flags EIE.ADIE and ADCON2.ADCIE are
set. The ADC will stop when the threshold
comparison
holds
true,
clearing
ADCON.ADCRUN.
Multi-conversion,
reset-generating.
When the threshold comparison holds true
(value ≥ ADTRH⋅ 4) a system reset is
generated. This mode can be used in
conjunction with the 8051's stop mode and
the 32 kHz oscillator to achieve very low
power consumption while monitoring a
signal. The value stored in ADDATH and
ADDATL is not affected by a reset, so that
the sampled value can be read back after
the reset has taken effect.
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CC1010
ADCON (0x93) - ADC Control Register
Bit
7
Name
AD_PD
R/W
R/W
Reset value
1
6
-
R0
0
5:4
ADCM(1:0)
R/W
00
3
ADCREF
R/W
0
2
ADCRUN
R/W
0
1:0
ADADR(1:0)
R/W
00
Description
ADC Power down bit.
0 : ADC is active
1 : ADC is in power down
Reserved, read as 0
ADC Mode:
00 :
Single-conversion mode. (Interrupt when
threshold condition holds true, stop after one
conversion.)
01 :
Multi-conversion mode, continuous. (Interrupt
when threshold condition holds true, continue sampling.)
10 :
Multi-conversion mode, stopping. (Interrupt
when threshold condition holds true, stop sampling.)
11:
Multi-conversion mode, reset-generating.
(Generate reset when threshold condition holds true.)
Select the internal ADC Voltage Reference
0 : Voltage reference is VDD
1 : Voltage reference is 1.25 V, generated on chip.
ADC run control. Setting this bit in software will start
ADC operation in single- or multi-conversion mode. In
single conversion mode this bit is cleared by hardware
when the single conversion is done. Multi-conversion
operation can be halted at the end of the current
conversion by clearing this bit. (When ADCM=10 the
hardware clears this bit when stopping.)
Select the analog input to the ADC
00 : Mux data from the AD0 pin
01 : Mux data from the AD1 pin
10 : Mux data from the AD2 (RSSI/IF) pin
11 : Mux data from the AD0 pin with AD1 as an external
reference. ADCREF is ignored in this setting
ADDATL (0x94) - ADC Data Register, Low Byte
Bit
7:0
Name
ADDAT(7:0)
R/W
R
Reset value
0x00
Description
8 LSB of ADC data output
ADDATH (0x95) - ADC Data Register, High Bits
Bit
7:2
1:0
Name
ADDAT(9:8)
R/W
R0
R
Reset value
0x00
0x00
Description
Reserved, read as 0
2 MSB of ADC data output, latched when ADDATL is
read
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CC1010
ADCON 2(0x96) - ADC Control Register 2
Bit
7
Name
ADCIE
R/W
R/W
Reset value
0
6
ADCIF
R/W
0
5:0
ADCDIV
R/W
0x00
Description
ADC interrupt enable flag. In order for ADCIF to raise
an interrupt, EIE.ADIE must also be set.
ADC interrupt flag. ADCIF must be cleared by software.
Because the ADC shares an interrupt line with the DES
module, EXIF.ADIF must also be cleared by software
before exiting the interrupt service routine. EXIF.ADIF
should be cleared first so that the 8051 is ready to
receive a new interrupt immediately after ADCIF is
cleared.
ADC clock divider. Selects ADC clock divider in steps of
16.
000000: Divider is 16
000001: Divider is 32
…
111111: Divider is 1024
ADTRH (0x97) - ADC Threshold Register
Bit
7:0
Name
ADTRH(7:0)
R/W
R/W
Reset value
0x00
Description
ADC comparator threshold value, used to generate ADC
interrupt or chip reset when the threshold is exceeded.
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CC1010
17. RF Transceiver
17.1 General description
The CC1010 UHF RF Transceiver is
designed for very low power and low
voltage applications. The transceiver
circuit is mainly intended for the ISM
(Industrial, Scientific and Medical) and
SRD (Short Range Device) frequency
bands at 315, 433, 868 and 915 MHz, but
can easily be programmed for operation at
other frequencies in the 300-1000 MHz
range.
Very few external passive components are
required for operation of the RF
Transceiver.
The key parameters for the RF transceiver
are listed in Table 6, Table 7, Table 8,
Table 9, and Table 10, starting page 8.
The main operating parameters of CC1010
can be programmed via Special Function
Registers (SFRs), thus making CC1010 a
very flexible and easy to use transceiver.
17.2 RF Transceiver Block Diagram
AD2(RSSI/IF)
MIXER
RF_IN
LNA
DEMOD
IF STAGE
ENCODER
RF_OUT
RFBUF
Internal
8051 SFR Bus
SFR
CONTROL
REGISTERS
/N
PA
BIAS
VCO
~
L1 L2
LPF
CHARGE
PUMP
PD
/R
OSC
R_BIAS
XOSC_Q2
XOSC_Q1
CHP_OUT
Figure 19. Simplified block diagram of the RF Transceiver
A simplified block diagram of the RF
transceiver is shown in Figure 19. Only
analog signal pins are shown together with
the internal SFR data bus that is used to
configure the RF interface and to transmit
and receive data.
In receive mode the CC1010 is configured
as a traditional super-heterodyne receiver.
The RF input signal is amplified by the
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CC1010
low-noise amplifier (LNA) and converted
down to the intermediate frequency (IF) by
the mixer (MIXER). In the intermediate
frequency stage (IF STAGE) this downconverted signal is amplified and filtered
before being fed to the demodulator
(DEMOD). As an option a RSSI signal or
the IF signal after the mixer is available at
the AD2(RSSI/IF) pin. After demodulation the digital data is sent to the RFBUF
register. Interrupts can be generated for
each bit or byte received (EXIF.RFIF).
In transmit mode the voltage controlled
oscillator (VCO) output signal is fed
directly to the power amplifier (PA). The
RF output is frequency shift keyed (FSK)
by the digital bit stream fed to the RFBUF
register. Interrupts can be generated for
each bit or byte to be transmitted
(EXIF.RFIF). The internal T/R switch
circuitry makes the antenna interface and
matching very easy using a few passive
components.
The frequency synthesiser generates the
local oscillator signal which is fed to the
MIXER in receive mode and to the PA in
transmit mode. The frequency synthesiser
consists of a crystal oscillator (XOSC),
phase detector (PD), charge pump
(CHARGE PUMP), internal loop filter
(LPF), VCO, and frequency dividers (/R
and /N). An external crystal must be
connected to the XOSC. Only one external
inductor is required for the VCO.
A detailed pin description is given at page
15.
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CC1010
17.3 RF Application Circuit
Very few external components are
required for operation of the RF
transceiver. A typical application circuit is
shown in Figure 20. Component values are
shown in Table 28.
17.3.1
Input / output matching
C31/L32 is the input match for the
receiver, and L32 is also used as a DC
choke for biasing. C41, L41 and C42 are
used to match the transmitter to a 50-Ohm
load. An internal T/R switch circuit makes
it possible to connect the input and output
together and match the transceiver to 50
Ω in both RX and TX mode. See the Input
/ Output Matching section on page 126 for
details.
17.3.2
VCO inductor
The VCO is completely integrated except
for the inductor L101.
Component values for the matching
network and VCO inductor are easily
calculated using the SmartRF® Studio
software for any operation frequency.
17.3.3
Additional filtering
Additional external components (e.g. RF
LC or SAW-filter) may be used in order to
improve the performance in specific
applications. See also the Optional LC
Filter section on page 128 for further
information. If a SAW filter is used, it
should be included in the RX path only (an
external RX/TX switch should then be
used).
17.3.4
Voltage supply decoupling
Voltage supply filtering and de-coupling
capacitors must be used (not shown in the
application circuit). These capacitors
should be placed as close as possible to
the voltage supply pins of CC1010.
The placement and size of the decoupling
capacitors and power supply filtering are
very important to achieve the best
sensitivity and lowest possible LO leakage
and the reference layouts should be
followed.
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CC1010
DVDD
DVDD
DVDD
DGND
P0_3
P0_2 (MISO)
P1_5
P1_6
P1_7
P2_6
P2_7
PROG
RESET
AD0
DVDD
RF_IN
P2_5 45
5
RF_OUT
P2_4 44
6
AVDD
7
AGND
8
AGND
9
AGND
10
L1
11
L2
12
AVDD
13
CHP_OUT
14
R_BIAS
DVDD
DVDD 43
P2_3 42
DGND 41
DVDD 40
P2_2 39
P1_4 38
P1_3 37
P1_2 36
P1_1 35
(PWM2) P3_4
(INT1) P3_3
DGND
(PWM3) P3_5
(RXD1) P2_0
(TXD1) P2_1
P1_0
P0_0 (SCK) 33
POR_E
AGND
DGND
AVDD
16
DGND
15
P0_1 (MOSI) 34
AGND
R131
P3_2 (INT0) 46
4
P3_1 (TXD0) 47
AGND
L101
AGND
XOSC32_Q1
AVDD
L32
3
XOSC32_Q2
L41
AVDD
CC1010
C42
C41
P3_0 (RXD0) 48
AVDD
2
XOSC_Q2
Antenna
(Top view)
1
XOSC_Q1
C31
AD1
AVDD
AD2 (RSSI/IF)
AGND
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
XTAL
C181
C171
Figure 20. Typical CC1010 application circuit
Note: Decoupling capacitors not shown. Please see CC1010EM reference design.
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CC1010
Item
433 MHz
868 MHz
915 MHz
C31
10 pF, 5%, C0G, 0603
8.2 pF, 5%, C0G, 0603
8.2 pF, 5%, C0G, 0603
C41
6.8 pF, 5%, C0G, 0603
Not used
Not used
C42
8.2 pF, 5%, C0G, 0603
10 pF, 5%, C0G, 0603
10 pF, 5%, C0G, 0603
C171
18 pF, 5%, C0G, 0603
18 pF, 5%, C0G, 0603
18 pF, 5%, C0G, 0603
C181
18 pF, 5%, C0G, 0603
18 pF, 5%, C0G, 0603
18 pF, 5%, C0G, 0603
L32
68 nH, 10%, 0805
12 nH, 10%, 0805
12 nH, 10%, 0805
(Coilcraft 0805CS-680XKBC)
(Coilcraft 0805CS-120XKBC)
(Coilcraft 0805CS-120XKBC)
6.2 nH, 10%, 0805
2.5 nH, 10%, 0805
2.5 nH, 10%, 0805
(Coilcraft 0805HQ-6N2XKBC)
(Coilcraft 0805HQ-2N5XKBC)
(Coilcraft 0805HQ2N5XKBC)
27 nH, 5%, 0805
3.3 nH, 5%, 0805
3.3 nH, 5%, 0805
(Koa KL732ATE27NJ)
(Koa KL732ATE3N3C)
(Koa KL732ATE3N3C)
R131
82 kΩ, 1%, 0603
82 kΩ, 1%, 0603
82 kΩ, 1%, 0603
XTAL
14.7456 MHz crystal,
14.7456 MHz crystal,
14.7456 MHz crystal,
16 pF load
16 pF load
16 pF load
L41
L101
Table 28. Bill of materials for the application circuit
Note: Shaded items are different for different frequencies
Note that the component values for 868
and 915 MHz can be the same. However,
it is important that the layout is optimised
for the selected VCO inductor in order to
centre the tuning range around the
operating frequency to account for
inductor tolerance. The VCO inductor must
be placed very close and symmetrical with
respect to the pins (L1 and L2).
Chipcon provides reference layouts that
should be followed very closely in order to
achieve the best performance. The
reference design can be downloaded from
the Chipcon website.
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CC1010
17.4 Transceiver Configuration Overview
The RF transceiver configuration can be
optimised to achieve the best performance
for different applications. Through the SFR
registers the following key parameters can
be programmed:
• Receive / transmit mode
• RF output power
• Frequency synthesiser key parameters:
RF output frequency, FSK frequency
separation (deviation), crystal oscillator
reference frequency
• Power-down / power-up mode
• Data rate and data format (NRZ,
Manchester coded, Transparent or
UART interface)
• Synthesiser lock indicator mode
• Optional RSSI or external IF output
17.4.1
SmartRF® Studio
Chipcon provides users of CC1010 with a
Windows application, SmartRF® Studio,
which generates all necessary CC1010 RF
configuration settings based on the user's
selections of various parameters. These
SFR register settings can be used in a
CC1010 program to configure the RF. In
addition SmartRF® Studio will provide the
user with the component values needed
for the input/output matching circuit and
the VCO inductor.
Chipcon recommends using the register
settings found using the SmartRF® Studio
software. These are the register settings
that Chipcon can guarantee across
temperature, voltage and process. Please
visit the Chipcon web site regularly for
updates to the SmartRF Studio software,
or subscribe to the Chipcon Developer’s
Newsletter to be notified of updates.
Figure 21 shows the user interface of
SmartRF® Studio.
Figure 21. SmartRF® Studio
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CC1010
17.5 RF Transceiver RX/TX control and power management
RFMAIN register controls the
The
operation mode (RX or TX), use of the
dual frequency registers and several
power down modes. In this way the CC1010
offers great flexibility for RF power
management in order to meet strict power
consumption requirements in batteryoperated applications. Different powerdown modes are controlled through
individual bits in the RFMAIN register.
There are separate bits to control the RX
part, the TX part, the frequency
synthesiser and the crystal oscillator. This
individual control can be used to optimise
for lowest possible current consumption in
a certain application.
A typical power-on sequence for minimum
power consumption is shown in Figure 22.
The figure assumes that frequency A is
used for RX and frequency B is used for
TX. If this is not the case, simply invert the
F_REG setting.
RFMAIN (0xC8) - RF Main Control Register
Bit
7
Name
RXTX
R/W
R/W
Reset value
0
6
F_REG
R/W
0
5
RX_PD
R/W
1
4
TX_PD
R/W
1
3
FS_PD
R/W
1
2
CORE_PD
R/W
0
1
BIAS_PD
R/W
0
0
-
R0
0
Description
RX/TX Switch.
0 : RX
1 : TX
Select the frequency registers A or B
0 : Select frequency registers A
1 : Select frequency registers B
Select power down for the LNA, mixer, IF filter and digital
demodulator.
0 : Power up
1 : Power down
Select power down of the digital modem and PA.
0 : Power up
1 : Power down
Select power down of the frequency synthesizer
0 : Power up
1 : Power down
Power down of main crystal oscillator core.
0 : Power up
1 : Power down
Power down of bias current generator and crystal
oscillator buffer.
0 : Power up
1 : Power down
Reserved, read as 0
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CC1010
RF Power Down
RX
Turn on RX:
RFMAIN: RXTX = 0, F_REG = 0
RX_PD = 0, FS_PD = 0
CURRENT = ‘RX current’
Wait 250 µs
RX mode
RX or TX?
TX
Turn on TX:
PA_POW = 00h
RFMAIN: RXTX = 1, F_REG = 1
TX_PD = 0, FS_PD = 0
CURRENT = ‘TX current’
Wait 250 µs
PA_POW = ‘Output power’
Wait 20 µs
Turn off RX:
RFMAIN: RX_PD = 1, FS_PD = 1
RF Power Down
TX mode
Turn off TX:
RFMAIN: TX_PD = 1, FS_PD = 1
PA_POW = 00h
RF Power Down
Figure 22. RF Transceiver power-on sequence
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CC1010
17.6 Data Modem and Data Modes
Four different data modes are defined for
transmission and reception, programmable
through MODEM0.DATA_FORMAT. These
modes differ in data encoding, how
incoming and outgoing data is delivered
and
accepted,
and
whether
resynchronisation of the bitstream is
performed (clock regeneration) or not. The
data format should be selected before
enabling the RF Transceiver
Two of the modes, Synchronous NRZ
mode and Synchronous Manchester
encoded mode, transmit or receive data
using a baudrate as specified in
MODEM0.BAUDRATE. The modem does
resynchronisation of the bit stream during
reception. In the Manchester mode the
modem also does the Manchester
encoding and decoding. The NRZ and
Manchester modes accept and deliver
data either one bit or one byte at a time,
programmable
through
RFCON.BYTEMODE. In most applications
these two modes are recommended.
Data to be transmitted or data received
are stored in the RFBUF register. During
transmission or reception the need for
more data or the arrival of new data, bit by
bit or byte by byte depending on
RFCON.BYTEMODE,
is
signaled
by
generating an interrupt (EXIF.RFIF.)
Depending on whether the RF interrupt is
enabled or not (EIE.RFIE), transmission
or reception can be handled by an
interrupt service routine or be performed
by polling.
Synchronization and preamble detection
section on page 102.
Two other modes, Transparent mode and
UART mode, simply passes data between
the FSK modem and the RFBUF register
and UART0, respectively, allowing custom
baud rates and data encoding. When
using the UART0 in the UART mode the
pin P3.1 is not used for UART output and
can instead be used for general I/O.
Chipcon strongly recommends that the
synchronous modes be used. The other
data modes bypass the data decision
circuitry of the RF transceiver and do not
support bytemode. The Transparent mode
is only intended for testing.
17.6.1
Manchester encoding
In Manchester mode the data clock is
transmitted along with the data. A '1' is
encoded as a high frequency f1 followed
by a lower frequency f0. A '0' is encoded
as a low frequency f0 followed by a higher
frequency f1. This is illustrated in Figure
23. See the Frequency programming
section on page 106 for definitions of f0
and f1.
The Manchester code ensures that the
signal has a constant DC component,
which is necessary in some FSK
demodulators. Using this mode also
ensures compatibility with CC400 / CC900
designs.
The properties of the different data modes
are summarized in Table 29.
During reception when using NRZ or
Manchester mode, hardware preamble
and start of frame detection can optionally
be activated using the registers PDET and
BSYNC. This is described in the
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CC1010
10110001101
f1
TX
data
f0
Time
Figure 23. Manchester encoding
Transparent
mode
UART mode
Baudrate
configuration
Data encoding
User defined
Defined by UART
through Timer 1
Defined by UART
settings
Data Input &
Output
RFBUF(0)
N/A
Clock
Regeneration
N/A
Performed by
UART
Performed
internally. A
violation to the
Manchester coding
format is reported
in RFCON.MVIOL.
Bitmode/
Bytemode
N/A
N/A
Both possible. Bytemode is forced when
using preamble detection
Preamble
detection
N/A
N/A
If PDET.PEN=1 a configurable number of
alternating '0's and '1's (PDET.PLEN)
followed by a one-byte start of frame
delimiter as defined in BSYNC is needed to
trigger reception. Bytemode is forced
when PDET.PEN=1.
User defined
Synchronous
Synchronous NRZ
Manchester
mode
encoded mode
Generated by hardware, as defined by
MODEM0.BAUDRATE
Manchester
None (NRZ)
encoding.
Bitrate is half of
baudrate.
RFBUF in bytemode, RFBUF(0) in bitmode.
Performed by
hardware
Table 29. Properties of different data modes (MODEM0.DATA_FORMAT)
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CC1010
MODEM0 (0xDB) - Modem Control Register 0
Bit
7:5
Name
BAUDRATE(2:0)
R/W
R/W
Reset value
011
4:3
DATA_FORMAT (1:0)
R/W
10
2:0
XOSC_FREQ (2:0)
R/W
001
Description
000 : 0.6 kBaud
001 : 1.2 kBaud
010 : 2.4 kBaud
011 : 4.8 kBaud
100 : 9.6 kBaud
101 : 19.2, 38.4 and 76.8 kBaud
110 : Not used
111 : Not used
00 : NRZ mode
01 : Manchester mode
10 : Transparent mode
11 : UART mode
Select the current crystal oscillator frequency.
000 : 3-4 MHz, 3.6864 MHz recommended
Also used for 76.8 kBaud for 14.7456 MHz
and 38.4 kBaud for 7.3728 MHz
001 : 6-8 MHz, 7.3728 MHz recommended
Also used for 38.4 kBaud for 14.7456 MHz
010 : 9-12 MHz, 11.0592 MHz recommended
Also used for 38.4 kBaud for 22.1184 MHz
011 : 12-16 MHz, 14.7456 MHz
recommended
100 : 16-20 MHz, 18.4320 MHz
recommended
101 : 20-24 MHz, 22.1184 MHz
recommended
110 : Reserved for future use
111 : Reserved for future use
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CC1010
17.7 Baud rates
Baud rates from 0.6 kBaud to 76.8 kBaud
are
programmable
in
the
MODEM0.BAUDRATE
control
bits.
MODEM0.XOSC_FREQ must also be set
RF _ BAUDRATE =
according to the crystal in use. Baud rates
are generated as follows:
f xosc
2 BAUDRATE
⋅
⋅ 0.6 kBaud
( XOSC _ FREQ + 1) 3.6864 MHz
Other crystal frequencies will scale the
baud rate as described above.
RF_BAUDRATE is the output baud rate in
kBaud, BAUDRATE and XOSC_FREQ are
control bits in MODEM0. Using one of the
standard crystals mentioned in the
MODEM0.XOSC_FREQ
description
will
produce the standard baud rates 0.6, 1.2,
2.4, 4.8, 9.6, 19.2, 38.4 or 76.8 kBaud.
Baud rates up to and including 19.2 kBaud
can be generated for any crystal
frequency. Above 19.2 kBaud a few
combinations are possible, as shown in
Table 30.
MODEM0.
BAUDRATE
/XOSC.FREQ
RF_BAUDRATE
[kBaud]
0.6
1.2
2.4
4.8
9.6
19.2
38.4
76.8
fxosc
[MHz]
3.6864
7.3728
0/0
1/0
2/0
3/0
4/0
5/0
NA
NA
0/1
1/1
2/1
3/1
4/1
5/1
5/0
NA
11.0592
0/2
1/2
2/2
3/2
4/2
5/2
NA
NA
14.7456
0/3
1/3
2/3
3/3
4/3
5/3
5/1
5/0
18.4320
0/4
1/4
2/4
3/4
4/4
5/4
NA
NA
22.1184
0/5
1/5
2/5
3/5
4/5
5/5
5/2
NA
Table 30. Baud rates versus crystal frequency
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CC1010
17.8 Transmitting and receiving data
In the Transparent or UART modes
outgoing and incoming data is routed
directly to the modulator in transmit mode
and directly from the demodulator in
receive mode. In the NRZ and Manchester
RF
Transmitter
Modulator
modes, however, data buffering occurs in
RFBUF as illustrated in Figure 24. This
buffering has some repercussions that
must be considered when receiving or
transmitting data, particularly in bytemode.
RF
Receiver
Demodulator
8-bit shift reg.
RFBUF
LSB
8051 core
Figure 24. RF Data Buffering. Dotted lines show bitmode
RFBUF (0xC9) - RF Data Buffer
Bit
7:0
Name
RFBUF
17.8.1
R/W
R/W
Reset value
0x00
Description
RF Data Buffer, 8 bits. RFBUF is used as described below.
Transmission
When transmitting data in bytemode
the
buffering
(RFCON.BYTEMODE=1),
scheme shifts out bits of an 8-bit shift
register to the modulator one at a time,
MSB first, at periods specified by the
selected baud rate. When this shift register
is empty it will load a new byte from
RFBUF and continue shifting out bits. The
contents of the RFBUF register remain
unchanged after a shift register load. An
interrupt request is generated (EXIF.RFI)
so that RFBUF can be loaded with a new
data byte.
If a new byte is not written within eight bit
periods (eight baud periods in NRZ mode
and 16 baud periods in Manchester
mode), the next time the shift register is
empty it will load the same byte from
RFBUF again. E.g. when transmitting a
preamble consisting of alternating '0' and
'1', it is only necessary to write the byte to
RFBUF once and then wait the desired
number of byte cycles for the preamble to
be transmitted.
In bitmode (RFCON.BYTEMODE=0), the
same buffering occurs, but only for one bit
at a time. Thus, the shift register will load a
new bit from RFBUF.0 after each
transmitted bit, which in turn generates a
RF-interrupt request so that a new bit can
be loaded. In order to be able to write the
next bit to RFBUF.0 within one bit period
at high baud rates, it is advisable to use a
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CC1010
tight polling loop instead of an interrupt
based transmit procedure.
In order to start transmission of data as
quickly as possible, the first bit/byte to be
transmitted should be written to RFBUF
before the modulator is turned on
(RFMAIN.TX_PD=0). It will then be
immediately loaded into the shift register
and an interrupt request will be generated
for the second bit/byte.
It is especially important to take the
buffering scheme into account at the end
of a transmission. When the last byte of a
data frame or packet is loaded into the
shift register it is still not transmitted. Thus
the interrupt request generated at the
same time must not turn off either analog
or digital parts of the transmit chain. The
transmission can not be ended safely until
nine bit periods later in bytemode and two
bit periods later in bitmode, when the last
bit has been shifted out and has
propagated through the transmit chain to
the antenna. A simple solution is to always
transmit two extra bytes in bytemode or
two extra bits in bitmode at the end of the
real data content. (In bytemode this will
result in that approximately seven of these
bits will be transmitted along with the real
data.) This should cause no problems in
practice.
17.8.2
Reception
When receiving data the buffering scheme
works in reverse of what it does during
transmitting. Bit by bit from the
demodulator is shifted into the eight-bit
shift register, MSB-first: When the shift
register is full it is loaded into RFBUF and
an interrupt request is generated
(EXIF.RFIF). The byte must be read
within one byte period (eight baud periods
in NRZ mode and 16 baud periods in
Manchester mode). If not, it will be
overwritten by the next byte received and
the data is lost.
In bitmode the same buffering occurs, but
only for one bit at a time. Thus, when a
new bit arrives from the demodulator the
shift register will store it and store the last
bit into RFBUF.0, which in turn generates
a RF-interrupt request so that the new bit
can be read. In order to be able to read
the next bit from RFBUF.0 within one bit
period at high baud rates it is advisable to
use a tight polling loop instead of an
interrupt based receive procedure.
No special considerations have to be
taken at the start of, or end of, receptions.
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CC1010
17.9 Demodulation and data decision
A block diagram of the digital demodulator
is shown in Figure 25. The IF signal is
sampled and its instantaneous frequency
is detected. The result is decimated and
filtered. In the data slicer the data filter
output is compared to the average filter
output to generate the data output.
The averaging filter is used to find the
average value of the incoming data. While
the averaging filter is running and
acquiring samples, it is important that the
number of high and low bits received is
equal (e.g. Manchester code or a
balanced preamble).
Therefore all modes, also synchronous
NRZ mode, need a DC balanced preamble
for the internal data slicer to acquire
correct comparison level from the
averaging filter. The suggested preamble
is a ‘010101…’ bit pattern. The same bit
pattern should also be used in Manchester
mode, giving a ‘011001100110…chip
pattern. This is necessary for the bit
synchronizer to synchronize correctly.
The averaging filter must be locked before
any NRZ data can be received. This can
be done in one of two ways:
•
After receiving the preamble and byte
synchronisation
(see
the
Synchronization
and
preamble
detection section on page 102), set
MODEM1.LOCK_AVG_IN='1' to stop
updating the averaging filter.
•
MODEM1.LOCK_AVG_MODE='1',
Set
and then enter Receive mode
(RFMAIN.RX_PD=’0’). The averaging
filter will then be automatically locked
after a preset number of baud periods,
programmable in MODEM1.SETTLING.
The settling time is programmable
from 11 to 86 bauds. The average
filter lock status can be read through
MODEM1.AVG_FILTER_STAT.
Please note that the locking is only
automatic in that the lock is enabled
the programmed number of bit periods
after receive mode is entered. The
automatic locking should therefore
only be used in situations where the
transceiver will be switched away from
receive mode as soon as it is
determined that no data is present.
If the averaging filter is locked
(MODEM1.LOCK_AVG_MODE='1'),
the
acquired value will be kept also after
Power Down or Transmit mode.
After
a
modem
reset
(MODEM1.MODEM_RESET_N), or a main
reset (using any of the standard reset
sources), the averaging filter is reset.
In a polled receiver system the automatic
locking can be used. This is illustrated in
Figure 26. If the receiver is operated
continuously and searching for a
preamble, the averaging filter should be
locked manually as soon as the preamble
is detected. This is shown in Figure 27. If
the data is Manchester coded there is no
need to lock the averaging filter
(MODEM1.LOCK_AVG_IN='0'), as shown in
Figure 28.
The minimum length of the preamble
depends on the acquisition mode selected
and the settling time. Table 31 gives the
minimum recommended number of chips
for the preamble in NRZ and UART
modes. In this context ‘chips’ refer to the
data coding. Using Manchester coding
every bit consists of two ‘chips’. For
Manchester
mode
the
minimum
recommended number of chips is shown
in Table 32.
A special feature in the data filter is a peak
remover acting like a low pass filter. The
peak threshold must be programmed
according to the deviation and expected
frequency
drift.
When
MODEM1.PEAKDETECT
is
enabled,
MODEM2.PLO should be set such that:
PLO =
SWRS047
fS
fs
−
IFlow IF + ∆f
low
⋅
2
5
8
Page 97 of 152
CC1010
where
fs =
It is important that the peak detector is
programmed with a correct value; an error
may result in incorrect data reception.
f XOSC
MODEM 0. XOSC _ FREQ + 1
IFlow = 150kHz − 2 ⋅ f RF ⋅ XTAL _ accuracy
and ∆f is the deviation. SmartRF® Studio
may be used to configure this correctly.
Average
filter
Frequency
detector
Sampler
Decimator
Data
filter
Data slicer
comparator
Figure 25. Demodulator block diagram
Data package to be received
Noise
RX
Preamble
PD
NRZ data
Noise
RX
Averaging filter locked
Averaging filter
free-running / not used
Automatically locked after a short period depending on “SETTLING”
Figure 26. Automatic locking of the averaging filter
Data package to be received
Noise
PD
Preamble
NRZ data
Noise
RX
Averaging filter free-running
Averaging filter locked
Manually locked after preamble is detected
Figure 27. Manual locking of the averaging filter
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CC1010
Data package to be received
Noise
PD
Preamble
Manchester encoded data
Noise
RX
Averaging filter always free-running
Figure 28. Free-running averaging filter
Settling
NRZ mode
MODEM1.
SETTLING
(1:0)
00
01
10
11
Manual Lock
UART mode
MODEM1.LOCK_
AVG_MODE='1'
MODEM1.LOCK_
AVG_IN='0'=→’1’**
NRZ mode
MODEM1.LOCK_
AVG_MODE='1'
MODEM1.LOCK_
AVG_IN='0'=→’1’**
14
25
46
89
Automatic Lock
UART mode
MODEM1.LOCK_
AVG_MODE='0'
MODEM1.LOCK_
AVG_IN='X'***
11
22
43
86
16
32
64
128
MODEM1.LOCK_
AVG_MODE='0'
MODEM1.LOCK_
AVG_IN='X'***
16
32
64
128
Table 31. Minimum preamble bits for locking the averaging filter, NRZ and UART mode
Notes:
** The averaging filter is locked when MODEM1.LOCK_AVG_IN is set to 1
*** X = Do not care. The timer for the automatic lock is started when RX mode is set in the RFMAIN
register
Also please note that in addition to the number of bits required to lock the filter, you need to add the
number of bits needed for the preamble detector. See the next section for more information.
Settling
Free-running
Manchester mode
MODEM1.
SETTLING
(1:0)
MODEM1.LOCK_
AVG_MODE='1'
MODEM1.LOCK_
AVG_IN='0'
00
01
10
11
23
34
55
98
Table 32. Minimum number preamble chips for averaging filter, Manchester mode
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CC1010
MODEM1 (0xDA) - Modem Control Register 1
Bit
7
6
Name
LOCK_AVG_IN
R/W
R0
R/W
Reset value
0
0
5
LOCK_AVG_MODE
R/W
1
4
LOCK_AVG_STAT
R
0
3:2
SETTLING(1:0)
R/W
11
1
PEAKDETECT
R/W
0
MODEM_RESET_N
R/W
Description
Reserved, read as 0
Lock control bit of average filter
0 : Average Filter is free-running,
used for receiving zero average
data (e.g. Preamble or Manchester
encoded data)
1 : Lock average filter, used for NRZ
data
Automatic lock of average filter
0 : Lock of Average Filter is controlled
automatically, use when zero
average data is present when the
receiver is turned on
1 : Lock of Average Filter is controlled
by LOCK_AVG_IN
Average filter status bit
0 : Average filter is free running
1 : Average filter is locked
Settling time of average filter
00 : 11 baud settling time, worst case
1.2dB loss in sensitivity
01 : 22 baud settling time, worst case
0.6dB loss in sensitivity
10 : 43 baud settling time, worst case
0.3dB loss in sensitivity
11 : 86 baud settling time, worst case
0.15dB loss in sensitivity
Peak detector and remover enable /
disable
0 : Peak detector and remover is
disabled.
1 : Peak detector and remover is
enabled
Separate reset of the MODEM.
0 : The Modem is reset
1 : The Modem reset is released
MODEM2 (0xD9) - Modem Control Register 2
Bit
7
6:0
Name
PLO(6:0)
R/W
R0
R/W
Reset value
0
0x16
Description
Reserved, read as 0
Peak Level Offset, threshold level for peak the peak
detector and remover in the demodulator, which is
activated when MODEM1.PEAKDETECT is set. PLO
should be set as described on page 97.
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CC1010
RFCON (0xC2) - RF Control Register
Bit
7:5
4
Name
MVIOL
R/W
R0
R
Reset value
0
0
3:1
MLIMIT(2:0)
R/W
011
0
BYTEMODE
R/W
0
Description
Reserved, read as 0
Manchester code violation status of current bit in
bitmode or the aggregate-OR of the Manchester code
status of all bits in the current byte in bytemode. Only
valid when MODEM0.DATA_FORMAT=01
(Manchester encoding)
Limit value used by the clock regeneration logic in
Manchester mode to determine whether the current
symbol constitutes a Manchester code violation. The
violation detection is determined by how balanced the
bit is by looking at the 14 samples. A perfect bit is 14
(all samples are correct). The limit can be set from 1 to
7 (001 – 111). 0 disable the violation detection
function.
Select bit or bytemode
0 : Bitmode is enabled. Data is transmitted and
received bit by bit through RFBUF.0
1 : Bytemode is enabled. Data is transmitted and
received byte by byte through RFBUF, with MSB first.
BYTEMODE is ignored if PDET.PEN = 1
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CC1010
17.10 Synchronization and preamble detection
Most RF communication protocols will
have a preamble designated to let the
receiver synchronise reception on a bit
and byte level. CC1010 contains hardware
that will perform these tasks easily in
synchronous NRZ and Manchester
encoded modes.
examples are shown in Figure 29. Note
that the Manchester baud rate is twice the
NRZ baud rate in the figure.
The preamble must consist of an
alternating 0-1-pattern followed by a
synchronization byte of eight bits. Unless
the average filter is already locked at the
arrival of the synchronization byte in NRZ
mode, it is vital that the synchronization
byte is DC-balanced (equal number of
zeros and ones) and contains no more
than two consecutive ones or zeros. It is
also required that the synchronization byte
contains two consecutive ones or zeros.
This means that e.g. 0xCC is not a legal
synchronization byte, but 0xCA is.
The byte synchronization mechanism
ensures that the framing of bytes in the
received data bit stream is correct, thus
freeing the software from needing to
perform shifting and recombination of data
bytes. In addition, the synchronization byte
functions as a start of frame delimiter. The
preamble detection mechanism reduces
the workload for the processor when the
exact time of the start of a transmission is
uncertain. Both mechanisms are active
when PDET.PEN is set. (See PDET
register definition below.) Two preamble
NRZ
Bit value
1
0
1
0
1
0
1
0
1
0
1
0
0
1
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
1
0
1
1
0
0
1
0
Manchester
Bit value
Preamble
Byte sync
Data
Figure 29. Preamble detection examples
PDET (0xD3) - Preamble Detection Control Register
Bit
7
Name
PEN
R/W
R/W
Reset value
0
6:0
PLEN
R/W
0x00
Description
Preamble and byte synchronisation enable.
0 : Receiver mode is defined by RFCON.BYTEMODE.
1 : Preamble and byte synchronisation is enabled.
RFCON.BYTEMODE is don't care.
Preamble length.
Define the number of alternating bits required before byte
synchronisation. PLEN must be greater than zero.
BSYNC (0xD4) - Byte Synchronisation Register
Bit
7:0
Name
BSYNC(7:0)
R/W
R/W
Reset value
0x00
Description
BSYNC defines the byte that triggers byte
synchronisation during RF preamble detection.
SWRS047
Page 102 of 152
CC1010
The hardware support for preamble
detection consists of a seven-bit counter,
which keeps track of the number of
successive alternating bits. It is reset
whenever two bits are equal and
incremented whenever two successive bits
are different. The counter is limited and
will not overflow. A seven-bit threshold is
programmable through PDET.PLEN. Not
until this counter equals or exceeds
PDET.PLEN will a synchronization byte be
accepted. CC1010 is able to detect
preambles (including the synchronization
byte) with minimum lengths from 10 to 135
bits.
When the requisite number of alternating
zeros and ones has been received, a
special state is entered where a deviation
from the 0-1-pattern is searched for. Once
a bit does not correspond to the
alternating bits pattern, a synchronization
byte matching that defined in BSYNC must
occur within a maximum of seven bits,
otherwise the receiver will reset its
preamble counter and go back to the
preamble detection mode.
If, however, a match is found before the
timeout, the synchronization byte is
transferred to RFBUF and an EXIF.RFIF
interrupt request generated, after which
the receiver enters normal reception
mode. For both the examples shown in
Figure 29, BSYNC should be set to
10100101 (0xA5).
PDET.PEN is not cleared by hardware
when the preamble is detected, but it will
not affect the reception of data. It can be
cleared or left set, decided by what is
more practical for the software developer.
However, before a new preamble
detection session is initiated, PDET.PEN
must be cleared.
If manual average filter locking is
performed, the average filter should be
locked after receiving the synchronization
byte in NRZ mode. (See the Reception
section on page 96 for details.) As
mentioned above it is vital that the
synchronization byte is DC-balanced and
contains no more than two consecutive
ones or zeros in order to achieve a good
average filter lock in this case.
17.10.1 Estimating the required
preamble length
The preamble length is determined by
several factors. First, the receiver circuitry
needs some time to settle. Second, the
averaging filter must acquire a correct
value. Third, the preamble detection circuit
must receive the required number of bits.
The first factor depends on the data rate
and will be limited to only a few bits. The
number of bits required by the averaging
filter is a bit tricky to calculate, but
estimates of the maximum bound are
given in Table 31 and Table 32. The
number of bits required will vary because
the updating of the averaging filter is not
synchronised to the start of the
transmission. RF noise can complicate the
issue further.
To determine an approximate preamble
length, add the estimated number of bits
required by the averaging filter with the
preamble detector setting. Round the
number of bits up to the closest multiple of
8 and use this as a starting point. For timecritical applications where it is important to
use as short preamble as possible, the
preamble length should be optimized by
experimentation.
17.10.2 Manchester violations
In some RF-applications using Manchester
coding, violations of the Manchester
coding have been used for start- and endof-frame delimiters. Furthermore some
implementations use a sequence of all
ones or all zeros for a preamble instead of
an
alternating
zero-one
sequence.
Although an all zero or all one sequence
will certainly be DC-balanced once
Manchester coded, the receiver is unable
to decide whether it is receiving an all zero
or an all one sequence, since only the bit
synchronization will separate these.
In order to facilitate reception and
transmission of such special cases,
support has been implemented in CC1010
for allowing the data format to be changed
in the middle of a reception or
transmission. Furthermore, violations of
the Manchester coding format is reported
in the status bit RFCON.MVIOL. The
SWRS047
Page 103 of 152
CC1010
threshold for determining what constitutes
a Manchester coding violation can be
RFCON.MLIMIT.
configured
in
RFCON.MVIOL is set when, in bitmode,
the currently available bit in RFBUF.0 was
determined to violate Manchester coding,
or in bytemode, when one or more of the
bits in the byte currently available in
RFBUF were determined to violate the
Manchester coding. This can be used, for
example, to detect start of frame and end
of frame delimiter bytes.
be changed to NRZ mode for the byte in
question. When in NRZ mode, two bytes
must be sent for each Manchester-coded
byte. A flagrant violation of Manchester
coding could be, for example, the two-byte
sequence "11001100"-"00110011". In
order to provide this functionality,
MODEM0.DATA_FORMAT is buffered in
much the same way as data so that the
change does not take effect until the
following byte.
During transmission, the desired data
format should be updated in connection
with writing new data to RFBUF. The byte
currently being transmitted from the shift
register will not be affected. It is then
possible to have a NRZ preamble pattern
with Manchester data following. This is
illustrated in Figure 30.
Note that even if RFCON.MVIOL is set
when receiving data, RFBUF will still be set
to the "best guess" data received. In
applications
where
no
Manchester
violations are transmitted, it is therefore
advisable to ignore RFCON.MVIOL at
reception.
In order to be able to send Manchester
violations, MODEM0.DATA_FORMAT must
Manchester data
NRZ Preamble
Bit value
1
0
1
0
1
0
1
0
Preamble
1
0
1
0
1
1
0
0
Byte sync
1
0
0
Data
Figure 30. Switching data mode after preamble
Changing the desired data mode during
reception
of
NRZ
preamble
and
Manchester data is straightforward. A new
value of MODEM0.DATA_FORMAT does not
take effect before an RF interrupt request
is generated. After having started a
reception using preamble detection/byte
synchronization and the NRZ data mode,
the DATA_FORMAT should be set to
Manchester.
The
whole
preamble
detection process will then work with NRZ
data and the new DATA_FORMAT will not
take effect until a valid (NRZ)
synchronization byte is found and an
interrupt request generated.
It is not recommended to change the data
format during reception for new protocols,
but the functionality is included for
compatibility with existing protocols.
SWRS047
Page 104 of 152
CC1010
17.11 Receiver sensitivity versus data rate and frequency separation
The receiver sensitivity depends on the
data rate, the data format, FSK frequency
separation and the RF frequency. Typical
figures for the receiver sensitivity (BER =
10-3) are shown in Table 33 for 64 kHz
frequency separations and in Table 34 for
20
kHz.
Optimised
sensitivity
configurations are used. For best
Data rate
[kBaud]
Separation
[kHz]
0.6
1.2
2.4
4.8
9.6
19.2
38.4
76.8
64
64
64
64
64
64
64
64
433 MHz
NRZ
mode
-109
-107
-105
-104
-102
-100
-97
-96
performance the frequency separation
should be as high as possible especially at
high data rates.
Figure 31 and Figure 32 show typical
figures for how sensitivity varies as a
function of the frequency offset between
the transmitter and the receiver.
Manchester
mode
-108
-106
-105
-103
-101
-99
-98
-96
868 MHz
NRZ
mode
-106
-104
-101
-98
-96
-96
-94
-93
Manchester
mode
-106
-104
-103
-100
-98
-96
-94
-93
Table 33. Typical receiver sensitivity as a function of data rate at 433 and 868 MHz, BER =
10-3, frequency separation 64 kHz
Data rate
[kBaud]
Separation
[kHz]
0.6
1.2
2.4
4.8
9.6
19.2
38.4
76.8
20
20
20
20
20
20
20
20
433 MHz
NRZ
mode
-105
-104
-101
-98
-98
-97
N/R
N/R
Manchester
mode
-105
-103
-101
-100
-99
-98
N/R
N/R
868 MHz
NRZ
mode
-100
-99
-97
-96
-94
-94
N/R
N/R
Manchester
mode
-102
-101
-99
-98
-96
-94
N/R
N/R
Table 34. Typical receiver sensitivity as a function of data rate at 433 and 868 MHz, BER =
10-3, frequency separation 20 kHz
N/R = Not recommended (data rate too high compared to frequency separation)
SWRS047
Page 105 of 152
CC1010
-96
-97
-98
Sensitivity [dBm]
-99
-100
-101
-102
-103
-104
-105
-106
-107
-60
-40
-20
0
20
40
60
80
Frequency offset [kHz]
Figure 31. Sensitivity versus frequency offset, 868 MHz, 2.4 kBaud Manchester
-98
-99
-100
Sensitivity [dBm]
-101
-102
-103
-104
-105
-106
-107
-108
-80
-60
-40
-20
0
20
40
60
Frequency offset [kHz]
Figure 32. Sensitivity versus frequency offset, 433 MHz, 2.4 kBaud Manchester
SWRS047
Page 106 of 152
CC1010
17.12 Frequency programming
RX mode:
fRF
(Receive frequency)
fLO (low-side)
fIF
fvco
fLO (high-side)
fIF
TX mode:
f0
(Lower FSK
frequency)
fRF
(Center frequency)
f1
(Upper FSK
frequency)
fvco
fsep
Figure 33, Relation between fvco, fif, and LO frequency
The frequency synthesiser (PLL) is
controlled by the frequency word in the
configuration registers. There are two
frequency words, A and B, which can be
programmed to two different frequencies.
One of the frequency words can be used
for RX (local oscillator frequency) and
other for TX (transmitting frequency, f0).
This makes it possible to switch very fast
between RX mode and TX mode. They
can also be used for RX (or TX) on two
different channels. Selection of frequency
word A or B is performed by using the
RFMAIN.F_REG control bit.
The frequency word, FREQ, is 24 bits (3
bytes)
located
in
FREQ_2A:FREQ_1A:FREQ_0A
and
FREQ_2B:FREQ_1B:FREQ_0B for the A
and B word, respectively.
The FSK frequency separation (two times
the deviation), FSEP, is programmed in
the FSEP1:FSEP0 registers (11 bits).
The frequency
calculated from:
f VCO = f ref ⋅
word
FREQ
can
be
FREQ + FSEP ⋅ TXDATA + 8192 ,
16384
where TXDATA is 0 or 1 in transmit mode
depending on the data bit to be
transmitted. In receive mode TXDATA is
always 0.
The reference frequency fref is the crystal
oscillator clock divided by PLL.REFDIV, a
SWRS047
Page 107 of 152
CC1010
number between 2 and 24 that should be
chosen such that:
1.00 MHz ≤ fref ≤ 2.40 MHz
Thus, the reference frequency fref is:
f ref =
f xosc
REFDIV
fVCO is the Local Oscillator (LO) frequency
in receive mode, and the f0 frequency in
transmit mode (lower FSK frequency).
The LO frequency must be fRF – fIF or fRF +
fIF giving low-side or high side LO injection
respectively. Note that the data in RFBUF
will be inverted if high-side LO is used.
Please also note that fIF depends on the
RF frequency (150 and 130 kHz for 433
and 868 MHz respectively).
The upper FSK transmit frequency is given
by:
f1 = f0 + fsep ,
where the frequency separation fsep is set
by the 11 bit separation word
(FSEP1:FSEP0):
f sep = f ref ⋅
FSEP
16384
PLL.ALARM_DISABLE
will
Clearing
enable generation of the frequency alarm
bits PLL.ALARM_H and PLL.ALARM_L.
These bits indicate that the frequency
synthesis PLL is unable to generate the
frequency requested, and the PLL should
be recalibrated as described in the VCO
and PLL self-calibration section on page
113.
It
is
recommended
that
the
LOCK_CONTINOUS bit in the LOCK register
is checked when changing frequencies
and when changing between RX and TX
mode. If lock is not achieved, a calibration
should be performed as described on
page 113.
Chipcon recommends using the frequency
settings described in the Recommended
Settings for ISM Frequencies section on
page 111. Chipcon recommends the use
of the SmartRF® Studio software to
calculate RF settings for the CC1010.
Using the Print registers to file option in
the File menu generates a text file with a C
constant structure that can be passed to
the RF configuration routines in the HAL
library.
FREQ_2A (0xCC) – Frequency A, Control Register 2
Bit
7:0
Name
FREQ_A (23:16)
R/W
R/W
Reset value
0x75
Description
8 MSB of frequency control word A. It must be
programmed such that FREQ_2A ≥ 01000000
FREQ_1A (0xCB) – Frequency A, Control Register 1
Bit
7:0
Name
FREQ_A (15:8)
R/W
R/W
Reset value
0xA0
Description
Bit 15 to 8 of frequency control word A.
FREQ_0A (0xCA) – Frequency A, Control Register 0
Bit
7:0
Name
FREQ_A(7:0)
R/W
R/W
Reset value
0xCB
Description
8 LSB of frequency control word A.
FREQ_2B (0xCF) - Frequency B, Control Register 2
Bit
7:0
Name
FREQ_B (23:16)
R/W
R/W
Reset value
0x75
Description
8 MSB of frequency control word B. It must be
programmed such that FREQ_2B ≥ 01000000
FREQ_1B (0xCE) - Frequency B, Control Register 1
Bit
7:0
Name
FREQ_B (15:8)
R/W
R/W
Reset value
0xA5
Description
Bit 15 to 8 of frequency control word B.
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Page 108 of 152
CC1010
FREQ_0B (0xCD) - Frequency B, Control Register 0
Bit
7:0
Name
R/W
R/W
FREQ_B(7:0)
Reset value
0x4E
Description
8 LSB of frequency control word B.
FSEP1 (0xEB) - Frequency Separation Control Register 1
Bit
7:3
2:0
Name
FSEP(10:8)
R/W
R0
R/W
Reset value
0
0x00
Description
Reserved, read as 0
3 MSB of the frequency separation control word FSEP
FSEP0 (0xEA) - Frequency Separation Control Register 0
Bit
7:0
Name
FSEP(7:0)
R/W
R/W
Reset value
0x59
Description
8 LSB of the frequency separation control word FSEP
PLL (0xE3) - PLL Control Register
Bit
7:3
Name
R/W
R/W
Reset value
0x02
2
ALARM_
DISABLE
R/W
0
1
ALARM_H
R
None
0
ALARM_L
R
None
REFDIV(4:0)
Description
Reference divider setting. The main crystal oscillator
frequency is divided by REFDIV to create the RF
reference frequency fref. Valid REFDIV settings are 2
through 24, as described above.
Disable / Enable the generation of the ALARM_H and
ALARM_L bits
0 : Alarm function enabled
1 : Alarm function disabled
Status bit for tuning voltage out of range (too close to
VDD)
The PLL should be re-calibrated if this bit is set
Status bit for tuning voltage out of range (too close to
GND)
The PLL should be re-calibrated if this bit is set
SWRS047
Page 109 of 152
CC1010
17.13 Lock Indication
The frequency synthesis PLL has a lock
indicator, which can be read from the
LOCK register. LOCK_INSTANT is a single
sample of the phase difference between
the reference frequency and the divided
VCO frequency. This bit gives a lock
accuracy of > 25 %, depending on the
division ratio set by the FREQ registers. To
be used as a lock indicator, this bit must
be sampled over a period of time to
increase the accuracy.
Otherwise LOCK_CONTINUOUS should be
used. It is a filtered version of
LOCK_INSTANT, giving a lock accuracy of
99.3 % with PLL_LOCK_ACCURACY
cleared.
If lock is not achieved, the PLL should be
recalibrated as described on page 113.
LOCK (0xE4) - PLL Lock Register
Bit
7:4
3
Name
PLL_LOCK_ACCURACY
R/W
R0
R/W
Reset value
0
0
2
PLL_LOCK_LENGTH
R/W
0
1
LOCK_INSTANT
R
None
0
LOCK_CONTINUOUS
R
None
Description
Reserved, read as 0
0 : Sets Lock Threshold = 127, Reset Lock
Threshold = 111 for continuous lock.
Corresponds to a worst case accuracy of
99.3%
1 : Sets Lock Threshold = 31, Reset Lock
Threshold =15 for continuous lock.
Corresponds to a worst case accuracy of
97.2%
0 : Normal PLL lock window
1 : Not used
Status bit from Lock Detector. The result of
one sample of the lock window on the PLL
reference clock
Status bit from Lock Detector, set according
to the PLL_LOCK_ACCURACY setting
SWRS047
Page 110 of 152
CC1010
17.14 Recommended Settings for ISM Frequencies
The recommended frequency synthesiser
settings for a few operating frequencies in
the popular ISM bands are shown in Table
35. These settings ensure optimum
configuration of the synthesiser in receive
mode for best sensitivity. For some
settings of the synthesiser (combinations
of RF frequencies and reference
frequency), the receiver sensitivity is
degraded. The performance of the
transmitter is not affected by the settings,
but recommended transmitter settings are
included for completeness. The FSK
frequency separation is set to 64 kHz. The
SmartRF® Studio software can be used to
generate the optimised configuration data
as well. Also an application note (AN011)
and a spreadsheet are available from
Chipcon generating configuration data for
any frequency giving optimum sensitivity.
ISM
Frequency
[MHz]
Actual
frequency
[MHz]
Crystal
frequency
[MHz]
Low-side
/ highside
LO*
Reference
divider
REFDIV
[decimal]
Frequency
word
RX mode
FREQ
[decimal]
Frequency
word
RX mode
FREQ
[hex]
315
315.3372
low-side
433.3
433.302000
433.9
433.916400
434.5
434.530800
868.3
868.277200
868.95
868.938800
3,6864
7.3728
11.0592
14.7456
18.4320
22.1184
3.6864
7.3728
11.0592
14.7456
18.4320
22.1184
3.6864
7.3728
11.0592
14.7456
18.4320
22.1184
3.6864
7.3728
11.0592
14.7456
18.4320
22.1184
3.6864
7.3728
11.0592
14.7456
18.4320
22.1184
3.6864
7.3728
11.0592
14.7456
18.4320
22.1184
3
6
9
12
15
18
3
6
9
12
15
18
3
6
9
12
15
18
3
6
9
12
15
18
2
4
6
8
10
12
2
4
6
8
10
12
4194304
4194304
4194304
4194304
4194304
4194304
5767168
5767168
5767168
5767168
5767168
5767168
5775360
5775360
5775360
5775360
5775360
5775360
5783552
5783552
5783552
5783552
5783552
5783552
7708672
7708672
7708672
7708672
7708672
7708672
7716864
7716864
7716864
7716864
7716864
7716864
400000
400000
400000
400000
400000
400000
580000
580000
580000
580000
580000
580000
582000
582000
582000
582000
582000
582000
584000
584000
584000
584000
584000
584000
75A000
75A000
75A000
75A000
75A000
75A000
75C000
75C000
75C000
75C000
75C000
75C000
Low-side
Low-side
Low-side
Low-side
high-side
SWRS047
Page 111 of 152
CC1010
ISM
Frequency
[MHz]
Actual
frequency
[MHz]
Crystal
frequency
[MHz]
Low-side
/ highside
LO*
Reference
divider
REFDIV
[decimal]
Frequency
word
RX mode
FREQ
[decimal]
Frequency
word
RX mode
FREQ
[hex]
869.525
869.506000
Low-side
869.85
869.860400
915
915.018800
3.6864
7.3728
11.0592
14.7456
18.4320
22.1184
3.6864
7.3728
11.0592
14.7456
18.4320
22.1184
3.6864
7.3728
11.0592
14.7456
18.4320
22.1184
3
6
9
12
15
18
2
4
6
8
10
12
2
4
6
8
10
12
11583488
11583488
11583488
11583488
11583488
11583488
7725056
7725056
7725056
7725056
7725056
7725056
8126464
8126464
8126464
8126464
8126464
8126464
B0C000
B0C000
B0C000
B0C000
B0C000
B0C000
75E000
75E000
75E000
75E000
75E000
75E000
7C0000
7C0000
7C0000
7C0000
7C0000
7C0000
High-side
High-side
*Note: When using high-side LO injection the data received in RFBUF will be inverted.
Table 35. Recommended settings for ISM frequencies
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CC1010
17.15 VCO
Only one external inductor (L101) is
required for the VCO. The inductor will
determine the operating frequency range
of the circuit. It is important to place the
inductor as close to the pins as possible in
order to reduce stray inductance. It is
recommended to use a high Q, low
tolerance inductor for best performance.
Typical tuning range for the integrated
varactor is 20-25%.
Component values for various frequencies
are given in Table 28. Component values
for other frequencies can be found using
the SmartRF® Studio software.
17.16 VCO and PLL self-calibration
To compensate for supply voltage,
temperature and process variations the
VCO and PLL must be calibrated. The
calibration is done automatically and sets
optimum VCO tuning range and optimum
charge pump current for PLL stability. The
calibration is controlled by using the CAL
register.
After setting up the device at the operating
frequency, the TEST6 register must be
programmed (depend on operation mode).
Then the self-calibration is initiated by
setting the CAL.CAL_START bit. The
calibration result is stored internally in the
chip, and is valid as long as power is not
turned off. If large supply voltage
variations (more than 0.5 V) or
temperature variations (more than 40
degrees) occur after calibration, a new
calibration should be performed. For more
details on the calibration data, see the
description for test and calibration
registers page 128.
When CAL.CAL_WAIT = 1 the calibration
is complete and the CAL.CAL_COMPLETE
flag is set after 25650 reference clock
see
the
Frequency
cycles
(fREF,
programming section at page 106). The
user can poll this bit, or simply wait 25650
reference clock cycles. The lowest
permitted reference frequency (1 MHz)
gives a wait time of 25.65 ms, which is the
worst case. Some calibration times for
different reference frequencies are listed in
Table 36. When CAL.CAL_WAIT = 0 it
takes 12825 cycles, but this is not
recommended.
Reference frequency
[MHz]
Calibration time
[ms]
2.4
10.69
2.0
12.83
1.5
17.10
1.0
25.65
Table 36. Calibration times
The CAL_START bit must be cleared after
the calibration is done. This will also clear
the CAL.CAL_COMPLETE status bit.
There are separate calibration values for
the two frequency registers. If the two
frequencies, A and B, differ more than 1
MHz, or different VCO currents are used
the
(CURRENT.VCO_CURRENT(3:0)),
calibration should be done separately.
When using a 10.7 MHz external IF the LO
is 10.7 MHz below/above the transmit
frequency, hence separate calibration
must be done. The CAL.CAL_DUAL bit
controls dual or separate calibration.
The single frequency calibration algorithm
using separate calibration for RX and TX
frequency is illustrated in Figure 34.
In Figure 35 the dual calibration algorithm
is shown for two RX frequencies. It could
also be used for two TX frequencies, or
even for one RX and one TX frequency if
the same VCO current is used.
In multi-channel and frequency hopping
applications the PLL calibration values
may be read and stored for later use. By
reading back calibration values and
frequency change can be done without
doing a re-calibration which could take up
to 25 ms. After a calibration is completed,
SWRS047
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CC1010
the result of the calibration is stored in the
TEST0 (VCO capacitance array setting)
and TEST2 (Charge pump current setting)
registers. The access of these registers
depend on the RFMAIN.F_REG bit as
there are two physical registers mapped to
the same address, one for frequency A
and one for frequency B. The calibration
result can be read back from TEST0 and
TEST2, and later written back in
TEST5.VCO_AO(3:0)
and
TEST5.CHP_CO(4:0)
respectively.
TEST5.VCO_OVERRIDE
and
TEST6.CHP_OVERRIDE must be set in
order to make the override values to take
effect.
The rest of the TESTn registers are not
needed for normal operation of CC1010, but
are included here for completeness.
CAL (0xE5) - PLL Calibration Control Register
Bit
7
Name
CAL_START
R/W
R/W
Reset value
0
6
CAL_DUAL
R/W
0
5
CAL_WAIT
R/W
0
Description
↑ 1 : Calibration started
0 : Calibration inactive
Calibration is started after a positive transition on
CAL_START. CAL_START must manually be
written to 0 after calibration is complete (read the
CAL_COMPLETE flag)
1 : Store calibration in both A and B (dual
calibration)
0 : Store calibration in A or B defined by
RFMAIN.F_REG
1 : Normal Calibration Wait Time (Recommended)
0 : Half Calibration Wait Time
4
CAL_CURRENT
R/W
0
3
CAL_COMPLETE
R
0
2:0
CAL_ITERATE
R/W
101
The calibration time is proportional to the internal
reference frequency fREF. See the main text.
1 : Calibration Current Doubled
0 : Normal Calibration Current (Recommended)
Status bit which is set when the calibration is
complete
Iteration start value for calibration DAC
000 - 101: Not used
110 : Normal start value
111 : Not used
TEST6 (0xFF) – PLL Test Register 6
Bit
7
Name
LOOPFILTER_TP1
R/W
R/W
Reset value
0
6
LOOPFILTER_TP2
R/W
0
5
CHP_OVERRIDE
R/W
0
4:0
CHP_CO(4:0)
R/W
0x10
Description
Testpoint 1 select
0 : CHP_OUT tied to GND
1 : Select testpoint 1 to CHP_OUT
Testpoint 2 select
0 : CHP_OUT tied to GND
1 : Select testpoint 2 to CHP_OUT
Charge pump current override enable
0 : use calibrated value. Used in RX mode
1 : use CHP_CO[4:0] value. Used in TX mode
Charge pump current DAC override value,
applied when CHP_OVERRIDE is high. Use
0x1B in TX mode.
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CC1010
TEST5 (0xFE) – PLL Test Register 5
Bit
7:6
5
Name
CHP_DISABLE
R/W
R0
R/W
Reset value
0x00
0
4
VCO_OVERRIDE
R/W
0
3:0
VCO_AO(3:0)
R/W
0x08
Description
Reserved, read as 0
PLL Charge Pump disable
0 : Charge Pump is enabled (normal function)
1 : Charge Pump is disabled
VCO array override
0 : VCO array is not overridden (normal function)
1 : VCO array is set by VCO_AO(3:0)
VCO Array override value
TEST4 (0xFD) – PLL Test Register 4
Bit
7:6
5:0
Name
L2KIO
R/W
R/W
R/W
Reset value
0x00
0x25
Description
Reserved, read as 0
Constant charge pump current scaling / rounding
factor. Sets bandwidth of PLL. Default value is
0x25 and shall be used for all modes
TEST3 (0xFC) – PLL Test Register 3
Bit
7:5
4
Name
3:0
CAL_DAC_OPEN
(3:0)
BREAK_LOOP
R/W
R0
R/W
Reset value
0x00
0
R/W
100
Description
Reserved, read as 0
Break frequency synthesis PLL
0 : PLL loop closed (normal operation)
1 : PLL loop open
Calibration DAC override value, active when
BREAK_LOOP is set
TEST2 (0xFB) – PLL Test Register 2
Bit
7:5
4:0
Name
CHP_CURRENT
(4:0)
R/W
R0
R
Reset value
0x00
None
Description
Reserved, read as 0
Status vector defining the applied charge pump
current
TEST1 (0xFA) – PLL Test Register 1
Bit
7:4
3:0
Name
CAL_DAC(3:0)
R/W
R0
R
Reset value
0x00
None
Description
Reserved, read as 0
Status vector defining the applied calibration
DAC value
TEST0 (0xF9) – PLL Test Register 0
Bit
7:4
3:0
Name
VCO_ARRAY(3:0)
R/W
R0
R
Reset value
0x00
0x00
Description
Reserved, read as 0
Status vector defining the applied VCO array
SWRS047
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CC1010
Start single calibration
Write FREQ_A, FREQ_B
Write CAL.CAL_DUAL = 0
Write RFMAIN:
RXTX = 0; F_REG = 0; RX_PD = 0; TX_PD = 1;
FS_PD = 0; CORE_PD=0; BIAS_PD=0;
Write CURRENT.VCO_CURRENT = RX current
Write PLL.REFDIV = RX reference divider
Write TEST6=0x1B
Write CAL.CAL_START=1
Wait for maximum 26 ms, or
Read CAL and wait until
CAL.CAL_COMPLETE=1
Frequency register A is used for
RX mode, register B for TX
RX frequency register A is calibrated first
‘RX current’ is the VCO current to
be used in RX mode
Calibration is performed in RX mode,
Result is stored in TEST0 and TEST2,
RX register
Calibration time depends on the reference
frequency, see text.
Write CAL.CAL_START=0
Write RFMAIN:
RXTX = 1; F_REG = 1
RX_PD = 1; TX_PD = 0; FS_PD = 0
CORE_PD = 0; BIAS_PD = 0; RESET_N=1
Write CURRENT.VCO_CURRENT = TX current
Write PLL.REFDIV = TX reference divider
Write TEST6 = 0x3B
Write PA_POW = 0x00
Write CAL.CAL_START=1
TX frequency register B is calibrated second
‘TX current’ is the VCO current to be
used in TX mode
PA is turned off to prevent spurious
emission
Calibration is performed in TX mode,
Result is stored in TEST0 and TEST2,
TX registers
Wait for 26 ms, or
Read CAL and wait until
CAL.CAL_COMPLETE=1
Write CAL.CAL_START=0
End of calibration
Figure 34. Single calibration algorithm for RX and TX
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CC1010
Start dual calibration
Write FREQ_A, FREQ_B
Write CAL.CAL_DUAL = 1
Write RFMAIN:
RXTX = 0; F_REG = 0; RX_PD = 0; TX_PD = 1;
FS_PD = 0; CORE_PD=0; BIAS_PD=0;
Write CURRENT.VCO_CURRENT = RX current
Write PLL.REFDIV = RX reference divider
Write TEST6=0x1B
Frequency registers A and B are both used
for RX mode (or both for TX mode)
Either frequency register A or B is selected
‘RX current’ is the VCO current to be
used in RX mode.
TEST6 = 0x3B if TX mode
Write CAL.CAL_START=1
Dual calibration is performed.
Result is stored in TEST0 and TEST2,
for both frequency A and B registers
Wait for maximum 26 ms, or
Read CAL and wait until
CAL.CAL_COMPLETE=1
Calibration time depends on the reference
frequency, see text.
Write CAL:
CAL_START=0
End of calibration
Figure 35. Dual calibration algorithm for RX mode
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CC1010
17.17 VCO, LNA and buffer current control
The VCO current is programmable and
should be set according to operating
frequency, RX/TX mode and output power.
The receiver sensitivity will also be
affected
by
the
current
settings.
Recommended
settings
for
the
CURRENT.VCO_CURRENT bits are shown
in the CURRENT register table following
below.
The bias current for the LNA, and the LO
and PA buffers are also programmable
through FREND.LNA_CURRENT,
FREND.BUF_CURRENT,
CURRENT.LO_DRIVE and
CURRENT.PA_DRIVE.
CURRENT (0xE1) - RF Current Control Register
Bit
7:4
3:2
1:0
Name
VCO_CURRENT
(3:0)
R/W
R/W
Reset value
1100
Description
Control of current in VCO core for TX and RX
0000 : 150µA
0001 : 250µA
0010 : 350µA
0011 : 450µA
0100 : 950µA, use for RX, f< 500 MHz
0101 : 1050µA
0110 : 1150µA, use for RX f>500 MHz
0111 : 1250µA
1000 : 1450µA, use for TX f < 500 MHz
1001 : 1550µA
1010 : 1650µA
1011 : 1750µA
1100 : 2250µA
1101 : 2350µA
1110 : 2450µA
1111 : 2550µA, use for TX, f>500 MHz
LO_DRIVE
(1:0)
R/W
PA_DRIVE
(1:0)
R/W
10
Control of current in VCO buffer for LO drive
00 : 0.5mA, use for TX
01 : 1.0mA, use for RX when f<500 MHz
10 : 1.5mA
11 : 2.0mA, use for RX, f>500 MHz
10
Control of current in VCO buffer for PA
00 : 1mA, use for RX
01 : 2mA, use for TX, f<500 MHz
10 : 3mA
11 : 4mA, use for TX, f>500 MHz
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CC1010
FREND (0xEE) - Front End Control Register
Bit
7:6
5
Name
BUF_CURRENT
R/W
R/W
R/W
Reset value
0
0
4:3
LNA_CURRENT(1:0)
R/W
00
2
IF_EXTERNAL
R/W
0
1
RSSI
R/W
0
0
-
R/W
0
Description
Reserved, should always be written 0
Control of current in the LNA_FOLLOWER
0 : 520uA, use for f<500 MHz
1 : 690uA, use for f>500 MHz
Control of current in LNA
00 : 0.8mA
01 : 1.4mA, use for f<500 MHz
10 : 1.8mA, use for f>500 MHz
11 : 2.2mA
Controls where the output from the mixer
goes:
0: To internal IF filter and demodulator
1: To the AD2(RSSI/IF) pin for external
filtering and demodulation
0: RSSI output disconnected from
AD2(RSSI/IF)pin
1: RSSI output connected to
AD2(RSSI/IF)pin
Reserved, should always be written 0
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CC1010
17.18 Input / Output Matching
A few passive external components
combined with the internal T/R switch
circuitry ensures match in both RX and TX
mode. The matching network is shown in
Figure 36. Component values for various
frequencies are given in Table 28.
Component values for other frequencies
can be found using the SmartRF® Studio
software.
The register MATCH should initially be set
as shown in the register description below.
The MATCH register controls a capacitor
array located at the RF_OUT pin. The
register can be used to fine-tune the
impedance match for a particular layout
and component selection. The tuning can
be accomplished by stepping the register
values until optimum sensitivity and output
power is reached.
C41
RF_IN
TO ANTENNA
RF_OUT
CC1010
C52
C51
L51
L42
AVDD=3V
Figure 36. Input/output matching network
MATCH (0xDC) - Match Capacitor Array Control Register
Bit
7:3
Name
3:0
TX_MATCH
(3:0)
RX_MATCH
(3:0)
R/W
R/W
Reset value
0000
R/W
0000
Description
Selects matching capacitor array value for RX, step size is
0.4 pF
0000: Use for RF frequency > 500 MHz
1100: Use for RF frequency < 500 MHz
Selects matching capacitor array value for TX, step size is
0.4 pF. Recommended setting is 0000
SWRS047
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CC1010
Figure 37. Typical LNA input impedance, 300 – 1000 MHz
SWRS047
Page 121 of 152
CC1010
Figure 38. Typical inactive PA pin impedance, 300 – 1000 MHz
SWRS047
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CC1010
17.19 Output Power Programming
The RF output power is programmable
and controlled by the PA_POW register.
Table 37 shows the closest programmable
value for output powers in steps of 1 dB.
The typical current consumption is also
shown for a 14.7456 MHz main oscillator
frequency. The current consumption is for
Output power
[dBm]
the entire CC1010, with both the RF
transceiver and MCU active.
In power down mode the PA_POW should
be set to 0x00 for minimum leakage
current.
RF frequency 433 MHz
PA_POW
Current consumption,
RF frequency 868 MHz
PA_POW
Current consumption,
typ. [mA]
typ. [mA]
-20
0x02
21.7
0x02
24.2
-19
0x02
21.7
0x02
24.2
-18
0x02
21.7
0x03
24.4
-17
0x02
21.7
0x03
24.4
-16
0x02
21.7
0x04
24.6
-15
0x02
21.7
0x04
24.6
-14
0x03
21.9
0x05
24.8
-13
0x03
21.9
0x06
25
-12
0x04
22.2
0x07
25.2
-11
0x04
22.2
0x08
25.4
-10
0x05
22.4
0x09
25.7
-9
0x05
22.4
0x0A
25.9
-8
0x06
22.7
0x0B
26
-7
0x07
22.9
0x0C
26.2
-6
0x08
23.2
0x0E
26.6
-5
0x09
23.5
0x0F
26.8
-4
0x0A
23.8
0x50
29.3
-3
0x0B
24.0
0x60
29.9
-2
0x0D
24.5
0x70
30.5
-1
0x0E
24.9
0x80
31.0
0
0x40
26.0
0xA0
32.1
1
0x50
27.0
0xC0
33.1
2
0x60
28.0
0xE0
34.2
3
0x60
28.0
0xF0
34.7
4
0x70
28.9
0xFF
38.5
5
0x80
30.0
6
0x90
31.0
7
0xB0
33.2
8
0xC0
34.3
9
0xE0
36.7
10
0xFF
42.8
Note: The current consumption is measured at for a 14.7456 MHz main oscillator frequency, and is for
the entire CC1010 (both MCU and RF transceiver). If the crystal frequency is changed, the current
consumption for the MCU will change, the relationship between crystal frequency and MCU current
consumption is shown in Figure 1.
Table 37. Output power settings and typical current consumption
SWRS047
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CC1010
50,0
Output power [dBm] / Current consumption [mA]
40,0
30,0
20,0
10,0
0,0
-10,0
-20,0
-30,0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
10 20 30 40 50 60 70 80 90 A0 B0 C0 D0 E0 F0 FF
PA_POW (Hex ade cimal)
Output power
Current consumption
Figure 39. Typical output power and total current consumption, 433 MHz
40,0
Output power [dBm] / Current consumption [mA]
30,0
20,0
10,0
0,0
-10,0
-20,0
-30,0
-40,0
-50,0
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
10 20 30 40 50 60 70 80 90 A0 B0 C0 D0 E0 F0 FF
PA_POW [Hexadecimal]
Output power
Current consumption
Figure 40. Typical output power and total current consumption, 868 MHz
SWRS047
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CC1010
PA_POW (0xE2) - PA Output Power Control Register
Bit
7:4
Name
3:0
PA_LOWPOWER
(3:0)
PA_HIGHPOWER
(3:0)
R/W
R/W
Reset value
0x00
R/W
0x0F
Description
Control of output power in high power array.
Should be 0000 in PD mode. See Table 37 for
details.
Control of output power in low power array.
Should be 0000 in PD mode. See Table 37 for
details.
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CC1010
17.20 RSSI Output
CC1010 has a built-in RSSI (Received
Signal Strength Indicator) giving an analog
output signal at the AD2(RSSI/IF) pin.
RSSI
is
enabled
when
setting
FREND.RSSI (see page 119). The output
current of this pin is then inversely
proportional to the input signal level. The
output should be terminated in a resistor to
convert the current output into a voltage. A
capacitor is used to low-pass filter the
signal.
The RSSI voltage range is from 0 – 1.2 V
when using a 27 kΩ terminating resistor,
giving approximately 50 dB/V. This RSSI
voltage can be measured by the on-chip
A/D converter using the AD2 input. Note
that a higher voltage means a lower input
signal.
The RSSI measures the power referred to
the RF_IN pin. The input power can be
calculated using the following equations:
P = -48.8 VRSSI– 57.2 [dBm] at 433 MHz
P = -46.9 VRSSI– 53.9 [dBm] at 868 MHz
The external network for RSSI operation is
shown in
Figure 41. R281 = 27 kΩ, C281 = 1nF.
A typical plot of RSSI voltage as function
of input power is shown in Figure 42.
When using the on-chip A/D converter, set
ADCON = 0x06 to initiate a single
conversion using VDD as reference. The
converted RSSI voltage can then be read
from the ADDATH and ADDATL registers.
CC1010
Voltage
AD2 (RSSI/IF)
C281
R281
1,3
1,2
1,1
1
0,9
0,8
0,7
0,6
0,5
0,4
0,3
0,2
0,1
0
-105 -100 -95
433Mhz
868Mhz
-90
-85
-80
-75
-70
-65
-60
-55
dBm
Figure 41. RSSI circuit
Figure 42. Typical RSSI voltage vs. input
power
SWRS047
Page 126 of 152
-50
CC1010
17.21 IF output
CC1010 has a built-in 10.7 MHz IF output
buffer.
This buffer can be used in
applications requiring image frequency
rejection. The system is then built with
CC1010, a 10.7 MHz ceramic filter, SAW
front-end filter and an external 10.7 MHz
demodulator. The matching network for an
external IF filter is shown in Figure 43.
R281 = 470 Ω, C281 = 3.3nF. This
external network provides a 330 Ω source
impedance for the 10.7 MHz ceramic filter.
AD2 (RSSI/IF)
To 10.7MHz filter
and demodulator
CC1010
C281
R281
Figure 43. IF Output
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CC1010
17.22 Optional LC Filter
An optional low-pass LC filter may be
added between the antenna and the
matching network in certain applications.
The filter will reduce the emission of
harmonics and increase the receiver
selectivity.
The design equations for a 3dB equal
ripple filter are:
The filter topology is shown in Figure 44.
Component values are given in Table 38.
The filter is designed for 50 Ω
terminations. The component values may
have to be tuned to compensate for layout
parasitics.
L=
1
⎛
⎞
⎟
⎝ 1 − 0.1333 ⎠
ω C ≈ 2π ⋅ f RF ⋅ ⎜
35.6
ωC
,
C=
0.067
ωC
where ωc is the cut-off frequency and fRF is
the transmitted RF frequency.
L71
C71
C72
Figure 44. LC Filter
Item
315 MHz
434 MHz
869 MHz
915 MHz
C71
C72
L71
30 pF
30 pF
15 nH
20 pF
20 pF
12 nH
10 pF
10 pF
5.6 nH
10 pF
10 pF
4.7 nH
Table 38. LC Filter component values
SWRS047
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CC1010
18. Reserved registers and test registers
The CC1010 contains a few registers
intended for test purposes only. Normally
these registers should not be written to.
to use an external PLL loop filter.
However, this is not recommended in a
normal application.
The FSHAPEn, FSDELAY and FSCTRL
registers are reserved for future use. A
separate reset signal for the PLL is
available in FSCTRL.FS_RESET_N. This
will reset the frequency divider part of the
PLL. The reset is active when a zero is
written, and a one must be written for the
reset
to
be
released.
FSCTRL.EXT_FILTER can be set in order
The PRESCALER register controls the
prescaler current, and should always be
set to 0x00 (which is the reset state).
TESTMUX
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
The TESTMUX register is not needed for
normal operation of CC1010, but is included
here for completeness. TESTMUX should
always be set to 0x00.
P0.2
P0.1
P0.0
Normal operation
CLK_REF
LOCK_DET_CONTINUOUS
SER_PAR_IRQ
RTC_IRQ
ANALOG_ALARM_H
MODEM_BIT_CLK
MODEM_BIT_CLK
ADC_SAR_ADCCLK_EN
CLK_RTC
DES_DEBUG_0
DES_DEBUG_1
DES_DEBUG_2
DES_DEBUG_3
FLASH_WRITE_IRQ
CAL_DIG_COMPLETE
Normal operation
CLK_PHASE_DET_OUT
LOCK_DET_INSTANT
TIMER2_IRQ
ADC_IRQ
ANALOG_ALARM_L
MODEM_RX_DATA
MODEM_TX_DATA
ANALOG_COMP
RTC_IRQ
Normal operation
MODEM_TX_OUT
ANALOG_WINDOW_SYNC
TIMER3_IRQ
DES_IRQ
CAL_DIG_COMPLETE
ANALOG_IF_OUT
MODEM_TX_OUT
ADC_SAR_EOC
CLK_UC
Table 39. TESTMUX modes
FSHAPEn (0xF1 - 0xF7), n∈1..7 - Frequency Shaping Register n
Bit
7:5
4:0
Name
FSHAPEn (4:0)
R/W
R0
R/W
Reset value
0x00
0xXX
Description
Reserved, read as 0
Reserved for future use.
FSDELAY (0xE9) - Frequency Shaping Delay Control Register
Bit
7:0
Name
FSDELAY (7:0)
R/W
R/W
Reset value
0x2F
Description
Reserved for future use.
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CC1010
FSCTRL (0xEC) - Frequency Synthesiser Control Register
Bit
7:5
4
Name
EXT_FILTER
R/W
R0
R/W
Reset value
0x00
0
3
DITHER1
R/W
0
Description
Reserved, read as 0
Setting for external loop filter (not recommended)
0 : Internal loop filter (recommended)
1 : External loop filter
Reserved for future use. Write as 0.
2
DITHER0
R/W
0
Reserved for future use. Write as 0.
1
SHAPE
R/W
0
Reserved for future use. Write as 0.
0
FS_RESET_N
R/W
1
Separate reset of frequency synthesiser
0 : Frequency synthesiser is reset
1 : Frequency synthesiser reset is released
PRESCALER (0xE6) - Prescaler Control Register
Bit
7
Name
R/W
R/W
Reset value
00
PRE_CURRENT
(1:0)
R/W
00
3
IF_INPUT
R/W
0
2
IF_FRONT
R/W
0
1
-
R/W
0
Description
Prescaler swing. Fractions for PRE_CURRENT[1:0] =
00
00 : 1 * Nominal Swing
01 : 2/3 * Nominal Swing
10 : 7/3 * Nominal Swing
11 : 5/3 * Nominal Swing
Prescaler current scaling
00 : 1 * Nominal Current
01 : 2/3 * Nominal Current
10 : 1/2 * Nominal Current
11 : 2/5 * Nominal Current
0 : Nominal setting
1 : AD2(RSSI/IF) pin is input to IF-strips
0 : Nominal setting
1 : Output of IF_Front_amp is switched to the
AD2(RSSI/IF) pin
Reserved for future use, always write 0
5
0
-
R/W
0
Reserved for future use, always write 0
PRE_SWING
(1:0)
TESTMUX (0xEF) - Test Multiplexer Control Register (for prototype testing)
Bit
7:4
3:0
Name
TESTMUX
(3:0)
R/W
R0
R/W
Reset value
0x00
0x00
Description
Reserved, read as 0
Select internal test signals to be output to P0(2:0).
This function is enabled when TESTMUX ≠ 0000. The
port directions are still set by P0DIR.
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CC1010
19. System Considerations and Guidelines
19.1 SRD regulations
19.4 Narrow-band systems
International regulations and national laws
regulate the use of radio receivers and
transmitters. SRDs (Short Range Devices)
for licence free operation are allowed to
operate in the 433 and 868-870 MHz
bands in most European countries. In the
United States such devices operate in the
260–470 and 902-928 MHz bands. CC1010
is designed to meet the requirements for
operation in all these bands. A summary of
the most important aspects of these
regulations can be found in Application
Note AN001 SRD regulations for licence
free transceiver operation, available on
Chipcon’s web site.
CC400,
19.2 Low cost systems
In systems where low cost is of great
importance the CC1010 is the ideal choice.
Very few external components keep the
total cost at a minimum. The oscillator
crystal can then be a low cost crystal with
50/25 ppm frequency tolerance at 433/868
MHz respectively.
19.3 Battery operated systems
In low power applications the RF
Transceiver power down mode should be
used when no communication takes place.
Using receiver polling, that is, listening for
transmissions for a few milliseconds at
regular intervals, will also save a lot of
battery power. The RSSI can be used as a
first indication that a transmission is
received. See page 89 for information on
how effective power management can be
implemented. Utilizing the Idle mode and
Power down modes and clock modes of
the MCU will also reduce the power
consumption significantly. See page 33 for
details. Also of interest is Application Note
AN017 Low Power Systems Using the
CC1010, available on Chipcon’s web site.
CC900
and
CC1020
are
recommended for best performance in
narrow-band applications. The phase
noise of these chips is superior, and for
systems with 25 kHz channel spacing or
less with strict requirements to ACP
(Adjacent Channel Power), low phase
noise is important.
The selectivity of CC1010 can be improved
by using an external ceramic filter and
demodulator at 10.7 MHz. Such ceramic
filters are typically 180 or 280 kHz wide.
A unique feature in CC1010 is the very fine
frequency resolution of < 250 Hz. This can
be used to do the temperature
compensation of the crystal if the
temperature drift curve is known and a
temperature sensor is included in the
system. Even initial adjustment can be
done using the frequency programmability.
This eliminates the need for an expensive
TCXO and trimming in some applications.
In less demanding applications a crystal
with low temperature drift and low ageing
could
be
used
without
further
compensation. A trimmer capacitor in the
crystal oscillator circuit (in parallel with
C171) could be used to set the initial
frequency accurately. The fine frequency
step programming cannot be used in RX
mode if optimised frequency settings are
required (see page 111).
19.5 High reliability systems
Using a SAW filter as a preselector
between the antenna and the RF input will
improve the communication reliability in
harsh environments by reducing the
probability of blocking. The receiver
sensitivity and the output power will be
reduced due to the filter insertion loss. By
inserting the filter in the RX path only,
together with an external RX/TX switch,
only the receiver sensitivity is reduced,
and output power is unaffected. Any
general-purpose I/O pins can be
SWRS047
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CC1010
configured to control an external LNA,
RX/TX switch or power amplifier.
19.6 Frequency hopping spread
spectrum systems
Due to the very fast frequency shift
properties of the PLL, the CC1010 is very
suitable for frequency hopping systems.
Hop rates of 10-1000 hops/s are usually
used depending on the bit rate and the
amount of data to be sent during each
transmission. The two frequency registers
(FREQ_A and FREQ_B) are designed such
that the ‘next’ frequency can be
programmed while the ‘present’ frequency
is used. The switching between the two
frequencies
is
done
through
the
RFMAIN.F_REG control bit. Frequency
hopping improves the reliability and
increases the security of a wireless link.
The US ISM band at 902 – 928 MHz is
very suitable for frequency hopping
protocols. The FCC regulations allow the
use of transmitted output powers up to 1W
if frequency hopping is used and certain
requirements are met. Please see
application note AN001 SRD regulations
for licence free transceiver operation for
more information about this and other
radio regulations issues.
19.7 Software
Chipcon provides world-class software
support for the CC1010.
The HAL (Hardware Abstraction Library)
library provides easy-to-use functions and
macros to access the CC1010 hardware
without having to access SFRs directly. It
also provides functions simple RF
communications routines.
The CUL (Chipcon Utility Library) library
contains
more
sophisticated
RF
communication routines with support for
CRC
checking,
automatic
acknowledgment and retransmission.
Both libraries are supplied with full source
code, and are documented in the CC1010
IDE User Manual.
Chipcon also supplies a wide range of
examples for the CC1010. These examples
include simple examples, which show off
the various features of the CC1010, as well
as examples showing RF communication
and more sophisticated application-related
examples. Source code as well as precompiled HEX files are available for all
examples. A ZIP file including all examples
and documentation is available from the
Chipcon web pages. Make sure to check
the web pages regularly, as improvements
to existing examples as well as all-new
examples are added as they are available.
19.8 Development tools
Chipcon
supplies
a
full-featured
development kit for the CC1010 that
includes everything you need to start and
finish your design. The development kit is
documented in the CC1010DK User
Manual.
The development kit includes an
evaluation version of the Keil C compiler;
this is limited to a code size of 2 kBytes. If
the user wishes to compile larger
programs, a full version of the compiler
must be purchased from Keil. The Keil
development environment supports incircuit debugging using the second serial
port.
The CC1010 is supported by several
compiler vendors. More information about
compiler support can be found on
Chipcon’s web pages.
19.9 PA “splattering”
In systems where the PA is turned on and
off rapidly, for example in a system that
switches rapidly between RX and TX, socalled “splattering” may occur. This will
result in a very wide RF spectrum that may
intrude into neighbouring channels or
extend out of band. To minimise this
effect, Chipcon recommends that the
PA_POW register be used to turn the PA
gradually on and off. The optimal pattern is
to follow the sequence 0x00, 0x01, 0x1E,
0x8F, 0xEF when going from RX to TX
and consequently using 0xEF, 0x8F,
0x1E, 0x01, 0x00 when going from TX to
RX. PA_POW should be left set to 0x00 in
RX mode and 0xEF in TX mode.
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CC1010
19.10 PCB Layout Recommendations
Chipcon provide reference layouts that
should be followed in order to achieve the
best performance. The reference designs
can be downloaded on the Chipcon
website.
A four layer PCB is highly recommended.
The top layer should be used for signal
routing, and the open areas should be
filled with metallisation connected to
ground using many vias. The second layer
of the PCB should be the “ground-plane”.
Layer three is used for power supply and
layer four for general routing and
decoupling. A few components are also
placed at the reverse side (VCO inductor
and power filtering).
The ground pins should be connected to
ground as close as possible to the
package pin using individual vias for each
pin. The de-coupling capacitors should
also be placed as close as possible to the
supply pins and connected to the ground
plane by separate vias. For 868 and 915
MHz operation, some of the AVDD supply
pins should be fitted with ferrite beads in
series to prevent noise from coupling from
one supply pin to another. Please see the
reference layouts for more information. For
433 and 315 MHz operation these beads
are not required, and can be replaced with
0-ohm resistors or PCB traces.
The external components should be as
small as possible and surface mount
devices are required. The VCO inductor
must be placed as close as possible to the
chip and symmetrical with respect to the
input pins. It is important to keep the
coupling between the VCO inductor and
the matching network low in order to
reduce LO leakage. Due to this the VCO
inductor is placed at the reverse side of
the PCB.
A development kit with a fully assembled
PCB is available, and can be used as a
guideline for layout.
Full documentation and Gerber PCB
layout files are available on Chipcon’s web
site.
19.11 Antenna Considerations
CC1010 can be used together with various
types of antennas. The most common
antennas for short-range devices are
monopole, helical and loop antennas.
Monopole
antennas
are
resonant
antennas with a length corresponding to
one quarter of the electrical wavelength
(λ/4). They are very easy to design and
can be implemented simply as a “piece of
wire” or even integrated into the PCB.
Non-resonant monopole antennas shorter
than λ/4 can also be used, but at the
expense of range. In size and cost critical
applications such an antenna may very
well be integrated into the PCB.
Helical antennas can be thought of as a
combination of a monopole and a loop
antenna. They are a good compromise in
size critical applications. But helical
antennas tend to be more difficult to
optimise than the simple monopole.
Loop antennas are easy to integrate into
the PCB, but are less effective due to
difficult impedance matching because of
their very low radiation resistance if they
are made small.
For low power applications the λ/4monopole antenna is recommended giving
the best range and because of its
simplicity.
The length of the λ/4-monopole antenna is
given by:
L = 7125 / f
where f is in MHz, giving the length in cm.
An antenna for 869 MHz should be 8.2
cm, and 16.4 cm for 434 MHz.
The antenna should be connected as
close as possible to the IC. If the antenna
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Page 133 of 152
CC1010
is located away from the input pin the
antenna should be matched to the feeding
transmission line (50 Ω).
For a more thorough primer on antennas,
please refer to Application Note AN003
SRD Antennas available on Chipcon’s
web site.
SWRS047
Page 134 of 152
CC1010
20. Package Description (TQFP-64)
CC1010 is packaged in a TQFP-64 package. The package is shown in Figure 45 below and the
dimensions are listed in Table 40. Please note that the drawing in Figure 45 is not to scale.
Figure 45. TQFP-64 package
SWRS047
Page 135 of 152
CC1010
Symbol
A
A1
A2
D
D1
D3
E
E1
E3
R1
R2
β
β1
β2
β3
C
L
L1
S
Ccc
Ddd
e
b
Dimensions (mm)
1.20 max
0.05 - 0.15
1.00 ± 0.05
12.00 ± 0.20
9.95 ± 0.10
10.00 ± 0.10
12.00 ± 0.20
9.95 ± 0.10
10.00 ± 0.10
0.08 Min
0.15 Ref.
0° - 7°
0° Min
12°
12°
0.09 - 0.20
0.60 ± 0.15
1.0 Ref
0.20 Min.
0.080 Max
0.080 Max
0.50
0.17 - 0.27
Remarks
Overall height
Standoff
Package thickness
Terminal dimension
Top package width
Bottom package width
Terminal dimension
Top package length
Bottom package length
First radius
Second radius
Foot angle
Shoulder angle
Top draft angle
Bottom draft angle
Lead thickness
Foot length
Lead length
Coplanarity
Bent lead
Lead pitch
Lead tip width
Table 40. TQFP-64 package dimensions
21. Soldering Information
The recommended soldering profiles for both leaded and Pb-free packages are according to
IPC/JEDEC J-STD-020B, July 2002.
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Page 136 of 152
CC1010
22. Package marking
When contacting technical support with a chip-related question, please state the entire
marking information, not just the date code.
22.1 Standard leaded
0444CP2482.00
0444 is the date code (week 44 year 04)
CP2482.00 is the lot code
22.2 RoHS compliant Pb-free
0444CP2482.00X
0444 is the date code (week 44 year 04)
CP2482.00 is the lot code
X means Pb-free
SWRS047
Page 137 of 152
CC1010
23. Recommended PCB footprint
Note: The figure is an illustration only and not to scale. See the CC1010EM reference design
for recommended PCB layout.
24. Package thermal coefficients
Package thermal coefficients
Min.
71.1
Rthj-a [K/W]
Avg.
80.8
Max.
90.5
Power [W]
Avg.
0.5
Min.
0.4
SWRS047
Max.
0.6
Page 138 of 152
CC1010
25. Tray Specification
TQFP-64 antistatic tray, 8 by 20 devices.
Tray Specification
Tray Width
Tray Length
Tray
Height
135.9 mm
322.6 mm
7.62 mm
Package
TQFP-64
Units per
Tray
160
26. Carrier Tape and Reel Specification
Carrier tape and reel is in accordance with EIA Specification 481.
Package
Tape Width
TQFP-64
24 mm
Tape and Reel Specification
Component
Hole
Reel
Pitch
Pitch
Diameter
16 mm
4 mm
13”
SWRS047
Units per Reel
1500
Page 139 of 152
CC1010
27. List of Abbreviations
•
ADC - Analog to Digital Converter
•
OFB - Output Feedback Mode
•
AMR – Automatic Meter Reading
•
PCB - Printed Circuit Board
•
CFB - Cipher Feedback Mode
•
PLL - Phase Locked Loop
•
CMOS – Complementary Metal Oxide
Semiconductor
•
POR - Power On Reset
•
•
PWM - Pulse Width Modulation
CPU – Central Processor Unit
•
•
RAM – Random Access Memory
DES - Data Encryption Standard
•
•
RF - Radio Frequency
DMA - Direct Memory Access
•
•
FCC – Federal Communication
Committee
RSSI - Received Signal Strength
Indicator
•
•
RTC – Real-Time Clock
FSK - Frequency Shift Keying
•
•
RX - Receive
IDE – Integrated Development
Environment
•
SFR - Special Function Register
•
IF - Intermediate Frequency
•
SPI - Serial Peripheral Interface
•
ISM – Industrial Scientific Medical
•
SRAM – Static RAM
•
ISR - Interrupt Service Routine
•
SRD - Short Range Device
•
LNA - Low Noise Amplifier
•
TQFP - Thin Quad Flat Pack
•
LO - Local Oscillator
•
TBD – To Be Defined
•
LPF - Loop Filter
•
TX - Transmit
•
LSB - Least Significant Bit (or Byte)
•
•
UART - Universal Asynchronous
Receiver/Transmitter
MOQ – Minimum Order Quantity
•
•
UHF – Ultra High Frequency
MSB - Most Significant Bit (or Byte)
•
•
VCO - Voltage Controlled Oscillator
NRZ - Non Return to Zero
•
XOSC - Crystal Oscillator
SWRS047
Page 140 of 152
CC1010
28. SFR Summary
A summary of all SFRs with address, register names, bit names and reset values are shown in Table 41 below.
Addr
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
Page
0x80
0x81
0x82
0x83
0x84
0x85
0x86
0x87
0x88
0x89
0x8A
0x8B
0x8C
0x8D
0x8E
0x8F
0x90
0x91
0x92
0x93
0x94
0x95
0x96
0x97
0x98
0x99
0x9A
0x9B
0x9C
0x9D
0x9E
0x9F
P0
SP
DPL0
DPH0
DPL1
DPH1
DPS
PCON
TCON
TMOD
TL0
TL1
TH0
TH1
CKCON
P1
EXIF
MPAGE
ADCON
ADDATL
ADDATH
ADCON2
ADTRH
SCON0
SBUF0
.
CHVER
P0.7
SP.7
DPL0.7
DPH0.7
DPL1.7
DPH1.7
SMOD0
TF1
GATE
TL0.7
TL1.7
TH0.7
TH1.7
P1.7
TF3
MPAGE7
AD_PD
ADDAT7
ADCIE
ADTRH7
SM0_0
SBUF0.7
CHIP_TYPE5
P0.6
SP.6
DPL0.6
DPH0.6
DPL1.6
DPH1.6
TR1
C/T
TL0.6
TL1.6
TH0.6
TH1.6
P1.6
ADIF
MPAGE6
ADDAT6
ADCIF
ADTRH6
SM1_0
SBUF0.6
CHIP_TYPE4
P0.5
SP.5
DPL0.5
DPH0.5
DPL1.5
DPH1.5
TF0
M1
TL0.5
TL1.5
TH0.5
TH1.5
T2M
P1.5
TF2
MPAGE5
ADCM1
ADDAT5
ADCDIV5
ADTRH5
SM2_0
SBUF0.5
.
CHIP_TYPE3
P0.4
SP.4
DPL0.4
DPH0.4
DPL1.4
DPH1.4
TR0
M0
TL0.4
TL1.4
TH0.4
TH1.4
T1M
P1.4
RFIF
MPAGE4
ADCM0
ADDAT4
ADCDIV4
ADTRH4
REN_0
SBUF0.4
.
CHIP_TYPE2
P0.3
SP.3
DPL0.3
DPH0.3
DPL1.3
DPH1.3
GF1
IE1
GATE
TL0.3
TL1.3
TH0.3
TH1.3
T0M
P1.3
MPAGE3
ADCREF
ADDAT3
ADCDIV3
ADTRH3
TB8_0
SBUF0.3
.
CHIP_TYPE1
P0.2
SP.2
DPL0.2
DPH0.2
DPL1.2
DPH1.2
GF0
IT1
C/T
TL0.2
TL1.2
TH0.2
TH1.2
MD2
P1.2
MPAGE2
ADCRUN
ADDAT2
ADCDIV2
ADTRH2
RB8_0
SBUF0.2
.
CHIP_TYPE0
P0.1
SP.1
DPL0.1
DPH0.1
DPL1.1
DPH1.1
STOP
IE0
M1
TL0.1
TL1.1
TH0.1
TH1.1
MD1
P1.1
MPAGE1
ADADR1
ADDAT1
ADDAT9
ADCDIV1
ADTRH1
TI_0
SBUF0.1
.
CHIP_REV1
P0.0
SP.0
DPL0.0
DPH0.0
DPL1.0
DPH1.0
SEL
IDLE
IT0
M0
TL0.0
TL1.0
TH0.0
TH1.0
MD0
P1.0
MPAGE0
ADADR0
ADDAT0
ADDAT8
ADCDIV0
ADTRH0
RI_0
SBUF0.0
.
CHIP_REV0
00001111
00000111
00000000
00000000
00000000
00000000
00000000
00110000
00000000
00000000
00000000
00000000
00000000
00000000
00000001
00000000
11111111
00001000
00000000
10000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000001
49
24
21
21
21
21
22
36
54
53
52
52
52
52
55
49
30
22
81
81
81
82
82
67
66
46
SWRS047
Page 141 of 152
CC1010
Addr
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
Page
0xA0
0xA1
0xA2
0xA3
0xA4
0xA5
0xA6
0xA7
0xA8
0xA9
0xAA
0xAB
0xAC
0xAD
0xAE
0xAF
0xB0
0xB1
0xB2
0xB3
0xB4
0xB5
0xB6
0xB7
0xB8
0xB9
0xBA
0xBB
0xBC
0xBD
0xBE
0xBF
0xC0
0xC1
0xC2
0xC3
0xC4
P2
SPCR
SPDR
SPSR
P0DIR
P1DIR
P2DIR
P3DIR
IE
TCON2
T2PRE
T3PRE
T2
T3
FLADR
FLCON
P3
CRPINI0
CRPINI1
CRPINI2
CRPINI3
IP
RDATA
RADRL
RADRH
CRPINI4
CRPINI5
CRPINI6
CRPINI7
SCON1
SBUF1
RFCON
CRPCON
CRPKEY
P2.7
SPDR7
P1DIR7
P2DIR7
EA
T2PRE7
T3PRE7
T2.7
T3.7
FLADR7
CRPINI0.7
CRPINI1.7
CRPINI2.7
CRPINI3.7
RDATA7
RADR15
RADR7
CRPINI4.7
CRPINI5.7
CRPINI6.7
CRPINI7.7
SM0_1
SBUF1.7
CRPKEY7
P2.6
SPDR6
P1DIR6
P2DIR6
T2PRE6
T3PRE6
T2.6
T3.6
FLADR6
FLASH_LP1
CRPINI0.6
CRPINI1.6
CRPINI2.6
CRPINI3.6
RDATA6
RADR14
RADR6
CRPINI4.6
CRPINI5.6
CRPINI6.6
CRPINI7.6
SM1_1
SBUF1.6
CRPIE
CRPKEY6
P2.5
SPE
SPDR5
P1DIR5
P2DIR5
P3DIR5
T2PRE5
T3PRE5
T2.5
T3.5
FLADR5
FLASH_LP0
P3.5
CRPINI0.5
CRPINI1.5
CRPINI2.5
CRPINI3.5
RDATA5
RADR13
RADR5
CRPINI4.5
CRPINI5.5
CRPINI6.5
CRPINI7.5
SM2_1
SBUF1.5
CRPIF
CRPKEY5
P2.4
DORD
SPDR4
P1DIR4
P2DIR4
P3DIR4
ES0
T2PRE4
T3PRE4
T2.4
T3.4
FLADR4
WRFLASH
P3.4
CRPINI0.4
CRPINI1.4
CRPINI2.4
CRPINI3.4
PS0
RDATA4
RADR12
RADR4
CRPINI4.4
CRPINI5.4
CRPINI6.4
CRPINI7.4
REN_1
SBUF1.4
MVIOL
LOADKEYS
CRPKEY4
P2.3
CPOL
SPDR3
P0DIR3
P1DIR3
P2DIR3
P3DIR3
ET1
TR3
T2PRE3
T3PRE3
T2.3
T3.3
FLADR3
RMADR3
P3.3
CRPINI0.3
CRPINI1.3
CRPINI2.3
CRPINI3.3
PT1
RDATA3
RADR11
RADR3
CRPINI4.3
CRPINI5.3
CRPINI6.3
CRPINI7.3
TB8_1
SBUF1.3
MLIMIT2
CRPMD
CRPKEY3
P2.2
CPHA
SPDR2
P0DIR2
P1DIR2
P2DIR2
P3DIR2
EX1
M3
T2PRE2
T3PRE2
T2.2
T3.2
FLADR2
RMADR2
P3.2
CRPINI0.2
CRPINI1.2
CRPINI2.2
CRPINI3.2
PX1
RDATA2
RADR10
RADR2
CRPINI4.2
CRPINI5.2
CRPINI6.2
CRPINI7.2
RB8_1
SBUF1.2
MLIMIT1
ENCDEC
CRPKEY2
P2.1
SPR1
SPDR1
SPA
P0DIR1
P1DIR1
P2DIR1
P3DIR1
ET0
TR2
T2PRE1
T3PRE1
T2.1
T3.1
FLADR1
RMADR1
P3.1
CRPINI0.1
CRPINI1.1
CRPINI2.1
CRPINI3.1
PT0
RDATA1
RADR9
RADR1
CRPINI4.1
CRPINI5.1
CRPINI6.1
CRPINI7.1
TI_1
SBUF1.1
MLIMIT0
TRIDES
CRPKEY1
P2.0
SPR0
SPDR0
WCOL
P0DIR0
P1DIR0
P2DIR0
P3DIR0
EX0
M2
T2PRE0
T3PRE0
T2.0
T3.0
FLADR0
RMADR0
P3.0
CRPINI0.0
CRPINI1.0
CRPINI2.0
CRPINI3.0
PX0
RDATA0
RADR8
RADR0
CRPINI4.0
CRPINI5.0
CRPINI6.0
CRPINI7.0
RI_1
SBUF1.0
BYTEMODE
CRPEN
CRPKEY0
11111111
00000000
00000000
00000000
00001111
11111111
11111111
00111111
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00111111
00000000
00000000
00000000
00000000
00000000
00000000
00000000
10000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000000
00000110
00000000
00000000
50
72
72
72
50
50
51
51
29
59
60
60
60
60
43
43
50
78
78
78
78
31
45
45
45
78
78
78
78
68
67
101
76
77
SWRS047
Page 142 of 152
CC1010
Addr
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
Page
0xC5
0xC6
0xC7
0xC8
0xC9
0xCA
0xCB
0xCC
0xCD
0xCE
0xCF
0xD0
0xD1
0xD2
0xD3
0xD4
0xD5
0xD6
0xD7
0xD8
0xD9
0xDA
CRPDAT
CRPCNT
RANCON
RFMAIN
RFBUF
FREQ_0A
FREQ_1A
FREQ_2A
FREQ_0B
FREQ_1B
FREQ_2B
PSW
X32CON
WDT
PDET
BSYNC
EICON
MODEM2
MODEM1
CRPDAT7
CRPCNT7
RXTX
RFBUF7
FREQ_A7
FREQ_A15
FREQ_A23
FREQ_B7
FREQ_B15
FREQ_B23
CY
PEN
BSYNC7
-
CRPDAT6
CRPCNT6
F_REG
RFBUF6
FREQ_A6
FREQ_A14
FREQ_A22
FREQ_B6
FREQ_B14
FREQ_B22
AC
PLEN6
BSYNC6
PLO6
LOCK_AVG_IN
CRPDAT5
CRPCNT5
RX_PD
RFBUF5
FREQ_A5
FREQ_A13
FREQ_A21
FREQ_B5
FREQ_B13
FREQ_B21
F0
PLEN5
BSYNC5
FDIE
PLO5
LOCK_AVG_MO
CRPDAT4
CRPCNT4
TX_PD
RFBUF4
FREQ_A4
FREQ_A12
FREQ_A20
FREQ_B4
FREQ_B12
FREQ_B20
RS1
WDTSE
PLEN4
BSYNC4
FDIF
PLO4
LOCK_AVG_STA
CRPDAT3
CRPCNT3
FS_PD
RFBUF3
FREQ_A3
FREQ_A11
FREQ_A19
FREQ_B3
FREQ_B11
FREQ_B19
RS0
WDTEN
PLEN3
BSYNC3
RTCIF
PLO3
SETTLING1
CRPDAT2
CRPCNT2
CORE_PD
RFBUF2
FREQ_A2
FREQ_A10
FREQ_A18
FREQ_B2
FREQ_B10
FREQ_B18
OV
X32_BYPASS
WDTCLR
PLEN2
BSYNC2
PLO2
SETTLING0
CRPDAT1
CRPCNT1
RANEN
BIAS_PD
RFBUF1
FREQ_A1
FREQ_A9
FREQ_A17
FREQ_B1
FREQ_B9
FREQ_B17
F1
X32_PD
WDTPRE1
PLEN1
BSYNC1
PLO1
PEAKDETECT
CRPDAT0
CRPCNT0
RANBIT
RFBUF0
FREQ_A0
FREQ_A8
FREQ_A16
FREQ_B0
FREQ_B8
FREQ_B16
P
CMODE
WDTPRE0
PLEN0
BSYNC0
PLO0
MODEM_RESET
00000000
00000000
00000000
00111000
00000000
11001011
10100000
01110101
01001110
10100101
01110101
00000000
00000010
00001011
00000000
00000000
00000000
00000000
00000000
01000000
00010110
00101111
77
77
78
89
95
108
108
108
109
108
108
23
36
63
102
102
30
100
98
0xDB
0xDC
0xDD
0xDE
0xDF
0xE0
0xE1
0xE2
MODEM0
MATCH
FLTIM
ACC
CURRENT
PA_POW
BAUDRATE2
RX_MATCH3
ACC7
VCO_CURRENT3
PA_HIGHPOWER
BAUDRATE1
RX_MATCH2
ACC6
VCO_CURRENT2
PA_HIGHPOWER
BAUDRATE0
RX_MATCH1
FLWCTIME5
ACC5
VCO_CURRENT1
PA_HIGHPOWER
DATA_FORMAT1
RX_MATCH0
FLWCTIME4
ACC4
VCO_CURRENT0
PA_HIGHPOWER
DATA_FORMAT0
TX_MATCH3
FLWCTIME3
ACC3
LO_DRIVE1
PA_LOWPOWER
XOSC_FREQ2
TX_MATCH2
FLWCTIME2
ACC2
LO_DRIVE0
PA_LOWPOWER
XOSC_FREQ1
TX_MATCH1
FLWCTIME1
ACC1
PA_DRIVE1
PA_LOWPOWER
XOSC_FREQ0
TX_MATCH0
FLWCTIME0
ACC0
PA_DRIVE0
PA_LOWPOWER
01110001
00000000
00001010
00000000
00000000
00000000
11001010
00001111
92
120
43
23
118
123
0xE3
PLL
REFDIV4
REFDIV3
REFDIV2
REFDIV1
REFDIV0
ALARM_DISABL
ALARM_H
ALARM_L
000100xx
109
0xE4
LOCK
-
-
-
-
110
CAL_START
CAL_DUAL
CAL_WAIT
CAL_CURRENT
LOCK_
CONTINUOUS
CAL_ITERATE0
000000xx
CAL
PLL_LOCK_
LENGTH
CAL_ITERATE2
LOCK_INSTANT
0xE5
PLL_LOCK_
ACCURACY
CAL_COMPLETE
00000101
114
SWRS047
CAL_ITERATE1
Page 143 of 152
CC1010
Addr
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
Page
0xE6
PRESCALE
PRE_SWING1
PRE_SWING0
PRE_CURRENT1
PRE_CURRENT0
IF_INPUT
IF_FRONT
PRESCALE.1
PRESCALE.0
00000000
129
0xE7
0xE8
0xE9
0xEA
0xEB
0xEC
0xED
0xEE
0xEF
0xF0
0xF1
0xF2
0xF3
0xF4
0xF5
0xF6
0xF7
0xF8
0xF9
0xFA
0xFB
0xFC
RESERVED
EIE
FSDELAY
FSEP0
FSEP1
FSCTRL
RTCON
FREND
TESTMUX
B
FSHAPE7
FSHAPE6
FSHAPE5
FSHAPE4
FSHAPE3
FSHAPE2
FSHAPE1
EIP
TEST0
TEST1
TEST2
TEST3
RESERVED.7
FSDELAY7
FSEP7
RTEN
B.7
FSHAPE7.7
FSHAPE6.7
FSHAPE5.7
FSHAPE4.7
FSHAPE3.7
FSHAPE2.7
FSHAPE1.7
-
RESERVED.6
FSDELAY6
FSEP6
RT6
B.6
FSHAPE7.6
FSHAPE6.6
FSHAPE5.6
FSHAPE4.6
FSHAPE3.6
FSHAPE2.6
FSHAPE1.6
-
RESERVED.5
FSDELAY5
FSEP5
RT5
LNA_BUF_CUR
B.5
FSHAPE7.5
FSHAPE6.5
FSHAPE5.5
FSHAPE4.5
FSHAPE3.5
FSHAPE2.5
FSHAPE1.5
-
RESERVED.4
RTCIE
FSDELAY4
FSEP4
EXT_FILTER
RT4
LNA_CURRENT1
B.4
FSHAPE7.4
FSHAPE6.4
FSHAPE5.4
FSHAPE4.4
FSHAPE3.4
FSHAPE2.4
FSHAPE1.4
PRTC
CHP_CURRENT4
BREAK_LOOP
LOOPFILTER_
TP1
LOOPFILTER_
TP2
L2KIO0.5
CHP_DISABLE
CHP_OVERRIDE
L2KIO0.4
VCO_OVERRIDE
CHP_CO4
RESERVED.1
ET2
FSDELAY1
FSEP1
FSEP9
SHAPE
RT1
RSSI
TESTSEL1
B.1
FSHAPE7.1
FSHAPE6.1
FSHAPE5.1
FSHAPE4.1
FSHAPE3.1
FSHAPE2.1
FSHAPE1.1
PT2
VCO_ARRAY1
CAL_DAC1
CHP_CURRENT1
CAL_DAC_
OPEN1
L2KIO0.1
VCO_AO1
CHP_CO1
RESERVED.0
RFIE
FSDELAY0
FSEP0
FSEP8
FS_RESET_N
RT0
TESTSEL0
B.0
FSHAPE7.0
FSHAPE6.0
FSHAPE5.0
FSHAPE4.0
FSHAPE3.0
FSHAPE2.0
FSHAPE1.0
PRF
VCO_ARRAY0
CAL_DAC0
CHP_CURRENT0
CAL_DAC_
OPEN0
L2KIO0.0
VCO_AO0
CHP_CO0
45
29
129
109
109
130
65
119
130
23
129
129
129
129
129
129
129
31
115
115
115
115
TEST4
TEST5
TEST6
RESERVED.2
ADIE
FSDELAY2
FSEP2
FSEP10
DITHER0
RT2
IF_EXTERNAL
TESTSEL2
B.2
FSHAPE7.2
FSHAPE6.2
FSHAPE5.2
FSHAPE4.2
FSHAPE3.2
FSHAPE2.2
FSHAPE1.2
PAD
VCO_ARRAY2
CAL_DAC2
CHP_CURRENT2
CAL_DAC_
OPEN2
L2KIO0.2
VCO_AO2
CHP_CO2
00000000
11100000
00101111
01011001
00000000
00000001
00000000
00000000
00000000
00000000
00011100
00010110
00010000
00001010
00000110
00000011
00000001
11100000
0000xxxx
0000xxxx
000xxxxx
00000100
0xFD
0xFE
0xFF
RESERVED.3
ET3
FSDELAY3
FSEP3
DITHER1
RT3
LNA_CURRENT0
TESTSEL3
B.3
FSHAPE7.3
FSHAPE6.3
FSHAPE5.3
FSHAPE4.3
FSHAPE3.3
FSHAPE2.3
FSHAPE1.3
PT3
VCO_ARRAY3
CAL_DAC3
CHP_CURRENT3
CAL_DAC_
OPEN3
L2KIO0.3
VCO_AO3
CHP_CO3
00100101
00001000
00010000
115
115
114
Table 41. SFR Summary (sorted by address)
SWRS047
Page 144 of 152
CC1010
29. Alphabetic Register Index
ACC (0xE0) - Accumulator Register........................................................................................ 23
ADCON (0x93) - ADC Control Register................................................................................... 81
ADCON 2(0x96) - ADC Control Register 2 ............................................................................. 82
ADDATH (0x95) - ADC Data Register, High Bits .................................................................... 81
ADDATL (0x94) - ADC Data Register, Low Byte .................................................................... 81
ADTRH (0x97) - ADC Threshold Register............................................................................... 82
B (0xF0) - B Register............................................................................................................... 23
BSYNC (0xD4) - Byte Synchronisation Register................................................................... 102
CAL (0xE5) - PLL Calibration Control Register ..................................................................... 114
CHVER (0x9F) - Chip Version / Revision Register ................................................................. 46
CKCON (0x8E) - Timer Clock rate Control Register ............................................................... 55
CRPCNT (0xC6) – Encryption / Decryption Counter............................................................... 77
CRPCON (0xC3) - Encryption / Decryption Control Register ................................................. 77
CRPDAT (0xC5) - Encryption / Decryption Data Location Register........................................ 77
CRPINIn, n∈{0..7} (0xB4-0xB7, 0xBC-0xBF) - DES Initialisation Vector................................ 78
CRPKEY (0xC4) - Encryption / Decryption Key Location Register ......................................... 77
CURRENT (0xE1) - RF Current Control Register ................................................................. 118
DPH0 (0x83) - Data Pointer 0, high byte................................................................................. 21
DPH1 (0x85) - Data Pointer 1, high byte................................................................................. 21
DPL0 (0x82) - Data Pointer 0, low byte................................................................................... 21
DPL1 (0x84) - Data Pointer 1, low byte................................................................................... 21
DPS (0x86) - Data Pointer Select............................................................................................ 22
EICON (0xD8) - Extended Interrupt Control............................................................................ 30
EIE (0xE8) - Extended Interrupt Enable Register.................................................................... 29
EIP (0xF8) - Extended Interrupt Priority Register.................................................................... 32
EXIF (0x91) - Extended Interrupt Flag .................................................................................... 30
FLADR (0xAE) - Flash Write Address Register....................................................................... 43
FLCON (0xAF) - Flash Write Control Register ........................................................................ 43
FLTIM (0xDD) - Flash Write Timing Register .......................................................................... 43
FREND (0xEE) - Front End Control Register ........................................................................ 119
FREQ_0A (0xCA) – Frequency A, Control Register 0 .......................................................... 108
FREQ_0B (0xCD) - Frequency B, Control Register 0 ........................................................... 109
FREQ_1A (0xCB) – Frequency A, Control Register 1 .......................................................... 108
FREQ_1B (0xCE) - Frequency B, Control Register 1 ........................................................... 109
SWRS047
Page 145 of 152
CC1010
FREQ_2A (0xCC) – Frequency A, Control Register 2 .......................................................... 108
FREQ_2B (0xCF) - Frequency B, Control Register 2 ........................................................... 108
FSCTRL (0xEC) - Frequency Synthesiser Control Register ................................................. 130
FSDELAY (0xE9) - Frequency Shaping Delay Control Register........................................... 129
FSEP0 (0xEA) - Frequency Separation Control Register 0 .................................................. 109
FSEP1 (0xEB) - Frequency Separation Control Register 1 .................................................. 109
FSHAPEn (0xF1 - 0xF7), n∈1..7 - Frequency Shaping Register n....................................... 129
IE (0xA8) - Interrupt Enable Register ...................................................................................... 29
IP (0xB8) - Interrupt Priority Register ...................................................................................... 31
LOCK (0xE4) - PLL Lock Register......................................................................................... 110
MATCH (0xDC) - Match Capacitor Array Control Register ................................................... 120
MODEM0 (0xDB) - Modem Control Register 0 ....................................................................... 93
MODEM1 (0xDA) - Modem Control Register 1 ..................................................................... 100
MODEM2 (0xD9) - Modem Control Register 2...................................................................... 100
MPAGE (0x92) - Memory Page Select Register ..................................................................... 22
P0 (0x80) - Port 0 Data Register ............................................................................................. 49
P0DIR (0xA4) - Port 0 Direction Register................................................................................ 50
P1 (0x90) - Port 1 Data Register ............................................................................................. 49
P1DIR (0xA5) - Port 1 Direction Register................................................................................ 50
P2 (0xA0) - Port 2 Data Register............................................................................................. 50
P2DIR (0xA6) - Port 2 Direction Register................................................................................ 51
P3 (0xB0) - Port 3 Data Register............................................................................................. 50
P3DIR (0xA7) - Port 3 Direction Register................................................................................ 51
PA_POW (0xE2) - PA Output Power Control Register ......................................................... 125
PCON (0x87) - Power Control Register .................................................................................. 36
PDET (0xD3) - Preamble Detection Control Register ........................................................... 102
PLL (0xE3) - PLL Control Register ........................................................................................ 109
PRESCALER (0xE6) - Prescaler Control Register................................................................ 130
PSW (0xD0) - Program Status Word....................................................................................... 23
RADRH (0xBB) - Replacement address, high byte................................................................. 45
RADRL (0xBA) - Replacement address, low byte................................................................... 45
RANCON (0xC7) - Random Bit Generator Control Register................................................... 78
RDATA (0xB9) - Replacement Data........................................................................................ 45
RESERVED (0xE7) - Reserved register, used by Chipcon debugger software ..................... 45
RFBUF (0xC9) - RF Data Buffer.............................................................................................. 95
RFCON (0xC2) - RF Control Register ................................................................................... 101
SWRS047
Page 146 of 152
CC1010
RFMAIN (0xC8) - RF Main Control Register ........................................................................... 89
RTCON (0xED) - Realtime Clock Control Register ................................................................. 65
SBUF0 (0x99) - Serial Port 0, data buffer ............................................................................... 67
SBUF1 (0xC1) – Serial Port 1, data buffer .............................................................................. 67
SCON0 (0x98) - Serial Port 0 Control Register....................................................................... 67
SCON1 (0xC0) - Serial Port 1 Control Register ...................................................................... 68
SP (0x81) - Stack Pointer ........................................................................................................ 24
SPCR (0xA1) - SPI Control Register ....................................................................................... 72
SPDR (0xA2) - SPI Data Register ........................................................................................... 72
SPSR (0xA3) - SPI Status Register......................................................................................... 72
T2 (0xAC) - Timer 2 Low byte counter value........................................................................... 60
T2PRE (0xAA) - Timer 2 Prescaler Control............................................................................. 60
T3 (0xAD) - Timer 3 Low byte counter value........................................................................... 60
T3PRE (0xAB) - Timer 3 Prescaler Control............................................................................. 60
TCON (0x88) - Timer / Counter 0 and 1 control register ......................................................... 54
TCON2 (0xA9) - Timer Control register 2................................................................................ 59
TEST0 (0xF9) – PLL Test Register 0 .................................................................................... 115
TEST1 (0xFA) – PLL Test Register 1.................................................................................... 115
TEST2 (0xFB) – PLL Test Register 2.................................................................................... 115
TEST3 (0xFC) – PLL Test Register 3 ................................................................................... 115
TEST4 (0xFD) – PLL Test Register 4 ................................................................................... 115
TEST5 (0xFE) – PLL Test Register 5.................................................................................... 115
TEST6 (0xFF) – PLL Test Register 6 .................................................................................... 114
TESTMUX (0xEF) - Test Multiplexer Control Register (for prototype testing) ...................... 130
TH0 (0x8C) - Timer / Counter 0 High byte counter value........................................................ 52
TH1 (0x8D) - Timer / Counter 1 High byte counter value........................................................ 52
TL0 (0x8A) - Timer / Counter 0 Low byte counter value ......................................................... 52
TL1 (0x8B) - Timer / Counter 1 Low byte counter value ......................................................... 52
TMOD (0x89) - Timer / Counter 0 and 1 Mode register .......................................................... 53
WDT (0xD2) - Watchdog Timer Control Register.................................................................... 63
X32CON (0xD1) - 32.768 kHz Crystal Oscillator Control Register ......................................... 36
SWRS047
Page 147 of 152
CC1010
30. Ordering Information
Ordering part number
CC1010-STY1
CC1010-STR1
CC1010-RTY1
CC1010-RTR1
CC1010DK-433
CC1010DK-868
CC1010SK
CC1010SK RoHS
Description
CC1010, TQFP64 package, standard
leaded assembly, trays with 160 pcs
per tray
CC1010, TQFP64 package, standard
leaded assembly, T&R with 1500 pcs
per reel
CC1010, TQFP64 package, RoHS
compliant Pb-free assembly, trays with
160 pcs per tray
CC1010, TQFP64 package, RoHS
compliant Pb-free assembly, T&R with
1500 pcs per reel
CC1010 Development Kit, 433 MHz
CC1010 Development Kit, 868/915
MHz
CC1010 Sample Kit (5 pcs)
CC1010 Sample Kit (5 pcs) Pb-free
MOQ
160 (tray)
1500 (tape and reel)
160 (tray)
1500 (tape and reel)
1
1
1
1
MOQ = Minimum Order Quantity
SWRS047
Page 148 of 152
CC1010
31. General Information
31.1 Document History
Revision
Date
1.3
2004-12-17
Description/Changes
Added history table.
Various corrections and clarifications.
Preliminary status removed.
Added Smith charts for LNA input impedance and inactive PA input impedance.
Added sensitivity vs. data rate information.
Added information about power consumption of Schmitt-trigger input.
Added power consumption spec for main crystal oscillator.
Added chapter numbering.
Reorganized electrical specifications.
Ordering info updated.
Added current consumption for Power-on reset circuit.
Added recommended PCB footprint.
Added section about PA “splattering”.
Added specification for ADC input voltage.
Added specification for 32 kHz oscillator crystal load capacitance.
Added information about flash programming times.
Added RoHS Pb-free chip and sample kit ordering information.
SWRS047
Page 149 of 152
CC1010
31.2 Product Status Definitions
Data Sheet Identification
Product Status
Definition
Advance Information
Planned or Under
Development
This data sheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
Engineering Samples
and First Production
This data sheet contains preliminary data, and
supplementary data will be published at a later date.
Chipcon reserves the right to make changes at any
time without notice in order to improve design and
supply the best possible product.
No Identification Noted
Full Production
This data sheet contains the final specifications.
Chipcon reserves the right to make changes at any
time without notice in order to improve design and
supply the best possible product.
Obsolete
Not In Production
This data sheet contains specifications on a product
that has been discontinued by Chipcon. The data
sheet is printed for reference information only.
31.3 Disclaimer
Chipcon AS believes the information contained herein is correct and accurate at the time of this printing. However,
Chipcon AS reserves the right to make changes to this product without notice. Chipcon AS does not assume any
responsibility for the use of the described product.; neither does it convey any license under its patent rights, or the
rights of others. The latest updates are available at the Chipcon website or by contacting Chipcon directly.
As far as possible, major changes of product specifications and functionality, will be stated in product specific Errata
Notes published at the Chipcon website. Customers are encouraged to sign up to the Developers Newsletter for the
most recent updates on products and support tools.
When a product is discontinued this will be done according to Chipcon’s procedure for obsolete products as
described in Chipcon’s Quality Manual. This includes informing about last-time-buy options. The Quality Manual can
be downloaded from Chipcon’s website.
Compliance with regulations is dependent on complete system performance. It is the customer's responsibility to
ensure that the system complies with regulations.
This Chipcon product contains Flash memory code protection. However, Chipcon does not guarantee the security of
this protection. Chipcon customers using or selling these products with program code do so at their own risk and
agree to fully indemnify Chipcon AS for any damages resulting from the use or sale of such products.
Chipcon believes that the Flash memory protection used in this product is one of the most secure in the market today
when used in the intended manner and under normal conditions. However, there might be methods to breach the
code protection feature. Neither Chipcon nor any other semiconductor manufacturer can guarantee the security of
their code protection. Code protection does not mean that we are guaranteeing the product as “unbreakable”.
This Chipcon product contains hardware DES encryption. Chipcon does not guarantee the security of the key
protection or the security of the encryption scheme. Chipcon customers using or selling products with DES do so at
their own risk and agree to fully indemnify Chipcon AS for any damages resulting from the use or sale of such
products.
31.4 Trademarks
SmartRF® is a registered trademark of Chipcon AS. SmartRF® is Chipcon's RF technology platform with RF library
cells, modules and design expertise. Based on SmartRF® technology Chipcon develops standard component RF
circuits as well as full custom ASICs based on customer requirements and this technology.
All other trademarks, registered trademarks and product names are the sole property of their respective owners.
31.5 Life Support Policy
This Chipcon product is not designed for use in life support appliances, devices, or other systems where malfunction
can reasonably be expected to result in significant personal injury to the user, or as a critical component in any life
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support device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness. Chipcon AS customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Chipcon AS for any damages resulting
from any improper use or sale.
© 2003, 2004, Chipcon AS. All rights reserved.
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