NXP ADC1004S030 Single 10 bits adc, up to 30 mhz, 40 mhz or 50 mhz Datasheet

ADC1004S030/040/050
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
Rev. 03 — 7 August 2008
Product data sheet
1. General description
The ADC1004S030/040/050 are a family of 10-bit high-speed low-power Analog-to-Digital
Converters (ADC) for professional video and other applications. They convert the analog
input signal into 10-bit binary-coded digital signals at a maximum sampling rate of
50 MHz. All digital inputs and outputs are Transistor-Transistor Logic (TTL) and CMOS
compatible, although a low-level sine wave clock input signal is allowed.
The device requires an external source to drive its reference ladder. If the application
requires that the reference is driven via internal sources, NXP Semiconductors
recommends you use one of the ADC1003S030/040/050 family.
2. Features
n
n
n
n
n
n
n
n
n
n
n
n
n
n
10-bit resolution
Sampling rate up to 50 MHz
DC sampling allowed
One clock cycle conversion only
High signal-to-noise ratio over a large analog input frequency range
(9.4 effective bits at 4.43 MHz full-scale input at fclk = 40 MHz)
No missing codes guaranteed
In-Range (IR) CMOS output
TTL and CMOS levels compatible digital inputs
3 V to 5 V CMOS digital outputs
Low-level AC clock input signal allowed
External reference voltage regulator
Power dissipation only 175 mW (typical)
Low analog input capacitance, no buffer amplifier required
No sample-and-hold circuit required
3. Applications
n
n
n
n
n
n
n
Video data digitizing
Radar
Transient signal analysis
Σ∆ modulators
Medical imaging
Barcode scanner
Global Positioning System (GPS) receiver
ADC1004S030/040/050
NXP Semiconductors
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
n Cellular base stations
4. Quick reference data
Table 1.
Quick reference data
VCCA = V3 to V4 = 4.75 V to 5.25 V; VCCD = V11 to V12 and V28 to V27 = 4.75 V to 5.25 V;
VCCO = V13 to V14 = 3.0 V to 5.25 V; AGND and DGND shorted together; Tamb = 0 °C to +70 °C;
typical values measured at VCCA = VCCD = 5 V and VCCO = 3.3 V; Vi(a)(p-p) = 2.0 V;CL = 15 pF and
Tamb = 25 °C; unless otherwise specified.
Symbol
Parameter
VCCA
Min
Typ
Max
Unit
analog supply voltage
4.75
5.0
5.25
V
VCCD
digital supply voltage
4.75
5.0
5.25
V
VCCO
output supply voltage
3.0
3.3
5.25
V
ICCA
analog supply current
-
18
24
mA
ICCD
digital supply current
-
16
21
mA
ICCO
output supply current
fclk = 40 MHz;
ramp input
-
1
2
mA
INL
integral non-linearity
fclk = 40 MHz;
ramp input
-
±0.8
±2.0
LSB
DNL
differential non-linearity
fclk = 40 MHz;
ramp input
-
±0.5
±0.9
LSB
fclk(max)
maximum clock frequency ADC1004S030TS
30
-
-
MHz
ADC1004S040TS
40
-
-
MHz
ADC1004S050TS
50
-
-
MHz
fclk = 40 MHz;
ramp input
-
175
247
mW
Ptot
Conditions
total power dissipation
5. Ordering information
Table 2.
Ordering information
Type number
Package
Sampling
frequency
(MHz)
Name
Description
Version
ADC1004S030TS
SSOP28
plastic shrink small outline package; 28 leads;
body width 5.3 mm
SOT341-1 30
ADC1004S040TS
SSOP28
plastic shrink small outline package; 28 leads;
body width 5.3 mm
SOT341-1 40
ADC1004S050TS
SSOP28
plastic shrink small outline package; 28 leads;
body width 5.3 mm
SOT341-1 50
ADC1004S030_040_050_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 7 August 2008
2 of 19
ADC1004S030/040/050
NXP Semiconductors
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
6. Block diagram
VCCA
CLK
VCCD2
OE
3
1
11
10
2
CLOCK DRIVER
RT
TC
9
25 D9
MSB
24 D8
23 D7
22 D6
Rlad
21 D5
VI
8
RM
7
analog
voltage input
ANALOG - TO - DIGITAL
CONVERTER
CMOS
OUTPUTS
LATCHES
20 D4
data outputs
19 D3
18 D2
17 D1
16 D0
RB
13
6
ADC1004S030/040/050
CMOS OUTPUT
IN-RANGE LATCH
26
28
4
12
14
27
AGND
DGND2
OGND
DGND1
analog ground
Fig 1.
digital ground
output ground
digital ground
LSB
VCCO
IR
output
VCCD1
014aaa336
Block diagram
ADC1004S030_040_050_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 7 August 2008
3 of 19
ADC1004S030/040/050
NXP Semiconductors
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
7. Pinning information
7.1 Pinning
CLK
1
TC
2
28 VCCD1
27 DGND1
VCCA
3
26 IR
AGND
4
25 D9
n.c.
5
24 D8
RB
6
23 D7
RM
7
VI
8
RT
9
20 D4
OE 10
19 D3
VCCD2 11
18 D2
DGND2 12
17 D1
VCCO 13
16 D0
OGND 14
15 n.c.
ADC1004S
050TS
22 D6
21 D5
014aaa337
Fig 2.
Pin configuration
7.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
CLK
1
clock input
TC
2
two’s complement input (active LOW)
VCCA
3
analog supply voltage (5 V)
AGND
4
analog ground
n.c.
5
not connected
RB
6
reference voltage BOTTOM input
RM
7
reference voltage MIDDLE
VI
8
analog input voltage
RT
9
reference voltage TOP input
OE
10
output enable input (CMOS level input, active LOW)
VCCD2
11
digital supply voltage 2 (5 V)
DGND2
12
digital ground 2
VCCO
13
supply voltage for output stages (3 V to 5 V)
OGND
14
output ground
n.c.
15
not connected
D0
16
data output; bit 0 (Least Significant Bit (LSB))
D1
17
data output; bit 1
D2
18
data output; bit 2
D3
19
data output; bit 3
ADC1004S030_040_050_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 7 August 2008
4 of 19
ADC1004S030/040/050
NXP Semiconductors
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
Table 3.
Pin description …continued
Symbol
Pin
Description
D4
20
data output; bit 4
D5
21
data output; bit 5
D6
22
data output; bit 6
D7
23
data output; bit 7
D8
24
data output; bit 8
D9
25
data output; bit 9 (Most Significant Bit (MSB))
IR
26
in-range data output
DGND1
27
digital ground 1
VCCD1
28
digital supply voltage 1 (5 V)
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCCA
analog supply voltage
[1]
−0.3
+7.0
V
VCCD
digital supply voltage
[1]
−0.3
+7.0
V
VCCO
output supply voltage
[1]
−0.3
+7.0
V
∆VCC
supply voltage difference
VCCA − VCCD
−0.1
+1.0
V
VCCA − VCCO
−0.1
+4.0
V
VCCD − VCCO
−0.1
+4.0
V
VI
input voltage
referenced to
AGND
−0.3
+7.0
V
Vi(clk)(p-p)
peak-to-peak clock input
voltage
referenced to
DGND
-
VCCD
V
IO
output current
-
10
mA
Tstg
storage temperature
−55
+150
°C
Tamb
ambient temperature
−40
+85
°C
Tj
junction temperature
-
150
°C
[1]
The supply voltages VCCA, VCCD and VCCO may have any value between −0.3 V and +7.0 V provided that
the supply voltage differences ∆VCC are respected.
9. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction
to ambient
in free air
110
K/W
ADC1004S030_040_050_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 7 August 2008
5 of 19
ADC1004S030/040/050
NXP Semiconductors
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
10. Characteristics
Table 6.
Characteristics
VCCA = V3 to V4 = 4.75 V to 5.25 V; VCCD = V11 to V12 and V28 to V27 = 4.75 V to 5.25 V;
VCCO = V13 to V14 = 3.0 V to 5.25 V; AGND and DGND shorted together; Tamb = 0 °C to +70 °C; typical values measured at
VCCA = VCCD = 5 V and VCCO = 3.3 V; CL = 15 pF and Tamb = 25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply
VCCA
analog supply voltage
4.75
5.0
5.25
V
VCCD
digital supply voltage
4.75
5.0
5.25
V
VCCO
output supply voltage
∆VCC
supply voltage difference
3.0
3.3
5.25
V
VCCA − VCCD
−0.20
-
+0.20
V
VCCA − VCCO
−0.20
-
+2.25
V
VCCD − VCCO
−0.20
-
+2.25
V
ICCA
analog supply current
-
18
24
mA
ICCD
digital supply current
-
16
21
mA
ICCO
output supply current
fclk = 40 MHz;
ramp input
-
1
2
mA
Ptot
total power dissipation
fclk = 40 MHz;
ramp input
-
175
247
mW
Inputs
Clock input CLK (referenced to DGND)[1]
VIL
LOW-level input voltage
0
-
0.8
V
VIH
HIGH-level input voltage
2
-
VCCD
V
IIL
LOW-level input current
Vclk = 0.8 V
−1
-
+1
µA
IIH
HIGH-level input current
Vclk = 2 V
-
2
10
µA
Zi
input impedance
fclk = 40 MHz
-
2
-
kΩ
Ci
input capacitance
-
2
-
pF
0
-
0.8
V
Inputs OE and TC (referenced to DGND); see Table 8
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
2
-
VCCD
V
IIL
LOW-level input current
VIL = 0.8 V
−1
-
-
µA
IIH
HIGH-level input current
VIH = 2 V
-
-
1
µA
VI (analog input voltage referenced to AGND)
IIL
LOW-level input current
VI = VRB = 1.3 V
-
0
-
µA
IIH
HIGH-level input current
VI = VRT = 3.67 V
-
35
-
µA
Zi
input impedance
fi = 4.43 MHz
-
8
-
kΩ
Ci
input capacitance
-
5
-
pF
Reference voltages for the resistor ladder; see Table 7
VRB
voltage on pin RB
1.2
1.3
2.45
V
VRT
voltage on pin RT
3.2
3.67
VCCA − 0.8
V
Vref(dif)
differential reference
voltage
VRT − VRB
2.0
2.37
3.0
V
Iref
reference current
VRT − VRB = 2.37
-
9.7
-
mA
ADC1004S030_040_050_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 7 August 2008
6 of 19
ADC1004S030/040/050
NXP Semiconductors
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
Table 6.
Characteristics …continued
VCCA = V3 to V4 = 4.75 V to 5.25 V; VCCD = V11 to V12 and V28 to V27 = 4.75 V to 5.25 V;
VCCO = V13 to V14 = 3.0 V to 5.25 V; AGND and DGND shorted together; Tamb = 0 °C to +70 °C; typical values measured at
VCCA = VCCD = 5 V and VCCO = 3.3 V; CL = 15 pF and Tamb = 25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rlad
ladder resistance
-
245
-
Ω
TCRlad
ladder resistor temperature
coefficient
-
456
-
mΩ/K
Voffset
offset voltage
Vi(a)(p-p)
BOTTOM;
VRT − VRB = 2.37
[2]
-
175
-
mV
TOP;
VRT − VRB = 2.37
[2]
-
175
-
mV
[3]
1.7
2.02
2.55
V
peak-to-peak analog input
voltage
Digital outputs D9 to D0 and IR (referenced to OGND)
VOL
LOW-level output voltage
IOL = 1 mA
0
-
0.5
V
VOH
HIGH-level output voltage
IOH = −1 mA
VCCO − 0.5
-
VCCO
V
IO
output current
in 3-state mode;
0.5 V < VO < VCCO
−20
-
+20
µA
ADC1004S030TS
30
-
-
MHz
ADC1004S040TS
40
-
-
MHz
ADC1004S050TS
50
-
-
MHz
Switching characteristics; Clock input CLK; see Figure 4[1]
fclk(max)
maximum clock frequency
tw(clk)H
HIGH clock pulse width
full effective
bandwidth
8.5
-
-
ns
tw(clk)L
LOW clock pulse width
full effective
bandwidth
5.5
-
-
ns
Analog signal processing
Linearity
INL
integral non-linearity
fclk = 40 MHz;
ramp input
-
±0.8
±2.0
LSB
DNL
differential non-linearity
fclk = 40 MHz;
ramp input
-
±0.5
±0.9
LSB
Eoffset
offset error
middle code;
VRB = 1.3 V;
VRT = 3.67 V
-
±1
-
LSB
EG
gain error
from device to device;
VRB = 1.3 V;
VRT = 3.67 V
[4]
-
±0.1
-
%
full-scale sine wave
[5]
-
15
-
MHz
75 % full-scale sine
wave
-
20
-
MHz
small signal at
mid-scale;
VI = ±10 LSB at code
512
-
350
-
MHz
Bandwidth (fclk = 40 MHz)
B
bandwidth
ADC1004S030_040_050_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 7 August 2008
7 of 19
ADC1004S030/040/050
NXP Semiconductors
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
Table 6.
Characteristics …continued
VCCA = V3 to V4 = 4.75 V to 5.25 V; VCCD = V11 to V12 and V28 to V27 = 4.75 V to 5.25 V;
VCCO = V13 to V14 = 3.0 V to 5.25 V; AGND and DGND shorted together; Tamb = 0 °C to +70 °C; typical values measured at
VCCA = VCCD = 5 V and VCCO = 3.3 V; CL = 15 pF and Tamb = 25 °C; unless otherwise specified.
Symbol
Parameter
ts(LH)
LOW to HIGH settling time
ts(HL)
HIGH to LOW settling time
Conditions
full-scale square
wave; see Figure 6
[6]
Min
Typ
Max
Unit
-
1.5
3.0
ns
-
1.5
3.0
ns
Harmonics (fclk = 40 MHz); see Figure 7 and 8
α1H
first harmonic level
fi = 4.43 MHz
-
-
0
dB
α2H
second harmonic level
fi = 4.43 MHz
-
−75
−65
dB
α3H
third harmonic level
fi = 4.43 MHz
-
−72
−65
dB
THD
total harmonic distortion
fi = 4.43 MHz
-
−64
-
dB
55
58
-
dB
fi = 4.43 MHz
-
9.4
-
bit
fi = 7.5 MHz
-
9.1
-
bit
fi = 4.43 MHz
-
9.4
-
bit
fi = 7.5 MHz
-
9.0
-
bit
fi = 10 MHz
-
8.9
-
bit
fi = 15 MHz
-
8.1
-
bit
fi = 4.43 MHz
-
9.3
-
bit
fi = 7.5 MHz
-
8.9
-
bit
fi = 10 MHz
-
8.8
-
bit
fi = 15 MHz
-
8.0
-
bit
fclk = 40 MHz
-
−69
-
dB
fclk = 40 MHz;
fi = 4.43 MHz;
VI = ±16 LSB at code
512
-
10−13
-
times/samples
fclk = 40 MHz;
PAL modulated ramp
-
0.8
-
%
Signal-to-noise ratio; see Figure 7 and
S/N
signal-to-noise ratio
8[7]
full scale;
without harmonics;
fclk = 40 MHz;
fi = 4.43 MHz
Effective bits; see Figure 7 and 8[7]
ENOB
effective number of bits
ADC1004S030TS;
fclk = 30 MHz
ADC1004S040TS;
fclk = 40 MHz
ADC1004S050TS;
fclk = 50 MHz
Two-tone intermodulation[8]
αIM
intermodulation
suppression
Bit error rate
BER
bit error rate
Differential gain[9]
Gdif
differential gain
ADC1004S030_040_050_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 7 August 2008
8 of 19
ADC1004S030/040/050
NXP Semiconductors
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
Table 6.
Characteristics …continued
VCCA = V3 to V4 = 4.75 V to 5.25 V; VCCD = V11 to V12 and V28 to V27 = 4.75 V to 5.25 V;
VCCO = V13 to V14 = 3.0 V to 5.25 V; AGND and DGND shorted together; Tamb = 0 °C to +70 °C; typical values measured at
VCCA = VCCD = 5 V and VCCO = 3.3 V; CL = 15 pF and Tamb = 25 °C; unless otherwise specified.
Symbol
Parameter
Differential phase
ϕdif
Conditions
Min
Typ
Max
Unit
fclk = 40 MHz;
PAL-modulated ramp
-
0.4
-
deg
[9]
differential phase
Timing (fclk = 40 MHz; CL = 15 pF); see Figure 4[10]
td(s)
sampling delay time
-
3
-
ns
th(o)
output hold time
4
-
-
ns
td(o)
output delay time
VCCO = 4.75 V
-
10
13
ns
VCCO = 3.15 V
-
12
15
ns
-
-
15
pF
CL
load capacitance
3-state output delay times; see Figure 5
tdZH
float to active HIGH delay
time
-
5.5
8.5
ns
tdZL
float to active LOW delay
time
-
12
15
ns
tdHZ
active HIGH to float delay
time
-
19
24
ns
tdLZ
active LOW to float delay
time
-
12
15
ns
[1]
In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock must not be less
than 0.5 ns.
[2]
Analog input voltages producing code 0 up to and including code 1023:
a) Voffset BOTTOM is the difference between the analog input which produces data equal to 00 and the reference voltage on pin RB
(VRB) at Tamb = 25 °C.
b) Voffset TOP is the difference between the reference voltage on pin RT (VRT) and the analog input which produces data outputs equal
to code 1023 at Tamb = 25 °C.
[3]
In order to ensure the optimum linearity performance of such converter architecture the lower and upper extremities of the converter
reference resistor ladder (corresponding to output codes 0 and 1023 respectively) are connected to pins RB and RT via offset resistors
ROB and ROT as shown in Figure 3.
V RT – V RB
R OB + R L + R OT
a) The current flowing into the resistor ladder is I = ---------------------------------------- and the full-scale input range at the converter, to cover code 0
RL
to 1023 is V I = R L × I L = ---------------------------------------- × ( V RT + V RB ) = 0.852 × ( V RT – V RB )
R OB + R L + R OT
RL
---------------------------------------b) Since RL, ROB and ROT have similar behavior with respect to process and temperature variation, the ratio R OB + R L + R OT
will be kept reasonably constant from device to device. Consequently, the variation of the output codes at a given input voltage
depends mainly on the difference VRT − VRB and its variation with temperature and supply voltage. When several ADCs are
connected in parallel and fed with the same reference source, the matching between each of them is optimized.
[4]
( V 1023 – V 0 ) – V i ( p – p )
E G = --------------------------------------------------------- × 100
V i( p – p)
[5]
The analog bandwidth is defined as the maximum input sine wave frequency which can be applied to the device. No glitches greater
than 2 LSB, neither any significant attenuation are observed in the reconstructed signal.
[6]
The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale input (square
wave signal) in order to sample the signal and obtain correct output data.
ADC1004S030_040_050_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 7 August 2008
9 of 19
ADC1004S030/040/050
NXP Semiconductors
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
[7]
Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8000 acquisition points per equivalent fundamental
period. The calculation takes into account all harmonics and noise up to half of the clock frequency (Nyquist frequency). Conversion to
signal-to-noise ratio: SINAD = ENOB × 6.02 + 1.76 dB.
[8]
Intermodulation measured relative to either tone with analog input frequencies of 4.43 MHz and 4.53 MHz. The two input signals have
the same amplitude and the total amplitude of both signals provides full-scale to the converter.
[9]
Measurement carried out using video analyzer VM700A, where the video analog signal is reconstructed through a digital-to-analog
converter.
[10] Output data acquisition: the output data is available after the maximum delay time of td(max). For 50 MHz version NXP Semicocnductors
recommends the lowest possible output load.
RT
ROT
code 1023
RL
RL
RM
IL
RL
Rlad
RL
code 0
ROB
RB
014aaa325
Fig 3.
Explanation of Table 6, Table note 3
11. Additional information relating to Table 6
Table 7.
Output coding and input voltage (typical values; referenced to AGND, VRB = 1.3 V,
VRT = 3.67 V)
Code
Vi(a)(p-p)
(V)
IR
Binary outputs D9 to D0
Two’s complement
outputs D9 to D0
Underflow
< 1.475
0
00 0000 0000
10 0000 0000
0
1.475
1
00 0000 0000
10 0000 0000
1
-
1
00 0000 0001
10 0000 0001
↓
-
↓
↓
↓
1022
-
1
11 1111 1110
01 1111 1110
1023
3.495
1
11 1111 1111
01 1111 1111
Overflow
> 3.495
0
11 1111 1111
01 1111 1111
ADC1004S030_040_050_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 7 August 2008
10 of 19
ADC1004S030/040/050
NXP Semiconductors
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
Table 8.
Mode selection
TC
OE
D9 to D0
IR
X
1
high impedance
high impedance
0
0
active; two’s complement
active
1
0
active; binary
active
sample N + 1
sample N
sample N + 2
tw(clk)L
tw(clk)H
VCCO
CLK
50%
0V
sample N
sample N + 1
sample N + 2
VI
td(s)
th(o)
VCCO
DATA
D0 to D9
DATA
N−2
DATA
N−1
DATA
N
DATA
N+1
50%
0V
td(o)
Fig 4.
Timing diagram
ADC1004S030_040_050_3
Product data sheet
014aaa326
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 7 August 2008
11 of 19
ADC1004S030/040/050
NXP Semiconductors
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
VCCD
50%
OE
tdHZ
tdZH
HIGH
90%
output
data
50%
LOW
tdZL
tdLZ
HIGH
output
data
50%
LOW
10%
VCCD
TEST
S1
tdLZ
VCCD
tdZL
VCCD
tdHZ
DGND
tdZH
DGND
3.3 kΩ
ADC1004S050
S1
15 pF
OE
014aaa335
frequency on pin OE = 100 kHz
Fig 5.
Timing diagram and test conditions of 3-state output delay time
ts(LH)
ts(HL)
code 1023
VI
50%
50%
code 0
2 ns
CLK
2 ns
50%
50%
0.5 ns
0.5 ns
014aaa327
Fig 6.
Analog input settling time diagram
ADC1004S030_040_050_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 7 August 2008
12 of 19
ADC1004S030/040/050
NXP Semiconductors
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
014aaa328
+20
amplitude
(dB)
−20
−60
−100
−140
0
5.00
10.0
15.0
20.0
f (MHz)
Effective bits: 9.42; THD = −71.8 dB.
Harmonic levels (dB): 2nd = −83.19; 3rd = −78.09; 4th = −78.72; 5th = −78.33; 6th = −77.55.
Fig 7.
Typical fast Fourier transform (fclk = 40 MHz; fi = 4.43 MHz)
014aaa329
+20
amplitude
(dB)
−20
−60
−100
−140
0
5.0
10.0
15.0
20.0
25.0
f (MHz)
Effective bits: 8.91; THD = −62.96 dB.
Harmonic levels (dB): 2nd = −71.38; 3rd = −71.54; 4th = −74.14; 5th = −65.15; 6th = −77.16.
Fig 8.
Typical fast Fourier transform (fclk = 50 MHz; fi = 10 MHz)
ADC1004S030_040_050_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 7 August 2008
13 of 19
ADC1004S030/040/050
NXP Semiconductors
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
VCCA
VCCO
D9 to D0
IR
VI
OGND
AGND
014aaa332
014aaa330
Fig 9. CMOS data and in-range outputs
Fig 10. Analog inputs
VCCA
VCCO
RT
RL
RL
RM
OE
TC
RL
RL
RB
OGND
AGND
014aaa323
Fig 11. OE and TC input
014aaa331
Fig 12. RB, RM and RT
VCCD
CLK
1.5 V
DGND
014aaa324
Fig 13. CLK input
ADC1004S030_040_050_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 7 August 2008
14 of 19
ADC1004S030/040/050
NXP Semiconductors
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
12. Application information
CLK
TC
VCCA
(3)
100 nF
AGND
n.c.
RB(1)
RM(1)
100 nF
100 nF
AGND
VI
RT(1)
AGND
OE
100 nF
VCCD2
AGND
(3)
100 nF DGND2
VCCO
(3)
100 nF
OGND
1
28
2
27
3
26
4
25
5
24
6
23
7
ADC1004S050
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
VCCD1
DGND1
(3)
100 nF
IR
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
n.c.(2)
014aaa338
The analog and digital supplies should be separated and well decoupled
A user manual is available that describes the demonstration board that uses the version ADC1004S030/040/050 family with an
application environment.
(1) RB, RM and RT are decoupled to AGND.
(2) Pin 15 may be connected to DGND in order to prevent noise influence.
(3) Decoupling capacitor for supplies; must be placed close to the device.
Fig 14. Application diagram
12.1 Alternative parts
The following alternative parts are also available:
Table 9.
Alternative parts
Type number
Description
Sampling frequency
ADC1003S030
Single 10 bits ADC, with
voltage regulator[1]
30 MHz
ADC1003S040
Single 10 bits ADC, with
voltage regulator[1]
40 MHz
ADC1003S050
Single 10 bits ADC, with
voltage regulator[1]
50 MHz
ADC1005S060
Single 10 bits ADC[1]
60 MHz
ADC0804S030
Single 8 bits ADC[1]
30 MHz
ADC0804S040
Single 8 bits
ADC[1]
40 MHz
Single 8 bits
ADC[1]
50 MHz
ADC0804S050
[1]
Pin to pin compatible
ADC1004S030_040_050_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 7 August 2008
15 of 19
ADC1004S030/040/050
NXP Semiconductors
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
13. Package outline
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm
D
SOT341-1
E
A
X
c
HE
y
v M A
Z
28
15
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
14
w M
bp
e
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
10.4
10.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
1.1
0.7
8
o
0
o
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
OUTLINE
VERSION
SOT341-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
MO-150
Fig 15. Package outline SOT341-1 (SSOP28)
ADC1004S030_040_050_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 7 August 2008
16 of 19
ADC1004S030/040/050
NXP Semiconductors
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
14. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
ADC1004S030_040_050_3
20080807
Product data sheet
-
ADC1004S030_040_050_2
Modifications:
•
•
•
Corrections made to the table description in Table 1.
Corrections made to several entries in Table 6.
Corrections made to Figure 12.
ADC1004S030_040_050_2
20080616
Product data sheet
-
ADC1004S030_040_050_1
ADC1004S030_040_050_1
20080611
Product data sheet
-
-
ADC1004S030_040_050_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 7 August 2008
17 of 19
ADC1004S030/040/050
NXP Semiconductors
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
15.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
ADC1004S030_040_050_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 7 August 2008
18 of 19
NXP Semiconductors
ADC1004S030/040/050
Single 10 bits ADC, up to 30 MHz, 40 MHz or 50 MHz
17. Contents
1
2
3
4
5
6
7
7.1
7.2
8
9
10
11
12
12.1
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Additional information relating to Table 6 . . . 10
Application information. . . . . . . . . . . . . . . . . . 15
Alternative parts . . . . . . . . . . . . . . . . . . . . . . . 15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 7 August 2008
Document identifier: ADC1004S030_040_050_3
Similar pages