Material Content Data Sheet Sales Product Name BSC120N03MS G MA# MA001321272 Package PG-TDSON-8-14 Issued 5. February 2015 Weight* 118.49 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal non noble metal inorganic material non noble metal < 10% silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver silver tin lead phosphorus zinc iron copper iron phosphorus copper 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7439-89-6 7723-14-0 7440-50-8 0.614 0.52 0.010 0.01 0.039 0.03 328 0.778 0.66 6566 31.590 26.66 27.36 266615 273591 0.054 0.05 0.05 455 455 0.242 0.20 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.52 5180 5180 82 2043 7.504 6.33 40.665 34.33 40.86 343208 408581 1.243 1.05 1.05 10487 10487 0.037 0.03 0.03 316 316 0.024 0.02 0.020 0.02 0.932 0.79 0.005 0.00 0.021 0.02 180 0.428 0.36 3608 17.360 14.65 0.017 0.01 0.005 0.00 16.898 14.26 63330 206 165 0.83 7865 15.03 146515 2. 3. 43 14.27 142620 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 150348 143 Important Remarks: 1. 8236 45 142806 1000000