M40Z300 M40Z300W 5V or 3V NVRAM Supervisor for Up to 8 LPSRAMs FEATURES SUMMARY ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ CONVERTS LOW POWER SRAM INTO NVRAMs PRECISION POWER MONITORING AND POWER SWITCHING CIRCUITRY AUTOMATIC WRITE-PROTECTION WHEN VCC IS OUT-OF-TOLERANCE TWO-INPUT DECODER ALLOWS CONTROL FOR UP TO 8 SRAMs (with 2 devices active in parallel) CHOICE OF SUPPLY VOLTAGES AND POWER-FAIL DESELECT VOLTAGES: – M40Z300: VCC = 4.5V to 5.5V THS = VSS: 4.5V ≤ VPFD ≤ 4.75V THS = VOUT: 4.2V ≤ VPFD ≤ 4.5V – M40Z300W: VCC = 3.0V to 3.6V THS = VSS: 2.8V ≤ VPFD ≤ 3.0V VCC = 2.7V to 3.3V THS = VOUT: 2.5 ≤ VPFD ≤ 2.7V RESET OUTPUT (RST) FOR POWER ON RESET BATTERY LOW PIN (BL) LESS THAN 12ns CHIP ENABLE ACCESS PROPAGATION DELAY (for 5.0V device) PACKAGING INCLUDES A 28-LEAD SOIC AND SNAPHAT® TOP (to be ordered separately), OR A 16-LEAD SOIC SOIC PACKAGE PROVIDES DIRECT CONNECTION FOR A SNAPHAT TOP WHICH CONTAINS THE BATTERY February 2005 Figure 1. 16-pin SOIC Package 16 1 SO16 (MQ) Figure 2. 28-pin SOIC Package SNAPHAT (SH) Crystal/Battery 28 1 SOH28 (MH) 1/21 M40Z300, M40Z300W TABLE OF CONTENTS FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 1. 16-pin SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 2. 28-pin SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Figure 3. Table 1. Figure 4. Figure 5. Figure 6. Figure 7. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28-pin SOIC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . M40Z300 16-pin SOIC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . M40Z300W 16-pin SOIC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware Hookup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .....4 .....4 .....5 .....5 .....5 .....6 OPERATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Two to Four Decode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 2. Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 8. Address-Decode Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Data Retention Lifetime Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Power-on Reset Output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Battery Low Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 VCC Noise And Negative Going Transients. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 9. Supply Voltage Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 3. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 4. DC and AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 10.AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 5. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 6. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 11.Power Down Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 12.Power Up Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Table 7. Power Down/Up Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 PACKAGE MECHANICAL INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 13.SOH28 – 28-lead Plastic Small Outline, 4-socket battery SNAPHAT, Package Outline. 15 Table 8. SOH28 – 28-lead Plastic Small Outline, battery SNAPHAT, Package Mechanical Data 15 Figure 14.SH – 4-pin SNAPHAT Housing for 48mAh Battery, Package Outline . . . . . . . . . . . . . . . 16 Table 9. SH – 4-pin SNAPHAT Housing for 48mAh Battery, Package Mechanical Data . . . . . . . 16 Figure 15.SH – 4-pin SNAPHAT Housing for 120mAh Battery, Package Outline . . . . . . . . . . . . . . 17 Table 10. SH – 4-pin SNAPHAT Housing for 120mAh Battery, Package Mechanical Data . . . . . . 17 Figure 16.SO16 – 16-lead Plastic Small Outline, 150 mils body width, Package Outline . . . . . . . . 18 Table 11. SO16 – 16-lead Plastic Small Outline, 150 mils body width, Package Mechanical Data 18 2/21 M40Z300, M40Z300W PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 12. Ordering Information Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 13. SNAPHAT® Battery Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 14. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3/21 M40Z300, M40Z300W DESCRIPTION The M40Z300/W NVRAM SUPERVISOR is a selfcontained device which converts a standard lowpower SRAM into a non-volatile memory. A precision voltage reference and comparator monitors the VCC input for an out-of-tolerance condition. When an invalid VCC condition occurs, the conditioned chip enable outputs (E1CON to E4CON) are forced inactive to write-protect the stored data in the SRAM. During a power failure, the SRAM is switched from the VCC pin to the lithium cell within the SNAPHAT® to provide the energy required for data retention. On a subsequent power-up, the SRAM remains write protected until a valid power condition returns. The 28-pin, 330mil SOIC provides sockets with gold plated contacts for direct connection to a separate SNAPHAT housing containing the battery. The SNAPHAT housing has gold plated pins which mate with the sockets, ensuring reliable connection. The housing is keyed to prevent improper insertion. This unique design allows the SNAPHAT battery package to be mounted on top of the SOIC package after the completion of the surface mount process which greatly reduces the board manufacturing process complexity of either directly soldering or inserting a battery into a soldered holder. Providing non-volatility becomes a “SNAP.” The 16-pin SOIC provides battery pins for an external user-supplied battery. Insertion of the SNAPHAT housing after reflow prevents potential battery damage due to the high temperatures required for device surface-mounting. The SNAPHAT housing is also keyed to prevent reverse insertion. The 28-pin SOIC and battery packages are shipped separately in plastic anti-static tubes or in Tape & Reel form. For the 28-lead SOIC, the battery/crystal package (e.g., SNAPHAT) part number is “M4ZXX-BR00SH” (see Table 13., page 19). Caution: Do not place the SNAPHAT battery top in conductive foam, as this will drain the lithium button-cell battery. Figure 3. Logic Diagram Table 1. Signal Names THS Threshold Select Input E Chip Enable Input VOUT E1CON - E4CON Conditioned Chip Enable Output E BL A, B Decoder Inputs B E1CON RST Reset Output (Open Drain) E2CON BL Battery Low Output (Open Drain) E3CON VOUT Supply Voltage Output E4CON VCC Supply Voltage RST VSS Ground B+ Positive Battery Pin B– Negative Battery Pin NC Not Connected Internally VCC B +(1) THS A M40Z300 M40Z300W VSS B –(1) AI02242 Note: 1. For 16-pin SOIC package only. 4/21 Note: For M40Z300W, B– must be connected to the negative battery terminal only (not to Pin 8, VSS). M40Z300, M40Z300W Figure 4. 28-pin SOIC Connections VOUT NC NC RST NC A NC B NC BL NC NC THS VSS 28 1 2 27 3 26 4 25 5 24 6 23 7 M40Z300 22 8 M40Z300W 21 9 20 10 19 11 18 12 17 13 16 14 15 Figure 6. M40Z300W 16-pin SOIC Connections VCC E NC NC NC E1CON E2CON NC E3CON NC NC NC E4CON NC VOUT NC RST A B BL THS VSS 16 1 2 15 3 14 4 13 M40Z300W 5 12 6 11 7 10 8 9 VCC B– E E1CON E2CON E3CON E4CON B+ AI06350 AI02243 Figure 5. M40Z300 16-pin SOIC Connections VOUT NC RST A B BL THS VSS 1 2 3 4 5 6 7 8 16 15 14 13 M40Z300 12 11 10 9 Note: For M40Z300W, B– must be connected to the negative battery terminal only (not to Pin 8, VSS). VCC B+ E E1CON E2CON E3CON E4CON B– AI03624 5/21 M40Z300, M40Z300W Figure 7. Hardware Hookup 3.0V, 3.3V or 5V VCC VOUT 0.1µF VCC VCC VCC VCC E2(1) E2(1) E2(1) E2(1) CMOS SRAM M40Z300 M40Z300W 0.1µF CMOS SRAM 0.1µF E A B E Threshold CMOS SRAM 0.1µF E CMOS SRAM 0.1µF E E E1CON E2CON E3CON E4CON THS RST VSS BL To Microprocessor To Battery Monitor Circuit AI02395 Note: 1. If the second chip enable pin (E2) is unused, it should be tied to VOUT. 6/21 M40Z300, M40Z300W OPERATION E1CON to E4CON are unconditionally driven high, write protecting the SRAM. A power failure during a WRITE cycle may corrupt data at the currently addressed location, but does not jeopardize the rest of the SRAM's contents. At voltages below VPFD (min), the user can be assured the memory will be write protected within the Write Protect Time (tWPT) provided the VCC fall time exceeds tF (see Figure 8., page 8). As VCC continues to degrade, the internal switch disconnects VCC and connects the internal battery to VOUT. This occurs at the switchover voltage (VSO). Below the VSO, the battery provides a voltage VOHB to the SRAM and can supply current IOUT2 (see Table 6., page 12). When VCC rises above VSO, VOUT is switched back to the supply voltage. Outputs E1CON to E4CON are held inactive for tCER (120ms maximum) after the power supply has reached VPFD, independent of the E input, to allow for processor stabilization (see Figure 12., page 13). The M40Z300/W, as shown in Figure 7., page 6, can control up to four (eight, if placed in parallel) standard low-power SRAMs. These SRAMs must be configured to have the chip enable input disable all other input signals. Most slow, low-power SRAMs are configured like this, however many fast SRAMs are not. During normal operating conditions, the conditioned chip enable (E1CON to E4CON) output pins follow the chip enable (E) input pin with timing shown in Figure 8., page 8 and Table 7., page 14. An internal switch connects VCC to VOUT. This switch has a voltage drop of less than 0.3V (IOUT1). When VCC degrades during a power failure, E1CON to E4CON are forced inactive independent of E. In this situation, the SRAM is unconditionally write protected as VCC falls below an out-of-tolerance threshold (VPFD). For the M40Z300 the power fail detection value associated with VPFD is selected by the Threshold Select (THS) pin and is shown in Table 6., page 12. For the M40Z300W, the THS pin selects both the supply voltage and VPFD (also shown in Table 6., page 12). Note: In either case, THS pin must be connected to either VSS or VOUT. If chip enable access is in progress during a power fail detection, that memory cycle continues to completion before the memory is write protected. If the memory cycle is not terminated within time tWPT, Two to Four Decode The M40Z300/W includes a 2 input (A, B) decoder which allows the control of up to 4 independent SRAMs. The Truth Table for these inputs is shown in Table 2. Table 2. Truth Table Inputs Outputs E B A E1CON E2CON E3CON E4CON H X X H H H H L L L L H H H L L H H L H H L H L H H L H L H H H H H L 7/21 M40Z300, M40Z300W Figure 8. Address-Decode Time A, B tAS E tEDL tEDH E1CON - E4CON AI02551 Note: During system design, compliance with the SRAM timing parameters must comprehend the propagation delay between E1CON E4CON. Data Retention Lifetime Calculation Power-on Reset Output Most low power SRAMs on the market today can be used with the M40Z300/W NVRAM SUPERVISOR. There are, however some criteria which should be used in making the final choice of which SRAM to use. The SRAM must be designed in a way where the chip enable input disables all other inputs to the SRAM. This allows inputs to the M40Z300/W and SRAMs to be “Don't Care” once VCC falls below VPFD(min). The SRAM should also guarantee data retention down to VCC = 2.0V. The chip enable access time must be sufficient to meet the system needs with the chip enable propagation delays included. If the SRAM includes a second chip enable pin (E2), this pin should be tied to VOUT. If data retention lifetime is a critical parameter for the system, it is important to review the data retention current specifications for the particular SRAMs being evaluated. Most SRAMs specify a data retention current at 3.0V. Manufacturers generally specify a typical condition for room temperature along with a worst case condition (generally at elevated temperatures). The system level requirements will determine the choice of which value to use. The data retention current value of the SRAMs can then be added to the IBAT value of the M40Z300/ W to determine the total current requirements for data retention. The available battery capacity for the SNAPHAT® of your choice can then be divided by this current to determine the amount of data retention available (see Table 13., page 19). CAUTION: Take care to avoid inadvertent discharge through VOUT and E1CON - E4CON after battery has been attached. For a further more detailed review of lifetime calculations, please see Application Note AN1012. All microprocessors have a reset input which forces them to a known state when starting. The M40Z300/W has a reset output (RST) pin which is guaranteed to be low within tWPT of VPFD (see 7). This signal is an open drain configuration. An appropriate pull-up resistor should be chosen to control the rise time. This signal will be valid for all voltage conditions, even when VCC equals VSS. Once VCC exceeds the power failure detect voltage VPFD, an internal timer keeps RST low for tREC to allow the power supply to stabilize. 8/21 Battery Low Pin The M40Z300/W automatically performs battery voltage monitoring upon power-up, and at factoryprogrammed time intervals of at least 24 hours. The Battery Low (BL) pin will be asserted if the battery voltage is found to be less than approximately 2.5V. The BL pin will remain asserted until completion of battery replacement and subsequent battery low monitoring tests, either during the next power-up sequence or the next scheduled 24-hour interval. If a battery low is generated during a power-up sequence, this indicates that the battery is below 2.5V and may not be able to maintain data integrity in the SRAM. Data should be considered suspect, and verified as correct. A fresh battery should be installed. If a battery low indication is generated during the 24-hour interval check, this indicates that the battery is near end of life. However, data is not compromised due to the fact that a nominal VCC is supplied. In order to insure data integrity during subsequent periods of battery back-up mode, the battery should be replaced. The SNAPHAT® top should be replaced with valid VCC applied to the device. M40Z300, M40Z300W The M40Z300/W only monitors the battery when a nominal VCC is applied to the device. Thus applications which require extensive durations in the battery back-up mode should be powered-up periodically (at least once every few months) in order for this technique to be beneficial. Additionally, if a battery low is indicated, data integrity should be verified upon power-up via a checksum or other technique. The BL pin is an open drain output and an appropriate pull-up resistor to VCC should be chosen to control the rise time. VCC Noise And Negative Going Transients ICC transients, including those produced by output switching, can produce voltage fluctuations, resulting in spikes on the VCC bus. These transients can be reduced if capacitors are used to store energy which stabilizes the VCC bus. The energy stored in the bypass capacitors will be released as low going spikes are generated or energy will be absorbed when overshoots occur. A ceramic bypass capacitor value of 0.1µF (as shown in Figure 9.) is recommended in order to provide the needed filtering. In addition to transients that are caused by normal SRAM operation, power cycling can generate negative voltage spikes on VCC that drive it to values below VSS by as much as one volt. These negative spikes can cause data corruption in the SRAM while in battery backup mode. To protect from these voltage spikes, STMicroelectronics recommends connecting a schottky diode from VCC to VSS (cathode connected to VCC, anode to VSS). Schottky diode 1N5817 is recommended for through hole and MBRS120T3 is recommended for surface mount. Figure 9. Supply Voltage Protection VCC VCC 0.1µF DEVICE VSS AI00622 9/21 M40Z300, M40Z300W MAXIMUM RATING Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 3. Absolute Maximum Ratings Symbol TA TSTG TSLD(1,2) Parameter Value Unit Grade 1 0 to 70 °C Grade 6 –40 to 85 °C SNAPHAT® –40 to 85 °C SOIC –55 to 125 °C 260 °C –0.3 to VCC + 0.3 V M40Z300 –0.3 to 7.0 V M40Z300W –0.3 to 4.6 V Ambient Operating Temperature Storage Temperature Lead Solder Temperature for 10 seconds VIO Input or Output Voltage VCC Supply Voltage IO Output Current 20 mA PD Power Dissipation 1 W Note: 1. For SO package, standard (SnPb) lead finish: Reflow at peak temperature of 225°C (total thermal budget not to exceed 180°C for between 90 to 150 seconds). 2. For SO package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C (total thermal budget not to exceed 245°C for greater than 30 seconds). CAUTION: Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up mode. CAUTION: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets. 10/21 M40Z300, M40Z300W DC AND AC PARAMETERS This section summarizes the operating and measurement conditions, as well as the DC and AC characteristics of the device. The parameters in the following DC and AC Characteristic tables are derived from tests performed under the Measure- ment Conditions listed in the relevant tables. Designers should check that the operating conditions in their projects match the measurement conditions when using the quoted parameters. Table 4. DC and AC Measurement Conditions Parameter M40Z300 M40Z300W 4.5 to 5.5V 2.7 to 3.6V Grade 1 0 to 70°C 0 to 70°C Grade 6 –40 to 85°C –40 to 85°C Load Capacitance (CL) 100pF 50pF Input Rise and Fall Times ≤ 5ns ≤ 5ns 0 to 3V 0 to 3V 1.5V 1.5V Max Unit Input Capacitance 8 pF Input/Output Capacitance 10 pF VCC Supply Voltage Ambient Operating Temperature Input Pulse Voltages Input and Output Timing Ref. Voltages Note: Output High Z is defined as the point where data is no longer driven. Figure 10. AC Testing Load Circuit 333Ω DEVICE UNDER TEST CL = 100pF or 50pF CL includes JIG capacitance 1.73V AI02393 Note: 50pF for M40Z300W. Table 5. Capacitance Symbol CIN COUT(3) Parameter(1,2) Min Note: 1. Sampled only, not 100% tested. 2. At 25°C, f = 1MHz. 3. Outputs deselected. 11/21 M40Z300, M40Z300W Table 6. DC Characteristics Sym Parameter Test Condition(1) M40Z300 M40Z300W Unit Min Typ 0V ≤ VIN ≤ VCC Max ILI(2) Input Leakage Current ICC Supply Current VIL Input Low Voltage –0.3 0.8 VIH Input High Voltage 2.2 VCC + 0.3 Min Typ ±1 Outputs open 3 Max ±1 µA 4 mA –0.3 0.8 V 2.0 VCC + 0.3 V 6 2 Output Low Voltage IOL = 4.0mA 0.4 0.4 V Output Low Voltage (open drain)(3) IOL = 10mA 0.4 0.4 V VOH Output High Voltage IOH = –2.0mA 2.4 VOHB VOH Battery Back-up(4) IOUT2 = –1.0µA 2.0 IOUT1 VOUT Current (Active) VOL V 150 100 mA Threshold Select Voltage VSS Power-fail Deselect Voltage (THS = VSS) 4.5 Power-fail Deselect Voltage (THS = VOUT) 4.2 Note: 1. 2. 3. 4. 3.6 VOUT > VCC –0.2 THS Battery Voltage 2.9 mA Data Retention Mode Current(5) VBAT 2.0 150 ICCDR Battery Back-up Switchover Voltage 3.6 250 VOUT Current (Battery Back-up) VSO 2.9 V VOUT > VCC –0.3 IOUT2 VPFD 2.4 VOUT > VBAT –0.3 100 100 100 100 nA VOUT V VOUT VSS 4.6 4.75 2.8 2.9 3.0 V 4.35 4.5 2.5 2.6 2.7 V 3.0 2.0 µA 2.9 2.5 3.6 2.0 2.9 V 3.6 V Valid for Ambient Operating Temperature: TA = 0 to 70°C or –40 to 85°C; VCC = 2.7 to 3.6V or 4.5 to 5.5V(except where noted). Outputs deselected. For RST & BL pins (Open Drain). Chip Enable outputs (E1CON - E4CON) can only sustain CMOS leakage currents in the battery back-up mode. Higher leakage currents will reduce battery life. 5. Measured with VOUT and E1CON - E4CON open. 12/21 M40Z300, M40Z300W Figure 11. Power Down Timing VCC VPFD (max) VPFD VPFD (min) VSO tF tFB E tWPT VOHB E1CON-E4CON RST AI02398B Figure 12. Power Up Timing VCC VPFD (max) VPFD VPFD (min) VSO tR tRB tCER E tEDH E1CON-E4CON tEDL VOHB tREC RST AI02399B 13/21 M40Z300, M40Z300W Table 7. Power Down/Up Mode AC Characteristics Parameter(1) Symbol tF(2) VPFD (max) to VPFD (min) VCC Fall Time tFB(3) VPFD (min) to VSS VCC Fall Time tR Chip Enable Propagation Delay Low tEDH Chip Enable Propagation Delay High tCER tREC(4) tWPT tRB Max Unit 300 µs M40Z300 10 µs M40Z300W 150 µs 10 µs VPFD(min) to VPFD (max) VCC Rise Time tEDL tAS Min M40Z300 12 ns M40Z300W 20 ns M40Z300 10 ns M40Z300W 20 ns A, B set up to E 0 ns Chip Enable Recovery 40 120 ms VPFD (max) to RST High 40 120 ms M40Z300 40 150 µs M40Z300W 40 250 µs Write Protect Time VSS to VPFD (min) VCC Rise Time 1 µs Note: 1. Valid for Ambient Operating Temperature: TA = 0 to 70°C or –40 to 85°C; VCC = 2.7 to 3.6V or 4.5 to 5.5V(except where noted). 2. VPFD (max) to VPFD (min) fall time of less than tF may result in deselection/write protection not occurring until 200 µs after VCC passes VPFD (min). 3. VPFD (min) to VSS fall time of less than tFB may cause corruption of RAM data. 4. tREC (min) = 20ms for industrial temperature Grade 6 device. 14/21 M40Z300, M40Z300W PACKAGE MECHANICAL INFORMATION Figure 13. SOH28 – 28-lead Plastic Small Outline, 4-socket battery SNAPHAT, Package Outline A2 A C B eB e CP D N E H A1 α L 1 SOH-A Note: Drawing is not to scale. Table 8. SOH28 – 28-lead Plastic Small Outline, battery SNAPHAT, Package Mechanical Data mm inches Symbol Typ Min A Max Typ Min 3.05 Max 0.120 A1 0.05 0.36 0.002 0.014 A2 2.34 2.69 0.092 0.106 B 0.36 0.51 0.014 0.020 C 0.15 0.32 0.006 0.012 D 17.71 18.49 0.697 0.728 E 8.23 8.89 0.324 0.350 – – – – eB 3.20 3.61 0.126 0.142 H 11.51 12.70 0.453 0.500 L 0.41 1.27 0.016 0.050 α 0° 8° 0° 8° N 28 e CP 1.27 0.050 28 0.10 0.004 15/21 M40Z300, M40Z300W Figure 14. SH – 4-pin SNAPHAT Housing for 48mAh Battery, Package Outline A1 A2 A eA A3 B L eB D E SHZP-A Note: Drawing is not to scale. Table 9. SH – 4-pin SNAPHAT Housing for 48mAh Battery, Package Mechanical Data mm inches Symbol Typ Min A Typ Min 9.78 Max 0.385 A1 6.73 7.24 0.265 0.285 A2 6.48 6.99 0.255 0.275 A3 16/21 Max 0.38 0.015 B 0.46 0.56 0.018 0.022 D 21.21 21.84 0.835 0.860 E 14.22 14.99 0.560 0.590 eA 15.55 15.95 0.612 0.628 eB 3.20 3.61 0.126 0.142 L 2.03 2.29 0.080 0.090 M40Z300, M40Z300W Figure 15. SH – 4-pin SNAPHAT Housing for 120mAh Battery, Package Outline A1 A2 A eA A3 B L eB D E SHZP-A Note: Drawing is not to scale. Table 10. SH – 4-pin SNAPHAT Housing for 120mAh Battery, Package Mechanical Data mm inches Symbol Typ Min A Max Typ Min 10.54 Max 0.415 A1 8.00 8.51 0.315 .0335 A2 7.24 8.00 0.285 0.315 A3 0.38 0.015 B 0.46 0.56 0.018 0.022 D 21.21 21.84 0.835 0.860 E 17.27 18.03 0.680 0.710 eA 15.55 15.95 0.612 0.628 eB 3.20 3.61 0.126 0.142 L 2.03 2.29 0.080 0.090 17/21 M40Z300, M40Z300W Figure 16. SO16 – 16-lead Plastic Small Outline, 150 mils body width, Package Outline A2 A C B CP e D N E H 1 A1 α L SO-b Note: Drawing is not to scale. Table 11. SO16 – 16-lead Plastic Small Outline, 150 mils body width, Package Mechanical Data mm inches Symbol Typ. Min. A Typ. Min. 1.75 A1 0.10 A2 Max. 0.069 0.25 0.004 1.60 0.010 0.063 B 0.35 0.46 0.014 0.018 C 0.19 0.25 0.007 0.010 D 9.80 10.00 0.386 0.394 E 3.80 4.00 0.150 0.158 – – – – H 5.80 6.20 0.228 0.244 L 0.40 1.27 0.016 0.050 α 0° 8° 0° 8° N 16 e CP 18/21 Max. 1.27 0.050 16 0.10 0.004 M40Z300, M40Z300W PART NUMBERING Table 12. Ordering Information Example Example: M40Z 300W MH 1 TR Device Type M40Z Supply and Write Protect Voltage 300 = VCC = 4.5 to 5.5V THS = VSS = 4.5V ≤ VPFD ≤ 4.75V THS = VOUT = 4.2V ≤ VPFD ≤ 4.5V 300W = VCC = 3.0 to 3.6V THS = VSS = 2.8V ≤ VPFD ≤ 3.0V VCC = 2.7V to 3.3V THS = VOUT = 2.5V ≤ VPFD ≤ 2.7V Package MH (1) = SOH28 MQ = SO16 Temperature Range 1 = 0 to 70°C 6 = –40 to 85°C Shipping Method for SOIC blank = Tubes TR = Tape & Reel Note: 1. The SOIC package (SOH28) requires the battery package (SNAPHAT®) which is ordered separately under the part number “M4Zxx-BR00SH” in plastic tube or “M4Zxx-BR00SHTR” in Tape & Reel form. Caution: Do not place the SNAPHAT battery package “M4Zxx-BR00SH” in conductive foam as it will drain the lithium button-cell battery. For other options, or for more information on any aspect of this device, please contact the ST Sales Office nearest you. Table 13. SNAPHAT® Battery Table Part Number Description Package M4Z28-BR00SH Lithium Battery (48mAh) SNAPHAT SH M4Z32-BR00SH Lithium Battery (120mAh) SNAPHAT SH 19/21 M40Z300, M40Z300W REVISION HISTORY Table 14. Document Revision History Date Version March 1999 1.0 First Issue 08-Mar-00 1.1 Document Layout changed; SO16 package added; Battery Capacity changed (Table 13) 22-Sep-00 1.2 SO16 package measures change 23-Feb-01 1.3 Added information for Industrial Temperature (Table 3, 7, 12) 30-May-01 1.4 Change “Controller” references to “SUPERVISOR” 10-Jul-01 2.0 Reformatted; added temp/voltage info. to tables (Table 6, 7); Figures changed (Figures 3, 5, 7, 10, 8) 01-Aug-01 2.1 E2 connections added to Hookup (Figure 7) 15-Jan-02 2.2 16-pin SOIC Connections split, graphic added (Figure 6); addition to hardware hookup (Figure 7) 13-May-02 2.3 Modify reflow time and temperature footnote (Table 3) 31-Oct-03 2.4 Update DC Characteristics (Table 6) 04-Nov-03 2.5 Correct DC Characteristics (Table 6) 23-Feb-05 3.0 Reformatted; IR reflow, SO package updates (Table 3) 20/21 Revision Details M40Z300, M40Z300W Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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