MBR230LSFT1G Surface Mount Schottky Power Rectifier Plastic SOD−123 Package This device uses the Schottky Barrier principle with a large area metal−to−silicon power diode. Ideally suited for low voltage, high frequency rectification or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. This package also provides an easy to work with alternative to leadless 34 package style. Because of its small size, it is ideal for use in portable and battery powered products such as cellular and cordless phones, chargers, notebook computers, printers, PDAs and PCMCIA cards. Typical applications are AC−DC and DC−DC converters, reverse battery protection, and “Oring” of multiple supply voltages and any other application where performance and size are critical. http://onsemi.com SCHOTTKY BARRIER RECTIFIER 2.0 AMPERES, 30 VOLTS SOD−123FL CASE 498 Features • • • • • • • • Guardring for Stress Protection Low Forward Voltage 125°C Operating Junction Temperature Epoxy Meets UL 94 V−0 Package Designed for Optimal Automated Board Assembly ESD Ratings: Machine Model, C Human Body Model, 3B NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant Mechanical Characteristics • • • • • • • • July, 2014 − Rev. 1 L3N MG G L3N = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Reel Options: MBR230LSFT1G = 3,000 per 7 in reel/8 mm tape Device Marking: L3N Polarity Designator: Cathode Band Weight: 11.7 mg (approximately) Case: Epoxy, Molded Lead Finish: 100% Matte Sn (Tin) Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Device Meets MSL 1 Requirements © Semiconductor Components Industries, LLC, 2014 MARKING DIAGRAM 1 MBR230LSFT1G Package Shipping† SOD−123FL 3000/Tape & Reel (Pb−Free) NRVB230LSFT1G SOD−123FL 3000/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: MBR230LSFT1/D MBR230LSFT1G MAXIMUM RATINGS Rating Symbol Value Unit VRRM VRWM VR 30 V IO 2.0 A Peak Repetitive Forward Current (At Rated VR, Square Wave, 100 kHz, TL = 95°C) IFRM 4.0 A Non−Repetitive Peak Surge Current (Non−Repetitive peak surge current, halfwave, single phase, 60 Hz) IFSM 40 A Storage Temperature Tstg −55 to 150 °C Operating Junction Temperature TJ −55 to 125 °C dv/dt 10,000 V/ms Rtjl Rtjl Rtja Rtja 26 21 325 82 °C/W Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TL = 105°C) Voltage Rate of Change (Rated VR, TJ = 25°C) THERMAL CHARACTERISTICS Thermal Resistance, Junction−to−Lead (Note 1) Thermal Resistance, Junction−to−Lead (Note 2) Thermal Resistance, Junction−to−Ambient (Note 1) Thermal Resistance, Junction−to−Ambient (Note 2) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Mounted with minimum recommended pad size, PC Board FR4. 2. Mounted with 1 in. copper pad (Cu area 700 mm2). ELECTRICAL CHARACTERISTICS VF Maximum Instantaneous Forward Voltage (Note 3) (IF = 1.0 A) (IF = 2.0 A) IR Maximum Instantaneous Reverse Current (Note 3) (VR = 30 V) TJ = 25°C TJ = 100°C 0.38 0.43 0.30 0.37 TJ = 25°C TJ = 100°C 1.0 25 V mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2%. http://onsemi.com 2 MBR230LSFT1G TYPICAL CHARACTERISTICS TJ = 125°C TJ = 100°C TJ = 25°C TJ = −55°C 0.1 0.10 0.30 0.20 0.40 0.50 0.60 0.70 1 T = 125°C J TJ = 100°C 0.1 0.10 0.80 0.20 0.30 0.40 0.50 Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage TJ = 125°C 10E−3 TJ = 25°C 10E−6 1E−6 TJ = −55°C 100E−9 10E−3 TJ = 100°C 1E−3 TJ = 25°C 0 10 20 VR, REVERSE VOLTAGE (VOLTS) 30 TJ = −55°C 10E−6 0 3.5 dc 3 2.5 freq = 20 kHz square wave Ipk/IO = p Ipk/IO = 5 1.5 1 0.5 0 25 35 45 55 65 75 85 95 10 20 VR, REVERSE VOLTAGE (VOLTS) 30 Figure 4. Maximum Reverse Current 105 115 125 TL, LEAD TEMPERATURE (°C) PFO, AVERAGE POWER DISSIPATION (WATTS) Figure 3. Typical Reverse Current 2 TJ = 125°C 100E−6 10E−9 1E−9 1E+0 100E−3 TJ = 100°C 1E−3 0.70 0.60 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 100E−6 IO, AVERAGE FORWARD CURRENT (AMPS) TJ = −55°C TJ = 25°C VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 100E−3 IR, REVERSE CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 1 10 IR, MAXIMUM REVERSE CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 10 1.6 1.4 dc square wave Ipk/IO = p 1.2 1.0 Ipk/IO = 5 0.8 0.6 0.4 0.2 0 0 0.5 1.0 1.5 2.0 2.5 3.0 IO, AVERAGE FORWARD CURRENT (AMPS) Figure 6. Forward Power Dissipation Figure 5. Current Derating http://onsemi.com 3 3.5 MBR230LSFT1G C, CAPACITANCE (pF) 1000 TJ, DERATED OPERATING TEMPERATURE (°C) TYPICAL CHARACTERISTICS TJ = 25 °C 100 10 0 5 10 15 20 25 VR, REVERSE VOLTAGE (VOLTS) 30 125 RqJA = 25.6 °C/W 120 115 110 105 RqJA = 130 °C/W 100 95 90 RqJA = 235 °C/W 85 80 75 70 65 RqJA = 324.9 °C/W RqJA = 400 °C/W 0 r(t), TRANSIENT THERMAL RESISTANCE Figure 7. Capacitance 2 4 6 8 10 12 14 16 VR, DC REVERSE VOLTAGE (VOLTS) 18 20 Figure 8. Typical Operating Temperature Derating 1000 D = 0.5 100 0.2 0.1 0.05 P(pk) 10 0.01 t1 t2 1 DUTY CYCLE, D = t1/t2 SINGLE PULSE qJA = 321.8 °C/W Test Type > Min Pad < Die Size 38x38 @ 75% mils 0.1 0.000001 0.00001 0.0001 0.001 0.01 0.1 t1, TIME (sec) Figure 9. Thermal Response http://onsemi.com 4 1 10 100 1000 MBR230LSFT1G PACKAGE DIMENSIONS SOD−123LF CASE 498 ISSUE D q E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH. 4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. D 1 2 DIM A A1 b c D E L HE q A1 POLARITY INDICATOR OPTIONAL AS NEEDED A END VIEW TOP VIEW q HE MIN 0.90 0.00 0.70 0.10 1.50 2.50 0.55 3.40 0° MILLIMETERS NOM MAX 0.95 0.98 0.05 0.10 0.90 1.10 0.15 0.20 1.65 1.80 2.70 2.90 0.75 0.95 3.60 3.80 8° − MIN 0.035 0.000 0.028 0.004 0.059 0.098 0.022 0.134 0° INCHES NOM 0.037 0.002 0.035 0.006 0.065 0.106 0.030 0.142 − MAX 0.039 0.004 0.043 0.008 0.071 0.114 0.037 0.150 8° RECOMMENDED SOLDERING FOOTPRINT* c SIDE VIEW 4.20 2X 2X L b 2X BOTTOM VIEW 1.22 ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ 2X 1.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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