Rohm BU29TA2WHFV 1ch 200ma cmos ldo regulator Datasheet

CMOS LDO Regulators for Portable Equipments
1ch 200mA
CMOS LDO Regulators
BUTA2WNVX series, BUTA2WHFV series
No.11020ECT01
●Description
BU□□TA2WNVX /HFV series is high-performance FULL CMOS regulator with 200-mA output, which is mounted on
microminiature package SSON004X1216 (1.2 mm  1.6 mm  0.6 mm) &HVSOF5(1.6mm  1.6mm  0.6mm). It has
excellent noise characteristics and load responsiveness characteristics despite its low circuit current consumption of 40 µA.
It is most appropriate for various applications such as power supplies for logic IC, RF, and camera modules.
Microminiature package SSON004X1216 & HVSOF5 with built-in heatsink is adopted for the package, which contributes to
the space-saving design of the set.
●Features
1) High-accuracy output voltage of 1% (25 mV on 1.5-V & 1.8-V products）
2) High ripple rejection: 70 dB (Typ., 1 kHz, VOUT1.8 V))
3) Compatible with small ceramic capacitor (CIN=Co=1.0 µF)
4) Low current consumption: 40 µA
5) ON/OFF control of output voltage
6) With built-in overcurrent protection circuit and overheat protection circuit
7) With built-in output discharge circuit
8) Adopting microminiature power package SSON004X1216
●Applications
Battery-powered portable equipment, etc.
●Line up
■ 200 mA BU□□TA2WNVX / HFV series
Product Name
1.5
1.8
2.5
2.6
2.7
2.8 2.85 2.9
3.0
3.1
3.2
3.3
3.4
Package
BU□□TA2WNVX
○
○
○
○
○
○
○
○
○
○
○
○
○
SSON004X1216
BU□□TA2WHFV
○
○
○
○
○
○
○
○
○
○
○
○
○
HVSOF5
Model name: BH□□TA2W□□□
a
b
Symbol
Contents
Specification of output voltage
a
b
□□
Output voltage (V)
□□
Output voltage (V)
□□
Output voltage (V)
15
1.5V(Typ.)
28
2.8V(Typ.)
32
3.2V(Typ.)
18
1.8V(Typ.)
2J
2.85V(Typ.)
33
3.3V(Typ.)
25
2.5V(Typ.)
29
2.9V(Typ.)
34
3.4V(Typ.)
26
2.6V(Typ.)
30
3.0V(Typ.)
-
-
27
2.7V(Typ.)
31
3.1V(Typ.)
-
-
Package
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
NVX :SSON004X1216
HFV :HVSOF5
1/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Absolute maximum rating
Parameter
Symbol
Ratings
Maximum applied power voltage VMAX
-0.3 ~
Unit
+6.5
V
Pd1
220*1 (SSON004X1216)
Pd2
410*2 (HVSOF5)
Maximum junction temperature
TjMAX
+125
Operational temperature range
Topr
-40 ~
+85
℃
Storage temperature range
Tstg
-55 ~
+125
℃
Power dissipation
*1
*2
mW
℃
When 1 PCB (70 mm  70 mm, thickness 1.6-mm glass epoxy) a standard ROHM board is implemented.
Reduced to 2.2 mW/C when used at Ta=25C or higher.
When 1 PCB (70 mm  70 mm, thickness 1.6-mm glass epoxy) a standard ROHM board is implemented.
Reduced to 4.1 mW/C when used at Ta=25C or higher.
●Recommended operating range (Do not exceed Pd.)
Parameter
Input power supply voltage
Maximum output current
Symbol
Ratings
VIN
2.5 ~
IMAX
Unit
5.5
V
200
mA
●Recommended operating conditions
Parameter
Symbol
Ratings
Min.
Typ.
Max.
Unit
Conditions
Input capacitor
CIN
0.5*3
1.0
－
μF
A ceramic capacitor is
recommended.
Output capacitor
CO
0.5*3
1.0
－
μF
A ceramic capacitor is
recommended.
*3
Set the capacity value of the capacitor so that it does not fall below the minimum value, taking temperature characteristics,
DC device characteristics, and change with time into consideration.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
2/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Electrical characteristics
(Unless otherwise specified
Parameter
Ta=25℃, VIN=VOUT+1.0 V (VIN=3.5 V on VOUT=1.8-V and1.5-V products),
STBY=1.5 V, CIN=1.0 µF, CO=1.0 µF)
Limits
Symbol
Unit
Conditions
Min.
Typ.
Max.
Output voltage
VOUT
Circuit current
Circuit current (at STBY)
VOUT
×0.99
VOUT
-25 mV
VOUT
VOUT
×1.01
V
VOUT
+25 mV
IOUT=10 μA, VOUT<2.5 V
IIN
-
40
95
μA
IOUT=0mA
ISTBY
-
-
1
μA
STBY=0 V
70
Ripple rejection
RR
55
-
dB
65
Input/Output voltage difference
IOUT=10 μA, VOUT≥2.5 V
VRR=-20 dBv, fRR=1 kHz,
IOUT=10 mA, 1.5 V≤VOUT≤1.8 V
VRR=-20 dBv,fRR=1 kHz,
IOUT=10 mA, 2.5 V≤VOUT
-
400
800
mV
2.5 V≤VOUT≤2.6 V
(VIN=0.98*VOUT, IOUT=200 mA)
-
360
720
mV
2.7 V≤VOUT≤2.85 V
(VIN=0.98*VOUT, IOUT=200 mA)
-
330
660
mV
2.9 V≤VOUT≤3.1 V
(VIN=0.98*VOUT,IOUT=200 mA)
-
300
600
mV
3.2 V≤VOUT≤3.4 V
(VIN=0.98*VOUT, IOUT=200 mA)
VSAT
Line regulation
VDL
-
2
20
mV
VIN=VOUT+1.0 V to 5.5 V,
IOUT=10 μA
Load regulation
VDLO
-
10
80
mV
IOUT=0.01 mA to 100 mA
Overcurrent protection detection
ILMAX
current
250
400
700
mA
Vo=VOUT*0.8
Output short-circuit current
ISHORT
20
70
150
mA
Vo=0 V
Output discharge resistance
RDSC
20
40
80
Ω
Standby pull-down resistance
RSTB
500
1000
2000
kΩ
Standby control
ON
VSTBH
1.5
-
5.5
V
OFF
VSTBL
-0.3
-
0.3
V
VIN=4.0 V, STBY=0 V
* This product does not have radiation-proof design.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
3/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Block diagram, recommended circuit diagram, and pin configuration diagram
BH□□TA2WNVX
VIN
VIN
4/3
VREF
VOUT
Cin
VOUT
1
1/4
2
OCP
Co
GND
VSTB Y
STBY
3/1
STBY
Discharge
Recommended ceramic capacitor for Cin & Co
Murata Manufacturing Co., Ltd.
GRM188B11A105KA61D
Fig.1 Recommended circuit diagram
BU□□TA2WNVX(SSON004X1216)
4
3
1
2
PIN No.
Symbol
Function
1
VOUT
Voltage output
2
GND
Grounding
3
STBY
ON/OFF control of output voltage
(High: ON, Low: OFF)
4
VIN
PIN No.
Symbol
1
STBY
ON/OFF control of output voltage
(High:ON, Low:OFF)
2
GND
Grounding
3
VIN
Power input
4
VOUT
5
N.C.
Power input
BU□□TA2WHFV(HVSOF5)
5
1
4
2
3
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
4/29
Function
Voltage output
No Connect
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Input/Output terminal equivalent circuit schematic
1pin (VOUT)
2pin (GND)
3pin (STBY)
VIN
4pin (VIN)
VIN
VOUT
STBY
Fig.２
Input/Output equivalent circuit
●About input/output capacitor
Capacity value of ceramic capacitor - DC bias characteristics
(Example)
10-V withstand voltage
B1characteristics
GRM188B11A105KA61D
10
0
-10
Capacitance Change [%]
It is recommended to place a capacitor as close as possible to the
pins between the input terminal and GND or between the output
terminal and GND.
The capacitor between the input terminal and GND becomes valid
when source impedance increases or when wiring is long. The
larger the capacity of the output capacitor between the output
terminal and GND is, the better the stability and characteristics in
output load fluctuation become. However, please check the status
of actual implementation. Ceramic capacitors generally have
variation, temperature characteristics, and direct current bias
characteristics and the capacity value also decreases with time
depending on the usage conditions. It is recommended to select a
ceramic capacitor upon inquiring about detailed data of the related
manufacturer.
10-V withstand voltage
B characteristics
-20
6.3-V withstand voltage
B characteristics
-30
10-V withstand voltage
F characteristics
-40
-50
-60
4-V withstand voltage
X6S characteristics
10-V withstand voltage
F characteristics
-70
-80
-90
-100
0
0.5
1
1.5
2
2.5
3
3.5
4
DC Bias Voltage [V]
Fig.3 Capacity – bias characteristics
●About the equivalent series resistance (ESR) of a ceramic capacitor
100
ESR [Ω]
Capacitors generally have ESR (equivalent series resistance) and it
operates stably in the ESR-IOUT area shown on the right. Since
ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc.
generally have different ESR, please check the ESR of the
capacitor to be used and use it within the stability area range shown
in the right graph for evaluation of the actual application.
Unstable area
10
Stability area
1
0.1
0.01
0
50
100
150
200
IOUT [mA]
Fig.4 Stability area characteristics (Example)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
5/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU15TA2WNVX / HFV
(Ta=25ºC unless otherwise specified.)
100
1.55
1.54
1.5
1.2
IO=0uA
IO=100uA
IO=50mA
IO=200mA
0.9
0.6
Temp=25°C
VIN = STBY
0.3
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.53
1.52
1.51
1.50
1.49
1.48
1.47
Temp=25°C
VIN = STBY
1.46
0.0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.25 1.35 1.45
1.55 1.65 1.75 1.85 1.95
Vin Voltage (V)
40
Temp=-40°C
Temp=25°C
Temp=85°C
20
0
2.05 2.15 2.25
0.5
1
1.5
2
2.5
3
60
Temp=-40°C
Temp=25°C
Temp=85°C
40
20
IO=200mA
VIN = STBY
Temp=85°C
8
Gnd Current (uA)
STBY Current (uA)
80
Temp=25°C
6
Temp=-40°C
4
2
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
0.5
1
1.5
Vin Voltage (V)
Fig. 8 Circuit Current IGND
2
2.5
3
3.5
4
4.5
5
Temp=-40°C
1.51
1.50
1.49
1.48
Temp=85°C
VIN = 3.5V
STBY = 1.5V
1.46
0.1
0.15
VIN=3.5V
1.25
1.00
VIN=2.5V
0.75
0.50
Temp=25°C
STBY = 1.5V
0.00
0.2
0.10
Fig. 11 Load Regulation
0.20
0.30
0.40
0.50
1.50
1.49
VIN=3.5V
STBY=1.5V
Io=0.1mA
1.46
1.45
-15
10
35
Temp=85°C
Temp=25°C
Temp=-40°C
0.50
0.5
40.00
30.00
20.00
VIN=3.5V
STBY=1.5V
Io=0mA
10.00
60
85
Temp (°C)
Fig. 14 VOUT vs. Temp
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
-40
-15
10
35
60
Temp (°C)
Fig. 15 IGND vs. Temp
6/29
1
1.5
Fig. 13 STBY Threshold
0.00
-40
0.75
STBY Voltage (V)
Gnd Current (uA)
Input Current (uA)
1.51
1.47
1.00
0
50.00
1.52
0.2
0.00
1.54
1.53
0.15
1.25
0.25
0.60
Fig. 12 OCP Threshold
1.55
0.1
1.50
Output Current (A)
Output Current (A)
1.48
0.05
1.75
1.50
0.00
0.05
VIN = 3.5V
STBY = 1.5V
2.00
0.25
1.45
0
Temp=-40°C
60
Fig. 10 IOUT - IGND
Output Voltage (V)
Output Voltage (V)
Temp=25°C
1.47
70
Output Current (A)
VIN=5.5V
1.75
1.52
80
0
5.5
2.00
1.53
Temp=25°C
90
Fig. 9 STBY Input Current
1.54
5.5
Temp=85°C
STBY Voltage (V)
1.55
5
40
0
0
4.5
100
50
VIN = STBY
0
4
120
110
100
3.5
Fig. 7 Circuit Current IGND
10
120
IO=0uA
VIN = STBY
Vin Voltage (V)
Fig. 6 Line Regulation
140
Gnd Current (uA)
60
Vin Voltage (V)
Fig. 5 Output Voltage
Output Voltage (V)
80
0
1.45
0
Output Voltage (V)
Gnd Current (uA)
Output Voltage (V)
Output Voltage (V)
1.8
85
1.000
0.900
0.800
0.700
0.600
0.500
0.400
0.300
0.200
0.100
0.000
-0.100
-40
VIN=3.5V
STBY=0V
-15
10
35
60
85
Temp (°C)
Fig. 16 IGND vs. Temp (STBY)
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
(Ta=25ºC unless otherwise specified.)
80
80
0.7
f= 0 .1 kHz
70
Ripple Rejection [dB]
Ripple Re je c tion (dB )
70
O u tpu t N o is e D e n s ity [μ V / √ H z ]
●Reference data BU15TA2WNVX /HFV
60
50
40
30
Vin= 3.5V
Io=10mA
Ta = 25℃
20
10
f= 1 kHz
60
f= 1 0 kHz
50
40
30
f= 1 0 0 kHz
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
20
10
0
0
2.5
0.1
1
10
100
1000
4.5
Input Voltage VIN[V]
Frequency (kHz)
Fig. 17 Ripple Rejection vs. Freq.
3.5
Fig. 18 Ripple Rejection vs. VIN
(Iout=10 mA)
5.5
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
0.6
0.5
0.4
0.3
0.2
0.1
0
0.1
1
10
Frequency f [kHz]
Fig. 19 Output Noise Spectral Density
vs. Freq.
Fig. 20 Load Response
Fig. 21 Load Response
Fig. 22 Load Response
Fig. 23 Load Response
Fig. 24 Load Response
Current Pulse=10 kHz
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
100
Fig. 25 Load Response
Current Pulse=10 kHz
7/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data
BU15TA2WNVX / HFV (Ta=25ºC unless otherwise specified.)
Fig. 26 Load Response
Current Pulse=100 kHz
Fig. 27 Load Response
Current Pulse=100 kHz
Fig. 28 Startup Time
Iout = 0 mA
Fig. 29 Startup Time
Iout = 200 mA
Fig. 31 Startup Time (STBY=VIN)
Iout = 200mA
Fig. 32 Discharge Time
Iout = 0 mA
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
8/29
Fig. 30 Startup Time (STBY=VIN)
Iout = 0 mA
Fig. 33 VIN Response
Iout = 10 mA
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU18TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
3.5
1.84
2.5
2.0
1.5
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.0
0.5
Temp=25°C
VIN = STBY
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.83
1.82
1.81
1.80
1.79
1.78
1.77
Temp=25°C
VIN = STBY
1.76
0.0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.75
1.85
1.95
Vin Voltage (V)
2.05
2.15
2.25
40
Temp=-40°C
Temp=25°C
Temp=85°C
20
0
2.35
0.5
1
1.5
2
2.5
3
60
Temp=-40°C
Temp=25°C
Temp=85°C
40
IO=200mA
VIN = STBY
20
Temp=85°C
8
Gnd Current (uA)
STBY Current (uA)
80
Temp=25°C
6
Temp=-40°C
4
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
1.80
1.79
1.78
VIN = 3.5V
STBY = 1.5V
0.05
0.1
0.15
0.2
VIN=5.5V
2.00
VIN=3.5V
1.50
1.00
VIN=2.5V
Temp=25°C
STBY = 1.5V
0.10
0.20
0.30
0.40
0.50
0.60
1.81
1.80
1.79
VIN=3.5V
STBY=1.5V
Io=0.1mA
40.00
30.00
20.00
VIN=3.5V
STBY=1.5V
Io=0mA
10.00
0.00
1.75
-15
10
35
60
85
Temp (°C)
Fig. 43 VOUT vs Temp
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
-40
-15
10
35
60
Temp (°C)
Fig. 44 IGND vs Temp
9/29
1
1.5
Fig. 42 STBY Threshold
G nd Current (uA)
Input Current (uA)
1.82
0.5
STBY Voltage (V)
Fig. 41 OCP Threshold
1.83
-40
Temp=85°C
Temp=25°C
Temp=-40°C
1.00
0
1.84
1.76
1.50
0.50
50.00
1.77
2.00
Output Current (A)
Fig. 40 Load Regulation
1.78
2.50
0.00
0.00
Output Current (A)
1.85
0.2
3.00
2.50
0.00
0
0.15
3.50
0.50
1.75
0.1
Fig. 39 IOUT - IGND
Output Voltage (V)
Output Voltage (V)
Temp=-40°C
1.81
1.76
0.05
Output Current (A)
3.00
Temp=25°C
Temp=85°C
VIN = 3.5V
STBY = 1.5V
0
5.5
3.50
1.77
Temp=-40°C
60
Fig. 38 STBY Input Current
1.84
1.82
70
STBY Voltage (V)
Fig. 37 Circuit Current IGND
1.83
80
40
Vin Voltage (V)
1.85
5.5
Temp=25°C
90
50
5.5
5
Temp=85°C
VIN = STBY
0
4.5
100
2
0
0
4
120
110
100
3.5
Fig. 36 Circuit Current IGND
10
120
IO=0uA
VIN = STBY
Vin Voltage (V)
Fig. 35 Line Regulation
140
Gnd Current (uA)
60
Vin Voltage (V)
Fig. 34 Output Voltage
Output Voltage (V)
80
0
1.75
0
Output Voltage (V)
Gnd Current (uA)
Output Voltage (V)
Output Voltage (V)
100
1.85
3.0
85
1.000
0.900
0.800
0.700
0.600
0.500
0.400
0.300
0.200
0.100
0.000
-0.100
-40
VIN=3.5V
STBY=0V
-15
10
35
60
85
Temp (°C)
Fig. 45 IGND vs Temp (STBY)
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
80
70
70
60
50
40
30
Vin= 3.5V
Io=10mA
Ta = 25℃
20
10
0.7
f= 0 .1 kHz
O u tpu t N oise D e n sity [μ V / √ H z]
80
Ripple Rejection [dB]
R ipple R ejection (dB)
●Reference data BU18TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
f= 1 kHz
60
f= 1 0 kHz
50
40
f= 1 0 0 kHz
30
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
20
10
0
0
0.1
1
10
100
2.5
1000
4.5
5.5
0.5
0.4
0.3
0.2
0.1
0
0.1
1
Input Voltage VIN[V]
Frequency (kHz)
Fig. 46 Ripple Rejection VS Freq.
3.5
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
0.6
Fig. 47 Ripple Rejection VS VIN
10
Frequency f [kHz]
100
Fig. 48 Output Noise Spectrl
Density VS Freq.
Fig. 49 Load Response
Fig. 50 Load Response
Fig. 51 Load Response
Fig. 52 Load Response
⇔
Fig. 53 Load Response
Current Pulse=10kHz
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 54 Load Response
Current Pulse=10kHz
10/29
2011.01 - Rev.C
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU18TA2WNVX / HFV
Technical Note
(Unless otherwise specified, Ta=25℃)
⇔
Fig. 55 Load Response
Current Pulse=100kHz
Fig. 57 Start Up Time
Iout = 0mA
Fig. 60 Start Up Time(STBY=VIN)
Iout = 200mA
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 56 Load Response
Current Pulse=100kHz
Fig. 58 Start Up Time
Iout = 200mA
Fig. 61 Discharge Time
Iout = 0mA
11/29
Fig. 59 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 62 VIN Response
Iout = 10mA
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU25TA2WNVX / HFV
(Unless otherwise specified, Ta=25℃)
3.5
2.54
2.5
2.0
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.5
1.0
0.5
Temp.=25°C
VIN=STBY
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
2.52
2.51
2.50
2.49
2.48
2.47
Temp.=25°C
VIN=STBY
2.46
0.0
0
IO=0uA
IO=100uA
IO=50mA
IO=200mA
2.53
Gnd Current (uA)
Output Voltage (V)
Output Voltage (V)
100
2.55
3.0
2.4
2.5
2.6
2.7
2.8
40
Temp.=-40°C
Temp.=25°C
Temp.=85°C
20
2.9
0
3
0.5
1
1.5
2
2.5
0.35
Temp.=25°C
0.30
0.25
Temp.=-40°C
0.20
0.15
0.10
VIN=0.98*VOUT
STBY=1.5V
0.05
Temp.=85°C
8
Gnd Current (uA)
STBY Current (uA)
110
Temp.=85°C
Temp.=25°C
6
Temp.=-40°C
4
2
0.05
0.1
0.15
4
4.5
5
5.5
Temp.=-40°C
100
Temp.=25°C
90
80
Temp.=85°C
70
60
50
0
0.00
0
3.5
120
10
0.45
0.40
3
Fig. 65 Circuit Current IGND
Fig. 64 Line Regulation
0.50
IO=0uA
VIN=STBY
Vin Voltage (V)
Vin Voltage (V)
Fig. 63 Output Voltage
Dropout Voltage (V)
60
0
2.45
5.5
Vin Voltage (V)
80
40
0
0.2
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
5.5
0.05
STBY Voltage (V)
Output Current (A)
Fig. 66 Dropout Voltage
Fig. 67 STBY Input Current
2.55
0.1
0.15
0.2
Output Current (A)
Fig. 68 IOUT - IGND
3.00
3.50
Temp.=25°C
2.52
Temp.=85°C
2.51
2.50
2.49
2.48
2.47
VIN=3.5V
STBY=1.5V
Temp.=-40°C
2.46
3.00
2.50
VIN=5.5V
VIN=3.5V
2.00
VIN=3.0V
1.50
1.00
Temp.=25°C
0.50
0.00
0
0.05
0.1
0.15
0.2
0
0.1
0.2
Output Current (A)
0.3
0.4
0.5
1.50
Temp.=85°C
Temp.=25°C
Temp.=-40°C
1.00
0.00
0.6
0
0.5
1.5
Fig. 71 STBY Threshold
1.000
50.00
VIN=3.5V
STBY=1.5V
Io=0.1mA
1
STBY Voltage (V)
Fig. 70 OCP Threshold
2.55
0.900
2.52
2.51
2.50
2.49
2.48
2.47
0.800
40.00
Gnd Current (uA)
Gnd Current (uA)
2.53
2.00
Output Current (A)
Fig. 69 Load Regulation
2.54
2.50
0.50
STBY=1.5V
2.45
Output Voltage (V)
Output Voltage (V)
2.53
Output Voltage (V)
Output Voltage (V)
2.54
VIN=3.5V
STBY=1.5V
Io=0mA
30.00
20.00
10.00
0.700
0.600
0.500
0.400
0.300
0.200
VIN=3.5V
STBY=0V
0.100
2.46
0.000
2.45
-0.100
0.00
-40
-15
10
35
60
85
Temp. (°C)
Fig. 72 VOUT vs Temp
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
-40
-15
10
35
60
Temp. (°C)
Fig. 73 IGND vs Temp
12/29
85
-40
-15
10
35
60
85
Temp. (°C)
Fig. 74 IGND vs Temp (STBY)
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU25TA2WNVX / HFV
(Unless otherwise specified, Ta=25℃)
80
80
1.2
O utput N oise D ensity [μ V /√ H z]
f= 0 .1 kHz
70
60
Ripple Rejection [dB]
Ripple Rejection (dB )
70
50
40
30
20
Vin= 3.5V
Io=10mA
Ta = 25℃
10
60
f= 1 kHz
50
f= 1 0 kHz
40
f= 1 0 0 kHz
30
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
20
10
0
0
0.1
1
10
100
1000
Frequency (kHz)
2.5
3.5
4.5
5.5
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
1
0.8
0.6
0.4
0.2
0
0.1
I OU T=0m A →100m A
10
Frequency f [kHz]
I OU T=100m A →0m A
Fig. 79 Load Response
Fig. 78 Load Response
Fig. 80 Load Response
Fig. 81 Load Response
⇔
⇔
Fig. 83 Load Response
Current Pulse=10kHz
Fig. 82 Load Response
Current Pulse=10kHz
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
100
Fig. 77 Output Noise Spectrl
Density VS Freq.
Fig. 76 Ripple Rejection VS VIN
Fig. 75 Ripple Rejection VS Freq.
1
Input Voltage VIN[V]
13/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU25TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
⇔
⇔
Fig. 84 Load Response
Current Pulse=100kHz
Fig. 86 Start Up Time
Iout = 0mA
Fig. 89 Start Up Time(STBY=VIN)
Iout = 200mA
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 85 Load Response
Current Pulse=100kHz
Fig. 87 Start Up Time
Iout = 200mA
Fig. 90 Discharge Time
Iout = 0mA
14/29
Fig. 88 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 91 VIN Response
Iout = 10mA
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU28TA2WNVX / HFV
(Unless otherwise specified, Ta=25℃)
3.5
IO=0uA
2.84
2.5
2.0
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.5
1.0
Temp.=25°C
VIN = STBY
0.5
0.0
IO=0uA
IO=100uA
IO=50mA
IO=200mA
2.83
2.82
2.81
80
Gnd Current (uA)
Output Voltage (V)
Output Voltage (V)
100
2.85
3.0
2.80
2.79
2.78
Temp.=25°C
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
2.76
VIN = STBY
5.5
2.8
2.9
3
3.1
3.2
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vin Voltage (V)
Vin Voltage (V)
Fig. 94 Circuit Current IGND
Fig. 93 Line Regulation
10
0.40
120
0.35
110
Temp.=85°C
0.25
Temp.=25°C
0.20
Temp.=-40°C
0.15
0.10
8
Temp.=85°C
Temp.=25°C
6
Temp.=-40°C
4
2
VIN=0.98 x VOUT
0.05
Gnd Current (uA)
0.30
STBY Current (uA)
90
Temp.=25°C
80
70
0
0.05
0.1
0.15
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0.15
0.2
3.50
VIN=3.8V
3.00
3.00
2.82
Output Voltage (V)
STBY = 1.5V
0.1
Fig. 97 IOUT - IGND
3.50
2.85
2.83
0.05
Output Currnt (A)
Fig. 96 STBY Input Current
Fig. 95 Dropout Voltage
VIN = 3.8V
STBY = 1.5V
0
5.5
STBY Voltage (V)
Output Current (A)
2.84
VIN = 3.8V
50
40
0
0.2
Temp.=-40°C
60
0
0.00
Temp.=85°C
100
VIN = STBY
STBY = 1.5V
Temp.=-40°C
2.81
2.80
2.79
2.78
2.77
Temp.=85°C
Temp.=25°C
VIN=3.8V
2.50
VIN=5.5V
2.00
VIN=3.3V
1.50
1.00
Temp=25°C
STBY = 1.5V
0.50
2.76
Output Voltage (V)
Dropout Voltage (V)
Temp.=-40°C
Temp.=25°C
Temp.=85°C
0
2.7
Fig. 92 Output Voltage
Output Voltage (V)
40
20
2.77
Vin Voltage (V)
2.50
2.00
1.50
Temp.=85°C
Temp.=25°C
Temp.=-40°C
1.00
0.50
0.00
2.75
0
0.05
0.1
0.15
0
0.2
0.1
0.2
0.3
0.4
0.5
0.6
0.00
Output Current (A)
Output Currnt (A)
0
0.5
1
1.5
STBY Voltage (V)
Fig. 98 Load Regulation
Fig. 99 OCP Threshold
Fig. 100 STBY Threshold
50.00
2.85
1.000
0.900
2.84
2.82
2.81
2.80
2.79
2.78
VIN=3.8V
STBY=1.5V
Io=0.1mA
2.77
2.76
0.800
40.00
Gnd Current (uA)
2.83
Gnd Current (uA)
Output Voltage (V)
60
2.75
0
VIN = STBY
30.00
20.00
VIN=3.8V
STBY=1.5V
Io=0mA
10.00
-40
-15
10
35
60
85
Temp. (°C)
Fig. 101 VOUT vs Temp
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
0.600
0.500
0.400
0.300
VIN=3.8V
STBY=0V
0.200
0.100
0.000
0.00
2.75
0.700
-0.100
-40
-15
10
35
60
Temp. (°C)
Fig. 102 IGND vs Temp
15/29
85
-40
-15
10
35
60
85
Temp. (°C)
Fig. 103 IGND vs Temp (STBY)
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
(Unless otherwise specified, Ta=25℃)
80
80
1.6
f= 0 .1 kHz
70
60
Ripple Rejection [dB]
Ripple Rejection (dB )
70
O utput N oise D ensity [μ V /√ H z]
●Reference data BU28TA2WNVX / HFV
50
40
30
20
Vin= 3.8V
Io=10mA
Ta = 25℃
10
1
10
f= 1 kH z
50
f= 1 0 kH z
40
f= 1 0 0 kH z
30
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
20
10
1.2
1
0.8
0.6
0.4
0.2
0
0
0.1
60
100
2.8
1000
3.8
0
4.8
0.1
100
Fig. 108 Load Response
Fig. 107 Load Response
Fig. 110 Load Response
Fig.109 Load Response
⇔
⇔
Fig. 112 Load Response
Current Pulse=10kHz
Fig. 111 Load Response
Current Pulse=10kHz
www.rohm.com
10
Frequency f [kHz]
Fig. 106 Output Noise Spectrl
Density VS Freq.
Fig. 105 Ripple Rejection VS VIN
© 2011 ROHM Co., Ltd. All rights reserved.
1
Input Voltage VIN[V]
Frequency (kHz)
Fig. 104 Ripple Rejection VS Freq.
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
1.4
16/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU28TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
⇔
⇔
Fig. 113 Load Response
Current Pulse=100kHz
Fig. 115 Start Up Time
Iout = 0mA
Fig. 118 Start Up Time(STBY=VIN)
Iout = 200mA
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 114 Load Response
Current Pulse=100kHz
Fig. 116 Start Up Time
Iout = 200mA
Fig. 119 Discharge Time
Iout = 0mA
17/29
Fig. 117 Start Up Time (STBY=VIN)
Iout = 0mA
Fig.120 VIN Response
Iout = 10mA
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
(Unless otherwise specified, Ta=25℃)
3.05
3.0
3.04
2.5
2.0
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.5
1.0
Temp.=25°C
0.5
0.0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
3.03
3.02
3.01
3.00
2.99
2.98
2.97
Temp.=25°C
VIN=STBY
2.96
VIN=STBY
0
100
IO=0uA
IO=100uA
IO=50mA
IO=200mA
Gnd Current (uA)
3.5
Output Voltage (V)
Output Voltage (V)
●Reference data BU30TA2WNVX / HFV
2.95
5.5
2.9
3
3.1
3.2
3.3
3.4
Temp.=-40°C
Temp.=25°C
Temp.=85°C
20
3.5
0
0.5
1
1.5
2
2.5
110
Temp.=25°C
0.20
Temp.=-40°C
0.15
0.10
VIN=0.98*VOUT
STBY=1.5V
0.05
Temp.=85°C
8
Gnd Current (uA)
STBY Current (uA)
0.25
Temp.=25°C
6
Temp.=-40°C
4
2
0
0
0.05
0.1
0.15
0.2
4.5
5
5.5
Temp.=25°C
100
Temp.=85°C
90
80
Temp=-40°C
70
60
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
0.05
STBY Voltage (V)
0.1
0.15
0.2
Output Current (A)
Fig. 125 STBY Input Current
Fig. 126 IOUT - IGND
3.50
3.05
4
40
0
Output Current (A)
Fig. 124 Dropout Voltage
3.5
50
VIN=STBY
0.00
3
120
10
Temp.=85°C
VIN=STBY
Fig. 123 Circuit Current IGND
0.35
0.30
IO=0uA
Vin Voltage (V)
Fig. 122 Line Regulation
0.40
3.50
VIN=4.0V
3.04
3.00
3.02
3.01
3.00
2.99
2.98
2.97
Temp.=-40°C
VIN=4.0V
STBY=1.5V
2.96
3.00
VIN=5.5V
VIN=4.0V
2.50
VIN=3.5V
2.00
1.50
1.00
Temp.=25°C
STBY=1.5V
0.50
Temp.=85°C
Output Voltage (V)
Output Voltage (V)
Temp.=25°C
3.03
0.00
2.95
0
0.05
0.1
0.15
0.1
0.2
Fig. 127 Load Regulation
0.3
0.4
0.5
0.6
1
1.5
Fig. 129 STBY Threshold
1.000
Input Current (µA)
0.900
3.02
3.01
3.00
2.99
2.98
2.97
0.800
40.00
30.00
20.00
VIN=4.0V
STBY=1.5V
Io=0mA
10.00
2.96
2.95
10
35
60
85
Temp. (°C)
Fig. 130 VOUT vs Temp
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
0.700
0.600
0.500
0.400
VIN=4.0V
STBY=0V
Io=0mA
0.300
0.200
0.100
0.000
-0.100
0.00
-15
0.5
STBY Voltage (V)
50.00
VIN=4.0V
STBY=1.5V
Io=0.1mA
-40
Temp.=85°C
Temp.=25°C
Temp.=-40°C
1.00
0
Fig.128 OCP Threshold
3.05
3.03
1.50
Output Current (A)
Output Current (A)
3.04
2.00
0.00
0
0.2
2.50
0.50
Input Current (µA)
Dropout Voltage (V)
40
Vin Voltage (V)
Fig. 121 Output Voltage
Output Voltage (V)
60
0
Vin Voltage (V)
Output Voltage (V)
80
-40
-15
10
35
60
Temp. (°C)
Fig. 131 IGND vs Temp
18/29
85
-40
-15
10
35
60
85
Temp. (°C)
Fig. 132 IGND vs Temp (STBY)
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU30TA2WNVX / HFV
(Unless otherwise specified, Ta=25℃)
80
80
1.6
O u tpu t N o ise D e n sity [μ V / √ H z]
f= 0 .1 kHz
70
60
Ripple Rejection [dB]
Ripple Re je c tio n (dB )
70
50
40
30
Vin= 4.0V
Io=10mA
Ta = 25℃
20
10
60
f= 1 kH z
50
f= 1 0 kHz
40
30
f= 1 0 0 kHz
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
20
10
0
3
0
0.1
1
10
Frequency (kHz)
100
1000
Fig. 133 Ripple Rejection VS Freq.
4
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
1.4
1.2
1
0.8
0.6
0.4
0.2
0
5
0.1
Input Voltage VIN[V]
Fig. 134 Ripple Rejection VS VIN
Fig. 136 Load Response
1
10
Frequency f [kHz]
Fig. 135 Output Noise Spectrl
Density VS Freq.
Fig. 137 Load Response
Fig. 138 Load Response
Fig. 139 Load Response
Fig. 140 Load Response
Current Pulse=10kHz
Fig. 141 Load Response
Current Pulse=10kHz
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
100
19/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU30TA2WNVX / HFV
(Unless otherwise specified, Ta=25℃)
Fig. 142 Load Response
Current Pulse=100kHz
Fig. 144 Start Up Time
Iout = 0mA
Fig. 147 Start Up Time(STBY=VIN)
Iout = 200mA
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 143 Load Response
Current Pulse=100kHz
Fig. 145 Start Up Time
Iout = 200mA
Fig. 148 Discharge Time
Iout = 0mA
20/29
Fig. 146 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 149 VIN Response
Iout = 10mA
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU33TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
3.5
3.34
2.5
2.0
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.5
1.0
0.5
Temp.=25°C
VIN = STBY
IO=0uA
IO=100uA
IO=50mA
IO=200mA
3.33
3.32
3.31
3.30
3.29
3.28
3.27
Temp=25°C
VIN = STBY
3.26
0.0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
3.2
3.3
3.4
Vin Voltage (V)
3.5
40
Temp.=-40°C
Temp.=25°C
Temp.=85°C
20
0
3.7
0.5
1
1.5
2
2.5
0.15
Temp.=-40°C
0.10
VIN=0.98 x VOUT
STBY = 1.5V
0.05
Temp.=85°C
8
Gnd Current (uA)
STBY Current (uA)
Temp.=25°C
0.20
Temp.=25°C
6
Temp.=-40°C
4
2
0
0.05
0.1
0.15
0.2
3.34
3.32
Temp.=25°C
Output Voltage (V)
3.33
Temp.=-40°C
3.31
3.30
3.29
3.28
Temp.=85°C
3.27
VIN = 4.3V
STBY = 1.5V
3.26
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0.05
0.1
Temp.=-40°C
80
70
60
VIN = 4.3V
STBY = 1.5V
0
5.5
0.05
0.15
3.50
3.00
VIN=3.8V
2.50
VIN=4.3V
2.00
1.50
1.00
STBY = 1.5V
2.50
2.00
1.50
Temp.=85°C
Temp.=25°C
Temp.=-40°C
1.00
0.00
0.1
0.2
0.3
0.4
0.5
0.6
0
0.5
Output Current (A)
Output Current (A)
Fig. 156 Load Regulation
1
1.5
STBY Voltage (V)
Fig. 158 STBY Threshold
Fig. 157 OCP Threshold
3.35
0.2
VIN=4.3V
0.50
Temp=25℃
0
0.2
0.15
Fig. 155 IOUT - IGND
3.00
VIN=5.5V
0.1
Output Current (A)
0.00
0
90
3.50
0.50
3.25
5.5
Temp.=85°C
Fig. 154 STBY Input Current
3.35
5
Temp.=25°C
V STBY Voltage (V)
Fig. 153 Dropout Voltage
4.5
40
0
Output Current (A)
Output Voltage (V)
0
4
100
50
VIN = STBY
0.00
3.5
120
110
Temp.=85°C
3
Fig. 152 Circuit Current IGND
10
0.30
0.25
IO=0uA
VIN = STBY
Vin Voltage (V)
Fig. 151 Line Regulation
0.35
50.00
1.000
3.34
0.900
3.32
3.31
3.30
3.29
3.28
VIN=4.3V
STBY=1.5V
Io=0.1mA
3.27
3.26
0.800
40.00
30.00
20.00
VIN=4.3V
STBY=1.5V
Io=0mA
10.00
3.25
Gnd Current (uA)
3.33
Gnd Current (uA)
Output Voltage (V)
60
Vin Voltage (V)
Fig. 150 Output Voltage
Dropout Voltage (V)
3.6
80
0
3.25
0
Output Voltage (V)
Gnd Current (uA)
Output Voltage (V)
Output Voltage (V)
100
3.35
3.0
-15
10
35
60
85
Temp. (°C)
Fig. 159 VOUT vs Temp
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
0.600
0.500
0.400
0.300
VIN=4.3V
STBY=0V
0.200
0.100
0.000
0.00
-40
0.700
-0.100
-40
-15
10
35
60
Temp. (°C)
Fig. 160 IGND vs Temp
21/29
85
-40
-15
10
35
60
85
Temp. (°C)
Fig. 161 IGND vs Temp (STBY)
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU33TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
80
1.8
80
50
40
30
Vin= 4.3V
Io=10mA
Ta = 25℃
20
10
60
O u tpu t N o ise D e n sity [μ V / √ H z ]
f= 1 kHz
70
60
Ripple Rejection [dB]
R ipple R e je c tio n (dB )
70
f= 0 .1 kHz
50
f= 1 0 kHz
40
30
f= 1 0 0 kHz
20
10
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
0
0
3.3
0.1
1
10
100
1000
1.2
1
0.8
0.6
0.4
0.2
0.1
Fig. 163 Ripple Rejection VS VIN
Fig. 165 Load Response
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
1.4
0
5.3
Input Voltage VIN[V]
Frequency (kHz)
Fig. 162 Ripple Rejection VS Freq.
4.3
1.6
1
10
Frequency f [kHz]
Fig. 164 Output Noise Spectrl
Density VS Freq.
Fig. 166 Load Response
Fig. 167 Load Response
Fig. 168 Load Response
Fig. 169 Load Response
Current Pulse=10kHz
Fig. 170 Load Response
Current Pulse=10kHz
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
100
22/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU33TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 172 Load Response
Current Pulse=100kHz
Fig. 171 Load Response
Current Pulse=100kHz
Fig. 173 Start Up Time
Iout = 0mA
Fig. 174 Start Up Time
Iout = 200mA
Fig. 176 Start Up Time(STBY=VIN)
Iout = 200mA
Fig. 177 Discharge Time
Iout = 0mA
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
23/29
Fig. 175 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 178 VIN Response
Iout = 10mA
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original
IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be
sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
Measurement conditions
Evaluation Board 1
(Single-side Board)
Evaluation Board 2
(Double-side Board)
40
40
20
20
40 20
40 20
Layout of Board for
Measurement
(Unit: mm)
Top Layer (Top View)
Top Layer (Top View)
40
40
20
IC Implementation Position
40
40 20
Bottom Layer (Top View)
Bottom Layer (Top View)
Measurement State
With board implemented (Wind speed 0 m/s)
With board implemented (Wind speed 0 m/s)
Board Material
Glass epoxy resin (Single-side board)
Glass epoxy resin (Double-side board)
Board Size
40 mm x 40 mm x 0.8 mm
40 mm x 40 mm x 0.8 mm
Top layer
Metal (GND) wiring rate: Approx. 25%
Metal (GND) wiring rate: Approx. 25%
Bottom layer
Metal (GND) wiring rate: Approx 0%
Metal (GND) wiring rate: Approx 25%
Through Hole
0 holes
Diameter 0.5 mm  12 holes
Power Dissipation
1100 mW
1250 mW
Thermal Resistance
θja=91℃/W
θja=80℃/W
Wiring Rate
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
24/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
○SSON004X1216
1500
1250 mW
* Please design the margin so that PMAX becomes is than Pd
(PMAXPd) within the usage temperature range.
Evaluation board 2
(Double-side board)
1000
Pd (mW)
1100 mW
- Standard ROHM board Size: 70 mm  70 mm  1.6 mm
Material: Glass epoxy board
Evaluation board 1
(Single-side board)
500
Standard ROHM board
220 mW
0
0
25
50
75
100
125
Ta ( ℃)
Fig.179 SSON004X1216
Power dissipation heat reduction characteristics
(Reference)
Pd（W)
○HVSOF5
* Please design the margin so that PMAX
becomes is than Pd (PMAXPd) within
the usage temperature range.
Fig.180 HVSOF5
Power dissipation heat reduction characteristics
(Reference)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
25/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●DEVICE TYPE & Mark
○HVSOF5
○SSON004X1216
Device type:
BUXXTA2WNVX
Device type:
BUXXTA2WHFV
a
a
a
package
XX
output
voltage
SSON004X1216
HVSOF5
15
1.5V typ.
AA
BA
18
1.8V typ.
AB
BB
25
2.5V typ.
AC
BD
26
2.6V typ.
AD
BE
27
2.7V typ.
AE
BF
28
2.8V typ.
AF
BG
2J
2.85V typ.
AG
BH
29
2.9V typ.
AH
BJ
30
3.0V typ.
AJ
BK
31
3.1V typ.
AK
BL
32
3.2V typ.
AL
BM
33
3.3V typ.
AM
BN
34
3.4V typ.
AN
BP
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
26/29
2011.01 - Rev.C
BUTA2WNVX series, BUTA2WHFV series
Technical Note
○SSON004X1216
Mark
Lot No.
○HVSOF5
Mark
Lot No.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
27/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Notes for use
・About absolute maximum rating
Breakage may occur when absolute maximum ratings such as applied voltage and operating temperature range are
exceeded. Short mode or open mode cannot be specified at occurrence of a break, so please prepare physical safety
measures (e.g., fuse) if such special mode in which the absolute maximum rating is exceeded can be assumed.
・About GND potential
Please be sure that the potential of the GND terminal is the lowest in any operating condition.
・About thermal design
Please provide thermal design with sufficient margin, taking power dissipation (Pd) in actual usage conditions into
consideration.
・About short between pins and misattachment
Please be careful regarding the IC direction and misalignment at attachment onto a printed circuit board. Misattachment
may cause a break of IC. Short caused by foreign matter between outputs, output and power supply, or GNDs may also
lead to a break.
・About operation in a strong electromagnetic field
Please note that usage in a strong electromagnetic field may cause malfunction.
・About common impedance
Please give due consideration to wiring of the power source and GND by reducing common-mode ripple or making ripple
as small as possible (e.g., making the wiring as thick and short as possible, or reducing ripple by LC), etc.
・About STBY terminal voltage
Set STBY terminal voltage to 0.3 V or less to put each channel into a standby state and to 1.5 V or more to put each
channel into an operating state. Do not fix STBY terminal voltage to 0.3 V or more and 1.5 V or less or do not lengthen
the transition time. This may cause malfunction or failure. When shorting the VIN terminal and STBY terminal for usage,
the status will be “STBY=VIN＝LOW” at turning the power OFF, and discharge of the VOUT terminal cannot operate,
which means voltage may remain for a certain time in the VOUT terminal. Since turning the power ON again in this state
may cause overshoot, turn the power ON for use after the VOUT terminal is completely discharged.
・About overcurrent protection circuit
Output has a built-in overcurrent protection circuit, which prevents IC break at load short. Note that this protection circuit
is effective for prevention of breaks due to unexpected accidents. Please avoid usage by which the protection circuit
operates continuously.
・About thermal shutdown
Output is OFF when the thermal circuit operates since a temperature protection circuit is built in to prevent thermal
breakdown. However, it recovers when the temperature returns to a certain temperature. The thermal circuit operates at
emergency such as overheating of IC. Since it is prepared to prevent IC breakdown, please do not use it in a state in
which protection works.
●About reverse current
For applications on which reverse current is assumed to flow into IC,
it is recommended to prepare a path to let the current out by putting
a bypass diode between the VIN-VOUT terminals.
Reverse current
VIN
STBY
OUT
GND
Fig.181 Example of bypass diode connection
●About testing on a set board
When connecting a capacitor to a terminal with low impedance for testing on a set board, please be sure to discharge for
each process since IC may be stressed. As a countermeasure against static electricity, prepare grounding in the assembly
process and take sufficient care in transportation and storage. In addition, when connecting a capacitor to a jig in a testing
process, please do so after turning the power OFF and remove it after turning the power OFF.
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
28/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Ordering part number
B
U
1
5
T
Lineup
Output voltage
Part No.
A
15: 1.5V 29: 2.9V
18: 1.8V 30: 3.0V
25: 2.5V 31: 3.1V
26: 2.6V 32: 3.2V
27: 2.7V 33: 3.3V
28: 2.8V 34: 3.4V
2J: 2.85V
2
W
N
Shutdown Swich
W : Includes
switch
V
X
-
Package
NVX : SSON004X1216
HFV : HVSOF5
T
R
Packaging and forming specification
TR: Embossed tape and reel
SSON004X1216
<Tape and Reel information>
1.6 ± 0.1
1.2±0.1
Tape
Embossed carrier tape
Quantity
5000pcs
Direction
of feed
0.6MAX
1PIN MARK
1
2
4
3
+0.03
0.02 -0.02
0.65±0.1
)
0.8 ± 0.1
0.2 ± 0.1
0.08 S
+0.05
0.2 -0.04
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
(0.12)
S
TR
Direction of feed
1pin
0.75±0.1
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
HVSOF5
<Tape and Reel information>
4
Embossed carrier tape
(0.3)
Quantity
3000pcs
(0.91)
4
0.2MAX
(0.05)
5
Tape
5
(0.41)
1.6±0.05
1.0±0.05
(0.8)
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
3 2 1
1 2 3
1pin
0.13±0.05
S
+0.03
0.02 –0.02
0.6MAX
1.2±0.05
(MAX 1.28 include BURR)
1.6±0.05
0.1
S
0.5
0.22±0.05
0.08
Direction of feed
M
Reel
(Unit : mm)
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
29/29
∗ Order quantity needs to be multiple of the minimum quantity.
2011.01 - Rev.C
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
R1120A