Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered. CY74FCT163244 CY74FCT163H244 16-Bit Buffers/Line Drivers SCCS046 - December 1996 - Revised March 2000 Features • Low power, pin-compatible replacement for LCX and LPT families • 5V tolerant inputs and outputs • 24 mA balanced drive outputs • Power-off disable outputs permits live insertion • Edge-rate control circuitry for reduced noise • FCT-C speed at 4.1 ns • Latch-up performance exceeds JEDEC standard no. 17 • Typical output skew < 250 ps • Industrial temperature range of –40˚C to +85˚C • TSSOP (19.6-mil pitch) or SSOP (25-mil pitch) • Typical Volp (ground bounce) performance exceeds Mil Std 883D • VCC = 2.7V to 3.6V • ESD (HBM) > 2000V CY74FCT163H244 • Bus hold on data inputs • Eliminates the need for external pull-up or pull-down resistors • Devices with bus hold are not recommended for translating rail-to-rail CMOS signals to 3.3V logic levels Functional Description These 16-bit buffers/line drivers are designed for use in memory driver, clock driver, or other bus interface applications, where high-speed and low power are required. The three-state controls are designed to allow 4-bit, 8-bit or combined 16-bit operation. Flow-through pinout and small shrink packaging simplifies board layout. The CY74FCT163244 has 24-mA balanced output drivers with current limiting resistors in the outputs. The CY74FCT163H244 has “bus hold” on the data inputs, which retains the last state of the input whenever the source driving the input goes to high impedance. This eliminates the need for pull-up/down resistors and prevents floating inputs. Pin Configuration Logic Block Diagrams CY74FCT163244, CY74FCT163H244 3OE 1OE 1A1 1A2 SSOP/TSSOP Top View 1Y1 1Y2 3A1 3A2 3Y1 3Y2 1OE 1 48 1Y1 2 47 1A1 1Y2 3 46 1A2 GND 4 45 GND 1Y3 5 1Y4 1A3 1A4 1Y3 1Y4 2A2 2A3 2A4 3A4 3Y3 2Y1 4A1 2Y2 4A2 2Y3 4A3 2Y4 4A4 VCC 2Y1 2Y2 3Y4 4OE 2OE 2A1 3A3 4Y1 4Y2 4Y3 4Y4 Copyright 44 163244 6 163H244 43 42 7 8 41 2OE 1A3 1A4 VCC 2A1 9 40 2A2 GND 10 39 GND 2Y3 11 38 2A3 2Y4 37 36 2A4 3Y1 12 13 3Y2 14 35 3A2 GND 15 34 GND 3Y3 16 33 3A3 3Y4 17 32 3A4 VCC 4Y1 18 31 19 30 VCC 4A1 3A1 4Y2 20 29 4A2 GND 21 28 GND 4Y3 22 27 4A3 4Y4 23 26 4A4 4OE 24 25 3OE © 2000, Texas Instruments Incorporated CY74FCT163244 CY74FCT163H244 Maximum Ratings[3,4] Pin Description Name Description OE Three-State Output Enable Inputs (Active LOW) A Y (Above which the useful life may be impaired. For user guidelines, not tested.) Data Inputs[1] Storage Temperature ................................. –55°C to +125°C Three-State Outputs Ambient Temperature with Power Applied............................................ –55°C to +125°C Supply Voltage Range ..................................... 0.5V to +4.6V Function Table[2] Inputs DC Input Voltage ........................................... –0.5V to +7.0V Outputs DC Output Voltage......................................... –0.5V to +7.0V OE A Y L L L DC Output Current (Maximum Sink Current/Pin) ........................–60 to +120 mA L H H Power Dissipation .......................................................... 1.0W H X Z Operating Range Range Industrial Ambient Temperature VCC –40°C to +85°C 2.7V to 3.6V Electrical Characteristics for Non Bus Hold Devices Over the Operating Range VCC=2.7V to 3.6V Parameter Description Test Conditions VIH Input HIGH Voltage All Inputs VIL Input LOW Voltage VH Input Hysteresis[6] VIK Input Clamp Diode Voltage VCC=Min., IIN=–18 mA IIH Input HIGH Current IIL Min. Typ.[5] 2.0 Max. Unit 5.5 V 0.8 V 100 –0.7 mV – 1.2 V VCC=Max., VI=5.5 ±1 µA Input LOW Current VCC=Max., VI=GND ±1 µA IOZH High Impedance Output Current (Three-State Output pins) VCC=Max., VOUT=5.5V ±1 µA IOZL High Impedance Output Current (Three-State Output pins) VCC=Max., VOUT=GND ±1 µA IOS Short Circuit Current[7] VCC=Max., VOUT=GND –240 mA IOFF Power-Off Disable VCC=0V, VOUT≤4.5V ±100 µA ICC Quiescent Power Supply Current VIN≤0.2V, VIN>VCC–0.2V VCC=Max. 0.1 10 µA ∆ICC Quiescent Power Supply Current (TTL inputs HIGH) VIN=VCC–0.6V[8] VCC=Max. 2.0 30 µA –60 –135 Notes: 1. On the CY74FCT163H244, these pins have “bus hold.” 2. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Impedance. 3. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature range. 4. With the exception of inputs with bus hold, unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground. 5. Typical values are at VCC=3.3V, TA = +25˚C ambient. 6. This parameter is specified but not tested. 7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. 8. Per TTL driven input; all other inputs at VCC or GND. 2 CY74FCT163244 CY74FCT163H244 Electrical Characteristics For Bus Hold Devices Over the Operating Range VCC=2.7V to 3.6V Parameter Description VIH Input HIGH Voltage VIL Input LOW Voltage Test Conditions All Inputs Min. Typ.[5] 2.0 [6] VH Input Hysteresis VIK Input Clamp Diode Voltage VCC=Min., IIN=–18 mA IIH Input HIGH Current VCC=Max., VI=VCC IIL Input LOW Current IBBH IBBL Bus Hold Sustain Current on Bus Hold Input[9] VCC=Min. IBHHO IBHLO Bus Hold Overdrive Current on Bus Hold Input[9] VCC=Max., VI=1.5V IOZH High Impedance Output Current (Three-State Output pins) IOZL Max. Unit VCC V 0.8 V 100 –0.7 mV –1.2 V ±100 µA ±100 µA VI=2.0V –50 µA VI=0.8V +50 µA ±500 µA VCC=Max., VOUT=VCC ±1 µA High Impedance Output Current (Three-State Output pins) VCC=Max., VOUT=GND ±1 µA IOS Short Circuit Current[7] VCC=Max., VOUT=GND –240 mA IOFF Power-Off Disable VCC=0V, VOUT≤4.5V ±100 µA ICC Quiescent Power Supply Current VIN≤0.2V, VIN>VCC–0.2V VCC=Max. +40 µA ∆ICC Quiescent Power supply Current (TTL inputs HIGH) VIN=VCC–0.6V[8] VCC=Max. +350 µA –60 –135 Electrical Characteristics For Balanced Drive Devices Over the Operating Range VCC=2.7V to 3.6V Parameter Max. Unit IODL Output LOW Dynamic VCC=3.3V, VIN=VIH or VIL, VOUT=1.5V 45 180 mA IODH Output HIGH Dynamic Current[7] VCC=3.3V, VIN=VIH or VIL, VOUT=1.5V –45 –180 mA VOH Output HIGH Voltage VCC=Min., IOH= –0.1 mA Output LOW Voltage Test Conditions Min. Typ.[5] Current[7] VOL Description VCC–0.2 V VCC=3.0V, IOH= –8 mA 2.4[10] 3.0 VCC=3.0V, IOH= –24 mA 2.0 3.0 VCC=Min., IOL= 0.1mA VCC=Min., IOL= 24 mA Notes: 9. Pins with bus hold are described in Pin Description. 10. VOH = VCC – 0.6V at rated current. 3 V V 0.2 0.3 0.55 V CY74FCT163244 CY74FCT163H244 Capacitance[6](TA = +25˚C, f = 1.0 MHz) Parameter Description Test Conditions Typ.[5] Max. Unit CIN Input Capacitance VIN = 0V 4.5 6.0 pF COUT Output Capacitance VOUT = 0V 5.5 8.0 pF Typ.[5] Max. Unit Power Supply Characteristics Parameter Description Test Conditions ICCD Dynamic Power Supply Current[10] VCC=Max., One Input Toggling, VIN=VCC or 50% Duty Cycle, VIN=GND Outputs Open, OE=GND 50 75 µA/MHz IC Total Power Supply Current[11] VCC=Max., f1=10 MHz, 50% VIN=VCC or Duty Cycle, Outputs Open, One VIN=GND Bit Toggling, OE=GND VIN=VCC–0.6V or VIN=GND 0.5 0.8 mA 0.5 0.8 mA VCC=Max., f1=2.5 MHz, 50% VIN=VCC or Duty Cycle, Outputs Open, Six- VIN=GND teen Bits Toggling, OE=GND VIN=VCC–0.6V or VIN=GND 2.0 3.0[12] mA 2.0 3.3[12] mA Notes: 11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations. 12. IC = IQUIESCENT + IINPUTS + IDYNAMIC IC = ICC+∆ICCDHNT+ICCD(f0/2 + f1N1) ICC = Quiescent Current with CMOS input levels ∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V) DH = Duty Cycle for TTL inputs HIGH NT = Number of TTL inputs at DH ICCD = Dynamic Current caused by an input transition pair (HLH or LHL) = Clock frequency for registered devices, otherwise zero f0 = Input signal frequency f1 N1 = Number of inputs changing at f1 All currents are in milliamps and all frequencies are in megahertz. 13. Values for these conditions are examples of the ICC formula. These limits are specified but not tested. 4 CY74FCT163244 CY74FCT163H244 Switching Characteristics Over the Operating Range VCC=3.0V to 3.6V[14,15] CY74FCT163244A CY74FCT163H244A CY74FCT163244C CY74FCT163H244C Description Min. Max. Min. Max. Unit Fig. No.[16] tPLH tPHL Propagation Delay Data to Output 1.5 4.8 1.5 4.1 ns 1, 3 tPZH tPZL Output Enable Time 1.5 6.2 1.5 5.8 ns 1, 7, 8 tPHZ tPLZ Output Disable Time 1.5 5.6 1.5 5.2 ns 1, 7, 8 tSK(O) Output Skew[17] 0.5 ns — Parameter 0.5 Notes: 14. Minimum limits are specified but not tested on Propagation Delays. 15. For VCC =2.7, propagation delay, output enable and output disable times should be degraded by 20%. 16. See “Parameter Measurement Information” in the General Information section. 17. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design. Ordering Information CY74FCT163244 Speed (ns) 4.1 4.8 Ordering Code Package Name Package Type CY74FCT163244CPACT Z48 48-Lead (240-Mil) TSSOP CY74FCT163244CPVC/PVCT O48 48-Lead (300-Mil) SSOP CY74FCT163244APACT Z48 48-Lead (240-Mil) TSSOP CY74FCT163244APVC/PVCT O48 48-Lead (300-Mil) SSOP Operating Range Industrial Industrial Ordering Information CY74FCT163H244 Speed (ns) 4.1 Ordering Code Package Name Package Type 74FCT163H244CPACT Z48 48-Lead (240-Mil) TSSOP CY74FCT163H244CPVC O48 48-Lead (300-Mil) SSOP 74FCT163H244CPVCT O48 48-Lead (300-Mil) SSOP 5 Operating Range Industrial CY74FCT163244 CY74FCT163H244 Package Diagrams 48-Lead Shrunk Small Outline Package O48 48-Lead Thin Shrunk Small Outline Package Z48 6 PACKAGE OPTION ADDENDUM www.ti.com 30-Mar-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74FCT163H244CPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI 74FCT163H244CPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI Lead/Ball Finish MSL Peak Temp (3) CY74FCT163244APAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT163244APACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT163244APVC OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT163244APVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT163244CPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT163244CPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT163244CPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT163244CPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI CY74FCT163H244CPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI CY74FCT163H244CPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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