MAX3223E www.ti.com.......................................................................................................................................... SLLS707A – JANUARY 2006 – REVISED SEPTEMBER 2009 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION Check for Samples: MAX3223E FEATURES 1 • • • • • • • • • ESD Protection for RS-232 Bus Pins – ±15-kV Human-Body Model (HBM) – ±8-kV IEC61000-4-2, Contact Discharge – ±15-kV IEC61000-4-2, Air-Gap Discharge Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V VCC Supply Operates up to 500 kbit/s Two Drivers and Two Receivers Low Standby Current . . . 1 μA Typ External Capacitors . . . 4 × 0.1 μF Accepts 5-V Logic Input With 3.3-V Supply Alternative High-Speed Pin-Compatible Device (1 Mbit/s) for SNx5C3223E DB, DW, OR PW PACKAGE (TOP VIEW) EN C1+ V+ C1− C2+ C2− V− DOUT2 RIN2 ROUT2 1 20 2 19 3 18 4 17 5 16 6 7 15 14 8 13 9 12 10 11 FORCEOFF VCC GND DOUT1 RIN1 ROUT1 FORCEON DIN1 DIN2 INVALID APPLICATIONS • • • • • • Battery-Powered Systems PDAs Notebooks Laptops Palmtop PCs Hand-Held Equipment DESCRIPTION/ORDERING INFORMATION The MAX3223E consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The device operates at typical data signaling rates up to 500 kbit/s and a maximum of 30-V/μs driver output slew rate. Flexible control options for power management are available when the serial port is inactive. The auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is set low and EN is high, both drivers and receivers are shut off, and the supply current is reduced to 1 mA. Disconnecting the serial port or turning off the peripheral drivers causes auto-powerdown to occur. Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown enabled, the device is activated automatically when a valid signal is applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less than 30 μs. INVALID is low (invalid data) if the receiver input voltage is between –0.3 V and 0.3 V for more than 30 μs. Refer to Figure 4 for receiver input levels. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2009, Texas Instruments Incorporated MAX3223E SLLS707A – JANUARY 2006 – REVISED SEPTEMBER 2009.......................................................................................................................................... www.ti.com Table 1. ORDERING INFORMATION TA PACKAGE SOIC – DW –0°C to 70°C SSOP – DB TSSOP – PW SOIC – DW –40°C to 85°C SSOP – DB TSSOP – PW (1) (2) 2 (1) (2) ORDERABLE PART NUMBER Tube of 25 MAX3223ECDW Reel of 2000 MAX3223ECDWR Tube of 70 MAX3223ECDB Reel of 2000 MAX3223ECDBR Tube of 70 MAX3223ECPW Reel of 2000 MAX3223ECPWR Tube of 25 MAX3223EIDW Reel of 2000 MAX3223EIDWR Tube of 70 MAX3223EIDB Reel of 2000 MAX3223EIDBR Tube of 70 MAX3223EIPW Reel of 2000 MAX3223EIPWR TOP-SIDE MARKING MAX3223EC MP223EC MP223EC MAX3223EI MP223EI MP223EI Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3223E MAX3223E www.ti.com.......................................................................................................................................... SLLS707A – JANUARY 2006 – REVISED SEPTEMBER 2009 FUNCTION TABLES ABC EACH DRIVER (1) INPUTS DIN (1) FORCEON FORCEOFF VALID RIN RS-232 LEVEL OUTPUT DOUT DRIVER STATUS X X L X Z Powered off L H H X H H H H X L Normal operation with auto-powerdown disabled L L H Yes H H L H Yes L L L H No Z H L H No Z Normal operation with auto-powerdown enabled Powered off by auto-powerdown feature H = high level, L = low level, X = irrelevant, Z = high impedance EACH RECEIVER (1) INPUTS (1) OUTPUT DOUT RIN EN VALID RIN RS-232 LEVEL L L X H L X L X H X Z Open L No H H H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3223E 3 MAX3223E SLLS707A – JANUARY 2006 – REVISED SEPTEMBER 2009.......................................................................................................................................... www.ti.com LOGIC DIAGRAM (POSITIVE LOGIC) DIN1 DIN2 13 17 12 8 20 FORCEOFF DOUT2 11 Powerdown 14 FORCEON DOUT1 INVALID 1 EN ROUT1 ROUT2 15 16 10 9 RIN1 RIN2 Pin numbers are for the DB, DW, and PW packages. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range –0.3 6 V V+ Positive-output supply voltage range (2) –0.3 7 V V– Negative-output supply voltage range (2) 0.3 –7 V 13 V V+ – V– Supply voltage difference (2) VI Input voltage range VO Output voltage range θJA Package thermal impedance (3) TJ Operating virtual junction temperature Tstg Storage temperature range Driver (FORCEOFF, FORCEON, EN) –0.3 6 Receiver –25 25 –13.2 13.2 –0.3 VCC + 0.3 Driver Receiver (INVALID) (4) DB package 70 DW package 58 PW package (1) (2) (3) (4) 4 V V °C/W 83 –65 150 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3223E MAX3223E www.ti.com.......................................................................................................................................... SLLS707A – JANUARY 2006 – REVISED SEPTEMBER 2009 RECOMMENDED OPERATING CONDITIONS (1) See Figure 6 VCC = 3.3 V Supply voltage VCC = 5 V VIH Driver and control high-level input voltage DIN, EN, FORCEOFF, FORCEON VIL Driver and control low-level input voltage DIN, EN, FORCEOFF, FORCEON Driver and control input voltage DIN, EN, FORCEOFF, FORCEON VI TA (1) VCC = 3.3 V VCC = 5 V Receiver input voltage MAX3223EC Operating free-air temperature MAX3223EI MIN NOM MAX 3 3.3 3.6 4.5 5 5.5 UNIT V 2 V 2.4 0.8 V 0 5.5 V –25 25 V 0 70 –40 85 °C Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. ELECTRICAL CHARACTERISTICS (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER II ICC (1) (2) Input leakage current Supply current TEST CONDITIONS MIN EN, FORCEOFF, FORCEON (2) MAX ±0.01 ±1 μA 0.3 1 mA TYP Auto-powerdown disabled VCC = 3.3 V or 5 V, TA = 25°C, No load, FORCEOFF and FORCEON at VCC Powered off No load, FORCEOFF at GND 1 10 Auto-powerdown enabled No load, FORCEOFF at VCC, FORCEON at GND, All RIN are open or grounded 1 10 UNIT μA Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3223E 5 MAX3223E SLLS707A – JANUARY 2006 – REVISED SEPTEMBER 2009.......................................................................................................................................... www.ti.com DRIVER SECTION Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER TEST CONDITIONS MIN (2) TYP MAX UNIT VOH High-level output voltage DOUT at RL = 3 kΩ to GND 5 5.4 V VOL Low-level output voltage DOUT at RL = 3 kΩ to GND –5 –5.4 V IIH High-level input current VI = VCC ±0.01 ±1 μA IIL Low-level input current VI at GND ±0.01 ±1 μA ±35 ±60 mA IOS Short-circuit output current (3) ro Output resistance IOZ (1) (2) (3) VCC = 3.6 V, VO = 0 V VCC = 5.5 V, VO = 0 V VCC, V+, and V– = 0 V, VO = ±2 V Output leakage current 300 Ω 10M FORCEOFF = GND, VCC = 3 V to 3.6 V, VO = ±12 V ±25 FORCEOFF = GND, VCC = 4.5 V to 5.5 V, VO = ±12 V ±25 μA Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER TEST CONDITIONS MIN TYP (2) MAX Maximum data rate CL = 1000 pF, One DOUT switching, RL = 3 kΩ, See Figure 1 tsk(p) Pulse skew (3) CL = 150 pF to 2500 pF, See Figure 2 RL = 3 kΩ to 7 kΩ, SR(tr) Slew rate, transition region (See Figure 1) RL = 3 kΩ to 7 kΩ, VCC = 3.3 V CL = 150 pF to 1000 pF 6 30 CL = 150 pF to 2500 pF 4 30 (1) (2) (3) 250 UNIT 500 kbit/s 100 ns V/μs Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. ESD Protection TYP Driver outputs (DOUTx) 6 Human-Body Model (HBM) ±15 IEC61000-4-2, Air-Gap Discharge ±15 IEC61000-4-2, Contact Discharge ±8 Submit Documentation Feedback UNIT kV Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3223E MAX3223E www.ti.com.......................................................................................................................................... SLLS707A – JANUARY 2006 – REVISED SEPTEMBER 2009 RECEIVER SECTION Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6) PARAMETER TEST CONDITIONS VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOL = 1.6 mA VIT+ Positive-going input threshold voltage VIT– Negative-going input threshold voltage Vhys Input hysteresis (VIT+ – VIT–) IOZ Output leakage current EN = VCC ri Input resistance VI = ±3 V to ±25 V (1) (2) MIN VCC – 0.6 TYP (2) MAX VCC – 0.1 V 0.4 VCC = 3.3 V 1.6 2.4 VCC = 5 V 1.9 2.4 VCC = 3.3 V 0.6 1.1 VCC = 5 V 0.6 1.4 UNIT V V V 0.5 V ±0.05 μA 5 kΩ 3 Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS TYP (2) UNIT tPLH Propagation delay time, low- to high-level output CL = 150 pF, See Figure 3 150 ns tPHL Propagation delay time, high- to low-level output CL = 150 pF, See Figure 3 150 ns ten Output enable time CL = 150 pF, RL = 3 kΩ, See Figure 4 200 ns tdis Output disable time CL = 150 pF, RL = 3 kΩ, See Figure 4 200 ns tsk(p) Pulse skew (3) See Figure 3 50 ns (1) (2) (3) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. ESD Protection TYP Receiver inputs (RINx) Human-Body Model (HBM) ±15 IEC61000-4-2, Air-Gap Discharge ±15 IEC61000-4-2, Contact Discharge ±8 Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3223E UNIT kV 7 MAX3223E SLLS707A – JANUARY 2006 – REVISED SEPTEMBER 2009.......................................................................................................................................... www.ti.com AUTO-POWERDOWN SECTION Electrical Characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER TEST CONDITIONS MIN VT+(valid) Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC VT(valid) Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC –2.7 VT(invalid) Receiver input threshold for INVALID low-level output voltage FORCEON = GND, FORCEOFF = VCC –0.3 VOH INVALID high-level output voltage IOH = 1 mA, FORCEOFF = VCC FORCEON = GND, VOL INVALID low-level output voltage IOL = 1.6 mA, FORCEOFF = VCC FORCEON = GND, MAX 2.7 UNIT V V 0.3 VCC – 0.6 V V 0.4 V Switching Characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (seeFigure 5) PARAMETER TYP (1) UNIT tvalid Propagation delay time, low- to high-level output 1 μs tinvalid Propagation delay time, high- to low-level output 30 μs ten Supply enable time 100 μs (1) 8 All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3223E MAX3223E www.ti.com.......................................................................................................................................... SLLS707A – JANUARY 2006 – REVISED SEPTEMBER 2009 PARAMETER MEASUREMENT INFORMATION A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V CL (see Note A) tTHL 3V FORCEOFF tTLH VOH 3V 3V Output −3 V −3 V VOL TEST CIRCUIT VOLTAGE WAVEFORMS SR(tr) + t THL 6V or t TLH C. CL includes probe and jig capacitance. D. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. 3V Generator (see Note B) RS-232 Output 50 Ω RL Input 1.5 V 1.5 V 0V CL (see Note A) tPLH tPHL VOH 3V FORCEOFF 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS E. CL includes probe and jig capacitance. F. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. EN 0V 3V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) 50 Ω tPHL CL (see Note A) tPLH VOH Output 50% 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS G. CL includes probe and jig capacitance. H. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3223E 9 MAX3223E SLLS707A – JANUARY 2006 – REVISED SEPTEMBER 2009.......................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) VCC GND S1 RL 3 V or 0 V Output CL (see Note A) EN 3V Input 1.5 V 0V tPZH (S1 at GND) tPHZ (S1 at GND) VOH Output 50% 0.3 V Generator (see Note B) 1.5 V 50 Ω 0.3 V tPLZ (S1 at VCC) Output 50% VOL tPZL (S1 at VCC) TEST CIRCUIT VOLTAGE WAVEFORMS 10 I. CL includes probe and jig capacitance. J. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3223E MAX3223E www.ti.com.......................................................................................................................................... SLLS707A – JANUARY 2006 – REVISED SEPTEMBER 2009 PARAMETER MEASUREMENT INFORMATION (continued) 2.7 V 2.7 V EN 0V Receiver Input 0V 50 Ω VCC INVALID Output 50% V CC 0V ten ≈V+ V+ 0.3 V VCC 0V 0.3 V Supply Voltages FORCEOFF FORCEON 50% V CC INVALID CL = 30 pF (see Note A) DIN DOUT ≈V− V− TEST CIRCUIT −3 V tvalid tinvalid Autopowerdown 2.7 V −2.7 V ROUT Generator (see Note B) 3V ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ VOLTAGE WAVEFORMS Valid RS-232 Level, INVALID High 2.7 V Indeterminate 0.3 V If Signal Remains Within This Region for More Than 30 ms, INVALID Is Low † 0V 0.3 V Indeterminate 2.7 V Valid RS-232 Level, INVALID High † Auto-powerdown disables drivers reduces supply current to 1 µA and Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3223E 11 MAX3223E SLLS707A – JANUARY 2006 – REVISED SEPTEMBER 2009.......................................................................................................................................... www.ti.com APPLICATION INFORMATION 1 EN 2 20 Autopowerdown VCC C1+ FORCEOFF 19 CBYPASS + 3 C1 V+ GND 18 = 0.1mF C3 † 4 5 17 C1 16 C2+ DOUT1 RIN1 + C2 6 15 C2 ROUT1 5 kΩ 7 C4 DOUT2 RIN2 ROUT2 14 V FORCEON + 8 13 9 12 10 11 DIN1 DIN2 INVALID 5 kΩ † C3 can be connected to V CC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. VCC vs CAPACITOR VALUES VCC 3.3 V " 0.3 V 12 C1 0.1 µF C2, C3, and C4 0.1 µF 5 V " 0.5 V 0.047 µF 0.33 µF 3 V to 5.5 V 0.1 µF 0.47 µF Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3223E PACKAGE OPTION ADDENDUM www.ti.com 7-Nov-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) MAX3223ECDB ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MP223EC MAX3223ECDBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MP223EC MAX3223ECDBRG4 ACTIVE SSOP DB 20 TBD Call TI Call TI 0 to 70 MAX3223ECDW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3223EC MAX3223ECDWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3223EC MAX3223ECPW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MP223EC MAX3223ECPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MP223EC MAX3223ECPWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MP223EC MAX3223EIDB ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP223EI MAX3223EIDBG4 ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP223EI MAX3223EIDBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP223EI MAX3223EIDW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3223EI MAX3223EIDWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3223EI MAX3223EIPW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP223EI MAX3223EIPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP223EI MAX3223EIPWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP223EI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 7-Nov-2014 LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device MAX3223ECDBR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 MAX3223ECDWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 MAX3223ECPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 MAX3223EIDBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 MAX3223EIDWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 MAX3223EIPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX3223ECDBR SSOP DB 20 2000 367.0 367.0 38.0 MAX3223ECDWR SOIC DW 20 2000 367.0 367.0 45.0 MAX3223ECPWR TSSOP PW 20 2000 367.0 367.0 38.0 MAX3223EIDBR SSOP DB 20 2000 367.0 367.0 38.0 MAX3223EIDWR SOIC DW 20 2000 367.0 367.0 45.0 MAX3223EIPWR TSSOP PW 20 2000 367.0 367.0 38.0 Pack Materials-Page 2 PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 TYP 9.97 SEATING PLANE PIN 1 ID AREA A 0.1 C 20 1 13.0 12.6 NOTE 3 18X 1.27 2X 11.43 10 11 B 7.6 7.4 NOTE 4 20X 0.51 0.31 0.25 C A B 2.65 MAX 0.33 TYP 0.10 SEE DETAIL A 0.25 GAGE PLANE 0 -8 0.3 0.1 1.27 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. www.ti.com EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 11 10 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2016, Texas Instruments Incorporated