LIGITEK LGFLV-311E-60 1w power light led Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
1W Power Light LED
LGFLV-311E-60
DATA SHEET
DOC. NO :
REV:
DATE
QW0905- LGFLV-311E-60
A
:
20 - Apr. -2011
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Typical Applications
Features
*. High Flux per LED
*. Very long operating life(up to 100k hours).
*. Available in White.
*. More Energy Efficient than lncandescent and most Halogen lamps.
*. Low voltage DC operated..
*. Cool beam, safe to the touch.
*. Instant light(less than 100 ns).
*. Fully dimmable.
*. No UV.
*. Superior ESD protection..
*. Soldering methods: hand Soldering or reflow solder.
*. Reading Light (car,bus,aircraft)
*. Portable(flashlight,bicycle).
*. LCD Backlights / Light Guides.
*. Automotive Exterior (Stop-Tail-Tum,CHMSL,Mirror Side Repeat).
*. Commercial and Residential Architectural lighting.
*. Mini-accent / Uplighters / Downlighters / Orientation lighting
*. Fiber Optic Alternative / Decorative / Entertainment lighting.
*. Security / Garden lighting.
*. Cove / Undershelf / Task lighting.
*. Traffic signaling / Beacons / Rail crossing and Wayside lighting.
*. Decorative.
*. Sign and channel Letter.
Dimension
∅8±0.2
Anode
2x1.5±0.2
2x1.3±0.2
Anode(+)
Cathode(-)
5.0±0.2
1.25±0.2
9.6±0.3
11.9±0.3
2.4
5.8±0.3
14.5±0.3
Note:1.All dimension are in millimeter
2.Specifications are subject to change without notice
Page 1/13
6
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Parameter
Symbol
UNIT
Warm White
DC Forward Current
IF
350
mA
Power Dissipation
PD
1.4
W
Peak pulse current
Duty 1/10@10KHz
IFP
500
mA
LED junction Temperature
Tj
125
℃
Reverse Current(VR=5V)
Ir
100
μA
ESD Sensitivity
VB
±4000
V
Storage Temperature
Tstg
-40 ~ +120
℃
Operating Temperature
Topr
-40 ~ +100
℃
Manual Soldering Time
at 260°C(Max)
Tsol
5
seconds
NOTE:
1. Proper current derating must be observed to maintain temperature below the maximum.
2. LEDS are not designed to be driven in reverse bias.
. Luminous Flux Characteristics at 350mA
(Ratings At 25℃ Ambient)
Radiation
Pattern
PART NO
Luminous
Flux
@350mA(lm)
Emission
Color
Lambertian LGFLV-311E-60 Warm White
Units
Min.
Typ.
Max.
51.7
60
----
Note :
1. Warm Whiteemitters are built with InGaN.
2. Flux and power is measured with an accuracy of ±10%
Page 2/13
lm
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
. Forward Voltage Characteristics at 350mA
(Ratings At 25℃ Ambient)
Radiation
Pattern
Lambertian LGFLV-311E-60
Vf
Emission
Color
Min.
Typ.
Max.
Warm White
3.0
3.6
4.0
PART NO
Units
V
Note : Forward Voltage is measured with an accuracy of ±0.1V
. Color Tempeature Characteristics at 350mA
(Ratings At 25℃ Ambient )
Radiation
Pattern
Lambertian LGFLV-311E-60
CCT
Emission
Color
PART NO
Min.
Typ.
Units
Max.
2670 ---- 3800
Warm White
K
Note : CCT±5% tester tolerance.
. Tempeature Coefficient Of Forward Voltage&Thermal
Resistance Junction To Board Characteristics at 350mA
(Ratings At 25℃ Ambient )
Radiation
Pattern
Lambertian
PART NO
LGFLV-311E-60
VF/ T
Emission
Color
Typ. Units
(Ratings At 25℃ Ambient )
Emission
Color
LGFLV-311E-60 Warm White
Lambertian
60
Typ.
Units
-2 mV/° C 18 °C/W
Warm White
. Emission Angle Characteristics at 350mA
PART NO
Rth,j-B
Units
Degrees
Page 3/13
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Brightness Code For High Power LED
Luminous flux(lm)
Group
Min
Max
F23-1
51.7
60
F23-2
60
67.2
Note : Flux is measured with an accuracy of ±10%
White Binning Structure Graphical Representation
0.48
2670K
0.46
3050K
2850K
3250K
3500K
0.44
3800K
y
NM
PM
QM
0.42
PN
QN
RN
0.40
0.38
MO
NO
PO
QO
RO
MN
NN
RM
MM
MP
PP
NP
QP
RP
0.36
0.34
0.38
0.40
0.42
0.44
0.46
x
Page 4/13
0.48
0.50
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Color Bins
White Bin Structure
20 color bins, CCT range 3800K to 2670K
Bin Code
MO
MN
MP
MM
NO
NN
NP
NM
PO
PN
PP
PM
QO
QN
QP
QM
RO
RN
RP
RM
x
y
0.453
0.444
0.458
0.467
0.461
0.453
0.467
0.477
0.458
0.444
0.436
0.449
0.471
0.461
0.477
0.487
0.438
0.429
0.444
0.453
0.446
0.438
0.453
0.461
0.444
0.429
0.422
0.436
0.454
0.446
0.461
0.471
0.424
0.416
0.429
0.438
0.431
0.424
0.438
0.446
0.429
0.416
0.410
0.422
0.438
0.431
0.446
0.454
0.409
0.402
0.416
0.424
0.415
0.409
0.424
0.431
0.416
0.402
0.397
0.410
0.421
0.415
0.431
0.438
0.392
0.387
0.402
0.409
0.415
0.409
0.392
0.396
0.387
0.383
0.397
0.402
0.421
0.415
0.396
0.402
0.416
0.399
0.403
0.420
0.433
0.416
0.420
0.437
0.403
0.399
0.384
0.388
0.451
0.433
0.437
0.454
0.412
0.394
0.399
0.416
0.429
0.412
0.416
0.433
0.399
0.394
0.379
0.384
0.446
0.429
0.433
0.451
0.406
0.389
0.394
0.412
0.423
0.407
0.412
0.429
0.394
0.389
0.374
0.379
0.440
0.423
0.429
0.446
0.400
0.382
0.389
0.406
0.416
0.400
0.407
0.423
0.389
0.382
0.367
0.374
0.433
0.416
0.423
0.440
0.391
0.374
0.382
0.400
0.416
0.400
0.391
0.404
0.374
0.360
0.367
0.382
0.433
0.416
0.404
0.423
Typ. CCT
(K)
2760
2760
2760
2760
2950
2950
2950
2950
3150
3150
3150
3150
3375
3375
3375
3375
3650
3650
3650
3650
NOTE: Tolerance on each color bin(x,y)is ±0.01
Page 5/13
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Recommended Solder Pad Design
16.65
11.65
5.82
2
Solder Mark
Solder Pad
Slug independent
NOTE:
1. All dimensions are in mm.
2. The drawings are not to scale.
3. Solder pad can't be connected to slug.
Precautions For Use:
Storage :
1.The operation of Temperatures and RH are : 5℃~35℃,RH60%,After the package is opened,
LEDs should be stored at temperatures less than 30 ℃ and humidity less than 30%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the products life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃ ,RH60%, they
should be treated at 60℃± 5 ℃for 6hrs.
Page 6/13
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Manual Hand Soldering
1.
Thermal Conductive Glue
2.
MCPCB
Emitter
+
-
LIGITEK
+
Place Emitter on the MCPCB.
Place Thermal Comductive Glue on the MCPCB.
4.
3.
Soldering Iron
Solder Wire
Heat Plate
Heat Plate
Use Soldering Iron to solder the leads
of Emitter within 5 seconds.
Handling Precaution:
1. For prototype builds or small series production runs it possible to place and solder the emitters by hand.
2. Solder tip temperature : 230 ° C max for Lead Solder and 260 ° C max for Lead-Free Solder.
3. Avoiding damage to the emitter or to the MCPCB dielectric layer.Damage to the epoxy layer can cause a
short circuit in the array.
4. Do not let the solder contact from solder pad to back-side of MCPCB.This one will cause a short circuit
and damage emitter.
5.
6.
7.
8.
Avoid leaving fingerprints or scratches (by sharp tools) on the silicone resin parts.
Do not force over 2000gf impact or pressure on the silicone molding lens.
The LEDs should only be picked up by making contact with the sides of the LED body.
When populating in SMT production, the pick-and-place nozzle must not place excessive pressure on the
silicone molding lens.
Page 7/13
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Fig.1 Forward current vs. Forward Voltage
Forward Current(mA)
400
300
200
100
0
2.0
2.5
3.0
3.5
4.0
4.5
Forward Voltage(V)
Fig.2 Operating current vs. Ambient Temperature
Forward Current(mA)
400
300
200
100
50
0
Rth(J-A)=60C/W
Rth(J-A)=50C/W
Rth(J-A)=40C/W
Rth(J-A)=30C/W
25
50
75
100
Ambient Temperature( ° C)
Page 8/13
125
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Fig.3 Forward current vs. Luminous Flux
Relative Luminous Flux(%)
1.2
1.0
0.8
0.6
0.4
0.2
0
100
200
300
400
500
IF(mA)
Fig.4 Junction Temperature vs. Forward Voltage
2.0
Relative Flux(%)
1.8
1.6
Warm White
1.4
1.2
1.0
0.8
0.6
0.4
0.2
-20
0
20
40
60
80
Junction Temperature(°C)
Page 9/13
100
120
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Relative Luminous Flux( %)
Fig.5 Luminous Spectrum(Ta=25 ℃)
SPECTRAL RADIANCE
100
80
60
40
20
0
400
500
600
700
800
Wavelength (nm)
Fig.6 Directivity Radiation
0°
-30°
30°
-60°
100% 75% 50%
60°
25%
0
Page 10/13
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PACKING SPECIFICATION
1. 50PCS / TUBE
9.6
Anode
420
4.76
8
2.2
0.56
16.6
2. 20 TUBES / INNER BOX (10*2)
SIZE : L X W X H 460cm X 110cm X 60cm
L
3. 10 INNER BOXES / CARTON
SIZE : L X W X H 480cm X 240cm X 325cm
L
W
C/NO:
MADE IN CHINA
.
NO
M
IT E Y :
Q'T ,:
W :
N,
,
W
G,
S
PC
s
kg
s
kg
Page 11/13
H
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Recommended Soldering Conditions
1. PB-Free Reflow Solder
D
1~5° C/sec
C
A
250° C MaX.
10sec.Max
E
Preheat
180~200° C
1~5° C/sec
Above 220 ° C
60 sec.Max.
B
120 sec.Max.
Reflow Soldering should not be done more than two times.
Solder Reflow Process Parameters:
1.Reflow soldering of Helixeon emitters requires effective control of heating and cooling. Both the
rate of heating and cooling and the absolute temperatures reached are critical in assuring the
formation of a reliable solder joint while avoiding damage to the emitter during the reflow process.
The recommended temperature profile of solder reflow process is shown below in the figure.
1-1. Preheat
Set the temperature rising speed A at a rate of 1~5 ℃/s. Careful about rapid temperature
rise in preheat zone as it may cause excessive slumping of the solder paste.Appropriate
preheat time B will be from 60 to 120 seconds. If the preheat is insufficient, rather large
solder balls tend to be generated. Conversely, if performed excessively, fine balls and large
balls will generate in clusters at a time.Appropriate preheat ending temperature C will be
from 180 to 200 ℃. If the temperature is too low, non-melting tends to be caused in the area
with large heat capacity after reflow.
1-2. Heating
Careful about sudden rise in temperature as it may worsen the slump of solder paste.
Set the peak temperature D in the range from 220 to 250 ℃.Adjust the melting time that
the time over 220 ℃, E, will be from 30 to 60 seconds.
1-3. Cooling
Careful about slow cooling as it may cause the positional shift of parts and decline in joining
strength at times.
Page 12/13
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Reliability Test
Item
Description
Stress Condition
Test Duration
RTOL
Room Temperature Operation Life
25°C, IF:max.DC (Note1)
1000 hours
WHT
Wet High Temperature
85°C/85%RH
1000 hours
TC
Temperature Cycling
-40/+110° C,
30min dwell,<5min trans.
200 cycles
TS
Thermal Shock
-40/+110° C,
20min dwell,<20min trans.
200 cycles
HTSL
High Temperature Storage Life
120° C
1000 hours
LTSL
Low Temperature Storage Life
-40° C
1000 hours
SHR
Solder Heat Resistance
260±5° C, 5secs
MS
Mechanical Shock
1500G,0.5msec pulse,
5 shocks each 6 axis
ND
Natural Drop
On concrete from 1.2m, 3xtimes
RV
Random Vibration
6G RMS from 10 to 2KHz,
10mins/axis
VVF
Variable Vibration Frequency
10-2000-10Hz, 20G
1 min, 1.5mm, 3timesx/axis
Note :
1. Depending on the maximum derating curve.
2. Failure criteria:
Electrical failures
V F shife >= 10%
IR < 50uA@Vr = 5v
Ligitek output Degradation
%Iv shift >= 30%@1000hrs or 200cycle
Visual failures
Broken or damaged package or lead
Dimension out of tolerance
Page 13/13
Similar pages