Datasheet 2ch High Side Switch ICs Current Limit High Side Switch ICs BD6516F BD6517F BD2042AFJ BD2052AFJ General Description Key Specifications BD6516F, BD6517F, BD2042AFJ and BD2052AFJ are dual channel high side switch ICs with an over current protection for Universal Serial Bus (USB) power supply line. The IC’s switch unit has two channels of N-Channel power MOSFET. Over current detection circuit, thermal shutdown circuit, under voltage lockout and soft start circuit are built in. Input Voltage Range: BD6516F/BD6517F 3.0V to 5.5V BD2042AFJ/BD2052AFJ 2.7V to 5.5V ON-Resistance: BD6516F/BD6517F 110mΩ(Typ) BD2042AFJ/BD2052AFJ 100mΩ(Typ) Continuous Current: 0.5A Current Limit Threshold: BD6516F/BD6517F 1.2A(Min), 2.5A (Max) BD2042AFJ/BD2052AFJ 0.7A(Min), 1.8A (Max) Standby Current: 0.01μA (Typ) Output Rise Time: 1.8ms (Typ) Operating Temperature Range: BD6516F/BD6517F -25°C to +85°C BD2042AFJ/BD2052AFJ -40°C to +85°C Features ■ ■ ■ ■ ■ ■ ■ ■ ■ Dual N-MOS High Side Switch Control Input Logic Active-Low: BD6517F, BD2042AFJ Active-High: BD6516F, BD2052AFJ Soft Start Circuit Over Current Detection Thermal Shutdown Under Voltage Lockout Open Drain Error Flag Output Reverse-Current Protection when Switch Off Flag Output Delay W(Typ) Packages D(Typ) H(Max) Applications USB Hub in Consumer Appliances, Note PC, PC Peripheral Equipment, and so on. SOP8 5.00mm x 6.20mm x 1.71mm Typical Application Circuit SOP-J8 4.90mm x 6.00mm x 1.65mm 5V(Typ) GND /OC1 CL CIN IN OUT1 /EN1 (EN1) /EN2 (EN2) OUT2 Data /OC2 CL Data Lineup Current Limit Threshold Control Input Logic Min Typ Max 1.2A 1.65A 2.5A High 1.2A 1.65A 2.5A Low 0.7A 1.0A 1.8A High 0.7A 1.0A 1.8A Low Package BD6516F-E2 SOP8 Reel of 2500 SOP-J8 Orderable Part Number BD6517F-E2 BD2052AFJ-E2 BD2042AFJ-E2 ○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays www.rohm.com TSZ02201-0E3E0H300240-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 1/31 TSZ22111･14･001 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Block Diagrams BD6516F/BD6517F CTRLA BD2042AFJ/BD2052AFJ FLAGA Delay Gate Logic1 /EN1 EN1 TSD1 Gate Logic1 Charge Pump1 OCD1 OUTA UVLO TSD IN UVLO Charge Pump2 OCD2 FLAGB /OC2 Gate Logic2 Delay GND OUT2 /EN2 EN2 Charge Pump2 Gate Logic2 OUT1 OUTB CTRLB OCD2 Charge Pump1 OCD1 VDD /OC1 Delay Delay GND TSD2 Pin Configurations BD6516F/BD6517F TOP VIEW BD2042AFJ/BD2052AFJ TOP VIEW 1 CTRLA OUTA 8 1 GND /OC1 2 FLAGA VDD 7 2 IN OUT1 7 3 FLAGB GND 6 OUT2 6 4 CTRLB OUTB 5 3 /EN1 (EN1) 4 /EN2 (EN2) /OC2 8 5 Pin Descriptions BD6516F/BD6517F Pin Symbol I/O No. 1, 4 CTRLA CTRLB I 2, 3 FLAGA FLAGB O Pin Function Enable input. Switch on at low level. (BD6517F) Low level input < 0.7V. Switch on at high level. (BD6516F) High level input > 2.5V. Error flag output. Low at over current, thermal shutdown. Open drain output. BD2042AFJ/BD2052AFJ Pin Symbol I / O No. 1 GND I Ground. 2 IN I Power supply input. Input terminal of the switch and power supply of internal circuit. 3, 4 /EN1 /EN2, EN1 EN2 I Ground. 5, 8 /OC2 /OC1 O Power supply input. Input terminal of the switch and power supply of internal circuit. 6, 7 OUT2 OUT1 O 5, 8 OUTA OUTB O Switch output. 6 GND I 7 VDD I www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/31 Pin Function Enable input. /EN: Switch on at low level. (BD2042AFJ) Low level input < 0.8V EN: Switch on at high level. (BD2052AFJ) High level input > 2.0V. Error flag output. Low at over current, thermal shutdown. Open drain output. Switch output. TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Absolute Maximum Ratings BD6516F/BD6517F Parameter Symbol Rating Unit Input Voltage VDD -0.3 to +6.0 V CTRL Voltage VCTRL -0.3 to V DD +0.3 V FLAG Voltage VFLAG -0.3 to +6.0 V Output Voltage VOUT -0.3 to +6.0 V Storage Temperature Tstg -55 to +150 ºC Power Dissipation Pd 0.67 (Note 1) W BD2042AFJ/BD2052AFJ Parameter Symbol Rating Unit VIN -0.3 to +6.0 V VEN, V/EN -0.3 to +6.0 V /OC Voltage V/OC -0.3 to +6.0 V /OC Current IS/OC 10 mA OUT Voltage VOUT -0.3 to +6.0 V Storage Temperature Tstg -55 to +150 ºC Power Dissipation Pd 0.67 Input Voltage EN, /EN Voltage (Note 1) W o (Note 1) Mounted on 70mm x 70mm x 1.6mm glass-epoxy PCB. Derating : 5.4mW/ C above Ta=25 oC Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operation Conditions BD6516F/BD6517F Parameter Symbol Rating Min Typ Max Unit Input Voltage V DD 3.0 - 5.5 V Operation Temperature Topr -25 - +85 °C Continuous Output Current I LO 0 - 500 mA BD2042AFJ/BD2052AFJ Parameter Symbol Rating Min Typ Max - 5.5 Unit Input Voltage V IN 2.7 Operation Temperature Topr -40 - +85 °C Continuous Output Current I LO 0 - 500 mA www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/31 V TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Electrical Characteristics BD6516F/BD6517F (V DD =5V, Ta=25 ºC, unless otherwise specified.) Limit Parameter Symbol Min Typ Max Unit Conditions Operating Current I DD - 100 140 μA Standby Current I STB - 0.01 2 μA - - 0.7 V V CTRL =5V(BD6516F), 0V(BD6517F) OUT=OPEN V CTRL =0V(BD6516F), 5V(BD6517F) OUT=OPEN Low Level Input Voltage 2.5 - - V High Level Input Voltage CTRL Input Voltage V CTRL CTRL Input Current I CTRL -1 +0.01 +1 μA V CTRL =0V or 5V FLAG Output Resistance R FLAG - 250 450 Ω I FLAG =1mA FLAG Output Leak Current I FLAG - 0.01 1 μA V FLAG =5V FLAG Output Delay t/FL - 1 4 ms ON-Resistance R ON Over-Current Threshold Short Circuit Output Current - 110 150 mΩ V DD =5V, I OUT =500mA - 140 180 mΩ V DD =3.3V, I OUT =500mA I TH 1.2 1.65 2.5 A I SC 1.2 1.65 2.2 A V OUT =0V Output Leak Current I LEAK - - 10 μA V CTRL =0V(BD6516F), 5V(BD6517F) Thermal Shutdown Threshold T TS - 135 - ºC At Tj Increase Output Rise Time t ON1 0.1 1.3 4.0 ms R L =10Ω Output Turn ON Delay Time t ON2 0.2 1.5 6.0 ms R L =10Ω Output Fall Time t OFF1 - 1 20 μs R L =10Ω Output Turn OFF Delay Time t OFF2 - 3 20 μs R L =10Ω BD2042AFJ/BD2052AFJ (V DD =5V, Ta=25 ºC, unless otherwise specified.) Limit Parameter Symbol Unit Min Typ Max Conditions Operating Current I DD - 110 140 μA V /EN = 0V, OUT = OPEN (BD2042AFJ) V EN = 5V, OUT = OPEN (BD2052AFJ) Standby Current I STB - 0.01 1 μA V /EN = 5V, OUT = OPEN (BD2042AFJ) V EN = 0V, OUT = OPEN (BD2052AFJ) V /ENH , V ENH 2.0 - - V High Input /EN, EN Input Voltage V /ENL , V ENL - - 0.8 V Low Input - - 0.4 V Low Input 2.7V≤ V IN ≤4.5V I /EN , I EN -1.0 +0.01 +1.0 μA V /EN ,V EN = 0V or V /EN ,V EN = 5V /OC Output Low Voltage V /OC - - 0.5 V I /OC = 5mA /OC Output Leak Current I L/OC - 0.01 1 μA V /OC = 5V ON-Resistance R ON - 100 130 mΩ I OUT = 500mA Over-Current Threshold I TH 0.7 1.0 1.8 A Short Circuit Output Current I SC 0.7 1.0 1.3 A Output Rise Time t ON1 - 1.8 10 ms Output Turn ON Time t ON2 - 2.1 20 ms Output Fall Time t OFF1 - 1 20 μs Output Turn OFF Time t OFF2 - 3 40 μs V TUVH 2.1 2.3 2.5 V Increasing V IN V TUVL 2.0 2.2 2.4 V Decreasing V IN /EN, EN Input Current UVLO Threshold www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/31 V IN = 5V, V OUT = 0V, C L = 100μF (RMS) R L = 10Ω , C L = OPEN TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Measurement Circuits BD6516F/BD6517F VDD VDD CTRLA VCTRL FLAGA VCTRL A OUTA VDD VCTRL GND CTRLB OUTB VCTRL A. Operating Current VCTRL VCTRL VDD CTRLA OUTA FLAGA VDD FLAGB GND CTRLB OUTB FLAGA VDD FLAGB GND CTRLB OUTB RL CL RL CL B. CTRL Input Voltage, Output Rise / Fall Time VDD 10k 10k OUTA 1µF 1µF FLAGB CTRLA VCTRL IOUT VDD IFLAG IFLAG CL CTRLA OUTA FLAGA VDD FLAGB GND CTRLB OUTB 1µF 1µF VCTRL IOUT CL C. ON-Resistance, Over Current Detection D. FLAG Output Resistance BD2042AFJ/BD2052AFJ VDD VDD 1µF 1µF A GND /OC1 IN OUT1 VEN EN1 OUT2 VEN EN2 /OC2 GND /OC1 IN OUT1 VEN EN1 OUT2 VEN EN2 /OC2 RL RL E. Operating Current VDD 1µF GND 10k OUT1 VEN EN1 OUT2 VEN EN2 /OC2 CL F. EN, /EN Input Voltage, Output Rise / Fall Time VDD 10k VDD /OC1 IN CL 1µF GND IOUT IOUT IOUT /OC1 IN OUT1 VEN EN1 OUT2 VEN EN2 /OC2 G. ON-Resistance, Over Current Detection IOUT H. /OC Output Low Voltage Figure 1. Measurement Circuits www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Timing Diagram BD6517F/BD2042AFJ BD6516F/BD2052AFJ tOFF1 tOFF1 tON1 tON1 90% VOUT 90% 10% VCTRL V/EN VCTRL V/ENL 90% 10% 10% tON2 90% VOUT 10% tON2 tOFF2 VCTRL V/ENH VCTRL VEN VCTRL VENH tOFF2 VCTRL VENL Figure 2. Timing Diagram www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Typical Performance Curves BD6516F/ BD6517F Ta=25ºC Operating Current: I [μA] 100 120 OPERATING CURRENT : DD I DD [uA] OperatingCURRENT Current:: IIDD [μA] DD [uA] OPERATING 120 80 60 40 20 3 4 5 80 60 40 20 0 -50 0 2 VDD=5.0V 100 6 50 100 AMBIENT Ta[°C Ambient TEMPERATURE Temperature : :Ta[ ℃] SUPPLY VDD DD [V] Supply VOLTAGE Voltage :: V [V] Figure 3. Operating Current vs Supply Voltage Figure 4. Operating Current vs Ambient Temperature 1.0 1.0 Standby Current: ISTB[μA] Ta=25ºC OPERATING CURRENT : IDD [uA] Standby CURRENT Current: I:STB OPERATING IDD[μA] [uA] 0 0.8 0.6 0.4 0.2 0.0 2 3 4 5 0.6 0.4 0.2 0.0 6 -50 SUPPLY Voltage VOLTAGE : VDD[V] [V] Supply :V DD 0 50 100 AMBIENT : Ta[ ℃] ] Ambient TEMPERATURE Temperature : Ta[ °C Figure 5. Standby Current vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 VDD=5.0V 0.8 Figure 6. Standby Current vs Ambient Temperature 7/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Typical Performance Curves - continued 3.0 Ta=25ºC CTRL Input Voltage : VCTRL[V] 2.5 CONTROL INPUT VOLTAGE : VCTRL[V] CTRL Input Voltage : V [V] CONTROL INPUT VOLTAGE : CTRL VCTRL[V] 3.0 2.0 1.5 1.0 0.5 0.0 VDD=5.0V 2.5 2.0 1.5 1.0 0.5 0.0 2 3 4 5 6 -50 SUPPLY SupplyVOLTAGE Voltage :: V VDD [V] [V] Figure 8. CTRL Input Voltage vs Ambient Temperature (BD6516F) 3.0 CTRL Input Voltage : VCTRL[V] 3.0 CONTROL INPUT VOLTAGE : VCTRL[V] CTRL Input [V] CTRL [V] CONTROL INPUTVoltage VOLTAGE: V : VCTRL (BD6516F) Ta=25ºC Low to High 1.5 High to Low 1.0 100 Ambient Temperature : Ta[°C] Figure 7. CTRL Input Voltage vs Supply Voltage 2.0 50 AMBIENT TEMPERATURE : Ta[℃] DD 2.5 0 0.5 VDD=5.0V 2.5 2.0 Low to High 1.5 High to Low 1.0 0.5 0.0 0.0 2 3 4 5 -50 6 SUPPLY [V] SupplyVOLTAGE Voltage ::VVDDDD [V] 50 100 AMBIENT TEMPERATURE ] ] ℃°C Ambient Temperature: :Ta[ Ta[ Figure 10. CTRL Input Voltage vs Ambient Temperature Figure 9. CTRL Input Voltage vs Supply Voltage (BD6517F) (BD6517F) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 8/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Typical Performance Curves - continued 200 Ta=25ºC ON RESISTANCE : RON [mΩ] ON-Resistance : RON[mΩ] ON RESISTANCE : RON [mΩ] ON-Resistance : RON[mΩ] 200 150 100 50 150 3 4 5 50 0 -50 6 100 ] Figure 12. ON-Resistance vs Ambient Temperature 4.0 Output Rise Time: tON1 [ms] ON1 [us] 4.0 Ta=25ºC 3.0 TURN ON RISE TIME : T ON1 [us] 50 Ambient Temperature : Ta[°C℃ ] Figure 11. ON-Resistance vs Supply Voltage Output Rise Time: tON1[ms] 0 AMBIENT TEMPERATURE : Ta[ SUPPLYVoltage VOLTAGE VDD [V] Supply : V:DD [V] TURN ON RISE TIME : T VDD=5.0V 100 0 2 VDD=3.3V 2.0 1.0 0.0 2 3 4 5 VDD=3.3V 2.0 VDD=5.0V 1.0 0.0 6 -50 SUPPLY VOLTAGE : VDD [V] 0 50 100 AmbientTEMPERATURE Temperature :: Ta[℃] Ta[°C] AMBIENT Supply Voltage : VDD[V] Figure 13. Output Rise Time vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3.0 Figure 14. Output Rise Time vs Ambient Temperature 9/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ 4.0 Output TURN Turn ON Delay Time: tON2[ms] ON DELAY : T ON2 [us] TURN ON DELAY : T ON2 [us] Output Turn ON Delay Time: tON2[ms] Typical Performance Curves - continued Ta=25ºC 3.0 2.0 1.0 0.0 2 3 4 5 6 4.0 3.0 VDD=3.3V 2.0 VDD=5.0V 1.0 0.0 -50 [V] SUPPLY Supply VOLTAGE Voltage : :VVDD[V] Figure 15. Output Turn ON Delay Time vs Supply Voltage Output Fall Time: [μs] OFF1 [us] TURN OFF FALL TIME : TtOFF1 [μs] Output Fall Time: t OFF1 [us] TURN OFF FALL TIME : TOFF1 5.0 4.0 3.0 2.0 1.0 0.0 3 100 Figure 16. Output Turn ON Delay Time vs Ambient Temperature Ta=25ºC 2 50 AMBIENT Ta[℃] AmbientTEMPERATURE Temperature : :Ta[ °C] DD 5.0 0 4 5 4.0 3.0 2.0 VDD=3.3V 1.0 VDD=5.0V 0.0 6 -50 0 50 Supply :V [V] DD [V] SUPPLYVoltage VOLTAGE :V DD Ambient TEMPERATURE Temperature : Ta[ AMBIENT : Ta[°C ℃]] Figure 17. Output Fall Time vs Supply Voltage Figure 18. Output Fall Time vs Ambient Temperature www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/31 100 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Output TURN Turn OFF Delay: Time: OFF DELAY TOFF2[us]tOFF2[μs] TURN OFF DELAY : TOFF2[us] Output Turn OFF Delay Time: tOFF2[μs] Typical Performance Curves - continued 5.0 Ta=25ºC 4.0 3.0 2.0 1.0 0.0 2 3 4 5 6 5.0 4.0 VDD=3.3V 3.0 2.0 VDD=5.0V 1.0 0.0 -50 SUPPLYVoltage VOLTAGE VDD Supply : V:DD [V][V] Short Output Current : ISC[A] SHORTCircuit CIRCUIT CURRENT : ISC [A] SC Short Circuit Output Current : I [A] SHORT CIRCUIT CURRENT : I [A]SC Ta=25ºC 2.0 1.0 0.0 4 5 3.0 2.0 VDD=5.0V VDD=3.3V 1.0 0.0 6 -50 SUPPLY VOLTAGE :V DD [V] Supply Voltage :V [V] DD 0 50 100 AmbientTEMPERATURE Temperature : :Ta[ AMBIENT Ta[°C ℃]] Figure 21. Short Circuit Output Current vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 100 Figure 20. Output Turn OFF Delay Time vs Ambient Temperature 3.0 3 50 AMBIENT Ta[℃ AmbientTEMPERATURE Temperature :: Ta[ °C] ] Figure 19. Output Turn OFF Delay Time vs Supply Voltage 2 0 Figure 22. Short Circuit Output Current vs Ambient Temperature 11/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ FLAG Output Resistance: RFLAG FLAG OUTPUT RESISTANCE : RFLAG [Ω] [Ω] FLAG Output Resistance: R FLAG FLAG OUTPUT RESISTANCE : RFLAG [Ω] [Ω] Typical Performance Curves - continued 500 Ta=25ºC 400 300 200 100 0 2 3 4 5 500 400 300 VDD=3.3V 200 VDD=5.0V 100 0 6 -50 Supply : V:DD [V] [V] SUPPLYVoltage VOLTAGE VDD 4 100 FLAG Output Delay: t/FL [ms] 4 Ta=25ºC FLAG OUTPUT DELAY : TDFL[ms] FLAG OUTPUT DELAY : TD FL [ms] 50 Figure 24. FLAG Output Resistance vs Ambient Temperature Figure 23. FLAG Output Resistance vs Supply Voltage FLAG Output Delay: t/FL [ms] 0 AmbientTEMPERATURE Temperature: :Ta[ AMBIENT Ta[°C ℃]] 3 2 1 0 2 3 4 5 3 2 1 0 6 -50 SUPPLY VOLTAGE : VDD [V] 0 50 100 AmbientTEMPERATURE Temperature : :Ta[ AMBIENT Ta[°C ℃]] Supply Voltage : VDD[V] Figure 25. FLAG Output Delay vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 VDD=5.0V Figure 26. FLAG Output Delay vs Ambient Temperature 12/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Typical Performance Curves - continued BD2042AFJ/ BD2052AFJ VIN=5.0V Operating Current : IDD[μA] Operating Current : IDD[μA] Ta=25ºC Supply Voltage : VIN[V] Ambient Temperature : Ta[°C] Figure 27. Operating Current vs Supply Voltage (EN, /EN Enable) Figure 28. Operating Current vs Ambient Temperature (EN, /EN Enable) 1.0 1.0 Standby Current : ISTB: [μA] OPERATING CURRENT I STB[uA] Standby Current : ISTB[μA] Ta=25ºC 0.8 0.6 0.4 0.2 0.0 2 3 4 5 0.8 0.6 0.4 0.2 0.0 6 -50 0 50 AMBIENT : Ta[℃] AmbientTEMPERATURE Temperature : Ta[ °C] Supply Voltage : VIN[V] Figure 29. Standby Current vs Supply Voltage (EN, /EN Disable) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 VIN=5.0V 100 Figure 30. Standby Current vs Ambient Temperature (EN, /EN Disable) 13/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Typical Performance Curves - continued Enable Input Voltage: VEN, V/EN[V] Ta=25ºC 1.5 Low to High VEN, V/EN [V] 0 ENABLE INPUT VOLTAGE Enable Input Voltage: VEN, V:/EN[V] 2.0 High to Low 1.0 0.5 VIN=5.0V Low to High High to Low 0.0 2 3 4 5 SUPPLY VOLTAGE IN [V] Supply Voltage : V: V[V] 6 Ambient Temperature : Ta[°C] IN Figure 32. EN, /EN Input Voltage vs Ambient Temperature Figure 31. EN, /EN Input Voltage vs Supply Voltage Ta=25ºC /OC Output Low Voltage: V/OC[V] V/OC [V] OUTPUT VOLTAGE : /OC/OC Output LowLOW Voltage: V/OC[V] 0.5 0.4 0.3 0.2 0.1 0.0 2 3 4 5 SUPPLY VOLTAGE : VDD [V] 6 Supply Voltage : VIN [V] Ambient Temperature : Ta[°C] Figure 34. /OC Output Low Voltage vs Ambient Temperature Figure 33. /OC Output Low Voltage vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 VIN=5.0V 14/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Typical Performance Curves - continued 2.0 2 ON RESISTANCE :RON[mΩ] /OC Output Delay: t/OC[ms] ON RESISTANCE : RON[mΩ] /OC Output Delay: t/OC[ms] Ta=25ºC 1.5 1.0 0.5 0.0 VIN=5.0V 1.5 1 0.5 0 2 3 4 5 SUPPLY VOLTAGE : V Supply Voltage : V [V]DD[V] 6 -50 0 Figure 35. /OC Output Delay vs Supply Voltage Figure 36. /OC Output Delay vs Ambient Temperature 200 200 Ta=25ºC VIN=5.0V 150 ON-Resistance : RON[mΩ] ON RESISTANCE : RON[mΩ] 100 Ambient TEMPERATURE Temperature : Ta[ °C] AMBIENT : Ta[℃] IN ON-Resistance : RON[mΩ] 50 100 50 0 150 100 50 0 2 3 4 5 SUPPLY VOLTAGE : V DD [V] Supply Voltage : V [V] 6 -50 IN Figure 37. ON-Resistance vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 100 AMBIENT TEMPERATURE Ta[℃] Ambient Temperature : Ta[:°C ] Figure 38. ON-Resistance vs Ambient Temperature 15/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Typical Performance Curves - continued 2.0 VIN=5.0V Ta=25ºC Over Current Threshold: SHORT CIRCUIT CURRENT :ITH[A] SHORT CIRCUIT CURRENT :I Over Current Threshold: ITH[A] SC [A] 2.0 1.5 1.0 0.5 1.5 1.0 0.5 0.0 0.0 2 3 4 5 SUPPLY VOLTAGE : V IN [V] Supply Voltage : V [V] 6 -50 Figure 39. Over Current Threshold vs Supply Voltage SC [A] 100 Figure 40. Over Current Threshold vs Ambient Temperature 2.0 2.0 Ta=25ºC Short Circuit Output Current : ISC[A] SHORT CIRCUIT CURRENT :I 50 Ambient Temperature : Ta[°C] IN Short Circuit Output Current : ISC[A] 0 AMBIENT TEMPERATURE : Ta[℃] 1.5 1.0 0.5 0.0 2 3 4 5 SUPPLY VOLTAGE : V IN [V] Supply Voltage : V [V] 1.5 1.0 0.5 0.0 -50 6 IN Figure 41. Short Circuit Output Current vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 VIN=5.0V 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Ambient Temperature : Ta[°C] Figure 42. Short Circuit Output Current vs Ambient Temperature 16/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Typical Performance Curves - continued 5.0 VIN=5.0V 4.0 RISE TIME : TON1[ms] Output Rise Time : tON1[ms] Output Rise Time : tON1[ms] Ta=25ºC 3.0 2.0 1.0 0.0 -50 Supply Voltage : VIN[V] Figure 43. Output Rise Time vs Supply Voltage 0 50 AMBIENTTemperature TEMPERATURE Ta[]℃] Ambient : Ta[: °C 100 Figure 44. Output Rise Time vs Ambient Temperature Ta=25ºC ON2 [ms] VIN=5.0V 4.0 TURN ON TIME :T Output Turn ON Time: tON2[ms] Output Turn ON Time: tON2[ms] 5.0 3.0 2.0 1.0 0.0 -50 Supply Voltage : VIN[V] Figure 45. Output Turn ON Time vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0 50 100 Ambient Temperature : Ta[: °C ] AMBIENT TEMPERATURE Ta[℃] Figure 46. Output Turn ON Time vs Ambient Temperature 17/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Typical Performance Curves - continued 5.0 VIN=5.0V Output Fall Time : tOFF1[µs] 4.0 FALL TIME : TOFF1[us] Output Fall Time : tOFF1[µs] Ta=25ºC 3.0 2.0 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE VIN [V] Supply Voltage : VIN: [V] 6 Ambient Temperature : Ta[°C] Figure 47. Output Fall Time vs Supply Voltage Figure 48. Output Fall Time vs Ambient Temperature 5.0 5.0 4.0 3.0 2.0 1.0 0.0 2 3 4 5 SUPPLY VOLTAGE VIN [V] Supply Voltage : VIN:[V] 4.0 3.0 2.0 1.0 0.0 6 -50 Figure 49. Output Turn OFF Time vs Supply Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 VIN=5.0V TOFF2[us] Output TURN Turn OFF Time: t [µs] OFF TIME :OFF2 Ta=25°C TURN OFF TIME : TOFF2[us] Output Turn OFF Time: tOFF2[µs] 6.0 0 50 100 AMBIENT TEMPERATURE : Ta[ ] ℃ Ambient Temperature : Ta[°C] Figure 50. Output Turn OFF Time vs Ambient Temperature 18/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Typical Performance Curves - continued 1.0 UVLO Hysteresis Voltage: VHYS[V] UVLO THRESHOLD VOLTAGE : V V UVLOL [V] UVLO Threshold : VTUVH, VTUVL[V] UVLOH , 2.5 2.4 VTUVH 2.3 VTUVL 2.2 2.1 2.0 -50 0 50 100 AMBIENT TEMPERATURE : Ta[℃] Ambient Temperature : Ta[°C] 0.6 0.4 0.2 0.0 -50 0 50 100 Ambient Temperature : Ta[°C] AMBIENT TEMPERATURE : Ta[℃] Figure 51. UVLO Threshold Voltage vs Ambient Temperature www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0.8 Figure 52. UVLO Hysteresis Voltage vs Ambient Temperature 19/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Typical Wave Forms VCTRL (5V/div.) VEN (5V/div.) VFLAG (5V/div.) VOUT (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VDD=5V VIN=5V RL=10Ω RL=47Ω CL=47μF IOUT (0.2A/div.) CL=100μF IOUT (0.2A/div.) TIME(200ms/div.) TIME(200ms/div.) Figure 54. Output Rise / Fall Characteristic Figure 53. Output Rise / Fall Characteristic (BD2052AFJ) (BD6516F) VFLAG (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VDD=5V CL=47μF IOUT (0.5A/div.) VIN=5V IOUT (0.5A/div.) TIME (2ms/div.) TIME (2ms/div.) Figure 55. Over-Current Response Ramped Load Figure 56. Over-Current Response Ramped Load (BD2052AFJ) (BD6516F) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Typical Wave Forms - continued VCTRL (5V/div.) VEN (5V/div.) VFLAG (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) 1ms Delay VDD=5V CL=47μF IOUT (0.5A/div.) IOUT (0.5A/div.) 1.3ms Delay VIN=5V CL=100μF TIME (2ms/div.) TIME (2ms/div.) Figure 58. Over-Current Response Enable to 1Ω Short Circuit Figure 57. Over-Current Response Enable to Short Circuit (BD2052AFJ) (BD6516F) VFLAG (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VDD=5V CL=47μF VIN=5V CL=100μF Thermal Shutdown Thermal Shutdown IOUT (2A/div.) IOUT (2A/div.) TIME (100ms/div.) TIME (200ms/div.) Figure 59. Over-Current Response 1Ω Load Connected at Enable Figure 60. Over-Current Response 1Ω Load Connected at Enable (BD2052AFJ) (BD6516F) Regarding the output rise/fall and over current detection characteristics of BD6517F, BD2042AFJ refer to the characteristic of BD6516F, BD2052AFJ. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Typical Application Circuit 5V(Typ) 10k to100k 10k to100k VBUS IN OUT ON/OFF GND /OC1 D+ CL OC CIN DOC Regulator GND ON/OFF IN /EN1 (EN1) /EN2 (EN2) OUT1 OUT2 /OC2 Data CL BD2042AFJ/52AFJ Data USB Controller Data Application Information Excessive current flow due to output short circuit, or so, may induce ringing because of the presence of an inductance between the supply line and IC. This event may cause IC malfunction during operation. To avoid this, connect a bypass capacitor between IN and GND pins. 1μF or higher is recommended. Pull up flag output (/OC) by resistance value from 10kΩ to 100kΩ. Set up values of C L which satisfies the application. The application circuit above does not guarantee its operation. When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including AC/DC characteristics as well as IC transient characteristics. Functional Description 1. Switch Operation VDD(IN) pin and OUT pin are connected to the drain and the source of switch MOSFET respectively. The VDD(IN) pin is also used as a power source for internal control circuit. When the switch is turned on from CTRL(EN) control input, VDD(IN) and OUT are connected. In a normal condition, current flows from VDD to OUT. If the voltage at OUT is higher than VDD, current flows from OUT to VDD since the There is no parasitic diode and it is possible to prevent current flow from OUT to VDD(IN). 2. Thermal Shutdown (TSD) Thermal shutdown circuit turns off the switch and outputs an error flag when the junction temperature in the chip exceeds a threshold temperature. The thermal shutdown circuit works when either of the two control signals is active. In BD6516F/BD6517F, the switches of both OUTA and OUTB turn off and output error flags;. BD2042AFJ/ BD2052AFJ has dual threshold temperature for its thermal shutdown. Since thermal shutdown works at a lower junction temperature, only the switch with an over current state turns off whenever over current occurs and outputs an error flag. Thermal shutdown detection has hysteresis. Therefore, when the junction temperature goes down, switch turns on and error flag is cancelled. Unless the increase of the chip’s temperature is removed or the output of power switch is turned off, this operation repeats. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 22/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet 3. Over-Current Detection/Limit Circuit The over current detection circuit limits current (I SC ) and outputs an error flag (/OC) when current flowing in each switch MOSFET exceeds a specified value. There are three types of response against over current. The over current detection circuit works when the switch is on (CTRL, EN signal is active). (1) When the switch is turned on while the output is in short-circuit status, the switch goes into current limit status immediately. (2) When the output short-circuits or high-current load is connected while the switch is on, very large current flows until the over current limit circuit reacts. When the current detection and limit circuit works, current limitation is carried out. (3) When the output current increases gradually, current limitation does not work until the output current exceeds the over current detection value. When it exceeds the detection value, current limitation is carried out. 4. Under Voltage Lockout (UVLO) UVLO circuit turns off the switch to prevent malfunction when the supply voltage is below the UVLO threshold level, The UVLO circuit works when either of two control signals is active. ◎BD2042AFJ/BD2052AFJ UVLO circuit prevents the switch from turning on until the V IN exceeds 2.3V(Typ). If the V IN drops below 2.2V(Typ) while the switch is ON, then UVLO shuts OFF the switch. UVLO has hysteresis of 100mV(Typ). 5. Error Flag (/OC) Output Error flag output is an N-MOS open drain output. At detection of over current limit and thermal shutdown, /OC outputs a low level signal. Error flag output (/OC) at over current detection has a delay filter. This delay filter prevents instantaneous current detection such as inrush current at switch ON, or applying external power supplies. If fault flag output is unused, /OC pin should be connected to open or ground line. VCTRL CTRL CTRL V V VEN EN VOUT V VOUT OUT IOUT IOUT OUT Output Short shortcircuit Output Circuit Thermal shut down Thermal Shutdown V VFLAG FLAG FLAG V V/OC /OC FLAG delay Output Delay Figure 61. BD6516F/ BD6517F/BD2042AFJ/ BD2052AFJ Over Current Detection, Thermal Shutdown Timing Diagram (V CTRL , V /EN of BD6517F/BD2042AFJ Active Low) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 23/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Power Dissipation (SOP8, SOP-J8) 700 Power Dissipation: Pd[mW] POWER DISSIPATION : Pd [mW] 600 500 400 300 200 100 0 0 25 50 75 100 AMBIENT [℃] AmbientTEMPERATURE Temperature:: TaTa[°C] 125 150 70mm x 70mm x 1.6mm Glass Epoxy Board Figure 62. Power Dissipation Curve www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 24/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ I/O Equivalence Circuit BD6516F/BD6517F Symbol Pin No. CTRLA CTRLB 1, 4 Equivalence Circuit CTRLA CTRLB FLAGA FLAGB FLAGA FLAGB 2, 3 OUTA OUTB 5, 8 OUTA OUTB BD2042AFJ/BD2052AFJ Symbol Pin No /EN1(EN1) /EN2(EN2) Equivalence Circuit /EN1(EN1) /EN2(EN2) 3, 4 /OC1 /OC2 /OC1 /OC2 OUT1 OUT2 5, 8 OUT1 OUT2 6, 7 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 25/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. In rush Current 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 26/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Operational Notes - continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C Pin A N P+ N P N P+ N Parasitic Elements N P+ GND E N P N P+ B N C E Parasitic Elements P Substrate P Substrate Parasitic Elements Pin B B Parasitic Elements GND GND Figure 63. Example of monolithic IC structure N Region close-by GND 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 15. Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of use. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 27/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Ordering Information B D 6 5 1 x D - Package F: SOP8 Part Number 6516 6517 B F 2 0 x 2 A Part Number 2042 2052 F E2 Packaging and forming specification E2: Embossed tape and reel (SOP8) J - Package FJ:SOP-J8 E2 Packaging and forming specification E2: Embossed tape and reel (SOP-J8) Marking Diagrams SOP8 (TOP VIEW) SOP-J8 (TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK Part Number Part Number Marking Part Number Part Number Marking BD6516F D6516 BD2042AFJ D042A D6517 BD2052AFJ D052A BD6517F www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 28/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Physical Dimension, Tape and Reel Information Package Name SOP8 (Max 5.35 (include. BURR)) (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 29/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ BD2052AFJ Datasheet Physical Dimension, Tape and Reel Information – continued Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SOP-J8 30/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 BD6516F BD6517F BD2042AFJ Datasheet BD2052AFJ Revision History Date Revision 11.Mar.2013 25.Jun.2013 001 002 21.Aug.2014 003 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Changes New Release Changed character color from RED to BLACK on page 6. Applied the ROHM Standard Style and improved understandability. Delete BD6512F and BD6513F. 31/31 TSZ02201-0E3E0H300240-1-2 21.Aug.2014 Rev.003 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001