HSMF-C116 Ultra Small Surface Mount Tricolor ChipLED Data Sheet Features Applications LED with AlInGaP and InGaN die Surface mount device with ultra small 1.0 x 1.0mm footprint Suitable for application that requires small pitch size Compatible with reflow soldering Taped in 8mm carrier tape on a 7 inch diameter reel Display Backlighting Indicator Package Dimensions Notes: 1. All dimensions in millimeters. 2. Tolerance is ±0.1mm unless otherwise specified. CAUTION: This LED is class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional details. 1 Absolute Maximum Ratings (TJ = 25°C) Parameter AlInGaP Red InGaN Green InGaN Blue Unit 10 10 10 mA 60 60 60 mA Power Dissipation 22 31 33 mW LED Junction Temperature 95 95 95 °C DC Forward Current [1] Peak Forward Current [2] Operating Temperature Range -40 to 85 °C Storage Temperature Range -40 to 85 °C Notes: 1. Derate linearly as shown in Figure 7. 2. 1/10 duty factor and 0.1ms pulse width. Optical Characteristics (T J = 25°C, R=10mA, G/B=5mA) Color Luminous Intensity, Iv(mcd) [1] Peak Wavelength, λp(nm) Dominant Wavelength, λd (nm) [2] Viewing Angle, 2θ1/2 (°) [3] Min. Typ. Max. Typ. Typ. Typ. Red 63.0 80.0 140.0 631 622 137 Green 140.0 220.0 315.0 520 528 140 Blue 32.0 45.0 71.0 466 471 140 Notes: 1. The luminous intensity is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not be aligned with the axis. 2. The dominant wavelength is derived from the CIE chromaticity diagram and represents the perceived color of the device. 3. Θ1/2 is the off axis angle where the luminous intensity is ½ the peak intensity. Electrical Characteristics (TJ = 25°C, R=10mA, G/B=5mA) Forward Voltage, VF (V) [1] Reverse Voltage, VR (V)[2] at IR=100μA Min. Max. Min. Red 1.8 2.2 5 Green 2.5 3.1 5 Blue 2.7 3.3 5 Color Notes: 1. Forward voltage tolerance ±0.1V. 2. Reverse voltage indicates product final test. Long term reverse bias is not recommended. 2 Bin Information Intensity Bins (CAT) - Red Color Bins (BIN) - Red Bin ID Luminous Intensity (mcd) Min. Max. P2 Q Q5 Q7 63.0 71.0 80.0 90.0 100.0 112.0 125.0 140.0 Bin ID Dominant Wavelength (nm) Min. Max. 1 615.0 627.0 Tolerance: ±1nm Tolerance: ±15% Intensity Bins (CAT) - Green Color Bins (BIN) - Green Bin ID Luminous Intensity (mcd) Min. Max. R7 R9 S S5 140.0 159.0 180.0 201.0 224.0 250.0 280.0 315.0 Tolerance: ±15% Bin ID Dominant Wavelength (nm) Min. Max. 2 3 4 5 6 523.0 525.0 528.0 530.0 533.0 529.0 531.0 534.0 536.0 539.0 Tolerance: ±1nm Intensity Bins (CAT) - Blue Color Bins (BIN) - Blue Bin ID Luminous Intensity (mcd) Min. Max. N5 N7 N9 P 32.0 36.0 40.0 45.0 50.0 56.0 63.0 71.0 Bin ID Dominant Wavelength (nm) Min. Max. 6 7 8 466.0 468.0 470.0 471.0 473.0 475.0 Tolerance: ±1nm Tolerance: ±15% Caution: 1. The above optical performance specifications are valid in the case where single LED is lit up. 2. The above product specifications DO NOT provide any guarantee on color mixing, color consistency over time or uniformity in luminous intensity when more than 1 LED is lit up. 3 0 Figure 1. Spectral power dissipation 10 20 30 40 If - mA 50 60 Figure 2. Relative intensity vs. forward current 60 50 If - mA 40 30 20 10 0 0 10 20 30 40 If - mA 50 Figure 3. Forward current vs. forward voltage Figure 4. Dominant wavelength shift vs. forward current Figure 5. Radiation pattern Figure 6. Relative intensity vs. temperature 4 60 MAXIMUM FORWARD CURRENT - mA 12 10 8 6 4 2 0 0 20 40 60 80 AMBIENT TEMPE RA TURE - °C 100 Figure 7. Derating curve Figure 8. Recommended soldering land pattern Figure 9. Reel dimensions 5 Figure 10. Carrier tape dimensions Soldering Recommended reflow soldering condition: (a) Reflow soldering must not be done more than 2 times. Do observe necessary precautions of handling moisture sensitive device as stated in below section. (b) Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. (c) It is preferred to use reflow soldering to solder the LED. But if unavoidable (such as rework), manual hand soldering can be used but must be strictly controlled to condition below: Soldering iron tip temperature = 310°C max Soldering duration = 2sec max Number of cycle = 1 only Power of soldering iron = 50W max (d) Do not touch the LED package body with the soldering iron except for the soldering terminals as it may cause damage to the LED. (e) User is advised to confirm beforehand whether the functionality and performance of the LED is affected by hand soldering. 6 PRECAUTIONARY NOTES 1. Handling of moisture sensitive device This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Do refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. (a) Before use - An unopened moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity Indicator Card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is recommended that the MBB not be opened prior to assembly (e.g. for IQC). (b) Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30°C / 60%RH at all times and all high temperature related processes including soldering, curing or rework need to be completed within 168 hours. (c) Control for unfinished reel - Unused LEDs must be stored in a sealed MBB with desiccant or desiccator at <5%RH. (d) Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure that all LEDs have not exceeded their floor life of 168 hours. (e) Baking is required if: - The HIC indicator is not blue at 10% and is pink at 5%. - The LEDs are exposed to condition of >30°C / 60% RH at any time. - The LED floor life exceeded 168hrs. The recommended baking condition is: 60±5ºC for 20hrs Baking should only be done once. Disclaimer Avago’s products are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved. February 4, 2015 7