WEDC EDI88512LPAXMB 512kx8 plastic monolithic sram cmo Datasheet

White Electronic Designs
EDI88512CA-RP
512Kx8 Plastic Monolithic SRAM CMOS
WEDC's ruggedized plastic 512Kx8 SRAM that allows
the user to capitalize on the cost advantage of using a
plastic component while not sacrificing all of the reliability
available in a full military device.
FEATURES
512Kx8 bit CMOS Static
Random Access Memory
Extended temperature testing is performed with the test
patterns developed for use on WEDC’s fully compliant
512Kx8 SRAMs. WEDC fully characterizes devices
to determine the proper test patterns for testing at
temperature extremes. This is critical because the
operating characteristics of device change when it is
operated beyond the commercial guarantee a device that
operates reliably in the field at temperature extremes.
Users of WEDC’s ruggedized plastic benefit from WEDC’s
extensive experience in characterizing SRAMs for use in
military systems.
• Access Times of 17, 20, 25ns
• Data Retention Function (LPA version)
• Extended Temperature Testing
• Data Retention Functionality Testing
36 lead JEDEC Approved Revolutionary Pinout
• Plastic SOJ (Package 319)
Single +5V (±10%) Supply Operation
WEDC ensures Low Power devices will retain data in Data
Retention mode by characterizing the devices to determine
the appropriate test conditions. This is crucial for systems
operating at -40°C or below and using dense memories
such as 512Kx8s.
WEDC’s ruggedized plastic SOJ is footprint compatible
with WEDC’s full military ceramic 36 pin SOJ.
FIG. 1 – PIN CONFIGURATION
PIN Description
TOP VIEW
A0
A1
A2
A3
A4
CS#
I/O0
I/O1
VCC
VSS
I/O2
I/O3
WE#
A5
A6
A7
A8
A9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
36pin
Revolutionary
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
NC
A18
A17
A16
A15
OE#
I/O7
I/O6
VSS
VCC
I/O5
I/O4
A14
A13
A12
A11
A10
NC
BLOCK DIAGRAM
I/O0-7
Data Inputs/Outputs
A0-18
Address Inputs
WE#
Write Enables
CS#
Chip Selects
OE#
Output Enable
VCC
Power (+5V ±10%)
VSS
Ground
NC
Not Connected
Memory Array
AØ-18
Address
Buffer
Address
Decoder
I/O
Circuits
I/OØ-7
WE#
CS#
OE#
May 2004
Rev. 6
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
EDI88512CA-RP
ABSOLUTE MAXIMUM RATINGS
TRUTH TABLE
Unit
OE#
CS#
WE#
Mode
Output
Power
-0.5 to 7.0
V
X
H
X
Standby
High Z
Icc2, Icc3
H
L
H
Output Deselect
High Z
Icc1
0 to +70
°C
L
H
Data Out
Icc1
°C
L
Read
-40 to +85
X
L
L
Write
Data In
Icc1
Parameter
Voltage on any pin relative to Vss
Operating Temperature TA (Ambient)
Commercial
Industrial
Military
-55 to +125
°C
Storage Temperature, Plastic
-65 to +150
°C
Power Dissipation
1.5
W
Output Current
20
mA
Junction Temperature, TJ
175
°C
RECOMMENDED OPERATING CONDITIONS
Parameter
NOTE:
Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage
to the device. This is a stress rating only and functional operation of the device at these or any other
conditions greater than those indicated in the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Symbol
Min
Typ
Max
Unit
V
Supply Voltage
VCC
4.5
5.0
5.5
Supply Voltage
VSS
0
0
0
V
Input High Voltage
VIH
2.2
—
VCC + 0.5
V
Input Low Voltage
VIL
-0.3
—
+0.8
V
CAPACITANCE
TA = +25°C
Parameter
Symbol
Condition
Max
Unit
Address Lines
CI
VIN = Vcc or Vss, f = 1.0MHz
6
pF
Data Lines
CO
VIN = Vcc or Vss, f = 1.0MHz
8
pF
These parameters are sampled, not 100% tested.
DC CHARACTERISTICS
VCC = 5V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter
Symbol
Input Leakage Current
Conditions
Min
Max
Units
10
µA
ILI
VCC = 5.5, VIN = VSS to VCC
Output Leakage Current
ILO
CS# = VIL, OE# = VIH, VOUT = VSS to VCC
10
µA
Operating Supply Current
ICC
CS# = VIL, OE# = VIH, f = 5MHz, VCC = 5.5
180
mA
15
mA
Standby Current
ISB
CS# = VIH, OE# = VIH, f = 5MHz, VCC = 5.5
Output High Volltage
VOH
IOH = -4.0mA, VCC = 4.5
Output Low Voltage
VOL
IOL = 8.0mA, VCC = 4.5
2.4
V
0.4
V
NOTE: DC test conditions: VIL = 0.3V, VIH = VCC -0.3V
AC TEST CONDITIONS
Figure 1
Figure 2
Vcc
480Ω
Q
Vcc
Input Pulse Levels
Input Rise and Fall Times
Input and Output Timing Levels
Output Load
480Ω
Q
VSS to 3.0V
5ns
1.5V
Figure 1
NOTE: For tEHQZ, tGHQZ and tWLQZ, CL = 5pF (Figure 2)
255Ω
May 2004
Rev. 6
30pF
255Ω
5pF
2
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
EDI88512CA-RP
AC CHARACTERISTICS – READ CYCLE
VCC = 5.0V, VSS = 0V, 0°C ≤ TA ≤ +70°C
Parameter
Symbol
JEDEC
Alt.
Min
17ns
tRC
17
20ns
Max
Min
25ns
Max
20
Min
Max
25
Units
ns
Read Cycle Time
tAVAV
Address Access Time
tAVQV
tAA
17
20
25
ns
Chip Enable Access Time
tELQV
tACS
17
20
25
ns
10
ns
12
ns
Chip Enable to Output in Low Z (1)
tELQX
tCLZ
3
Chip Disable to Output in High Z (1)
tEHQZ
tCHZ
0
Output Hold from Address Change
tAVQX
tOH
0
Output Enable to Output Valid
tGLQV
tOE
Output Enable to Output in Low Z (1)
tGLQX
tOLZ
0
Output Disable to Output in High Z(1)
tGHQZ
tOHZ
0
3
7
3
0
8
0
ns
0
0
8
ns
10
0
7
0
0
8
0
Max
Min
ns
10
ns
Max
Units
1. This parameter is guaranteed by design but not tested.
AC CHARACTERISTICS – WRITE CYCLE
VCC = 5.0V, VSS = 0V, 0°C ≤ TA ≤ +70°C
Parameter
Symbol
JEDEC
Alt.
Min
17ns
20ns
Max
Min
25ns
Write Cycle Time
tAVAV
tWC
17
20
25
ns
Chip Enable to End of Write
tELWH
tELEH
tCW
tCW
14
14
15
15
17
17
ns
ns
Address Setup Time
tAVWL
tAVEL
tAS
tAS
0
0
0
0
0
0
ns
ns
Address Valid to End of Write
tAVWH
tAVEH
tAW
tAW
14
14
15
15
17
17
ns
ns
Write Pulse Width
tWLWH
tWLEH
tWP
tWP
14
14
15
15
17
17
ns
ns
Write Recovery Time
tWHAX
tEHAX
tWR
tWR
0
0
0
0
0
0
ns
ns
Data Hold Time
tWHDX
tEHDX
tDH
tDH
0
0
0
0
0
0
ns
ns
Write to Output in High Z (1)
tWLQZ
tWHZ
0
Data to Write Time
tDVWH
tDVEH
tDW
tDW
8
8
10
10
12
12
ns
ns
Output Active from End of Write (1)
tWHQX
tWLZ
0
0
0
ns
8
0
8
0
10
ns
1. This parameter is guaranteed by design but not tested.
May 2004
Rev. 6
3
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
EDI88512CA-RP
FIG. 2 – TIMING WAVEFORM — READ CYCLE
tAVAV
ADDRESS
tAVQV
CS#
tAVAV
ADDRESS
ADDRESS 1
ADDRESS 2
tAVQV
tAVQX
tELQV
tELQX
tEHQZ
tGLQV
tGLQX
tGHQZ
OE#
DATA I/O
DATA 1
DATA OUT
DATA 2
READ CYCLE 2 (WE# HIGH)
READ CYCLE 1 (WE# HIGH; OE#, CS# LOW)
FIG. 3 – WRITE CYCLE — WE# CONTROLLED
tAVAV
ADDRESS
tAVWH
tELWH
tWHAX
CS#
tAVWL
tWLWH
WE#
tDVWH
DATA IN
tWHDX
DATA VALID
tWLQZ
tWHQX
HIGH Z
DATA OUT
WRITE CYCLE 1, WE# CONTROLLED
FIG. 4 – WRITE CYCLE — CS# CONTROLLED
tAVAV
ADDRESS
tAVEH
tELEH
WS32K32-XHX
tEHAX
CS#
tAVEL
tWLEH
WE#
tDVEH
DATA IN
tEHDX
DATA VALID
HIGH Z
DATA OUT
WRITE CYCLE 2, CS# CONTROLLED
May 2004
Rev. 6
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
EDI88512CA-RP
DATA RETENTION CHARACTERISTICS (EDI88512LPA ONLY)
-55°C ≤ TA ≤ +125°C
Characteristic
Low Power Version only
Sym
Conditions
Min
Typ
Max
Units
Data Retention Voltage
Data Retention Quiescent Current
VDD
ICCDR
VDD = 2.0V
CS# ≥ VDD -0.2V
2
–
–
–
–
2
V
mA
Chip Disable to Data Retention Time
Operation Recovery Time
TCDR
TR
VIN ≥ VDD -0.2V
or VIN ≤ 0.2V
0
TAVAV
–
–
–
ns
ns
FIG. 5 – DATA RETENTION - CS# CONTROLLED
Data Retention Mode
4.5V
Vcc
VDD
4.5V
tCDR
CS#
tR
CS# = VDD -0.2V
DATA RETENTION, CS# CONTROLLED
May 2004
Rev. 6
5
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
EDI88512CA-RP
FIG. 6 – NORMALIZED OPERATING GRAPHS
Write Pulse Width vs. Temp.
ICC1 (20ns) vs Temp
14
13
Write Pulse Width (ns)
220
ICC1 (ma)
210
200
190
180
11
10
9
8
7
170
160
12
6
-55
25
-55
125
25
TAVQV vs. Temp
ICC3 vs. Temp
10
22
TAVQV (ns)
ICC3 (ma)
125
Temp. (C)
Temp. (C)
1
20
18
190
16
0.1
14
12
0.01
-55
25
-55
125
25
125
Temp. (C)
Temp. (C)
ICCDR vs. Temp
10
Normalized curves are offered
as a service to our customers.
They are not to be construed
as a guarantee of operating
characterics.
ICCDR (ma)
1
0.1
Characteristics of actual
devices will vary.
0.01
0.001
-55
25
125
Temp. (C)
IDR, 2V
May 2004
Rev. 6
6
IDR, 3V
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
EDI88512CA-RP
PACKAGE 319: 36 LEAD, PLASTIC SMALL OUTLINE J-LEAD (SOJ)
0.920
0.930
0.395
0.405
0.360 0.435
0.380 0.445
0.026
0.032
Pin 1 Indicator
0.148
max.
0.375
TYP.
0.050
TYP.
0.027
min.
0.015
0.021
ALL DIMENSIONS ARE IN INCHES
ORDERING INFORMATION
EDI 8 8 512 CA X X X
WHITE ELECTRONIC DESIGNS
SRAM
ORGANIZATION, 512Kx8
TECHNOLOGY:
CA = CMOS Standard Power
LPA = Low Power
ACCESS TIME (ns)
PACKAGE TYPE:
M = 36 lead Plastic SOJ
DEVICE GRADE:
B = MIL-STD-883 Compliant
M = Military Screened
I = Industrial
C = Commercial
May 2004
Rev. 6
-55°C to +125°C
-40°C to +85°C
0°C to +70°C
7
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
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