NCP662, NCV662, NCP663, NCV663 100 mA CMOS Low Iq Low-Dropout Voltage Regulator This series of fixed output low−dropout linear regulators are designed for handheld communication equipment and portable battery powered applications which require low quiescent current. This series features an ultra−low quiescent current of 2.5 A. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, resistors for setting output voltage, current limit, and temperature limit protection circuits. The NCP662/NCV662 series provides an enable pin for ON/OFF control. This series has been designed to be used with low cost ceramic capacitors and requires a minimum output capacitor of 0.1 F. The device is housed in the micro−miniature SC82−AB surface mount package. Standard voltage versions are 1.5, 1.8, 2.5, 2.7, 2.8, 3.0, 3.3, and 5.0 V. http://onsemi.com SC−82AB CASE 419C PIN CONNECTIONS & MARKING DIAGRAMS GND 1 Typical Applications Vin 2 3 Vout (NCP662/NCV662 Top View) GND 1 Vin 2 4 N/C xxxMG G Low Quiescent Current of 2.5 A Typical Low Output Voltage Option Output Voltage Accuracy of 2.0% Temperature Range for NCV662/NCV663 −40C to 125C Temperature Range for NCP662/NCP663 −40C to 85C NCP662/NCV662 Provides as Enable Pin NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable Pb−Free Packages are Available 4 Enable xxxMG G Features 3 Vout (NCP663/NCV663 Top View) Battery Powered Instruments Hand−Held Instruments Camcorders and Cameras Automotive Infotainment xxx M G = Specific Device Code = Month Code* = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. Semiconductor Components Industries, LLC, 2013 May, 2013 − Rev. 3 1 Publication Order Number: NCP662/D NCP662, NCV662, NCP663, NCV663 ON GND Enable GND N/C Vin Vout OFF Input Vin C1 Output Vout + + Input C2 C1 + Output + C2 This device contains 28 active transistors This device contains 28 active transistors Figure 1. NCP662/NCV662 Typical Application Diagram Figure 2. NCP663/NCV663 Typical Application Diagram ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PIN FUNCTION DESCRIPTION NCP662/ NCV662 NCP663/ NCV663 Pin Name 1 1 GND 2 2 Vin Positive power supply input voltage. 3 3 Vout Regulated output voltage. 4 − Enable − 4 N/C Description Power supply ground. This input is used to place the device into low−power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable should be connected to Vin. No internal connection. MAXIMUM RATINGS Rating Symbol Input Voltage Value Unit Vin 6.0 V Enable −0.3 to Vin +0.3 V Output Voltage Vout −0.3 to Vin +0.3 V Power Dissipation and Thermal Characteristics Power Dissipation Thermal Resistance, Junction to Ambient PD RJA Internally Limited 330 W C/W Operating Junction Temperature TJ +150 C Operating Ambient Temperature NCP662/NCP663 NCV662/NCV663 TA Storage Temperature Tstg Enable Voltage (NCP662/NCV662 ONLY) −40 to +85 −40 to +125 −55 to +150 C C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL−STD−883, Method 3015 Machine Model Method 200 V 2. Latch up capability (85C) "100 mA DC with trigger voltage. http://onsemi.com 2 NCP662, NCV662, NCP663, NCV663 ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Venable = Vin, Cin = 1.0 F, Cout = 1.0 F, TJ = 25C, unless otherwise noted.) Characteristic Symbol Output Voltage (Iout = 1.0 mA) NCP662/NCP663: TA = −40C to 85C NCV662/NCV663: TA = −40C to 125C 1.5 V 1.8 V 2.5 V 2.7 V 2.8 V 3.0 V 3.3 V 5.0 V Vout Output Voltage (TA = −40C to 85C, Iout = 100 mA) 1.5 V 1.8 V 2.5 V 2.7 V 2.8 V 3.0 V 3.3 V 5.0 V Vout Line Regulation 1.5 V−4.4 V (Vin = Vo(nom.) + 1.0 V to 6.0 V 4.5 V−5.0 V (Vin = 5.5 V to 6.0 V) Regline Load Regulation (Iout = 10 mA to 100 mA) Regload Output Current (Vout = (Vout at Iout = 100 mA) −3.0%) 1.5 V to 3.9 V (Vin = Vout(nom.) + 2.0 V) 4.0 V−5.0 V (Vin = 6.0 V) Io(nom.) Dropout Voltage (Iout = 100 mA, Measured at Vout −3.0%) NCP662/NCP663: TA = −40C to 85C NCV662/NCV663: TA = −40C to 125C 1.5 V−1.7 V 1.8 V−2.4 V 2.5 V−2.6 V 2.7 V−2.9 V 3.0 V−3.2 V 3.3 V−4.9 V 5.0 V Vin−Vout Quiescent Current (Enable Input = 0 V) (Enable Input = Vin, Iout = 1.0 mA to Io(nom.)) IQ Output Short Circuit Current 1.5 V to 3.9 V (Vin = Vnom + 2.0 V) 4.0 V−5.0 V (Vin = 6.0 V) Iout(max) Output Voltage Noise (f = 100 Hz to 100 kHz, Vout = 3.0 V) Vn Enable Input Threshold Voltage (NCP662/NCV662 ONLY) (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Vth(en) Output Voltage Temperature Coefficient TC Min Typ Max V 1.463 1.755 2.438 2.646 2.744 2.940 3.234 4.9 1.5 1.8 2.5 2.7 2.8 3.0 3.3 5.0 1.538 1.845 2.563 2.754 2.856 3.060 3.366 5.1 1.433 1.719 2.388 2.592 2.688 2.880 3.168 4.8 1.5 1.8 2.5 2.7 2.8 3.0 3.3 5.0 1.568 1.881 2.613 2.808 2.912 3.120 3.432 5.2 − − 10 10 20 20 − 20 40 100 100 280 280 − − − − − − − − − 680 500 300 280 250 230 170 950 700 500 500 420 420 300 − − 0.1 2.5 1.0 6.0 150 150 300 300 600 600 − 100 − 1.3 − − − − 0.5 − "100 − T *TA PD + J(max) RJA 4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 3 V mV mV mA mV 3. Maximum package power dissipation limits must be observed. http://onsemi.com Unit A mA Vrms V ppm/C NCP662, NCV662, NCP663, NCV663 TYPICAL CHARACTERISTICS 3 VIN = 4.0 V VOUT = 3.0 V IOUT = 0 mA 2.7 IQ, QUIESCENT CURRENT (A) IQ, QUIESCENT CURRENT (A) 2.9 2.5 2.3 2.1 1.9 1.7 −60 −40 VOUT = 3.0 V 2.5 2 1.5 1 0.5 0 −20 0 20 40 60 0 100 80 1 T, TEMPERATURE (C) 3.5 3.015 3 VIN = 6.0 V 3.010 3.005 3.000 2.990 −60 VIN = 4.0 V 6 IOUT = 30 mA 2 1.5 1 0.5 0 −40 0 −20 20 40 60 80 100 0 1 2 3 4 5 T, TEMPERATURE (C) VIN, INPUT VOLTAGE (V) Figure 5. Output Voltage versus Temperature Figure 6. Output Voltage versus Input Voltage 300 VOUT(nom) = 3.0 V 250 80 mA LOAD 200 150 6 4 2 VIN = 4.0 V CIN = 1.0 F 0 3 40 mA LOAD 100 50 0 5 4 2.5 ENABLE VOLTAGE (V) VIN − VOUT, DROPOUT VOLTAGE (mV) VOUT, OUTPUT VOLTAGE (V) 3.020 2.995 3 Figure 4. Quiescent Current versus Input Voltage VOUT, OUTPUT VOLTAGE (V) VOUT, OUTPUT VOLTAGE (V) Figure 3. Quiescent Current versus Temperature VOUT(nom) = 3.0 V IOUT = 10 mA 2 VIN, INPUT VOLTAGE (V) 10 mA LOAD −50 −25 0 25 50 75 100 1 0 125 COUT = 0.1 F IOUT = 10 mA 2 0 T, TEMPERATURE (C) 50 100 150 200 250 300 t, TIME (s) Figure 7. Dropout Voltage versus Temperature Figure 8. Turn−On Response (NCP662/NCV662 ONLY) http://onsemi.com 4 350 400 NCP662, NCV662, NCP663, NCV663 IOUT, OUTPUT CURRENT (mA) 6 5 4 3 OUTPUT VOLTAGE DEVIATION (V) 1 0.5 0 VOUT = 3.0 V COUT = 0.1 F IOUT = 10 mA −0.5 −1 0 50 100 150 200 250 300 350 400 0 −30 1 VOUT = 3.0 V COUT = 0.1 F 0.5 0 −0.5 −1 0 50 100 150 200 250 300 350 400 t, TIME (s) t, TIME (s) Figure 9. Line Transient Response Figure 10. Load Transient Response IOUT = 1.0 mA to 30 mA VIN = 4.0 V 30 0 −30 400 200 0 −400 0 IOUT = 1.0 mA to 30 mA VIN = 4.0 V 30 450 500 60 −200 60 COUT = 1.0 F VOUT = 3.0 V 100 200 300 400 500 600 700 800 900 1000 Vn, OUTPUT VOLTAGE NOISE (mV/Hz) OUTPUT VOLTAGE DEVIATION (mV) IOUT, OUTPUT CURRENT (mA) OUTPUT VOLTAGE DEVIATION (V) VIN, INPUT VOLTAGE (V) TYPICAL CHARACTERISTICS 3.5 VIN = 5.0 V VOUT = 3.0 V IOUT = 50 mA COUT = 0.1 F 3 2.5 2 1.5 1 0.5 0 0.01 0.1 1 10 100 t, TIME (s) f, FREQUENCY (kHz) Figure 11. Load Transient Response Figure 12. Output Voltage Noise http://onsemi.com 5 450 500 1000 NCP662, NCV662, NCP663, NCV663 DEFINITIONS Load Regulation Line Regulation The change in output voltage for a change in output current at a constant temperature. The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 3.0% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Line Transient Response Typical over and undershoot response when input voltage is excited with a given slope. Thermal Protection Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 160C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Maximum Power Dissipation The maximum total dissipation for which the regulator will operate within its specifications. Quiescent Current The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current. Maximum Package Power Dissipation The maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125C. Depending on the ambient power dissipation and thus the maximum available output current. http://onsemi.com 6 NCP662, NCV662, NCP663, NCV663 APPLICATIONS INFORMATION Thermal A typical application circuit for the NCP662/NCV662 and NCP663/NCV663 series are shown in Figure 1 and Figure 2. As power across the NCP662/NCV662 and NCP663/NCV663 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. The mounting pad configuration on the PCB, the board material, and the ambient temperature effect the rate of temperature rise for the part. This is stating that when the devices have good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by: Input Decoupling (C1) A 1.0 F capacitor, either ceramic or tantalum is recommended and should be connected close to the device package. Higher capacitance values and lower ESR will improve the overall line transient response. TDK capacitor: C2012X5R1C105K or C1608X5R1A105K Output Decoupling (C2) The NCP662/NCV662 and NCP663/NCV663 are very stable regulators and do not require any specific Equivalent Series Resistance (ESR) or a minimum output current. Capacitors exhibiting ESRs ranging from a few m up to 10 can safely be used. The minimum decoupling value is 0.1 F and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response. TDK capacitor: C2012X5R1C105K, C1608X5R1A105K, or C3216X7R1C105K T *TA PD + J(max) RJA If junction temperature is not allowed above the maximum 125C, then the NCP662/NCV662 and NCP663/NCV663 can dissipate up to 300 mW @ 25C. The power dissipated by the NCP662/NCV662 and NCP663/NCV663 can be calculated from the following equation: Ptot + ƪVin * Ignd (Iout)ƫ ) [Vin * Vout] * Iout or Enable Operation (NCP662/NCV662 ONLY) P ) Vout * Iout VinMAX + tot Ignd ) Iout The enable pin will turn on the regulator when pulled high and turn off the regulator when pulled low. The threshold limits are covered in the electrical specification section of the data sheet. If the enable is not used, the pin should be connected to Vin. If an 100 mA output current is needed then the ground current from the data sheet is 2.5 A. For the NCP662/NCV662 or NCP663/NCV663 (3.0 V), the maximum input voltage is 6.0 V. Hints Please be sure the Vin and GND lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible. http://onsemi.com 7 NCP662, NCV662, NCP663, NCV663 ORDERING INFORMATION Nominal Output Voltage Marking NCP662SQ15T1G 1.5 LGY NCP662SQ18T1G 1.8 LGZ NCP662SQ25T1G 2.5 LHA NCP662SQ27T1G 2.7 LHB NCP662SQ28T1G 2.8 LHC NCP662SQ30T1G 3.0 LHD NCP662SQ33T1G 3.3 LHE NCP662SQ50T1G 5.0 LHF NCP663SQ15T1G 1.5 LHG NCP663SQ18T1G 1.8 LHH NCP663SQ25T1G 2.5 LHI NCP663SQ27T1G 2.7 LHJ NCP663SQ28T1G 2.8 LHK NCP663SQ30T1G 3.0 LHL NCP663SQ33T1G 3.3 LHM NCP663SQ50T1G 5.0 LHN NCV662SQ15T1G* 1.5 LGY NCV662SQ18T1G* 1.8 LGZ NCV662SQ25T1G* 2.5 LHA NCV662SQ27T1G* 2.7 LHB NCV662SQ28T1G* 2.8 LHC NCV662SQ30T1G* 3.0 LHD NCV662SQ33T1G* 3.3 LHE NCV662SQ50T1G* 5.0 LHF NCV663SQ15T1G* 1.5 LHG NCV663SQ18T1G* 1.8 LHH NCV663SQ25T1G* 2.5 LHI NCV663SQ27T1G* 2.7 LHJ NCV663SQ28T1G* 2.8 LHK NCV663SQ30T1G* 3.0 LHL NCV663SQ33T1G* 3.3 LHM NCV663SQ50T1G* 5.0 LHN Device Package Shipping† SC−82AB 3000 Units/ 8 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 8 NCP662, NCV662, NCP663, NCV663 PACKAGE DIMENSIONS SC−82AB CASE 419C−02 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. 419C−01 OBSOLETE. NEW STANDARD IS 419C−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A G C D 3 PL N 4 3 K B S 1 2 F L MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.20 0.40 0.30 0.50 1.10 1.50 0.00 0.10 0.10 0.26 0.10 −−− 0.05 BSC 0.20 REF 1.80 2.40 DIM A B C D F G H J K L N S H J 0.05 (0.002) INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.008 0.016 0.012 0.020 0.043 0.059 0.000 0.004 0.004 0.010 0.004 −−− 0.002 BSC 0.008 REF 0.07 0.09 SOLDERING FOOTPRINT* 1.30 0.0512 0.65 0.026 1.90 0.95 0.075 0.037 0.90 0.035 0.70 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 9 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NCP662/D