LM185-2.5-N, LM285-2.5-N, LM385-2.5-N www.ti.com SNVS743D – DECEMBER 1999 – REVISED MARCH 2013 LM185-2.5-N/LM285-2.5-N/LM385-2.5-N Micropower Voltage Reference Diode Check for Samples: LM185-2.5-N, LM285-2.5-N, LM385-2.5-N FEATURES Careful design of the LM185-2.5-N has made the device exceptionally tolerant of capacitive loading, making it easy to use in almost any reference application. The wide dynamic operating range allows its use with widely varying supplies with excellent regulation. 1 • 2 • • • • • ±20 mV (±0.8%) max. Initial Tolerance (A Grade) Operating Current of 20 μA to 20 mA 0.6Ω Dynamic Impedance (A Grade) Low Temperature Coefficient Low Voltage Reference—2.5V 1.2V Device and Adjustable Device Also Available—LM185-1.2 Series and LM185 Series, respectively DESCRIPTION The extremely low power drain of the LM185-2.5-N makes it useful for micropower circuitry. This voltage reference can be used to make portable meters, regulators or general purpose analog circuitry with battery life approaching shelf life. Further, the wide operating current allows it to replace older references with a tighter tolerance part. For applications requiring 1.2V see LM185-1.2. The LM185-2.5-N/LM285-2.5-N/LM385-2.5-N are micropower 2-terminal band-gap voltage regulator diodes. Operating over a 20 μA to 20 mA current range, they feature exceptionally low dynamic impedance and good temperature stability. On-chip trimming is used to provide tight voltage tolerance. Since the LM-185-2.5-N band-gap reference uses only transistors and resistors, low noise and good long term stability result. The LM185-2.5-N is rated for operation over a −55°C to 125°C temperature range while the LM285-2.5-N is rated −40°C to 85°C and the LM385-2.5-N 0°C to 70°C. The LM185-2.5-N/LM285-2.5-N are available in a hermetic TO package and the LM285-2.5-N/LM3852.5-N are also available in a low-cost TO-92 molded package, as well as SOIC and SOT-23. The LM1852.5-N is also available in a hermetic leadless chip carrier package. Connection Diagram Figure 1. TO-92 Package (Bottom View) See Package Number LP0003A Figure 2. SOIC Package See Package Number D0008A * Pin 3 is attached to the Die Attach Pad (DAP) and should be connected to Pin 2 or left floating. Figure 3. SOT-23 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated LM185-2.5-N, LM285-2.5-N, LM385-2.5-N SNVS743D – DECEMBER 1999 – REVISED MARCH 2013 www.ti.com Figure 4. LCCC Leadless Chip Carrier See Package Number NAJ0020A Figure 5. TO Package (Bottom View) See Package Number NDU0002A These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) (3) Reverse Current 30 mA Forward Current 10 mA Operating Temperature Range (4) LM185-2.5-N −55°C to + 125°C LM285-2.5-N −40°C to + 85°C LM385-2.5-N 0°C to 70°C ESD Susceptibility (5) 2kV −55°C to + 150°C Storage Temperature TO-92 Package (10 sec.) Soldering Information 260°C TO Package (10 sec.) 300°C SOIC and SOT-23 Package Vapor Phase (60 sec.) 215°C Infrared (15 sec.) 220°C See http://www.ti.com for other methods of soldering surface mount devices. (1) (2) (3) (4) (5) Refer to RETS185H-2.5 for military specifications. Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. For elevated temperature operation, TJ MAX is: LM185-N: 150°C LM285-N: 125°C LM385-N: 100°C See THERMAL CHARACTERISTICS. The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. THERMAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) Thermal Resistance θja (Junction to Ambient) LM185 150°C LM285 125°C LM385 100°C TO-92 TO 180°C/W (0.4″ Leads) SOIC-8 SOT-23 440°C/W 165°C/W 283°C/W 80°C/W N/A N/A 170°C/W (0.125″ Leads) θjc (Junction to Case) 2 N/A Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N LM185-2.5-N, LM285-2.5-N, LM385-2.5-N www.ti.com SNVS743D – DECEMBER 1999 – REVISED MARCH 2013 ELECTRICAL CHARACTERISTICS LM385A-2.5-N Parameter Conditions LM385AX-2.5-N Typ LM385AY-2.5-N Tested Limit (2) Reverse Breakdown IR = 100 μA 2.500 Voltage Design Limit (3) 2.480 V(Min) 2.520 2.500 Minimum Operating 12 18 V(Max) 2.470 V(Min) 2.530 V(Max) 20 Current Reverse Breakdown μA (Max) IMIN ≤ IR ≤ 1mA 1 1.5 Voltage Change with Current Units (Limits) mV (Max) 1 mA ≤ IR ≤ 20 mA 10 20 mV (Max) Reverse Dynamic IR = 100 μA, Impedance f = 20 Hz Wideband Noise (rms) IR = 100 μA 0.2 0.6 Ω 1.5 120 μV 20 ppm 10 Hz ≤ f ≤ 10 kHz Long Term Stability IR = 100 μA, T = 1000 Hr, TA = 25°C ±0.1°C Average Temperature Coefficient (4) IMIN ≤ IR ≤ 20 mA X Suffix 30 Y Suffix 50 ppm/°C (Max) All Others (1) (2) (3) (4) 150 Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA = TJ = 25°C. Specified and 100% production tested. Specified, but not 100% production tested. These limits are not used to calculate average outgoing quality levels. The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between the operating TMAX and TMIN, divided by TMAX–TMIN. The measured temperatures are −55°C, −40°C, 0°C, 25°C, 70°C, 85°C, 125°C. Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N 3 LM185-2.5-N, LM285-2.5-N, LM385-2.5-N SNVS743D – DECEMBER 1999 – REVISED MARCH 2013 www.ti.com ELECTRICAL CHARACTERISTICS LM185-2.5-N LM385B-2.5-N LM185BX-2.5-N LM185BY-2.5-N Parameter Conditions Typ LM385BX-2.5-N LM285-2.5-N LM285BX-2.5-N LM385-2.5-N LM385BY-2.5-N Units (Limit) LM285BY-2.5-N Tested Limit (1) (2) Design Limit (3) Reverse Breakdown TA = 25°C, Voltage 2.5 20 μA ≤ IR ≤ 20 mA Minimum Operating Current 13 Tested Limit (1) Design Limit (3) Reverse Dynamic IR = 100 μA, Impedance f = 20 Hz Wideband Noise (rms) IR = 100 μA, Long Term Stability IR = 100 μA, 10 Hz ≤ f ≤ 10 kHz T = 1000 Hr, Design Limit (3) 2.462 2.462 2.425 V(Min) 2.538 2.538 2.575 V(Max) 30 μA (Max) 20 30 20 30 20 15 20 1 1.5 2.0 2.5 2.0 2.5 mV (Max) 10 20 20 25 20 25 mV (Max) LM385M3-2.5-N Reverse Breakdown 20 μA ≤ IR ≤ 1 mA Voltage Change with Current 1 mA ≤ IR ≤ 20 mA Tested Limit (1) 1 Ω 120 μV 20 ppm TA = 25°C ±0.1°C Average Temperature Coefficient (4) IR = 100 μA X Suffix 30 30 Y Suffix 50 50 All Others 150 ppm/°C ppm/°C 150 150 ppm/°C (Max) (1) (2) (3) (4) 4 Specified and 100% production tested. A military RETS electrical specification available on request. Specified, but not 100% production tested. These limits are not used to calculate average outgoing quality levels. The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between the operating TMAX and TMIN, divided by TMAX–TMIN. The measured temperatures are −55°C, −40°C, 0°C, 25°C, 70°C, 85°C, 125°C. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N LM185-2.5-N, LM285-2.5-N, LM385-2.5-N www.ti.com SNVS743D – DECEMBER 1999 – REVISED MARCH 2013 TYPICAL PERFORMANCE CHARACTERISTICS Reverse Characteristics Reverse Characteristics Figure 6. Figure 7. Forward Characteristics Temperature Drift Figure 8. Figure 9. Reverse Dynamic Impedance Reverse Dynamic Impedance Figure 10. Figure 11. Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N 5 LM185-2.5-N, LM285-2.5-N, LM385-2.5-N SNVS743D – DECEMBER 1999 – REVISED MARCH 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) Noise Voltage Filtered Output Noise Figure 12. Figure 13. Response Time Figure 14. 6 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N LM185-2.5-N, LM285-2.5-N, LM385-2.5-N www.ti.com SNVS743D – DECEMBER 1999 – REVISED MARCH 2013 APPLICATIONS Figure 15. Wide Input Range Reference Figure 16. Micropower Reference from 9V Battery LM385-2.5-N Applications IQ ≃ 30 μA standby current IQ ≃ 40 μA Figure 17. Micropower 5V Reference Figure 18. Micropower 10V Reference PRECISION 1 μA to 1 mA CURRENT SOURCES Figure 19. METER THERMOMETERS Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N 7 LM185-2.5-N, LM285-2.5-N, LM385-2.5-N SNVS743D – DECEMBER 1999 – REVISED MARCH 2013 www.ti.com Calibration Calibration 1. Short LM385-2.5-N, adjust R3 for IOUT=temp at 1μA/°K. 1. Short LM385-2.5-N, adjust R3 for IOUT=temp at 1.8 μA/°K 2. Remove short, adjust R2 for correct reading in centigrade 2. Remove short, adjust R2 for correct reading in °F Figure 20. 0°C–100°C Thermomemter Figure 21. 0°F–50°F Thermomemter Adjustment Procedure 1. Adjust TC ADJ pot until voltage across R1 equals Kelvin temperature multiplied by the thermocouple Seebeck coefficient. 2. Adjust zero ADJ pot until voltage across R2 equals the thermocouple Seebeck coefficient multiplied by 273.2. Figure 22. Micropower Thermocouple Cold Junction Compensator (1) 8 Thermocouple Type (1) Seebeck Coefficient (μV/°C) R1 (Ω) R2 (Ω) Voltage Across R1 @25°C (mV) Voltage Across R2 (mV) J 52.3 523 1.24k 15.60 14.32 T 42.8 432 1k 12.77 11.78 K 40.8 412 953Ω 12.17 11.17 S 6.4 63.4 150Ω 1.908 1.766 Typical supply current 50 μA Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N LM185-2.5-N, LM285-2.5-N, LM385-2.5-N www.ti.com SNVS743D – DECEMBER 1999 – REVISED MARCH 2013 Figure 23. Improving Regulation of Adjstable Regulators Schematic Diagram Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N 9 LM185-2.5-N, LM285-2.5-N, LM385-2.5-N SNVS743D – DECEMBER 1999 – REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision C (March 2013) to Revision D • 10 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 9 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N PACKAGE OPTION ADDENDUM www.ti.com 2-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM185BXH-2.5 ACTIVE TO NDU 2 1000 TBD Call TI Call TI -55 to 125 LM185BXH2.5 LM185BXH-2.5/NOPB ACTIVE TO NDU 2 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM185BXH2.5 LM185BYH-2.5 ACTIVE TO NDU 2 1000 TBD Call TI Call TI -55 to 125 LM185BYH2.5 LM185BYH-2.5/NOPB ACTIVE TO NDU 2 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM185BYH2.5 LM285BXM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BX M2.5 LM285BXMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 285BX M2.5 LM285BXZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type -40 to 85 285BX Z2.5 LM285BYM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BY M2.5 LM285BYMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BY M2.5 LM285BYZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type -40 to 85 285BY Z2.5 LM285M-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM285 M2.5 LM285MX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM285 M2.5 LM285Z-2.5/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type LM285Z-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type -40 to 85 LM285 Z-2.5 LM385BM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM385 BM2.5 LM385BMX-2.5 NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM385 BM2.5 LM385BMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM385 BM2.5 LM385BXM-2.5 NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 385BX Addendum-Page 1 LM285 Z-2.5 Samples PACKAGE OPTION ADDENDUM www.ti.com 2-Nov-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) M2.5 LM385BXM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BX M2.5 LM385BXMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BX M2.5 LM385BXZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type 0 to 70 385BX Z-2.5 LM385BYM-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BY M2.5 LM385BYMX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BY M2.5 LM385BYZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type 0 to 70 385BY Z-2.5 LM385BZ-2.5/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type LM385BZ-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type 0 to 70 LM385 BZ2.5 LM385M-2.5/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM385 M2.5 LM385M3-2.5 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI 0 to 70 R12 LM385M3-2.5/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 R12 LM385M3X-2.5 NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI 0 to 70 R12 LM385M3X-2.5/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 R12 LM385MX-2.5 NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM385 M2.5 LM385MX-2.5/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM385 M2.5 LM385Z-2.5/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type LM385 Z2.5 LM385Z-2.5/LFT2 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type LM385 Z2.5 LM385Z-2.5/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type LM385 Z2.5 Addendum-Page 2 LM385 BZ2.5 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 2-Nov-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) LM385Z-2.5/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type LM385Z-2.5/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type Op Temp (°C) Device Marking (4/5) LM385 Z2.5 0 to 70 LM385 Z2.5 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 2-Nov-2013 Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM285BXMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM285BYMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM285MX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BMX-2.5 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BXMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BYMX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385M3-2.5 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385M3-2.5/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385M3X-2.5 SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385M3X-2.5/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385MX-2.5 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385MX-2.5/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM285BXMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM285BYMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM285MX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BMX-2.5 SOIC D 8 2500 367.0 367.0 35.0 LM385BMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BXMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BYMX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385M3-2.5 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM385M3-2.5/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM385M3X-2.5 SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM385M3X-2.5/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM385MX-2.5 SOIC D 8 2500 367.0 367.0 35.0 LM385MX-2.5/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NDU0002A H02A (Rev F) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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