NLAS5157 Ultra-Low 0.4 W SPDT Analog Switch The NLAS5157 is Single Pole Double Throw (SPDT) switch designed for audio systems in portable applications. The NLAS5157 features Ultra−Low RON of 0.4 typical at VCC = 3.0 V and 0.15 RON Flatness for +3.0 V supply across temperature. This device also has a broad VCC operating range of 1.65 V to 4.3 V, ideal for battery−powered devices. The NLAS5157 is protected on all pins with 8 kV Human Body Model ESD protection. This allows the device to be placed in a variety of locations, including near the interface, without risk of damage. http://onsemi.com 1 UDFN6 CASE 517AQ Features • • • • MARKING DIAGRAM X M RON = 0.4 Typical @ VCC = 3.0 V VCC Range: 1.65 V to 4.3 V 8 kV Human Body Model ESD on All Pins These are Pb−Free Devices XM = Specific Device Code = Date Code PIN ASSIGNMENTS Typical Applications • Mobile Phones • Portable Devices IN 1 6 NO VCC 2 5 GND COM 3 4 NC (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2009 February, 2009 − Rev. 1 1 Publication Order Number: NLAS5157/D NLAS5157 PIN DESCRIPTION TRUTH TABLE PIN # Name Direction Description Control Input Function 1 IN Input Control Input Select Line L NC Connected to COM 2 VCC Power Voltage Supply H NO Connected to COM 3 COM I/O Common Signal Line 4 NC I/O Normally Closed Signal Line 5 GND Power Ground 6 NO I/O Normally Open Signal Line MAXIMUM RATINGS Symbol Pins Rating VCC VCC Positive DC Supply Voltage VIS NO, NC, or COM VIN IN IIS_CON NO, NC, or COM Analog Signal Continuous Current $300 Closed Switch mA IIS_PK NO, NC, or COM Analog Signal Peak Current $500 10% Duty Cycle mA IIN IN Control Input Current $20 mA −65 to 150 °C TSTG Value Condition Unit 0.5 to +5.5 V Analog Signal Voltage −0.5 to VCC + 0.5 V Control Input Voltage −0.5 to +5.5 V Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. RECOMMENDED OPERATING CONDITIONS Symbol Pins VCC VCC VIS NO, NC, or COM VIN IN Parameter Value Positive DC Supply Voltage Condition Unit 1.65 to 4.3 V Analog Signal Voltage GND to VCC V Control Input Voltage (OVT) Overvoltage Tolerance GND to 4.3 V TA Operating Temperature Range −40 to +85 °C tr, tf Input Rise or Fall Time 20 VCC = 1.6 V − 2.7 V 10 VCC = 3.0 V − 4.5 V ns/V Minimum and maximum values are guaranteed through test or design across the Recommended Operating Conditions, where applicable. Typical values are listed for guidance only and are based on the particular conditions listed for each section, where applicable. These conditions are valid for all values found in the characteristics tables unless otherwise specified in the test conditions. ESD PROTECTION Pins All Pins Description Minimum Voltage Human Body Model 7 kV http://onsemi.com 2 NLAS5157 DC ELECTRICAL CHARACTERISTICS CONTROL INPUT (Typical: T = 25°C; VCC = 3.0 V) Parameter Test Conditions Min 1.0 1.3 1.6 Symbol Pins VIH IN Control Input High 1.8 − 2.7 3.0 4.3 VIL IN Control Input Low 1.8 − 2.7 3.0 4.3 IIN IN Control Input Leakage 0 v VIN v VCC −405C to +855C VCC (V) 4.3 Typ Max Unit V ±0.1 0.4 0.5 0.6 V ±0.5 A SUPPLY CURRENT AND LEAKAGE (Typical: T = 25°C; VCC = 3.0 V) Symbol Pins Parameter Test Conditions INO/NC (OFF) NC, NO OFF State Leakage VIN = VIL or VIH VNC/NO = 0.3 V VCOM = 4.0 V ICOM (ON) COM ON State Leakage VIN = VIL or VIH VNO = 0.3 V or 4.0 V with VNC Floating or VNC = 0.3 V or 4.0 V with VNO Floating VCOM = 0.3 V or 4.0 V ICC VCC Quiescent Supply VIN and VIS = VCC or GND ID = 0 A IOFF IN Power Off Leakage VIN = 4.3 V or GND VCC (V) −405C to +855C Min Typ Max Unit 4.3 ±10 ±100 nA 4.3 ±20 ±100 nA 1.65 − 4.3 ±0.1 ±1.0 A 0 ±0.5 ±1.0 A ON RESISTANCE (Typical: T = 25°C; VCC = 3.0 V) VCC (V) −405C to +855C Symbol Pins Typ Max Unit RON NO, NC COM ON Resistance ION = −100 mA VIS = 0 to VCC 3.0 4.3 0.4 0.35 0.6 0.5 RFLAT NO, NC COM RON Flatness ION = −100 mA VIS = 0 to VCC 3.0 4.3 0.12 0.15 0.16 0.17 RON NO, NC COM RON Matching ION = −100 mA VIS = 0 to VCC 3.0 4.3 0.08 0.08 0.1 0.1 Parameter Test Conditions http://onsemi.com 3 Min NLAS5157 AC ELECTRICAL CHARACTERISTICS TIMING/FREQUENCY (Typical: T = 25°C; VCC = 3.0 V, RL = 50 , CL = 35 pF, f = 1 MHz) Symbol tON Pins Parameter Test Conditions IN to NC or NO Turn On Time tOFF IN to NC or NO Turn Off Time tBBM IN to NC or NO Break Before Make BW VCC (V) Typ Max Unit 2.3 − 4.3 30 40 ns 2.3 − 4.53 18 25 ns 3.0 −3dB Bandwidth CL = 5 pF −405C to +855C Min 2 1.65 − 4.3 15 ns 36 MHz ISOLATION AND THD (Typical: T = 25°C; VCC = 3.0 V, RL = 50 , CL = 5 pF, f = 1 MHz) Symbol Pins Q THD OIRR Xtalk NO Parameter Test Conditions VCC (V) −405C to +855C Min Typ Max Unit Charge Injection VIN = VCC to GND RIS = 0 , CL = 1.0 nF Q = CL − ΔVOUT 1.65 − 4.3 38 pC Total Harmonic Distortion FIS = 20 Hz to 20 kHz RL = Rgen = 600 , CL = 1.0 pF VIS = 1.0 VPP 3.0 0.02 % Off Isolation VIN = 0 VNO or VNC (pk−pk) = 1.0 V 1.65 − 4.3 −54 dB VNO or VNC (pk−pk) = 1.0 V 1.65 − 4.3 −54 dB COM to COMy Non−Adjacent Channel CAPACITANCE (Typical: T = 25°C; VCC = 3.0 V, RL = 50 , CL = 5 pF, f = 1 MHz) Symbol Pins CIN IN Parameter CON NC to COM Through Switch COFF NC, NC Unselected Port Test Conditions Control Input VCC (V) −405C to +855C Min Typ Max Unit 0V 3.5 pF VIN = 0V 3.0 V 95 pF VIS = 3.0V, VIN = 3.0 V 3.0 V 47 pF http://onsemi.com 4 NLAS5157 0.65 0.65 0.55 0.55 0.45 0.45 0.35 RON () RON () TYPICAL CHARACTERISTICS 85°C 0.25 25°C 0.15 0 0.5 1.0 1.5 −40°C 2.0 2.5 −0.05 3.0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Vis (mV) Vis (V) Figure 1. RON vs. Vin @ Vcc = 3.0 V, All Temps Figure 2. RON vs. Vin @ Vcc = 4.3 V, All Temps −0.5 −10 −1.0 −20 MAGNITUDE (dB) 0 −1.5 −2.0 −2.5 −3.0 −30 −40 −50 −60 −3.5 −70 −4.0 −80 1,000,000 10,000,000 100,000,000 −90 10 K 100 K 1M 10 M 100 M FREQUENCY (Hz) FREQUENCY (Hz) Figure 3. Bandwidth vs. Frequency Figure 4. Cross−Talk vs. Frequency @ 255C 0.022 0.020 0.018 0.016 PERCENT (%) MAGNITUDE (dB) 25°C 0.05 0 −4.5 85°C 0.25 0.15 −40°C 0.05 −0.05 0.35 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0 10 100 1000 10,000 100,000 FREQUENCY (Hz) Figure 5. THD vs. Frequency @ Vin = 1 Vpp http://onsemi.com 5 1B NLAS5157 VCC DUT VCC Input Output GND VOUT 0.1 F 50 tBMM 35 pF 90% 90% of VOH Output Switch Select Pin GND Figure 6. tBBM (Time Break−Before−Make) VCC Input DUT VCC 0.1 F 50% Output VOUT Open 50% 0V 50 VOH 90% 35 pF 90% Output VOL Input tON tOFF Figure 7. tON/tOFF VCC VCC Input DUT Output 50% 0V 50 VOUT Open 50% VOH 35 pF Output Input tOFF Figure 8. tON/tOFF http://onsemi.com 6 10% 10% VOL tON NLAS5157 50 DUT Reference Transmitted Input Output 50 Generator 50 Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. ǒVVOUT Ǔ for VIN at 100 kHz IN VOUT Ǔ for VIN at 100 kHz to 50 MHz VONL = On Channel Loss = 20 Log ǒ VIN VISO = Off Channel Isolation = 20 Log Bandwidth (BW) = the frequency 3 dB below VONL VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50 Figure 9. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL DUT VCC VIN Output Open GND CL Output Off VIN On Off VOUT Figure 10. Charge Injection: (Q) DEVICE ORDERING INFORMATION Device Order Number NLAS5157MUTCG Package Type Tape & Reel Size† UDFN6 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 7 NLAS5157 PACKAGE DIMENSIONS UDFN6, 1.45x1.0, 0.5P CASE 517AQ−01 ISSUE O A B D L L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. L1 PIN ONE REFERENCE 0.10 C ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS ÉÉÉ ÉÉÉ EXPOSED Cu TOP VIEW 0.10 C DETAIL B OPTIONAL CONSTRUCTIONS A 0.05 C A1 SIDE VIEW MOLD CMPD DETAIL B 0.05 C 6X DIM A A1 A2 b D E e L L1 MOUNTING FOOTPRINT A2 e 6X C 6X SEATING PLANE L 1.24 DETAIL A 6X 0.53 6 0.30 PACKAGE OUTLINE 3 1 4 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 6X BOTTOM VIEW 0.50 PITCH DIMENSIONS: MILLIMETERS b 0.10 C A B 0.05 C 1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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