Microchip MCP6S26 Single-ended, rail-to-rail i/o, low gain pga Datasheet

MCP6S21/2/6/8
Single-Ended, Rail-to-Rail I/O, Low Gain PGA
Features
Description
• Multiplexed Inputs: 1, 2, 6 or 8 channels
• 8 Gain Selections:
- +1, +2, +4, +5, +8, +10, +16 or +32 V/V
• Serial Peripheral Interface (SPI)
• Rail-to-Rail Input and Output
• Low Gain Error: ±1% (max)
• Low Offset: ±275 µV (max)
• High Bandwidth: 2 to 12 MHz (typ)
• Low Noise: 10 nV/Hz @ 10 kHz (typ)
• Low Supply Current: 1.0 mA (typ)
• Single Supply: 2.5V to 5.5V
The Microchip Technology Inc. MCP6S21/2/6/8 are
analog Programmable Gain Amplifiers (PGA). They
can be configured for gains from +1 V/V to +32 V/V and
the input multiplexer can select one of up to eight channels through an SPI port. The serial interface can also
put the PGA into shutdown to conserve power. These
PGAs are optimized for high speed, low offset voltage
and single-supply operation with rail-to-rail input and
output capability. These specifications support single
supply applications needing flexible performance or
multiple inputs.
The one channel MCP6S21 and the two channel
MCP6S22 are available in 8-pin PDIP, SOIC and
MSOP packages. The six channel MCP6S26 is available in 14-pin PDIP, SOIC and TSSOP packages. The
eight channel MCP6S28 is available in 16-pin PDIP
and SOIC packages. All parts are fully specified from
-40°C to +85°C.
Typical Applications
•
•
•
•
•
•
A/D Converter Driver
Multiplexed Analog Applications
Data Acquisition
Industrial Instrumentation
Test Equipment
Medical Instrumentation
Block Diagram
VDD
Package Types
MCP6S22
PDIP, SOIC, MSOP
VOUT 1
8 VDD
VOUT 1
8 VDD
CH0 2
7 SCK
CH0 2
7 SCK
VREF 3
6 SI
CH1 3
6 SI
VSS 4
5 CS
VSS 4
5 CS
MCP6S26
PDIP, SOIC, TSSOP
MCP6S28
PDIP, SOIC
VOUT 1
14 VDD
VOUT 1
16 VDD
CH0 2
13 SCK
CH0 2
15 SCK
CH1 3
12 SO
CH1 3
14 SO
CH2 4
11 SI
CH2 4
13 SI
CH3 5
10 CS
CH3 5
12 CS
CH4 6
9 VSS
CH4 6
CH5 7
8 VREF
CH5 7
11 VSS
10 VREF
CH6 8
9 CH7
 2003-2012 Microchip Technology Inc.
MUX
CS
SI
SO
SCK
SPI™
Logic
+
VOUT
RF
Gain
Switches
8
RG
Resistor Ladder (RLAD)
MCP6S21
PDIP, SOIC, MSOP
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
POR
VSS
VREF
DS21117B-page 1
MCP6S21/2/6/8
1.0
ELECTRICAL
CHARACTERISTICS
PIN FUNCTION TABLE
Name
Absolute Maximum Ratings †
VDD - VSS .........................................................................7.0V
Function
VOUT
Analog Output
CH0-CH7
Analog Inputs
All inputs and outputs ....................... VSS - 0.3V to VDD +0.3V
VSS
Negative Power Supply
Difference Input voltage ........................................ |VDD - VSS|
VDD
Positive Power Supply
Output Short Circuit Current...................................continuous
SCK
Current at Input Pin 2 mA
SI
Current at Output and Supply Pins  30 mA
SO
SPI Serial Data Output
Storage temperature .....................................-65°C to +150°C
CS
SPI Chip Select
Junction temperature .................................................. +150°C
VREF
ESD protection on all pins (HBM;MM) 2 kV; 200V
SPI Clock Input
SPI Serial Data Input
External Reference Pin
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, TA = +25°C, VDD = +2.5V to +5.5V, VSS = GND, VREF = VSS, G = +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, SI and SCK are tied low and CS is tied high.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Amplifier Input
Input Offset Voltage
Input Offset Voltage Drift
Power Supply Rejection Ratio
VOS
-275
—
+275
µV
VOS/TA
—
±4
—
µV/°C
G = +1, VDD = 4.0V
TA = -40 to +85°C
PSRR
70
85
—
dB
G = +1 (Note 1)
Input Bias Current
IB
—
±1
—
pA
CHx = VDD/2
Input Bias Current over
Temperature
IB
—
—
250
pA
TA = -40 to +85°C,
CHx = VDD/2
ZIN
—
1013||15
—
||pF
VIVR
VSS0.3
—
VDD+0.3
V
Input Impedance
Input Voltage Range
Amplifier Gain
Nominal Gains
—
—
1 to 32
—
V/V
gE
-0.1
—
+0.1
%
G  +2
gE
-1.0
—
+1.0
%
G = +1
G/TA
—
±0.0002
—
%/°C
TA = -40 to +85°C
G  +2
G/TA
—
±0.0004
—
%/°C
TA = -40 to +85°C
RLAD
3.4
4.9
6.4
k
RLAD/TA
—
+0.028
—
%/°C
DC Output Non-linearity G = +1
VONL
—
±0.003
—
% of FSR VOUT = 0.3V to VDD 0.3V, VDD = 5.0V
G  +2
VONL
—
±0.001
—
% of FSR VOUT = 0.3V to VDD 0.3V, VDD = 5.0V
VOH, VOL
VSS+20
—
VDD-100
VSS+60
—
VDD-60
—
±30
—
DC Gain Error
DC Gain Drift
G = +1
Internal Resistance
Internal Resistance over
Temperature
+1, +2, +4, +5, +8, +10, +16 or +32
VOUT  0.3V to VDD 0.3V
VOUT  0.3V to VDD 0.3V
(Note 1)
(Note 1)
TA = -40 to +85°C
Amplifier Output
Maximum Output Voltage Swing
Short-Circuit Current
IO(SC)
mV
G  +2; 0.5V output overdrive
G  +2; 0.5V output overdrive,
VREF = VDD/2
mA
Note 1: RLAD (RF + RG in Figure 4-1) connects VREF, VOUT and the inverting input of the internal amplifier. The MCP6S22 has
VREF tied internally to VSS, so VSS is coupled to the internal amplifier and the PSRR spec describes PSRR+ only. We
recommend the MCP6S22’s VSS pin be tied directly to ground to avoid noise problems.
2: IQ includes current in RLAD (typically 60 µA at VOUT = 0.3V). Both IQ and IQ_SHDN exclude digital switching currents.
3: The output goes Hi-Z and the registers reset to their defaults; see Section 5.4, “Power-On Reset”.
DS21117B-page 2
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, TA = +25°C, VDD = +2.5V to +5.5V, VSS = GND, VREF = VSS, G = +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, SI and SCK are tied low and CS is tied high.
Parameters
Sym
Min
Typ
Max
Units
Conditions
VDD
2.5
—
5.5
V
IQ
0.5
1.0
1.35
mA
IO = 0 (Note 2)
IQ_SHDN
—
0.5
1.0
µA
IO = 0 (Note 2)
VPOR
1.2
1.7
2.2
V
(Note 3)
VPOR/T
—
-3.0
—
mV/°C
Power Supply
Supply Voltage
Quiescent Current
Quiescent Current, Shutdown
mode
Power-On Reset
POR Trip Voltage
POR Trip Voltage Drift
TA = -40°C to+85°C
Note 1: RLAD (RF + RG in Figure 4-1) connects VREF, VOUT and the inverting input of the internal amplifier. The MCP6S22 has
VREF tied internally to VSS, so VSS is coupled to the internal amplifier and the PSRR spec describes PSRR+ only. We
recommend the MCP6S22’s VSS pin be tied directly to ground to avoid noise problems.
2: IQ includes current in RLAD (typically 60 µA at VOUT = 0.3V). Both IQ and IQ_SHDN exclude digital switching currents.
3: The output goes Hi-Z and the registers reset to their defaults; see Section 5.4, “Power-On Reset”.
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, TA = +25°C, VDD = +2.5V to +5.5V, VSS = GND, VREF = VSS, G = +1 V/V,
Input = CH0 =(0.3V)/G, CH1 to CH7=0.3V, RL = 10 kto VDD/2, CL = 60 pF, SI and SCK are tied low, and CS is tied high.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Frequency Response
All gains; VOUT < 100 mVP-P (Note 1)
-3 dB Bandwidth
BW
—
2 to 12
—
MHz
Gain Peaking
GPK
—
0
—
dB
All gains; VOUT < 100 mVP-P
f = 1 kHz, G = +1 V/V
THD+N
—
0.0015
—
%
VOUT = 1.5V ± 1.0VPK, VDD = 5.0V,
BW = 22 kHz
f = 1 kHz, G = +4 V/V
THD+N
—
0.0058
—
%
VOUT = 1.5V ± 1.0VPK, VDD = 5.0V,
BW = 22 kHz
f = 1 kHz, G = +16 V/V
THD+N
—
0.023
—
%
VOUT = 1.5V ± 1.0VPK, VDD = 5.0V,
BW = 22 kHz
f = 20 kHz, G = +1 V/V
THD+N
—
0.0035
—
%
VOUT = 1.5V ± 1.0VPK, VDD = 5.0V,
BW = 80 kHz
f = 20 kHz, G = +4 V/V
THD+N
—
0.0093
—
%
VOUT = 1.5V ± 1.0VPK, VDD = 5.0V,
BW = 80 kHz
f = 20 kHz, G = +16 V/V
THD+N
—
0.036
—
%
VOUT = 1.5V ± 1.0VPK, VDD = 5.0V,
BW = 80 kHz
SR
—
4.0
—
V/µs
G = 1, 2
—
11
—
V/µs
G = 4, 5, 8, 10
—
22
—
V/µs
G = 16, 32
—
3.2
—
µVP-P
—
26
—
Total Harmonic Distortion plus Noise
Step Response
Slew Rate
Noise
Input Noise Voltage
Eni
f = 0.1 Hz to 10 kHz (Note 2)
f = 0.1 Hz to 200 kHz (Note 2)
Input Noise Voltage Density
eni
—
10
—
nV/Hz f = 10 kHz (Note 2)
Input Noise Current Density
ini
—
4
—
fA/Hz f = 10 kHz
Note 1: See Table 4-1 for a list of typical numbers.
2: Eni and eni include ladder resistance noise. See Figure 2-33 for eni vs. G data.
 2003-2012 Microchip Technology Inc.
DS21117B-page 3
MCP6S21/2/6/8
DIGITAL CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, TA = +25°C, VDD = +2.5V to +5.5V, VSS = GND, VREF = VSS, G = +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, CL = 60 pF, SI and SCK are tied low, and CS is tied high.
Parameters
Sym
Min
Typ
Max
Units
Conditions
SPI Inputs (CS, SI, SCK)
Logic Threshold, Low
VIL
0
—
0.3VDD
V
Input Leakage Current
IIL
-1.0
—
+1.0
µA
Logic Threshold, High
VIH
0.7VDD
—
VDD
V
Amplifier Output Leakage Current
—
-1.0
—
+1.0
µA
In Shutdown mode
SPI Output (SO, for MCP6S26 and MCP6S28)
Logic Threshold, Low
VOL
VSS
—
VSS+0.4
V
IOL = 2.1 mA, VDD = 5V
Logic Threshold, High
VOH
VDD-0.5
—
VDD
V
IOH = -400 µA
Pin Capacitance
CPIN
—
10
—
pF
All digital I/O pins
Input Rise/Fall Times (CS, SI, SCK)
tRFI
—
—
2
µs
Note 1
Output Rise/Fall Times (SO)
tRFO
—
5
—
ns
MCP6S26 and MCP6S28
CS high time
tCSH
40
—
—
ns
SCK edge to CS fall setup time
tCS0
10
—
—
ns
CS fall to first SCK edge setup time
tCSSC
40
—
—
ns
SCK Frequency
fSCK
—
—
10
MHz
tHI
40
—
—
ns
SPI Timing
SCK high time
SCK edge when CS is high
VDD = 5V (Note 2)
tLO
40
—
—
ns
tSCCS
30
—
—
ns
tCS1
100
—
—
ns
SI set-up time
tSU
40
—
—
ns
SI hold time
tHD
10
—
—
ns
SCK to SO valid propagation delay
tDO
—
—
80
ns
MCP6S26 and MCP6S28
CS rise to SO forced to zero
tSOZ
—
—
80
ns
MCP6S26 and MCP6S28
Channel Select Time
tCH
—
1.5
—
µs
CHx = 0.6V, CHy =0.3V, G = 1,
CHx to CHy select
CS = 0.7VDD to VOUT 90% point
Gain Select Time
tG
—
1
—
µs
CHx = 0.3V, G = 5 to G = 1 select,
CS = 0.7VDD to VOUT 90% point
Out of Shutdown mode (CS goes
high) to Amplifier Output Turn-on
Time
tON
—
3.5
10
µs
CS = 0.7VDD to VOUT 90% point
Into Shutdown mode (CS goes high)
to Amplifier Output High-Z Turn-off
Time
tOFF
—
1.5
—
µs
CS = 0.7VDD to VOUT 90% point
Power-On Reset power-up time
tRPU
—
30
—
µs
VDD = VPOR - 0.1V to VPOR + 0.1V,
50% VDD to 90% VOUT point
Power-On Reset power-down time
tRPD
—
10
—
µs
VDD = VPOR + 0.1V to VPOR - 0.1V,
50% VDD to 90% VOUT point
SCK low time
SCK last edge to CS rise setup time
CS rise to SCK edge setup time
SCK edge when CS is high
Channel and Gain Select Timing
Shutdown Mode Timing
POR Timing
Note 1: Not tested in production. Set by design and characterization.
2: When using the device in the daisy chain configuration, maximum clock frequency is determined by a combination of
propagation delay time (tDO  80 ns), data input setup time (tSU  40 ns), SCK high time (tHI  40 ns), and SCK rise and
fall times of 5 ns. Maximum fSCK is, therefore,  5.8 MHz.
DS21117B-page 4
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +2.5V to +5.5V, VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Specified Temperature Range
TA
-40
—
+85
°C
Operating Temperature Range
TA
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 8L-PDIP
JA
—
85
—
°C/W
Thermal Resistance, 8L-SOIC
JA
—
163
—
°C/W
Thermal Resistance, 8L-MSOP
JA
—
206
—
°C/W
Thermal Resistance, 14L-PDIP
JA
—
70
—
°C/W
Thermal Resistance, 14L-SOIC
JA
—
120
—
°C/W
Thermal Resistance, 14L-TSSOP
JA
—
100
—
°C/W
Thermal Resistance, 16L-PDIP
JA
—
70
—
°C/W
Thermal Resistance, 16L-SOIC
JA
—
90
—
°C/W
Conditions
Temperature Ranges
(Note 1)
Thermal Package Resistances
Note 1: The MCP6S21/2/6/8 family of PGAs operates over this extended temperature range, but with reduced
performance. Operation in this range must not cause TJ to exceed the Maximum Junction Temperature
(150°C).
CS
CS
tCH
VOUT
FIGURE 1-1:
Diagram.
tG
0.6V
Channel Select Timing
CS
VOUT
Gain Select Timing
VPOR - 0.1V
tOFF
Hi-Z
VPOR + 0.1V
VPOR - 0.1V
tRPU
Hi-Z
0.3V
1.0 mA (typ)
ISS
0.3V
FIGURE 1-3:
Diagram.
VDD
tON
1.5V
VOUT
0.3V
VOUT
ISS
tRPD
Hi-Z
Hi-Z
0.3V
1.0 mA (typ)
500 nA (typ)
500 nA (typ)
FIGURE 1-2:
PGA Shutdown timing
diagram (must enter correct commands before
CS goes high).
 2003-2012 Microchip Technology Inc.
FIGURE 1-4:
POR power-up and powerdown timing diagram.
DS21117B-page 5
MCP6S21/2/6/8
tCSH
CS
tCSSC
tSCCS tCS1
tCS0
tLO tHI
SCK
tSU tHD
1/fSCK
SI
tDO
tSOZ
SO
(first 16 bits out are always zeros)
FIGURE 1-5:
Detailed SPI Serial Interface Timing, SPI 0,0 mode.
tCSH
CS
tCSSC
tSCCS tCS1
tHI
tCS0
tLO
SCK
tSU tHD
1/fSCK
SI
tDO
tSOZ
SO
(first 16 bits out are always zeros)
FIGURE 1-6:
DS21117B-page 6
Detailed SPI Serial Interface Timing, SPI 1,1 mode.
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
1.1
DC Output Voltage Specs / Model
1.1.1
VOUT (V)
IDEAL MODEL
The ideal PGA output voltage (VOUT) is:
EQUATION
V2
VDD-0.3
VREF = V SS = 0V
O
UT
O
_l
in
V ear
O
_i
de
al
V O_ideal = GV IN
VDD
V
V
where: G is the nominal gain
(see Figure 1-7). This equation holds when there are
no gain or offset errors and when the VREF pin is tied to
a low impedance source (<< 0.1) at ground potential
(VSS = 0V).
1.1.2
V1
0.3
0
VIN (V)
LINEAR MODEL
0
0.3
G
VDD - 0.3 VDD
G
G
The PGA’s linear region of operation, including offset
and gain errors, is modeled by the line VO_linear, shown
in Figure 1-7.
FIGURE 1-7:
Output Voltage Model with
the standard condition VREF = VSS = 0V.
EQUATION
1.1.3
VO_linear = G  1 + g E   V IN – 0.3V + VOS  + 0.3V
V REF = V SS = 0V
The endpoints of this line are at VO_ideal = 0.3V and
VDD-0.3V. The gain and offset specifications referred to
in the electrical specifications are related to Figure 1-7,
as follows:
EQUATION
V2 – V 1
g E = 100% -------------------------------------G  V DD – 0.6V 
V1
G = +1
V OS = -----------------------G  1 + gE 
g
G  T A = ---------ET A
OUTPUT NON-LINEARITY
Figure 1-8 shows the Integral Non-Linearity (INL) of the
output voltage.
EQUATION
INL = VOUT – V O_linear
The output non-linearity specification in the electrical
specifications is related to Figure 1-8 by:
EQUATION
max  V 4 V3 
VONL = -------------------------------V DD – 0.6V
INL (V)
V4
0
V3
0
0.3
G
VDD - 0.3 VDD
G
G
VIN (V)
FIGURE 1-8:
Output Voltage INL with the
standard condition VREF = VSS = 0V.
 2003-2012 Microchip Technology Inc.
DS21117B-page 7
MCP6S21/2/6/8
1.1.4
DIFFERENT VREF CONDITIONS
Some of the plots in Section 2.0, “Typical Performance
Curves”, have the conditions VREF = VDD/2 or
VREF = VDD. The equations and figures above are easily modified for these conditions. The ideal VOUT
becomes:
EQUATION
V O_ideal = VREF + G  V IN – VREF 
V DD  VREF  VSS = 0V
The complete linear model is:
EQUATION
V O_linear = G  1 + g E   V IN – V IN_L + V OS  + 0.3V
where the new VIN endpoints are:
EQUATION
0.3V – VREF
V IN_L = ----------------------------G + V REF
VDD – 0.3V – VREF
VIN_R = ---------------------------------------------G + V REF
The equations for extracting the specifications do not
change.
DS21117B-page 8
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
420 Samples
G = +1
TA = -40 to +125°C
16%
14%
12%
10%
8%
6%
4%
2%
FIGURE 2-4:
DC Gain Error, G +2.
18%
16%
0.0006
0.0005
0.0004
0.0003
0.0002
0.0020
0.0016
360 Samples
VDD = 4.0 V
G = +1
14%
12%
10%
8%
6%
4%
2%
Ladder Resistance Drift.
 2003-2012 Microchip Technology Inc.
240
200
160
120
80
40
0
-40
-80
-120
-160
-200
0%
-240
Percentage of Occurrences
0.031
0.030
0.029
0.028
0.027
0.026
0.025
0.024
0.0001
20%
Input Offset Voltage (µV)
Ladder Resistance Drift (%/°C)
FIGURE 2-3:
DC Gain Drift, G +2.
FIGURE 2-5:
420 Samples
TA = -40 to +125°C
0.023
Percentage of Occurrences
22%
20%
18%
16%
14%
12%
10%
8%
6%
4%
2%
0%
0.0000
DC Gain Drift (%/°C)
DC Gain Error (%)
FIGURE 2-2:
0.0012
0.5
0.4
0.3
0.2
0.1
0.0
-0.1
-0.2
-0.3
-0.4
0%
0.0008
2%
0.0004
4%
0.0000
6%
-0.0004
8%
-0.0012
10%
420 Samples
G t +2
TA = -40 to +125°C
-0.0016
12%
24%
22%
20%
18%
16%
14%
12%
10%
8%
6%
4%
2%
0%
-0.0020
Percentage of Occurrences
14%
-0.5
Percentage of Occurrences
420 Samples
G t +2
DC Gain Drift, G = +1.
-0.0008
DC Gain Error, G = +1.
18%
16%
-0.0001
DC Gain Drift (%/°C)
DC Gain Error (%)
FIGURE 2-1:
-0.0002
-0.0003
-0.0004
-0.0005
0%
-0.0006
Percentage of Occurrences
18%
0.004
0.000
-0.004
-0.008
-0.012
-0.016
-0.020
-0.024
-0.028
-0.032
420 Samples
G = +1
-0.036
22%
20%
18%
16%
14%
12%
10%
8%
6%
4%
2%
0%
-0.040
Percentage of Occurrences
Note: Unless otherwise indicated, TA = +25°C, VDD = +5.0V, VSS = GND, VREF = VSS, G= +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, and CL = 60 pF.
FIGURE 2-6:
VDD = 4.0V.
Input Offset Voltage,
DS21117B-page 9
MCP6S21/2/6/8
Note: Unless otherwise indicated, TA = +25°C, VDD = +5.0V, VSS = GND, VREF = VSS, G= +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, and CL = 60 pF.
22%
G = +1
Percentage of Occurrences
150
100
50
0
VDD = +2.5
-50
-100
VDD = +5.5
-150
20%
18%
420 Samples
TA = -40 to +125°C
G = +1
16%
14%
12%
10%
8%
6%
4%
2%
5.0
5.5
VREF Voltage (V)
FIGURE 2-7:
VREF Voltage.
FIGURE 2-10:
0.001
VONL/G, G = +2
VONL/G, G t +4
0.00001
8
6
4
0.0010%
VONL/G, G t +2
3.0
3.5
4.0
4.5
5.0
5.5
1
10
Output Voltage Swing (VP-P)
Power Supply Voltage (V)
FIGURE 2-8:
Supply Voltage.
DC Output Non-Linearity vs.
FIGURE 2-11:
Output Swing.
Input Noise Voltage Density
(nV/—Hz)
1000
Input Noise Voltage Density
(nV/—Hz)
2
VONL/G, G = +1
0.0001%
2.5
100
10
1
0
VDD = +5.5 V
VONL/G, G = +1
0.0001
Input Offset Voltage Drift.
0.0100%
VOUT = 0.3V to VDD -0.3V
DC Output Non-Linearity,
Input Referred (%)
DC Output Non-Linearity,
Input Referred (% of FSR)
Input Offset Voltage Drift (µV/°C)
Input Offset Voltage vs.
0.01
16
4.5
14
4.0
12
3.5
10
3.0
-2
2.5
-4
2.0
-6
1.5
-8
1.0
-10
0.5
-12
0.0
-14
0%
-200
-16
Input Offset Voltage (µV)
200
0.1
1
0.1
1
10
10
100
100
1000
1k
10000
10k
12
11
10
9
8
7
6
5
4
3
2
1
0
f = 10 kHz
100000
100k
1
Frequency (Hz)
FIGURE 2-9:
vs. Frequency.
DS21117B-page 10
DC Output Non-Linearity vs.
Input Noise Voltage Density
2
4
5
8
10
16
32
Gain (V/V)
FIGURE 2-12:
vs. Gain.
Input Noise Voltage Density
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
100
120
Power Supply Rejection Ratio
(dB)
Power Supply Rejection Ratio
(dB)
Note: Unless otherwise indicated, TA = +25°C, VDD = +5.0V, VSS = GND, VREF = VSS, G= +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, and CL = 60 pF.
110
100
90
80
70
-50
-25
0
25
50
75
100
90
80
VDD = 2.5 V
70
60
50
40
125
Input Referred
VDD = 5.5 V
10
100
10
100
FIGURE 2-16:
CH0 = VDD
VDD = 5.5 V
Input Bias Current (pA)
Input Bias Current (pA)
PSRR vs. Ambient
10,000
1,000
100
100000
100k
10
PSRR vs. Frequency.
VDD = 5.5 V
1,000
TA = +125°C
100
TA = +85°C
10
1
1
55
65
75
85
95
105
115
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
125
Input Voltage (V)
Ambient Temperature (°C)
FIGURE 2-17:
Voltage.
FIGURE 2-14:
Input Bias Current vs.
Ambient Temperature.
Input Bias Current vs. Input
7
100
G = +1
G = +4
G = +16
10
Gain Peaking (dB)
6
Bandwidth (MHz)
10000
10k
Frequency (Hz)
Ambient Temperature (°C)
FIGURE 2-13:
Temperature.
1000
1k
G = +1
G = +4
G = +16
5
4
3
2
1
0
1
10
100
1000
10
FIGURE 2-15:
Load.
Bandwidth vs. Capacitive
 2003-2012 Microchip Technology Inc.
100
1000
Capacitive Load (pF)
Capacitive Load (pF)
FIGURE 2-18:
Load.
Gain Peaking vs. Capacitive
DS21117B-page 11
MCP6S21/2/6/8
Note: Unless otherwise indicated, TA = +25°C, VDD = +5.0V, VSS = GND, VREF = VSS, G= +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, and CL = 60 pF.
40
Gain (dB)
30
Quiescent Current (mA)
G = +32
G = +16
20
10
0
G = +10
G = +8
G = +5
G = +4
-10
-20
G = +2
G = +1
1.E+05
1.E+06
100k
1.E+07
1M
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
1.E+08
10M
100M
0.0
0.5
1.0
Frequency (Hz)
FIGURE 2-22:
Supply Voltage.
Gain vs. Frequency.
420 Samples
VDD = 5.0 V
80%
70%
60%
50%
40%
30%
20%
10%
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0%
0.0
Percentage of Occurrences
100%
90%
1.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Quiescent Current vs.
In Shutdown Mode
VDD = 5.0 V
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-50
-25
Quiescent Current in Shutdown (µA)
0
25
50
75
100
125
Ambient Temperature (°C)
FIGURE 2-20:
Histogram of Quiescent
Current in Shutdown Mode.
FIGURE 2-23:
Quiescent Current in
Shutdown Mode vs. Ambient Temperature.
100
40
Output Short Circuit Current
(mA)
Output Voltage Headroom (mV)
VDD - VOH and VOL - VSS
2.0
Supply Voltage (V)
Quiescent Current in Shutdown
(µA)
FIGURE 2-19:
1.5
VDD = +5.5V
10
VDD = +2.5V
1
35
30
25
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
20
15
10
5
0
0.1
1
10
Output Current Magnitude (mA)
FIGURE 2-21:
Output Voltage Headroom
vs. Output Current.
DS21117B-page 12
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Power Supply Voltage (V)
FIGURE 2-24:
Output Short Circuit Current
vs. Supply Voltage.
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
Note: Unless otherwise indicated, TA = +25°C, VDD = +5.0V, VSS = GND, VREF = VSS, G= +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, and CL = 60 pF.
1
Measurement BW = 80 kHz
VOUT = 2 VP-P
VDD = 5.0 V
THD + Noise (%)
0.1
G = +16
0.01
G = +4
Measurement BW = 80 kHz
VOUT = 4 VP-P
VDD = 5.0 V
0.1
G = +16
0.01
G = +4
G = +1
G = +1
0.001
100
0.001
100
1.E+02
1.E+02
1.E+03
1.E+04
1k
1.E+05
10k
100k
1.E+03
1.E+04
1k
10k
Frequency (Hz)
Frequency (Hz)
FIGURE 2-25:
THD plus Noise vs.
Frequency, VOUT = 2 VP-P.
FIGURE 2-28:
THD plus Noise vs.
Frequency, VOUT = 4 VP-P.
80
250
5.0
VDD = +5.0V
7.5
VDD = +5.0V
70
60
150
50
100
40
50
30
20
0
GVIN
10
-50
0
VOUT, G = +1
G = +5
G = +32
-10
-20
-100
-150
4.5
Output Voltage (V)
Normalized Input Voltage
(50 mV/div)
200
Output Voltage
(10 mV/div)
1.E+05
100k
6.5
4.0
5.5
3.5
4.5
3.0
3.5
2.5
2.5
2.0
Normalized Input Voltage
(1V/div)
THD + Noise (%)
1
1.5
GVIN
VOUT, G = +1
G = +5
G = +32
1.5
1.0
0.5
-0.5
0.5
-1.5
-200
-30
0.0
2.00E-07
4.00E-07
6.00E-07
8.00E-07
1.00E-06
1.20E-06
1.40E-06
1.60E-06
1.80E-06
-2.5
5.00E-07
1.00E-06
FIGURE 2-29:
Response.
15
3.00E-06
3.50E-06
4.00E-06
4.50E-06
5.00E-06
VOUT
(CH0 = 0.6V, G = +1)
10
CS
0.50
5
0.45
0
5
0
CS
VOUT
(CH1 = 0.3V, G = +1)
Large Signal Pulse
1.6
-5
20
1.4
Output Voltage (V)
20
0.60
Chip Select Voltage (V)
Output Voltage (V)
Small Signal Pulse
0.40
2.50E-06
Time (500 ns/div)
0.65
0.55
2.00E-06
-250
2.00E-06
Time (200 ns/div)
FIGURE 2-26:
Response.
1.50E-06
1.2
15
VOUT
(CH0 = 0.3V, G = +5)
10
CS
5
1.0
5
0.8
0
0
CS
VOUT
(CH0 = 0.3V, G = +1)
0.6
-5
0.35
-10
0.4
-10
0.30
-15
0.2
-15
0.25
-20
0.0
0.00E+00
5.00E-07
1.00E-06
1.50E-06
2.00E-06
2.50E-06
3.00E-06
3.50E-06
4.00E-06
4.50E-06
5.00E-06
-20
0.00E+00
5.00E-07
Time (500 ns/div)
FIGURE 2-27:
Channel Select Timing.
 2003-2012 Microchip Technology Inc.
Chip Select Voltage (V)
-40
0.00E+00
0.00E+00
1.00E-06
1.50E-06
2.00E-06
2.50E-06
3.00E-06
3.50E-06
4.00E-06
4.50E-06
5.00E-06
Time (500 ns/div)
FIGURE 2-30:
Gain Select Timing.
DS21117B-page 13
MCP6S21/2/6/8
Note: Unless otherwise indicated, TA = +25°C, VDD = +5.0V, VSS = GND, VREF = VSS, G= +1 V/V,
Input = CH0 = (0.3V)/G, CH1 to CH7 = 0.3V, RL = 10 kto VDD/2, and CL = 60 pF.
1.0
20
0.8
15
0.7
10
0.6
5
CS
CS
0.5
0
5
0
0.4
-5
0.3
-10
0.2
-15
VOUT is "ON"
(CH0 = 0.3V, G = +1)
0.1
Output Voltage Swing (V P-P)
Shutdown
Chip Select Voltage (V)
Output Voltage (mV)
10
25
Shutdown
0.9
VDD = 5.5 V
VDD = 2.5 V
1
G = +1, +2
G = +4 to +10
G = +16, +32
-20
0.1
10k
1.E+04
0.0
-25
0.0E+00
1.0E-06
2.0E-06
3.0E-06
4.0E-06
5.0E-06
6.0E-06
7.0E-06
8.0E-06
9.0E-06
1.E+05
Time (1 µs/div)
FIGURE 2-31:
Shutdown Mode.
18%
Output Voltage vs.
FIGURE 2-33:
Frequency.
14%
12%
10%
8%
6%
4%
2%
0%
1.68
1.72
1.76
1.80
POR Trip Voltage (V)
FIGURE 2-32:
DS21117B-page 14
Output Voltage Swing vs.
VDD = 5.0 V
G = +1 V/V
VIN
16%
1.64
10M
6
420 Samples
1.60
1.E+07
1M
Frequency (Hz)
Input, Output Voltage (V)
Percentage of Occurrences
20%
1.E+06
100k
1.0E-05
POR Trip Voltage.
1.84
1.88
5
VOUT
4
3
2
1
0
-1
0.0E+00
1.0E-03
2.0E-03
3.0E-03
4.0E-03
5.0E-03
6.0E-03
7.0E-03
8.0E-03
9.0E-03
1.0E-02
Time (1 ms/div)
FIGURE 2-34:
The MCP6S21/2/6/8 family
shows no phase reversal under overdrive.
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
MCP6S21
MCP6S22
MCP6S26
MCP6S28
Symbol
1
1
1
1
VOUT
Analog Output
2
2
2
2
CH0
Analog Input
—
3
3
3
CH1
Analog Input
—
—
4
4
CH2
Analog Input
—
—
5
5
CH3
Analog Input
—
—
6
6
CH4
Analog Input
—
—
7
7
CH5
Analog Input
—
—
—
8
CH6
Analog Input
—
—
—
9
CH7
Analog Input
3
—
8
10
VREF
External Reference Pin
4
4
9
11
VSS
Negative Power Supply
5
5
10
12
CS
SPI Chip Select
3.1
6
6
11
13
SI
SPI Serial Data Input
—
—
12
14
SO
SPI Serial Data Output
7
7
13
15
SCK
SPI Clock Input
8
8
14
16
VDD
Positive Power Supply
Analog Output
The output pin (VOUT) is a low-impedance voltage
source. The selected gain (G), selected input (CH0CH7) and voltage at VREF determine its value.
3.2
Analog Inputs (CH0 thru CH7)
The inputs CH0 through CH7 connect to the signal
sources. They are high-impedance CMOS inputs with
low bias currents. The internal MUX selects which one
is amplified to the output.
3.3
Description
External Reference Voltage (VREF)
The VREF pin should be at a voltage between VSS and
VDD (the MCP6S22 has VREF tied internally to VSS).
The voltage at this pin shifts the output voltage.
3.4
Power Supply (VSS and VDD)
The positive power supply pin (VDD) is 2.5V to 5.5V
higher than the negative power supply pin (VSS). For
normal operation, the other pins are between VSS and
VDD.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need a local bypass capacitor (0.1 µF) at the VDD pin.
It can share a bulk capacitor with nearby analog parts
(typically 2.2 µF to 10 µF within 4 inches (100 mm) of
the VDD pin.
3.5
Digital Inputs
The SPI interface inputs are: Chip Select (CS), Serial
Input (SI) and Serial Clock (SCK). These are Schmitttriggered, CMOS logic inputs.
3.6
Digital Output
The MCP6S26 and MCP6S28 devices have a SPI
interface serial output (SO) pin. This is a CMOS pushpull output and does not ever go High-Z. Once the
device is deselected (CS goes high), SO is forced low.
This feature supports daisy chaining, as explained in
Section 5.3, “Daisy Chain Configuration”.
 2003-2012 Microchip Technology Inc.
DS21117B-page 15
MCP6S21/2/6/8
4.0
ANALOG FUNCTIONS
4.1
The MCP6S21/2/6/8 family of Programmable Gain
Amplifiers (PGA) are based on simple analog building
blocks (see Figure 4-1). Each of these blocks will be
explained in more detail in the following sub-sections.
VDD
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
MUX
CS
SI
SO
SCK
SPI™
Logic
+
VOUT
RF
Gain
Switches
8
RG
Resistor Ladder (RLAD)
-
POR
Input MUX
The MCP6S21 has one input, the MCP6S22 and
MCP6S25 have two inputs, the MCP6S26 has six
inputs and the MCP6S28 has eight inputs (see
Figure 4-1).
For the lowest input current, float unused inputs. Tying
these pins to a voltage near the used channels also
works well. For simplicity, they can be tied to VSS or
VDD, but the input current may increase.
The one channel MCP6S21 has the lowest input bias
current, while the eight channel MCP6S28 has the
highest. There is about a 2:1 ratio in IB between these
parts.
4.2
Internal Op Amp
The internal op amp provides the right combination of
bandwidth, accuracy and flexibility.
4.2.1
VREF
VSS
MCP6S21–One input (CH0), no SO pin
MCP6S22–Two inputs (CH0, CH1), VREF tied internally
to VSS, no SO pin
MCP6S26–Six inputs (CH0 to CH5)
COMPENSATION CAPACITORS
The internal op amp has three compensation capacitors connected to a switching network. They are
selected to give good small signal bandwidth at high
gains, and good slew rate (full power bandwidth) at low
gains. The change in bandwidth as gain changes is
between 2 MHz and 12 MHz. Refer to Table 4-1 for
more information.
MCP6S28–Eight inputs (CH0 to CH7)
FIGURE 4-1:
PGA Block Diagram.
TABLE 4-1:
Gain
(V/V)
GAIN VS. INTERNAL COMPENSATION CAPACITOR
Internal
Compensation
Capacitor
Typical GBWP
(MHz)
Typical SR
(V/µs)
Typical FPBW
(MHz)
Typical BW
(MHz)
1
Large
12
4.0
0.30
2
Large
12
4.0
0.30
4
Medium
20
11
0.70
5
Medium
20
11
0.70
8
Medium
20
11
0.70
10
Medium
20
11
0.70
16
Small
64
22
1.6
32
Small
64
22
1.6
Note 1: FPBW is the Full Power Bandwidth. These numbers are based on VDD = 5.0V.
2: No changes in DC performance (e.g., VOS) accompany a change in compensation capacitor.
3: BW is the closed-loop, small signal -3 dB bandwidth.
DS21117B-page 16
12
6
10
7
2.4
2.0
5
2.0
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
4.2.2
RAIL-TO-RAIL INPUT
4.3
The input stage of the internal op amp uses two differential input stages in parallel; one operates at low VIN
(input voltage), while the other operates at high VIN.
With this topology, the internal inputs can operate to
0.3V past either supply rail. The input offset voltage is
measured at both VIN = VSS - 0.3V and VDD + 0.3V to
ensure proper operation.
The transition between the two input stages occurs
when VIN  VDD - 1.5V. For the best distortion and gain
linearity, avoid this region of operation.
4.2.3
RAIL-TO-RAIL OUTPUT
The Maximum Output Voltage Swing is the maximum
swing possible under a particular output load. According to the specification table, the output can reach
within 60 mV of either supply rail when RL = 10 kand
VREF = VDD/2. See Figure 2-21 for typical performance
under other conditions.
4.2.4
INPUT VOLTAGE AND PHASE
REVERSAL
The amplifier family is designed with CMOS input
devices. It is designed to not exhibit phase inversion
when the input pins exceed the supply voltages.
Figure 2-34 shows an input voltage exceeding both
supplies with no resulting phase inversion.
The maximum voltage that can be applied to the input
pins (CHX) is VSS - 0.3V to VDD + 0.3V. Voltages on the
inputs that exceed this absolute maximum rating can
cause excessive current to flow in or out of the input
pins. Current beyond ±2 mA can cause possible reliability problems. Applications that exceed this rating
must be externally limited with an input resistor, as
shown in Figure 4-2.
Resistor Ladder
The resistor ladder shown in Figure 4-1 (RLAD = RF +
RG) sets the gain. Placing the gain switches in series
with the inverting input reduces the parasitic capacitance, distortion and gain mismatch.
RLAD is an additional load on the output of the PGA and
causes additional current draw from the supplies.
In Shutdown mode, RLAD is still attached to the OUT
and VREF pins. Thus, these pins and the internal amplifier’s inverting input are all connected through RLAD
and the output is not high-Z (unlike the external op
amp).
While RLAD contributes to the output noise, its effect is
small. Refer to Figure 2-12.
4.4
Shutdown Mode
These PGAs use a software shutdown command.
When the SPI interface sends a shutdown command,
the internal op amp is shut down and its output placed
in a high-Z state.
The resistive ladder is always connected between
VREF and VOUT; even in shutdown. This means that the
output resistance will be on the order of 5 k and there
will be a path for output signals to appear at the input.
The Power-on Reset (POR) circuitry will temporarily
place the part in shutdown when activated. See
Section 5.4, “Power-On Reset”, for details.
RIN CHX
VIN
MCP6S2X
VOUT
 Maximum expected VIN  – V DD
RIN  ------------------------------------------------------------------------------2 mA
V SS –  Minimum expected V IN 
RIN  ---------------------------------------------------------------------------2 mA
FIGURE 4-2:
into an input pin.
RIN limits the current flow
 2003-2012 Microchip Technology Inc.
DS21117B-page 17
MCP6S21/2/6/8
5.0
DIGITAL FUNCTIONS
CS is raised after one word (16 bits) to implement the
desired changes. Section 5.3, “Registers”, covers
applications using multiple 16-bit words. SO goes low
after CS goes high; it has a push-pull output that does
not go into a high-Z state.
The MCP6S21/2/6/8 PGAs use a standard SPI compatible serial interface to receive instructions from a
controller. This interface is configured to allow daisy
chaining with other SPI devices. There is an internal
POR (Power On Reset) that resets the registers under
low power conditions.
5.1
The MCP6S21/2/6/8 devices operate in SPI Modes 0,0
and 1,1. In 0,0 mode, the clock idles in the low state
(Figure 5-1) and, in 1,1 mode, the clock idles in the high
state (Figure 5-2). In both modes, SI data is loaded into
the PGA on the rising edge of SCK and SO data is
clocked out on the falling edge of SCK. In 0,0 mode, the
falling edge of CS also acts as the first falling edge of
SCK (see Figure 5-1). There must be multiples of 16
clocks (SCK) while CS is low or commands will abort
(see Section 5.3, “Registers”).
SPI Timing
Chip Select (CS) toggles low to initiate communication
with these devices. The first byte of each SI word (two
bytes long) is the instruction byte, which goes into the
Instruction Register. The Instruction Register points the
second byte to its destination. In a typical application,
2
3
4
5
6
7
8
9
bit 7
1
bit 0
CS
10
11
12
13
14
15
16
SCK
bit 0
bit 7
SI
Instruction Byte
Data Byte
SO
(first 16 bits out are always zeros)
FIGURE 5-1:
Serial bus sequence for the PGA; SPI 0,0 mode (see Figure 1-5).
2
3
4
5
6
7
8
9
bit 7
1
bit 0
CS
10
11
12
13
14
15
16
SCK
Instruction Byte
bit 0
bit 7
SI
Data Byte
SO
(first 16 bits out are always zeros)
FIGURE 5-2:
DS21117B-page 18
Serial bus sequence for the PGA; SPI 1,1 mode (see Figure 1-6).
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
5.2
Registers
The analog functions are programmed through the SPI
interface using 16-bit words (see Figure 5-1 and
Figure 5-2). This data is sent to two of three 8-bit registers: Instruction Register (Register 5-1), Gain Register
(Register 5-2) and Channel Register (Register 5-3).
The power-up defaults for these three registers are:
• Instruction Register: 000x xxx0
• Gain Register: xxxx x000
• Channel Register: xxxx x000
REGISTER 5-1:
Thus, these devices are initially programmed with the
Instruction Register set for NOP (no operation), a gain
of +1 V/V and CH0 as the input channel.
5.2.1
INSTRUCTION REGISTER
The Instruction Register has 3 command bits and 1
indirect address bit; see Register 5-1. The command
bits include a NOP (000) to support daisy chaining (see
Section 5.3, “Registers”); the other NOP commands
shown should not be used (they are reserved for future
use). The device is brought out of Shutdown mode
when a valid command, other than NOP or Shutdown, is
sent and CS is raised.
INSTRUCTION REGISTER
W-0
W-0
W-0
U-x
U-x
U-x
U-x
W-0
M2
M1
M0
—
—
—
—
A0
bit 7
bit 0
bit 7-5
M2-M0: Command Bits
000 = NOP (Default) (Note 1)
001 = PGA enters Shutdown Mode as soon as a full 16-bit word is sent and CS is raised.
(Notes 1 and 2)
010 = Write to register.
011 = NOP (reserved for future use) (Note 1)
1XX = NOP (reserved for future use) (Note 1)
bit 4-1
Unimplemented: Read as ‘0’ (reserved for future use)
bit 0
A0: Indirect Address Bit
1 = Addresses the Channel Register
0 = Addresses the Gain Register (Default)
Note 1: All other bits in the 16-bit word (including A0) are “don’t cares”.
2: The device exits Shutdown mode when a valid command (other than NOP or Shutdown) is sent and CS is raised; that valid command will be executed. Shutdown
does not toggle.
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
’1’ = Bit is set
’0’ = Bit is cleared
 2003-2012 Microchip Technology Inc.
x = Bit is unknown
DS21117B-page 19
MCP6S21/2/6/8
5.2.2
SETTING THE GAIN
The amplifier can be programmed to produce binary
and decimal gain settings between +1 V/V and +32 V/V.
Register 5-2 shows the details. At the same time, different compensation capacitors are selected to optimize
the bandwidth vs. slew rate trade-off (see Table 4-1).
REGISTER 5-2:
GAIN REGISTER
U-x
U-x
U-x
U-x
U-x
W-0
W-0
—
—
—
—
—
G2
G1
bit 7
W-0
G0
bit 0
bit 7-3
Unimplemented: Read as ‘0’ (reserved for future use)
bit 2-0
G2-G0: Gain Select Bits
000 = Gain of +1 (Default)
001 = Gain of +2
010 = Gain of +4
011 = Gain of +5
100 = Gain of +8
101 = Gain of +10
110 = Gain of +16
111 = Gain of +32
Legend:
DS21117B-page 20
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
’1’ = Bit is set
’0’ = Bit is cleared
x = Bit is unknown
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
5.2.3
CHANGING THE CHANNEL
If the instruction register is programmed to address the
channel register, the multiplexed inputs of the
MCP6S22, MCP6S26 and MCP6S28 can be changed
per Register 5-3.
REGISTER 5-3:
CHANNEL REGISTER
U-x
U-x
U-x
U-x
U-x
W-0
W-0
—
—
—
—
—
C2
C1
bit 7
C0
bit 0
bit 7-3
Unimplemented: Read as ‘0’ (reserved for future use)
bit 2-0
C2-C0: Channel Select Bits
MCP6S21
000 = CH0 (Default)
001 = CH0
001 = CH0
011 = CH0
100 = CH0
101 = CH0
110 = CH0
111 = CH0
W-0
MCP6S22
CH0 (Default)
CH1
CH0
CH1
CH0
CH1
CH0
CH1
MCP6S26
CH0 (Default)
CH1
CH2
CH3
CH4
CH5
CH0
CH0
MCP6S28
CH0 (Default)
CH1
CH2
CH3
CH4
CH5
CH6
CH7
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
’1’ = Bit is set
’0’ = Bit is cleared
 2003-2012 Microchip Technology Inc.
x = Bit is unknown
DS21117B-page 21
MCP6S21/2/6/8
5.2.4
SHUTDOWN COMMAND
The example in Figure 5-3 shows a daisy chain configuration with two devices, although any number of
devices can be configured this way. The MCP6S21 and
MCP6S22 can only be used at the far end of the daisy
chain because they do not have a serial data out (SO)
pin. As shown in Figure 5-4 and Figure 5-5, both SI
and SO data are sent in 16-bit (2 byte) words. These
devices abort any command that is not a multiple of 16
bits.
The software Shutdown command allows the user to
put the amplifier into a low power mode (see
Register 5-1). In this shutdown mode, most pins are
high impedance (Section 4.4, “Shutdown Mode”, and
Section 5.1, “SPI Timing”, cover the exceptions at pins
VREF, VOUT and SO).
Once the PGA has entered shutdown mode, it will
remain in this mode until either a valid command is sent
to the device (other than NOP or Shutdown), or the
device is powered down and back up again. The
internal registers maintain their values while in
shutdown.
When using the daisy chain configuration, the maximum clock speed possible is reduced to  5.8 MHz
because of the SO pin’s propagation delay (see
Electrical Specifications).
The internal SPI shift register is automatically loaded
with zeros whenever CS goes high (a command is executed). Thus, the first 16-bits out of the SO pin once CS
line goes low are always zeros. This means that the
first command loaded into the next device in the daisy
chain is a NOP. This feature makes it possible to send
shorter command and data byte strings when the farthest devices do not need to change. For example, if
there were three devices on the chain and only the middle device needed changing, only 32 bytes of data
need to be transmitted (for the first and middle
devices), and the last device on the chain would
receive a NOP when the CS pin is raised to execute the
command.
Once brought out of shutdown mode, the part comes
back to its previous state (see Section 5.4 for exceptions to this rule). This makes it possible to bring the
device out of shutdown mode using one command;
send a command to select the current channel (or gain)
and the device will exit shutdown with the same state
that existed before shutdown.
5.3
Daisy Chain Configuration
Multiple devices can be connected in a daisy chain
configuration by connecting the SO pin from one device
to the SI pin on the next device and using common SCK
and CS lines (Figure 5-3). This approach reduces PCB
layout complexity.
CS
SCK
SO
PIC®
Microcontroller
CS
SCK
SI
SO
Device 1
1.
2.
3.
4.
5.
6.
Set CS low.
Clock out the instruction and data
for Device 2 (16 clocks) to Device 1.
Device 1 automatically clocks out all
zeros (first 16 clocks) to Device 2.
Clock out the instruction and data
for Device 1 (16 clocks) to Device 1.
Device 1 automatically shifts data
from Device 1 to Device 2 (16
clocks).
Raise CS.
FIGURE 5-3:
DS21117B-page 22
CS
SCK
SI
SO
Device 2
Device 1
Device 2
00100000 00000000
00000000 00000000
Device 1
Device 2
01000001 00000111
00100000 00000000
Daisy Chain Configuration.
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
1 2 3 4 5 6 7 8 9 10111213141516
1 2 3 4 5 6 7 8 9 10111213141516
bit 7
bit 7
CS
SCK
Instruction Byte
for Device 2
Instruction Byte
for Device 1
Data Byte
for Device 2
bit 0
bit 0
bit 7
bit 0
bit 0
bit 7
SI
Data Byte
for Device 1
Instruction Byte
for Device 2
FIGURE 5-4:
bit 0
bit 7
(first 16 bits out are always zeros)
bit 0
bit 7
SO
Data Byte
for Device 2
Serial bus sequence for daisy-chain configuration; SPI 0,0 mode.
1 2 3 4 5 6 7 8 9 10111213141516
1 2 3 4 5 6 7 8 9 10111213141516
bit 7
bit 7
CS
SCK
Instruction Byte
for Device 2
Data Byte
for Device 2
Instruction Byte
for Device 1
bit 0
bit 0
bit 7
bit 0
bit 0
bit 7
SI
Data Byte
for Device 1
Instruction Byte
for Device 2
FIGURE 5-5:
bit 0
bit 0
bit 7
(first 16 bits out are always zeros)
bit 7
SO
Data Byte
for Device 2
Serial bus sequence for daisy-chain configuration; SPI 1,1 mode.
 2003-2012 Microchip Technology Inc.
DS21117B-page 23
MCP6S21/2/6/8
5.4
Power-On Reset
If the power supply voltage goes below the POR trip
voltage (VDD < VPOR  1.7V), the internal POR circuit
will reset all of the internal registers to their power-up
defaults (this is a protection against low power supply
voltages). The POR circuit also holds the part in shutdown mode while it is activated. It temporarily overrides
the software shutdown status. The POR releases the
shutdown circuitry once it is released (VDD > VPOR).
A 0.1 µF bypass capacitor mounted as close as possible to the VDD pin provides additional transient
immunity.
DS21117B-page 24
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
6.0
APPLICATIONS INFORMATION
6.1
Changing External Reference
Voltage
Figure 6-1 shows a MCP6S21 with the VREF pin at
2.5V and VDD = 5.0V. This allows the PGA to amplify
signals centered on 2.5V, instead of ground-referenced
signals. The voltage reference MCP1525 is buffered by
a MCP6021, which gives a low output impedance reference voltage from DC to high frequencies. The
source driving the VREF pin should have an output
impedance of  0.1 to maintain reasonable gain
accuracy.
VDD
VDD
VIN
MCP1525
VDD
VOUT
MCP6S21
VREF
For CL  100 pF, a good estimate for RISO is 50. This
value can be fine-tuned on the bench. Adjust RISO so
that the step response overshoot and frequency
response peaking are acceptable at all gains.
6.3
Layout Considerations
Good PC board layout techniques will help achieve the
performance shown in the Electrical Characteristics
and Typical Performance Curves. It will also help
minimize EMC (Electro-Magnetic Compatibility) issues.
6.3.1
COMPONENT PLACEMENT
Separate circuit functions; digital from analog, low
speed from high speed, and low power from high
power, as this will reduce crosstalk.
Keep sensitive traces short and straight, separating
them from interfering components and traces. This is
especially important for high frequency (low rise time)
signals.
Use a 0.1 µF supply bypass capacitor within 0.1 inch
(2.5 mm) of the VDD pin. It must connect directly to the
ground plane. A multi-layer ceramic chip capacitor, or
high-frequency equivalent, works best.
2.5V
REF
MCP6021
6.3.2
1 µF
FIGURE 6-1:
PGA with Different External
Reference Voltage.
6.2
Capacitive Load and Stability
Large capacitive loads can cause both stability problems and reduced bandwidth for the MCP6S21/2/6/8
family of PGAs (Figure 2-17 and Figure 2-18). This
happens because a large load capacitance decreases
the internal amplifier’s phase margin and bandwidth.
If the PGA drives a large capacitive load, the circuit in
Figure 6-2 can be used. A small series resistor (RISO)
at the VOUT improves the phase margin by making the
load resistive at high frequencies. It will not, however,
improve the bandwidth.
The input pins of the MCP6S21/2/6/8 family of operational amplifiers (op amps) are high-impedance. This
makes them especially susceptible to capacitively-coupled noise. Using a ground plane helps reduce this
problem.
When noise is capacitively-coupled, the ground plane
provides additional shunt capacitance to ground. When
noise is magnetically coupled, the ground plane
reduces the mutual inductance between traces.
Increasing the separation between traces makes a
significant difference.
Changing the direction of one of the traces can also
reduce magnetic coupling. It may help to locate guard
traces next to the victim trace. They should be on both
sides of the victim trace and be as close as possible.
Connect the guard traces to the ground plane at both
ends, and in the middle, of long traces.
6.3.3
RISO
VIN
MCP6S2X
VOUT
CL
FIGURE 6-2:
Capacitive Loads.
PGA Circuit for Large
 2003-2012 Microchip Technology Inc.
SIGNAL COUPLING
HIGH FREQUENCY ISSUES
Because the MCP6S21/2/6/8 PGAs reach unity gain
near 64 MHz when G = 16 and 32, it is important to use
good PCB layout techniques. Any parasitic coupling at
high frequency might cause undesired peaking. Filtering high frequency signals (i.e., fast edge rates) can
help. To minimize high frequency problems:
•
•
•
•
•
Use complete ground and power planes
Use HF, surface mount components
Provide clean supply voltages and bypassing
Keep traces short and straight
Try a linear power supply (e.g., an LDO)
DS21117B-page 25
MCP6S21/2/6/8
6.4
Typical Applications
6.4.1
VIN

GAIN RANGING
MCP6021
Figure 6-3 shows a circuit that measures the current IX.
It benefits from changing the gain on the PGA. Just as
a hand-held multimeter uses different measurement
ranges to obtain the best results, this circuit makes it
easy to set a high gain for small signals and a low gain
for large signals. As a result, the required dynamic
range at the PGA’s output is less than at its input (by up
to 30 dB).

10.0 k
VOUT
MCP6S21
1.11 k
FIGURE 6-5:
MCP6S2X
IX
6.4.3
VOUT
FIGURE 6-3:
Wide Dynamic Range
Current Measurement Circuit.
SHIFTED GAIN RANGE PGA
Figure 6-4 shows a circuit using an MCP6021 at a gain
of +10 in front of an MCP6S21. This changes the overall gain range to +10 V/V to +320 V/V (from +1 V/V to
+32 V/V).
VIN
EXTENDED GAIN RANGE PGA
Figure 6-6 gives a +1 V/V to +1024 V/V gain range,
which is much greater than the range for a single PGA
(+1 V/V to +32 V/V). The first PGA provides input multiplexing capability, while the second PGA only needs
one input. These devices can be daisy chained
(Section 5.3, “Daisy Chain Configuration”).
RS
6.4.2
PGA with lower gain range.
MCP6S21
VOUT

PGA with Modified Gain
It is also easy to shift the gain range to lower gains (see
Figure 6-6). The MCP6021 acts as a unity gain buffer,
and the resistive voltage divider shifts the gain range
down to +0.1 V/V to +3.2 V/V (from +1 V/V to +32 V/V).
DS21117B-page 26
6.4.4
MCP6S21
VOUT
PGA with Extended Gain
MULTIPLE SENSOR AMPLIFIER
The multiple channel PGAs (except the MCP6S21)
allow the user to select which sensor appears on the
output (see Figure 6-7). These devices can also
change the gain to optimize performance for each
sensor.
10.0 k
1.11 k
FIGURE 6-4:
Range.
MCP6S28
FIGURE 6-6:
Range.

MCP6021
VIN
Sensor # 0
Sensor # 1
MCP6S26
VOUT
Sensor # 5
FIGURE 6-7:
Inputs.
PGA with Multiple Sensor
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
6.4.5
6.4.7
EXPANDED INPUT PGA
Figure 6-8 shows cascaded MCP6S28s that provide
up to 15 input channels. Obviously, Sensors #7-14
have a high total gain range available, as explained in
Section 6.4.3, “Extended Gain Range”. These devices
can be daisy chained (Section 5.3, “Daisy Chain
Configuration”).
ADC DRIVER
The family of PGA’s is well suited for driving Analog-toDigital Converters (ADC). The binary gains (1, 2, 4, 8,
16 and 32) effectively add five more bits to the input
range (see Figure 6-10). This works well for applications needing relative accuracy more than absolute
accuracy (e.g., power monitoring).
Lowpass
Filter
Sensors
# 0-6
MCP6S28
Sensors
# 7-14
VOUT
VIN
12
MCP6S28
FIGURE 6-8:
PGA with Expanded Inputs.
PIC MCU WITH EXPANDED INPUT
CAPABILITY
Figure 6-9 shows an MCP6S28 driving an analog input
to a PIC microcontroller. This greatly expands the input
capacity of the microcontroller, while adding the ability
to select the appropriate gain for each source.
VIN
OUT
MCP6S28
FIGURE 6-10:
6.4.6
MCP3201
MCP6S28
PGA as an ADC Driver.
At low gains, the ADC’s Signal-to-Noise Ratio (SNR)
will dominate since the PGAs input noise voltage density is so low (10 nV/Hz @ 10 kHz, typ.). At high gains,
the PGA’s noise will dominate the SNR, but its low
noise supports most applications. Again, these PGAs
add the flexibility of selecting the best gain for an
application.
The low pass filter in the block diagram reduces the
integrated noise at the MCP6S28’s output and serves
as an anti-aliasing filter. This filter may be designed
using Microchip’s FilterLab® software, available at
www.microchip.com.
PIC®
Microcontroller
SPI™
FIGURE 6-9:
Microcontroller.
Expanded Input for a PIC®
 2003-2012 Microchip Technology Inc.
DS21117B-page 27
MCP6S21/2/6/8
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
8-Lead PDIP (300 mil) (MCP6S21, MCP6S22)
XXXXXXXX
XXXXXNNN
YYWW
MCP6S21
I/P256
0345
8-Lead SOIC (150 mil) (MCP6S21, MCP6S22)
XXXXXXXX
XXXXYYWW
NNN
Note:
*
Example:
MCP6S21I
345256
XXXXX
YWWNNN
XX...X
YY
WW
NNN
Example:
MCP6S21
I/SN0345
256
8-Lead MSOP (MCP6S21, MCP6S22)
Legend:
Example:
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please check
with your Microchip Sales Office.
DS21117B-page 28
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
Package Marking Information (Con’t)
14-Lead PDIP (300 mil) (MCP6S26)
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
14-Lead SOIC (150 mil) (MCP6S26)
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
14-Lead TSSOP (4.4mm) (MCP6S26)
XXXXXXXX
Example:
MCP6S26-I/P
XXXXXXXXXXXXXX
0345256
Example:
MCP6S26ISL
XXXXXXXXXXXXXXXXXXXXXXXXX
0345256
Example:
MCP6S26IST
YYWW
0345
NNN
256
 2003-2012 Microchip Technology Inc.
DS21117B-page 29
MCP6S21/2/6/8
Package Marking Information (Con’t)
16-Lead PDIP (300 mil) (MCP6S28)
Example:
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
16-Lead SOIC (150 mil) (MCP6S28)
XXXXXXXXXXXXX
XXXXXXXXXXXXX
YYWWNNN
DS21117B-page 30
MCP6S28-I/P
XXXXXXXXXXXXXX
0345256
Example:
MCP6S28-I/SL
XXXXXXXXXXXXXXXXXXXXXXXX
0345256
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
D
2
n
1

E
A2
A
L
c
A1

B1
p
eB
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
c
§
B1
B
eB


MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
 2003-2012 Microchip Technology Inc.
DS21117B-page 31
MCP6S21/2/6/8
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
B
n
1

h
45
c
A2
A


L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L

c
B


MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21117B-page 32
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
p
E1
D
2
B
n
1

A2
A
c

A1
(F)
L

INCHES
Units
Number of Pins
Pitch
Dimension Limits
n
p
Overall Height
MILLIMETERS*
NOM
MIN
MAX
NOM
MIN
.026
0.65
1.18
.044
A
0.86
0.97
4.67
4.90
.5.08
.122
2.90
3.00
3.10
.122
2.90
3.00
3.10
.022
.028
0.40
0.55
0.70
.037
.039
0.90
0.95
1.00
6
0
.006
.008
0.10
0.15
0.20
.012
.016
0.25
0.30
0.40
.038
0.76
.006
0.05
.193
.200
.114
.118
.114
.118
L
.016
.035
Foot Angle
F

Lead Thickness
c
.004
Lead Width
B

.010
Mold Draft Angle Top
Mold Draft Angle Bottom

Molded Package Thickness
A2
.030
Standoff
A1
.002
E
.184
Molded Package Width
E1
Overall Length
D
Foot Length
Footprint (Reference)
§
Overall Width
MAX
8
8
.034
0
0.15
6
7
7
7
7
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
Drawing No. C04-111
 2003-2012 Microchip Technology Inc.
DS21117B-page 33
MCP6S21/2/6/8
14-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
D
2
n
1

E
A2
A
L
c
A1

B1
eB
p
B
Units
Dimension Limits
n
p
MIN
INCHES*
NOM
14
.100
.155
.130
MAX
MILLIMETERS
NOM
14
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
18.80
19.05
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
Molded Package Thickness
A2
.115
.145
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.300
.313
.325
Molded Package Width
E1
.240
.250
.260
Overall Length
D
.740
.750
.760
Tip to Seating Plane
L
.125
.130
.135
c
Lead Thickness
.008
.012
.015
Upper Lead Width
B1
.045
.058
.070
Lower Lead Width
B
.014
.018
.022
Overall Row Spacing
§
eB
.310
.370
.430

Mold Draft Angle Top
5
10
15

Mold Draft Angle Bottom
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-005
DS21117B-page 34
MAX
4.32
3.68
8.26
6.60
19.30
3.43
0.38
1.78
0.56
10.92
15
15
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
14-Lead Plastic Small Outline (SL) – Narrow, 150 mil (SOIC)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
B
n
1

h
45
c
A2
A

A1
L

Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L

c
B


MIN
.053
.052
.004
.228
.150
.337
.010
.016
0
.008
.014
0
0
INCHES*
NOM
14
.050
.061
.056
.007
.236
.154
.342
.015
.033
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.347
.020
.050
8
.010
.020
15
15
MILLIMETERS
NOM
14
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
5.99
3.81
3.90
8.56
8.69
0.25
0.38
0.41
0.84
0
4
0.20
0.23
0.36
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
8.81
0.51
1.27
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-065
 2003-2012 Microchip Technology Inc.
DS21117B-page 35
MCP6S21/2/6/8
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
1
n
B

A
c


A1
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L

c
B1


MIN
.033
.002
.246
.169
.193
.020
0
.004
.007
0
0
INCHES
NOM
14
.026
.035
.004
.251
.173
.197
.024
4
.006
.010
5
5
A2
MAX
.043
.037
.006
.256
.177
.201
.028
8
.008
.012
10
10
MILLIMETERS*
NOM
MAX
14
0.65
1.10
0.85
0.90
0.95
0.05
0.10
0.15
6.25
6.38
6.50
4.30
4.40
4.50
4.90
5.00
5.10
0.50
0.60
0.70
0
4
8
0.09
0.15
0.20
0.19
0.25
0.30
0
5
10
0
5
10
MIN
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
DS21117B-page 36
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
16-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
D
2
n

1
E
A2
A
L
c

A1
B1
eB
p
B
Units
Dimension Limits
n
p
MIN
INCHES*
NOM
16
.100
.155
.130
MAX
MILLIMETERS
NOM
16
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
18.80
19.05
3.18
3.30
0.20
0.29
1.14
1.46
.036
0.46
7.87
9.40
5
10
5
10
MIN
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
Molded Package Thickness
A2
.115
.145
Base to Seating Plane
.015
A1
Shoulder to Shoulder Width
E
.300
.313
.325
Molded Package Width
E1
.240
.250
.260
Overall Length
D
.740
.750
.760
Tip to Seating Plane
L
.125
.130
.135
c
Lead Thickness
.008
.012
.015
Upper Lead Width
B1
.045
.058
.070
Lower Lead Width
B
.014
.018
.022
Overall Row Spacing
§
eB
.310
.370
.430

Mold Draft Angle Top
5
10
15

Mold Draft Angle Bottom
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-017
 2003-2012 Microchip Technology Inc.
MAX
4.32
3.68
8.26
6.60
19.30
3.43
0.38
1.78
0.56
10.92
15
15
DS21117B-page 37
MCP6S21/2/6/8
16-Lead Plastic Small Outline (SL) – Narrow 150 mil (SOIC)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
B
n
1

h
45
c
A2
A

L
A1

Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L

c
B


INCHES*
NOM
16
.050
.053
.061
.052
.057
.004
.007
.228
.237
.150
.154
.386
.390
.010
.015
.016
.033
0
4
.008
.009
.013
.017
0
12
0
12
MIN
MAX
.069
.061
.010
.244
.157
.394
.020
.050
8
.010
.020
15
15
MILLIMETERS
NOM
16
1.27
1.35
1.55
1.32
1.44
0.10
0.18
5.79
6.02
3.81
3.90
9.80
9.91
0.25
0.38
0.41
0.84
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
10.01
0.51
1.27
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-108
DS21117B-page 38
 2003-2012 Microchip Technology Inc.
MCP6S21/2/6/8
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
-X
/XX
Device
Temperature
Range
Package
Device:
Examples:
a)
MCP6S21-I/P: One Channel PGA,
PDIP package.
b)
MCP6S21-I/SN: One Channel PGA,
SOIC package.
c)
MCP6S21-I/MS: One Channel PGA,
MSOP package.
d)
MCP6S22-I/MS: Two Channel PGA,
MSOP package.
e)
MCP6S22T-I/MS: Tape and Reel,
Two Channel PGA, MSOP package.
MCP6S21: One Channel PGA
MCP6S21T: One Channel PGA
(Tape and Reel for SOIC and MSOP)
MCP6S22: Two Channel PGA
MCP6S22T: Two Channel PGA
(Tape and Reel for SOIC and MSOP)
MCP6S26: Six Channel PGA
MCP6S26T: Six Channel PGA
(Tape and Reel for SOIC and TSSOP)
MCP6S28: Eight Channel PGA
MCP6S28T: Eight Channel PGA
(Tape and Reel for SOIC)
f)
MCP6S26-I/P: Six Channel PGA,
PDIP package.
g)
MCP6S26-I/SN: Six Channel PGA,
SOIC package.
Temperature Range:
I
= -40°C to +85°C
h)
MCP6S26T-I/ST: Tape and Reel,
Six Channel PGA, TSSOP package.
Package:
MS
P
SN
SL
ST
=
=
=
=
=
i)
MCP6S28T-I/SL: Tape and Reel,
Eight Channel PGA, SOIC package.
Plastic Micro Small Outline (MSOP), 8-lead
Plastic DIP (300 mil Body), 8, 14, and 16-lead
Plastic SOIC, (150 mil Body), 8-lead
Plastic SOIC (150 mil Body), 14, 16-lead
Plastic TSSOP (4.4mm Body), 14-lead
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
Your local Microchip sales office
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2003-2012 Microchip Technology Inc.
DS21117B-page 39
MCP6S21/2/6/8
NOTES:
DS21117B-page 40
 2003-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2003-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767504
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2003-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21117B-page 41
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
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Tel: 852-2401-1200
Fax: 852-2401-3431
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Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
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Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
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Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
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Tel: 91-20-2566-1512
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Tel: 33-1-69-53-63-20
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Tel: 81-66-152-7160
Fax: 81-66-152-9310
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Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
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Tel: 678-957-9614
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Tel: 774-760-0087
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Tel: 216-447-0464
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Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21117B-page 42
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
10/26/12
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