STMicroelectronics M29DW324 Flash nor high density & consumer Datasheet

FLASH NOR
HIGH DENSITY & CONSUMER
M29DWxxx FAMILY
Multiple Bank
May, 2004
HD & Cons. Division -VAM29DW.ppt – ptfl0402-504
STMicroelectronics
www.st.com/flash
Family Overview
¾Densities from 32Mb to 64Mb
¾Wide application area covered
¾0.15µm process technology
¾technology shrink on going
¾higher densities
¾improved performances
¾Increased reliability
HD & Cons. Division - May, 2004
M29DW.ppt – release 1.0 –ptfl0402-504-
www.st.com/flash
page 2
Main Features
M29DW323
¾32Mb (4Mbx8 / 2Mbx16), Boot Block
¾Access Time
¾70, 90ns
¾Supply Voltage
¾Vcc = 2.7V to 3.6V for Program, Erase and Read
¾Vpp = 12V for fast Program (optional)
¾Programming Time
¾10µs per Byte/Word typical
¾Double Word / Quadruple Byte Program
¾Low Power Consumption
¾Standby and Automatic Standby
¾Dual Operations:
¾Read in one bank or group of banks while Program or
Erase in the other
HD & Cons. Division - May, 2004
M29DW.ppt – release 1.0 –ptfl0402-504-
www.st.com/flash
page 3
Bank Architecture
M29DW323
DUAL BANK Memory Array 8Mb + 24Mb
While Programming or Erasing in Bank A,
Read operations are possible in Bank B
and viceversa
HD & Cons. Division - May, 2004
M29DW.ppt – release 1.0 –ptfl0402-504-
www.st.com/flash
page 4
Main Features
M29DW324
¾32Mb (4Mbx8 / 2Mbx16), Boot Block
¾Access Time
¾70, 90ns
¾Supply Voltage
¾Vcc = 2.7V to 3.6V for Program, Erase and Read
¾Vpp = 12V for fast Program (optional)
¾Programming Time
¾10µs per Byte/Word typical
¾Double Word / Quadruple Byte Program
¾Low Power Consumption
¾Standby and Automatic Standby
HD & Cons. Division - May, 2004
M29DW.ppt – release 1.0 –ptfl0402-504-
www.st.com/flash
page 5
Bank Architecture
M29DW324
DUAL BANK Memory Array 16Mb + 16Mb
While Programming or Erasing in Bank A,
Read operations are possible in Bank B
and viceversa
HD & Cons. Division - May, 2004
M29DW.ppt – release 1.0 –ptfl0402-504-
www.st.com/flash
page 6
Main Features
M29DW640
¾64Mb (8Mbx8 / 4Mbx16), Page, Boot Block
¾Access Time
¾70, 90ns
¾Supply Voltage
¾Vcc = 2.7V to 3.6V for Program, Erase and Read
¾Vpp = 12V for fast Program (optional)
¾Programming Time
¾10µs per Byte/Word typical
¾4 word / 8Bytes at-a-time Program
¾Asynchronous Page Read Mode
¾Page Width 4 Words
¾Page Access 25,30ns
¾Random Access 70,90ns
HD & Cons. Division - May, 2004
M29DW.ppt – release 1.0 –ptfl0402-504-
www.st.com/flash
page 7
Bank Architecture
M29DW640
QUADRUPLE BANK Memory Array
8Mb + 24Mb + 24Mb + 8Mb
While Programming or Erasing in a group of Banks
(from 1 to 3), Read operations are possible in any of the
other banks
HD & Cons. Division - May, 2004
M29DW.ppt – release 1.0 –ptfl0402-504-
www.st.com/flash
page 8
Other Family Features
¾Temporary block unprotection mode
¾Unlock bypass Program Command
¾faster production/batch programming
¾Extended memory block
¾Extra block used as security block or to store additional
information
¾Common Flash Interface
¾64 bit security code
¾M29DW323/324: Erase suspend and resume modes
¾Read and program another block during erase suspend
¾M29DW640: Program /Erase suspend and resume modes
¾Read from any block during program suspend
¾Read and program another block during erase suspend
¾100,000 program / erase cycles per block
HD & Cons. Division - May, 2004
M29DW.ppt – release 1.0 –ptfl0402-504-
www.st.com/flash
page 9
TSOP48 Package
Package connections
Package Mechanical
TSOP48 Lead Plastic Thin Small Outline
12x20mm Bottom View Package Outline
¾M29DW323
¾M29DW324
¾M29DW640
HD & Cons. Division - May, 2004
M29DW.ppt – release 1.0 –ptfl0402-504-
www.st.com/flash
page 10
TFBGA48 Package
Package connections
Package Mechanical
Top view through package
6x8mm -6x8 Ball Array, 0.8mm pitch
Bottom View Package Outline
¾M29DW323
¾M29DW324
HD & Cons. Division - May, 2004
M29DW.ppt – release 1.0 –ptfl0402-504-
www.st.com/flash
page 11
Part Numbering Scheme
ex. M29DW640D
Speed
Device Function
640D= 64Mb (x8/x16), Boot Block
8+24+24+8 partitioning
M29
W
D
640D
Architecture
D = Dual Operations
Device Type
M28
Package
70 = 70ns
90 = 90ns
N = TSOP48, 12x20mm
ZA = TFBGA63, 7x11mm,
0.80mm pitch
70 N
1
T
Temperature Range
1 = 0 to 70 °C
6 = -40 to + 85°C
Option
Operating Voltage
W = Vcc = 2.7V to 3.6V
HD & Cons. Division - May, 2004
M29DW.ppt – release 1.0 –ptfl0402-504-
Blank = Standard Packing
T = Tape & Reel Packing 24mm
E = Lead Free Package, Standard Packing
F = Lead Free Package, Tape & Reel
Packing
www.st.com/flash
page 12
Main Applications
¾Mobile Phone
¾Digital Video Disk
¾Personal Digital Assistant
¾Set-Top Box
¾Digital Still Camera
¾High Definition TV
¾Personal Computer
¾Game
HD & Cons. Division - May, 2004
M29DW.ppt – release 1.0 –ptfl0402-504-
www.st.com/flash
page 13
Future Developments
¾New State of the Art technology shrink on going
¾Higher densities soon available
¾Improved performances
¾Stand Alone and Stacked solutions
HD & Cons. Division - May, 2004
M29DW.ppt – release 1.0 –ptfl0402-504-
www.st.com/flash
page 14
Additional Information
¾www.st.com/flash
¾Datasheets
¾Application Notes
¾Software Drivers
¾Presentations
¾Technical Articles
¾…and more…
[email protected]
HD & Cons. Division - May, 2004
M29DW.ppt – release 1.0 –ptfl0402-504-
www.st.com/flash
page 15
Similar pages