BeRex BD25B Quadruple Band 2-Way SMT Power Divider 1700~2500MHz USPCS & PCS, WCDMA & TD-SCDMA, WiBro Device Features and Description 23dB Typical Isolation 0.5dB Typical Insertion Loss Small Size and Low Profile MSL 1 moisture rating Lead-free/Green/RoHS compliant package Application: commercial, space, military wireless system Industry Standard SOIC-8 SMT Plastic Package with exposed back side ground pad Chip is fully passivated for enhanced performance and reliability Can be used without back side ground soldering (This may degrade the performance at the high frequency edge. Refer to the following typical test data) Electrical specifications Parameters Unit Min Typ Max Frequency Range MHz 1700 Insertion Loss dB Isolation dB IRL(S11) dB -20 -15 ORL(S22,S33) dB -23 -15 Amplitude Balance dB 0.05 0.2 Phase Balance deg 1.0 2.0 2500 0.5 15 0.8 23 All specifications apply with the following test conditions, 1. Device performance is measured on BeRex evaluation board at 25C, 50 ohm system 2. Insertion Loss: Above 3.0dB 3. Back side ground was soldered Absolute Maximum Ratings Parameters Input Power Storage Temperature Operating Temperature Rating 1W CW -55 to +155C -40C to +85C Operation of this device above any of these parameters may result in permanent damage. Function Block Diagram http: //www.berex.com BeRex BD25B Evaluation Board Drawing Pins 1,3,4,6 and 7 must be DC and RF grounded. Typical Test Data With Back Side Ground Soldering TD-SCDMA WCDMA Parameters Unit USPCS & PCS WiBro Frequency Range MHz 1700 1800 1900 1900 2075 2250 2200 2350 2500 Insertion Loss dB 0.37 0.38 0.38 0.38 0.42 0.53 0.48 0.60 0.75 Isolation dB 19.6 20.8 21.9 21.9 25.7 28.9 30.6 22.2 15.5 IRL(S11) dB -21.3 -23.7 -25.4 -25.4 -22.0 -17.3 -18.5 -15.2 -12.6 ORL(S22,S33) dB -24.4 -32.2 -33.9 -33.9 -24.7 -22.4 -22.6 -22.5 -22.7 Phase Diff. deg 0.2 0.2 0.3 0.3 0.4 0.5 0.5 0.7 0.7 Amplitude Balance dB 0.07 0.07 0.07 0.08 0.09 0.10 0.10 0.12 0.10 Without Back Side Ground Soldering USPCS & PCS TD-SCDMA WCDMA Parameters Unit WiBro Frequency Range MHz 1700 1800 1900 1900 2075 2250 2200 2350 2500 Insertion Loss dB 0.40 0.41 0.42 0.42 0.49 0.64 0.59 0.75 0.94 Isolation dB 19.5 21.1 22.7 22.7 26.3 23.6 25.7 19.0 13.7 IRL(S11) dB -20.8 -21.7 -21.1 -21.1 -17.8 -14.3 -15.2 -12.4 -10.2 ORL(S22,S33) dB -25.9 -37.8 -31.5 -31.5 -22.8 -20.3 -20.6 -19.9 -19.4 Phase Diff. deg 1.5 1.5 1.6 1.6 1.7 1.7 1.7 1.7 2.0 Amplitude Balance dB 0.08 0.08 0.09 0.09 0.11 0.10 0.11 0.10 0.08 http: //www.berex.com BD25B Insertion Loss vs. Frequency Isolation vs. Frequency BG BG NBG 0 0 -1 -5 -2 -10 Isolation [dB] Insertion Loss [dB] BeRex -3 -4 -5 -15 -20 -25 -6 1700 1900 2100 2300 2500 -30 1700 1900 Freq [MHz] BG BG NBG -5.00 -5.00 -10.00 -10.00 ORL [dB] 0.00 -15.00 -20.00 -25.00 -25.00 2100 2500 2300 2500 NBG -15.00 -20.00 1900 2300 ORL vs. Frequency 0.00 -30.00 1700 2100 Freq [MHz] IRL vs. Frequency IRL [dB] NBG -30.00 1700 Freq [MHz] 1900 2100 2300 2500 Freq [MHz] Notes) - BG: Data taken with backside ground soldering - NBG: Data taken without backside ground soldering http: //www.berex.com BeRex BD25B Package Drawing http: //www.berex.com BeRex BD25B Suggested PCB Land Pattern and PAD Layout PCB Land Pattern PCB Mounting RF In 0.047"(1.20) 0.018"(0.45) 0.076"(1.92) 0.157"(3.98) 0.040"(1.01) RF Out1 RF Out2 0.030"(0.76) 0.198"(5.02) Visit http://www.berex.com for PCB layout Tape & Reel Packaging information: SOIC8 SOIC8-Part orientation Tape Width (mm): 12 Reel Size (inches): 7 Device Cavity Pitch (mm): 8 Devices Per Reel: 1000 Direction of feed Lead plating finish 100% Tin Matte finish. (All BeRex products undergoes a 1 hour, 150 degree C, Anneal bake to eliminate thin whisker growth concerns) MSL / ESD Rating MSL Rating: Standard: Level 3 at +265C convection reflow JEDEC Standard J-STD-020 NATO CAGE code: 2 N 9 6 F NOTICE BeRex Corporation reserves the right to make changes of product specification or to discontinue product at any time without notice. http: //www.berex.com