HP HCPL-050L-500 Lvttl/lvcmos compatible 3.3 v optocouplers (1 mb/s) Datasheet

AgilentHCPL-250L/050L/253L/053L
LVTTL/LVCMOS Compatible 3.3 V
Optocouplers (1 Mb/s)
Data Sheet
Features
• Low power consumption
• High speed: 1 Mb/s
• LVTTL/LVCMOS compatible
Description
These diode-transistor optocouplers
use an insulating layer between a
LED and an integrated
photodetector to provide electrical
insulation between input and
output. Separate connections for
the photodiode bias and outputtransistor collector increase the
speed up to a hundred times that of
a conventional phototransistor
coupler by reducing the basecollector capacitance.
These optocouplers are available
in an 8-pin DIP and in an industry
standard SO-8 package. The
following is a cross reference
table listing the 8-pin DIP part
number and the electrically
equivalent SO-8 part number.
• Available in 8-pin DIP, SO-8
The SO-8 does not require
"through holes" in a PCB. This
package occupies approximately
one-third the footprint area of the
Applications
• Open collector output
• Guaranteed performance from
temperature: 0˚C to +70˚C
• Safety approval, UL, CSA, IEC/EN/DIN
EN 60747-5-2
• High voltage insulation
• Video signal isolation
• Power translator isolation in motor
drives
• Line receivers
Functional Diagram
• Feedback element in switched mode
power supplies
HCPL–250L/HCPL–050L
NC 1
HCPL–253L/HCPL–053L
8 VCC
ANODE 1 1
8 VCC
• High speed logic ground isolation –
LVTTL/LVCMOS
• Replaces pulse transformers
ANODE 2
7 VB
CATHODE 1 2
7 VO1
CATHODE 3
6 VO
CATHODE 2 3
6 VO2
• Replaces slow phototransistor
isolators
• Analog signal ground isolation
NC 4
5 GND
ANODE 2 4
5 GND
TRUTH TABLE
(POSITIVE LOGIC)
LED
VO
LOW
ON
HIGH
OFF
A 0.1 µF bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent
damage and/or degradation which may be induced by ESD.
Ordering Information
Specify Part Number followed by Option Number (if desired).
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
Example:
HCPL-250L #XXXX
These optocouplers can be used
in LVTTL/LVCMOS or wide
bandwidth analog applications.
060 = IEC/EN/DIN EN 60747-5-2 VIORM
500 = Tape and Reel Packaging Option
XXXE = Lead Free Option
The common mode transient
immunity of 1000 V/µs minimum
to typical at VCM = 10 V
guaranteed for these
optocouplers.
8-Pin DIP
HCPL-250L
HCPL-253L
Option data sheets available. Contact Agilent sales representative or
authorized distributor for information.
Remarks: The notation “#” is used for existing products, while (new)
products launched since 15th July 2001 and lead free option will use “-”
SO-8 Package
HCPL-050L
HCPL-053L
Schematic
HCPL-250L/HCPL-050L
HCPL-253L/HCPL-053L
ICC
ICC
I F1
+
8
VF1
+
I O1
–
VF
CATHODE
1
VCC
IF
2
ANODE
8
IO
–
6
7
VCC
VO1
2
VO
3
5
SHIELD
IB
7 *
VB
3
GND
I F2
–
I O2
6
VF2
VO2
+
4
GND
5
SHIELD
2
Package Outline Drawings
8-Pin DIP Package
7.62 ± 0.25
(0.300 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
8
TYPE NUMBER
7
6
5
6.35 ± 0.25
(0.250 ± 0.010)
OPTION CODE*
DATE CODE
A XXXXZ
YYWW RU
1
2
3
4
UL
RECOGNITION
1.78 (0.070) MAX.
1.19 (0.047) MAX.
5° TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
0.51 (0.020) MIN.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
* MARKING CODE LETTER FOR OPTION NUMBERS
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
0.65 (0.025) MAX.
1.080 ± 0.320
(0.043 ± 0.013)
2.54 ± 0.25
(0.100 ± 0.010)
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Small Outline SO-8 Package
LAND PATTERN RECOMMENDATION
8
7
6
5
5.994 ± 0.203
(0.236 ± 0.008)
XXXV
YWW
3.937 ± 0.127
(0.155 ± 0.005)
TYPE NUMBER
(LAST 3 DIGITS)
7.49 (0.295)
DATE CODE
PIN ONE 1
2
3
4
0.406 ± 0.076
(0.016 ± 0.003)
1.9 (0.075)
1.270 BSC
(0.050)
0.64 (0.025)
* 5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005)
7°
45° X
0.432
(0.017)
0 ~ 7°
0.228 ± 0.025
(0.009 ± 0.001)
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
0.305 MIN.
(0.012)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
3
Regulatory Information
The devices contained in this
data sheet have been approved by
the following organizations:
Solder Reflow Temperature Profile
300
TEMPERATURE (°C)
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
200
2.5°C ± 0.5°C/SEC.
30
SEC.
160°C
150°C
140°C
SOLDERING
TIME
200°C
CSA
100
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
Approval under CSA Component
Acceptance
Notice #5, File CA 88324.
IEC/EN/DIN EN 60747-5-2
0
50
100
150
200
TIME (SECONDS)
Recommended Pb-Free IR Profile
tp
Tp
TL
TEMPERATURE
Approval under UL 1577,
Component Recognition
Program, File E55361.
30
SEC.
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
Tsmax
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
260 +0/-5 °C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
RAMP-DOWN
6 °C/SEC. MAX.
Tsmin
ts
PREHEAT
60 to 180 SEC.
tL
60 to 150 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 °C, Tsmin = 150 °C
4
UL
PEAK
TEMP.
230°C
250
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
Insulation and Safety Related Specifications
Parameter
Minimum External Air
Gap (External Clearance)
Minimum External Tracking
(External Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking
Index)
Isolation Group
Symbol
L (101)
8-Pin DIP
(300 Mil)
Value
7.1
SO-8
Value
4.9
Units
mm
L (102)
7.4
4.8
mm
0.08
0.08
mm
200
200
Volts
IIIa
IIIa
CTI
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
IEC/EN/DIN EN 60747-5-2Insulation Related Characteristics
Description
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤ 150 V rms
for rated mains voltage ≤ 300 V rms
for rated mains voltage ≤ 600 V rms
Climatic Classification
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b*
VIORM x 1.875 = VPR, 100% Production Test
with tm = 1 sec, Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
VIORM x 1.5 = VPR, Type and Sample Test,
tm = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec)
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 16, Thermal Derating curve.)
Case Temperature
Input Current
Output Power
Insulation Resistance at TS, VIO = 500 V
Symbol
PDIP Option 060
SO-8 Option 60
Units
VIORM
I-IV
I-III
55/85/21
2
630
I-IV
I-III
I-II
55/85/21
2
566
Vpeak
VPR
1181
1063
Vpeak
VPR
945
849
Vpeak
VIOTM
6000
4000
Vpeak
TS
IS,INPUT
PS,OUTPUT
RS
175
230
600
≥ 109
150
150
600
≥ 109
˚C
mA
mW
Ω
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN 60747-5-2, for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
5
Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Symbol
TS
TA
Average Forward Input Current
Peak Forward Input Current
(50% duty cycle, 1 ms pulse width)
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current
(≤ 1 µs pulse width, 300 pps)
IF(AVG)
IF(PEAK)
Reverse LED Input Voltage (Pin 3-2)
Input Power Dissipation
VR
PIN
Average Output Current (Pin 6)
Peak Output Current
Emitter-Base Reverse Voltage
Supply Voltage (Pin 8-5)
Output Voltage (Pin 6-5)
Base Current
Output Power Dissipation
Lead Solder Temperature
(Through Hole Parts Only)
1.6 mm below seating plane, 10 sec.
up to seating plane, 10 seconds
Reflow Temperature Profile
IO(AVG)
IO(PEAK)
VEBR
VCC
VO
IB
PO
Min.
–55
–55
–55
IF(TRANS)
TLS
TRP
–0.5
–0.5
Max.
125
100
85
25
Units
°C
°C
Note
mA
1
2
50
40
1
mA
0.1
5
45
4
8
16
5
7
7
5
100
6
Symbol
VCC
IF(ON)
VF(OFF)
TA
Min.
2.7
16
0
0
V
mW
3
mA
mA
V
V
V
mA
mW
4
260
°C
260
°C
See Package Outline Drawings
section
Recommended Operating Conditions
Parameter
Power Supply Voltage
Forward Input Current
Forward Input Voltage
Operating Temperature
A
Max.
3.6
20
0.8
85
Units
V
mA
V
°C
Electrical Specifications (DC)
Over Recommended Temperature (TA = 0˚C to +70˚C), VCC = 3.3 V, IF = 16 mA, unless otherwise specified. See Note 13.
Parameter
Sym. Device Min. Typ.
Current Transfer CTR
Ratio
15
Logic Low
Output Voltage
VOL
Logic High
Output Current
Logic Low
Supply Current
Logic High
Supply Current
Input Forward
Voltage
Input Reverse
Breakdown
Voltage
Input
Capacitance
IOH
ICCH
Dual
VF
IF = 16 mA,
VCC = 3.3 V
Fig. Note
2
5, 11
50
IF = 16 mA,
VCC = 3.3 V
0.05 0.3
0.003 1
µA
TA = 25˚C
TA = 25˚C
43.0
µA
IF = 16 mA, VO = Open, VCC = 3.3 V
13
µA
TA = 25˚C
13
V
TA = 25˚C
V
IR = 10 µA
pF
f = 1 MHz, VF = 0 V
100
300
0.005 0.3
10
1.52 1.7
Dual
CIN
Test Conditions
TA = 25˚C VO = 0.4 V
V
ICCL
BVR
20
Max. Units
%
5
60
IO = 3.0 mA
VO = VCC = 3.3 V IF = 0 mA
IF = 0 mA, VO = Open,
VCC = 3.3 V
IF = 16 mA
3
1
Switching Specifications (AC)
Over Recommended Temperature (TA = 0˚C to +70˚C), VCC = 3.3 V, IF = 16 mA unless otherwise specified.
All typicals at VCC = 3.3 V, TA = 25°C.
Parameter
Propagation
Delay Time to
Logic Low at
Output
Propagation
Delay Time to
Logic High at
Output
Common Mode
Transient
Immunity at
Logic High
Level Output
Common Mode
Transient
Immunity at
Logic Low
Level Output
Sym.
tPHL
Device Min. Typ.* Max. Units
0.35
1
µs
tPLH
0.65
|CMH|
1
kV/µs
|CML|
1
kV/µs
*All typicals at TA = 25˚C
7
1
Test Conditions
RL = 1.9 kΩ
µs
Fig. Note
5
8, 9
RL = 1.9 kΩ
5
8, 9
RL = 4.1 kΩ
RL = 1.9 kΩ
IF = 0 mA, TA = 25˚C,
VCM = 10 Vp-p
CL = 15 pF
6
7, 8, 9
RL = 4.1 kΩ
RL = 1.9 kΩ
IF = 16 mA, TA = 25˚C,
VCM = 10 Vp-p
CL = 15 pF
6
7, 8, 9
Package Characteristics
Over Recommended Temperature (TA = 0˚C to 70˚C) unless otherwise specified.
Parameter
Sym. Device
Min. Typ.* Max.
Units Test Conditions
Input-Output
VISO
8-Pin DIP
3750
V rms RH < 50%,
Momentary
SO-8
t = 1 min.,
Withstand
TA = 25˚C
Voltage**
I I-O
8-Pin DIP
1
µA
45% RH, t = 5 s,
VI-O = 3 kVdc,
TA = 25˚C
Input-Output
RI-O
8-Pin DIP
1012
Ω
VI-O = 500 Vdc
Resistance
SO-8
Input-Output
CI-O
8-Pin DIP
0.6
pF
f = 1 MHz
Capacitance
SO-8
Fig.
Note
6, 14
6, 16
6
6
*All typicals at TA = 25˚C.
**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous
voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table (if applicable),
your equipment level safety specification or Agilent Application Note 1074 entitled "Optocoupler Input-Output Endurance Voltage," publication
number 5963-2203E.
Notes:
1. Derate linearly above 70˚C free-air temperature at a rate of 0.8 mA/˚C (8-Pin DIP).
Derate linearly above 85˚C free-air temperature at a rate of 0.5 mA/˚C (SO-8).
2. Derate linearly above 70˚C free-air temperature at a rate of 1.6 mA/˚C (8-Pin DIP).
Derate linearly above 85˚C free-air temperature at a rate of 1.0 mA/˚C (SO-8).
3. Derate linearly above 70˚C free-air temperature at a rate of 0.9 mW/˚C (8-Pin DIP).
Derate linearly above 85˚C free-air temperature at a rate of 1.1 mW/˚C (SO-8).
4. Derate linearly above 70˚C free-air temperature at a rate of 2.0 mW/˚C (8-Pin DIP).
Derate linearly above 85˚C free-air temperature at a rate of 2.3 mW/˚C (SO-8).
5. CURRENT TRANSFER RATIO in percent is defined as the ratio of output collector current, IO, to the forward LED input current, IF, times 100.
6. Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together.
7. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM/dt on the leading edge of the common
mode pulse signal, VCM, to assure that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a
Logic Low level is the maximum tolerable (negative) dVCM/dt on the trailing edge of the common mode pulse signal, VCM, to assure that the
output will remain in a Logic Low state (i.e., VO < 0.8 V).
8. The 1.9 kΩ load represents 1 TTL unit load of 1.6 mA and the 5.6 mA kΩ pull-up resistor.
9. The 4.1 kΩ load represents 1 LSTTL unit load of 0.36 mA and 6.1 kΩ pull-up resistor.
10. The frequency at which the AC output voltage is 3 dB below its mid-frequency value.
11. The JEDEC registration for the 6N136 specifies a minimum CTR of 15%. Agilent guarantees a minimum CTR of 15%.
12. See Option 020 data sheet for more information.
13. Use of a 0.1 µf bypass capacitor connected between pins 5 and 8 is recommended.
14. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 4500 V rms for 1 second (leakage
detection current limit, II-O ≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation
Related Characteristics Table, if applicable.
15. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 6000 V rms for 1 second (leakage
detection current limit, II-O ≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation
Related Characteristics Table, if applicable.
16. This rating is equally validated by an equivalent AC proof test.
8
IF
TA = 25°C
+
VF
–
10
1.0
0.1
0.01
0.001
1.1
1.2
1.3
1.4
1.5
1.6
VF – FORWARD VOLTAGE – VOLTS
OUTPUT POWER – PS, INPUT CURRENT – IS
Figure 1. Input current vs. forward voltage.
800
PS (mW)
700
IS (mA)
600
500
400
300
200
100
0
0
25
50
75 100 125 150 175 200
TS – CASE TEMPERATURE – °C
Figure 4. Thermal derating curve, dependence
of safety limiting value with case temperature
per IEC/EN/DIN EN 60747-5-2.
9
8 PIN DIP, SO-8
1.1
1.0
0.9
0.8
NORMALIZED
IF = 16 mA
VO = 0.4 V
VCC = 3.3 V
TA = 25°C
0.7
0.6
-60 -40 -20
0
20
40
60
80 100
TA – TEMPERATURE – °C
Figure 2. Current transfer ratio vs.
temperature.
IOH – LOGIC HIGH OUTPUT CURRENT – nA
IF – FORWARD CURRENT – mA
100
NORMALIZED CURRENT TRANSFER RATIO
8 PIN DIP, SO-8
1000
8 PIN DIP, SO-8
10+4
10+3
IF = 0
VO = VCC = 3.3 V
10+2
10+1
100
10 -1
10 -2
-75
-50
-25
0
+25 +50 +75 +100
TA – TEMPERATURE – °C
Figure 3. Logic high output current vs.
temperature.
IF
PULSE
GEN.
ZO = 50 Ω
t r = 5 ns
0
VO
IF
10% DUTY CYCLE
1/f < 100 µS
50%
50%
VOL
8
2
7
3
6
+3.3 V
RL
VO
0.1µF
I F MONITOR
4
5
CL = 1.5 µF
RM
t PLH
t PHL
1
Figure 5. Switching test circuit.
IF
1
8
2
7 *
3
6
+3.3 V
B
VCM
10%
0V
90% 90%
10%
tr
RL
A
tf
VO
0.1 µF
VO
4
3.3 V
VO
SWITCH AT B: I F = 16 mA
5
VFF
SWITCH AT A: I F = 0 mA
VOL
VCM
+
–
PULSE GEN.
Figure 6. Test circuit for transient immunity and typical waveforms.
10
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Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5989-0300EN
December 20, 2004
5989-2111EN
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