® OPA 177 OPA177 OPA 177 Precision OPERATIONAL AMPLIFIER FEATURES APPLICATIONS ● LOW OFFSET VOLTAGE: 25µV max ● LOW DRIFT: 0.3µV/°C ● PRECISION INSTRUMENTATION ● DATA ACQUISITION ● HIGH OPEN-LOOP GAIN: 130dB min ● LOW QUIESCENT CURRENT: 1.5mA typ ● TEST EQUIPMENT ● BRIDGE AMPLIFIER ● REPLACES INDUSTRY-STANDARD OP AMPS: OP-07, OP-77, OP-177, AD707, ETC. ● THERMOCOUPLE AMPLIFIER DESCRIPTION The OPA177 precision bipolar op amp feature very low offset voltage and drift. Laser-trimmed offset, drift and input bias current virtually eliminate the need for costly external trimming. The high performance and low cost make them ideally suited to a wide range of precision instrumentation. electric effects in input interconnections. It provides an effective alternative to chopper-stabilized amplifiers. The low noise of the OPA177 maintains accuracy. OPA177 performance gradeouts are available. Packaging options include 8-pin plastic DIP and SO-8 surface-mount packages. The low quiescent current of the OPA177 dramatically reduce warm-up drift and errors due to thermoV+ 7 Trim 1 14kΩ Trim 8 25Ω VO 6 30Ω +In 3 –In 2 500Ω 500Ω 20µA V– 4 International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111 Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132 © SBOS008 1990 Burr-Brown Corporation PDS-1081E Printed in U.S.A. August, 1997 OPA177 SPECIFICATIONS At VS = ±15V, TA = +25°C, unless otherwise noted. OPA177F PARAMETER CONDITION OFFSET VOLTAGE Input Offset Voltage Long-Term Input Offset(1) Voltage Stability Offset Adjustment Range Power Supply Rejection Ratio RP = 20kΩ VS = ±3V to ±18V MIN 115 INPUT BIAS CURRENT Input Offset Current Input Bias Current NOISE Input Noise Voltage Input Noise Current INPUT IMPEDANCE Input Resistance 1Hz to 100Hz(2) 1Hz to 100Hz Differential Mode(3) Common-Mode TYP MAX 10 0.3 25 ±3 125 OPA177G MIN 110 TYP MAX UNITS 20 0.4 60 µV µV/Mo ✻ 120 mV dB 0.3 0.5 1.5 ±2 ✻ ✻ 2.8 ±2.8 nA nA 85 4.5 150 ✻ ✻ ✻ nVrms pArms 26 45 200 18.5 ✻ ✻ MΩ GΩ INPUT VOLTAGE RANGE Common-Mode Input Range(4) Common-Mode Rejection VCM = ±13V ±13 130 ±14 140 ✻ 115 ✻ ✻ V dB OPEN-LOOP GAIN Large Signal Voltage Gain RL ≥ 2kΩ VO = ±10V(5) 5110 12,000 2000 6000 V/mV RL ≥ 10kΩ RL ≥ 2kΩ RL ≥ 1kΩ ±13.5 ±12.5 ±12 ±14 ±13 ±12.5 60 ✻ ✻ ✻ ✻ ✻ ✻ ✻ V V V Ω RL ≥ 2kΩ G = +1 0.1 0.4 0.3 0.6 ✻ ✻ ✻ ✻ V/µs MHz OUTPUT Output Voltage Swing Open-Loop Output Resistance FREQUENCY RESPONSE Slew Rate Closed-Loop Bandwidth POWER SUPPLY Power Consumption Supply Current VS = ±15V, No Load VS = ±3V, No Load VS = ±15V, No Load 40 3.5 1.3 60 4.5 2 ✻ ✻ ✻ ✻ ✻ ✻ mW mW mA 15 0.1 40 0.3 20 0.7 100 1.2 µV µV/°C At VS = ±15V, –40°C ≤ TA ≤ +85°C, unless otherwise noted. OFFSET VOLTAGE Input Offset Voltage Average Input Offset Voltage Drift Power Supply Rejection Ratio VS = ±3V to ±18V 110 INPUT BIAS CURRENT Input Offset Current Average Input Offset Current Drift(6) Input Bias Current Average Input Bias Current Drift(6) INPUT VOLTAGE RANGE Common-Mode Input Range Common-Mode Rejection OPEN-LOOP GAIN Large Signal Voltage Gain OUTPUT Output Voltage Swing POWER SUPPLY Power Consumption Supply Current 120 106 115 dB 0.5 1.5 2.2 40 ✻ ✻ 4.5 85 nA pA/°C 0.5 8 ±4 40 ✻ 15 ±6 60 nA pA/°C VCM = ±13V ±13 120 ±13.5 140 ✻ 110 ✻ ✻ V dB RL ≥ 2kΩ, VO = ±10V 2000 6000 1000 4000 V/mV RL ≥ 2kΩ ±12 ±13 ✻ ✻ V VS = ±15V, No Load VS = ±15V, No Load 60 2 75 25 ✻ ✻ ✻ ✻ mW mA ✻ Same as specification for product to left. NOTES: (1) Long-Term Input Offset Voltage Stability refers to the averaged trend line of VOS vs time over extended periods after the first 30 days of operation. Excluding the initial hour of operation, changes in VOS during the first 30 operating days are typically less than 2µV. (2) Sample tested. (3) Guaranteed by design. (4) Guaranteed by CMRR test condition. (5) To insure high open-loop gain throughout the ±10V output range, AOL is tested at –10V ≤ VO ≤ 0V, 0V ≤ VO ≤ +10V, and –10V ≤ VO ≤ +10V. (6) Guaranteed by end-point limits. ® OPA177 2 PIN CONFIGURATION ABSOLUTE MAXIMUM RATINGS Top View Power Supply Voltage ....................................................................... ±22V Differential Input Voltage ................................................................... ±30V Input Voltage ....................................................................................... ±VS Output Short Circuit ................................................................. Continuous Operating Temperature: Plastic DIP (P), SO-8 (S) .............................................. –40°C to +85°C θJA (PDIP) ................................................................................. 100°C/W θJA (SOIC) ................................................................................. 160°C/W Storage Temperature: Plastic DIP (P), SO-8 (S) ............................................ –65°C to +125°C Junction Temperature .................................................................... +150°C Lead Temperature (soldering, 10s) P packages ........................... +300°C (soldering, 3s) S package ............................... +260°C DIP/SOIC Offset Trim 1 8 Offset Trim –In 2 7 V+ +In 3 6 VO V– 4 5 No Internal Connection PACKAGE/ORDERING INFORMATION PRODUCT PACKAGE PACKAGE DRAWING NUMBER(1) OPA177FP OPA177GP OPA177GS 8-Pin Plastic DIP 8-Pin Plastic DIP SO-8 Surface-Mount 006 006 182 TEMPERATURE RANGE –40°C to +85°C –40°C to +85°C –40°C to +85°C ELECTROSTATIC DISCHARGE SENSITIVITY Any integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. ESD can cause damage ranging from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet published specifications. NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. Burr-Brown’s standard ESD test method consists of five 1000V positive and negative discharges (100pF in series with 1.5kΩ) applied to each pin. Failure to observe proper handling procedures could result in small changes to the OPA177’s input bias current. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. ® 3 OPA177 TYPICAL PERFORMANCE CURVES At TA = +25°C, VS = ±15V, unless otherwise noted. TOTAL HARMONIC DISTORTION AND NOISE vs FREQUENCY MAXIMUM VOUT vs IOUT (Negative Swing) 1 –17.5 A = 20dB, 3Vrms, 10kΩ load Inverting Noninverting VS = ±18V –12.5 VS = ±15V –10 VS = ±12V VOUT (V) THD + N (%) 0.1 –15 –7.5 0.01 –5 VS = ±15V –2.5 30kHz low pass filtered 0.001 0 1k 10k 100k 0 –2 –4 –6 Frequency (Hz) MAXIMUM VOUT vs IOUT (Positive Swing) –10 –12 WARM-UP OFFSET VOLTAGE DRIFT 3 17.5 Offset Voltage Change (µV) 15 VS = ±18V 12.5 VOUT (V) –8 –IOUT (mA) VS = ±15V 10 VS = ±12V 7.5 5 2.5 2 1 0 –1 –2 VS = ±15V –3 0 0 6 12 18 24 30 0 36 15 30 45 60 75 90 105 120 Time from Power Supply Turn-On (s) IOUT (mA) OFFSET VOLTAGE CHANGE DUE TO THERMAL SHOCK CLOSED-LOOP RESPONSE vs FREQUENCY 30 100 Device Immersed in 70°C Inert Liquid 80 Closed-Loop Gain (dB) Absolute Change in Input Offset Voltage (µV) 25 20 15 10 Plastic DIP 5 60 40 20 0 0 –20 0 10 20 30 40 50 60 70 80 10 Time (s) 1k 10k 100k Frequency (Hz) ® OPA177 100 4 1M 10M TYPICAL PERFORMANCE CURVES (CONT) At TA = +25°C, VS = ±15V, unless otherwise noted. CMRR vs FREQUENCY OPEN-LOOP GAIN/PHASE vs FREQUENCY 160 0 Gain 140 45 100 Phase 80 90 60 40 135 130 CMRR (dB) 120 Phase Shift (Degrees) Open-Loop Gain (dB) 140 150 110 100 90 20 0 0.01 180 0.1 1 10 100 1k 10k 100k 80 1 1M 100 10k POWER SUPPLY REJECTION vs FREQUENCY INPUT BIAS AND INPUT OFFSET CURRENT vs TEMPERATURE Input Bias and Input Offset Current (nA) 110 90 70 1 10 100 1k 10k 100k 2 1 IB I OS 0 –1 –2 –40 50 –15 10 35 60 85 Temperature (°C) Frequency (Hz) TOTAL NOISE vs BANDWIDTH (0.1Hz to Frequency Indicated) INPUT NOISE VOLTAGE DENSITY vs FREQUENCY 1k Input Noise Voltage (nV/√Hz) 10 RMS Noise (µV) 1k Frequency (Hz) 130 0.1 10 Frequency (Hz) 150 Power Supply Rejection (dB) 120 1 0.1 RS1 = RS2 = 200kΩ Thermal noise of source resistors included. 100 RS = 0 10 1 0.01 100 1k 10k 1 100k 10 100 1k 10k Frequency (Hz) Bandwidth (Hz) ® 5 OPA177 TYPICAL PERFORMANCE CURVES (CONT) At TA = +25°C, VS = ±15V, unless otherwise noted. MAXIMUM OUTPUT SWING vs FREQUENCY POWER CONSUMPTION vs POWER SUPPLY 100 G = +1 R L = 2kΩ 28 24 Power Consumption (mW) Peak-to-Peak Amplitude (V) 32 20 16 12 8 10 4 1 0 1k 10k 100k 1M 0 10 Frequency (Hz) 30 40 OUTPUT SHORT-CIRCUIT CURRENT vs TIME MAXIMUM OUTPUT VOLTAGE vs LOAD RESISTANCE 40 Output Short-Circuit Current (mA) 20 Maximum Output (V) 20 Total Supply Voltage (V) Positive Output 15 Negative Output 10 5 35 30 ISC + 25 20 ISC – 15 0 100 1k 0 10k Load Resistance to Ground ( Ω) ® OPA177 1 2 3 Time from Output Being Shorted (min) 6 4 APPLICATIONS INFORMATION V+ The OPA177 is unity-gain stable, making it easy to use and free from oscillations in the widest range of circuitry. Applications with noisy or high impedance power supply lines may require decoupling capacitors close to the device pins. In most cases 0.1µF ceramic capacitors are adequate. The OPA177 has very low offset voltage and drift. To achieve highest performance, circuit layout and mechanical conditions must be optimized. Offset voltage and drift can be degraded by small thermoelectric potentials at the op amp inputs. Connections of dissimilar metals will generate thermal potential which can mask the ultimate performance of the OPA177. These thermal potentials can be made to cancel by assuring that they are equal in both input terminals. VIN 3 8 VOUT OPA177 Trim Range is approximately ±3.0mV FIGURE 1. Optional Offset Nulling Circuit. NOISE PERFORMANCE The noise performance of the OPA177 is optimized for circuit impedances in the range of 2kΩ to 50kΩ. Total noise in an application is a combination of the op amp’s input voltage noise and input bias current noise reacting with circuit impedances. For applications with higher source impedance, the OPA627 FET-input op amp will generally provide lower noise. For very low impedance applications, the OPA27 will provide lower noise. 1. Keep connections made to the two input terminals close together. 2. Locate heat sources as far as possible from the critical input circuitry. 3. Shield the op amp and input circuitry from air currents such as cooling fans. OFFSET VOLTAGE ADJUSTMENT The OPA177 has been laser-trimmed for low offset voltage and drift so most circuits will not require external adjustment. Figure 1 shows the optional connection of an external potentiometer to adjust offset voltage. This adjustment should not be used to compensate for offsets created elsewhere in a system since this can introduce excessive temperature drift. INPUT BIAS CURRENT CANCELLATION The input stage base current of the OPA177 is internally compensated with an equal and opposite cancellation current. The resulting input bias current is the difference between the input stage base current and the cancellation current. This residual input bias current can be positive or negative. INPUT PROTECTION The inputs of the OPA177 are protected with 500Ω series input resistors and diode clamps as shown in the simplified circuit diagram. The inputs can withstand ±30V differential inputs without damage. The protection diodes will, of course, conduct current when the inputs are overdriven. This may disturb the slewing behavior of unity-gain follower applications, but will not damage the op amp. When the bias current is cancelled in this manner, the input bias current and input offset current are approximately the same magnitude. As a result, it is not necessary to balance the DC resistance seen at the two input terminals (Figure 2). A resistor added to balance the input resistances may actually increase offset and noise. R2 R1 20kΩ 1 2 R2 Op Amp R1 RB = R2 || R1 OPA177 No bias current cancellation resistor needed (a) (b) Conventional op amp with external bias current cancellation resistor. OPA177 with no external bias current cancellation resistor. FIGURE 2. Input Bias Current Cancellation. ® 7 OPA177 PACKAGE OPTION ADDENDUM www.ti.com 16-Feb-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty OPA177FP ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA177FPG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA177GP ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA177GPG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type OPA177GS ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA177GS/2K5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA177GS/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA177GS/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA177GSE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR OPA177GSG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device OPA177GS/2K5 Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 6.4 5.2 2.1 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA177GS/2K5 SOIC D 8 2500 346.0 346.0 29.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DLP® Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2009, Texas Instruments Incorporated